Dashboard Python File

import tkinter as tk
import pandas as pd
selected_component_names = []

def get_selected_components():
selected_components = listbox.curselection()
selected_component_names = [listbox.get(index) for index in
selected_components]
components_label.config(text="List of selected components: " + ",
".join(selected_component_names))

update_options(selected_component_names)

def update_options(selected_components):
selected_components_menu['menu'].delete(0, 'end')
for component in selected_components:
selected_components_menu['menu'].add_command(label=component,
command=lambda x=component: selected_components_var.set(x))

root = tk.Tk()

# Create a list of components

components = ['Housing', 'Cover', 'PCB', 'PCBA', 'PCBC', 'Gasket', 'Thermal
paste', 'EMI filter', 'Fasteners',
'Adhesive', 'Connector', 'Dowel pin', 'Coolant', 'LED Window',
'Bracket', 'Heat pipes',
'Heat sinks', 'Washers']

selected_components_label = tk.Label(root, text="List of Components")

selected_components_label.pack(side=tk.TOP)

# Create a Listbox widget for selecting components

listbox = tk.Listbox(root, selectmode=tk.MULTIPLE)
for component in components:
listbox.insert(tk.END, component)
listbox.pack(side=tk.TOP)

# Create a button to retrieve the selected components

button = tk.Button(root, text="Select the Components of ECU",
command=get_selected_components)
button.pack(side=tk.TOP)

selected_components_label = tk.Label(root, text="P-Diagram and DFMEA")

selected_components_label.pack(side=tk.TOP)

selected_components_label = tk.Label(root, text="Select the Component")

selected_components_label.pack(side=tk.TOP)

# Create a label to display the selected components

components_label = tk.Label(root)
components_label.pack(side=tk.TOP)
# Create another Listbox widget to display the selected components

selected_components_var = tk.StringVar(root)
selected_components_var.set(components[0]) # Set initial value to an empty
string
selected_components_menu = tk.OptionMenu(root, selected_components_var,
*components)
selected_components_menu.pack(side=tk.TOP)

selected_components_label = tk.Label(root, text="Select the Material")

selected_components_label.pack(side=tk.TOP)

# Create a label to display the selected components

materials = ['Steel', 'Aluminium', 'Copper', 'Plastic', 'Composite',
'General', 'EGW', 'FR4', 'Stainless Steel',
'ABS', 'ABS+PC', 'PC', 'Zinc plated steel']

materials_name = tk.StringVar(root)
materials_name.set(materials[0])
materials_menu = tk.OptionMenu(root, materials_name, *materials)
materials_menu.pack()

selected_components_label = tk.Label(root, text="Select the Manufacturing

Process")
selected_components_label.pack(side=tk.TOP)

# Create a list of manufacturing processes

manufacturing_processes = ['Casting', 'Forging', 'Machining', 'Injection
Molding', 'Extrusion',
'Fabrication and Assembly', 'Precision machining',
'Cold forming', 'Compounding',
'Die cutting', 'General']

# Create a Listbox widget for selecting manufacturing processes

manufacturing_name = tk.StringVar(root)
manufacturing_name.set(manufacturing_processes[0])
manufacturing_menu = tk.OptionMenu(root, manufacturing_name,
*manufacturing_processes)
manufacturing_menu.pack()

def submit():

from Component_Data import cmmp

from Write_To_Excel import Excel
excel_instance = Excel()
component = selected_components_var.get() # corrected to get selected
value from var
material = materials_name.get()
 manufacturing_process = manufacturing_name.get()
print("Selected Component:", component)
print("Selected Material:", material)
print("Selected Manufacturing Process:", manufacturing_process)
label_class_instance = cmmp('name')

prev_component = None
header_added = False

if (component, material, manufacturing_process) in

label_class_instance.label1:
label = label_class_instance.label1[(component, material,
manufacturing_process)]
ptpv_values = label_class_instance.PTPV.get(label, [])
cot_values = label_class_instance.COT.get(label, [])
cu_values = label_class_instance.CU.get(label, [])
ef_values = label_class_instance.EF.get(label, [])
output_data = []
if header_added:
print("Piece to piece variation:", ptpv_values)
print("Change over Time:", cot_values)
print("Customer Usage:", cu_values)
print("Environmental factors:", ef_values)

if component != prev_component:
output_data.append([component, ", ".join(map(str,
ptpv_values)), ", ".join(map(str, cot_values)),
", ".join(map(str, cu_values)), ",
".join(map(str, ef_values))])

else:
output_data.append(["", "", "", "", ""])

output_df = pd.DataFrame(output_data,
columns=["Component", "Piece to piece
variation", "Change over Time:",
"Customer Usage:",
"Environmental factors:"])
print(output_df)
print("\n")

excel_instance.write_to_excel(output_df, filename="PDIAGRAM.xlsx")
print(output_df)

submit_button = tk.Button(root, text="Submit", command=submit)

submit_button.pack()

root.mainloop()

P-Diagram Python File

class p_diagram:

def __init__(self, name):

self.name = name

label2 = {
(1, 'Cover', 'Physical',): ["{0} receives {1}", "{1} stays with the {0}",
"a)Mounting geometry and mounting features\n b) Screw hole pattern layout\n
c)size and shape of Base","Unable to protect the PCB assembly by staying with
the {1}\n * Incorrect mounting geometry or mounting features \n *Incorrect
screw hole pattern \n *Incorrect size and shape of the {0} "],
(1, 'PCBA', 'Thermal energy transfer'): ["{0} receives thermal energy from
{1}", "{0} dissipates the thermal energy from {1} effectively.","a)Material
Selection, b)Thermal design features", "Overheating and Failure of PCB\n -
Thermal fatigue \n *Incorrect material selection\n *Insufficient contact area
with {1} for heat dissipation *Insufficient thermal design
features(Pedastal,Fins)"],
(1, 'PCBA', 'Physical'): ["{0} receives the{1}","{1} stay secured with the
{0}.","a)Screw hole pattern layout\n b)Mounting features and clearance
required for PCB components", "PCB assembly doesn't stays with the housing \n
*Incorrect screw hole pattern layout \n*Incorrect mounting features for PCB
assembly \n*Insufficeint clearance for {1}"],
(1, 'Gasket','Physical'): ["Receives {1} at {0} seal interface ","{0}
stays secured in {1} sealing interface and seal the unit ", "a)Surface
cleanliness\n b)Clearance to receive the {1}","Unable to secure {1} on the
{0} and unable to seal the {0} with the unit \n*Uncleanliness of
surface\n*Designated seal area insufficient "],
(1, 'Thermal paste','Physical'): ["Receives {1} between {0} and major
power generating components", "Pedastal size and clearance sufficient to
accomodate enough {1}","a)Surface cleanliness \n b)Mounting features to
receive {1} maintaining clearance with PCB \n c)Contact area with
{1}","Housing unable to accommodate sufficient {1} between housing and major
power generating components in PCB.\n *Uncleanliness of surface \n*Incorrect
design feature(pedastal) to recieve the {1} \n*Insufficeint clearance to
receive {1} \n*Insufficeint contact with the {1}"],
(1, 'Thermal paste','Thermal energy transfer'): ["Thermal energy
transfered from PCB assembly through {1}","{0} dissipates the thermal energy
received through {1} to external environment","a)Thermal management design
features on {0}- Fins, Pedastals, clearance for TIM between {0} and PCB
assembly \n b)Incorrect material selection","{0} unable to accommodate
sufficient {1} between housing and major power generating components in PCB.
\n *Uncleanliness of surface \n*Insufficient thermal design features to
receive {0}\n *Insufficeint clearance to receive {1} \n*Insufficeint contact
with the {1}"],
(1, 'Adhesive','Physical'): ["Receives adhesive between {0} and ?", "{1}
hold the ? with {0}", "Surface cleanliness \n b)Contact area \nc)Mounting
feature to receive sufficient {1} \nd)Maintained clearance ", "Adhesive fails
to hold EMI Filter to the housing \n*Insuffiicient contact area
\n*Uncleanliness of surface \n*Incorrect mounting feature for EMI filter
\n*Insufficient clearance for EMI filter with the {1}"],
(1, 'Adhesive','Electrical energy'): ["Receives adhesive between {0} and
?", "{1} hold the ? with {0}", "Surface cleanliness \n b)Contact area
\nc)Mounting feature to receive sufficient {1} \nd)Maintained clearance ",
"Adhesive fails to hold EMI Filter to the housing \n*Insuffiicient contact
area \n*Uncleanliness of surface \n*Incorrect mounting feature for EMI filter
\n*Insufficient clearance for EMI filter with the {1}"],
(1,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", " {1} stays intact with , and protect the","a)Material Selection \n
b)Size, thickness and shape of cover \n c)Mounting features and mounting
technique for cover","Deformation due to vibration and shock and unable to
protect the PCB assembly from shock and vibration(Corrosion,
deformation,Crack intiation or propagation) \n *Incorrect material selection
\n *Incorrect size, thicknesss and shape of {0} \n*Incorrect Mounting
features and mounting technique for components"],
(1,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","a)Compactible material selection which are
resistant to chemicals \n b) Coating or use of gaskets", "Corrosion,
Degradation \n* Incorrect material specified (not high temperature
resistant)\n*Incorrect material specified (not low temperature resistant)
\n*Lack of coating or gasket "],
(1, 'Other','Thermal cycle'): ["Thermal Cycling","No nagative imapact due
to thermal cycling", "a)Compactible material selection of housing based on
thermal properties(low thermal expansion) \n b)Design of housing to
accomodate thermal expansion \nc)Operating environment of the housing"],
(1, 'Other', 'EMI exposure'): ["Exposure to EMI", "{0} protect or shield
the unit from EMI exposure", "a)Selection of EMI shielding mater \n b)Proper
grounding","Unable to protect the unit from EMI exposure \n*Incorrect
material selection \n*Inproper PCB to housing ground path \n*Improper housing
to vehicle ground"],

(2, 'Housing', 'Physical'): ["{1} receives {0}", "{0} stays with the {1}",
"{0} Hole line up according to position of mounting bosses","Unable to
assemble or improper assemble of {0} to {1} \n*Screw holes on the {0} don't
line up correctly with the mounting bosses holes on the {1} \n*Insufficient
compressive yield strength"],
(2, 'Cover', 'Physical'): ["{0} receives {1}", "{1} stays with the {0}",
"a)Mounting geometry and mounting features\n b) Screw hole pattern layout\n
c)size and shape of Base","Unable to protect the PCB assembly by staying with
the {1}\n * Incorrect mounting geometry or mounting features \n *Incorrect
screw hole pattern \n *Incorrect size and shape of the {0} "],
(2, 'Gasket','Physical'): ["Receives {1} at {0} seal interface ","{0}
stays secured in {1} sealing interface and seal the unit ", "a)Surface
cleanliness\n b)Clearance to receive the {1}","Unable to secure {1} on the
{0} and unable to seal the {0} with the unit \n*Uncleanliness of
surface\n*Insufficient clearance or incorrect sealing interfeace design to
receieve adhesive-sealing"],
(2, 'Thermal paste','Physical'): ["Receives {1} on major power generating
components on {0}", "Transfer the heat generated by power generating
components to {1}","a)Identification of Power generating components \n
b)Clearance for receiving TIM","Unable to transfer heat generated to TIM \n
*Incorrect identification of power generating component \n*Insufficient
clearance for thermal adhesive"],
(2, 'Thermal paste','Thermal energy transfer'): ["Thermal Energy generated
by components on {0}","{0} dissipates the thermal energy and functions
properly","a)Thermal management techniques for {0}, Thermal Pads,
Vias","Overheating of PCB assembly which results in its failure \n
*Insufficient Thermal Vias Near High Heat Components \n * Less heat
dissipation contact area \n *Less contact of thermal pads of components with
vias \n *Improper material selection for PCB to meet thermal environment \n
*Copper Traces too Thin and/or too Narrow \n *Incorrect placement of power
consuming components"],
(2, 'Adhesive','Physical'): ["Receives adhesive between {0} and ?", "{1}
hold the ? with {0}", "Surface cleanliness \n b)Contact area \nc)Mounting
feature to receive sufficient {1} \nd)Maintained clearance ", "Adhesive fails
to hold EMI Filter to the housing \n*Insuffiicient contact area
\n*Uncleanliness of surface \n*Incorrect mounting feature for EMI filter
\n*Insufficient clearance for EMI filter with the PCb assembly"],
(2,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", "{0} stay unaffected by vibration and shock load and Functions
properly","Clearance on PCB to place it on mounting bosses, Distribution of
components on PCB Board, Solder Strength, Clamp load on PCB","PCB Assembly
fails to function due to vibration and shock load \n*Unequal distribution of
components in PCB makes it vulnerable to vibration and shock(weight or
concentration of components) \n*Poor strength of solder to hold the
components to the PCB"],
(2,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","a)Compactible material selection which are
resistant to chemicals \n b) Coating or use of gaskets", "Corrosion,
Degradation \n* Incorrect Material selection \n*Lack of coating or gasket "],
(2, 'Other','Thermal cycle'): ["Thermal Cycling","No negative imapact due
to thermal cycling", "a)Compactible material selection of housing based on
thermal properties(low thermal expansion) \n b)Design of housing to
accomodate thermal expansion \nc)Operating environment of the housing"],
(2, 'Other', 'EMI exposure'): ["Receives or emits EMI", "{0} staying
unaffected from EMI by staying in contact with EMI filter and proper
grounding", "a)Positioning of PCB components on PCB, Grounding \n b)Clearance
with cover and case for placing EMI filter","Unable to reduce the amount of
EMI that is emitted or received \n *Improper PCB to housing ground. \n
*Improper PCB component layout \n *Improper PCB to housing ground path \n
*Improper PCB to vehicle ground "],

(3, 'Housing', 'Physical'): ["{0} receives {1}", "{1} stays with the {0}",
"a)Mounting geometry and mounting features\n b) Screw hole pattern layout\n
c)size and shape of Base","Unable to protect the PCB assembly by staying with
the {1}\n * Incorrect mounting geometry or mounting features \n *Incorrect
screw hole pattern \n *Incorrect size and shape of the {0} "],
(3, 'PCBA', 'Thermal energy transfer'): ["{0} receives thermal energy from
{1}", "{0} dissipates the thermal energy from {1} effectively.","a)Material
Selection, b)thermal design", "Overheating and Failure of PCB\n *Thermal
fatigue"],
(3, 'PCBA', 'Physical'): ["{0} receives the{1}","{1} stay secured with the
{0}.","Screw hole pattern layout\n b)Mounting features and clearance required
for PCB components", "PCB assembly doesn't stays with the housing
\n*incorrect screw hole pattern layout \n*incorrect mounting features for PCB
assembly \n*insufficeint clearance for Pcb assembly"],
(3, 'Gasket','Physical'): ["Receives {1} at {0} seal interface ","{0}
stays secured in {1} sealing interface and seal the unit ", "a)Surface
cleanliness\n b)Clearance to receive the {1}","Unable to secure {1} on the
{0} and unable to seal the {0} with the unit \n*Uncleanliness of
surface\n*Insufficient clearance or incorrect sealing interfeace design to
receieve adhesive-sealing"],
(3, 'Thermal paste','Physical'): ["Receives {1} between {0} and major
power generating components", "Pedastal size and clearance sufficient to
accomodate enough {1}","a)Surface cleanliness \n b)Mounting features to
receive TIM maintaining clearance with PCB \n c)Contact area with
TIM","Housing unable to accommodate sufficient Thermal adhesive between
housing and major power generating components in PCB.\n *Uncleanliness of
surface \n*Incorrect design feature(pedastal) to recieve the thermal adhesive
\n*Insufficeint clearance to receive thermal adhesive \n*Insufficeint contact
with the thermal adhesive"],
(3, 'Thermal paste','Thermal energy transfer'): ["Thermal energy
transfered from PCB assembly through {1}","{0} dissipates the thermal energy
received through {1} to external environment","a)Thermal management design
features on {0}- Fins, Pedastals, clearance for TIM between {0} and PCB
assembly \n b)Incorrect material selection","{0} unable to accommodate
sufficient {1} between housing and major power generating components in PCB.
\n *Uncleanliness of surface \n*Incorrect design feature(pedastal) to recieve
the thermal adhesive \n *Insufficeint clearance to receive thermal adhesive
\n*Insufficeint contact with the {1}"],
(3, 'Adhesive','Physical'): ["Receives adhesive between {0} and ?", "{1}
hold the ? with {0}", "Surface cleanliness \n b)Contact area \nc)Mounting
feature to receive sufficient {1} \nd)Maintained clearance ", "Adhesive fails
to hold EMI Filter to the housing \n*Insuffiicient contact area
\n*Uncleanliness of surface \n*Incorrect mounting feature for EMI filter
\n*Insufficient clearance for EMI filter with the PCb assembly"],
(3,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", " {1} stays intact with , and protect the","a)Material Selection \n
b)Size, thickness and shape of cover \n c)Mounting features and mounting
technique for cover","Deformation due to vibration and shock and unable to
protect the PCB assembly from shock and vibration(Corrosion,
deformation,Crack intiation or propagation) \n *Incorrect material selection
\n *Incorrect size, thicknesss and shape of cover \n*Incorrect Mounting
features and mounting technique for cover"],
(3,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","a)Compactible material selection which are
resistant to chemicals \n b) Coating or use of gaskets", "Corrosion,
Degradation \n* Incorrect Material selection \n*Lack of coating or gasket "],
(3, 'Other','Thermal cycle'): ["Thermal Cycling","No nagative imapact due
to thermal cycling", "a)Compactible material selection of housing based on
thermal properties(low thermal expansion) \n b)Design of housing to
accomodate thermal expansion \nc)Operating environment of the housing"],
(3, 'Other', 'EMI exposure'): ["Exposure to EMI", "{0} protect or shield
the unit from EMI exposure", "a)Selection of EMI shielding mater \n b)Proper
grounding","Unable to protect the unit from EMI exposure \n*Incorrect
material selection \n*Inproper PCB to housing ground path \n*Improper housing
to vehicle ground"],

(4, 'Housing', 'Physical'): ["{1} receives {0}", "{0} stays in contact

with the {1} and effectively transfer heat generated by PCBA", "a)Compactible
{0} selection \n b)Proper aligning and applying of {0} with mating surfaces
\n c)Even distribution of {0} \n d)Thicknesss of {0}","Thermal paste
failure\n *Incorrect selection of {0} \n *Improper aligning and applying of
{0} with mating surfaces \n *Uneven distribution of {0} \n *Too thin or thick
{0} "],
(4, 'Cover', 'Physical'): ["{1} receives {0}", "{0} stays in contact with
the {1} and effectively transfer heat generated by PCBA", "a)Compactible {0}
selection \n b)Proper aligning and applying of {0} with mating surfaces \n
c)Even distribution of {0} \n d)Thicknesss of {0}","Thermal paste failure\n
*Incorrect selection of {0} \n *Improper aligning and applying of {0} with
mating surfaces \n *Uneven distribution of {0} \n *Too thin or thick {0} "],
(4, 'PCBA', 'Thermal energy transfer'): ["{0} receives thermal energy from
{1}", "{0} improve heat transfer out of the {1}.","a)Compactible {0}
selection \n b)Proper aligning and applying of {0} with mating surfaces \n
c)Even distribution of {0} \n d)Thicknesss of {0}", "Thermal paste failure\n
*Incorrect selection of {0} \n *Improper aligning and applying of {0} with
mating surfaces \n *Uneven distribution of {0} \n *Too thin or thick {0}"],
(4, 'PCBA', 'Physical'): ["{1} receives the {0}","Even distribution of {0}
on required areas of {1}","a)Compactible {0} selection \n b)Proper aligning
and applying of {0} with mating surfaces \n c)Even distribution of {0} \n
d)Thicknesss of {0}", "Thermal paste failure\n *Incorrect selection of {0} \n
*Improper aligning and applying of {0} with mating surfaces \n *Uneven
distribution of {0} \n *Too thin or thick {0}"],
(4,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", " {0} resistant to deformation and capable of withstanding the
specific vibration and shock loads that it will be subjected
to.","a)Compactible {0} selection \n b)Proper aligning and applying of {0}
with mating surfaces \n c)Even distribution of {0} \n d)Thicknesss of
{0}","Thermal paste failure\n *Incorrect selection of {0} \n *Improper
aligning and applying of {0} with mating surfaces \n *Uneven distribution of
{0} \n *Too thin or thick {0}"],
(4,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","a)Compactible {0} selection \n b)Proper aligning
and applying of {0} with mating surfaces \n c)Even distribution of {0} \n
d)Thicknesss of {0}", "Thermal paste failure\n *Incorrect selection of {0} \n
*Improper aligning and applying of {0} with mating surfaces \n *Uneven
distribution of {0} \n *Too thin or thick {0}"],
(4, 'Other','Thermal cycle'): ["Thermal Cycling","No nagative imapact due
to thermal cycling", "a)Compactible {0} selection \n b)Proper aligning and
applying of {0} with mating surfaces \n c)Even distribution of {0} \n
d)Thicknesss of {0}", "Thermal paste failure\n *Incorrect selection of {0} \n
*Improper aligning and applying of {0} with mating surfaces \n *Uneven
distribution of {0} \n *Too thin or thick {0}"],

(5, 'Housing', 'Physical'): ["{1} receives {0}", "Compactible {0} seal the
unit at mating surfaces", "a)Compactible {0} selection \n b)Proper sizing of
{0}\n c)Dispensing method and curing process of {0} \n Cleanliness of mating
surfaces","{0} failure\n *Incorrect selection of {0} \n *Incorrect size and
shape to fit and form proper seal \n *Incorrect dispensing method or curing
process for {0} \n *Insufficient quantity of {0} \n *Uncleanliness of mating
surfaces"],
(5, 'Cover', 'Physical'): ["{1} receives {0}", "Compactible {0} seal the
unit at mating surfaces", "a)Compactible {0} selection \n b)Proper sizing of
{0}\n c)Dispensing method and curing process of {0} \n Cleanliness of mating
surfaces","{0} failure\n *Incorrect selection of {0} \n *Incorrect size and
shape to fit and form proper seal \n *Incorrect dispensing method or curing
process for {0} \n *Insufficient quantity of {0} \n *Uncleanliness of mating
surfaces"],
(5, 'PCBA', 'Thermal energy transfer'): ["{0} receives thermal energy from
{1}", "{0} improve heat transfer out of the {1}.","a)Compactible {0}
selection \n b)Proper aligning and applying of {0} with mating surfaces \n
c)Even distribution of {0} \n d)Thicknesss of {0}", "Thermal paste failure\n
*Incorrect selection of {0} \n *Improper aligning and applying of {0} with
mating surfaces \n *Uneven distribution of {0} \n *Too thin or thick {0}"],
(5, 'PCBA', 'Physical'): ["{1} receives the {0}","Even distribution of {0}
on required areas of {1}","a)Compactible {0} selection \n b)Proper aligning
and applying of {0} with mating surfaces \n c)Even distribution of {0} \n
d)Thicknesss of {0}", "Thermal paste failure\n *Incorrect selection of {0} \n
*Improper aligning and applying of {0} with mating surfaces \n *Uneven
distribution of {0} \n *Too thin or thick {0}"],
(5,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", " Maintain sealing by withstanding vibration and shock
load","a)Compactible {0} selection - Resistant to deformation, Capable of
withstanding the specific vibration and shock loads that it will be subjected
to. \n b)Proper sizing of {0}\n c)Dispensing method and curing process of {0}
\n Cleanliness of mating surfaces","Deformation or damaged over time, leading
to loss of sealing ability\n *Incorrect selection of {0} \n *Incorrect size
and shape to fit and form proper seal \n *Incorrect dispensing method or
curing process for {0} \n *Insufficient quantity of {0} \n *Uncleanliness of
mating surfaces"],
(5,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","Compactible {0} selection which are resistant to
chemicals", "Gasket degrade and fail\n *Incorrect selection of {0} "],
(5, 'Other','Thermal cycle'): ["Thermal Cycling","No negative imapact due
to thermal cycling", "{0} compactible with the specific temperature range in
will be exposed to.", "Deform/Damage/{0} failure \n *Incorrect {0} selection
\n *Exposure to lower temperature cause {0} to become stiffer and more
brittle. \n *Exposure to higher temperature cause {0} to soft or lose it's
resiliency, leading to failure \n *Exposure to thermal variations from the
unit,vehicle, or environment, it will be deformed or damaged over time,
leading to loss of sealing ability."],
(5, 'Other','Shear stress'): ["Shear stress from mating surfaces","Stay
unaffected by Shear stress and seal the unit at mating surfaces",
"a)Compactible {0} selection \n b)Proper sizing of {0}\n c)Dispensing method
and curing process of {0} \n Cleanliness of mating surfaces", "Wear and tear
of {0}\n *Incorrect selection of {0} \n *Incorrect size and shape to fit and
form proper seal \n *Incorrect dispensing method or curing process for {0} \n
*Insufficient quantity of {0} \n *Uncleanliness of mating surfaces"],
(5, 'Other','Compression stress'): ["Compression stress from mating
surfaces","Stay unaffected by compression stress and seal the unit at mating
surfaces", "a)Compactible {0} selection \n b)Proper sizing of {0}\n
c)Dispensing method and curing process of {0} \n Cleanliness of mating
surfaces", "Permanently deformed, leading to a loss of sealing ability{0}\n
*Incorrect selection of {0} \n *Incorrect size and shape to fit and form
proper seal \n *Incorrect dispensing method or curing process for {0} \n
*Insufficient quantity of {0} \n *Uncleanliness of mating surfaces"],
 (6, 'Housing', 'Physical'): ["{1} receives {0} to fix the ? to {1} ", "{0}
hold the ? with {1} in place under normal operating conditions with
sufficient bond strength", "a){0} selection based on standards\n b)Thickness
of {0} \n c)Quantity of {0}","Unable to hold ? to {1}\n * Incorrect selection
of {0} \n *Adhesive thickness less or than required \n *Insufficient {0} "],
(6, 'Cover', 'Physical'): ["{1} receives {0} to fix the ? to {1} ", "{0}
hold the ? with {1} in place under normal operating conditions with
sufficient bond strength", "a){0} selection based on standards\n b)Thickness
of {0} \n c)Quantity of {0}","Unable to hold ? to {1}\n * Incorrect selection
of {0} \n *Adhesive thickness less or than required \n *Insufficient {0} "],
(6, 'PCBA', 'Thermal energy transfer'): ["{0} receives thermal energy from
{1}", "{0} dissipates the thermal energy from {1} effectively.","a)Material
Selection, b)thermal design", "Overheating and Failure of PCB\n *Thermal
fatigue"],
(6, 'PCBA', 'Physical'): ["{1} receives {0} to fix the ? to {1} ", "{0}
hold the ? with {1} in place under normal operating conditions with
sufficient bond strength", "a){0} selection based on standards\n b)Thickness
of {0} \n c)Quantity of {0}","Unable to hold ? to {1}\n * Incorrect selection
of {0} \n *Adhesive thickness less or than required \n *Insufficient {0} "],
(6, 'Gasket','Physical'): ["Receives {1} at {0} seal interface ","{0}
stays secured in {1} sealing interface and seal the unit ", "a)Surface
cleanliness\n b)Clearance to receive the {1}","Unable to secure {1} on the
{0} and unable to seal the {0} with the unit \n*Uncleanliness of
surface\n*Insufficient clearance or incorrect sealing interfeace design to
receieve adhesive-sealing"],
(6,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", " {1} stays intact with , and protect the","a){0} selection based
on standards\n b)Thickness of {0} \n c)Quantity of {0}","Unable to hold ? to
{1}\n * Incorrect selection of {0} \n *Adhesive thickness less or than
required \n *Insufficient {0}"],
(6,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","a)Compactible material selection which are
resistant to chemicals \n b) Coating or use of gaskets", "Corrosion,
Degradation \n* Incorrect Material selection \n*Lack of coating or gasket "],
(6, 'Other','Thermal cycle'): ["Thermal Cycling","No nagative imapact due
to thermal cycling", "a)Compactible material selection of housing based on
thermal properties(low thermal expansion) \n b)Design of housing to
accomodate thermal expansion \nc)Operating environment of the housing"],
(6, 'Other', 'EMI exposure'): ["Exposure to EMI", "{0} protect or shield
the unit from EMI exposure", "a)Selection of EMI shielding mater \n b)Proper
grounding","Unable to protect the unit from EMI exposure \n*Incorrect
material selection \n*Inproper PCB to housing ground path \n*Improper housing
to vehicle ground"],
(6, 'Other','Shear stress'): ["Shear stress from mating surfaces","Stay
unaffected by Shear stress and seal the unit at mating surfaces",
"a)Compactible {0} selection \n b)Proper sizing of {0}\n c)Dispensing method
and curing process of {0} \n Cleanliness of mating surfaces", "Wear and tear
of {0}\n *Incorrect selection of {0} \n *Incorrect size and shape to fit and
form proper seal \n *Incorrect dispensing method or curing process for {0} \n
*Insufficient quantity of {0} \n *Uncleanliness of mating surfaces"],
(6, 'Other','Compression stress'): ["Compression stress from mating
surfaces","Stay unaffected by compression stress and seal the unit at mating
surfaces", "a)Compactible {0} selection \n b)Proper sizing of {0}\n
c)Dispensing method and curing process of {0} \n Cleanliness of mating
surfaces", "Permanently deformed, leading to a loss of sealing ability{0}\n
*Incorrect selection of {0} \n *Incorrect size and shape to fit and form
proper seal \n *Incorrect dispensing method or curing process for {0} \n
*Insufficient quantity of {0} \n *Uncleanliness of mating surfaces"],

(7, 'Cover', 'Physical'): ["{0} receives {1}", "{1} stays with the {0}",
"a)Mounting geometry and mounting features\n b) Screw hole pattern layout\n
c)size and shape of Base","Unable to protect the PCB assembly by staying with
the {1}\n * Incorrect mounting geometry or mounting features \n *Incorrect
screw hole pattern \n *Incorrect size and shape of the {0} "],
(7, 'PCBA', 'Thermal energy transfer'): ["{0} receives thermal energy from
{1}", "{0} dissipates the thermal energy from {1} effectively.","a)Material
Selection, b)thermal design", "Overheating and Failure of PCB\n *Thermal
fatigue"],
(7, 'PCBA', 'Physical'): ["{0} receives the{1}","{1} stay secured with the
{0}.","a)Screw hole pattern layout\n b)Mounting features and clearance
required for PCB components", "PCB assembly doesn't stays with the housing
\n*incorrect screw hole pattern layout \n*incorrect mounting features for PCB
assembly \n*insufficeint clearance for Pcb assembly"],
(7, 'Gasket','Physical'): ["Receives {1} at {0} seal interface ","{0}
stays secured in {1} sealing interface and seal the unit ", "a)Surface
cleanliness\n b)Clearance to receive the {1}","Unable to secure {1} on the
{0} and unable to seal the {0} with the unit \n*Uncleanliness of
surface\n*Insufficient clearance or incorrect sealing interfeace design to
receieve adhesive-sealing"],
(7, 'Thermal paste','Physical'): ["Receives {1} between {0} and major
power generating components", "Pedastal size and clearance sufficient to
accomodate enough {1}","a)Surface cleanliness \n b)Mounting features to
receive TIM maintaining clearance with PCB \n c)Contact area with
TIM","Housing unable to accommodate sufficient Thermal adhesive between
housing and major power generating components in PCB.\n *Uncleanliness of
surface \n*Incorrect design feature(pedastal) to recieve the thermal adhesive
\n*Insufficeint clearance to receive thermal adhesive \n*Insufficeint contact
with the thermal adhesive"],
(7, 'Thermal paste','Thermal energy transfer'): ["Thermal energy
transfered from PCB assembly through {1}","{0} dissipates the thermal energy
received through {1} to external environment","a)Thermal management design
features on {0}- Fins, Pedastals, clearance for TIM between {0} and PCB
assembly \n b)Incorrect material selection","{0} unable to accommodate
sufficient {1} between housing and major power generating components in PCB.
\n *Uncleanliness of surface \n*Incorrect design feature(pedastal) to recieve
the thermal adhesive \n *Insufficeint clearance to receive thermal adhesive
\n*Insufficeint contact with the {1}"],
(7, 'Adhesive','Physical'): ["Receives adhesive between {0} and ?", "{1}
hold the ? with {0}", "Surface cleanliness \n b)Contact area \nc)Mounting
feature to receive sufficient {1} \nd)Maintained clearance ", "Adhesive fails
to hold EMI Filter to the housing \n*Insuffiicient contact area
\n*Uncleanliness of surface \n*Incorrect mounting feature for EMI filter
\n*Insufficient clearance for EMI filter with the PCb assembly"],
(7,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", " {1} stays intact with , and protect the","a)Material Selection \n
b)Size, thickness and shape of cover \n c)Mounting features and mounting
technique for cover","Deformation due to vibration and shock and unable to
protect the PCB assembly from shock and vibration(Corrosion,
deformation,Crack intiation or propagation) \n *Incorrect material selection
\n *Incorrect size, thicknesss and shape of cover \n*Incorrect Mounting
features and mounting technique for cover"],
(7,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","a)Compactible material selection which are
resistant to chemicals \n b) Coating or use of gaskets", "Corrosion,
Degradation \n* Incorrect Material selection \n*Lack of coating or gasket "],
(7, 'Other','Thermal cycle'): ["Thermal Cycling","No nagative imapact due
to thermal cycling", "a)Compactible material selection of housing based on
thermal properties(low thermal expansion) \n b)Design of housing to
accomodate thermal expansion \nc)Operating environment of the housing"],
(7, 'Other', 'EMI exposure'): ["Exposure to EMI", "{0} protect or shield
the unit from EMI exposure", "a)Selection of EMI shielding mater \n b)Proper
grounding","Unable to protect the unit from EMI exposure \n*Incorrect
material selection \n*Inproper PCB to housing ground path \n*Improper housing
to vehicle ground"],

(8, 'Cover', 'Physical'): ["{0} receives {1}", "{1} stays with the {0}",
"a)Mounting geometry and mounting features\n b) Screw hole pattern layout\n
c)size and shape of Base","Unable to protect the PCB assembly by staying with
the {1}\n * Incorrect mounting geometry or mounting features \n *Incorrect
screw hole pattern \n *Incorrect size and shape of the {0} "],
(8, 'PCBA', 'Thermal energy transfer'): ["{0} receives thermal energy from
{1}", "{0} dissipates the thermal energy from {1} effectively.","a)Material
Selection, b)thermal design", "Overheating and Failure of PCB\n *Thermal
fatigue"],
(8, 'PCBA', 'Physical'): ["{0} receives the{1}","{1} stay secured with the
{0}.","a)Screw hole pattern layout\n b)Mounting features and clearance
required for PCB components", "PCB assembly doesn't stays with the housing
\n*incorrect screw hole pattern layout \n*incorrect mounting features for PCB
assembly \n*insufficeint clearance for Pcb assembly"],
(8, 'Gasket','Physical'): ["Receives {1} at {0} seal interface ","{0}
stays secured in {1} sealing interface and seal the unit ", "a)Surface
cleanliness\n b)Clearance to receive the {1}","Unable to secure {1} on the
{0} and unable to seal the {0} with the unit \n*Uncleanliness of
surface\n*Insufficient clearance or incorrect sealing interfeace design to
receieve adhesive-sealing"],
(8, 'Thermal paste','Physical'): ["Receives {1} between {0} and major
power generating components", "Pedastal size and clearance sufficient to
accomodate enough {1}","a)Surface cleanliness \n b)Mounting features to
receive TIM maintaining clearance with PCB \n c)Contact area with
TIM","Housing unable to accommodate sufficient Thermal adhesive between
housing and major power generating components in PCB.\n *Uncleanliness of
surface \n*Incorrect design feature(pedastal) to recieve the thermal adhesive
\n*Insufficeint clearance to receive thermal adhesive \n*Insufficeint contact
with the thermal adhesive"],
(8, 'Thermal paste','Thermal energy transfer'): ["Thermal energy
transfered from PCB assembly through {1}","{0} dissipates the thermal energy
received through {1} to external environment","a)Thermal management design
features on {0}- Fins, Pedastals, clearance for TIM between {0} and PCB
assembly \n b)Incorrect material selection","{0} unable to accommodate
sufficient {1} between housing and major power generating components in PCB.
\n *Uncleanliness of surface \n*Incorrect design feature(pedastal) to recieve
the thermal adhesive \n *Insufficeint clearance to receive thermal adhesive
\n*Insufficeint contact with the {1}"],
(8, 'Adhesive','Physical'): ["Receives adhesive between {0} and ?", "{1}
hold the ? with {0}", "Surface cleanliness \n b)Contact area \nc)Mounting
feature to receive sufficient {1} \nd)Maintained clearance ", "Adhesive fails
to hold EMI Filter to the housing \n*Insuffiicient contact area
\n*Uncleanliness of surface \n*Incorrect mounting feature for EMI filter
\n*Insufficient clearance for EMI filter with the PCb assembly"],
(8,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", " {1} stays intact with , and protect the","a)Material Selection \n
b)Size, thickness and shape of cover \n c)Mounting features and mounting
technique for cover","Deformation due to vibration and shock and unable to
protect the PCB assembly from shock and vibration(Corrosion,
deformation,Crack intiation or propagation) \n *Incorrect material selection
\n *Incorrect size, thicknesss and shape of cover \n*Incorrect Mounting
features and mounting technique for cover"],
(8,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","a)Compactible material selection which are
resistant to chemicals \n b) Coating or use of gaskets", "Corrosion,
Degradation \n* Incorrect Material selection \n*Lack of coating or gasket "],
(8, 'Other','Thermal cycle'): ["Thermal Cycling","No nagative imapact due
to thermal cycling", "a)Compactible material selection of housing based on
thermal properties(low thermal expansion) \n b)Design of housing to
accomodate thermal expansion \nc)Operating environment of the housing"],
(8, 'Other', 'EMI exposure'): ["Exposure to EMI", "{0} protect or shield
the unit from EMI exposure", "a)Selection of EMI shielding mater \n b)Proper
grounding","Unable to protect the unit from EMI exposure \n*Incorrect
material selection \n*Inproper PCB to housing ground path \n*Improper housing
to vehicle ground"],

(9, 'Cover', 'Physical'): ["{0} receives {1}", "{1} stays with the {0}",
"a)Mounting geometry and mounting features\n b) Screw hole pattern layout\n
c)size and shape of Base","Unable to protect the PCB assembly by staying with
the {1}\n * Incorrect mounting geometry or mounting features \n *Incorrect
screw hole pattern \n *Incorrect size and shape of the {0} "],
(9, 'PCBA', 'Thermal energy transfer'): ["{0} receives thermal energy from
{1}", "{0} dissipates the thermal energy from {1} effectively.","a)Material
Selection, b)thermal design", "Overheating and Failure of PCB\n *Thermal
fatigue"],
(9, 'PCBA', 'Physical'): ["{0} receives the{1}","{1} stay secured with the
{0}.","a)Screw hole pattern layout\n b)Mounting features and clearance
required for PCB components", "PCB assembly doesn't stays with the housing
\n*incorrect screw hole pattern layout \n*incorrect mounting features for PCB
assembly \n*insufficeint clearance for Pcb assembly"],
(9, 'Gasket','Physical'): ["Receives {1} at {0} seal interface ","{0}
stays secured in {1} sealing interface and seal the unit ", "a)Surface
cleanliness\n b)Clearance to receive the {1}","Unable to secure {1} on the
{0} and unable to seal the {0} with the unit \n*Uncleanliness of
surface\n*Insufficient clearance or incorrect sealing interfeace design to
receieve adhesive-sealing"],
 (9, 'Thermal paste','Physical'): ["Receives {1} between {0} and major
power generating components", "Pedastal size and clearance sufficient to
accomodate enough {1}","a)Surface cleanliness \n b)Mounting features to
receive TIM maintaining clearance with PCB \n c)Contact area with
TIM","Housing unable to accommodate sufficient Thermal adhesive between
housing and major power generating components in PCB.\n *Uncleanliness of
surface \n*Incorrect design feature(pedastal) to recieve the thermal adhesive
\n*Insufficeint clearance to receive thermal adhesive \n*Insufficeint contact
with the thermal adhesive"],
(9, 'Thermal paste','Thermal energy'): ["Thermal energy transfered from
PCB assembly through {1}","{0} dissipates the thermal energy received through
{1} to external environment","a)Thermal management design features on {0}-
Fins, Pedastals, clearance for TIM between {0} and PCB assembly \n
b)Incorrect material selection","{0} unable to accommodate sufficient {1}
between housing and major power generating components in PCB. \n
*Uncleanliness of surface \n*Incorrect design feature(pedastal) to recieve
the thermal adhesive \n *Insufficeint clearance to receive thermal adhesive
\n*Insufficeint contact with the {1}"],
(9, 'Adhesive','Physical'): ["Receives adhesive between {0} and ?", "{1}
hold the ? with {0}", "Surface cleanliness \n b)Contact area \nc)Mounting
feature to receive sufficient {1} \nd)Maintained clearance ", "Adhesive fails
to hold EMI Filter to the housing \n*Insuffiicient contact area
\n*Uncleanliness of surface \n*Incorrect mounting feature for EMI filter
\n*Insufficient clearance for EMI filter with the PCb assembly"],
(9,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", " {1} stays intact with , and protect the","a)Material Selection \n
b)Size, thickness and shape of cover \n c)Mounting features and mounting
technique for cover","Deformation due to vibration and shock and unable to
protect the PCB assembly from shock and vibration(Corrosion,
deformation,Crack intiation or propagation) \n *Incorrect material selection
\n *Incorrect size, thicknesss and shape of cover \n*Incorrect Mounting
features and mounting technique for cover"],
(9,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","a)Compactible material selection which are
resistant to chemicals \n b) Coating or use of gaskets", "Corrosion,
Degradation \n* Incorrect Material selection \n*Lack of coating or gasket "],
(9, 'Other','Thermal cycling'): ["Thermal Cycling","No nagative imapact
due to thermal cycling", "a)Compactible material selection of housing based
on thermal properties(low thermal expansion) \n b)Design of housing to
accomodate thermal expansion \nc)Operating environment of the housing"],
(9, 'Other', 'EMI exposure'): ["Exposure to EMI", "{0} protect or shield
the unit from EMI exposure", "a)Selection of EMI shielding mater \n b)Proper
grounding","Unable to protect the unit from EMI exposure \n*Incorrect
material selection \n*Inproper PCB to housing ground path \n*Improper housing
to vehicle ground"],

(10, 'Cover', 'Physical'): ["{0} receives {1}", "{1} stays with the {0}",
"a)Mounting geometry and mounting features\n b) Screw hole pattern layout\n
c)size and shape of Base","Unable to protect the PCB assembly by staying with
the {1}\n * Incorrect mounting geometry or mounting features \n *Incorrect
screw hole pattern \n *Incorrect size and shape of the {0} "],
(10, 'PCBA', 'Thermal energy transfer'): ["{0} receives thermal energy
from {1}", "{0} dissipates the thermal energy from {1}
effectively.","a)Material Selection, b)thermal design", "Overheating and
Failure of PCB\n *Thermal fatigue"],
(10, 'PCBA', 'Physical'): ["{0} receives the{1}","{1} stay secured with
the {0}.","a)Screw hole pattern layout\n b)Mounting features and clearance
required for PCB components", "PCB assembly doesn't stays with the housing
\n*incorrect screw hole pattern layout \n*incorrect mounting features for PCB
assembly \n*insufficeint clearance for Pcb assembly"],
(10, 'Gasket','Physical'): ["Receives {1} at {0} seal interface ","{0}
stays secured in {1} sealing interface and seal the unit ", "a)Surface
cleanliness\n b)Clearance to receive the {1}","Unable to secure {1} on the
{0} and unable to seal the {0} with the unit \n*Uncleanliness of
surface\n*Insufficient clearance or incorrect sealing interfeace design to
receieve adhesive-sealing"],
(10, 'Thermal paste','Physical'): ["Receives {1} between {0} and major
power generating components", "Pedastal size and clearance sufficient to
accomodate enough {1}","a)Surface cleanliness \n b)Mounting features to
receive TIM maintaining clearance with PCB \n c)Contact area with
TIM","Housing unable to accommodate sufficient Thermal adhesive between
housing and major power generating components in PCB.\n *Uncleanliness of
surface \n*Incorrect design feature(pedastal) to recieve the thermal adhesive
\n*Insufficeint clearance to receive thermal adhesive \n*Insufficeint contact
with the thermal adhesive"],
(10, 'Thermal paste','Thermal energy transfer'): ["Thermal energy
transfered from PCB assembly through {1}","{0} dissipates the thermal energy
received through {1} to external environment","a)Thermal management design
features on {0}- Fins, Pedastals, clearance for TIM between {0} and PCB
assembly \n b)Incorrect material selection","{0} unable to accommodate
sufficient {1} between housing and major power generating components in PCB.
\n *Uncleanliness of surface \n*Incorrect design feature(pedastal) to recieve
the thermal adhesive \n *Insufficeint clearance to receive thermal adhesive
\n*Insufficeint contact with the {1}"],
(10, 'Adhesive','Physical'): ["Receives adhesive between {0} and ?", "{1}
hold the ? with {0}", "Surface cleanliness \n b)Contact area \nc)Mounting
feature to receive sufficient {1} \nd)Maintained clearance ", "Adhesive fails
to hold EMI Filter to the housing \n*Insuffiicient contact area
\n*Uncleanliness of surface \n*Incorrect mounting feature for EMI filter
\n*Insufficient clearance for EMI filter with the PCb assembly"],
(10,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", " {1} stays intact with , and protect the","a)Material Selection \n
b)Size, thickness and shape of cover \n c)Mounting features and mounting
technique for cover","Deformation due to vibration and shock and unable to
protect the PCB assembly from shock and vibration(Corrosion,
deformation,Crack intiation or propagation) \n *Incorrect material selection
\n *Incorrect size, thicknesss and shape of cover \n*Incorrect Mounting
features and mounting technique for cover"],
(10,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","a)Compactible material selection which are
resistant to chemicals \n b) Coating or use of gaskets", "Corrosion,
Degradation \n* Incorrect Material selection \n*Lack of coating or gasket "],
(10, 'Other','Thermal cycling'): ["Thermal Cycling","No nagative imapact
due to thermal cycling", "a)Compactible material selection of housing based
on thermal properties(low thermal expansion) \n b)Design of housing to
accomodate thermal expansion \nc)Operating environment of the housing"],
 (10, 'Other', 'EMI exposure'): ["Exposure to EMI", "{0} protect or shield
the unit from EMI exposure", "a)Selection of EMI shielding mater \n b)Proper
grounding","Unable to protect the unit from EMI exposure \n*Incorrect
material selection \n*Inproper PCB to housing ground path \n*Improper housing
to vehicle ground"],

(11, 'Cover', 'Physical'): ["{0} receives {1}", "{1} stays with the {0}",
"a)Mounting geometry and mounting features\n b) Screw hole pattern layout\n
c)size and shape of Base","Unable to protect the PCB assembly by staying with
the {1}\n * Incorrect mounting geometry or mounting features \n *Incorrect
screw hole pattern \n *Incorrect size and shape of the {0} "],
(11, 'PCBA', 'Thermal energy transfer'): ["{0} receives thermal energy
from {1}", "{0} dissipates the thermal energy from {1}
effectively.","a)Material Selection, b)thermal design", "Overheating and
Failure of PCB\n *Thermal fatigue"],
(11, 'PCBA', 'Physical'): ["{0} receives the{1}","{1} stay secured with
the {0}.","a)Screw hole pattern layout\n b)Mounting features and clearance
required for PCB components", "PCB assembly doesn't stays with the housing
\n*incorrect screw hole pattern layout \n*incorrect mounting features for PCB
assembly \n*insufficeint clearance for Pcb assembly"],
(11, 'Gasket','Physical'): ["Receives {1} at {0} seal interface ","{0}
stays secured in {1} sealing interface and seal the unit ", "a)Surface
cleanliness\n b)Clearance to receive the {1}","Unable to secure {1} on the
{0} and unable to seal the {0} with the unit \n*Uncleanliness of
surface\n*Insufficient clearance or incorrect sealing interfeace design to
receieve adhesive-sealing"],
(11, 'Thermal paste','Physical'): ["Receives {1} between {0} and major
power generating components", "Pedastal size and clearance sufficient to
accomodate enough {1}","a)Surface cleanliness \n b)Mounting features to
receive TIM maintaining clearance with PCB \n c)Contact area with
TIM","Housing unable to accommodate sufficient Thermal adhesive between
housing and major power generating components in PCB.\n *Uncleanliness of
surface \n*Incorrect design feature(pedastal) to recieve the thermal adhesive
\n*Insufficeint clearance to receive thermal adhesive \n*Insufficeint contact
with the thermal adhesive"],
(11, 'Thermal paste','Thermal energy transfer'): ["Thermal energy
transfered from PCB assembly through {1}","{0} dissipates the thermal energy
received through {1} to external environment","a)Thermal management design
features on {0}- Fins, Pedastals, clearance for TIM between {0} and PCB
assembly \n b)Incorrect material selection","{0} unable to accommodate
sufficient {1} between housing and major power generating components in PCB.
\n *Uncleanliness of surface \n*Incorrect design feature(pedastal) to recieve
the thermal adhesive \n *Insufficeint clearance to receive thermal adhesive
\n*Insufficeint contact with the {1}"],
(11, 'Adhesive','Physical'): ["Receives adhesive between {0} and ?", "{1}
hold the ? with {0}", "Surface cleanliness \n b)Contact area \nc)Mounting
feature to receive sufficient {1} \nd)Maintained clearance ", "Adhesive fails
to hold EMI Filter to the housing \n*Insuffiicient contact area
\n*Uncleanliness of surface \n*Incorrect mounting feature for EMI filter
\n*Insufficient clearance for EMI filter with the PCb assembly"],
(11,'Other','Vibration and shock load'): ["Vibration and shock load from
vehicle", " {1} stays intact with , and protect the","a)Material Selection \n
b)Size, thickness and shape of cover \n c)Mounting features and mounting
technique for cover","Deformation due to vibration and shock and unable to
protect the PCB assembly from shock and vibration(Corrosion,
deformation,Crack intiation or propagation) \n *Incorrect material selection
\n *Incorrect size, thicknesss and shape of cover \n*Incorrect Mounting
features and mounting technique for cover"],
(11,'Other','Chemical exposure'): ["Chemical Exposure","No negative impact
due to chemical exposure","a)Compactible material selection which are
resistant to chemicals \n b) Coating or use of gaskets", "Corrosion,
Degradation \n* Incorrect Material selection \n*Lack of coating or gasket "],
(11, 'Other','Thermal cycling'): ["Thermal Cycling","No nagative imapact
due to thermal cycling", "a)Compactible material selection of housing based
on thermal properties(low thermal expansion) \n b)Design of housing to
accomodate thermal expansion \nc)Operating environment of the housing"],
(11, 'Other', 'EMI exposure'): ["Exposure to EMI", "{0} protect or shield
the unit from EMI exposure", "a)Selection of EMI shielding mater \n b)Proper
grounding","Unable to protect the unit from EMI exposure \n*Incorrect
material selection \n*Inproper PCB to housing ground path \n*Improper housing
to vehicle ground"]
}

icomponent = ['Housing', 'Cover', 'PCB', 'PCBA', 'PCBC', 'Gasket',

'Thermal paste', 'EMCF', 'Fasteners', 'Adhesive', 'Connector','Other']
intr = ['Thermal energy transfer','Electrical energy', 'Physical',
'Material transfer', 'Data transfer','Vibration and shock load','Chemical
exposure','Thermal cycling','EMI exposure','Shear stress','Compression
stress']
component_joining=['Housing','Cover','PCBA', 'EMI Filter']
joining_process =['Soldering','Welding','Brazing','Adhesive','Fasteners',
'NR']
interactions = []
Component Data Python File

class cmmp:
# Define lists of components, materials, and manufacturing processes
def __init__(self, name):
self.name = name

component = ['Housing', 'Cover', 'PCB', 'PCBA', 'PCBC', 'Gasket', 'Thermal

paste', 'EMI filter', 'Fasteners',
'Adhesive', 'Connector', 'Dowel pin', 'Coolant', 'LED
Window', 'Bracket', 'Heat pipes',
'Heat sinks', 'Washers']
material = ['Steel', 'Aluminium', 'Copper', 'Plastic', 'Composite',
'General', 'EGW', 'FR4', 'Stainless Steel',
'ABS', 'ABS+PC', 'PC', 'Zinc plated steel']
manufacturing_process = ['Casting', 'Forging', 'Machining', 'Injection
Molding', 'Extrusion',
'Fabrication and Assembly', 'Precision
machining', 'Cold forming', 'Compounding',
'Die cutting', 'General']

label1 = {
 ('Housing', 'Aluminium', 'Casting'): 1,
('PCB', 'FR4', 'Fabrication and Assembly'): 2,
('Cover', 'Aluminium', 'Casting'): 3,
('Thermal paste', 'General', 'Compounding'): 4,
('Gasket', 'General', 'General'): 5,
('Adhesive', 'General', 'Compounding'): 6,
('Dowel pin', 'Aluminium', 'Precision machining'): 7,
('Connector', 'General', 'General'): 8,
('Fasteners', 'General', 'General'): 9,
('EMI filter', 'General', 'General'): 10,
('Coolant', 'EGW', 'General'): 11

PTPV = {
1: ['Material', 'Manufacturing Process', 'Warpage', 'Burr'],
2: ['PCB Alignment', 'PCB Flatness', 'Hole position and size',
'PCB layers'],
3: ['Material', 'Manufacturing Process', 'Warpage', 'Burr'],
4: ['Material', 'Manufacturing Process', 'Application
Temperature'],
5: ['Material', 'Formulation of adhesive', 'Dispensing method',
'Curing process'],
6: ['Material', 'Formulation of adhesive', 'Dispensing method',
'Curing process',
'Application temperature'],
7: ['Material', 'Manufacturing Process', 'Length/Chamfer/Radius'],
8: ['Connector selection', 'Pin height,position and size',
'Assembly Technique'],
9: ['Material', 'Manufacturing process', 'Thread pitch and depth',
'Surface plating'],
10: ['Material', 'Manufacturing process', 'Strip size and shape']
}
COT = {
1: ['Thermal Fatigue', 'Wear and Tear', 'Corrosion'],
2: ['PCB delamination', 'Change in PCB Flatness', 'Solder Joint
Breaks', 'Aging', 'Degradation',
'Corrosion'],
3: ['Thermal Fatigue', 'Wear and Tear', 'Corrosion'],
4: ['Thermal Fatigue', 'Thermal paste dryout', 'Thermal paste
pumpout', 'Degradation'],
5: ['Thermal Fatigue', 'Degradation', 'Wear and Tear',
'Shrinkage', 'Aging'],
6: ['Thermal Fatigue', 'Degradation', 'Wear and Tear',
'Corrosion', 'Aging'],
7: ['Thermal Fatigue', 'Degradation', 'Wear and Tear', 'Aging'],
8: ['Thermal Fatigue', 'Degradation', 'Wear and Tear',
'Shrinkage', 'Aging'],
9: ['Thermal Fatigue', 'Corrosion', 'Wear and Tear', 'Relaxation',
'Hydrogen embrittlement'],
10: ['Thermal Fatigue', 'Degradation', 'Wear and Tear',
'Shrinkage', 'Aging']
}
 CU = {
1: ['Unintended customer usage'],
2: ['Unintended customer usage'],
3: ['Unintended customer usage'],
4: ['Unintended customer usage'],
5: ['Unintended customer usage'],
6: ['Unintended customer usage'],
7: ['Unintended customer usage'],
8: ['Unintended customer usage'],
9: ['Unintended customer usage'],
10: ['Unintended customer usage']
}

EF = {
1: ['Water', 'Snow', 'Dust', 'Salt', 'Wind', 'Temperature
Exposure', 'Chemical exposure'],
2: ['Moisture', 'Humidity', 'Temperature Exposure', 'Chemical
exposure'],
3: ['Water', 'Snow', 'Dust', 'Salt', 'Wind', 'Temperature
Exposure', 'Chemical exposure'],
4: ['Moisture', 'Humidity', 'Temperature Exposure', 'Chemical
exposure'],
5: ['Moisture', 'Humidity', 'Temperature Exposure', 'Chemical
exposure'],
6: ['Moisture', 'Humidity', 'Temperature Exposure', 'Chemical
exposure'],
7: ['Moisture', 'Humidity', 'Temperature Exposure', 'Chemical
exposure'],
8: ['Moisture', 'Humidity', 'Temperature Exposure', 'Chemical
exposure'],
9: ['Moisture', 'Humidity', 'Temperature Exposure', 'Chemical
exposure'],
10: ['Moisture', 'Humidity', 'Temperature Exposure', 'Chemical
exposure']

SI = {
1: ['Vibration', 'Heat'],
2: ['Vibration', 'Heat', 'Power', 'Signals', 'Data'],
3: ['Vibration', 'Heat'],
4: ['Vibration', 'Heat'],
5: ['Vibration', 'Heat'],
6: ['Vibration', 'Heat'],
7: ['Vibration', 'Heat'],
8: ['Vibration', 'Heat'],
9: ['Vibration', 'Heat'],
10: ['Vibration', 'Heat']
}
Excal Python File

import openpyxl

class Excel:
def write_to_excel(self, output_df, filename):
workbook = openpyxl.Workbook()
worksheet = workbook.active
worksheet.title = "PDIAGRAM"
for i, col in enumerate(output_df.columns):
worksheet.cell(row=1, column=i+1, value=col)
for i, row in enumerate(output_df.itertuples(index=False), start=2):
for j, value in enumerate(row):
worksheet.cell(row=i, column=j+1, value=value)
workbook.save(filename=filename)