PUBLISHEDJOURNALFINAL
PUBLISHEDJOURNALFINAL
PUBLISHEDJOURNALFINAL
net/publication/325496131
CITATIONS READS
2 1,080
3 authors:
Sunil Thomas
BITS Pilani, Dubai
25 PUBLICATIONS 133 CITATIONS
SEE PROFILE
Some of the authors of this publication are also working on these related projects:
Sensitivity analysis and Robustness Analysis of a current source inverter fed Synchronous Motor Drive System View project
All content following this page was uploaded by Shubhankan Mukherjee on 09 June 2018.
Abstract
This paper elucidates the application of electrostatic field theory to analyze partial discharge due to the void formation inside the insulat-
ing material. Formation of voids leads to accumulation of static charges leading to capacitance build-up. The most probable cause of
insulation failure is due to the subjection of high voltage. Prolonged high voltage poses a threat and leads to insulation failure. Failures
occur in the tip gap between the conductor and insulating material’s inner periphery. Probable causes of such failures are corona dis-
charge, surface discharge and treeing, leading to formation of Lichtenberger figures in the material and cavity discharge. This paper pre-
sents a way of fabricating the inner lining of the insulator with a semiconductor layer obeying avalanche breakdown at breakdown volt-
age or voltages at which partial discharge is likely to occur. With the onset of high voltage which can cause a discharge, the semiconduc-
tor experiences avalanche breakdown giving out a single photon ejection by Geiger mode (principle). A superior prevention method of
using Teflon for insulation instead of XLPE/PILC has been suggested and simulated using COMSOL. Detection using Avalanche photo-
detector(LiDAR) may enable us to track the probable location of the occurrence of partial discharge and isolate the system.
photodiode to detect partial discharge was taken into account to of the surface area, da = elemental surface area and the symbol for
predict dielectric breakdown[17]. integration stands for closed surface integral
Now, we focus on important parameters responsible for partial
2. Electrostatic field theory approach discharge. The parameters in our purview here is charge and die-
lectric strength of the insulation (material).
Partial discharge is related to the discharge of excess charge lead-
In this segment of analysis, we have used Maxwell’s equation to ing to breakdown. So excessive charge builds up in the void leads
define the degradation of insulators in the proximity of high volt- to a formation of pseudo capacitance.
age in devices such as current transformers windings, high voltage
cable insulators and rotor windings.
At this juncture of our approach we first use the concept of void 3. Lumped capacitance model for void for-
formation in materials. This can happen due to the following rea- mation and partial discharge
sons:
1) Fabrication error We used the lumped capacitance or ‘ABC model’ to model the
2) Continuous bombardment by electrons leading to wall en- formation of capacitance in voids due to material non linearities.
largement and release of byproducts such as ozone and acid-
ic compounds leading to degradation.
Void formation is, basically, due to partial discharge occurring in
the high tension and high voltage cables. Void in non-viscous and
solvent-less resin insulation is filled with gas or air having lower
dielectric strength and permittivity in comparison to the surround-
ing insulating material.
Moreover, electrical stresses which is, basically, due to the high
voltage and inrush current (at startup of motors). The electrical
stress is electric field and is formulated below:
U
E=
x
qa = Cb ∆Vc
E = Electric field (V/m) , q= charge enclosed (coulomb), ε0 =
permittivity in vacuum, n= unit vector perpendicular to the plane Where,
∆Vc = is the voltage drop across the void (in volts)
844 International Journal of Engineering & Technology
Now, we consider the line charge density on a single plate and We also know that the external charge is the time integral of the
volume charge density for the void considering it to be spherical current flowing through the capacitances Cb and Cc, so we arrive
in nature. at the final equation,
Linear charge density,
Cb
Volume charge density, qa = qc
Cb + Cc
The charges confined in the void is directly linked to the origin of
electric flux, and the free charges lead to development of electric
But measurement of discharge current is not feasible and a more
flux density (D).
accurate way to measure is the dipole moment due to the dielectric
polarization in the voids as due to partial discharge there is for-
mation of secondary elements like ozone and acidic compounds
having greater relative permittivity and thereby leading to increase
in capacitance. Fig 4 can be modified as shown in Fig 6, showing
As E = - V, it yields that, indication of current distribution.
ID = Ich = 2πfCU
Where
f= Supply frequency (Hertz), C = capacitance of the void (Farads),
Fig. 4: Experimental Setup with Spark Gap F. U= supply voltage (volts)
For a coaxial cable the capacitance can be written as follows,
Where EB is the dielectric strength, ‘T’ the film thickness, and k is With the prevalent stage of technology, we can detect in-situ Ava-
the fitting parameter. It is to be noted that the k factor can be var- lanche breakdown. We can measure the single photon electromag-
ied in accordance with the cable configuration, internal micro- netic wave using Geiger counter to trace any unwanted partial
scopic structure and charge transfer rate within the insulating Tef- discharge and isolate the material before any degradation or faults
lon material. As indicated by the relationship, the dielectric [Fig.8].
strength is inversely proportional to the thickness and dielectric
strength decreases with increasing thickness.
Another factor which adds onto external stress on insulating mate-
rial, subjected to high voltage, in regard of the charge distribution,
is thermal energy. As the temperature rises due to the heating ef-
fect of current, the electrons accelerate further leading to lowering
of the insulating material’s dielectric strength. At very low tem-
perature, all charged particles are trapped and are closely held
together. As the temperature rises, the trapped electrons will get
delocalized more easily, and less electric field is needed.
Moreover, with the increase of temperature the overall volume
increases, and the dielectric strength decreases with the decrease
of the material density, Thus, it is expected that EB decreases with
increasing temperature. This proves that the dielectric strength Fig. 8: A) Experimental Setup for Photon Detection.
decreases as the temperature increases and with the increasing
material volume due to thermal effect. © Christian Kurtsiefer, Patrick Zarda, Sonja Mayer, and Harald
According to the formula of capacitance, out of the three parame- Weinfurter [18]
ters, we have one last parameter to overcome the issue of Partial
Discharge is by using an insulation with lower dielectric constant.
Q Q A∈
C= = =
V Ed d
6. Result and conclusion found to be in the range of 6.43x106 to -6.44x106 as shown in fig-
ure 10.
In this paper we were able to map the relation between partial
discharge and the theoretical aspects of electrostatic field and find
out the root cause of partial discharge due to the formation of ca-
pacitance in the void due to excess apparent charge which occurs
due to high voltage originating from electric field due to charge
localization.
On having found out the basic analogy which causes material
degradation, we were able to adopt a better insulating material
such as Teflon having higher discharge strength and lower relative
permittivity. Apart from that, this paper devises an innovative
technology of using Silicon Carbide avalanche diode to be layered
between the Teflon and oil impregnated paper to make Partial
Discharge and void formation trackable and prevent any early
onset of fault.
By using COMSOL simulations, following conclusions are drawn. Fig 10: Polarisation Due to Electric Field.
COMSOL simulations for the above-said analysis was performed
with the following data. iv) On account of electric field arising due to static charges, in
The simulations were synthesised at a voltage of 33kV (Medium a high voltage cable, most of the static charges originates on
voltage) volts with electric displacement field of 30 C/m2, short the tip gap between the current carrying conductor and the
circuit current of 330 A/m and surface charge density of 300 C/m2. insulating material. So, the maximum electric field (normal)
Single core conductor radius was 50 milli-meter and other layers to the surface is found near the tip gap is 1.18x108 V/m and
were placed at a gradation of 25 milli-meters apart from the con- the minimal value is found to be 3.94x10-9 V/m as shown
ductor. The following plots were obtained. in figure 11.
i) Electric Field due to electrostatic charges located in the
conductor. In the simulation, electric field is particularly
visible in dielectric materials like paper and Teflon. Maxi-
mum field strength is concentrated on the inner core of the
conductor as per the simulations due by direct application of
Gauss’ Law in Electrostatics.
Q dV
E=K And E =
r2 dr
B = μH