IC-SP-06027 R1

Hitachi Single Chip Inverter IC

Application Guide

(Applicable models)

VSP-input type 6-input type

ECN30105 ECN30611
For ≅ AC115V
ECN30107
ECN30204 ECN30601
For ≅ AC230V ECN30206 ECN30603
ECN30207 ECN30604

Development Department
Power Device Division
Hitachi, Ltd., Power Systems, Power & Industrial System Division
 IC-SP-06027 R1

Precautions for Safe Use and Notices

If semiconductor devices are handled inappropriate manner, failures may result. For this
reason, be sure to read this “Application Guide” before use.

! This mark indicates an item about which caution is required.

This mark indicates a potentially hazardous situation which,

! CAUTION if not avoided, may result in minor or moderate injury and
damage to property.

! CAUTION
(1) Regardless of changes in external conditions during use “absolute maximum
ratings” should never be exceed in designing electronic circuits that employ
semiconductors. In the case of pulse use, furthermore,″safe operating
area(SOA)”precautions should be observed.

(2) Semiconductor devices may experience failures due to accident or unexpected

surge voltages. Accordingly, adopt safe design features, such as redundancy or
prevention of erroneous action, to avoid extensive damage in the event of a failure.

(3) In cases where extremely high reliability is required (such as use in nuclear power
control, aerospace and aviation, traffic equipment, life-support-related medical
equipment, fuel control equipment and various kinds of safety equipment), safety
should be ensured by using semiconductor devices that feature assured safety or
by means of user’s fail-safe precautions or other arrangement. Or consult Hitachi’s
sales department staff.

(If a semiconductor device fails, there may be cases in which the semiconductor
device, wiring or wiring pattern will emit smoke or cause a fire or in which the
semiconductor device will burst)

NOTICES
1. This Application Guide contains the specifications, characteristics(in figures and tables), dimensions
and handling notes concerning power semiconductor products (hereinafter called “products”) to aid
in the selection of suitable products.
2. The specifications and dimensions, etc. stated in this Application Guide are subject to change
without prior notice to improve products characteristics. Before ordering, purchasers are advised to
contact Hitachi’s sales department for the latest version of this Application Guide and specifications.
3. In no event shall Hitachi be liable for any damage that may result from an accident or any other
cause during operation of the user’s units according to this Application Guide. Hitachi assumes to
responsibility for any intellectual property claims or any other problems that may result from
applications of information, products or circuits described in this Application Guide.
4. In no event shall Hitachi be liable for any failure in a semiconductor device or any secondary
damage resulting from use at a value exceeding the absolute maximum rating.
5. No license is granted by this Application Guide under any patents or other rights of any third party
or Hitachi, Ltd.
6. This Application Guide may not be reproduced or duplicated, in any form, in whole or in part,
without the expressed written permission of Hitachi, Ltd.
7. The products (technologies) described in this Application Guide are not to be provided to any party
whose purpose in their application will hinder maintenance of international peace and safety nor
are they to be applied to that purpose by their direct purchasers or any third party. When exporting
these products (technologies), the necessary procedures are to be taken in accordance with related
laws and regulations.
 IC-SP-06027 R1

Hitachi offers even better products by taking advantage of

our long years of experiences in the market.
Hitachi helps you save even more energy under our policy
of "quality first."

Advanced
Hitachi Single-chip Inverter ICs

Much easy to use

It becomes easy to design the system power supply by the power supply up/down
sequence free design of IC. *1).

Much reduce the effects on the environment

It conforms to lead (Pb) free phase category "Phase 3A" *4)
of “electronic
equipment” of JEITA *3) ETR-7021 (issue in June, 2004)".

Much strong noise-immunity

A built-in cancellation circuit designed to inhibit noises of no more than about 1 μs,
reduces output malfunctions induced by noises in the input signal line *2).

*1) This applies to ECN30107s, ECN30611s, ECN30206s, ECN30207s, ECN30603s and ECN30604s.
*2) This applies to ECN30204s, ECN30206s, ECN30207s, ECN30601s, ECN30603s and ECN30604s
*3) JEITA: Japan Electronics and Information Technology Industries Association
*4) Phase 3A: The entire parts must be lead-free, include the internal connection and the part materials,
that exclude exemption of EU RoHS *5) directive.
*5) EU RoHS: DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of
27 January 2003 on the restriction of the use of certain hazardous substances in electrical
and electronic equipment
 IC-SP-06027 R1

≪Contents≫

1. Overview
1-1. Dielectric isolation (DI) -------------------------------------------------------------------------------------------- 1
1-2. Single-chip Inverter ICs ------------------------------------------------------------------------------------------- 2
1-3. Composition of an inverter IC ---------------------------------------------------------------------------------- 2
1-4. Motor drive system ------------------------------------------------------------------------------------------------- 3
1-5. Block diagram of inverter ICs ----------------------------------------------------------------------------------- 3

2. Content of specification ------------------------------------------------------------------------------------------------ 4

3. Package
3-1. Model name ------------------------------------------------------------------------------------------------------------ 5
3-2. Production lot number --------------------------------------------------------------------------------------------- 5
3-3. Marking ------------------------------------------------------------------------------------------------------------------ 5
3-4. Package outline ------------------------------------------------------------------------------------------------------- 6

4. Pins
4-1. Pin arrangement ----------------------------------------------------------------------------------------------------- 8
4-2. Functions of the pins ---------------------------------------------------------------------------------------------- 9

5. Functions and operational precautions

5-1. Protection function ------------------------------------------------------------------------------------------------- 13
(1) Detection of VCC under voltage
(2) Current limitation
(a) Operation description
(b) How to set up
(c) Noises of the RS pin
(d) Precautions on wiring
(e) Motor lock
(3) Protection against short circuit
5-2. Charge pump circuit ----------------------------------------------------------------------------------------------- 16
(1) Description of operation
5-3. Power supply sequence ------------------------------------------------------------------------------------------ 17
5-4. VB power supply ---------------------------------------------------------------------------------------------------- 18
5-5. Operation of the output IGBT of the VSP-input type --------------------------------------------------- 19
(1) PWM operation
(2) Output all-off function
(a) Function description
(b) Precautions
5-6. Internal Filter ---------------------------------------------------------------------------------------------------------- 20
5-7. Dead time -------------------------------------------------------------------------------------------------------------- 21
5-8. Calculation of power consumption ---------------------------------------------------------------------------- 24
5-9. Derating ---------------------------------------------------------------------------------------------------------------- 26
5-10. External components -------------------------------------------------------------------------------------------- 27
 IC-SP-06027 R1

6. Handling Instruction
6-1 Mounting ---------------------------------------------------------------------------------------------------------------- 29
(1) Insulation between pins
(2) Connection of tabs
(3) Soldering conditions
6-2 Antistatic measures ------------------------------------------------------------------------------------------------ 30

7. Quality
7-1. Quality tests ----------------------------------------------------------------------------------------------------------- 30
7-2. QC Control Flow ----------------------------------------------------------------------------------------------------- 31

8. Inverter IC Handling Note

8-1. Electrical static destruction of VSP pin caused by external surge -------------------------------- 32
8-2. Electrical static destruction of FG pin caused by external surge --------------------------------- 32
8-3. IC destruction by external surge inputted to VS and VCC line (1) -------------------------------- 33
8-4. IC destruction by external surge inputted to VS and VCC line (2) -------------------------------- 33
8-5. IC destruction by external surge inputted to VS and VCC line (3) -------------------------------- 33
8-6. IC destruction by line noise put into VCC (1) ------------------------------------------------------------- 34
8-7. IC destruction by line noise put into VCC (2) ------------------------------------------------------------- 34
8-8. IC destruction by relay noise of inspection machine -------------------------------------------------- 35
8-9. Motor failure (missing phase output) ------------------------------------------------------------------------ 35
 IC-SP-06027 R1

1. Overview

1-1. Dielectric isolation (DI)

Hitachi Intelligent Power IC

A logical device and a power-switching device can be integrated in a
single chip.
No mutual interference occurs, not only between devices but also
between device and board.
The Hitachi high-voltage monolithic IC is an intelligent power IC, developed based on a unique dielectric isolation
technology (DI). It is structured that there be no latch-up between devices and between device and board, and that
an IC can be made so a high-dielectric-strength, large-current output circuit is mixed with a logical circuit. The ICs
can be made smaller than conventional discrete boards and hybrid ICs.

Latch-up-free IC offers wider range of applications.

The Hitachi high-voltage monolithic IC developed with dielectric isolation technology are such that the devices are
isolated with SiO2 layers in between, unlike P-N junction isolation. In consequence, it can remain latched-up free
even under high-temperature, large-current, high-noise, and other severe conditions. This technology also enables
them to be extremely flexible in circuit designing and thus to meet more customer requirement.

Aluminum wire

SiO2
Dielectric isolation

N P

Single crystal silicon

N N

Poly silicon

SiO2
(Insulator separation layer)

Aluminum wire
P-N junction isolation

SiO2
N
P+ P P+
N N N Single crystal silicon

P type silicon

Depletion layer
(Insulator separation layer)

Fig. 1-1. Dielectric isolation and P-N junction isolation

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 IC-SP-06027 R1

1-2. Single-chip Inverter ICs

Hitachi Single-chip Inverter ICs are monolithic ICs integrating various constituent devices and circuits required for
inverter control on a single chip with dielectric isolation technology. They are for driving motors, best suited for
controlling small three-phase brushless DC motors. The advantage of downsizing by the use of a single-chip structure
can be used to reduce the control board in size, which facilitates the incorporate of such ICs in motors.

(Can be incorporated in motors.)

IGBT
Driver
Logic Level Shift
IGBT
Control Circuit
(Single-chip inverter IC)

Fig. 1-2. Single-chip inverter IC

1-3. Composition of an inverter IC

An inverter is a device that converts DC currents into AC. It can be used to drive motors for efficient variable-speed
control. Fig. 1-3 shows the basic configuration of an inverter IC required for that purpose. To drive the three-phase
motor with an inverter, six IGBTs and free wheel diodes are used as output stages. The IC consists of an IGBT driving
power circuit, level shift circuit, a logic circuit and other components for IGBT control. Hitachi Inverter ICs can directly
receive high voltage supplied from rectifying commercial AC power, because they have high dielectric strength. This
obviates the need of a step-down circuit, thus inhibiting efficiency cuts induced by voltage conversion.

High voltage 3-phase DCBLM Driver IC

Output Power device: IGBTs

U V W
Charge pump
Rectifying/smoothing

circuit
Driver circuit
Protection circuit Motor
AC115V 15V Level shift circuit
Logic circuit

μ-Processor Position detection

Fig.1-3. Basic configuration of an inverter IC

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 IC-SP-06027 R1

1-4. Motor drive system

Three-phase inverters generally fall into two categories according to the method of commutation of the six output-stage
devices: 120-degree energization and 180-degree energization. The method of 120-degree energization is such that
the device on the top arm and that on the bottom arm are controlled to set the energization period between phases to
120 degrees, thus transferring the current from phase U to V to W, thus driving the motor. Hitachi Single-chip Inverter
ICs (VSP-input series) are based on 120-degree energization and receive position signals from hall ICs and VSP
signals that constitute speed instructions, thus conducting PWM control by the chopping action of the lower arm. For
uses of 180-degree energization, a six-input series are provided where six output stage devices can be controlled by
each input signal.

1-5. Block Diagram of Inverter IC

Fig. 1-4 shows a block diagram of ECN30206 for receiving 230V AC, as an example of inverter IC. Its main function is
to receive input signals from the three phases of hall ICs of the brushless DC motor, turns on and off the particular
IGBTs with the three-phase distribution circuit, and to drive the motor. Other components include a charge pump circuit
as a power self-supply circuit, a triangular wave oscillator and a comparator-based PWM generation circuit as rpm
control circuits, an over current detection circuit which provides a current trip function at motor startup, and an under
voltage detection circuit that detects power drops in the drive circuit and turns off the output.

RU

D2 D1 VS
VCC(15V) RV

C2 +
RW
+ - C1
C0 -

CB HU HV HW C+ C- CL VS1 VS2

VCC VB
VB supply VB
Clock
Charge Pump
VCC
FG
FG
Top Arm Hall ICs
DM
Motor Rotating
Driver MU
MicroController Direction
Filter Circuit

3-Phase MV
VSP PWM Comparator
+ Distributor MW
CMP
All off Bottom
+ arm off Bottom Arm
CMP
Driver Motor
VCC
SAW wave
Over Current Sense
Generator
Clock
LVSD +
Vref

CR VTR GL RS GH1 GH2

Note : Inside of bold line RTR

shows ECN30206 CTR RS

Fig.1-4. Block diagram of ECN30206

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 IC-SP-06027 R1

2. Content of specifications

The following items have been described in the specifications.

(1) Maximum Ratings

• It describes direct conditions(electric, thermal use conditions) of leading to IC destruction and so on. And
the safety operating range with operating conditions is shown by minimum or maximum value.
• Each item is an independent item. Also, these items show the ratings value of not exceeding any use
conditions. The maximum rating and other characteristics are mutually related, and not permitted at the
same time.

(2) Electrical Characteristics

• It provides for an electric characteristic item that shows the function of IC, and describes minimum,
standard, and maximum.

(3) Function and Operation

• It describes Truth Table, Time Chart, Protection Function and so on.

(4) Standard application

• It describes external parts to operate IC.

(5) Pin Assignments and Pin Definitions

• It describes pin assignments, pin names and pin definitions.

(6) Important notice Precautions

• It describes notes of the static electricity, the maximum rating, handling and so on.

(7) Appendix and Reference data

• It describes SOA and Deratings.

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 IC-SP-06027 R1

3. Package

3-1. Model name

ECN 30206 SP
Package type (SP, SPV, SPR)

Series name

Hitachi High-voltage IC

3-2. Production lot number

5 E 12 F
Control number
It shows by two digits or less (alphabetical character).
Lead (Pb) Free: Last digit is Marked as “F”

Quality control number.

It shows by one digit or two digits. (Numerals from 1 to 9,
alphabetical character (except O and I) or space is used.)

Assembled month as shown in below

January, A; February, B; March, C; April, D; May, E; June, K;
July, L; August, M; September, N; October, X; November, Y;
and December, Z

Least significant digit of Assembled year (A.D.)

3-3. Marking

Model name

Package Type: SP, SPV JA PAN

Index pin
Hitachi mark Production lot number

Model name
(only numbers*)

Package Type: SPR

Production lot number

* e.g. ECN30206SPR is represented as “30206”.

Fig. 3-1. Marking diagram

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 IC-SP-06027 R1

3-4. Package Outline

Table 3-1(1). Package Dimensions (unit: mm)

Package Type Package Dimensions

SP

(SP-23TA)

SPV

(SP-23TB)

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 IC-SP-06027 R1

Table 3-1(2). Package Dimensions (unit: mm)

Package Type Package Dimensions

SPR

(SP-23TR)

1 23

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 IC-SP-06027 R1

4. Pins

4-1. Pin assignments

Table 4-1. Assignment table of pins
Applicable ECN30102 ECN30204 ECN30611
Model ECN30105 ECN30206 ECN30601
ECN30107 ECN30603
Pin # ECN30207 ECN30604
1 VS2 VS2 VS2
2 MW MW MW
3 NC note1 NC note1 NC note1
4 GH2 GH2 GH2
5 VCC VCC VCC
6 GL GL GL
7 C+ C+ C+
8 C- C- C-
9 CL CL CL
10 CB CB CB
11 CTR CTR CTR
12 VTR VTR VTR
13 VSP VSP WB
14 FG FG VB
15 NC note1 DM UB
16 HW HW RS
17 HV HV WT
18 HU HU VT
19 RS RS UT
20 GH1 GH1 GH1
21 MU MU MU
22 VS1 VS1 VS1
23 MV MV MV

Note 1: NC represents an unconnected pin. It is not connected to an internal chip.

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 IC-SP-06027 R1

4-2. Functions of the pins

Table 4-2. List of pins and their functions (pins common to all models)
No. Pin Item Functions and Precautions Related items Remarks
1 VCC Control power supply pin • Powers the drive circuits for the top • 5-1. (1) VCC under
and bottom arms, the charge pump voltage Detection
circuit, the built-in VB supply circuit, • 5-3. Power supply
and others. sequence
• Determine the capacity of the power • 8-3 to 8-7
supply for VCC allowing a margin by
IC destruction by external
adding the standby current Icc and the
surge or line noise
current taken out of CB pin.
2 VS1 IGBT power pin • Connected to the collector of the top • 5-3. Power supply High voltage
VS2 arm IGBT. sequence pin
• Connect pins VS1 and VS2 close to • 8-3 to 8-5
the IC pin. If either pin is open, the ICIC destruction by external
may get destroyed. surge
3 CB Output pin of the build-in • Outputs a voltage (typ 7.5V) • 5-4. VB power supply
VB supply generated in the build-in VB power
supply.
• Provides power from the VB power
supply to the input, three-phase
distribution, FG, internal clock, over
current detection, and other circuits.
• Connect a capacitor C0 to prevent
oscillation to the CB pin. Capacitor
with capacity of 0.22μF ±20% is
recommended
4 C+ Top arm drive circuit • Powers the drive circuit for the top • 5-2. Charge pump circuit High voltage
C- power pin arm. pin
CL Charge pump circuit pin • Connect external components
(capacitor and diode).

C+
C- VS1
VS2
Top arm
driver
MU
CL MV
MW
Internal
clock
GL GH1
GH2
Equivalent Circuit

5 GL Control ground pin • It is the ground pin for VCC and VB

power lines.
6 GH1 IGBT Emitter pin • Connected to the emitter of the bottom • 5-1. (2) Current limitation
GH2 arm IGBT.
• Connected to a shunt resistor Rs to
detect over currents.
• Connect the GH1 and GH2 near the IC
pin. If either pin is open, the IC may get
destroyed.

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 IC-SP-06027 R1

Table 4-2. List of pins and their functions (pins common to all models) <Continued>
No. Pin Item Functions and Precautions Related items Remarks
7 CR PWM frequency • Externally connected resistors and • 5-5. (1) PWM operation
VTR setting pin capacitors are used to determine the
(VSP-input type) frequency of the PWM (internal clock).
Clock frequency • Frequencies are roughly determined by
setting pin the following equation:
(6-input type) f ≅ 0.494/(C X R) (Hz)
note 1) Input resistor value
typ.50Ω
• typ.300Ω
VTR
VB ECN30102
ECN30107
ECN30206
CR + C ECN30207
Input - (Internal clock)
ECN30611
resistor ECN30603
(note 1) VB
L ECN30604
VSAWH(typ. 5.4V)
• typ.150Ω
Switch selection by VSAWL(typ. 2.1V) ECN30105
comparator output H
ECN30204
ECN30601
Equivalent Circuit
8 MU Inverter output pin • It is an output of a three-phase bridge High-voltage
MV consisting of six IGBTs and free wheel pin
MW diodes.
9 RS Input pin for over • Monitors the voltage of the Rs shunt • 5-1. (2) Current limitation
current detection resistor and detects its over current
signals status.
note 1) Input resistor value

• typ.300Ω
typ. VB ECN30102
200kΩ typ. 220kΩ ECN30107
- ECN30206
RS S ECN30207
Input typ. + Latch
R ECN30611
resistor 5pF Vref ECN30603
(note 1) ECN30604
Interlock clock trigger
• typ.150Ω
ECN30105
Equivalent Circuit ECN30204
ECN30601

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 IC-SP-06027 R1

Table 4-3. List of pins and their functions (pin different according to model)
Applicable
No. Pin Item models Functions and Precautions Related items
VSP Speed ECN30102 • Input a speed instruction signal to generate • 5-3. Power supply sequence
instruction ECN30105 a PWM signal. • 5-5. Operation of the output
input pin ECN30107 • Entering an all-off operating voltage of the IGBT of the VSP input type
ECN30204 VSP terminal (typ. 1.23V) turns off all • 8-1. Electrical static destruction of
ECN30206 IGBTs. VSP pin caused by external
ECN30207 • If a noise is detected, install a resistor surge
and/or capacitor. Data Sheet
• 4.2 Input terminals
note 1) Input resistor value
VB
Input resistor • typ. 300Ω
(note 1) Comparator ECN30102
VSP - ECN30107
+ ECN30206
typ. 200kΩ ECN30207
• typ. 150Ω
From CR pin
ECN30105
Equivalent Circuit ECN30204
2 HU Hall signal ECN30102 • Input a hall IC signal. Based on that signal, Data Sheet
HV input pin ECN30105 the system controls the phase switchover • 3.1. Truth table
HW ECN30107 of the output IGBT. • 4.2. Input Pins
ECN30204 • If a noise is detected, install a capacitor.
ECN30206 • The maximum input voltage is VB+0.5V.
ECN30207 The output voltage of hall IC must not
exceed the maximum input voltage.
note 1) Input resistor value
VB
• typ. 300Ω
typ.
ECN30102
HU 200kΩ
ECN30107
HV ECN30206
HW Input ECN30207
resistor
(note 1) • typ. 150Ω
ECN30105
ECN30204
Equivalent Circuit
3 FG Motor ECN30102 • Output pulses according to the input • 8-2. Electrical static destruction of
rotation ECN30105 signals of the HU, HV and HW. FG pin caused by external
speed ECN30107 • Motor rotation speed can be monitored by surge
monitoring measuring the frequency of output pulse.
pin ECN30204 • Output pulses according to the input Data Sheet
ECN30206 signals of the HU, HV and HW. • 3.2 Time chart
ECN30207 • Motor rotation speed can be monitored by
measuring the frequency of output pulse.
• Connect an external circuit such as a
pull-up resistor of around 5kΩ to 10kΩ to
VCC or CB pin.
CMOS output type Open drain output type

VB Applicable models VCC Applicable models

ECN30102 ECN30204
ECN30105 ECN30206
FG ECN30107 FG ECN30207

Equivalent Circuit Equivalent Circuit

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 IC-SP-06027 R1

Table 4-3. List of pins and their functions (pins common to all models) <Continued>
No. Applicable
Pin Item models Functions and Precautions Related items
4 DM Direction ECN30204 • High or Low level output according to the
of motor ECN30206 input signal of the HU, HV and HW.
rotation • Direction of motor rotation can be detected
detecting by measuring output voltage.
pin • Connect an external circuit such as a
pull-up resistor of around 5kΩ to 10kΩ to
VCC or CB pin.
• Direction of motor rotation relates to the
DM output, as shown below ;
Direction of
DM output
motor rotation
U --> V --> W L
U --> W --> V H

VCC

DM

Equivalent Circuit
5 UT Control ECN30611 • Input control signals of each arm. • 5-3. Power supply sequence
VT input pin ECN30601 • In each input, input the High level turns on • 5-7. Dead time
WT of each ECN30603 the output IGBT. The UT, VT, and WT
UB arm ECN30604 correspond to the top arm output IGBT. Data sheet
VB • The UB, VB, and WB corrrespond to the • 4.2. Input Pins
WB bottom arm output IGBT.
• The input voltage is 5V CMOS or TTL logic
level compatible.
• If a noise is detected, install a resistor
and/or capacitor.
• The maximum input voltage is VB+0.5V.
note 1) Input resistor value
VB • typ. 300Ω
UT
VT Input resistor ECN30611
WT (note 1) ECN30603
ECN30604
UB
VB typ. • typ. 150Ω
WB 200kΩ ECN30601

Equivalent Circuit

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 IC-SP-06027 R1

5. Functions and operational precautions

5-1. Protection function

(1) Detection of VCC under voltage (LVSD operation)

• When the VCC voltage goes below the LVSD operating voltage (LVSDON), the output IGBTs of the top
and bottom arms are all turned off regardless of the input signal.
• This function has hysteresis (Vrh). When the VCC voltage goes up again, the system goes back to a
state where the ouput IGBT operates according to the input signal at a level equal to or exceeding the
LVSD recovery voltage (LVSDOFF).

LVSD operation LVSD recovery

VCC voltage

LVSD recovery voltage

(LVSDOFF) LVSD hysteresis
(Vrh)
LVSD operation voltage
(LVSDON)

Operation according All off regardless of the Operation according to

to the input signal input signal the input signal
IGBT
operation (LVSD operation status)

Fig. 5-1. Timing chart for detection of VCC under voltage (LVSD operation)

(2) Current limitation

(a) Operation description
• The system monitors the current flowing through the shunt resistance Rs at the RS pin (see Fig. 5-2).
When the reference voltage for current limitation (Vref = typ. 0.5V) is exceeded, the IGBT of the
bottom arm is turned off.
• Reset after current limitation is performed in each cycle of the internal clock signal (VTR pin voltage).
(See Fig.5-3.)

VS
VS1 VS2

MU
MV
MW
- Motor
+
Vref

RS GH1 GH2
RS
Is

Fig. 5-2. Current of shunt resistance (typical)

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 IC-SP-06027 R1

Reset
signal

VTR pin
voltage

Over current detected

Delay

Current limit setting

IO
Delay
Power Supply current
IS

Lower arm IGBT operation ON OFF ON

Current limitation
performed
IGBT off Current limitation reset

Fig. 5-3. Timing chart for current limitation

(b) How to set up

• The current limitation setting IO is calculated as follows ;
IO = Vref / Rs
where
Vref: Standard voltage for current limitation
Rs: Shunt resistor
• In setting a current limit, you should allow for Vref variance, Rs resistance variance, and the delay
between the time the over current limitation is detected and the time the IGBT is turned off.
• This function is not effective for currents that do not flow forward through the shunt resistor, such as
reflux current and power regenerative current (see Figs. 5-4 and 5-5). In practice, users are
requested to observe and check the output currents (the coil currents of the motor) of the IC.

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 IC-SP-06027 R1

VS VS
VS1 VS2 VS1 VS2

MU MU
MV MV
MW MW
Motor Motor

RS GH1 GH2 RS GH1 GH2

RS RS

Fig. 5-4. Example to Reflux current Fig. 5-5. Example to Power regenerative current

(c) Noises of the RS pin

• The RS pin contains a filter having a time constant of about 1μs.
• If the system malfunctions due to a noise, an effective solution is to add a filter externally. However,
beware that the external filter increases the delay time before the IGBT turns off.

typ. 200kΩ VB
typ. 220kΩ Comparator
GH1, Rf
GH2 - S
Rs Cf
RS Input resistor
typ. 5pF + Latch
(Note) R
Vref
External filter
(Inside the IC) Interlock clock trigger
Note) See the section "RS" of Pin Name in Table 4.2 for the input resistor value.
Fig. 5-6. Example to add external filter

(d) Precautions on wiring

• Make the wiring of the shunt resistor Rs as short as possible. The GH1 and GH2 are connected to the
IGBT emitter. If the wiring has a high resistance or inductance component, the emitter potential of the
IGBT changes, perhaps resulting in the IGBT malfunctioning.
• Connect the GH1 and GH2 pins near the pin. If the resistance components of the wiring is poor
balanced between the GH1 and GH2 pins and the shunt resistor Rs, the current limit levels in each
phase may not be equal.

(e) Motor lock

• This IC does not contain a protection function against motor lock.
• If the motor locks, the phase where the output IGBT turns on is fixed, resulting in a constant
current-limited state. This produces a major loss, which results in IC temperature increase and IC
gets destroyed.

(3) Protection against short-circuit

• This IC does not contain a protection function against short-circuits (such as load short-circuit, earth fault,
and short-circuit between the top and bottom arms).
• A short-circuit produces a large current exceeding the maximum rating in the IC. The IC may therefore
get destroyed.

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 IC-SP-06027 R1

5-2. Charge pump circuit

(1) Description of operation

• Fig. 5-7 shows a block diagram of a charge pump circuit. The SW1 and SW2 repeat turning on and off
alternatively, synchronously with the internal clock.
• When the SW1 is off and the SW2 is on, the CL pin has a potential of 0V. Through the passage (1),
charge the capacitor C1.
• Next, the SW1 is turned on and the SW2 is turned off, and the CL pin rises in potential to the VS level.
Through the passage (2), the charge of the capacitor C1 is pumped up to the capacitor C2.
• This operation is repeated with the frequency of the internal clock, and the charge is given to the
capacitor C2.
• The capacitor C2 constitutes a power supply for the drive circuit for the top arm.

+
- C2 C+ VS1,VS2
C-
Vs

(2) SW1
Top arm
D2
Driver
C1
+ -
CL
MU,
D1 (1)
MV,
MW
Internal
Vcc clock
SW2

GH1,GH2

GL

Fig. 5-7. Charge pump circuit

- 16 -
 IC-SP-06027 R1

5-3. Power supply sequence

(1) Power supply sequence free type

• ECN30107, ECN30611, ECN30207, ECN30604, ECN30206 (below 1A), ECN30603 (below 1A)

(2) Power supply sequence setting type of the VSP-input type and 6-input type is described below.
• ECN30102, ECN30105, ECN30204 : Refer to (3) (a) VSP-input type
• ECN30601 : Refer to (3) (b) 6-input type

(3) How to set Power supply sequence

(a) VSP-input type
• Recommended sequences are as follows:
At power-up: VCC on --> VS on --> VSP on
At power-down: VSP off --> VS off --> VCC off
If any sequence is involved other than those specified above, please refer to Tables 5-1 and 5-2.
• When the VSP is no higher than the VSAWL, the power sequence is free.
• As for the sequences No. 2 and 5 in Table 5-1, if the VS line gets noisy before the VS is powered up after
the VCC and VSP are applied, the ON signal of the upper arm IGBT is reset and the motor may not start
up. In such a case, first reduce the VSP to a level no higher than the all-off operating voltage (Voff), then
apply it.
• In the case of No. 4 and 6 in Table 5-1 and No. 4 and 6 in Table 5-2, see "Current Derating for Power
Sequence and Vcc Voltage" of the Product Specifications.

Table 5-1 Power up sequence (VSP-input type) Table 5-2 Power down sequence (VSP-input type)
Permit or Permit or
No. (1) (2) (3) Inhibit No. (1) (2) (3) Inhibit
1 VCC VS VSP Permit 1 VSP VS VCC Permit
2 VCC VSP VS Permit 2 VS VSP VCC Permit
3 VS VCC VSP Permit 3 VSP VCC VS Permit
4 VS VSP VCC Inhibit 4 VCC VSP VS Inhibit
5 VSP VCC VS Permit 5 VS VCC VSP Permit
6 VSP VS VCC Inhibit 6 VCC VS VSP Inhibit

(b) 6-input type

• Recommended sequences are as follows ;
At power-up: VCC on --> VS on --> "Control input" on
At power-down: "Control input" off --> VS off --> VCC off
For any sequence other than those specified above, see Tables 5-3 and 5-4.
• The power sequence is free if the lower arm control inputs UB, VB, and WB are all low (L) and if the
upper control inputs UT, VT, and WT are all low (L).
• In the sequences No. 2 and 5 in Table 5-3, after the VCC and "control input" are applied, when a noise
enters the VS line before VS power-up, the ON signal of the top arm IGBT can be reset and the motor
may not start up. In such a case, the control inputs (UT, VT, and WT) for the top arm should be set to low,
then power the system up again.
• In the case of No. 4 and 6 in Table 5-3 and No. 4 and 6 in Table 5-4, see "Current Derating for power
supply sequence and Vcc voltage" of the product specifications.

Table 5-3 Power up sequence (6-input type) Table 5-4 Power down sequence (6-input type)
Permit or Permit or
No. (1) (2) (3) Inhibit No. (1) (2) (3) Inhibit
1 VCC VS Control Input Permit 1 Control Input VS VCC Permit
2 VCC Control Input VS Permit 2 VS Control Input VCC Permit
3 VS VCC Control Input Permit 3 Control Input VCC VS Permit
4 VS Control Input VCC Inhibit 4 VCC Control Input VS Inhibit
5 Control Input VCC VS Permit 5 VS VCC Control Input Permit
6 Control Input VS VCC Inhibit 6 VCC VS Control Input Inhibit

- 17 -
 IC-SP-06027 R1

5-4. VB power supply

• The VB power (VB = typ. 7.5V) to be output to the CB pin is generated at the VCC power. The VB power
is supplied to the IC internal circuits such as the triangular wave oscillation circuit, over current detection
circuit and so on.
• The VB power circuit constitutes a feedback circuit (see Fig. 5-8). To prevent oscillation, connect a
capacitor C0 to the CB pin.
• The recommended capacity for the C0 is 0.22μF ± 20%. If any value other than the recommended one is
to be used, refer to the below precautions and determine a suitable capacity.

<Precautions>
• As shown in Fig. 5-9, the CB pin may be oscillated depending on the C0 capacity and the output current
IB.
• The larger the C0 capacity is, the more stable the VB power supply is. It is recommended, however not to
set the capacity figure to an excessive level. As a guide, it should be 2μ to 3μF or less in the
non-oscillated region.

CB pin
IB
VCC pin

Reference C0 External
Voltage Internal circuit
source circuit

(Inside the IC)

Fig. 5-8. Equivalent circuit for the VB power supply

Specification: 25mA maximum

10

1
C0 (μＦ)

0.1

Oscillation
0.01
0 5 10 15 20 25 30
Output current IB for VB power supply (mA)

Fig.5-9. IB and C0 dependence of CB pin oscillation (reference data)

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 IC-SP-06027 R1

5-5. Operation of the output IGBTs of the VSP-input type

(Applicable models: ECN30102, ECN30105, ECN30107, ECN30204, ECN30206, ECN30207)

(1) PWM operation

• PWM signals are generated by comparing the VSP input voltage and triangular signal (CR pin voltage).
• Chopping with PWM is conducted by the lower arm. (See Fig.5-10.)
VSP input voltage > triangular signal; the lower arm IGBT on
VSP input voltage < triangular signal; lower arm IGBT off
• The PWM duty varies linearly between the bottom limit (VSAWL = typ. 2.1V) and the top limit (VSAWH =
typ. 5.4V) of the triangular wave amplitude level. It becomes 0% at VSAWL, and 100% at VSAWH.

VSAWH
(typ. 5.4V)
Triangular wave signal
(CR pin voltage)
VSP input voltage

VSAWL
(typ. 2.1V)

Lower arm IGBT

OFF ON OFF ON OFF ON OFF ON

Motor coil current

Power supply current IS

Fig. 5-10. Timing chart of PWM operation

(2) Output all-off function

(a) Function description
• When the input voltage of the VSP pin reaches or goes below the all-off operation voltage (Voff = typ
1.23V), this function turns off all the output IGBTs. The operation of the output IGBTs with regard to the
VSP input voltage conforms to Table 5-5.

Table 5-5. Operation of the output IGBTs with regard to VSP input voltage
VSP input voltage Top arm IGBT Bottom arm IGBT
0V≦VSP＜Voff ( typ. 1.23V) All off All off
Voff (typ. 1.23V) ≦VSP＜VSAWL (typ. 2.1V) As per hall signal input All off
VSAWL (typ. 2.1V) ≦VSP As per hall signal input As per hall signal input

(b) Precautions
• When the output all-off function is activated while the motor is rotating, a regenerative current is
generated in the VS power supply, in some cases resulting in the VS power voltage rise. Keep the VS
pin voltage equal to or below the maximum rating. Attention is particularly needed, when the capacity
between the VS and GND is small, where the voltage is more likely to rise.

- 19 -
 IC-SP-06027 R1

5-6. Internal Filter

(Applicable models: ECN30204, ECN30206, ECN30207, ECN30601, ECN30603, ECN30604)

• Internal Filter circuit is located before the Top and Bottom arm drivers (see Fig. 5-11.).
This filter circuit removes the signal and the noise, that width is less than about 1μs (see Fig. 5-12.).
Table 5-6. shows the effective pin of the internal filter circuit.
• The noise is coupled on Vcc line: The internal filter becomes effective, when the VCC level is dropped by
the noise, that is lower than LVSDON voltage and that width is about
1μs or less.

RU

D2 D1 VS
VCC(15V) RV

C2 +
RW
+ - C1
C0 -

CB HU HV HW C+ C- CL VS1 VS2

VCC VB
VB supply VB
Clock
Charge Pump
VCC
FG
FG
Top Arm Hall ICs
DM
Motor Rotating
Driver MU
MicroController Direction Filter Circuit
3-Phase MV
VSP PWM Comparator
+ Distributor MW
CMP
All off Bottom
+ arm off Bottom Arm
CMP
Driver Motor
VCC
SAW wave
Over Current Sense
Generator
Clock
LVSD +
Vref

CR VTR GL RS GH1 GH2

Note : Inside of bold line RTR

shows ECN30206 CTR RS

Fig.5-11. Block diagram of ECN30206

Input signal

Output signal

About 1 μsec or less Filter Circuit

About 1 μsec or less

Fig. 5-12. Operation of Internal Filter circuit
Table 5-6 The effective pin of the internal filter circuit
ECN30204 ECN30601
Model ECN30206 ECN30603
ECN30207 ECN30604
VCC* VCC*
HU UT
HV VT
HW WT
Effective Pin
VSP UB
CR VB
RS WB
RS
*) Effective only to the output signal of the LVSD Detection circuit.

- 20 -
 IC-SP-06027 R1

5-7. Dead time

(Applicable model: ECN30611, ECN30601, ECN30603, ECN30604)

• Since this IC has an output of consisting of a totem pole of IGBTs, the IC may get destroyed when the top
and bottom arm IGBTs of the same phase are turned on simultaneously. Therefore, allow for an internal
delay of the IC and determine a dead time.
• Here is how the dead time (TDI) of the input pin in the IC relates to the dead time (TDO) of the output pin.
TDO = TDI - TdOFF + TdON --------------------- (1)
where
TdON: Turn-on delay
TdOFF: Turn-off delay
• To prevent the simultaneous turning-on of the top and bottom arms, the TDO should be set to more than
zero.
From Equation (1), TDI > TdOFF - TdON is the required setting condition of the dead time TDI. The worst
case is when the TdOFF is maximum or TdON is minimum.
• The TdON and TdOFF have temperature-dependency (see Fig. 5-14 to Fig. 5-15). These should be
considered as well.
• The above discussion does not allow for the effects of the populated board wiring and other elements. In
practice, please monitor the power supply current and other factors, and check that the top and the
bottom arm IGBTs of the same phase are not turned on simultaneously.

UT input

Dead time TDI > TdOFFT - TdONB

UB input

Dead time TDI > TdOFFB - TdONT

Fig. 5-13. Typical dead time settings

- 21 -
 IC-SP-06027 R1

ECN306011 ECN30601

4.0 4.0

3.0 3.0
Turn on delay time

TdONT(μs)

TdONT(μs)
(Top arm)

2.0 2.0

1.0 1.0

0.0 0.0
-30 0 30 60 90 120 150 -30 0 30 60 90 120 150
o
Temperature Tj ( C) Temperature Tj (oC)

4.0 4.0

3.0 3.0
Turn on delay time

TdONB(μs)
TdONB(μs)
(Bottom arm)

2.0 2.0

1.0 1.0

0.0 0.0
-30 0 30 60 90 120 150 -30 0 30 60 90 120 150
o o
Temperature Tj ( C) Temperature Tj ( C)

4.0 4.0

3.0 3.0
TdOFFT(μs)

TdOFFT(μs)
Turn off delay time
(Top arm)

2.0 2.0

1.0 1.0

0.0 0.0
-30 0 30 60 90 120 150 -30 0 30 60 90 120 150
Temperature Tj (oC) Temperature Tj (oC)

4.0 4.0

3.0 3.0
TdOFFB(μs)

TdOFFB(μs)
Turn off delay time
(Bottom arm)

2.0 2.0

1.0 1.0

0.0 0.0
-30 0 30 60 90 120 150 -30 0 30 60 90 120 150
Temperature Tj (oC) o
Temperature Tj ( C)

Fig. 5-14 Temperature-dependency of TdON and TdOFF (1)

- 22 -
 IC-SP-06027 R1

ECN30603 ECN30604

4.0 4.0

3.0 3.0
Turn on delay time

TdONT(μs)

TdONT(μs)
(Top arm)

2.0 2.0

1.0 1.0

0.0 0.0
-30 0 30 60 90 120 150 -30 0 30 60 90 120 150
o
Temperature Tj ( C) Temperature Tj (oC)

4.0 4.0

3.0 3.0
Turn on delay time

TdONB(μs)
TdONB(μs)
(Bottom arm)

2.0 2.0

1.0 1.0

0.0 0.0
-30 0 30 60 90 120 150 -30 0 30 60 90 120 150
o o
Temperature Tj ( C) Temperature Tj ( C)

4.0 4.0

3.0 3.0
Turn off delay time

TdOFFT(μs)

TdOFFT(μs)
(Top arm)

2.0 2.0

1.0 1.0

0.0 0.0
-30 0 30 60 90 120 150 -30 0 30 60 90 120 150
Temperature Tj (oC) Temperature Tj (oC)

4.0 4.0

3.0 3.0
Turn off delay time

TdOFFB(μs)

TdOFFB(μs)
(Bottom arm)

2.0 2.0

1.0 1.0

0.0 0.0
-30 0 30 60 90 120 150 -30 0 30 60 90 120 150
Temperature Tj (oC) o
Temperature Tj ( C)

Fig. 5-15 Temperature-dependency of TdON and TdOFF (2)

- 23 -
 IC-SP-06027 R1

5-8. Calculation of power consumption

• Here are simple formulae for calculating of power consumption generated in the VSP-input type and the
six-input type. As for the constant required for calculation, contact our sales representative.

(1) VSP-input type (Inverter controlled 120-degree commutation mode, bottom arm PWM chopping)
(Applicable models: ECN30102, ECN30105, ECN30107, ECN30204, ECN30206, ECN30207)

Total IC power consumption; P = PIGBT + PFWD + PSW + Pr + PIS + PICC (W)

(1) Steady-state power dissipation of IGBTs

PIGBT = IAVE x VONT + IAVE x VONB x D (W)
(2) Steady-state power dissipation of Free Wheeling Diodes (FWDs)
PFWD = IAVE x VFDT x (1 – D) (W)
(3) Switching power dissipation of IGBTs
PSW = (Eon + Eoff) x fPWM (W)
(4) Recovery power dissipation of FWDs
Pr = 1/4 x (IrrT x VS x trrT x fPWM) (W)
(5) VS power supply consumption
PIS = VS x IS (W)
(6) VCC power supply consumption
PICC = VCC x ICC (W)

IAVE ; Average output current (see Fig. 5-16) (A)

VONT ; Drop in the output voltage of the top arm IGBT @ I = IAVE (V)
VONB ; Drop in the output voltage of the bottom arm IGBT @ I = IAVE (V)
D ; PWM duty
VFDT ; Forward voltage drop in the FWD of the upper arm @ I = IAVE (V)
Eon ; Switching loss when the IGBT is turned on @ I = IAVE (J/pulse)
Eoff ; Switching loss when the IGBT is turned off @ I = IAVE (J/pulse)
fPWM ; PWM frequency (Hz)
IrrT ; Recovery current of the FWD of the top arm (A)
trrT ; Reverse recovery time of the FWD of the top arm (sec)
VS ; VS power voltage (V)
VCC ; VCC power voltage (V)
IS ; Current consumption of the high-voltage circuit (A)
ICC ; Current consumption of the control circuit (A)

Note) FWD: Free Wheeling Diode

Iave
0

t1 Motor coil current (one phase worth)

Average output current Iave: average motor coil current during the period t1

Fig. 5-16. Current waveform of the motor coil (120-degree energization)

- 24 -
 IC-SP-06027 R1

(2) Six-input type (inverter controlled 180o sine wave commutation mode)
(Applicable model: ECN30611, ECN30601, ECN30603, ECN30604)
• The formula given below assumes the use of 180o sine wave commutation mode (all arms PWM
chopping).

Total IC power consumption; P = PIGBT + PFWD + PSW + Pr + PIS + PICC (W)

(1) Steady-state power dissipation of IGBTs

PIGBT = IP x VONTP x (1/8 + D/3π x cosθ) x 3 + IP x VONBP x (1/8 + D/3π x cosθ) x 3 (W)
(2) Steady-state power dissipation of Free Wheeling Diodes (FWDs)
PFWD = IP x VFDTP x (1/8 - D/3π x cosθ) x 3 + IP x VFDBP x (1/8 - D/3π x cosθ) x 3 (W)
(3) Switching power dissipation of IGBT
PSW = (EonP +EoffP) x fPWM/π x 6 (W)
(4) Recovery power dissipation of FWDs
Pr = 1/8 x (IrrT x VS x trrT x fPWM) x 3 + 1/8 x (IrrB x VS x trrB x fPWM) x 3 (W)
(5) VS power supply consumption
PIS = VS x IS (W)
(6) VCC power supply consumption
PICC = VCC x ICC (W)

IP ; Peak current (see Fig.5-17) (A)

VONTP ; Drop in the output voltage of the top arm IGBT @ I = IP (V)
VONBP ; Drop in the output voltage of the bottom arm IGBT @ I = IP (V)
(1 + D x sin t)/2 ; PWM duty power factor during the time t
cosθ ; Power factor
VFDTP ; Forward voltage drop in the FWD of the top arm @ I = IP (V)
VFDBP ; Forward voltage drop in the FWD of the bottom arm @ I = IP (V)
EonP ; Switching loss when the IGBT is turned on @ I = IP (J/pulse)
EoffP ; Switching loss when the IGBT is turned off @ I = IP (J/pulse)
fPWM ; PWM frequency (Hz)
IrrT ; Recovery current of the FWD of the top arm (A)
IrrB ; Recovery current of the FWD of the bottom arm (A)
trrT ; Reverse recovery time of the FWD of the top arm (sec)
trrB ; Reverse recovery time of the FWD of the bottom arm (sec)
VS ; VS power voltage (V)
VCC ; VCC power voltage (V)
IS ; Current consumption of the high-voltage circuit (A)
ICC ; Current consumption of the control circuit (A)

Note) FWD: Free Wheeling Diode

Ip
0

Motor coil current (one phase worth)

Fig.5-17. Current waveform of the motor coil (Inverter controlled 180o sine wave commutation mode)

- 25 -
 IC-SP-06027 R1

(3) Calculation of junction temperature

A junction temperature can be calculated by the following equation after measuring the temperature of the
IC case(Tab).

Tj = Tc + Rjc x P

Tj : Junction Temperature (oC)

Tc : IC case(Tab) Temperature (oC) (actual measurement)
Rjc : Thermal resistance of between junction and IC case (Tab) (oC/W)
P : Total IC power consumption (W)

• Measuring method of Tc
The thermo-couple is set in the tab of IC (heat sink) and temperature Tc of the IC case is measured.
The temperature of Tc has the time dependency, please measure the temperature after it is saturated.

5-9. Derating

How much to derate a unit from the maximum rating is an important issue to consider a reliable design.
Items to be considered in the stage of system design include the derating of voltage, current, power, load,
and electric stresses, along with the derating of temperature, humidity and other environmental conditions
and vibration, impact and other mechanical stresses.

Table 5-7 specifies the standard examples of derating to be considered a reliable designing. To consider
these derating items in the stage of equipment design is desirable from the point of reliability securement. If
any item is difficult to control within the standard, another means will be necessary, such as selecting a
device having higher maximum ratings. Please consult our sales representative in advance.

Table 5-7. Typical derating design standards

Item Typical derating standards (example)
o
Junction temperature Tj 110 C maximum
ECN30102, ECN30105
185V maximum
ECN30107, ECN30611
VS power supply voltage
ECN30204, ECN30206, ECN30207
450V maximum
ECN30601, ECN30603, ECN30604

- 26 -
 IC-SP-06027 R1

5-10. External components

(1) Standard external components

Table 5-8. External components

Applicable models Parts Typical value Usage Remarks
Common C0 0.22 μF +/-20% Filters the internal Stress voltage is VB (=8.2V)
power supply (VB)
Rs Sets Over-Current limit Please refer to the 4-1 (2) Note1
CTR 1800 pF +/-5% Sets PWM frequency Stress voltage is VB (=8.2V) Note2
RTR 22 kΩ +/-5% Sets PWM frequency Stress voltage is VB (=8.2V) Note2
RU, RV, RW 5.6 kΩ +/-5% Pull-up
C1, C2 1.0 μF +/-20% For charge pump Stress voltage is Vcc Note3
Hall IC Asahi Kasei EMD For detecting the rotor For reference Note4
EW-632 or position
equivalent
ECN30204, ECN30206, D1, D2 Hitachi DFG1C6 For charge pump 600V, 1A, trr ≤ 100ns Note3
ECN30207, ECN30601, (Glass mold type)
ECN30603, ECN30604 DFM1F6 (Resin
mold type) or
equivalent
ECN30102, ECN30105 D1, D2 Hitachi DFG1C4 For charge pump 400V, 1A, trr ≤ 100ns Note3
ECN30107, ECN30611 (Glass mold type)
DFM1F4 (Resin
mold type) or
equivalent

RU

D2 D1 VS
VCC(15V) RV

C2 +
RW
+ - C1
C0 -

CB HU HV HW C+ C- CL VS1 VS2

VCC VB
VB supply VB
Clock
Charge Pump
VCC
FG
FG
Top Arm Hall ICs
DM
Motor Rotating
Driver MU
MicroController Direction
Filter Circuit

3-Phase MV
VSP PWM Comparator
+ Distributor MW
CMP
All off Bottom
+ arm off Bottom Arm
CMP
Driver Motor
VCC
SAW wave
Over Current Sense
Generator
Clock
LVSD +
Vref

CR VTR GL RS GH1 GH2

Note : Inside of bold line RTR

shows ECN30206 CTR RS

Fig.5-18. Block diagram of ECN30206

Table 5-8 and Fig. 5-18 are only for reference, select external components based on your system.

Note 1: Please shorten the wiring between the resistor Rs and the Rs pin, and the wiring between the
resistor Rs and the GH1/GH2 pins as much as possible.
- 27 -
 IC-SP-06027 R1

Note 2: The PWM frequency is approximated by the following equation:

PWM Frequency (in Hertz) ≅ 0.494 / ( CTR x RTR )
Note: CTR is in Farads, RTR is in Ohms.
• Please set the maximum frequency of PWM is 20KHz or less.
• When the PWM frequency is set a high frequency, the switching loss is increased. And it
produces an increase in temperature of IC.
• Please confirm the increased IC temperature with an actual set, and use it in the range of
derating curve.

Note 3: Attention of part setting of charge pump circuit

The following attention is necessary when used excluding the standard part.
• When the voltage (Vcp) between C+ and C- is dropped, the gate voltage of top arm IGBTs is
dropped. And then the loss of IC increases. Vcp must not become Vcp<10V.
Capacitor
• Vcp is dropped by the internal dissipation current from C+ terminal of IC, when capacity is
small.
• The voltage impressed to the capacitor becomes VCC in operation. Therefore, the withstand
voltage of the capacitor is necessary more than the VCC voltage.
Diode
• Forward voltage (VF) recommends the small one as much as possible. Because of, Vcp is
dropped when VF is large.
• Reverse recovery time (trr) recommends the small one as much as possible. Because of,
Reverse recovery charge (Qrr) becomes large at charge pump operation when trr is large.
And then, VCP is drop.
• The withstand voltage of the diode is needed more than the VS voltage because CL is
changed from about 0V to VS.
• The rush current flows to diode D1 and D2 by charging with capacitor C1 and C2 when the
VCC power supply is turned on by VS=0V. Please select the ratings current of the diode in
consideration of this current.

Note 4: When the VB supply is used for the power supply of Hall ICs, please select Hall IC in
consideration of VB output current. The VB output current must be less than 25mA.

(2) Other external parts

• Parts of Table 5-9 are recommended to be arranged to protect stabilization and IC of the power supply
from the voltage serge.
• Please adjust the part setting according to usage conditions. And also, please set up each part close to
the terminal of IC to achieve the effect of the voltage serge absorption.

Table 5-9
Parts Purpose Remarks
Cvcc1 for High frequency noise suppressing Ceramic capacitor with good frequency response etc.
Cvcc2 for Vcc power supply smoothing Electrolytic capacitor etc.
ZDvcc for Over voltage suppressing Zener diode with good frequency response etc.
Cvs1 for High frequency noise suppressing Ceramic capacitor with good frequency response etc.
Cvs2 for Vs power supply smoothing Electrolytic capacitor etc.
ZDvs for Over voltage suppressing Zener diode with good frequency response etc.

- 28 -
 IC-SP-06027 R1

6. Handling Instruction

6-1. Mounting

(1) Insulation between pins

• High voltages are applied between the pins of the numbers specified below. Hitachi advises to apply
coating or molding treatment.
1 - 2, 2 - 4, 6 - 7, 8 - 9, 9 - 10, 20 -21, 21- 22, 22 -23
• Coating resin comes in various types. There are some unclear points as to how much thermal and
mechanical stresses are exercised on semiconductor devices by size, thickness, and other factors of
board shape, and the effects of other components. In selecting coating resin, please consult with your
manufacturer.

(2) Connection of tabs (radiator panels of the ICs)

• Fig. 6-1 is a cross section of the IC. The tab and the GL pin of the IC are connected with high
impedance (Rp = hundreds of KΩ to several MΩ).
• Set the tab potential to open or GND.
• If the tab is mounted on the external cabinet of the motor for heat radiation purpose, the IC cannot
withstand an isolation withstand voltage test where a high voltage is applied between the external
cabinet and the ground. Please apply a mylar sheet or something similar between the IC tab and the
external cabinet.

(SiO2)
To GL pin Aluminum wire
Isolation layer

N P

N N

Rp

Substrate

To tab

Fig. 6-1. Cross section of Hitachi HVIC

(3) Soldering conditions

• The peak temperature of flow soldering* must be less than 260oC, and the dip time must be less than
10 seconds. High stress by mounting, such as long time thermal stress by preheating, mechanical
stress, etc, can lead to degradation or destruction. Make sure that your mounting method does not
cause problem as a system.

* Flow soldering: Only pins enter a solder bath, while the resin or tab does not.

- 29 -
 IC-SP-06027 R1

6-2. Antistatic measures

• Containers and jigs for transporting ICs should be designed not to get charged under vibration or other
impact during transportation. One effective measure is to use a conductive container or aluminum foil.
• Ground all work benches, machines and devices, meters, and other units that may get in contact with the
ICs.
• While handling an IC, ground your body with a high resistor (about 100kΩ to 1MΩ) to prevent breakdown
due to static electricity that has charged your body and/or clothes.
• Do not produce any friction with other polymer compounds.
• To move any printed circuit board or other component equipped with an IC, make sure that no vibration or
friction occurs and short-circuit the pins to keep the potential at the same level.
• Exercise control so that the humidity does not go too low.
• Take enough care in handling to prevent the breakdown of ICs due to static electricity.

7. Quality

7-1. Quality tests

• Table 7-1 shows the main quality tests performed by our company.

Table 7-1
No. Test item Test conditions
1 High temperature operation VCC=VCCop, VS=Vsop, Tj=135oC, t=1000h
2 Motor rotation continuousness operation VCC=VCCop, VS=Vsop, Tj=135oC, t=1000h
3 High temperature storage Ta= 150oC, t=1000h
4 Low temperature storage Ta= -40oC, t=1000h
5 Temperature cycle -65oC to room temperature, 150oC,
100cycles (30min, 5min, 30min)

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 IC-SP-06027 R1

7-2. Quality Control Flow

Process Process Classinfication Control Method
Control Item Remarks
Flow No. Process name Contents Sampling
Sillicon Wafer incoming Resistivity
1 1 Wefer receive insupection Sampling [Process symbols]
inspection Thickness
: Incoming
2 2 DI (dielectric isolation) DI condition Appearance Size All : Inspection
: Processing or
Photo lithography machining
3 3 Photo lithography Pattern Form Sampling
condition
Resistivity Gate
4 4 Diffusion Diffusion condition Sampling
oxidation thickness
Metal evaporation Thickness
5 5 Metal evaporation Sampling
condition Appearance
Surface protection film Surface protection film Thickness
6 6 Sampling
deposition deposition condition Appearance
Wafer thickness
7 7 Back grinding Grinding condition Sampling
Appearance
Metal evaporation Thickness
8 8 Back metal evaporation Sampling
condition Appearance
Electrical
9 9 Wafer Probing Electrical characteristic All
characteristic

Assembling parts Assembling parts receive

10 10 Appearance Size Sampling
incoming inspection inspection

11 11 Dicing Dicing condition Appearance Sampling

12 12 Pellet appearance check Appearance Appearance Sampling

13 13 Die bonding Bonding condition Appearance Sampling

14 14 Joining Joining condition Appearance Sampling

15 15 Wire bonding Wire bonding condition Appearance Sampling

16 16 Molding Molding condition Appearance Sampling

17 17 Lead plating Lead plating condition Appearance Sampling

Marking Marking condition

18 18 Appearance Sampling
Cutting bending Appearance

Assembly final
19 19 Appearance Appearance Sampling
appearance check

Characteristic Characteristic
20 20 Screening All
Appearance Appearance
Characteristic Characteristic
21 21 Final check Sampling
Appearance Appearance Size

Type The number

22 22 Store Checking Sampling
Inventory code

Type The number

23 23 Shipping inspection Checking Sampling
Inventory code

24 Packing・ Shipping Shipping guide - -

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 IC-SP-06027 R1

8. Inverter IC Handling Note

8-1. Electrical static destruction of VSP pin caused by external surge

Cause The external surge on the VSP line of the motor was put into IC directly.
Phenomenon The VSP signal is not transmitted in IC, and the motor doesn't rotate.
Countermeasure The series resistance is inserted so that the external surge is not put into IC directly.
In addition, if capacitor is added, it becomes more effective.

<Pin name of Motor>

VSP pin
Inverter IC VSP

GL pin GND

<Motor populated board>

Fig. 8-1. Example to configuration for external parts of VSP

8-2. Electrical static destruction of FG pin caused by external surge

Cause The external surge on the FG line of the motor was put into IC directly.
Phenomenon The FG signal of the IC is not monitored.

Countermeasure The buffer circuit using the transistor is used on the motor populated board so that
the external surge is not put into IC directly.

<Terminal name of Motor>

CB pin
FG
FG pin
Inverter IC

GL pin GND
<Motor populated board>

Fig. 8-2. Example to configuration for external parts of FG (CMOS output case)

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 IC-SP-06027 R1

8-3. IC destruction by external surge inputted to VS and VCC line (1)

Cause The external surge on the VS and VCC line of the motor was put into IC. Because the
Zener voltage of the surge suppressor diode was higher than the maximum rating
voltage of IC, it did not protect IC.
Phenomenon The motor doesn't rotate by the over voltage destruction of IC.

Countermeasure Use the surge suppressor diode of the Zener voltage, which is lower than the
maximum rating voltage of IC.

8-4. IC destruction by external surge inputted to VS and VCC line (2)

Cause The external surge on the VS and VCC line of the motor was put into IC. Because the
capacity of bypass capacitor for surge suppression was small, surge was not able to
be suppressed enough.
Phenomenon The motor doesn't rotate by the over voltage destruction of IC.
Countermeasure Use the bypass capacitor for surge suppression, which capacity should be enough to
suppress surge.

Small capacity case

Large capacity case

Fig. 8-3. Example to surge waveform by difference of capacity of bypass capacitor

8-5. IC destruction by external surge inputted to VS and VCC line (3)

Cause The external surge on the VS and VCC line of the motor was put into IC. Because the
position of external parts for surge suppression on the motor populated board was
bad, surge was not able to be suppressed enough.
Phenomenon The motor doesn't rotate by the over voltage destruction of IC.
Countermeasure Bypass capacitor and Zener diode for surge suppression should be mounted close to
IC.

Far from IC

Close to IC

Fig. 8-4. Example to surge waveform by difference of the location on the board of bypass capacitor

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 IC-SP-06027 R1

8-6. IC destruction by line noise put into VCC (1)

Cause Pulsed noise of a voltage that is lower than LVSD level was put into VCC line of IC. In
this case, IC repeats split-second LVSD operation. Then, IC will have the possibility
of causing the overheating destruction.
Phenomenon The motor doesn't rotate by the overheating destruction of IC.

Countermeasure (1) The noise that is put into motor Vcc line is removed by reviewing the power supply
circuit(inductance and so on of power cable).
(2) Suppress the noise by mounting the capacitor of enough capacity between Vcc
and GND pin of IC. That capacitor should be mounted close to Vcc-GND pin of IC.

Noise pulse width: TL

Vcc voltage level : Vcc

Detect voltage of LVSD: LVSDON

Noise level : VccL

Vcc = 15V VccL ≦ 10V
TL ≅ 2μs

Fig. 8-5. Example to pulsed noise on Vcc at IC destruction

8-7. IC destruction by line noise put into VCC (2)

Cause The surge voltage that exceeds the maximum ratings of IC that was put into VCC pin
of IC.
Phenomenon The motor doesn't rotate by the over voltage destruction of IC.

Countermeasure (1) Mount a bypass capacitor C1 close to pin of IC. It's effective to use a capacitor
that has excellent frequency characteristics, such as a ceramic capacitor, as a
bypass capacitor. As a guide, ones of around 1μF are recommended (The larger
the capacity, the more effective it is.).
(2) It is more effective to mount a surge suppression device such as bypass capacitor
C2 close to connector of motor populated board like figure 8-6.

Motor populated board

Connector
Motor Power supply cable
IC
Vcc
VCC pin
V
C2 C1

Bypass Capacitor
PCB
Fig. 8-6. Example to mount surge suppression devices

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 IC-SP-06027 R1

8-8. IC destruction by relay noise of inspection machine

Cause A mechanical relay for On-off control of electric connection between IC and
inspection machine was used. Surge was generated when it was on-off, and it was
put into IC.
Phenomenon The motor doesn't rotate by the over voltage destruction of IC.

Countermeasure Use the wet relay (mercury relay etc.). Confirm surge is not generated when the relay
is on-off.

Fig. 8-7 Example to surge waveform when mechanical relay is used

8-9. Motor failure (missing phase output)

Cause The motor has missing phase output that was shipped to the set maker.
Phenomenon The motor might start depend on the position of the rotor when starting even if the
motor has missing phase output. Therefore, the missing phase output of motor
cannot be detected by the motor rotation test.

Countermeasure Monitor the Motor current or the torque pulsation in order to detect the missing phase
output of motor.

Normal

missing phase output

Fig. 8-8 Example to Motor current waveform of the motor that has missing phase output

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