HMC 960
HMC 960
HMC 960
1212
HMC960LP4E
DC - 100 MHz DUAL Digital
Variable Gain AmplifieR with Driver
Analog Performance
Gain Range 0 40 dB
Signal Bandwidth
0.5 dB bandwidth over all gain settings 50 90 MHz
3 dB bandwidth 100 180 MHz
Analog I/O
Logic Levels
Supply Related
Digital I/O
IF/BASEBAND PROCESSING - SMT
[1] Sideband Rejection is only measured in dB, but relates to phase/magnitude channel imbalance as follows, for a mismatch of 1 degree phase and
0.1 dB magnitude:
SBR = -10Log[(1+A^2-2Acosx)/(1+A^2+2Acosx)]
where A = 10^(0.1/20) (linear magnitude) and x = 1*pi/180 (radians)
[2] Output common mode voltage range is specified for worst case temperature, supply voltage, and bias settings with 2 Vppd signal amplitude. For
5 V supply and recommended biasing (op-amp bias =1 and driver bias=2), over 3.5 V is typical. See “Output IP3 vs. Common Mode Voltage vs.
Driver Bias Setting[1]” in Figure 12
[3] Recommend bias setting (op-amp bias =1 and driver bias=2)
[4] Standard deviation = 15 mV
35
30 0.05
MEASURED GAIN (dB)
20 0
15
10 -0.05
27 C
85 C ABSOLUTE GAIN
5 -40 C RELATIVE GAIN
0 -0.1
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
PROGRAMMED GAIN (dB) PROGRAMMED GAIN (dB)
35
30 0.25
MEASURED GAIN (dB)
25
20 0
15
10 27 C -0.25
85 C
-40 C
5 ABSOLUTE GAIN
RELATIVE GAIN
0 -0.5
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
PROGRAMMED GAIN (dB) PROGRAMMED GAIN (dB)
Figure 5. Frequency Response vs. Gain [1] Figure 6. Channel Isolation vs. Gain [2]
50 -20
40dB GAIN
40 -30 0dB
10dB
20dB
30dB
30 -40 40dB
ISOLATION (dBfs)
20 -50
GAIN (dB)
10 -60
0 dB Gain
0 -70
0dB GAIN
-10 -80
-20 -90
40 dB Gain
-30 -100
0.1 1 10 100 1000 0.1 1 10 100 1000
FREQUENCY (MHz) FREQUENCY (MHz)
0 dB
100 10 dB
20 dB
-100 30 dB
40 dB
90
IM2 (dBc)
OIP2 (dBm)
-105 0 dB
10 dB
20 dB 80
30 dB
40 dB
-110
70
-115 60
10 20 30 40 50 60 70 80 10 20 30 40 50 60 70 80
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 9. IM3 vs. Frequency and Gain, Figure 10. IM3 vs. Frequency & Gain,
Standard Bias Setting [5][7] High Linearity Bias Setting [6][7]
IF/BASEBAND PROCESSING - SMT
-40 -40
35dB
IM3 (dBc)
35dB
-70 40dB -70 40dB
Gain Settings
30 dB or Greater -80 Gain Settings
-80
30 dB or Greater
-90
-90
-100
-100 10 100
10 100 FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 11. Output IP3 vs. Frequency & Figure 12. Output IP3 vs. Frequency &
Gain, Standard Bias Setting [5] [7] Gain, High Linearity Bias Setting [6] [7]
45 45
40 40
Greater Than 30 dB
Gain Setting
35 Greater Than 30 dB 35
Gain Setting
OIP3 (dBm)
30 30
OIP3 (dBm)
0dB 0dB
5dB 25 5dB
25 10dB 10dB
15dB
15dB 20dB Less Than 30 dB
20dB 20 25dB Gain Setting
20 25dB 30dB
30dB Less Than 30 dB 35dB
35dB 40dB
40dB Gain Setting 15
15
10
10 10 100
10 100 FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 13. Output IP3 vs. Figure 14. Output IP3 vs.
Frequency & Bias, Gain = 10 dB [5][6] [7] [9] Frequency & Bias, Gain = 30 dB [5][6] [7] [9]
45 45
40 40
35 35
OIP3 (dBm)
OIP3 (dBm)
30 30
25 25
10 10
10 100 10 100
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 15. Output IP3 vs. Output Common Figure 16. Output IP3 vs. Output Common
Mode, Standard Bias Setting [3][5] Mode, High Linearity Bias Settings [3][6]
34 34
32 32
OIP3 (dBm)
OIP3 (dBm)
30 30 4.5 V 5.5 V
Vdd = 4.5 4.5 V 5.5 V Vdd = 4.5
Vdd = 4.75 Vdd = 4.75
Vdd = 5 Vdd = 5
28 Vdd = 5.25 28 Vdd = 5.25
Vdd = 5.5 Vdd = 5.5
26 26
0.5 1 1.5 2 2.5 3 3.5 4 0.5 1 1.5 2 2.5 3 3.5 4 4.5
COMMON MODE VOLTAGE (V) COMMON MODE VOLTAGE (V)
10 20dB
25dB
40 dB Gain 8 30dB 0 dB Gain
35dB
6 40dB
refP1dB
4
1
2
2Vppd / 1dBm
0
0dB
5dB -2
10dB
15dB -4
20dB 1Vppd / -5dBm
25dB -6
30dB
0 dB Gain 35dB
40dB -8
0.1 -10
-10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 18 20
0.01 0.1 1 10
INPUT VOLTAGE (Vppd) EXPECTED OUTPUT POWER (dBm)
Figure 19. Output Noise vs. Low Figure 20. Noise Figure vs.
Frequency, 100 Ω Rin [10] Gain & Input Impedance at 1 MHz
1000 25
400 Ohm
20 100 Ohm
40 dB Gain
100
15
10
10
0 dB Gain 5
75 0.4
6 dB gain increase
0.3
70 1 MHz
SIDEBAND REJECTION (dBc)
40 MHz
0.2
65
0.1
OUTPUT (V)
60 0
-0.1
55
-0.2
50
-0.3
45 -0.4
0 5 10 15 20 25 30 35 40 4000 4500 5000 5500 6000
PROGRAMMED GAIN (dB) TIME (nsec)
NOTES:
[1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC
SILICA AND SILICON IMPREGNATED.
[2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
[3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
[4] DIMENSIONS ARE IN INCHES [MILLIMETERS].
[5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
[6] PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL
BE 0.25m MAX.
[7] PACKAGE WARP SHALL NOT EXCEED 0.05mm
[8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO
PCB RF GROUND.
[9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND
PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating [2] Package Marking [1]
H960
HMC960LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1
XXXX
[1] 4-Digit lot number XXXX
[2] Max peak reflow temperature of 260 °C
12, 14, 15 SCLK, SDI, SEN SPI Data clock, data input and enable respectively.
Evaluation PCB
IF/BASEBAND PROCESSING - SMT
The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ohms
impedance while the package ground leads and exposed paddle should be connected directly to the ground plane
similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes.
The evaluation circuit board shown is available from Hittite upon request.
Evaluation Setup
Theory of Operation
The HMC960LP4E consists of the following functional blocks
1. Input Match & Gain Stage
2. Second Gain Stage
3. Output Driver & Gain Stage
4. Bias Circuit
5. Serial Port Interface
6. Parallel Port Interface
Bias Circuit
A band gap reference circuit generates the reference currents used by the different sections. The bias circuit is
enabled or disabled as required with the I or Q channel as appropriate.
5. Host places the 3 chip address bits <110> on the next 3 falling edges of SCK (MSB to LSB). Note the
HMC960LP4E chip address is fixed as “6d” or “110b”.
6. SEN goes from low to high after the 32nd rising edge of SCK. This completes the first portion of the READ
cycle.
7. The host asserts SEN (active low Serial Port Enable) followed by a rising edge SCK.
8. HMC960LP4E places the 24 data bits, 5 address bits, and 3 chip id bits, on the SDO, on each rising edge of
the SCK, commencing with the first rising edge beginning with MSB.
9. The host de-asserts SEN (i.e. sets SEN high) after reading the 32 bits from the SDO output. The 32 bits
consists of 24 data bits, 5 address bits, and the 3 chip id bits. This completes the read cycle.
Note that the data sent to the SPI during this portion of the READ operation is stored in the SPI when
SEN is de-asserted. This can potentially change the state of the HMC960LP4E. If this is undesired it is
recommended that during the second phase of the READ operation that Reg 0h is addressed with either the
same address or the address of another register to be read during the next cycle.
IF/BASEBAND PROCESSING - SMT
[2] SEN must rise after the 32nd falling edge of SCK but before the next rising SCK edge. If SCK is shared amongst several devices this timing must be
respected.
Register Map
Three registers provide all the required functionality via the SPI port.
[2:3] spare 2 0
[23:4] unused 19
[23:8] unused
Table 10. Reg 03h - Gain Control Register WHEN USING decode logic [1][2]
Bit Name Width Default Description
[23:7] unused
gain[8:0] define the VGA I and Q channel gain when Reg 02h[5] = 1 and
Reg 02h[6] = 1 (i.e. SPI gain control and gain decode bypassed)
Generally the first 4 bits control the 1st and 3rd stage while the last 5
bits control the 2nd stage gain.
x001nnnnn - 1st stage set to 0 dB
x010nnnnn - 1st stage set to 10 dB
x100nnnnn - 1st stage set to 20 dB
[8:0] gain[8:0] 9 000000000
0xxxnnnnn - 3rd stage set to 0 dB
1xxxnnnnn - 3rd stage set to 10 dB
[23:9] unused
[1] Reg 03h bit assignment depends on the setting of bits 5 and 6 in Reg 02h. If Reg 02h[5]=0, then all Reg 03h bits are ignored (parallel port selected)
[2] For Reg 02h[5]=1 and Reg 02h[6]=0, gain control is via an SPI register with decode, and Reg 03h[6:0] are used as follows.
[3] Note that the Parallel Port gain logic always uses the gain decode logic, and therefore the bit encoding is the same as Reg 03h - Gain Control
Register WHEN USING decode logic.
[4] For Reg 02h[5]=1 and Reg 02h[6]=1, gain control is via an SPI register without decode, and Reg 03h[6:0] are used as follows.