AFE8000, AFE8004, AFE8010

SBASAG9A – DECEMBER 2022 – REVISED JUNE 2023

AFE80xx RF Sampling Transceiver

1 Features 3 Description
• Request full data sheet The AFE8000 is a high performance, wide bandwidth
• AFE80xx versions: multi-channel transceiver, integrating eight RF
– AFE8000: 8 TX, 10 RX sampling DACs and 10 RF sampling ADCs. Pin
– AFE8004: 4 TX, 4 RX and programming compatible lower channel count
– AFE8010: 10 RX versions (AFE8004 with 4TX and 4RX channels,
• 12 GSPS RF Sampling DACs AFE8010 with 10RX channels) are available to allow
• 4 GSPS RF Sampling ADCs scalable system designs.
• Maximum RF signal bandwidth: Each receiver (RX) chain includes a 25 dB range
– TX: 800 MHz (8 ch) or 1.2 GHz (4 ch) DSA (Digital Step Attenuator) followed by a 4 GSPS
– RX: 800 MHz (8 ch) or 400 MHz (8 ch) + 800 ADC (analog-to-digital converter). The 10 ADCs are
MHz (2 ch) connected to 8 receiver paths (1RX though 8RX)
• RF frequency range: and 2 feedback paths (1FB and 2FB). The ADCs
– TX: 5 MHz to 7.125 GHz are identical between RX and FB but the digital
– RX: 100 MHz to 7.125 GHz down converter paths are different (the FB paths
• Digital Step Attenuators (DSA): are capable of wider bandwidth and can be used as
– TX: 40 dB range, 1 dB analog and 0.125 dB receivers). Each receiver channel has analog peak
digital steps power detectors and digital peak and power detectors
– RX/FB: 25 dB range, 1 dB step to assist an external or internal autonomous automatic
• Single or dual-band DUC, DDCs gain controller, and RF overload detectors for device
• Dual NCOs per chain for fast frequency switching reliability protection. The single or dual digital down
• Supports TDD operation with fast switching converters (DDC) provide up to 800 MHz of signal BW
between TX and RX for 8 channels or 400 MHz for 8 channels in addition
• Internal PLL/VCO to generate DAC/ADC clocks to 800 MHz for 2 channels.
• Optional external CLK at DAC or ADC rate
Each transmitter (TX) chain includes a single or dual
• SerDes data interface:
digital up converter (DUC). Supporting up to 800 MHz
– JESD204B and JESD204C signal bandwidth for eight channels or 1200 MHz for 4
– 8 SerDes transceivers up to 32.5 Gbps channels. The output of the DUCs drives a 12-GSPS
– 8b, 10b and 64b, 66b Encoding DAC (digital-to-analog converter) with a mixed mode
– 12 bit, 16 bit, 24 bit and 32 bit resolution output option to enhance 2nd Nyquist operation. The
– Subclass 1 multi-device synchronization DAC output includes a variable gain amplifier (TX
• Package: DSA) with 40 dB range and 1 dB analog and 0.125
– 17 mm × 17 mm FCBGA, 0.8-mm pitch dB digital steps.
2 Applications Package Information
• Radar PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
• Seeker front end AFE8000
• Defense radio AFE8004 FC-BGA 17 mm × 17 mm
AFE8010
• Tactical communications infrastructure
• Wireless communications test (1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) The package size (length × width) is a nominal value and
includes pins, where applicable.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE8000, AFE8004, AFE8010
SBASAG9A – DECEMBER 2022 – REVISED JUNE 2023 www.ti.com

4 Functional Block Diagram

VDD1P2RXFBCLK
VDD1P2RXFBCLK

VDD1p8RX
VDD1p2RX
VDD1p2FB
VDD1p8FB

VSSRXCLK
VSSFBCLK

VSSRX

VSSRX
VSSFB

1FB+/-

1RX+/-

3RX+/-
2RX+/-

4RX+/-

VDDA
DGND

VDDT
DVDD

VSST
VSS
RX Chain 1

RX Chain 2

RX Chain 3

RX Chain 4
Input 11
1TX+/- RF DAC

FB Chain
TX Chain 1 1SRX
VDD1p2TX

FB
VSSTX
1STX

From SPI

RF ADC

RF ADC

RF ADC

RF ADC
RF ADC
2TX+/- RF DAC
2SRX

4x SerDes BLK2
VDD1p8TX TX Chain 2
2STX
VSSTX
3TX+/- RF DAC 3SRX
TX DIG

RX DIG

RX DIG
RX DIG
RX DIG
FB DIG

Digital Backplane & JESD204C Controller / Mux

3STX
TX Chain 3
TX DIG
4SRX
4TX+/- RF DAC TX DIG 4STX
TX Chain 4 TX DIG VDDA1P8
VSS
SYSREF
Ref CLK DC CLK Common Dig Syncbin/out
REFCLK_+/- LO
VDD1p8PLL Dist PLL-VCO 5SRX
VSSPLL
5STX
TX DIG
5TX+/- RF DAC

4x SerDes BLK2
TX DIG 6SRX
FB DIG

RX DIG
RX DIG
RX DIG
RX DIG

TX Chain 5 6STX
TX DIG
6TX+/- RF DAC TX DIG 7SRX

7STX
TX Chain 6
VDD1p8TX
VSSTX 8SRX
RF ADC

RF ADC

RF ADC

RF ADC
RF ADC

7TX+/- RF DAC
8STX
VSST
VDD1p2TX TX Chain 7 VDDT
RX Chain 5

RX Chain 6

RX Chain 7

RX Chain 8
FB Chain 2

VSSTX
SPIB
8TX+/- RF DAC MCU
SPI
GPIO
TX Chain 8
YY..
GPIOs
7RXB+/-

8RXB+/-
DGND

6RXB+/-
VDD1p8FB

2FB+/-
DVDD

VDD1p2FB

5RXB+/-
VSSFB

5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from December 31, 2022 to June 14, 2023 (from Revision * (December 2022) to
Revision A (June 2023)) Page
• Changed note 2 to the Package Information table. Removed Product preview from the AFE8004 and
AFE8010 devices................................................................................................................................................1

2 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: AFE8000 AFE8004 AFE8010

 AFE8000, AFE8004, AFE8010
www.ti.com SBASAG9A – DECEMBER 2022 – REVISED JUNE 2023

6 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
6.1 Documentation Support

6.1.1 Related Documentation

6.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
6.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
6.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
6.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

6.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3

Product Folder Links: AFE8000 AFE8004 AFE8010

 PACKAGE OPTION ADDENDUM

www.ti.com 8-Jul-2023

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

AFE8000IABJ ACTIVE FCBGA ABJ 400 90 RoHS & Green SNAGCU Level-3-260C-168 HR -40 to 85 AFE8000 Samples

AFE8000IALK ACTIVE FCBGA ALK 400 90 Non-RoHS Call TI Level-3-220C-168 HR -40 to 85 AFE8000 Samples
& Green SNPB
AFE8004IABJ ACTIVE FCBGA ABJ 400 90 RoHS & Green SNAGCU Level-3-260C-168 HR -40 to 85 AFE8004 Samples

AFE8004IALK ACTIVE FCBGA ALK 400 90 Non-RoHS Call TI Level-3-220C-168 HR -40 to 85 AFE8004 Samples
& Green SNPB
AFE8010IABJ ACTIVE FCBGA ABJ 400 90 RoHS & Green SNAGCU Level-3-260C-168 HR -40 to 85 AFE8010 Samples

AFE8010IALK ACTIVE FCBGA ALK 400 90 Non-RoHS Call TI Level-3-220C-168 HR -40 to 85 AFE8010 Samples
& Green SNPB

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 8-Jul-2023

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 9-Jul-2023

TRAY

L - Outer tray length without tabs KO -

Outer
tray
height

W-
Outer
tray
width
Text

P1 - Tray unit pocket pitch

CW - Measurement for tray edge (Y direction) to corner pocket center
CL - Measurement for tray edge (X direction) to corner pocket center

Chamfer on Tray corner indicates Pin 1 orientation of packed units.

*All dimensions are nominal

Device Package Package Pins SPQ Unit array Max L (mm) W K0 P1 CL CW
Name Type matrix temperature (mm) (µm) (mm) (mm) (mm)
(°C)
AFE8000IABJ ABJ FCBGA 400 90 6 x 16 150 315 135.9 7620 19.5 21 19.2
AFE8000IALK ALK FCBGA 400 90 6 x 16 150 315 135.9 7620 19.5 21 19.2
AFE8004IABJ ABJ FCBGA 400 90 6 x 16 150 315 135.9 7620 19.5 21 19.2
AFE8004IALK ALK FCBGA 400 90 6 x 16 150 315 135.9 7620 19.5 21 19.2
AFE8010IABJ ABJ FCBGA 400 90 6 x 16 150 315 135.9 7620 19.5 21 19.2
AFE8010IALK ALK FCBGA 400 90 6 x 16 150 315 135.9 7620 19.5 21 19.2

Pack Materials-Page 1
 PACKAGE OUTLINE
ABJ0400A SCALE 0.750
FCBGA - 2.65 mm max height
BALL GRID ARRAY

17.2
BALL A1 CORNER A
16.8

17.2
( 16)
16.8

2.65
2.29 (1.4)
0.2 C
C

SEATING PLANE
0.76 NOTE 4
BALL TYP
0.56
0.12 C
0.5
TYP
0.3
15.2 TYP

SYMM
0.8 TYP (0.9) TYP

Y
W
V
U
T
R
P
N 15.2
M SYMM
L TYP
K
J
H
G
0.55 F
400X E
0.45 D
0.15 C A B C
B
0.08 C NOTE 3 A
1 3 5 7 9 11 13 15 17 19
2 4 6 8 10 12 14 16 18 20 0.8 TYP
4221311/D 03/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
5. The lids are electrically floating (e.g. not tied to GND).

www.ti.com
 EXAMPLE BOARD LAYOUT
ABJ0400A FCBGA - 2.65 mm max height
BALL GRID ARRAY

(0.8) TYP

A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

(0.8) TYP C
D
E
F
400X ( 0.4) G
H
J
K SYMM
L
M
N
P
R
T
U
V
W
Y

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:6X

( 0.4) 0.025 MAX

METAL 0.025 MIN METAL
UNDER
MASK

SOLDER MASK EXPOSED EXPOSED ( 0.4)

OPENING METAL METAL SOLDER MASK
OPENING
NON-SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE
4221311/D 03/2023
NOTES: (continued)

6. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).

www.ti.com
 EXAMPLE STENCIL DESIGN
ABJ0400A FCBGA - 2.65 mm max height
BALL GRID ARRAY

(0.8) TYP ( 0.4) TYP

A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

(0.8) C
TYP
D
E
F
G
H
J
K SYMM

L
M
N
P
R
T
U
V
W
Y

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.15 mm THICK STENCIL
SCALE:6X

4221311/D 03/2023

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com
 PACKAGE OUTLINE
ALK0400A SCALE 0.750
FCBGA - 2.65 mm max height
BALL GRID ARRAY

17.2
BALL A1 CORNER A
16.8

17.2
( 16)
16.8

2.65
2.29 (1.4)
0.2 C
C

SEATING PLANE
0.76 NOTE 4
BALL TYP
0.56
0.12 C
0.5
TYP
0.3
15.2 TYP

SYMM
0.8 TYP (0.9) TYP

Y
W
V
U
T
R
P
N 15.2
M SYMM
L TYP
K
J
H
G
0.55 F
400X E
0.45 D
0.15 C A B C
B
0.08 C NOTE 3 A
1 3 5 7 9 11 13 15 17 19
2 4 6 8 10 12 14 16 18 20 0.8 TYP
4225930/C 03/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
5. Pb-Free die bump and SnPb solder ball.
6. The lids are electrically floating (e.g. not tied to GND).

www.ti.com
 EXAMPLE BOARD LAYOUT
ALK0400A FCBGA - 2.65 mm max height
BALL GRID ARRAY

(0.8) TYP

A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

(0.8) TYP C
D
E
F
400X ( 0.4) G
H
J
K SYMM
L
M
N
P
R
T
U
V
W
Y

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:6X

( 0.4) 0.025 MAX

METAL 0.025 MIN METAL
UNDER
MASK

SOLDER MASK EXPOSED EXPOSED ( 0.4)

OPENING METAL METAL SOLDER MASK
OPENING
NON-SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE
4225930/C 03/2023
NOTES: (continued)

7. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).

www.ti.com
 EXAMPLE STENCIL DESIGN
ALK0400A FCBGA - 2.65 mm max height
BALL GRID ARRAY

(0.8) TYP ( 0.4) TYP

A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

(0.8) C
TYP
D
E
F
G
H
J
K SYMM

L
M
N
P
R
T
U
V
W
Y

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.15 mm THICK STENCIL
SCALE:6X

4225930/C 03/2023

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com
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