Stick Diagram

Download as pdf or txt
Download as pdf or txt
You are on page 1of 55

Basics of Stick Diagrams

Stick Diagrams
• VLSI design aims to translate circuit concepts
onto silicon.
• Stick diagrams are a means of capturing
topography and layer information using simple
diagrams.
• Stick diagrams convey layer information
through color codes (or monochrome
encoding).
• Acts as an interface between symbolic circuit
and the actual layout.
Stick Diagrams
• Does show all components/vias.
– Via is used to connect higher level metals from metal connection

• It shows relative placement of components.


• Goes one step closer to the layout
• Helps plan the layout and routing

A stick diagram is a cartoon of a layout.


Stick Diagrams
• Does not show
– Exact placement of components
– Transistor sizes
– Wire lengths, wire widths, tub boundaries
– Any other low level details such as
parasitics
Stick Diagram Colour Code

P diffusion Yellow/Brown
N diffusion Green
Polysilicon Red

Contacts Black

Metal1 Blue

Metal2 Magenta/Purple

Metal3 Cyan/L.Blue
Stick Diagrams – Notations

Metal 1

poly
ndiff

pdiff
Can also draw
in shades of
gray/line style.
Buried Contact

Contact Cut
Component Colour Use

metal 1 Power and signal wires

metal 2 Power wires

polysilicon Signal wires and transistor


gates
n-diffusion Signal wires,source and drain of
transistors

p-diffusion Signal wires,source and drain of


transistors

contact Signal connection

via Connection between metals


NMOS transistor
PMOS transistor
Stick Diagrams – Some Rules
Rule 1:
When two or more ‘sticks’ of the same type cross or touch
each other that represents electrical contact.
Stick Diagrams – Some Rules
Rule 2:
When two or more sticks of different type cross or touch each
other there is no electrical contact.
(If electrical contact is needed we have to show the connection
explicitly)
Stick Diagrams – Some Rules
Rule 3:
When a poly crosses diffusion it represents a transistor.

Note: If a contact is shown then it is not a transistor.


Stick Diagrams – Some Rules
Rule 4:
In CMOS a demarcation line is drawn to avoid touching of p-diff
with n-diff. All PMOS must lie on one side of the line and all
NMOS will have to be on the other side.
INVERTER- STICK DIAGRAM
Step 1

Two horizontal wires are used for connection with VSS and
VDD. This is done in metal2, but metal1can be use instead.
Step 2

Two vertical wires (pdiff and ndiff) are used to represent the
p-transistor (yellow) and n-transistor (green).
Step 3

The gates of the transistors are joined with a


polysilicon wire, and connected to the input.
Step 4

. The drains of two transistor are then connected with


metal1 and joined to the output. There cannot be direct
connection from n-transistor to p-transistors.
Step 5

The sources of the transistors are next connected to


VSS and VDD with metal1. Notice that vias are used, not
contacts
Alternative inverter

metal1 is used instead of metal2 to connect VSS


and VDD supply
NAND Gate
NOR Gate
Examples of Stick Diagrams
VDD
VDD
X

x x x
x X

Gnd Gnd
Examples of Stick Diagrams
Examples of Stick Diagrams
* Note the depletion mode device

Vdd = 5V

Vout
Vin
Examples of Stick Diagrams
Design Rules
• The limitations of the patterning process give rise to a set of mask design
guidelines called design rules
• Design rules are a set of guidelines that specify the minimum dimensions and
spacings allowed in a layout drawing
• Violating a design rule might result in a non-functional circuit or in a highly
reduced yield

The design rules can be expressed as:


»A list of minimum feature sizes and spacings for all the masks required in a
given process
»Based on single parameter λ that characterize the linear feature (e.g. the
minimum grid dimension). λ base rules allow simple scaling
λ based design rules
λ based design rules
λ based design rules
λ based design rules
Contact Cuts
Double Metal MOS Process
Yield
General Observations of design values

1. Every dimensions must be rounded up to whole lambda

2. The goal of any set of design rules should be to optimized yield while keeping
the geometry as small as possible without compromising the reliability of the
finished circuit.

3. The 3λ metal rules

4. Metal to metal separation is too large.

5. Lambda based rules try “to be all things to all people” they do suffer from
least common denominator effects and from the upward rounding of all
process line dimension parameters into integrer values of lambda.
Design Rules Reality
Micron Based Rules

You might also like