PCB Raw Materials

RAYMING PCB & ASSEMBLY
PCB Raw Materials
PCB Laminate Material and

Its Manufacturers
PCB Laminate Technical informations
KB FR4-61606160A6160C RAW Material TECHNICAL
INFORMATION data sheet Click to down
PCB Manufacturing & Assembly Services https://www.raypcb.com/



The premium types of raw material are well-known brands in
the printed circuit board (PCB) industry, which guarantees the steady
product quality of RayPCB. More attention has been focused
on establishing long-term relationships between raw material suppliers
and RayPCB to ensure the stability and reliability of timely material
supply.
This friendly relationship leads to mutual support and growth.
Here you may review our list of PCB laminate material suppliers. We
offer for fabrication of your printed circuit boards these materials,
such as glass fiber epoxy laminates, special high performance
laminates, and more. Your choice of laminates will depend on your
application. If you need assistance selecting the right material, please

contact the helpful customer service representatives at RayMing
Technology.
If we are out of stock of some special PCB material, we can buy it
for you—there may just be a delay in requiring laminate. Or, you
can supply to the materials to us. We only charge for
the manufacturing cost. If you have any questions, you are
welcome to contact us!
Brands of PCB Material Manufacturers
First Grade Main FR-4 material :
KINDGBOARD (KB), NAN YA, SHENGYI, ISOLA ,ITEQ,

Second Grade FR-4 material :
Panasonic, VENTEC GMD, HUAZHENG
Microwave material:
Rogers, Taconic, TEFLON, DUPONT, ARLON, Nelco

Flexible material:
DUPONT, PI

Aluminum material:
BERGQUIST, CUSTOM AL Base
The CEM-3 type material is an electronic grade alkali-free glass
non-aromatic cloth with flame-retardant brominated epoxy resin
filled in the middle insulation layer, and one sheet is filled with
flame-retardant brominated epoxy resin on both sides of the
non-woven fabric. Copper foil is on one or both sides of Resin
electronic-grade alkali-free glass fiber cloth and is then formed by
hot-pressing into copper-clad laminate.

Copper-clad laminate is also called substrate. The reinforcing
material is soaked with resin, one or both sides are covered with

copper foil, and a board material is formed by hot pressing, which
is called copper-clad laminate. This is the basic material of PCB,
often called substrate. When it is used in multilayer PCB board
production, it is also called “core.”
 Paper substrate
 Glass fiber cloth substrate
 Synthetic fiber cloth substrate
 Non-woven substrate
 Composite substrate
 Other
Copper-clad laminate refers to substrates such as paper
and fiberglass cloth, which are filled with resin to make bonding
sheets (adhesive paper and tape). After combining several
bonding sheets, one or both sides are equipped with copper foil.
It is cured by heat and pressure to make a plate-shaped product.

Shielding board material refers to a copper-clad laminate with a
shielding layer or patterned circuit in the inner layer. As long as
the circuit on both sides is processed, it can become a multilayer
circuit board. This is also called a “copper clad laminate with
shielding layer.”
Multilayer materials refer to copper-clad laminates and adhesive
sheets (adhesive cloth) used to make multilayer circuit boards.
Recently, this has come to include grease-coated copper foil (RCC)
for multi-layer laminates. The so-called multi-layer board refers to
a circuit board with two layers of patterned circuits on both
surfaces and the inside.
Special substrates refer to laminates, metal core substrates, etc.
used in the additive process, which are not included in the
above-mentioned types of special plates.
Metal core substrates also include resin-coated substrates (FBC,
etc.) Others are:
 Aluminum core base substrates
 Copper core base substrate

 Ceramic core base substrate
 Glass base substrate
Copper-clad laminate, also called PCB substrate.

(1) A plate-shaped material formed by filling a reinforcing material
(glass fiber cloth, referred to as glass fiber cloth) with resin (pp
sheet), covering one or both sides with copper foil, and hot

pressing, called a copper-clad layer pressure plate (Copper Clad
Laminates, [CCL]).
(2) The basic material for PCB, it is often called board.
(3) When it is used in the production of multilayer boards, it is also
called core board (or core).
Copper foil
(1) The thickness of copper foil is measured in oz (ounces), and oz
itself is the unit of mass. Usually, the thickness of copper foil is
expressed as “thickness” by mass. The thickness of copper foil is
usually defined as “oz”, 1oz copper thickness—spread one ounce
of copper evenly on one square foot area. At this time, the
thickness of the copper foil is called 1oz copper thickness, and its
thickness is exactly 1.37mil (about 1.4mil).
 The standard thickness of copper foil is 12μm (1/3oz), 18μm
(Hoz), 35μm (1oz),and 70μm (2oz).
Process principle of prepreg (prepreg or pp)
pp is a sheet material made by filling treated glass fiber cloth with
resin glue, and then heat treating (pre-baking) to make the resin
enter the B stage. The process principle of the pressure plate is to

use the prepreg from the B-stage to the C-stage conversion
process to bond the various circuit layers into one.
Rogers 4350 raw material
Common performance indicators of substrate
(1) DK: The dielectric constant of the material. Only by reducing
DK can a high signal propagation speed be obtained.
(2) Df: The dielectric loss angle of the material; the lower this
angle, the lower the signal propagation loss is.
Note that DK is mainly related to the impedance of the
signal network and also related to the capacitance between the

plates, and Df is mainly related to the loss of the signal network.
Factors affecting DK are:
 Resin (DK of epoxy resin is between 3～4);
 Glass fiber cloth (DK between 6～7);
 Resin content (RC value).
(3) Tg: glass transition temperature, which has the greatest impact
on vias. The glass transition temperature is the characteristic of
the polymer, which refers to the resin from hard (glassy) to soft
(rubbery). This is the temperature at which the shape changes.
At present, the Tg value of FR-4 board is generally 130-140, and in
the manufacture of printed boards, there are several process
problems that exceed this range, which will have a certain impact
on the processing effect and final state of the product. Therefore,
increasing Tg is a primary method to improve the heat resistance
of FR-4. The Tg classification is as follows.
 Ordinary Tg sheet: 130～140℃.
 Medium Tg sheet: 140～150℃.

 High Tg board: greater than 170°C (PCB boards with more
than 8 layers must use high Tg boards).
(4) CAF: Abbreviation for conductive anodic filament, called ion migration resistance.
https://www.raypcb.com/the-introduction-of-cclcopper-clad-laminate/

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RAYMING PCB & ASSEMBLY

PCB Raw Materials

PCB Laminate Material and

PCB Laminate Technical informations

KB FR4-61606160A6160C RAW Material TECHNICAL

INFORMATION data sheet Click to down

PCB Manufacturing & Assembly Services https://www.raypcb.com/

PCB Manufacturing & Assembly Services https://www.raypcb.com/

PCB Manufacturing & Assembly Services https://www.raypcb.com/

The premium types of raw material are well-known brands in

product quality of RayPCB. More attention has been focused

on establishing long-term relationships between raw material suppliers

and RayPCB to ensure the stability and reliability of timely material

This friendly relationship leads to mutual support and growth.

offer for fabrication of your printed circuit boards these materials,

such as glass fiber epoxy laminates, special high performance

laminates, and more. Your choice of laminates will depend on your

application. If you need assistance selecting the right material, please

PCB Manufacturing & Assembly Services https://www.raypcb.com/

contact the helpful customer service representatives at RayMing

If we are out of stock of some special PCB material, we can buy it

for you—there may just be a delay in requiring laminate. Or, you

can supply to the materials to us. We only charge for

the manufacturing cost. If you have any questions, you are

welcome to contact us!

Brands of PCB Material Manufacturers

First Grade Main FR-4 material :

KINDGBOARD (KB), NAN YA, SHENGYI, ISOLA ,ITEQ,

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Second Grade FR-4 material :

Panasonic, VENTEC GMD, HUAZHENG

Rogers, Taconic, TEFLON, DUPONT, ARLON, Nelco

PCB Manufacturing & Assembly Services https://www.raypcb.com/

PCB Manufacturing & Assembly Services https://www.raypcb.com/

BERGQUIST, CUSTOM AL Base

The CEM-3 type material is an electronic grade alkali-free glass

non-aromatic cloth with flame-retardant brominated epoxy resin

flame-retardant brominated epoxy resin on both sides of the

non-woven fabric. Copper foil is on one or both sides of Resin

electronic-grade alkali-free glass fiber cloth and is then formed by

hot-pressing into copper-clad laminate.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Copper-clad laminate is also called substrate. The reinforcing

PCB Manufacturing & Assembly Services https://www.raypcb.com/

copper foil, and a board material is formed by hot pressing, which

is called copper-clad laminate. This is the basic material of PCB,

often called substrate. When it is used in multilayer PCB board

production, it is also called “core.”

 Glass fiber cloth substrate

 Synthetic fiber cloth substrate

Copper-clad laminate refers to substrates such as paper

sheets (adhesive paper and tape). After combining several

It is cured by heat and pressure to make a plate-shaped product.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Shielding board material refers to a copper-clad laminate with a

shielding layer or patterned circuit in the inner layer. As long as

the circuit on both sides is processed, it can become a multilayer

circuit board. This is also called a “copper clad laminate with

Multilayer materials refer to copper-clad laminates and adhesive