Gurpreet Singh (2K20/ME/101)

Design and Analysis of Punching Die for

Cutting Process

Innovative Project
ME-207 : (Engg. Analysis and Design)

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‘Design and Analysis of Punching Die for
Cutting Process’
A PROJECT REPORT
SUBMITTED IN COMPLETE FULFILLMENT OF THE
REQUIREMENTS
FOR THE AWARD OF THE DEGREE
OF
BACHELOR OF TECHNOLOGY
Submitted by:
Gurpreet Singh
2K20/ME/101
(Mechanical Engineering)
Under the supervision of
Mr. Rajiv Chaudhary
DELHI TECHNOLOGICAL UNIVERSITY
(Formerly
Delhi College of Engineering)

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 DELHI TECHNOLOGICAL UNIVERSITY

CERTIFICATE

This is to certify that the project report entitled“ Design and Analysis
of Punching Die for Cutting Process ” submitted by Gurpreet Singh
2K20/ME/101 studying the second year of the Btech program in
MECHANICAL ENGINEERING have satisfactorily completed
project in the semester - 3 during the academic year 2021-22.

PROJECT SUPERVISOR

Mr. Rajiv Chaudhary

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 Abstract

This project shows a new punching die design for the transistor leadframe
process in the semiconductor industry, as well as a finite element analysis
(FEA) for this punching die and a comparison to the previous punching die to
show a decrease in stress and displacement value. This novel design can
extend the life of a punched die while also lowering maintenance costs. The
study approach was Design for Analysis (DFA), which enhanced the design
process dramatically. The maximum stress for the previous punch was
1.729Mpa, whereas the new punch had a stress of 1.296Mpa, according to the
finite element study. As a result, there has been a 25% decrease in stress. The
previous punch had a maximum strain of 2.138x10-6, whereas the new punch
had a strain of 1.603x10-6. As a result, around 25% of the strain was reduced.
In general, as compared to the old design, a new punch has less displacement.
Both orientations are taken into account while reducing ranges (positive and
negative).

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 Introduction
A tool is a gadget used to do certain activities. A tool is one of the pieces in a
die set that creates profiles of a product need, such as a punch tool for
trimming, in the field of die manufacture. The term 'death' is pretty broad,
therefore it's a good idea to narrow it down. When used in a broad sense, it
refers to a complete press tool that includes all components. A tool is one of
the pieces in a die set that generates a profile of a product need, such as a
punch tool for trimming, in the field of die manufacture. According on the
processing and die structure, dies are divided into different groups.
Trimming/cutting is at the End of Line (EOL) stage for transistor (MFPAK-3
Leads) production. Figure 1 shows the transistor before the trimming/cutting
operation, while Figure 2 displays the finished result.The main defect in this
process is lead burr. Major cause of lead burr is at trimming/cutting process.

Fig. 1. Transistor (MFPAK-3 leads) before trimming/cutting process.

Fig. 2. Transistor (MFPAK-3 Leads) finish products.

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Introduction of Transistor Manufacturing

Transistor is one of the semiconductor products. In semiconductor industry,

there are three stages of semiconductor manufacturing; Front of Line (FOL),
Middle of Line (MOL), and End of Line (EOL). Below is a process to
manufacture transistor (MFPAK-3 Leads) for every stages:-
1. Front of Line:
- Saw Process.
- Die Bond Process.
- Wire Bond Process.
2. Middle of Line:
- Molding Process.
- Plating Process.
- Marking process.
3. End of Line:
- Trimming/Cutting Process (Individual leads of the packaged device
are trimmed away from its lead frame strip).
- Testing.
- Taping.

Problem Statement
For semiconductor (MFPAK-3 Leads) manufacturing, the trimming/cutting
method occurrs at end of Line (EOL) stage. one in every of the defects that
happens during this process is lead burr. in line with measurement, tolerances
for lead burr are 0-25μm for J1 and 0-10μm for J2 as shown in figure 3:-

Fig. 3. Side view of transistor (MFPAK-3 leads).

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The most common source of lead burr is during the trimming/cutting
procedure. Figure 4 is an example of excellent and terrible trimming/cutting.
Under extreme conditions, punching chip will cause burr, and the punch will
break, resulting in catastrophic lead burr. Only critical issues can be detected
by AVI (Auto Visual Inspection), and the machine will instantly stop.

Because practically non-serious lead burr circumstances are out of

specification, engineers must figure out how to minimise the cut duration to
assure no slip through to the customer. The lead burr defect must be
rechecked and resolved by the inspection operator. As a result, if lead burr
occurs, it will have an impact on expenses such as material, labour, yield, and
the time required for rechecking and countermeasures.

Fig. 4. Illustration of trimming/cutting process.

Figure 5 shows out of specification for lead burr defect. Lead burr defect
always happens at an 1-side lead, not 2-side lead, because geometry of
punching. On one side lead, punching surface is thinner compared to the 2-
side lead. Thus, stress on 1-side lead is higher compared to 2-side lead and
easier to chip or break.

Fig. 5. Lead burr defect.

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 Previous Punch Related Researches

Size, form, and part geometry are among the 15 critical aspects to consider
during stamping design, according to fundamental design principles for a
successful deep drawing.

Engineer bigger plates, pins, and bushings into the die set design, which is the
first of 12 strategies to increase punch life. Using the biggest, shortest
(stubbiest) punch design increases the stability of the piercing tip diameter,
resulting in extended tool life.

It means that the geometry of any die is a key consideration during design to
guarantee that the die's lifetime is extended. As a result, some costs, such as
maintenance and part ordering, will be reduced.

During the design process, the die manufacturer will examine the geometry of
punching. Automatic hole punch is one of the patents. One or more punches,
a punching die, and a bore formed in the punching die for ridable insertion of
one or more punches were supplied in a hole punching equipment. Within the
punching die, a slot is made to receive the material to be punched.

A housing holds the punching, punching die, cams, and electric motor, as well
as a material slot constructed in its upper surface to align a material to be
punched relative to the punches.

Fig. 6. Cross-sectional view of the punching system showing the travel limit of the punching system..

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This shape, as shown in Figure 6, will ensure that the paper is cut neatly and
will make it easy to operate. The use of a punch or do with ground relief on its
face is a typical technique to minimize tool stress and therefore allow thicker
or more resistant stock to be punched on the same press or to allow the use
of lower-rated presses. Figure 7 depicts the punch geometry. In order to
depict the real element shape, the punch fillet given near to the intersection
of diameters D and D2 is taken into consideration in this analysis.

Fig. 7. Punch configuration with various punch shapes and slugs [4].

The radial stiffness of several types of tools is shown in Figure 8. Punches 2, 3,

and 4 have a shear angle of 22.5 degrees, whereas punches 1, 5, and 6 have a
shear angle of 0. When punch 2 with balanced convex shear is used, the
findings reveal a significant improvement in tool performance. If great
dimensional precision of a component is required, and a thicker or more
resistant blank material is to be punched on the same press, the results imply
that punch 2 should be used.

Fig. 8. Radial stiffness versus punch type.

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According to the findings of this study, the geometry of a punching tool is one
component that should be addressed while constructing it, because geometry
has a link with stress and will effect the punching tool's lifetime. For indirect
affection, product quality will be affected, and customer happiness will
increase. Grinding the face of the punch or die at a minor shear angle with the
horizontal when developing a blanking testing die will reduce the area in shear
at any given moment. Shear also reduces press shock and smooths out the
cutting process. The die design must take into account the following factors in
order to meet the functional requirements:
a) The chosen manufacturing method and its restrictions.
b) Tooling and equipment needs
c) Process capabilities, such as size, geometry, tolerances, and rate of
production
d) Incoming material properties under processing conditions.

Die design was primarily a hobby that required a lot of practise. It has,
however, been considerably improved by employing process modelling
approaches to: -
a) Calculate material flow and stress in the die.
b) Determine the best process parameters (machine and ram speeds,
die/mold and material temperatures, time under pressure, and so on).
c) Create die/mold features that are required to complete the procedure
(flash and draught in forging, binder surface and draw beads in stamping,
gates and runners in injection moulding and die casting).
d) Complete the product and die dimensions by forecasting and removing
faults while fine-tuning the process parameters to provide a reliable process.

Because dies and moulds are wear and tear parts, understanding the link
between stress and fatigue is critical. Die and moulds are key pieces in the
manufacturing industry, and they are regularly checked to ensure that they
work well, especially when it comes to die and mould lifespan. Companies
must pay a significant amount of money to update dies and moulds; else,
product quality will suffer. If dies and moulds can be made to last longer
throughout the design process, their lifetime will be extended, and
corporations will save a lot of money.

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 Design for Analysis
This study technique employed design for analysis (DFA) because it has the
potential to dramatically improve the design process. Figure 9 depicts the
process of product design. In traditional product design practise, review
occurs only after the manufacturing stage, and if the product fails to fulfil
quality or other need, the design of the product must be revised.

Fig. 9. Traditional product design process.

However, as illustrated in Figure 10, analysis is now being used after product
design and before production in the product design process. It means that any
changes may be made before the product is manufactured. Costs such as
material, time, and personnel may all be reduced by using this strategy. It can
assist designers in quickly identifying good designs.

Fig. 10. Recent trend in product design process.

The design for analysis approach can be used in any manufacturing business
to create products. This approach is used in the semiconductor manufacturing
business to assure excellent quality in the trimming/punching process since
product specification precision is very important, which is why it's vital to
analyse punching die before production. The stress and displacement analysis
will be the focus of this design. After developing a new punch, a comparison of
the old and new punching die designs will be made. Stress and displacement

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should be decreased to guarantee that the new design is accepted. As a result,
the punching die's lifetime can be extended.
Principle of Stress
The Von Mises stress is derived from the distortion energy theory and is a
simple way to combine stresses in three dimensions to calculate failure
criteria of ductile materials. In this way, the strength of material in a 3-D state
of stress can be compared to a test sample that was loaded in one dimension
[8].
By definition, the uniform normal stress (the Greek lowercase letter sigma)
is:-

F
  (1)
A

Where:-
= the normal stress in the cross-section.
F = the internal axial force at the section.
A = the cross-sectional area of the rod.

DESIGN OF PUNCHING DIE

Concept of Old Punch Design
Punches were designed using Solidworks 2007. Punches are made to cut
leadframe with precision during the cutting process. The tip of the punch is an
important feature since it is easily broken due to poor handling or
maintenance.

The position of the leadframe gate determines the design of the old punch.
It's made to keep leadframe gates out of the cutting process. It was crucial
because a conflict between the punch and the leadframe gate might result in
leadframe cracking or chipping. Figure 11 depicts the contact between the
punch and the leadframe prior to the cutting operation, and Figure 12 depicts
the location of the transistor gates in the leadframe.

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 Fig. 11. Contact between old punch with leadframe before cutting process.

The punch will clip transistors from the leadframe during the cutting operation.
This cutting technique is known as EOL (End of Line) in the semiconductor
industry. This punch can cut four transistors at once.

Fig. 12. Transistor gates position in leadframe.

Designing of New Punching Unit

A new punch is developed in the designing stage based on the existing punch
design. Only the tip of the punch undergoes modification. As a result, the
position of the leadframe gate affects the modification of a new punching
design. In Figure 13, a new straight bar punch may be created for the cutting
position of these transistors. The new punch's radius will be decreased in
proportion to the gate size, which is normally controlled during the MOL
(Middle of Line) procedure.

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 Fig. 13. New punch design.

ANALYSIS OF PUNCH

STRESS
The stress results for both punches are presented in the two figures below
(figures 14 and 15). According to these two data, the old punch's maximum
stress was 1.729 MPa and the new punch's was 1.296 MPa. As a result, stress
levels were reduced by roughly 25%. Maximum stress points are found at the
bottom of each punches. It signifies that the new punch was more difficult to
break than the previous punch, and that the new punch's lifetime may be
extended.

Fig. 14. Stress for old punch.

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 Fig. 15. Stress for new punch.
Figures 16 and 17 provide thorough descriptions of stress analysis at selected
nodes. Because the old punch has a large radius and the new punch has a tiny
radius, this spot was chosen to compare stress values. The greatest stress,
according to graph figure 16, was 1.146Mpa and occurred at node 435, while
the maximum stress, according to graph figure 17, was 0.7781Mpa and
occurred at node 401. In general, node stress levels are decreasing at this site.

As stated in table 1, the previous punch was 0.6195Mpa at node 1 and

0.5065Mpa at node 4, whereas the new punch was 0.4334Mpa at node 1 and
0.4846Mpa at node 4, for the identical nodes (node 1 and node 4). At node 1,
stress was reduced by roughly 30%, while at node 4, it was reduced by 4.3
percent. Node 4 had a slight stress decrease since its placement was not likely
to change.There was no modification at node 4, which is why stress difference
was very small.

Fig. 16. Stress value for old punch at chosen nodes.

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 Fig. 17. Stress value for new punch at chosen nodes.

Table 1: Comparison of stress between old and new punch for four nodes.

CONCLUSION
The highest stress for both the old and new punch was 1.729Mpa for the old
punch and 1.296Mpa for the new punch, according to the analysis. As a result,
stress levels were reduced by roughly 25%. The previous punch's maximum
strain was 2.138x10-6, whereas the new punch's was 1.603x10-6. As a result,
there was a 25% reduction in strain. As a result, displacement rose by around
88 percent. When compared to an older design, a new punch has less
displacement. According to these studies, a new punch outperformed an old
punch. It indicates that by employing this new punch, costs can be cut
because the punch's lifetime can be extended. As a result, this new punch may
go on to the manufacturing stage using the design for analysis (DA) method.

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 References
[1]Art Hedrick, Key Design Principles for successful Deep Drawing, Stamping
Journal, 2001.
[2]Jerry Dwyer, 12 Ways to Boost Punch Life, The Fabricator, 2007.
[3]Joseph Y. Ko, Automatic Hole Punch, US Pattern and Trademark Office,
2003.
[4]U. P. Singh, Design Study of The Geometry of a Punching/Blanking Tool,
Department of Mechanical and Industrial Engineering, University of Ulster,
Jordanstown, UK, 1992.
[5]Mohd Shahfizal bin Mohd Ruslan, Development of Blanking Testing Die,
German Malaysian Institute, 2003.
[6]Taylan Altan, Manufacturing of Dies and Molds, Department of Industrial,
Welding, and Systems Engineering, The Ohio State University, Columbus,
Ohio, USA, 2001.

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