ZTU-IPEX Module Datasheet

Version: 20220802

Online Version
 Contents

Contents

1 Overview 2
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2 Module interfaces 3
2.1 Dimensions and package . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Electrical parameters 8
3.1 Absolute electrical parameters . . . . . . . . . . . . . . . . . . . . . 8
3.2 Normal working conditions . . . . . . . . . . . . . . . . . . . . . . . 8
3.3 TX and RX power consumption . . . . . . . . . . . . . . . . . . . . . 9
3.4 Operating current . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4 RF parameters 11
4.1 Basic RF features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2 TX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.3 RX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5 Requirements on power-on sequence 13

6 Antenna 15
6.1 Antenna type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2 Antenna interference reduction . . . . . . . . . . . . . . . . . . . . . 15

7 Packaging and production 16

7.1 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.2 Side view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3 Schematic diagram of footprint . . . . . . . . . . . . . . . . . . . . . 19
7.4 Production instructions . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.5 Recommended oven temperature curve . . . . . . . . . . . . . . . . . 22
7.6 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

8 MOQ and packaging information 26

I
 Contents

9 Appendix: Statement 27

II
 Contents

ZTU-IPEX is a Zigbee module that Tuya has developed. It consists of a highly inte-
grated RF processing chip Z2 and a few peripherals. ZTU-IPEX is embedded with
a low-power 32-bit CPU, 1024-KB flash memory, 64-KB RAM, and rich peripheral
resources.

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 1 Overview

1 Overview

Based on the module ZTU-IPEX, you can develop Zigbee products as required.

1.1 Features

• Embedded with a low-power 32-bit CPU processor

• The clock rate: 48 MHz
• Wide operating voltage: 1.8 to 3.6 V
• Peripherals: 9 GPIOs, 1 UART, and 2 ADCs
• Zigbee connectivity

– Support 802.15.4 MAC/PHY

– Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250
Kbps
– Up to +10dBm output power and dynamic output power>35 dB
– Built-in onboard PCB antenna, Ipex connector reserved
– IPEX antenna with a gain of 3.3 dBi
– Operating temperature: -40℃ to 105℃
– Support hardware encryption and AES 128

1.2 Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Intelligent bus

1.3 Change history

Update date Updated content Version after update

3/8/2021 This is the first release. V1.0.0

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 2 Module interfaces

2 Module interfaces

2.1 Dimensions and package

ZTU-IPEX has 3 rows of pins with the spacing of 1.4±0.1 mm.

The ZTU-IPEX dimensions are 20.3±0.35 mm (L)×15.8±0.35 mm (W) ×3±0.15 mm

(H).

The dimensions of ZTU-IPEX are as follows:

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 2 Module interfaces

2.2 Pin definition

Pin number Symbol I/O type Function

1 D3 I/O Common I/O pin,

which corresponds
to D3 (Pin 32) of IC

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 2 Module interfaces

Pin number Symbol I/O type Function

2 D7 I/O Common I/O pin,

which corresponds
to D7 (Pin 2) of IC
3 C0 I/O Common I/O pin,
which corresponds
to C0 (Pin 20) of IC
4 SWS I/O Burning pin, which
corresponds to
SWS (Pin 5) of IC
5 B6 I/O ADC pin, which
corresponds to B6
(Pin 16) of IC
6 A0 I/O Common I/O pin,
which corresponds
to A0 (Pin 3) of IC
7 A1 I/O Common I/O pin,
which corresponds
to A1 (Pin 4) of IC
8 C2 I/O Support hardware
PWM and
correspond to C2
(Pin 22) on the
internal IC
9 C3 I/O Support hardware
PWM and
correspond to C3
(Pin 23) on the
internal IC
10 D2 I/O Support hardware
PWM and
correspond to D2
(Pin 31) on the
internal IC

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 2 Module interfaces

Pin number Symbol I/O type Function

11 B4 I/O Support hardware

PWM and
correspond to B4
(Pin 14) on the
internal IC
12 B5 I/O Support hardware
PWM and
correspond to B5
(Pin 15) on the
internal IC
13 GND P Power supply
reference ground
14 VCC P Power supply pin
(3.3V)
15 B1 I/O Uart_TXD, which
corresponds to B1
(Pin 6) of IC
16 B7 I/O Uart_RXD, which
corresponds to B7
(Pin 17) of IC
17 C4 I/O ADC pin, which
corresponds to C4
(Pin 16) of IC
18 RST I/O Reset pin, active
low
19 C1 I/O Common I/O pin,
which corresponds
to C1 (Pin 21) of IC
20 D4 I/O Common I/O pin,
which corresponds
to D4 (Pin 1) of IC
21 NC I/O No connection

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 2 Module interfaces

Note: P indicates a power supply pin and I/O indicates an input/output pin.

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 3 Electrical parameters

3 Electrical parameters

3.1 Absolute electrical parameters

Minimum Maximum
Parameter Description value value Unit

Ta Operating -40 105 ℃

temperature
VBAT Power supply 1.8 3.6 V
voltage
ESD voltage TAMB-25℃ - 2 KV
(human body
model)
ESD voltage TAMB-25℃ - 0.5 KV
(machine
model)

3.2 Normal working conditions

Minimum Typical Maximum

Parameter Description value value value Unit

Ta Operating -40 - 105 ℃

tempera-
ture
VCC Operating 1.8 3.3 3.6 V
voltage
VIL I/O - - VDD*0.3 V
low-level
input
VIH I/O VDD*0.7 - - V
high-level
input

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 3 Electrical parameters

Minimum Typical Maximum

Parameter Description value value value Unit

VOL I/O - - VDD*0.2 V

low-level
output
VOH I/O VDD*0.8 - - V
high-level
output

3.3 TX and RX power consumption

Peak
Transmit value
Working power/re- Average (Typical
status Mode Rate ceive value value) Unit

Transmit - 250Kbps +0 dBm 4.64 23 mA

Transmit - 250Kbps +10 dBm 8.9 39 mA
Receive - 250Kbps Constantly 6.9 7 mA
receive

3.4 Operating current

Working Maximum
status, Ta = value (Typical
Working mode 25°C Average value value) Unit

Quick network The module is 9.5 13.5 mA

connection in the fast
state network
connection
state

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 3 Electrical parameters

Working Maximum
status, Ta = value (Typical
Working mode 25°C Average value value) Unit

Network The module is 8.9 10.5 mA

connection connected to
state the network
Deep sleep Deep sleep 2.8 - uA
mode mode, reserve
32KB SRAM

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 4 RF parameters

4 RF parameters

4.1 Basic RF features

Parameter Description

Working frequency 2.405 to 2.480 GHz

Zigbee standard IEEE 802.15.4
Data transmission rate 250 Kbps
Antenna type IPEX antenna with a gain of 3.3 dBi

4.2 TX performance

TX performance

Minimum Maximum
Parameter value Typical value value Unit

Maximum - 10 - dBm
output power
(250 Kbps)
Minimum - -25 - dBm
output power
(250 Kbps)
Output power - 0.5 1 dBm
adjustment
stepping
Output - -31 - dBc
spectrum
adjacent
channel
suppression
Frequency -10 - 10 ppm
error

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 4 RF parameters

4.3 RX performance

RX sensitivity:

Minimum Maximum
Parameter value Typical value value Unit

PER<8%, RX -102 -101 -99 dBm

sensitivity
(250 Kbps)

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 5 Requirements on power-on sequence

5 Requirements on power-on sequence

The Z2 chip has requirements on the power-on sequence. During the power-on
process, the system starts when the RST pin reaches 1.62V. At this time, the VCC
needs to reach more than 1.8V within 10ms. Because the RST pin has the RC link,
the VCC of the bare module is much more than 1.8V when the RST reaches 1.62V.
In some cases that the large capacitance in the power driver connected to the Z2
chip module charges or discharges, if the module voltage is not fully discharged

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 5 Requirements on power-on sequence

below 0.6V, the module will probably crash when it is restarted. It is required that
the power supply pin VCC_3.3V of the module needs to be connected with a dummy
load of 1K to release power quickly. You can refer to the following figure which shows
parts of power-driven links.

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 6 Antenna

6 Antenna

6.1 Antenna type

ZTU-IPEX uses only an IPEX antenna.

6.2 Antenna interference reduction

To ensure the optimal Zigbee performance when the Zigbee module uses an on-
board PCB antenna, it is recommended that the antenna be at least 15 mm away
from other metal parts. To prevent an adverse impact on the antenna radiation
performance, avoid copper or traces along the antenna area on the PCB.

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 7 Packaging and production

7 Packaging and production

7.1 Mechanical dimensions

The PCB dimensions are 20.3±0.35 mm (L)×15.8±0.35 mm (W) ×1.0±0.1 mm (H).

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 7 Packaging and production

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 7 Packaging and production

7.2 Side view

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 7 Packaging and production

7.3 Schematic diagram of footprint

Diagram of PCB footprint-SMT:

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 7 Packaging and production

7.4 Production instructions

1. For the modules that can be packaged with the SMT or in an in-line way, you can
select either of them according to the PCB design solutions of customers. If a
PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB
is designed to be in-line-packaged, package the module in an in-line way. After
being unpacked, the module must be soldered within 24 hours. Otherwise, it

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 7 Packaging and production

needs to be put into the drying cupboard where the relative humidity is not
greater than 10%; or it needs to be packaged again under vacuum and the
exposure time needs to be recorded (the total exposure time cannot exceed
168 hours).

• (SMT process) SMT devices:

– Mounter
– SPI
– Reflow soldering machine
– Thermal profiler
– Automated optical inspection (AOI) equipment
• (Wave soldering process) Wave soldering devices
– Wave soldering equipment
– Wave soldering fixture
– Constant-temperature soldering iron
– Tin bar, tin wire, and flux
– Thermal profiler
• Baking devices:
– Cabinet oven
– Anti-electrostatic and heat-resistant trays
– Anti-electrostatic and heat-resistant gloves

2. Storage conditions for a delivered module:

• The moisture-proof bag must be placed in an environment where the tem-

perature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.
• There is a humidity indicator card (HIC) in the packaging bag.

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2 53901. cos.ap - shanghai . myqcloud .com/goat /20210410/2 c61fd34d2a6464d8cb
3 ee05f63689786 .png)

3. The module needs to be baked in the following cases:

• The packaging bag is damaged before unpacking.

• There is no humidity indicator card (HIC) in the packaging bag.
• After unpacking, circles of 10% and above on the HIC become pink.

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 7 Packaging and production

• The total exposure time has lasted for over 168 hours since unpacking.
• More than 12 months have passed since the sealing of the bag.

4. Baking settings:

• Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5%
RH for tray package (please use the heat-resistant tray rather than plastic
container)
• Time: 168 hours for reel package and 12 hours for tray package
• Alarm temperature: 50°C for reel package and 135°C for tray package
• Production-ready temperature after natural cooling: < 36°C
• Re-baking situation: If a module remains unused for over 168 hours after
being baked, it needs to be baked again.
• If a batch of modules is not baked within 168 hours, do not use the wave
soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond
the allowable time. In this case, if they are soldered at high temperatures,
it may result in device failure or poor soldering.

5. In the whole production process, take electrostatic discharge (ESD) protective

measures.

6. To guarantee the passing rate, it is recommended that you use the SPI and AOI
to monitor the quality of solder paste printing and mounting.

7.5 Recommended oven temperature curve

Select a proper soldering manner according to the process. For the SMT process,
please refer to the recommended oven temperature curve of reflow soldering. For
the wave soldering process, please refer to the recommended oven temperature
curve of wave soldering. There are some differences between the set temperatures
and the actual temperatures. All the temperatures shown in this module datasheet
are obtained through actual measurements.

Manner 1: SMT process (Recommended oven temperature curve of reflow

soldering)

Set oven temperatures according to the following curve.

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 7 Packaging and production

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant tem-

perature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

Note: The above curve is just an example of the solder paste SAC305.
For more details about other solder pastes, please refer to Recommended
oven temperature curve in the solder paste specifications.

Manner 2: Wave soldering process (Oven temperature curve of wave sol-

dering)

Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260°C±5°C.

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 7 Packaging and production

Suggestions on
oven temperature Suggestions on
curve of wave manual soldering
soldering temperature

Preheat 80 to 130 °C Soldering 360±20°C

temperature temperature
Preheat time 75 to 100s Soldering time ＜ 3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin 260±5°C NA NA
cylinder
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

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 7 Packaging and production

7.6 Storage conditions

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 8 MOQ and packaging information

8 MOQ and packaging information

Shipping The number of The number of

packaging modules per reels per
Product model MOQ (pcs) method reel carton

ZTU-IPEX 4400 Tape reel 1100 4

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 9 Appendix: Statement

9 Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class
B digital device, according to part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if
not installed and used following the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which
can be determined by turning the device off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled
rolled environment. This device should be installed and operated with a minimum
distance of 20cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operating simultaneously
with other radios in the host system except following FCC multi-transmitter product
procedures. Additional testing and device authorization may be required to operate
simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are
country-dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user.

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 9 Appendix: Statement

The host product manufacturer is responsible for compliance with any other FCC
rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing
with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as

shown in this manual, including “This product must be installed and operated with
a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-ZTU-IPEX. The end product must be labelled
in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-
ZTU-IPEX”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna
and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product
for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module
product complies with essential requirements and other relevant provisions of Direc-
tive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found
at https://www.tuya.com.

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 9 Appendix: Statement

This product must not be disposed of as normal household waste, in accordance with
the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU).
Instead, it should be disposed of by returning it to the point of sale, or to a municipal
recycling collection point.

The device could be used with a separation distance of 20cm to the human body.

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