GXHT30

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GALAXY - CAS Technology

GXHT30 - DIS Temperature and Humidity Sensor
Features voltage range of 2.5~5.5V makes it adaptable to various
power supply environments.
• Fully calibrated, linearized, and temperature
compensated digital output

• W ide supply voltage range, from 2.5 V to 5.5 V

• I2C interface with communication speed of 1 MHz

• Two user-selectable addresses

• Typical accuracy of GXHT30 is ±3%RH and ±0.3°C

• Single chip integrated temperature and humidity

sensor

• High reliability and long-term stability

• Relative humidity range: 0 ~ 100%

• Temperature range: -45 ~ 130°C

• Integrated 16-bit high precision ADC Figure 1. Chip Rendering

• Measurement time as low as 2.5ms

Description

GXHT30 is the next generation of single-chip

integrated temperature and humidity sensor developed

by Beijing Galaxy-CAS Technology. It was developed

based on the extremely weak signal detection design

platform and MEMS process design platform of Beijing

Galaxy-CAS Technology. Integrating high-sensitivity

MEMS moisture-sensitive components on silicon-based

CMOS wafers can reduce the interference of multi-chip

signal transmission, reduce chip area, and improve

packaging reliability. It has two user-selectable I2C

addresses, the I2C communication speed is up to 1MHz,

Figure 2. Functional block diagram of GXHT30. The
and the chip is packaged in a miniaturized DFN package temperature and humidity sensor has been
with an outline size of 2.5 x 2.5 mm 2 and a height of 0.9 compensated and calibrated for changes in temperature
and power supply voltage before leaving the factory.
mm. This enables the GXHT30 to be integrated in

various applications. In addition, the wide power supply

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Table of Contents
1 Sensor Performance .......................................... 1 4 Communication and Operation ................... 4
2 Specifications ........................................................ 1 5 Packaging ............................................................... 6
3 Pin Assignment .................................................... 3 6 Precautions .......................................................... 18

1 Sensor Performance

Humidity Sensor Specification

Table 1. Humidity Sensor Specification

PARAMETER CONDITION VALUE UNITS

Typical ±3 % Relative humidity
GXHT30 accuracy
Maximum Figure 3 -
Low 0.25 % Relative humidity
Repeatability Medium 0.15 % Relative humidity
High 0.10 % Relative humidity
Resolution Typical 0.01 % Relative humidity
Hysteresis At 25°C 1 % Relative humidity
Specified range Measurement range 0-100 % Relative humidity
Response time 63% 8 Second
Long-term stability Typical <0.25 % Relative humidity / year

Temperature Sensor Specification

Table 2. Temperature Sensor Specification

PARAMETER CONDITION VALUE UNITS

GXHT30 accuracy Typical, -40°C ~ 90°C ±0.3 °C
Low 0.24 °C
Repeatability Medium 0.12 °C
High 0.06 °C
Resolution Typical 0.015 °C
Operating range Measurement range -45 ~ 130 °C
Response time τ63% >2 Second
Long-term stability Maximum <0.03 °C / year

Humidity Sensor Performance Graphs

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Figure 3. Tolerance of RH at 25°C for GXHT30

Figure 3.1 Typical tolerance of RH over T for GXHT30

Figure 4. Temperature accuracy of GXHT30

1.1 Recommended Operating Condition

The sensor shows optimum performance when operating within the recommended normal temperature and

humidity ranges (5°C ~ 60°C and 20%RH ~ 80%RH, respectively). Long-term exposure to conditions outside the

normal range, especially at high humidity, may temporarily shift the relative humidity signal (e.g., +3% RH after 60h

kept at >80%RH). After returning to normal temperature and humidity ranges, the sensor will slowly return to

calibration state by itself. Prolonged exposure to extreme conditions may accelerate aging. To ensure stable

operation of the humidity sensor, the conditions for exposure to volatile organic compounds in the document "GXHT

xx SMD Package Assembly" section "Storage and Handling Instructions" must be met. Note that this applies not only

to shipping and manufacturing, but also to the operation of the GXHT30.

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2 Specifications
2.1 Electrical Specifications

Table 3. Temperature Sensor Specification

PARAMETER SYMBOL CONDITION MIN TYP MAX UNITS COMMENTS

Supply voltage VDD 2.5 3.3 5.5 V
Power-up/down level VPOR 1.8 2.10 2.15 V
Changes in supply voltage should
Slew rate change of the be less than the maximum slew
VDD,slew - - 20 V/ms
supply voltage rate, changing too fast may lead to
reset.

Idle state Current when sensor is not

(single shot mode) - 0.2 2.0 μA performing a measurement during
T=25°C single shot mode.

Idle state Current when sensor is not

(single shot mode) - - 6.0 μA performing a measurement during
T=125°C periodic data acquisition mode.

Idle state Current when temperature and

(periodic data humidity conversion is not turned
Supply current IDD - 45 - μA
acquisition mode) on in periodic data acquisition
T=125°C mode.

Current consumption while sensor

Measuring - 600 1500 μA
is measuring.

Average consumption (operation

with one measurement per second
Average - 1.7 - μA
at lowest repeatability, single shot
mode)

Alert output driving strength IOH 1.5 x VDD mA

Heater power PHeater Heater running 3.6 - 33 mW Depending on the supply voltage.

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2.2 Timing Specification for the Sensor

Table 4. Timing Specification @ -40 °C ~ 125 °C ，2.4 V ~ 5.5 V

PARAMETER SYMBOL CONDITION MIN TYP MAX UNITS COMMENTS

Time between VDD reaching VPOR
Power-up time tPU VDD ≥ VPOR - 0.5 1 ms
and sensor entering idle state.
Time between ACK of soft reset
Soft reset time tSR - 0.5 1.5 ms command and sensor entering idle
state.

Duration of reset pulse tRESETN 1 - - µs

tMEAS,l - 2.5 4 ms Three repeatability modes differ

Measurement duration tMEAS,m - 4.5 6 ms with respect to duration, noise
tMEAS,h - 12.5 15.5 ms level and consumption.

Table 5. Timing Specification @ -40 °C ~ 125 °C ，2.2 V < 2.4 V

PARAMETER SYMBOL CONDITION MIN TYP MAX UNITS COMMENTS

Time between VDD reaching VPOR
Duration of reset pulse tRESETN VDD ≥ VPOR - 0.5 1.5 ms
and sensor entering idle state.
tMEAS,l Low repeatability - 2.5 4.5 ms Three repeatability modes differ
Measurement duration tMEAS,m Medium repeatability - 4.5 6.5 ms with respect to duration, noise
tMEAS,h High repeatability - 12.5 15.5 ms level and consumption.

2.3 Absolute Minimum and Maximum Ratings

Table 6. Minimum and Maximum Ratings, (volage values is only applied for short time periods)

PARAMETER RATING UNITS

Supply voltage, VDD -0.3 ~ 6 V
Max voltage on pins (1 (SDA); 2 (ADDR); 3 (ALERT); 4 (SCL); 6 (nRESET)) -0.3 ~ VDD+0.3 V
Max input current on any pin ±100 mA
Operating temperature range -45 ~ 130 °C
Storage temperature range -45 ~ 150 °C
ESD HBM (human body model) 8 kV
ESD CDM (charge device model) 850 V

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3 Pin Assignment 3.1 Power Pins (VDD, VSS)

The GXHT30 comes in 8-Pin DFN package – see The electrical specifications of the GXHT30 are

Table 6. described in Table 3. A 100nF decoupling capacitor

Table 7. GXHT30 Pin Assignment should be connected between the power supply pins
(Transparent top view)
and ground, and the capacitor should be as close as
Dashed lines are only visible viewed from below.
The middle pad is internally connected to VSS. possible to the sensor chip. A schematic diagram of a

PIN NAME COMMENTS typical application circuit is shown in Figure 5.

1 SDA Data pin; input/output.
3.2 Serial Clock and Serial Data (SCL, SDA)
Address pin, input; connect to
2 ADDR either logic high or low, do not SCL is used to synchronize the communication

leave floating. between the microcontroller and the sensor. The clock
Indicates alarm condition; will frequency range is 0~1MHz. Supports clock stretching
be set high if the set threshold
3 AIFRT commands conforming to I2C standard 1.
is exceeded; output; must be
The SDA pin is used to transfer I2C data.
left floating if unused
Communication with frequencies up to 400KHz must
4 SCL Serial clock; input/output
5 VDD Supply voltage; input meet the I2C Fast Mode1 standard. Communication with

Reset pin active low; input; if frequencies up to 1MHz must meet the specification
6 nRESET not used, it is recommended to conditions in Table 21.
be left floating.
Both SCL and SDA are open-drain output pins with
No electrical function; to be
7 R reverse-biased diodes connected to VDD and GND. SCL
connected to VSS.
8 VSS Ground.
and SDA must be pulled up to VDD by an external resistor.

Devices on the I2C bus can only pull the bus down to

ground. The pull-up resistors are required to pull the

signal high. The recommended pull-up resistor is 4.7K,

and resistors with different resistance values need to be

selected according to different communication rates. It

should be noted that pull-up resistors may be included

in some microcontrollers. The typical application circuit

of the temperature and humidity sensor chip is shown in

Figure 7.

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represented through the 7 MSBs of the I2C read or write

header. The LSB of the read-write command header is

the read-write indicator bit, 0 for writing and 1 for reading.

The pins of ADDR cannot be left floating. The specific

address description is shown in Table 8.

Table 8. I2C Device Addresses
GXHT 3x-DIS I2C ADDRESS IN HEX COMMENTS
ADDR pin connected
I2C address A 0x44 (default)
to VSS
ADDR pin connected
I2C address B 0x45
to VDD

Figure 5. Typical Application Circuit. It should be noted that

3.5 Alert Pin
the positioning of the pins does not reflect the position on
the real sensor. This is shown in Table 7. The Alert pin can be connected to the interrupt pin

3.3 Die Pad of the microcontroller. The output value of the Alert pin

depends on the comparison result between the

The center pad (die pad) is in the middle of the
temperature and humidity value converted by the
backside of the chip. It is connected to VSS inside the
sensor and the set threshold. Its specific functions are
sensor chip so there is no need to consider the electrical
described in the dedicated alarm documentation. This
connection of the center pad. However, based on
pin needs to be left floating when the alarm function is
mechanical stress considerations, the center pad
not used. When the output temperature and humidity
should still be soldered on the PCB. See the GXHT30
value exceed the set threshold range, this pin outputs a
Design Guide for more design information.
high level. The maximum drive loads are shown in Table
3.4 ADDR Pin
3. It should be noted that this pin can only be connected
The I2C address of the sensor can be changed by to the gate of the transistor to switch the transistor.
changing the connection method of ADDR. When ADDR
3.6 nRESET Pin
is connected to a low level, the address of the sensor
A reset signal can be given to the sensor through
chip is 0x44, and when ADDR is connected to a high
the nRESET pin. The reset signal is active low with a
level, the address of the sensor chip is 0x45. It should
minimum pulse width of 1 µs. Its function will be
be noted that the level of ADDR cannot be changed
explained in detail in the fourth section. If not used, it is
during the communication process. This address
recommended to leave this pin floating or use a resistor
selection method can connect two GXHT30s to the
greater than 2 kΩ to pull this pin up to VDD. In fact, this
same I2C bus.
pin has been pulled up to VDD by a 50kΩ resistor inside
It should be noted that the I2C address is
the chip.
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4 Pin Assignment for reducing the power consumption. The idle state is

The GXHT30 supports I2C fast mode (up to 1MHz). determined internally by the chip and is not controlled

Clock stretching can be turned on and off by specific by the user.

commands. For more I2C protocol descriptions, please 4.2 Starting a Measurement
refer to NXP's I2C bus specification2. To measure temperature and humidity, you need to
After each command is sent to the sensor, wait at send a start signal first, then send an I2C write header,
least 1ms before sending the next command to the and then follow a 16-bit temperature and humidity
sensor. conversion command. After the sensor receives each
All GXHT30 commands and data are mapped into a byte of data sent by the microcontroller, it will give an
16-bit address space. In addition, all data and ACK signal by pulling the SDA bus to a low level. The
commands are protected with a CRC checksum, which complete temperature and humidity measurement and
is used to enhance the reliability of data transmission. data reading process are shown in Table 9.
The 16-bit command already contains the CRC check With the acknowledgement of the measurement
result in the lower three bits. The data sent and received command, the GXHT30 starts the conversion
by the sensor needs to be followed by an 8-bit CRC. measurement of temperature and humidity.
When the microcontroller writes data to the sensor, it
4.3 Measurement Commands for Single Shot
must be accompanied by a CRC check byte, because Data Acquisition Mode
GXHT30 only receives data with correct CRC checksum.
After receiving these commands, the device will enter
When reading the data of the sensor, the microcontroller
the single shot data acquisition mode. After completing
is required to process the CRC check.
temperature and humidity conversion, it will store the
4.1 Power-Up and Communication
temperature and humidity data in the interface register
When the power supply voltage exceeds VPOR, the and wait for the microcontroller to read the
sensor starts powering-up. After reaching this threshold measurement data. Each data pair consists of one 16-
voltage the sensor needs the time tPU to enter idle state. bit temperature with 8-bit CRC, followed by one 16-bit
Once in the idle state, the chip is ready to receive humidity data with 8-bit CRC, see section 4.4 for details.
commands and data from the microcontroller. In single shot mode different 16-bit measurement
According to the I2C communication protocol, each commands can be selected, see Table 9 for details. The
communication of the sensor chip must start with a difference between them is the repeatability and clock
START signal and end with a STOP signal. When the stretching (enabled and disabled).
sensor is powered up, but not receiving communication A higher repeatability corresponds to a longer
or temperature and humidity conversion commands, it conversion duration, a higher energy consumption, and
automatically enters the idle state, which is convenient a higher conversion accuracy.

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Table 9. Measurement Command in Single Shot CRC checksum.

Mode
The master must send ACK condition to each byte of
The first SCL idle period means to wait at least 1ms. (Clear
blocks are controlled by the microcontroller, grey blocks by data received, otherwise the device will stop sending
the sensor) data.
CONDITION HEX
The microcontroller should send a NACK and a STOP
Repeatability Clock Stretching MSB LSB
condition to end this data transmission after receiving
High 06
the CRC byte of the humidity data, as shown in Table 9.
Medium Enabled 0x2C 0D
Low 10 The I2C master can abort the data transmission with
High 00 a NACK condition at any time. For example, I2C does
Medium Disabled 0x24 0B not care about the CRC result of the temperature data
Low 16
or does not care about the subsequent humidity data. It
e.g., 0x2C06: high repeatability, clock stretching enabled
can terminate the data transmission after receiving the

desired data, saving time.

No Clock Stretching

If the clock stretching function is disabled, after

sending the temperature and humidity conversion

command, if the temperature and humidity conversion

has not been completed, the temperature and humidity

data will be read, and the device will give NACK at this

time. Only when the waiting time is long enough to

ensure that the temperature and humidity conversion

has been completed and then read the data will the

4.4 Readout of Measurement Results for device respond. The temperature and humidity
Single Shot Mode conversion time are shown in Table 5.

After the sensor completes the temperature and Clock Stretching

humidity measurement, the master can read the When clock stretching is on, regardless of whether

measurement result by sending the START condition the temperature and humidity measurement is

followed by an I2C read header. If the temperature and completed, as long as the master sends the read data

humidity data is ready, the device will send an ACK header, the device will give ACK and then pull SCL low.

condition to the master, and then send two bytes of Once the measurement is completed, the SCL bus will

temperature data followed by one byte CRC checksum be released immediately, and then the device will start

and two bytes of humidity data followed by one byte sending the measured temperature and humidity data.

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_V .0_

4.5 Measurement Commands for Periodic (Clear blocks are controlled by the microcontroller, grey blocks
Data Acquisition Mode
by the sensor). It should be noted that self-heating of the
After receiving the command to convert the sensor might occur at the highest mps setting.
temperature and humidity periodically, the device will 4.6 Readout of Measurement Results for
periodically convert the temperature and humidity. Periodic Mode
Different periodic conversion modes can be selected, as
Transmission of the measurement data can be
shown in Table 10. The main difference between these
initiated through the fetch data command shown in
commands is the repeatability (high, medium, low) and
Table 11. If no measurement data is present, the I2C
data acquisition frequency (e.g., 0.5, 1, 2, 4 & 10
read header is responded with a NACK (Bit 9 in Table
measurements per second, mps). Clock stretching
10) and the communication stops. If the master reads
cannot be selected in this mode.
the temperature and humidity data, the buffer storing the
The data acquisition frequency and the repeatability
temperature and humidity data will be cleared to zero
setting influence the measurement duration and the
until the temperature and humidity data obtained by the
power consumption, see Section 2 for details
next measurement is loaded.
Table 10. Measurement Commands for Periodic
Table 10. Readout of Measurement Results for
Data Acquisition Mode
Periodic Mode

(Clear blocks are controlled by the microcontroller, grey

blocks by the sensor)

4.7 Break / Stop Periodic Data Acquisition

Mode

The periodic data acquisition mode can be stopped

using the break command shown in Table 12. In addition

to the command to read the periodic measurement

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temperature and humidity data, it is recommended to Table 13.

send the command to stop the periodic measurement Table 13. Soft Reset Command

mode before sending any other commands. After the (Clear blocks are controlled by microcontroller, grey blocks

device receives this command, it will exit the periodic by the sensor)

measurement mode and enter the single shot mode COMMAND HEX
Soft Reset 0x30A2
after the current measurement is completed. This mode
switching time takes 1ms.

Table 12. Break Periodic Data Acquisition Mode

Reset through General Call
(Clear blocks are controlled by the microcontroller, grey
In addition, the device can be reset through the
blocks by the sensor)
COMMAND HEX “general call” according to I2C-bus specification. This

Break 0x3093 generates a reset which is functionally identical to using

the nRESET pin. It should be noted that a reset

generated in this way is not device specific. See Table

4.8 Reset 14 for General Call commands.

Table 14. General Call Reset

The system reset of GXHT30 can be realized by
(Clear blocks are controlled by microcontroller, grey blocks
sending a reset command (soft reset) or sending a low-
by the sensor)
level signal to the nRESET port. In addition, a system

reset is generated internally during power-up. It should

be noted that the device will not process any commands

from the microcontroller during the reset procedure.

In order to achieve a full reset of the device without

removing the power supply, it is recommended to use

the nRESET reset pin of the GXHT30.

Soft Reset

The GXHT30 provides a soft reset mechanism to

reset the system to a predefined state without removing

the power supply. When the device is in an idle state, a Reset through the nReset Pin

soft reset command can be sent.0 After the device Pulling the nReset pin low generates a similar reset to a

receives the soft reset command, it will reset the internal power-on reset (see Table 7). The nReset pin is internally

control module and reload the data in the non-volatile connected to VDD through a pull-up resistor, so it is active low.

memory. The commands for soft reset are shown in The nReset pin has to be pulled low for at least 1 µs.

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Hard reset Read Out of status register 0xF32D

A hard reset is achieved by powering down the chip and

then powering it back on. In order to prevent powering the

sensor over the ESD diodes, the voltages on SDA and SCL

should also be removed.

4.9 Heater
Table 17. Description of the Status Register
The GXHT30 is equipped with a heater inside. When BIT FIELD DESCRIPTION DEFAULT
the heater is turned on, the temperature of the device Alert status
15 '0': no pending alerts ‘0’
will increase, but the temperature range is fixed. This '1': at least one pending alert
heater can be switched on and off with the corresponding 14 Reserved ‘0’

commands (as shown in Table 15). The on/off status of Heater status
13 '0': heater off ‘0’
the heater is also reflected in the internal status register. '1': heater on

Table 15. Heater Command 12 Reserved ‘0’

Humidity tracking alert
(Clear blocks are controlled by microcontroller, grey blocks ‘0
11 ‘0’: no alert
by the sensor) ‘1’: alert

HEX Temperature tracking alert

COMMAND 10 ‘0’: no alert ‘0’
MSB LSB ‘1’: alert
Heater Enable 6D
0x30 9:5 Reserved ‘xxxxx’
Heater Disabled 66 System reset detected
'0': no reset detected since last ‘clear
4 status register’ command ‘1’
'1': reset detected (soft reset, hard
reset, nReset reset)
3:2 Reserved ‘00’
4.10 Status Register
Command execution status
'0': last command executed successfully
The status register contains heater status, alarm 1 ‘0’
'1': last command not processed (An
information, reset information, CRC check information, incorrect command was sent)
Write data CRC checksum status
and command execution status. The command to read '0': checksum of last write transfer was
0 ‘0’
out the status register is shown in Table 16 whereas a correct
'1': checksum of last write transfer failed
description of the content can be seen in Table 17.
Clear status register
Table 16. Command to Read the Status Register
All flag bits (Bit 15, 11, 10, 4) of the internal register
(Clear blocks are controlled by microcontroller, grey blocks
can be cleared by sending commands shown in Table
by the sensor)
18.

Table 18. Command to Clear the Status Register

COMMAND HEX

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(Clear blocks are controlled by microcontroller, grey blocks Reflect output False
Final XOR 0x00
by the sensor)
Examples CRC (0xBEEF) = 0x92

4.12 Conversion of Signal Output

The output temperature and humidity data are 16-bit

unsigned data. These data have been linearized and

compensated for temperature. Converting these raw
4.11 CRC Checksum values into real temperature and humidity data can be

The CRC check algorithm for data transmission is achieved using the following formulas:

shown in Table 20. The CRC check object is the 2 bytes Relative humidity conversion formula (result in %RH):

of data transmitted before it

Table 19. I2C CRC8 Properties Temperature conversion formula (result in °C & °F):
PROPERTY VALUE
Name CRC-8
Width 8 bit
Protected data Read and/or write data SRH and ST represent the raw sensor output for
Polynomial 0x31 (x + x + x + 1)
8 5 4
humidity and temperature, respectively. Note that SRH
Initialization 0xFF
and ST must be converted to decimal representation in
Reflect input False
formula calculations.

4.12 Communication Timing

Table 20. Communication Timing Specifications for I2C

Temperature range T = -40°C ~ 125°C, voltage range VDD = VDDmin ~ VDDmax.

PARAMETER SYMBOL CONDITION MIN. TYP. MAX. UNITS COMMENTS
SCL clock frequency fSCL 0 - 1000 kHz
Hold time START condition tHD;STA 0.24 - - µs
LOW period of the SCL clock tLOW 0.53 - - µs
HIGH period of the SCL clock tHIGH 0.26 - - µs
tHD;DAT 0 - 250 ns
SDA hold time
0 - - ns
SDA set-up time tSU;DAT 100 - - ns
SCL/SDA rise time tR - - 300 ns
SCL/SDA fall time tF - - 300 ns
SDA valid time tVD;DAT - - 0.9 µs

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Set-up time for START

tSU;STA 0.26 - - µs
condition
Set-up time for STOP
tSU;STO 0.26 - - µs
condition
Capacitive load on the bus CB - - 400 pF
Low level input voltage VIL 0 - 0.3xVDD V
High level input voltage VIH 0.7xVDD - 1xVDD V
Low level output voltage VOL - - 0.4 V
Table 21. Timing Diagram for Digital Input/Output Pads
Bold SDA lines are controlled by the sensor, plain SDA lines are controlled by the micro-controller.

5 Packaging Scale Plastic Quad and Dual Inline, Square and

The GXHT30 are provided in an open-cavity DFN Rectangular, No-LEAD packages as described in 4.20

package. The opening for the humidity sensor is of JEDEC 95 and also in Small Scale (QFN/SON)

centered on top side of the DFN package. Specification D.01, 2009.

The temperature and humidity sensor are integrated The GXHT30 is compliant with IPC/JEDEC J-STD-

on a single CMOS die and then mounted to a lead frame. 020 Moisture sensitivity Level of 1.

The lead frame is made of Cu plated with Ni/Pd/Au. The 5.1 Traceability
die and lead frame are over-molded by an epoxy-based All GXHT30 sensors are laser marked for easy
mold compound, exposing the central die pad and I/O product identification and traceability. The marking on
pins. It should be noted that the chips are packaged in the sensor top side consists of a pin-1 indicator and two
batches and then cut into individual chips, so there are lines of text.
still gold cutting residues on the sides of the chips. The top mark represents the chip model number. The
The chip is packaged in accordance with the Small- bottom mark contains 7 characters, the first four XXYY

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represent the production date, XX represent year, YY

GHT30
present month. The latter D represents chip version .

That code can be decoded by

GXCAS, which enables tracing on batch level through

production, calibration and testing. If there is a

XXYYD
reasonable request, you can apply to GXCAS for the Figure 8. Top view of the GXHT30 illustrating the laser
decoding of batch marks for product traceability. marking.

5.2 Package Outline

Figure 9. Dimensional drawing of GXHT30 sensor package.

Table 22. Package Outline

PARAMETER SYMBOL MIN. TYP. MAX. UNITS COMMENTS
Package height A 0.8 0.9 1 mm
Lead frame height A3 - 0.2 - mm
Pad width b 0.2 0.25 0.3 mm
Package width D 2.4 2.5 2.6 mm
Center pad length D2 1 1.1 1.2 mm
Package length E 2.4 2.5 2.6 mm
Center pad width E2 1.7 1.8 1.9 mm
Pad pitch e - 0.5 mm
Pad length L 0.25 0.35 0.45 mm
Max cavity S 1 1.5 mm
Center pad marking T1xT2 - 0.3x0.45° - mm Indicates the position of pin 1

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5.3 Land Pattern

Figure 10 shows the land pattern of the sensor chip. The land pattern is understood to be the open metal areas on

the PCB, onto which DFN pads are soldered.

Figure 10. Recommended metal land pattern and stencil apertures for the GXHT30. (The dashed lines represent the
outer dimension of the DFN package)

6 Shipping Package

Figure 11. Dimensions of tape for chip transport.

7 Quality

The quality inspection of GXHT30 complies with the JEDEC JESD47 quality inspection standard. The product is

fully RoHS compliant and does not contain harmful metals such as Pb, Cd and Hg.

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8 Chip description and ordering information

PN：GXHT30-T&R，GXHT30 represents the product. T&R: tape and reel

1 、 GXHT30: GX represents the trademark of the company GXCAS, which can also be

represented by G; HT represents temperature and humidity series products; 30: represents

the chip number.

2、GXHT30C: GX represents the trademark of the company GXCAS, which can also be

represented by G; HT represents temperature and humidity series products; 30: represents

the chip number; C: Indicates that the chip is covered with a dustproof and breathable film,

which cannot be removed and provides protection for the chip.

3、GXHT30CF: GX represents the trademark of the company GXCAS, which can also be

represented by G; HT represents temperature and humidity series products; 30: represents

the chip number; CF: Indicates that the chip is coated with a conformal coating film, which

needs to be removed after Painting.

LOGO ：
HT:temperature and
humidity series products

G:GXCAS
30:Product number

Pin 1

3:VERSION

23:Year 13:week

Purchase Number Device PIN-PACKAGE QUANTITY REMARKS

GXHT30-T&R GXHT30 DFN8 2.5*2.5mm 2000 Tape and reel
Tape and reel, covered
GXHT30C-T&R GXHT30C DFN8 2.5*2.5mm 2000 with a dustproof
breathable film
Tape and reel, covered
GXHT30CF-T&R GXHT30CF DFN8 2.5*2.5mm 2000 with a conformal
coating film

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Important Notices:
1 ESD Precautions

The inherent design of this part makes it very sensitive to

electrostatic discharge (ESD). To prevent damage or 4 Applications in Extreme Environments

degradation caused by electrostatic discharge, operate the
Some applications require the temperature and
sensor in an Electrostatic Protected Area (EPA) and take
humidity sensor to be exposed to harsh environments.
proper measures (operator should be grounded by wrist strap,
In many cases, the suitability of the sensor is not
and all non-insulated or conductive objects should be
considered. There are some situations that require
grounded).
special attention.
2 Exposure to Chemicals (1) The sensor needs to return to the normal

The temperature and humidity sensors of Galaxy-CAS environment to recover for a period of time after working

Technology are high-sensitivity environmental sensor, not under abnormal temperature and humidity conditions (>

ordinary electronic components. The sensors should not be in 90).

close contact with volatile chemicals, such as chemical (2) In some application environments, the sensor may

solvents or organic compounds, especially high be exposed to a high concentration of volatile organic

concentrations and prolonged exposure are more dangerous. solvents for a long time, which may occur in both the

(Ethyl)ketene, acetone, isopropanol, ethanol, toluene, etc., assembly process and the application process. Such

have been shown to cause a shift in humidity readings that is applications require attention.

irreversible in most cases. (3) In some application environments, the sensor may

be exposed to an acidic or alkaline environment, but

3 Dustproof Breathable Film
only a certain concentration will cause harm to the
The temperature and humidity sensors are different
sensor. For bases, pH > 9 will cause damage to the
from the general sensor chips. The sensors are very
sensor. Etching materials, such as H2O2, NH3, etc., can
sensitive, so their opening part are easily polluted by
also harm the sensor in high concentrations.
dust and impurities. For customers in outdoor
(4) There may be corrosive gases in some application
applications, it is recommended to order our products
environments. If the concentration is relatively low, it will
with a dust-proof and breathable film, which can prevent
not affect the sensor, but it will affect the connection of
dust. It can protect the sensor, resist pollution, improve
the solder joints. Higher concentrations can also cause
the life and reliability of the sensor, and must not be torn
damage to the sensor.
off.
5 Spraying of Conformal Coating

The paint itself is contaminating to the temperature

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and humidity sensor. For customers who must spray the

paint on the board, they need to order our products with

a conformal coating film, after spraying the conformal

coating, tear off the conformal coating film before normal

testing of temperature and humidity. When spraying the

conformal coating, keep at least thirty centimeters away

from the sensor and move the can slowly to ensure an

even coating, the surface will dry in about thirty minutes

and the second spraying can be carried out. Allow the

paint to dry fully, approximately 24 hours, then gently

remove the film.

6 Packaging and Storage

Before use, it is strongly recommended to store the

sensor in its original packaging in the following

environment: temperature 10 °C ~ 50 °C (0 °C - 125 °C

for a limited time), 20% ~ 65% RH.

7 Assemblage

The sensor can be stored for 1 year in normal storage

environment, and the sensor has a moisture resistance

level of 1.

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