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Application Note
TMP LM 75 Comparison Common FAQs

Meredith McKean
ABSTRACT
This document explains the differences between all TI temperature sensors available within the 75 family. This
document further explains the available replacement options and their specs for our newer 75 devices.

Table of Contents
1 Introduction.............................................................................................................................................................................2
2 Hardware Compatibility..........................................................................................................................................................2
2.1 TMP1075............................................................................................................................................................................2
2.2 TMP110..............................................................................................................................................................................3
2.3 TMP112-Q1........................................................................................................................................................................ 3
3 Software Compatibility...........................................................................................................................................................4
4 Low Cost Dual Source Design...............................................................................................................................................5
5 Linux Driver.............................................................................................................................................................................7
6 Conversion Time and Resolution Setting Highlights.......................................................................................................... 7
7 Data Encoding Compatibility.................................................................................................................................................8
8 Summary................................................................................................................................................................................. 9
9 References............................................................................................................................................................................ 10

Trademarks
All trademarks are the property of their respective owners.

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1 Introduction
Texas Instruments provides a range of different digital temperature sensors compatible with two-wire, SMBus,
and I2C interfaces. These temperature sensors are included under the TI 75 family of sensors. This application
note guides customers in selecting the appropriate sensor within the 75-family series of TI Temperature sensors
and helps them optimize newer features offered in devices such as TMP1075, TMP110, and TMP112-Q1.
This document provides simplified comparison tables for customers to consider the main differences when
replacing components. These specs were carefully chosen to provide the best side-by-side comparison. This
document provides a high overview comparison but does not reveal all specs. Further investigation of the data
sheets is necessary before making a switch to one of these devices.
To provide additional clarity in hardware and software variations, this article discusses Linux driver compatibility,
conversion time, resolution compatibility, and data encoding compatibility.
2 Hardware Compatibility
Within the 75 family of temperature sensors there are 14 devices to consider. Figure 2-1 shows the size
comparison between the different package options available between the devices.Table 2-1 describes the
corresponding package available for the 75-temperature sensors in Figure 2-1.

Figure 2-1. Package Size Comparison

Table 2-1. Devices Available in Each Package Type

SOIC VSSOP WSON SOT563 X2Son
TMP1075, TMP1075,
TMP275, TMP175, TMP275, TMP175,
TMP75, TMP75B, TMP75, TMP75B,
TMP75C, LM75A, TMP75C, LM75A, TMP1075,
TMP1075 TMP110
LM75B, TMP175- LM75B, TMP175- TMP112-Q1
Q1, TMP75-Q1, Q1, TMP75-Q1,
TMP75B-Q1, TMP75B-Q1,
TMP75C-Q1 TMP75C-Q1

This section highlights TI's newer temperature sensors along with tables providing information on the hardware
requirements to consider when switching to the TMP1075, TMP110, or TMP112-Q.
2.1 TMP1075
The TMP1075 sensor provides the most accurate, lowest-power replacement option when comparing the sensor
to older sets of TI 75-family sensors (Table 2-2). TMP1075 comes in four different package options:
• VSSOP (8)
• SOIC (8)
• WSON (8)
• SOT563 (6)
The majority of 75-family devices are pin-to-pin compatible with VSSOP (8) and SOIC (8).

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2.2 TMP110
TMP110 sensor provides a considerable cost savings, high accuracy, and low power I2C temperature design
(Table 2-2). TMP110 comes in the X2Son package. TMP110 is not P2P compatible, but dual sourcing is
an option for TMP110. For more information about the dual source option, please refer to Section 4 in this
document.
2.3 TMP112-Q1
When considering automotive-rated 75-family sensors, TMP112-Q1 is advantageous for two-wire, SMBus, I2C-
interface, digital temperature sensor (Table 2-3). This sensor is designed for high accuracy and low power.
TMP112-Q1 is not P2P compatible with most of the 75 family, but TMP112-Q1 is an option for saving on power
consumption. TMP112-Q1 is only available in the SOT563 package.
Table 2-2. Catalog 75-Family Comparison
SOIC and Accuracy MAX (°C)
# of
Devices(1) VSSOP Rating FS UL NIST Tmin Tmax Vmax IQ
ADDR -55 -40 -20 0 25 50 85 100 125
Compatible
1.14 V -
TMP110 no Catalog 4 -55°C 125°C 10 µA ±1.5 ±1 ±1 ±1 ±1 ±1 ±1 ±1 ±1
5.5 V
1.7 V -
TMP1075 yes Catalog 32 ✔ -55°C 125°C 4 µA ±2 ±1 ±1 ±1 ±1 ±1 ±1 ±1 ±2
5.5 V

1.62 V -
TMP1075N no Catalog 4 ✔ -40°C 125°C 10 µA --- ±2 ±2 ±1 ±1 ±1 ±2 ±2 ±2
3.6 V

1.4 V -
TMP112 no Catalog 4 ✔ -40°C 125°C 10 µA --- ±1 ±1 ±0.5 ±0.5 ±0.5 ±1 ±1 ±1
3.6 V

1.4 V -
TMP102 no Catalog 4 ✔ -40°C 125°C 10 µA --- ±3 ±2 ±2 ±2 ±2 ±2 ±3 ±3
3.6 V

2.7 V -
TMP275 yes Catalog 8 -40°C 125°C 85 µA --- ±1 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±1
5.5 V
2.7 V -
TMP175 yes Catalog 27 -40°C 125°C 85 µA --- ±2 ±1.5 ±1.5 ±1.5 ±1.5 ±1.5 ±2 ±2
5.5 V
2.7 V -
TMP75 yes Catalog 8 ✔ -40°C 125°C 85 µA --- ±3 ±2 ±2 ±2 ±2 ±2 ±3 ±3
5.5 V
1.4 V -
TMP75B yes Catalog 8 -55°C 125°C 89 µA ±3 ±3 ±2 ±2 ±2 ±2 ±2 ±3 ±3
3.6 V
1.4 V -
TMP75C yes Catalog 8 -55°C 125°C 37 µA ±3 ±3 ±2 ±2 ±2 ±2 ±2 ±3 ±3
3.6 V
2.7 V -
LM75A yes Catalog 8 ✔ -55°C 125°C 500 µA ±3 ±3 ±2 ±2 ±2 ±2 ±2 ±2 ±3
5.5 V
3.0 V -
LM75B yes Catalog 8 ✔ -55°C 125°C 1000 µA ±3 ±3 ±2 ±2 ±2 ±2 ±2 ±2 ±3
5.5 V

Table 2-3. Automotive 75-Family Comparison

SOIC and Accuracy MAX (°C)
# of
Devices(1) VSSOP Rating FS UL NIST Tmin Tmax Vmax IQ
ADDR -40 -20 0 25 50 85 100 125
Compatible
TMP112- 1.4 V -
no Automotive 4 ✔ ✔ -40°C 125°C 10 µA ±1 ±1 ±0.5 ±0.5 ±0.5 ±1 ±1 ±1
Q1 3.6 V

TMP275- 2.7 V -
yes Automotive 8 -40°C 125°C 85 µA ±1.5 ±1.5 ±0.75 ±0.75 ±0.75 ±0.75 ±1.5 ±1.5
Q1 5.5 V

TMP175- 2.7 V -
yes Automotive 27 -40°C 125°C 85 µA ±2 ±1.5 ±1.5 ±1.5 ±1.5 ±1.5 ±2 ±2
Q1 5.5 V
2.7 V -
TMP75-Q1 yes Automotive 8 ✔ -40°C 125°C 86 µA ±3 ±2 ±2 ±2 ±2 ±2 ±3 ±3
5.5 V
TMP75B- 1.4 V -
yes Automotive 8 ✔ -40°C 125°C 89 µA ±3 ±2 ±2 ±2 ±2 ±2 ±3 ±3
Q1 3.6 V
TMP75C- 1.4 V -
yes Automotive 8 ✔ -40°C 125°C 37 µA ±3 ±2 ±1 ±1 ±1 ±2 ±3 ±3
Q1 3.6 V

(1) Functional safety compliant, UL certified, and NIST traceable.

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3 Software Compatibility
The software specs shown in Table 3-1 were chosen based on the following criteria:
• TMP275, TMP175, and TMP75 have programmable ADCs. Users can choose a 9-bit resolution mode up to a
12-bit resolution mode.
• I2C Data Hold Times t(HDDAT) are different between the devices. The t(HDDAT) listed in the table below
refers to the minimum spec during Fast Frequency Mode.
• All 75 devices have temperature and limit registers in the exact same locations with the same format.
• The main changes in registers are Configuration and ID Registers. The Configuration Register holds either 16
or 8 bits of data. The data stored in the Configuration Register is shown in Table 3-1.
Table 3-1. Software Compatibility Table
ID Config Register
Devices t(HDDAT)-
Resolution Register
\Categories FS Min
Location D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

TMP1075 0.0625°C (12 bits) 0 ns 0xF OS R1 R0 F1 F0 POL TM SD 1 1 1 1 1 1 1 1

TMP1075N 0.0625°C (12 bits) 100 ns n/a OS R1 R0 F1 F0 POL TM SD 1 0 X 0 0 0 0 0

TMP112 0.0625°C (12 bits) 100 ns n/a OS R1 R0 F1 F0 POL TM SD CR1 CR0 AL EM 0 0 0 0

TMP102 0.0625°C (12 bits) 100 ns n/a OS R1 R0 F1 F0 POL TM SD CR1 CR0 AL EM 0 0 0 0

TMP110 0.0625°C (12 bits) 0 ns n/a OS R1 R0 F1 F0 POL TM SD CR1 CR0 AL EM 0 0 0 0

LM75A 0.5°C (9 bits) 100 ns 0x7 0 0 0 F1 F0 POL TM SD n/a n/a n/a n/a n/a n/a n/a n/a
LM75B 0.5°C (9 bits) 100 ns n/a 0 0 0 F1 F0 POL TM SD n/a n/a n/a n/a n/a n/a n/a n/a

Selectable 0.5°C (9 bits) -

TMP275 4 ns n/a OS R1 R0 F1 F0 POL TM SD n/a n/a n/a n/a n/a n/a n/a n/a
0.0625 °C (12 bits)

Selectable 0.5°C (9 bits) -

TMP175 4 ns n/a OS R1 R0 F1 F0 POL TM SD n/a n/a n/a n/a n/a n/a n/a n/a
0.0625 °C (12 bits)

Selectable 0.5°C (9 bits) -

TMP75 4 ns n/a OS R1 R0 F1 F0 POL TM SD n/a n/a n/a n/a n/a n/a n/a n/a
0.0625 °C (12 bits)

TMP75B 0.0625°C (12 bits) 0 ns n/a OS CR CR FQ FQ POL TM SD *(1) *(1) *(1) *(1) *(1) *(1) *(1) *(1)

TMP75C 0.0625°C (12 bits) 0 ns n/a *(1) *(1) OS FQ FQ POL TM SD *(1) *(1) *(1) *(1) *(1) *(1) *(1) *(1)

TMP112-Q1 0.0625°C (12 bits) 100 ns n/a OS R1 R0 F1 F0 POL TM SD CR1 CR0 AL EM 0 0 0 0

TMP75-Q1 0.0625°C (12 bits) 4 ns n/a OS R1 R0 F1 F0 POL TM SD n/a n/a n/a n/a n/a n/a n/a n/a
TMP75B-Q1 0.0625°C (12 bits) 0 ns n/a OS CR CR FQ FQ POL TM SD *(1) *(1) *(1) *(1) *(1) *(1) *(1) *(1)

TMP75C-Q1 0.0625°C (12 bits) 0 ns n/a *(1) *(1) OS FQ FQ POL TM SD *(1) *(1) *(1) *(1) *(1) *(1) *(1) *(1)

TMP175-Q1 0.0625°C (12 bits) 4 ns n/a OS R1 R0 F1 F0 POL TM SD n/a n/a n/a n/a n/a n/a n/a n/a

(1) The * symbol denotes a reserved configured register.

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www.ti.com Low Cost Dual Source Design

4 Low Cost Dual Source Design

The TMP110 is a very accurate, cost-effective, and low-power I2C temperature sensor. The dual sourcing
feature offers a low-cost advantage, boosts supply chain flexibility, and minimizes risk by allowing more devices
in a given circuit design. Dual sourcing incorporates the footprint of two distinct devices within one footprint.
TMP110 is a 5 pin X2Son package, which is a smaller design than the common 8 pin VSSOP and SOIC
package typical of the 75 devices. This means that the TMP110 fits within the common 8 pin package. The
TMP110 comes in 5 different orderables (Table 4-1). The orderables offer the choice between an alert pin and an
address pin. Within the address pin orderables, users can choose between different addresses on the I2C bus.
The different orderables are listed in the Table 4-1. The TMP110 has a minimum via drill diameter of 4 mils and a
minimum via diameter of 13.78 mils. There are multiple dual source options depending on the number of layers
within your PCB.
Table 4-1. Different Orderables in the TMP110
GPN Function OPN Device Target Address
TMP110D0IDPWR 1001000
TMP110D1IDPWR 1001001
Alert
TMP110D2IDPWR 1001010
TMP110
TMP110D3IDPWR 1001011
1000000 (GND), 1000001 (VDD),
Address TMP110DIDPWR
1000010 (SDA), 1000011 (SCL)

Table 4-2 demonstrates a dual source footprint option between the TMP1075 VSSOP package and the TMP110
which contains an alert pin orderable. Table 4-2 shows the footprint connections between the TMP1075 and the
TMP110. The pinouts between the devices are also displayed for reference.
Table 4-2. Dual Source Footprint Connections
LM/TMPx75 VSSOP TMP110
Pin 1 – SDA Pin 4 – SDA
Pin 2 – SCL Pin 2 – SCL
Pin 3 – Alert Pin 3 – Alert
Pin 4 – GND Pin 1 – GND
Pin (5-7) – A0, A1, A2 Pin 1 – GND
Pin 8 – VDD Pin 5 -VDD

SDA 1 8 V+
GND 1 5 Vdd
SCL 2 7 A0

ALERT 3 6 A1
ADDR/
3 ALERT
GND 4 5 A2

4
Figure 4-1. 8-Pin VSSOP Top View SCL 2 SDA

Not to scale

Figure 4-2. 5-Pin X2Son Top View

Figure 4-3 and Figure 4-4 show a 3D and a 2D layout trace of the top overview of a 4-layer dual source solution.
For simplicity, the displayed boards follow a common four-layer board configuration containing the following
layers: Signal, VDD, GND, and Signal. The alert pin on the TMP110 is traced on the bottom layer of the PCB.

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The vias shown in the 3D and 2D views have a diameter of 16 mil and a hole size of 8 mil. A two layer option is
achievable with the aid of the layout trace depicted.

Figure 4-3. 3D Board Image

Figure 4-4. Top Layer Layout

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5 Linux Driver
The common Linux driver provides one source of compatibility between the 75 family of devices (Table 5-1). The
Linux driver is not created by TI, but by the general public. The Linux Driver provides the software the MCU
needs to communicate with the sensors over I2C, along with the ability to read and write registers. The Linux
Driver GitHub is found here.
Table 5-1. Devices Supported by the Linux Driver lm75.c
Devices(1)
adt75 at30ts74 ds1775 ds75 ds7505 g751 lm75 lm75a lm75b
max6625 max6626 max31725 mcp980x pct2075 stds75 stlm75 tcn75 tcn75
tmp100 tmp101 tmp105 tmp112 tmp175 tmp275 tmp75b tmp75c tmp1075

(1) Devices supported at the time of this writing.

Software compatibility is not an issue when utilizing the Linux driver because all these devices are supported
directly by the same driver. Q variants are software compatible with their corresponding commercial variants.
Currently, TI's new device TMP110 is not listed in the public source code. As shown in Section 3, TMP112 is
software compatible with TMP110. All 75-Family device communication is regulated by the Linux driver.
6 Conversion Time and Resolution Setting Highlights
Texas Instruments is making new technology that improves conversion outcomes. Conversion time describes
the time it takes to make a new temperature measurement. The device resolution and conversion time are
inversely related. In general, the higher the resolution, the more time required for the device to output a new
temperature measurement. This relationship is described with TMP275, TMP175, and TMP75 in Table 6-1.
TMP275, TMP175, and TMP75 have programmable ADCs, where users can choose from a 9-bit resolution
mode to a 12-bit resolution mode. The resolution selection is made by modifying R0 and R1 in the configuration
register. TI's older LM75 devices use technology that requires more time to convert data for 9-bit resolution.
TMP1075 has a 12-bit resolution where the user selects a different conversion time by changing the R0 and R1
bits in the configuration register. TMP1075 sleeps between measurements to save power. TMP1075 provides
the best conversion time results when comparing the devices. Figure 6-1 shows a diagram detailing the wait time
before a new temperature occurs.

LM75 Active Conversion

TMP75 9-Bit R=00 Active Conversion

TMP1075 R=00

TMP75 10-Bit R=01

TMP1075 R=01

First Measurement
Available TMP1075 TMP75 LM75

0ms 10ms 20ms 30ms 40ms 50ms 60ms 70ms 80ms 90ms 100ms 110ms 120ms

Figure 6-1. Conversion Time

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Table 6-1. TMP275, TMP175, and TMP75 Conversion Time

Bit Selection Resolution Conversion Time
R0 = 0, R1 = 0 9 bits 27.5 ms
R0 = 0, R1 = 1 10 bits 55 ms
R0 = 1, R1 =0 11 bits 110 ms
R0 = 1, R1 = 1 12 bits 220 ms

7 Data Encoding Compatibility

As shown in Figure 6-1, the 14 devices have different resolution values; however, the temperature output
remains compatible. Resolution defines the available bit-depth when reading the temperature value. Figure 7-1
demonstrates calculating the temperature value from the I2C data at 12-bit resolution and at 9-bit resolution.
I2C gives you a 2-byte value but only the first 12 bits will be used to translate the data. The compatibility takes
place in the bit weight distribution. Each bit is assigned a fractional value and then added together to form the
temperature result. The first byte portrays the sign and the integer value. All TI temperature sensors stated in
this document with a resolution greater than 8 bits have a compatible first byte. The difference in resolution takes
place in the second byte. The second byte portrays the limited precision of the device. As shown in Figure 7-1, a
12-bit resolution displays more data accuracy than a 9-bit resolution but still remains compatible.
12 bits used to express a signed value with 4 bits of fractional data

16-bit Word

8-bit Byte 8-bit Byte

1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1

Sign
Integer Decimal Fractional
point

12 bit Resolution Example

2 0 9 0

0 0 1 0 0 0 0 0 1 0 0 1 0 0 0 0
28

64

32

16

16

/A

/A

/A

/A
1/

1/

1/
=

N
-1

1/
3

0
=

=
6

-1

-2

-3
2

=
=

-4
2

2
7

2
-2

32 + 1/2 + 1/16 = 32.5625

9 bit Resolution Example

2 0 9 0

0 0 1 0 0 0 0 0 1 0 0 0 0 0 0 0
28

64

32

16

//A

/A

/A

/A

/A

/A

/A
1/
=

N
-1

N
=

=
6

-1
2

2
=

2
7

2
-2

32 + ½ = 32.5

Figure 7-1. Temperature Conversion Calculations

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8 Summary
Texas Instruments provides a range of different digital temperature sensors compatible with two-wire, SMBus,
and I2C interfaces known as the 75-family devices. Thanks to the guidance in this application note, readers now
have a general understanding of the hardware and software changes across the 75-family devices. Readers
can use this application note to evaluate the benefits of the TMP1075, TMP110, and TMP112-Q1 devices. In
addition, readers are now aware of the available Linux driver, the advantages of conversion times, and the data
encoding capabilities. Overall, the content in this application note guides customers in selecting the appropriate
sensor within the 75-family series of TI temperature sensors for their applications.

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9 References
For more information on the devices referenced in this application note, see also:
• Texas Instruments, I2C-Designer, designer tool.
• Linux Driver GitHub.
• Texas Instruments, SMBus Made Simple, application note.
• Texas Instruments, TMP1075 Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75
Form Factor and Pinout, data sheet.
• Texas Instruments, TMP112-Q1 Automotive Grade High-Accuracy, Low-Power, Digital Temperature Sensor in
SOT563, data sheet.
• Texas Instruments, TMP275 ±0.5°C Temperature Sensor With I 2C and SMBus Interface in Industry Standard
LM75 Form Factor and Pinout, data sheet.
• Texas Instruments, TMPx75 Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75
Form Factor and Pinout, data sheet.
• Texas Instruments, TMPx75 Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75
Form Factor and Pinout, data sheet.
• Texas Instruments, TMP75B 1.8-V Digital Temperature Sensor With Two-Wire Interface and Alert , data
sheet.
• Texas Instruments, TMP75C 1.8-V Digital Temperature Sensor With Two-Wire Interface and Alert, data sheet.
• Texas Instruments, LM75A Digital Temperature Sensor and Thermal Watchdog With Two-Wire Interface, data
sheet.
• Texas Instruments, LM75x Digital Temperature Sensor and Thermal Watchdog With Two-Wire Interface, data
sheet.
• Texas Instruments, TMPx75-Q1 Automotive Grade Temperature Sensor With I 2C and SMBus Interface in
Industry-Standard LM75 Form Factor and Pinout , data sheet.
• Texas Instruments, TMP75B-Q1 1.8-V Digital Temperature Sensor With Two-Wire Interface and Alert, data
sheet.
• Texas Instruments, TMP75C-Q1 1.8-V Digital Temperature Sensor With Two-Wire Interface and Alert, data
sheet.

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