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Test and Design Reuse

1) Design reuse through IP cores is essential for efficient SoC design but poses test challenges. 2) Two key technologies help enable SoC test while leveraging hierarchy: wrappers isolate cores during test, and Core Test Language communicates core test information. 3) Hierarchical test flows have emerged, inserting scan chains per core allows isolating test failures to specific blocks for easier debugging compared to flat insertion.

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Diptanshu Bagchi
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0% found this document useful (0 votes)
36 views3 pages

Test and Design Reuse

1) Design reuse through IP cores is essential for efficient SoC design but poses test challenges. 2) Two key technologies help enable SoC test while leveraging hierarchy: wrappers isolate cores during test, and Core Test Language communicates core test information. 3) Hierarchical test flows have emerged, inserting scan chains per core allows isolating test failures to specific blocks for easier debugging compared to flat insertion.

Uploaded by

Diptanshu Bagchi
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Test and Design Reuse


A design approach based on reuse of intellectual property may be essential for efficient
design creation and verification, but what is the impact for test? Teresa McLaurin,
Design Center Consultant, ARM, and Rohit Kapur, Synopsys Scientist, explain the
techniques necessary to get the best out of test in an SoC design methodology.
SEARCH SILICON IP
Design reuse is a natural consequence of the magnitude of the design effort involved in
16,000 IP Cores from 450 Vendors
creating and verifying huge chips in deep submicron (DSM) technologies. This approach
has become the basis for System-on-Chip (SoC) design, in which various intellectual Enter Keywords....
property (IP) components are created and reused to produce even larger, more complex
chips. This necessitates the emergence of advanced design flows and methods for
handling IP protection, as well as hierarchy and SoC test.

As more IP is utilized in SoC designs, a key design issue is how the design can be
tested efficiently while taking advantage of the hierarchy imposed by design reuse.
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To enable SoC test, two technologies have been developed:
• Wrapper technology, in which a wrapper isolates the core from the embedded SoCs: IP Reuse -> BIST takes the test beast out
environment during test, such that the core can be tested independently from the of reuse
logic in which it is embedded.
SoC: Codesign and Test -> Verification ensures
• Core Test Language (CTL) which communicates test information for the core and reuse really used
allows for the successful creation of a complete SoC test set.
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As the industry matures in the use of these technologies, hierarchical SoC test flows
have begun to emerge, and the benefits of having an SoC test methodology are being System on Modules (SOM) and its end-to-end
verification using Test Automation framework
recognized.

Isolating IP for Test


SoCs will invariably incorporate IP from more than one company, and the benefit of
testing the SoC hierarchically — offering the capability to isolate each section of a
design for debug — is proving highly advantageous. By isolating the IP test, each test NEW ARTICLES
issue also becomes isolated to a specific block of the design.
SoC design: When is a network-on-chip (NoC)
not enough?
Scan insertion completed on a flat — not per-core — basis, makes the SoC design
difficult to debug. If a test failure occurs, there is no way to figure out which portion of Integrating VESA DSC and MIPI DSI in a
System-on-Chip (SoC): Addressing Design
the design is failing without deeper diagnostics – it is usually difficult to tell by the pattern Challenges and Leveraging Arasan IP Portfolio
name that failed.
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Figure 1 illustrates how scan chains may be inserted in an SoC that is tested flat. The High-Speed PCIe and SSD Development and
scan chains connect to multiple cores, or to a core plus its user-defined logic (UDL). The Challenges
patterns created will test the entire design, but if a scan chain failure occurs, it is not How AI (Artificial Intelligence) Is Transforming
obvious which block of logic caused that failure. the Aerospace Industry

Test Figure 1
See New Articles >>
Figure 1: SoC Scan Inserted Flat

Figure 2 shows another way of inserting scan chains in an SoC to allow for isolation of
test. In this example, there are separate scan chains for each core. These scan chains
are connected to the top-level ports. This allows a pattern set to test a specific portion of MOST POPULAR
the SoC. If that pattern set fails, it is obvious which block of the design caused the
1. System Verilog Macro: A Powerful Feature
failure, making it easier to track yield issues during manufacturing test. This approach for Design Verification Projects
offers additional test time and cost reduction advantages, due to the use of the much 2. System Verilog Assertions Simplified
shorter scan chains resulting in a requirement for fewer test vectors. 3. SoC design: When is a network-on-chip
(NoC) not enough?
Test Figure 2 4. Dynamic Memory Allocation and
Fragmentation in C and C++
Figure 2: SoC Scan Inserted Hierarchically 5. Design Rule Checks (DRC) - A Practical
View for 28nm Technology
Maintaining High Coverage
To maintain high coverage of a core in the hierarchically scan inserted SoC, a See the Top 20 >>
mechanism is needed to control logic going into the core and to observe logic coming
out of the core. This mechanism is needed because most functional ports of a core are
not accessible from the top level of the SoC. A wrapper boundary register (WBR) — as E-mail This Article Printer-Friendly Page
shown in Figure 3 — isolates a core by bounding that core with a chain of registers,
allowing for testing of the internal logic of that core without access to the functional
ports.

Test Figure 3

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Figure 3 Core with Isolation Wrapper Boundary Register

A WBR comprises a register for each functional input and


output. Flip-flops that are part of the function of the design at
the input or output can be reused as a WBR cell. When no
reusable flip-flop exists, a dedicated WBR cell must be placed
on the functional input or output as shown in Figure 4 . The
dedicated input WBR cell, rather than the input port, has the
capability of driving the internal logic with the register during
internal test (Intest) mode. If the input port were used instead of
the WBR cell, it would generate an X in this scenario, as there
is no access to logic external to the core during the Intest mode.
This would cause a decrease in test coverage of the core.
During Intest mode, a dedicated output WBR cell captures
responses from the functional logic into the WBR cell. The WBR
added to a core can also be used to test the user-defined logic
surrounding a core.

Test Figure 4
Figure 4: Dedicated WBR Cell Examples

Test isolation can be leveraged to test each core with a different


methodology — such as flip-flop or latch-based scan, or BIST.
This allows the best test methodology to be applied to each
core — and eliminates the requirement that the entire SoC have
a matched test method. Test isolation also allows for each core
to be tested at different frequencies, which is often a
requirement in SoC design.

Test Effort: Divide and Conquer


When an SoC is created, it can be a massive effort to create
the test patterns for screening the device, and this effort cannot
be begun until very late in the design flow. With an SoC that is
composed of wrapped cores, this effort can be divided in many
ways. Each core’s test can be created whenever the core is
completed, and much earlier in the SoC design cycle to
absolutely minimize schedule impacts. Also, different resources
(people, CPUs, tools) can be used at different times to allow for
a more serial flow and a reduction of cost.

Once a pattern set is created for an isolated core, this pattern


set can be reused every time the core is reused. If hierarchical
isolation is not used, the test patterns must be created each
time the core is instantiated.

If the environment allows, all of the cores can be tested in


parallel. The number of pins, tester memory capacity and peak
power are considerations that must be taken into account. If
any of the environment will not allow for all of the cores and
UDL to be tested in parallel, hierarchical testing allows for other
options. One core at a time can be tested, two cores at a time
can be tested, or any other combination of cores and UDL can
be tested in parallel. The capability of hierarchical testing has
the flexibility to test the SoC in a way that best fits the test
environment. In the case of an SoC flat test, the choices are
much more limited.

Another advantage of hierarchical test is that if there are


unexpected problems during test, such as excess power
dissipation or IR drop, it may be possible to circumvent them.
An example of this is if three cores are being tested in parallel
and the IR drop during the test is high enough to cause data
inversion or insufficient frequency measurements, then the
testing order can be changed to accommodate these issues.

Test isolation also provides the ability to use the cores as a


guideline to divide the power domains. The current/voltage
measurements can be taken for each design entity. The
separation of the power information is extremely important in an
SoC environment.

The benefits of an SoC test methodology are significant enough


for designs to be processed in an SoC flow by partitioning the
design hierarchically – even if the IP reuse doesn’t strictly
demand it.

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Teresa McLaurin is a consulting


member of the technical staff at the
ARM Design Center in Austin, TX. She
manages and leads the DFT and Test
teams and she creates DFT
methodology for use across ARM. She
is a member of the IEEE and the IEEE
P1500 standard task force.

Dr. Rohit Kapur, Synopsys Scientist,


guides the development of Synopsys
design-for-test (DFT) solutions based
on Core Test Language (CTL) and
other open standards. He is chair of the
Core Test Language, IEEE P1450.6,
standard committee, and was named
IEEE Fellow in January 2003 for his
outstanding contributions to the field of
IC test technology.

Dr. Kapur wrote a book on the


industry's first standards-based
system-on-chip (SoC) test modeling
language. The book, titled CTL for Test
Information of Digital ICs and published
by Kluwer Academic Publishers, is a
reference guide for the IEEE CTL
standard.

Dr. Kapur received a bachelor's degree


in engineering from Birla Institute of
Technology in Mesra, India and his
master's and doctorate degrees in
computer engineering from the
University of Texas at Austin. Dr. Kapur
continues his research interests in
testing of Very Large Scale Integration
(VLSI) systems.

©2005 Synopsys, Inc. Synopsys and the


Synopsys logo are registered trademarks of
Synopsys, Inc. All other company and product
names mentioned herein may be trademarks or
registered trademarks of their respective
owners and should be treated as such.

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