EIA/JEDEC

STANDARD

Integrated Circuit Thermal Test

Method Environmental Conditions -
Forced Convection (Moving Air)

JESD51-6

MARCH 1999

ELECTRONIC INDUSTRIES ALLIANCE

JEDEC Solid State Technology Association
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 JEDEC Standard No. 51-6

INTEGRATED CIRCUIT THERMAL TEST METHOD

ENVIRONMENTAL CONDITIONS - FORCED CONVECTION (MOVING AIR)

Contents

Page

1 Scope 1

2 Normative references 1

3 Definitions, symbols, and abbreviations 1

4 Specification of environmental conditions 2

4.1 Wind tunnel specifications 2
4.1.1 Flow uniformity 2
4.1.2 Swirl 2
4.1.3 Turbulence 3
4.1.4 Unsteadiness 3
4.1.5 Chamber size 3
4.1.6 Temperature uniformity 4
4.1.7 Performance verification 4
4.2 Test board 4
4.3 Placement in the test section 4
4.3.1 Orientation 6
4.3.2 Measurement 6
4.3.3 Simultaneous testing 6
4.4 Test fixture support 7
4.5 Environmental conditions and measurements 7
4.5.1 Flow velocity measurement 7
4.5.2 Ambient temperature measurement 7

5 Thermal measurement procedure and methodology 8

5.1 K factor calibration 9
5.2 Test start-up and initial equilibrium verification 9
5.3 Power level selection and applying power 10
5.4 Verification of thermal steady-state and test completion 10
5.5 Verification of absence of interaction between applied power level and temperature- 10
sensitive parameter (optional procedure)

6 Thermal characterization parameters 11

6.1 ΨJT Junction-to-top-center of the package (Optional procedure) 11
6.2 ΨJT Junction-to-board (Optional procedure) 11

7 Test conditions to be reported 12

-i-
JEDEC Standard No. 51-6

INTEGRATED CIRCUIT THERMAL TEST METHOD

ENVIRONMENTAL CONDITIONS - FORCED CONVECTION (MOVING AIR)

Contents (concluded)

Page

Figures

1 Open circuit wind tunnel 2

2 minimum clearance 3
3 Test section 4
4 Horizontal air flow, horizontal board (Package up) 5
5 Horizontal air flow, vertical board orientation 5
6 Vertical air flow, vertical board 6
7 Thermocouple location 11

Tables

1 Recommended power levels 10

2 Thermal measurement test conditions and data parameters 12

-ii-
 JEDEC Standard No. 51-6
Page 1

INTEGRATED CIRCUIT THERMAL TEST METHOD

ENVIRONMENTAL CONDITIONS - FORCED CONVECTION (MOVING AIR)

(From JEDEC Board Ballot JCB-98-103, under the cognizance of the JC-15.1 Committee on Thermal
Characterization.)

1 Scope

This standard specifies the environmental conditions for determining thermal performance of an
integrated circuit device in a forced convection environment when mounted on a standard test board.
The thermal resistance measured using this document is RθJMA or θJMA. This methodology is not
meant to and will not predict the performance of a device in an application-specific environment.

2 Normative references

The following standards contain provisions that, through reference in this text, constitute provisions of
this standard. At the time of publication, the editions indicated were valid. All standards are subject to
revision, and parties to agreements based on this standard are encouraged to investigate the possibility of
applying the most recent editions of the standards indicated below.

JESD51, "Methodology for the Thermal Measurement of Component Packages (Single

Semiconductor Devices)”. This is the overview document for this series of specifications.

JESD51-1, "Integrated Circuit Thermal Measurement Method - Electrical Test Method".

JESD51-2, "Integrated Circuit Thermal Test Method Environmental Conditions - Natural Convection
(Still Air).

JESD51-3, "Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages".

JESD51-4, "Thermal Test Chip Guideline (Wire Bond Type Chip)"

JESD51-7, "High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages"

3 Definitions, symbols, and abbreviations

Refer to the documents JESD51, JESD51-1 and JESD51-2 for a general list of terminology.
JEDEC Standard No. 51-6
Page 2

4 Specification of environmental conditions

4.1 Wind tunnel specifications

A low velocity wind tunnel is shown in figure 1 as an example only. The package and test fixtures are
not shown in this example. In most electronic applications, the wind tunnels are normally used at
velocities less than 10 m/s. The minimum specifications for acceptable wind tunnels are detailed in the
following paragraphs. Normally the manufacturer of the wind tunnel will characterize the wind tunnel to
certify performance to these specifications. The wind tunnel is characterized without the test board and
package.

"Honeycomb"
Flow Straighteners
and Screens

Entrance and Contraction

Settling Zone Section
Transition Air Mover (Fan)
Test Section Section

Figure 1 — Open circuit wind tunnel

This type of tunnel (Eiffel type, fan at downstream end of system) is also commonly called a suction or
indraft style. A radiused inlet prevents separation of the flow from the settling length walls. The flow
management components include a honeycomb, which reduces lateral velocity differences, and screens
which, owing to their higher pressure drop in the flow direction, promote a more uniform axial velocity.
The combined effect of these elements is the reduction of turbulence intensity and production of a flat
velocity profile. A contraction duct is employed to accelerate the flow while maintaining flow quality.
The diffuser/transformation conveys the flow from the test section to the circular fan inlet. Proper
selection of diffuser angles helps to prevent flow separation which would create unsteadiness. A flow-
through tunnel (Wenham type) incorporates similar design features.

4.1.1 Flow uniformity

The flow velocity shall be uniform to +/-5% of the mean velocity across the central 90% of the test
chamber cross-section, and constant within +/-5% along the length of the test section.

4.1.2 Swirl

The cross stream component (swirl) of the mean flow shall be less than 5% of the mean flow velocity.
The cross stream component of the mean flow is measured with a three axis or cross wire anemometer
capable of measuring flow in a minimum of two directions.
 JEDEC Standard No. 51-6
Page 3

4.1 Wind tunnel specifications (cont’d)

4.1.3 Turbulence

The turbulence shall be less than 2%. The turbulence is measured with a hot wire anemometer with a
frequency response of 10 kHz or higher.

4.1.4 Unsteadiness

The unsteadiness (change in mean flow velocity) shall be less than 5% over the time period of a typical
measurement.

4.1.5 Chamber size

The test section shall be large enough that the frontal area of the test sample (package, board, support
fixture, and optional heat sink) shall be less than 5% of the wind tunnel cross sectional area. Adequate
"bypass" of the air is allowed around the test specimen to avoid the channel flow (or “ducted”) regime.
The minimum clearance on each side of the part is specified in figure 2. Wall effects are avoided if the
wind tunnel test section dimension perpendicular to the plane of the test board is at least twice the flow
length along the test board and the test board is mounted in the center of the wind tunnel. These
dimensions are illustrated in figure 3. Minimum distances to the wall in both directions are reported in
table 2. Using this specification, the measured thermal resistance will be largely independent of wind
tunnel cross section dimensions.

Minimum
Clearance = 2H

Minimum
Clearance = 2H

Minimum W Minimum
Clearance = 2W Clearance = 2W

Figure 2 — Minimum clearance

The minimum clearance around a package or around a package and heat sink is twice the width of the
heat sink (or package whichever is larger) or twice the height of the heat sink plus package and board. In
addition, the frontal area of the package, heat sink, test board, and fixture must be less than 5% of the
cross section of the test section of the wind tunnel. The same rules apply for a wind tunnel with round
section as illustrated with the dashed lines.
JEDEC Standard No. 51-6
Page 4

4.1 Wind tunnel specifications (cont’d)

4.1.5 Chamber size (cont’d)

Air
Flow h

L
Figure 3 — Test section

It is recommended that the test section perpendicular distance be twice the flow length of the test board
(h > 2L).

4.1.6 Temperature uniformity

The air temperature in an empty test section shall be uniform to +/- 1 °C.

4.1.7 Performance verification

The performance of the wind tunnel to the above characteristics must be periodically checked. Typical
causes of degradation in performance are sagging screens, dust in screens and honeycomb section, dust
on the contraction duct, and fan damage such as bent blades or wobble in the fan bearings. Careful
inspection of the wind tunnel on a yearly basis will normally be sufficient.

4.2 Test board

The test board specified in JESD51-3, and JESD51-7, which are appropriate for the device being tested,
shall be used. It is essential that any reported data must specify the test board used if the data was not
obtained using the appropriate 1s test board

4.3 Placement in the test section

The device that is mounted on the test board will be placed in the test section of the wind tunnel as
described in figures 4, 5, or 6.
 JEDEC Standard No. 51-6
Page 5

4 Specification of environmental conditions (cont’d)

4.3 Placement in the test section (cont’d)

Thermocouple
Support

Support for
Device under Test x Socket

Test Board
Test Board

Device under Test

Air
x Air
Flow
Flow
Optional
Optional Extra
Extra Support Rod
Support Rod

Side View Top View

Figure 4 — Horizontal air flow, horizontal board (Package up)

Device under Test

Air
Flow

Test Board
x
Support for
Socket

Thermocouple Side View

Support

Figure 5 — Horizontal air flow, vertical board orientation

JEDEC Standard No. 51-6
Page 6

4 Specification of environmental conditions (cont’d)

4.3 Placement in the test section (cont’d)

Side 1 View Side 2 View Device under Test
Test Board
Support for
Socket

x x

Thermocouple
Support

Air Flow Air Flow

Figure 6 — Vertical air flow, vertical board

4.3.1 Orientation

The orientation of the printed circuit board and the flow direction of the wind tunnel must be specified
when test data is reported. The printed circuit board is specified as horizontal or vertical orientation with
the flow of air in the wind tunnel either horizontal or vertically upward. If the printed circuit board is
horizontal, the package being tested shall be on the upward-facing side of the board.

4.3.2 Measurement

The measurement of thermal resistance in a horizontal wind tunnel with a horizontal orientation of the
test board in a mixed convection mode will yield thermal resistance measurements that will approach the
values obtained using reference [3] as the mean flow velocity in the tunnel approaches zero. Testing in
the vertical orientation will yield slightly lower thermal resistance values. Typically, at mean flow
velocities above 2 m/s (about 400 ft/min), there will be no difference between the different orientations
when the devices are at the surface temperatures produced by the power ranges specified in this
document.

4.3.3 Simultaneous testing

Simultaneous testing of more than one single-device board in the wind tunnel is possible if the devices
are arranged such that the resulting thermal resistance measurement is within +/- 3% of the average value
obtained when single devices are tested in the uniform velocity portion of the cross section. This
qualification of the test methodology for a given lab must be done with a statistically significant number
of samples. It should be tested on both the smallest device with highest thermal resistance and the
highest power device with lowest thermal resistance being tested.
 JEDEC Standard No. 51-6
Page 7

4 Specification of environmental conditions (cont’d)

4.4 Test fixture support

The printed circuit board and device being tested must be supported with minimal obstruction to the air
flow. The recommended support should lie in the plane of the board and be no thicker than the socket
and not more than 20 mm longer than the socket. To minimize turbulence, leading and trailing edges of
the support should not have square edges. Because the support structure can act as an airfoil, it must be
aligned with the air flow.

CAUTION — The geometrical angle of attack of the printed circuit board with the air flow may
cause significant differences in the measured thermal resistance. Normally a level is used to align
the test section; then the angle of attack is determined using measurements of the distance from the
leading and trailing edges to the test section wall. The board shall be aligned with the test section
wall within +/- 2 degrees.

Although the board is normally supported only by the edge connector, it may be necessary to provide
additional support such as a rod with diameter less than 3.5 mm to stabilize the end of the board as shown
in figure 4. The rod must be thermally insulated from the board.

4.5 Environmental conditions and measurements

4.5.1 Flow velocity measurement

The mean flow velocity shall be measured upstream from the device being tested with an anemometer (air
velocity transducer). The velocity reported shall be the velocity as if the air were at the standard air
conditions with a density of 1.2 kg/m3. This air density is equivalent to dry air at 101.325 kPa (760 mmHg)
at 21 °C or moist air at 50% humidity at the same pressure and 20 °C. A thermal anemometer that is
temperature compensated and calibrated to give the equivalent mass flow velocity is normally used. If the
air velocity measurement equipment does not automatically correct to those conditions, the appropriate
corrections shall be applied as described in Annex A. Placement of the anemometer shall be such that the
anemometer reads the same as it would in the location where a device is normally tested. The placement of
the anemometer shall be in a location where it does not cause turbulence in the air reaching the device
being tested. The anemometer shall be calibrated with traceability to NIST or other recognized standards
organization at the vendors’ recommended intervals. Calibration at more frequent intervals is required if
dust collects on the sensor or if the sensor drifts out of calibration during the normal calibration interval.
Minimum accuracy of the anemometer shall be +/- 4% of reading and +/- 0.05 m/s.

4.5.2 Ambient temperature measurement

Ambient temperature of the air in the wind tunnel shall be measured with a calibrated thermocouple with
wire diameter no larger than 0.5 mm. Accuracy of the thermocouple and associated measuring system
shall be +/- 1 °C or better. The thermocouple shall be located such that it measures the air temperature
approaching the device. The location shall be 100 mm to 150 mm upstream of the device being tested,
25 mm "below or behind" the plane of a board and the same distance from the test section side wall as
the connector or a minimum of 25 mm from the wall. The suggested location is shown with an "x" on
figures 4 through 6. The thermocouple should be supported from the nearest wall. The thermocouple
and support structure shall be less than 2 mm in diameter.
JEDEC Standard No. 51-6
Page 8

4.5 Environmental conditions and measurements (cont’d)

4.5.2 Ambient temperature measurement (cont’d)

The air temperature shall be between 20 °C and 30 °C. The temperature inside the wind tunnel must not
change more than 2 °C per hour to allow achieving an adequate steady state thermal performance
measurement.

For an open circuit wind tunnel, adequate clearance must exist at the entrance and exit of the tunnel as
specified by the wind tunnel designer for the wind tunnel to meet its specified performance. Traffic or
air conditioning flows in those areas must be restricted to prevent unsteady airflow within the wind
tunnel. The temperature control in the room must be sufficient to achieve the specified temperature
uniformity in the tunnel.

5 Thermal measurement procedure and methodology

This section details the steps necessary to perform a thermal resistance measurement in moving air. The
following equations describe the measured and calculated parameters required for making the
measurement.

The junction-to-moving-air thermal resistance is determined from equation (1):

θJMA = (TJ - TA)/PH (1)

where

θJMA is thermal resistance (°C/W) from junction to ambient as described by this specification

TJ is the junction temperature (°C) when the device has achieved a steady-state after application of
PH and the forced convection condition

TA is the ambient temperature (°C) when steady state occurs

PH is the power dissipation (W) that produced the change in junction temperature

In conjunction with the measured thermal resistance, the moving air environment must be specified in
units of feet per minute or meters per second.
 JEDEC Standard No. 51-6
Page 9

5 Thermal measurement procedure and methodology (cont’d)

As described in JESD51-1, a temperature-sensitive parameter (TSP) is used to sense the change in

temperature of the junction operating area due to the application of electrical power to the device. In
equation terms,

∆TJ = (∆TSP x K) (2)

where

∆TSP = change in the TSP caused by the application of PH

K factor is the quotient of the junction temperature change to the temperature sensitive parameter
change in the linear region of the temperature-sensitive parameter temperature relationship, typically
specified in units of °C/mV; usually applicable to semiconductor devices using a forward bias
temperature sensitive parameter.

The junction to moving air ambient thermal resistance can then be determined by equation (3):

θJMA = ((TA0 + ∆TSP x K) - TASS)/PH (3)

where

TA0 is the initial ambient air temperature (°C) before heating power is applied

TASS is final ambient air temperature (°C) when steady state has been reached.

The junction temperature can also be calculated directly from a calibration curve (reference 2).

5.1 K factor calibration

Prior to making actual thermal measurements, the junction or other temperature-sensitive parameters
must be empirically calibrated using the procedure in JESD51-1, subclause 3.3, K factor calibration.

5.2 Test start-up and initial equilibrium verification

Place the device to be tested in the wind tunnel and apply measurement current to the temperature-
sensitive device. Prior to recording the initial conditions at the beginning of the thermal test, verify that
the device has reached a state of equilibrium with the ambient temperature.

To verify that stabilization has occurred, wait an initial 5 minutes minimum, then record the TSP, wait an
additional 5 minutes and record a second TSP. If change in junction temperature as determined by the
TSP measurement is less than or equal to a 0.2 °C, then equilibrium has been achieved. If equilibrium
has not occurred, then continue for additional 5 minute intervals. The recommended practice is for the
equilibrium to be established with an air speed of 1 to 2 m/s.

After equilibrium has been reached, record the values for TSP and the initial ambient temperature TA0.
JEDEC Standard No. 51-6
Page 10

5 Thermal measurement procedure and methodology (cont’d)

5.3 Power level selection and applying power

The power levels at which devices are tested should be governed by actual use conditions. The minimum
recommended junction temperature rise during testing is 20 °C. For low air speeds below 1 m/s
(200 ft/min), the guidelines in table 1 are recommended.

Table 1 — Recommended power levels

Power θJMA Range
0.5 watt θJMA > 100 °C/watt
0.75 watt 60 < θJMA <100 °C/watt
1 watt 30 < θJMA < 60 °C/watt
2 watts 20 < θJMA < 30 °C/watt
3 watts 15 < θJMA < 20 °C/watt

After selecting the appropriate power level, apply the heating voltage (VH) and the heating current (IH)
to the device.

5.4 Verification of thermal steady-state and test completion

For a test measurement to be completed, verification that thermal steady state has been reached shall be
done using the method documented in JESD51-1, subclause 3.6, Thermal steady-state determination.

After a steady-state has been reached, record the values for the TSP, the heater voltage (VH), the heater
current (IH), the time required to reach steady state (tHss), the final ambient temperature at the end of the
test (TASS), and the air speed measured with the anemometer.

If tests at additional air speeds are desired, the air speed can be set to the new value. After steady state
has occurred, the values are determined as described above.

5.5 Verification of absence of interaction between applied power level and temperature-sensitive
parameter (optional procedure)

Once moving air velocity is in excess of approximately 2 m/s, the relationship between applied power
dissipation and junction temperature generally becomes very linear over typical temperature ranges
encountered in integrated circuit packages using thermal test die. That is, if the power is doubled, the
temperature rise of the junction above ambient will double. However, there are also occasions when an
undesired and generally difficult-to-detect electrical interaction exists between the applied power level and
the temperature sensitive parameter in the die or the effective heat generation area of the die. Also, the
conductivity of silicon decreases more than 30% from 25 °C to 125 °C.

Therefore, at the conclusion of a device test at a moving air velocity greater than or equal to 2 m/s, if the
power level was chosen based on the criteria established in section 5.3, table 1, a "verification" test may then
be performed at 1.5 times that power level (and at the same wind speed). If the resulting value in θJMA
differs by less than 2%, one may conclude that there is no significant electrical interaction between applied
power and the TSP. At higher wind speeds, the test reaches thermal equilibrium quicker; therefore it is most
expeditious to perform this verification test at the highest wind speed used during a particular test series.
 JEDEC Standard No. 51-6
Page 11

6 Thermal characterization parameters

6.1 Ψ JT Junction-to-top-center of the package (Optional procedure)

The junction-to-top-center thermal characterization parameter, ΨJT, is proportional to the temperature

difference between the top center of the package and the junction temperature. Hence, it is a useful value
for an engineer verifying device temperatures in an actual environment. By measuring the temperature of
the top center of the device, the junction temperature can be estimated if the thermal characterization
parameter has been measured under similar conditions. The methodology of attaching the thermocouple
on the top of the package to obtain the temperature of the top of the package (TT0 and TTss) has been
described in JESD51-2 together with the definition of ΨTA, the package-top-surface-to-air thermal
characterization parameter. The thermocouple wire should be routed next to the package body to the
printed circuit board in the downstream direction. The thermal characterization parameter depends on
the mean flow velocity; hence, the mean flow velocity must be reported along with the measured value
for ΨJT.

6.2 Ψ JB Junction-to-board (Optional procedure)

The junction-to-board thermal characterization parameter, ΨJB, is a useful indicator of the thermal
resistance between the junction and the thermal test board. The board temperature is measured with a 40
gauge thermocouple soldered to the thermal test board trace at the edge of the package footprint at the
center of one side of the package as shown in figure 7. A small amount of thermally conductive epoxy is
placed over the thermocouple joint and about 1 mm of thermocouple wire leading to the joint. By
thermally coupling the wire to the thermocouple joint, errors caused by temperature gradients in the
vicinity of the joint are minimized. The thermocouple wire should be thermally grounded to the test
board with either tape or epoxy and must lie flat on the board to minimize airflow disturbance. For
square packages, the board temperature thermocouple should be placed halfway along the package edge
on either the connector side of the package or the opposite side. For rectangular packages the
thermocouples would be located along each of the longer sides; upwind and downwind thermocouple
measurements should be averaged.

Device Under Test

Air
Flow

Board Thermocouple

Figure 7 — Thermocouple location

The board thermocouple should be soldered to thermal test board trace as close to the package as
possible. Thermocouple wire must lie flat on the board to minimize air flow disturbance.
JEDEC Standard No. 51-6
Page 12

6 Thermal characterization parameters (cont’d)

6.2 Ψ JB Junction-to-board (Optional procedure) (cont’d)

The junction-to-board thermal characterization parameter, ΨJB, is calculated using the following
equation

ΨJB = (TJss - TBss)/PH (4)

where

TJss is the junction temperature at steady state condition

TBss is the board temperature at steady state condition.

Normally the junction-to-board thermal characterization parameter is measured only on the 2s2p test
boards because the 2s2p test boards provide a more uniform temperature in the vicinity of the package.

7 Test conditions to be reported

The values listed in table 2, which are needed to describe this test and the results, must be reported.

Table 2 — Thermal measurement test conditions and data parameters.

Condition Parameters Data Parameters and Results
Device Identification Device Identification Date
Environmental Test Board Specification
Wind Tunnel Type
Wind Tunnel Test Section
Dimensions, length
Flow Orientation
Test Board Orientation
Minimum distances to wall
Wind Tunnel Length
Tunnel Contraction Ratio
Optional Barometric Pressure
For Each Mean Flow Velocity TA0 (°C) (m/s or ft/min)
Environmental TASS (°C)
Electrical VH (V) ∆Vf (V)
IH (mA) ∆TJ (°C)
tHss (s) TJss
Im (mA) PH (W)
K (°C/mV) θJMA (°C/W)
Package Case Measurement TT0 (°C) ΨJT (°C/W)
(Optional) TTss (°C)
Board Measurement TBss (°C) ΨJB (°C/W)
(Optional)
 JEDEC Standard No. 51-6
Page 13

Bibliography

[1] SEMI Test Method #G38-0996, Still and Forced Air Junction-to-Ambient Resistance
Measurements of Integrated Circuit Packages

[2] SEMI Test Method #42-0996, Thermal Test Board Standardization for Measuring Junction-to-
Ambient Thermal Resistance of Semiconductor Packages
JEDEC Standard No. 51-6
Page 14

Annex A — Air velocity corrections

It is normal industry practice to calibrate industrial thermal anemometers to indicate the velocity as if the
air being measured were at standard air conditions (density of 1.2 kg/m3). The velocity readings must be
corrected to standard air conditions if the anemometer has been calibrated to read actual velocity by
calibrating with a moving structure or by using a Laser Doppler Velocimeter or a similar instrument
which measures actual velocity of particles in the air. For typical values of humidity, the following
equation can be used to make the correction:

 294   Pbarometric 
Vstd = Vact    (5)
 273 + Ta   760 

where

Vstd is the air velocity at standard air conditions

Vact is the actual air velocity as if measured with tracer particles in the air

Ta is the ambient temperature (°C)

Pbarometric is the atmospheric pressure (mmHg) in the room where the wind tunnel is located.

NOTE — Standard air conditions are not the same as standard atmosphere conditions.