VinMin = 14.

0V Device = LM5007MM/NOPB
VinMax = 75.0V Topology = Buck
Vout = 12.0V Created = 2023-10-04 10:01:30.134
Iout = 0.5A BOM Cost = $3.17
® BOM Count = 19
WEBENCH Design Report Total Pd = 0.89W

Design : 1 LM5007MM/NOPB
LM5007MM/NOPB 14V-75V to 12.00V @ 0.5A

Cb D1
10.0 nF VF@Io= 760.0 m V
1.0 m Ohm VRRM= 100.0 V

Boost
Vin LM 5 0 0 7 SW
Ron L1
1.69 MOhm U1 1.2 m H
63.0 m W 1.07 Ohm
SD/Ron FB
Rcl GND Vcc

Rfbt
1000.0 Ohm
Vin 100.0 m W
Cout
47.0 µF
2.082 m Ohm
Cin Cinx Rilim Cbyp
1.0 µF 220.0 nF 133.0 kOhm 1.0 µF Rfbb Iout
5.334 m Ohm 1.0 m Ohm 50.0 m W 1.0 m Ohm Rseries
261.0 Ohm
63.0 m W 3.57 Ohm
100.0 m W

Electrical BOM
Name Manufacturer Part Number Properties Qty Price Footprint

Cb MuRata GRM155R71H103KA88D Cap= 10.0 nF 1 $0.01

Series= X7R ESR= 1.0 mOhm 0402 3 mm
2

VDC= 50.0 V
IRMS= 0.0 A
Cbyp Taiyo Yuden EMK107B7105KA-T Cap= 1.0 uF 1 $0.01
Series= X7R ESR= 1.0 mOhm 0603 5 mm
2

VDC= 16.0 V
IRMS= 0.0 A
Cin MuRata GRM31CR72A105KA01L Cap= 1.0 uF 1 $0.11
Series= X7R ESR= 5.334 mOhm 1206_190 11 mm
2

VDC= 100.0 V
IRMS= 1.55432 A
Cinx MuRata GRM21AR72A224KAC5L Cap= 220.0 nF 1 $0.08
Series= X7R ESR= 1.0 mOhm 0805 7 mm
2

VDC= 100.0 V
IRMS= 0.0 A
Cout TDK C3216X5R1E476M160AC Cap= 47.0 uF 1 $0.35
Series= X5R ESR= 2.082 mOhm 1206 11 mm
2

VDC= 25.0 V
IRMS= 5.0279 A
D1 ON Semiconductor MBR1H100SFT3G VF@Io= 760.0 mV 1 $0.18
VRRM= 100.0 V SOD-123FL 12 mm
2

L1 Coilcraft MSS1210-125KEB L= 1.2 mH 1 $0.81

1.07 Ohm

2
MSS1210 204 mm
Rfbb Vishay-Dale CRCW0402261RFKED Res= 261.0 Ohm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
Rfbb Vishay-Dale CRCW0402261RFKED Res= 261.0 Ohm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%

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Name Manufacturer Part Number Properties Qty Price Footprint

Rfbb Vishay-Dale CRCW0402261RFKED Res= 261.0 Ohm 1 $0.01

Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
Rfbt Vishay-Dale CRCW06031K00FKEA Res= 1000.0 Ohm 1 $0.01
Series= CRCW..e3 Power= 100.0 mW 0603 5 mm
2

Tolerance= 1.0%
Rfbt Vishay-Dale CRCW06031K00FKEA Res= 1000.0 Ohm 1 $0.01
Series= CRCW..e3 Power= 100.0 mW 0603 5 mm
2

Tolerance= 1.0%
Rfbt Vishay-Dale CRCW06031K00FKEA Res= 1000.0 Ohm 1 $0.01
Series= CRCW..e3 Power= 100.0 mW 0603 5 mm
2

Tolerance= 1.0%
Rilim Yageo RC0201FR-07133KL Res= 133.0 kOhm 1 $0.01
Series= ? Power= 50.0 mW 0201 2 mm
2

Tolerance= 1.0%
Ron Vishay-Dale CRCW04021M69FKED Res= 1.69 MOhm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
Rseries Vishay-Dale CRCW06033R57FKEA Res= 3.57 Ohm 1 $0.01
Series= CRCW..e3 Power= 100.0 mW 0603 5 mm
2

Tolerance= 1.0%
Ruv1 Yageo RC0201FR-0710KL Res= 10.0 kOhm 1 $0.01
Series= ? Power= 50.0 mW 0201 2 mm
2

Tolerance= 1.0%
Ruv2 Yageo RC0201FR-0756K2L Res= 56.2 kOhm 1 $0.01
Series= ? Power= 50.0 mW 0201 2 mm
2

Tolerance= 1.0%
U1 Texas Instruments LM5007MM/NOPB Switcher 1 $1.51
2
MUA08A 24 mm

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Operating Values
# Name Value Category Description
1. Cin IRMS 188.625 mA Capacitor Input capacitor RMS ripple current
2. Cin Pd 189.78 µW Capacitor Input capacitor power dissipation
3. Cout IRMS 52.085 mA Capacitor Output capacitor RMS ripple current
4. Cout Pd 5.648 µW Capacitor Output capacitor power dissipation
5. D1 Pd 194.97 mW Diode Output Diode Power Dissipation
6. IC Ipk 590.213 mA IC Peak switch current in IC
7. IC Pd 357.94 mW IC IC power dissipation
8. IC Tj 101.588 degC IC IC junction temperature
9. IC Tolerance 50.0 mV IC IC Feedback Tolerance
10. ICThetaJA 200.0 degC/W IC IC junction-to-ambient thermal resistance
11. Iin Avg 89.233 mA IC Average input current
12. L Ipp 180.43 mA Inductor Peak-to-peak inductor ripple current
13. L Pd 334.38 mW Inductor Inductor power dissipation
14. M1 Irms 207.273 mA Mosfet Q Iavg
15. M Vds Act 253.49 mV Mosfet Voltage drop across the MosFET
16. Cin Pd 189.78 µW Power Input capacitor power dissipation
17. Cout Pd 5.648 µW Power Output capacitor power dissipation
18. D1 Pd 194.97 mW Power Output Diode Power Dissipation
19. IC Pd 357.94 mW Power IC power dissipation
20. L Pd 334.38 mW Power Inductor power dissipation
21. Total Pd 887.482 mW Power Total Power Dissipation
22. BOM Count 19 System Total Design BOM count
Information
23. Duty Cycle 17.185 % System Duty cycle
Information
24. Efficiency 87.115 % System Steady state efficiency
Information
25. FootPrint 314.0 mm
2
System Total Foot Print Area of BOM components
Information
26. Frequency 50.004 kHz System Switching frequency
Information

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# Name Value Category Description

27. Iout 500.0 mA System Iout operating point
Information
28. Mode CCM System Conduction Mode
Information
29. Pout 6.0 W System Total output power
Information
30. Total BOM $3.17 System Total BOM Cost
Information
31. Vin 75.0 V System Vin operating point
Information
32. Vout 12.0 V System Operational Output Voltage
Information
33. Vout Actual 12.079 V System Vout Actual calculated based on selected voltage divider resistors
Information
34. Vout Tolerance 3.634 % System Vout Tolerance based on IC Tolerance (no load) and voltage divider
Information resistors if applicable
35. Vout p-p 644.498 mV System Peak-to-peak output ripple voltage
Information

Design Inputs
Name Value Description
Iout 500.0 m Maximum Output Current
VinMax 75.0 Maximum input voltage
VinMin 14.0 Minimum input voltage
Vout 12.0 Output Voltage
base_pn LM5007 Base Product Number
source DC Input Source Type
Ta 30.0 Ambient temperature
UserFsw 50.0 k Customer Selected Frequency

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WEBENCH Assembly

Component Testing
Some published data on components in datasheets such as Capacitor ESR and Inductor DC resistance is based on conservative values that
will guarantee that the components always exceed the specification. For design purposes it is usually better to work with typical values. Since
this data is not always available it is a good practice to measure the Capacitance and ESR values of Cin and Cout, and the inductance and DC
resistance of L1 before assembly of the board. Any large discrepancies in values should be electrically simulated in WEBENCH to check for
instabilities and thermally simulated in WebTHERM to make sure critical temperatures are not exceeded.

Soldering Component to Board

If board assembly is done in house it is best to tack down one terminal of a component on the board then solder the other terminal. For surface
mount parts with large tabs, such as the DPAK, the tab on the back of the package should be pre-tinned with solder, then tacked into place
by one of the pins. To solder the tab town to the board place the iron down on the board while resting against the tab, heating both surfaces
simultaneously. Apply light pressure to the top of the plastic case until the solder flows around the part and the part is flush with the PCB. If the
solder is not flowing around the board you may need a higher wattage iron (generally 25W to 30W is enough).

Initial Startup of Circuit

It is best to initially power up the board by setting the input supply voltage to the lowest operating input voltage 14.0V and set the input supply's
current limit to zero. With the input supply off connect up the input supply to Vin and GND. Connect a digital volt meter and a load if needed
to set the minimum Iout of the design from Vout and GND. Turn on the input supply and slowly turn up the current limit on the input supply.
If the voltage starts to rise on the input supply continue increasing the input supply current limit while watching the output voltage. If the
current increases on the input supply, but the voltage remains near zero, then there may be a short or a component misplaced on the board.
Power down the board and visually inspect for solder bridges and recheck the diode and capacitor polarities. Once the power supply circuit is
operational then more extensive testing may include full load testing, transient load and line tests to compare with simulation results.

Load Testing
The setup is the same as the initial startup, except that an additional digital voltmeter is connected between Vin and GND, a load is connected
between Vout and GND and a current meter is connected in series between Vout and the load. The load must be able to handle at least rated
output power + 50% ( 7.5 watts for this design). Ideally the load is supplied in the form of a variable load test unit. It can also be done in the
form of suitably large power resistors. When using an oscilloscope to measure waveforms on the prototype board, the ground leads of the
oscilloscope probes should be as short as possible and the area of the loop formed by the ground lead should be kept to a minimum. This will
help reduce ground lead inductance and eliminate EMI noise that is not actually present in the circuit.

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WEBENCH Electrical Simulation Report
Design Id = 1
sim_id = 1
Simulation Type = Startup

Cb VSwit ch D1
10.0 nF VF@Io= 760.0 m V
1.0 m Ohm ISwit ch VRRM= 100.0 V

IDiode

IIC
Boost
Vin LM 5 0 0 7 SW
VIn Ron L1 VOut
1.69 MOhm U1 1.2 m H
IIn 63.0 m W IInduct or
1.07 Ohm IOut
SD/Ron FB
Rcl GND Vcc ICout

Rfbt ILoad
ICin ICinx 1,000 Ohm
Vin 100.0 m W
Cout
47.0 µF
2.082 m Ohm
Cin Cinx Rilim Cbyp
1.0 µF 220.0 nF 133.0 kOhm 1.0 µF Rfbb
5.334 m Ohm 1.0 m Ohm 50.0 m W 1.0 m Ohm Rseries Rload
261.0 Ohm
63.0 m W 3.57 Ohm
100.0 m W

Simulation Parameters
# Name Parameter Name Description Values

1. Rload R Load Resistance 25 Ohm

Design Assistance
1. For a Constant On Time device to be stable, we need to provide a ripple at the feedback comparator. There are various methods to
implement the ripple. Depending on the circuit complexity vs. the allowable ripple, we have three options to choose from. The simplest option,
'Low Complexity', would require only a high ESR cap at the output. This means that the BOM count will be small, but the output voltage ripple
will be quite large. The 'Optimal Solution' would require a feed-forward cap in parallel with the upper feedback resistor to AC couple the ripple
to the feedback node. This increases the BOM count slightly, but now we have more control over the output voltage ripple. If the output voltage
requirement is very tight, then the best option is to go for the 'Low Output Ripple' solution. In this option we can go with very low ESR output
caps and have very good control over the output voltage ripple.
2. Master key : 30C10BB4617A3086476FBD78D30A1305[v1]
3. LM5007 Product Folder : http://www.ti.com/product/LM5007 : contains the data sheet and other resources.

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WEBENCH Design Report LM5007MM/NOPB : LM5007MM/NOPB 14V-75V to 12.00V @ 0.5A October 4, 2023 10:09:10 GMT-05:00