1 s2.0 S0921509302001995 Main
1 s2.0 S0921509302001995 Main
1 s2.0 S0921509302001995 Main
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Letter
Abstract
A novel surface modifying technique, friction stir processing (FSP), has been developed for fabrication of surface composite. Al /
SiC surface composites with different volume fractions of particles were successfully fabricated. The thickness of the surface
composite layer ranged from 50 to 200 mm. The SiC particles were uniformly distributed in the aluminum matrix. The surface
composites have excellent bonding with the aluminum alloy substrate. The microhardness of the surface composite reinforced with
27vol.%SiC of 0.7 mm average particle size was /173 HV, almost double of the 5083Al alloy substrate (85 HV). The solid-state
processing and very fine microstructure that results are also desirable for high performance surface composites.
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exhibited high microhardness and excellent wear resis- investigate the possibility of incorporating ceramic
tance compared with untreated sample. Pantelis et al. [2] particle into surface layer of aluminum alloy to form
reported that some SiC particles reacted partially with surface composite by means of FSP technique.
the aluminum matrix whereas Hu et al. [3 /6] revealed
that the SiC particles partially dissolved in the liquid
and reprecipitated during solidification and a new 2. Experimental
aluminum silicon carbide was formed during laser
processing. Commercial available SiC powder (99.5% purity and
It should be pointed out that the existing processing 0.7 mm average particle size) and 5083Al alloy (Al /Mg/
techniques for forming surface composites are based on Mn) rolled plate were used in this study. The surface of
liquid phase processing at high temperatures. In this 5083 alloy plates was cleaned before processing. SiC
case, it is hard to avoid the interfacial reaction between powder was added into a small amount of methanol and
reinforcement and metal-matrix and the formation of mixed, and then applied to surface of the plates to form a
some detrimental phases. Furthermore, critical control thin SiC particle layer. The process is similar to tape
of processing parameters is necessary to obtain ideal casting, except that no binder was added to the mixture.
solidified microstructure in surface layer. Obviously, if The aluminum plates with preplaced SiC particle layer
processing of surface composite is carried out at were subjected to FSP after drying in air. A tacking tool
temperatures below melting point of substrate, the with a pin height of 1.0 mm was used. A constant tool-
problems mentioned above can be avoided. In this rotating rate of 300 rpm was adopted and traverse rate
study, a new processing technique, Friction Stir Proces- and depth of shoulder was varied. The tool spindle angle
sing (FSP) was attempted to incorporate ceramic (angle between spindle and workpiece normal) of 2.58
particles into surface layer of aluminum alloy to form was used, which helps in forging action at the trailing
surface composite. FSP has been recently developed for edge of the shoulder. The target depth is defined as the
microstructural modification by Mishra et al. [15,16] depth to which the pin will insert into the workpiece. The
based on the basic principles of friction stir welding target depth was controlled to vary the position of
(FSW). FSW is a relatively new solid state joining shoulder with respect to the top surface of the workpiece.
process developed initially for aluminum alloys by The Transverse sections of as-processed aluminum plates
Welding Institute (TWI) of UK [17]. It is considered as were mounted, and then mechanically polished and
the most significant development in metal joining in a examined using an optical microscope. The volume
decade, and has been successfully used to produce joints fraction of SiC particle in surface layer was estimated
in aluminum, titanium and other alloys. using Scion Image software. The microhardness values
The basic concept of FSP is remarkably simple. A of surface composite layer and aluminum alloy substrate
rotating tool with pin and shoulder is inserted in a single were measured using a load of 400 g.
piece of material for microstructural modification and
traversed along the desired line to cover the region of
interest (Fig. 1). Friction between the tool and work- 3. Results and discussion
pieces results in localized heating that softens and
plasticizes the workpiece. A volume of processed Optical microscopic examinations revealed that the
material is produced by movement of materials from processing parameters exhibit significant effects on
the front of the pin to the back of the pin. During this formation of surface composite layer. In this study the
process, the material undergoes intense plastic deforma- effect of shoulder position and traverse speed were
tion and this results in significant grain refinement evaluated. The basic observations are summarized in
[15,16]. One of the potential applications of FSP is to Table 1. Table 1 shows that when the target depth is too
generate microstructure amenable to high strain rate large (2.28 mm), the shoulder of tool pushed away all
superplasticity [15,16]. The aim of the present study is to the preplaced SiC particles, and, basically no surface
composite formed. Too small target depth (1.78 mm)
was also ineffective to mix SiC particles into aluminum
alloy. A target depth of 2.03 mm resulted in incorpora-
tion of SiC particles into aluminum matrix. However,
the bonding of surface composite layer and substrate
plate was influenced by the traverse speed. At higher
traverse speed (101.6 mm min 1), the surface composite
layer was usually separated from the aluminum alloy
substrate and the bonding was poor as shown in Fig. 2.
Fig. 3a shows optical micrograph of surface compo-
Fig. 1. A schematic of the FSP. site. It is evident that SiC particles were uniformly
R.S. Mishra et al. / Materials Science and Engineering A341 (2003) 307 /310 309
Table 1
Effect of processing parameters on formation of surface composite
Fig. 3. Optical micrograph showing (a) uniform distribution of SiC particles (/13 vol.%) in aluminum alloy matrix, and (b) perfect bonding
between surface composite and aluminum alloy substrate.
310 R.S. Mishra et al. / Materials Science and Engineering A341 (2003) 307 /310
Fig. 4. Optical micrograph showing (a) uniform distribution of SiC particles (/27 vol.%) in aluminum alloy matrix, and (b) perfect bonding
between surface composite and aluminum alloy substrate.