CH 2 - 1 Conduction
CH 2 - 1 Conduction
Learn how to obtain temperature profiles for common geometries without heat generation.
Learn how to obtain heat flow for different applications under the assumptions of steady
state and one-dimensions
You will be familiar with the concept of thermal resistance, thermal circuits and overall heat
transfer coefficients.
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We will apply the energy conservation equation to the differential control volume
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Energy in = Energy out
q in E gen qout E st
Where:
q in qx q y qz
E g q dV q (dx dy dz )
Where:
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Energy storage term
Represents the rate of change of thermal energy stored in the
matter in the absence of phase change.
T T
Est m c p Vc p
t t
T
Est c p (dx dy dz )
t
T T T • T
k k k q c p
x x y y z z t
At any point in the medium the rate of energy transfer by conduction into a
unit volume plus the volumetric rate of thermal energy generation must equal
the rate of change of thermal energy stored within the volume
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Vector forms
T T T • T
k k k q c p
x x y y z z t
T
k T q c p
t
Where three dimensional del operator in Cartesian coordinates:
x y z
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If k=constant
T T T • T
k k k q c p
x x y y z z t
2T 2T 2T T 2T 2T 2T q 1 T
k 2 2 2 q C p 2 2
x y z t x y z k t
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Where:
k
is the thermal diffusivity
c p
Thermal diffusivity is the ratio of the thermal conductivity to the heat
capacity.
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For steady state conditions
T T T • T
k k k q c p
x x y y z z t
T T T
k k k q 0
x x y y y z
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If 𝒒 = o
T T T • T
k k k q c p
x x y y z z t
T T T T
k k k c p
x x y y y z t
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For steady state conditions, one-dimensional transfer in x-direction
and no energy generation
T T T • T
k k k q c p
x x y y z z t
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T
k T q c p
t
1 T 1 T T T
kr 2 k k q c p
r r r r z z t
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T
k T q c p
t
1 2 T 1 T 1 T T
kr 2 2 k 2 k sin q c p
r r
2
r r sin r sin t
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One-dimensional steady-state models can represent accurately
numerous engineering systems
Steady state heat transfer means that T = T(x)
Boundary conditions are needed at both ends of the range of for
which the problem is defined.
System may or may not have internal heat generator.
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Heat transfer across a rectangular solid is the most direct application of
Fourier’s law.
qx
Solution of the differential equation..
dT
C1 T ( x) C1 x C2 x=0 x=L
dx
x
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Boundary conditions. . .
At X=0 T = T1 T1 = C2
At X=L T = T2 T2 = C1L + T1
C1 = (T2 – T1)/L
T1
T2
Temperature distribution. . .
qx
T1 T2
T ( x) x T1
L
x=0 x=L
x
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From Fourier’s law. . .
dT
q x kA
dx
Substitute by dT T T in Fourier’s law. . .
C1 1 2 T1
dx L
T2
dT T1 T2 T1 T2
qx kA kA kA qx
dx L L
T1 T2
qx x=L
L x=0
kA x
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Radial Systems
Consider a simple case of one-dimensional conduction in a pipe of
finite thickness, with the following assumptions:
No heat sources r1
r2 T
Constant thermal conductivity 2
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Apply the previews assumptions
2T 0 r1
Where 2 for cylindrical coordinates (one dimension) r2 T
2
1 d d
2
r
r dr dr
1 d dT
r 0 T1
r dr dr r1 T2
L
dT dT C1 r2
r C1
dr dr r
T (r ) C1 ln r C2
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Boundary conditions. . .
At r = r1 T = T1 T1 C1 ln r1 C2
At r = r2 T = T2 r1
T2 C1 ln r2 C2 r2 T
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Temperature distribution. . .
T1
r1 T2
L
T1 T2 T1 T2 ln r r2
T (r ) ln r T1
r2 r2 1
ln r ln r
1 1
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From Fourier’s law. . .
r1
dT T T r2 T
qr kA k (2rL) 1 2 2
ln r2 r
dr
r
1
T1 T2
qr T1
r2 r1 T2
ln r2
L
r1
2kL
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By the same method…
T1 T2
qr
1 1
r r T1
r1 T2
1 2 L
4k
r2
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Many simple heat transfer problems can be solved using the “equivalent
thermal circuit” method.
It is possible to compare heat transfer to current flow in electrical circuits.
Where:
The heat transfer rate may be considered as a current flow and the
combination of thermal conductivity, thickness of material, and area as a
resistance to this flow. The temperature difference is the potential or driving
function for the heat flow, resulting in the Fourier equation being written in a
form similar to Ohm’s Law of Electrical Circuit Theory.
Potential Differenc e V
Electric current I
Resistance R
T T
q 1 2
L
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kA
Accordingly, from the previous discussion we can determine the thermal
resistance for three common shapes as follows:
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Slab (Wall): Rth plan
kA
r2
ln
Cylinder: Rth Cylinder r1
2kL
1 1
r1 r2
Sphere: Rth Sphere
4k
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Thermal resistance can also be associated with heat transfer by
convection;
(Ts T ) 1
q hA (Ts T ) Rth c
1 hA
hA
1
R
hrad As
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A surface exposed to the surrounding air involves convection and radiation
simultaneously. In this case the convection and radiation resistances are parallel
to each other.
When the surrounding temperature equals to T∞, the radiation effect can properly
be accounted for by replacing h in the convection resistance relation by:
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q x UAT
T 1
Rtot Rt
q UA
1
U
Rt A
where U is the overall heat transfer coefficient and T the
overall temperature difference.
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