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Guidelines for RF PCB Design and Microwave Materials Options
Introduction
Radio frequency (RF) printed circuit boards operate at frequencies from
30 kHz to 100 GHz and are essential components in wireless
communications, radars, broadcast systems and other high
frequency circuits. RF PCBs require specialized design expertise to
achieve the required signal integrity, transmission characteristics and
reliability.
This article provides a comprehensive set of guidelines for RF PCB
design covering layout considerations, stackup, material selection,
simulations, fabrication and assembly processes. Key microwave
substrate materials available for RF boards are also evaluated including
popular options like Rogers, Taconic, Isola and Arlon laminates.
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RF PCB Design Guidelines
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Following proven design strategies is critical when laying out
printed circuit boards for radio frequency and microwave
operating environments. Here are key guidelines to follow:
Board Stackup Design
Choose dielectric materials based on operating frequency,
loss tangent, thermal conductivity and CTE requirements
Minimize number of laminate materials if possible
Use symmetric stackup with controlled impedance layers
Include thin dielectric cores and prepregs where needed
Incorporate buried and blind vias for layer transitions
Model and simulate stackup in 3D EM tool and run signal
integrity analysis
Trace Routing
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Keep trace lengths as short and direct as possible
Avoid 90° turns on traces, use 45° mitred bends
Route adjacent traces orthogonally to avoid coupling
Provide clearance between traces based on voltage levels
Use curved and tapered bends to improve impedance
matching
Verify trace width and spacing for controlled impedance
Components Placement
Position components for shortest high speed links
Orient directional components properly
Keep RF input and output ports accessible
Group frequently interacting devices together
Separate analog and digital sections
Allow space for routing and tuners around devices
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Grounding Design
Use continuous copper fills for ground plane
Provide multiple vias connecting ground layers
Surround RF traces for return current with ground
Use distinct grounding for analog and digital circuits
Connect all board grounds at single point
Include periphery ground stitching vias
Layer Strategy
Assign plane layers appropriately – RF, ground, power
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Place sensitive traces between ground layers
Ensure uninterrupted reference planes
Use power planes to isolate circuits
Adjust layer count based on complexity
Optimize for EMI control, thermal and mechanical needs
Passive Integration
Include passives like capacitors and resistors
Select footprints for available components
Place passives close to ICs they support
Use buried resistors and capacitors if possible
Consider transmission line structures
Transitions and Terminations
Taper microstrip trace width when changing layers
Use via fences for common ground connections
Match trace width to pad width for smoother transition
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Include backdrilling for unused via portions
Add resistors for proper trace termination
Shielding and Partitions
Divide board sections with ground planes
Use electromagnetic bandgap structures
Place sensitive traces between ground layers
Add metal shielding enclosures if needed
Include edge plating for shielding and connections
Simulations
Perform 3D EM and SPICE simulations
Model entire board including devices
Run worst case tolerance analysis
Verify impedance, losses, frequency response
Tune design prior to fabrication
Materials
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Select materials based on dielectric constant, loss tangent needs
Use materials with tight dielectric constant tolerance
Confirm Dk and Df stability over freqeuncy
Evaluate moisture absorption, Tg glass transition temperature
Obtain certified laminates from reputable suppliers
Microwave Substrate Materials for RF PCBs
RF PCB substrates should provide stable dielectric constant and low
loss tangent over the operating frequency range. Some commonly
used microwave laminate materials are:
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Rogers Corporation
Rogers is a leading producer of printed circuit materials for high
frequency applications in aerospace, defense, automotive radar and
wireless communications. Popular microwave laminates from Rogers
include:
RO3003TM – Glass microfiber filled PTFEsubstrate with low Dk
and Df
RO4350BTM – Woven glass reinforced, ceramic-filled laminate
with high dielectric constant
RT/duroid® 6002 – Ceramic filled PTFE material with tight Dk and
Df tolerances
RO4835TM – Glass microfiber filled, ceramically loaded laminate
TMM® 10i – Woven glass reinforced, ceramic-filled PTFE material
Taconic
Taconic manufactures a broad range of RF laminates including:
TLY-5TM – Low loss thermoset laminate for analog circuits
TLC-30TM – Low Dk glass microfiber PTFE composite
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RF-35TM – Ceramic filled PTFE material for broadband
applications
RF-60TM – Thin film ceramic filled fluoropolymer laminate
TacPreg® – Low loss thermoset prepregs available in various
Dk
Isola
Isola offers high performance copper clad laminates including RF
materials:
IS680 – Low Dk glass weave reinforced laminate
FR408HR – High performance FR-4 with tight dielectric
tolerance
P96 – High thermal reliability FR4 material
Getek® – Glass microfiber reinforced fluoropolymer
substrates
ISOLA Astra MT77 – Composite material for broadband
applications
Arlon
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Arlon specializes in high performance laminates for microwave
and thermal management applications:
CLTE-XT – Low Dk glass reinforced hydrocarbon ceramic
laminate
CLTE-AT – Glass reinforced PTFE composite material
55NT – Non-PTFE, thermoset microwave substrate
25N – Economical woven glass reinforced laminate
Park Electrochemical
Park Electrochemical provides NelsonicTM RF/microwave
laminates including:
N9000-13EP – Tight tolerance woven glass reinforced
substrate
N9000-13SI – Filled ceramic PTFE composite material
N9120-4 – High frequency laminate with PPS thermoplastic
reinforcement
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Fabrication and Assembly Considerations
Fabricating RF PCBs requires specialized expertise and processes for
controlled impedance, tolerances, surface finishes and reliability.
Key RF board fabrication and assembly guidelines:
Maintain excellent impedance tolerance of ±5% or better
Use industry standard IPC laminate test vehicles for validation
Implement controlled environment conditions –
temperature, humidity
Confirm surface roughness, copper thickness, dielectric values
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Utilize impedance controlled bondply innerlayer materials
Employ sequential lamination process
Implement rigorous quality inspection procedures
Verify plating quality – surface, hole wall, via filling
Use automated optical inspection (AOI)
Perform electrical testing like time domain reflectometry
Include fixture and jig design for repeatable assembly
Execute thermal profiling for soldering processes
Conduct shock and vibration testing on assemblies
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Conclusion
Designing and producing RF PCBs for wireless and microwave
applications requires the right design rules, material selection,
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modeling tools and manufacturing processes. This article
summarized best practices guidelines covering stackup, layout,
grounding, layering, shielding, simulation, materials selection and
fabrication processes essential for high frequency
PCB development. Popular microwave laminate materials from
leading suppliers were also compared. Following these proven
strategies will help RF design engineers achieve excellent signal
integrity and reliable performance in their wireless, radar and
communication systems.
Frequently Asked Questions
Here are some common questions about RF PCB design
guidelines and materials selection:
Q: What are the most important RF PCB design guidelines to
follow?
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The most crucial considerations are controlled impedance traces,
minimizing trace lengths, proper grounding techniques, layer
stackup strategy, simulation/analysis and selecting the
right microwave materials.
Q: How are materials chosen for RF PCBs?
Materials are selected based on the dielectric constant, loss
tangent, frequency stability, thermal performance and cost
requirements of the application. Important parameters are Dk
tolerance, Df, Tg, moisture absorption.
Q: What fabrication process is used for RF PCB manufacturing?
A sequential lamination process with automated impedance
control and testing ensures the best impedance tolerance and
reliability. Maintaining process controls is critical.
Q: What tests are performed to validate RF PCBs?
Testing includes impedance, high-pot testing, time domain
reflectometry, VSWR measurements, thermal stress testing
and microsection analysis to confirm trace integrity.
Q: What interface design issues need consideration on RF PCBs?
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Careful design of interfaces between board layers, components,
connectors and external systems ensures smooth RF
signal transmission. Simulations help identify potential issues.
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