M10JNP2SB

Intel® Server Board

M10JNP2SB
User Guide
An overview of product features, functions, architecture,
support specifications, and instructions
for essential component installation.

Rev. 1.7
June 2021
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 Intel® Server Board M10JNP2SB User Guide

Document Revision History

Date Revision Changes
October 2019 1.0 First release.
October 2019 1.01 Added product regulatory compliance table.
November 2019 1.1 Chapter 3 - Added Supported processors
January 2020 1.2 Updated Appendix F – Product Regulatory information to include EU Lot 9 support content
April 2020 1.3 Chapter 5 – Added I/O Shield 2D drawing
Chapter 2 Server Board Overview – Updated processor Thermal Design Power (TDP)
June 2020 1.4
information
Updated reference source error messages
September 2020 1.5
Updated information on section 4.1 Memory Support
Chapter 4 – Added DDR4 Disclaimer
December 2020 1.6
Minor updates for clarity
Adding section installation and removal of IO shield
June 2021 1.7
Minor updates throughout for clarity

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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software, or service
activation. Learn more at Intel.com, or from the OEM or retailer.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which
includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The products described may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
Intel warranties that this product will perform to its published specifications. However, all computer systems are inherently subject to
unpredictable system behavior under various environmental and other conditions.
This product is not intended to be the sole source for any critical data and the user must maintain a verified backup. Failure to do
so or to comply with other user notices in the product user guide and specification documents may result in loss of or access to
data.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725
or by visiting www.intel.com/design/literature.htm.
Intel, the Intel logo, and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
Copyright © Intel Corporation. All rights reserved.

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Product Safety Overview

Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components will void the UL listing and other regulatory approvals of the product and will most
likely result in noncompliance with product regulations in the region(s) in which the product is sold.
Hazardous conditions, devices and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the system and disconnect all telecommunications systems,
networks, and modems attached to it before performing any service. Otherwise, personal injury or
equipment damage can result.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle
nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or
install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide
sides can damage the contacts inside the jumper, causing intermittent problems with the function controlled
by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper,
or you may bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can cause damage to your computer or the components within it. ESD can occur
without the user feeling a shock while working inside the system chassis or while improperly handling
electronic devices like processors, memory or other storage devices, and add-in cards.

Intel recommends the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
• Where available, all system integration and/or service should be performed at a properly equipped ESD
workstation.
• Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive
shoes.
• Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.
• Remove all jewelry.
• Disconnect all power cables and cords before opening the Server Chassis
• Power down the system and remove power feed from the Server Board before performing any
integration or service
• Touch any unpainted metal surface of the chassis before performing any integration or service.
• Hold all circuit boards and other electronic components by their edges only.
• After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive foam pad. Do not place electronic
devices on to the outside of any protective packaging.

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Table of Contents
1. Introduction .................................................................................................................................................................. 8
1.1 Intel® Server Board Use Disclaimer............................................................................................................................ 8
2. Server Board Overview............................................................................................................................................... 9
2.1 Server Board Features Overview ................................................................................................................................ 9
2.2 Server Board Component / Feature Identification ........................................................................................... 11
2.3 Server Board Mechanical Drawings ........................................................................................................................ 12
2.4 Product Architecture Overview ................................................................................................................................ 16
3. Processor Support.................................................................................................................................................... 17
3.1 Processor Features ........................................................................................................................................................ 18
4. Memory Support ....................................................................................................................................................... 19
4.1 Supported Memory ....................................................................................................................................................... 19
4.2 General Memory Population Rules ......................................................................................................................... 21
4.3 Memory RAS Features .................................................................................................................................................. 22
5. Server Board I/O ....................................................................................................................................................... 23
5.1 PCIe* Add-In Card Support ........................................................................................................................................ 23
5.1.1 PCIe* Enumeration and Allocation ......................................................................................................................... 23
5.2 1U One-Slot PCIe* Riser Card Option (iPC – JNP1URISER) .......................................................................... 24
5.3 Networking........................................................................................................................................................................ 24
5.4 USB ....................................................................................................................................................................................... 25
5.4.1 External USB 3.1 Connectors .................................................................................................................................... 25
5.4.2 Front Panel USB 3.1 Connector ............................................................................................................................... 25
5.5 Onboard SATA Support .............................................................................................................................................. 26
5.5.1 SATADOM support ........................................................................................................................................................ 26
5.6 I/O Shield Drawing ......................................................................................................................................................... 27
6. Server Management ................................................................................................................................................. 28
6.1 Shared Management Interface ................................................................................................................................. 28
6.2 Integrated Baseboard Management Controller Web Console (Integrated BMC Web Console) ... 28
7. Onboard Connector/Header Pinout Overview .................................................................................................. 30
7.1 Power Connectors ......................................................................................................................................................... 30
7.2 Onboard Storage Connectors ................................................................................................................................... 31
7.2.1 SATA 6 Gbps Connectors ........................................................................................................................................... 31
7.2.2 SATADOM 6 Gbps Connectors ................................................................................................................................. 31
7.2.3 SATA SGPIO Connector ............................................................................................................................................... 31
7.3 Fan Connectors ............................................................................................................................................................... 32
7.3.1 System Fan Connectors............................................................................................................................................... 32
7.3.2 Processor Fan Connectors ......................................................................................................................................... 32
7.4 Front Panel Headers and Connectors ................................................................................................................... 32
7.4.1 Front Panel Header ....................................................................................................................................................... 32
7.4.2 Front Panel USB 3.1 Connector ............................................................................................................................... 32
7.5 Dedicated LAN Activity LED Headers ..................................................................................................................... 33
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7.6 Other Headers and Connectors ............................................................................................................................... 33

7.6.1 Serial Port Connectors ................................................................................................................................................. 33
7.6.2 Power Supply Monitoring Interface (PSMI) Connector .................................................................................. 34
7.6.3 IPMB Header..................................................................................................................................................................... 34
7.6.4 Chassis Intrusion Header ............................................................................................................................................ 34
7.6.5 ID LED Header.................................................................................................................................................................. 34
8. Reset and Recovery Jumpers................................................................................................................................. 35
8.1 Clear CMOS Jumper Block ......................................................................................................................................... 35
8.2 BIOS Recovery Jumper ................................................................................................................................................ 36
9. Server Board and Essential System Component Installation and Removal ............................................... 37
9.1 I/O Shield Installation / Removal............................................................................................................................. 38
9.2 Installing the Server Board ......................................................................................................................................... 40
9.3 Server Board Removal ................................................................................................................................................. 40
9.4 Installing the Processor ............................................................................................................................................... 41
9.5 Processor Heat Sink Installation .............................................................................................................................. 44
9.6 Heat Sink Removal ......................................................................................................................................................... 45
9.7 Removing the Processor ............................................................................................................................................. 46
9.8 Memory (DIMM) Installation ...................................................................................................................................... 46
9.9 Memory (DIMM) Removal............................................................................................................................................ 46
9.10 Connecting SATA Drives ............................................................................................................................................. 47
9.11 Removing SATA Drives ................................................................................................................................................ 47
9.12 Connecting System Fans............................................................................................................................................. 48
9.13 Disconnecting System Fans ....................................................................................................................................... 49
Appendix A. Usage Tips............................................................................................................................................... 50
Appendix B. Getting Help............................................................................................................................................ 51
Appendix C. POST Code Errors .................................................................................................................................. 52
Appendix D. Additional References .......................................................................................................................... 59
Appendix E. Safety Instructions ................................................................................................................................ 60
Appendix F. Product Regulatory Information ........................................................................................................ 72
Appendix G. Statement Of Volatility ........................................................................................................................ 74
Glossary ............................................................................................................................................................................. 76

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List of Figures
Figure 1. Intel® Server Board M10JNP2SB ........................................................................................................................................ 9
Figure 2. Server board component / feature identification ..................................................................................................... 11
Figure 3. Server board mounting holes ........................................................................................................................................... 12
Figure 4. Component height restrictions ........................................................................................................................................ 13
Figure 5. Major components and connectors 1 of 2 .................................................................................................................. 14
Figure 6. Major components and connectors 2 of 2 .................................................................................................................. 15
Figure 7. Intel® Server Board M10JNP2SB block diagram ....................................................................................................... 16
Figure 8. Memory subsystem architecture ..................................................................................................................................... 19
Figure 9. DIMM slot identification ...................................................................................................................................................... 19
Figure 10. PCIe slot identification ...................................................................................................................................................... 23
Figure 11. 1U one-slot PCIe* riser card option (iPC – JNP1Uriser) ...................................................................................... 24
Figure 12. Rear networking ports ....................................................................................................................................................... 24
Figure 13. External USB 3.1 Gen2 ports .......................................................................................................................................... 25
Figure 14. Front panel USB 3.0 connector ..................................................................................................................................... 26
Figure 15. SATADOM connector pinout .......................................................................................................................................... 26
Figure 16. I/O Shield 2D drawing ....................................................................................................................................................... 27
Figure 17. Integrated BMC Web Console user interface ........................................................................................................... 29
Figure 18. Board jumper identification ............................................................................................................................................ 35
Figure 19. Server board mounting hole location ......................................................................................................................... 37
Figure 20. Installing the I/O shield ..................................................................................................................................................... 38
Figure 21. Removing the I/O shield ................................................................................................................................................... 39
Figure 22. Removing the socket protection cap .......................................................................................................................... 41
Figure 23. Opening the socket lever ................................................................................................................................................. 41
Figure 24. Opening the processor load plate ................................................................................................................................ 42
Figure 25. Installing the processor .................................................................................................................................................... 42
Figure 26. Closing the load plate ........................................................................................................................................................ 43
Figure 27. Closing the socket lever.................................................................................................................................................... 43
Figure 28. Installing the heat sink ...................................................................................................................................................... 44
Figure 29. Connecting the fan cable ................................................................................................................................................. 44
Figure 30. Removing the fan cable .................................................................................................................................................... 45
Figure 31. Removing the heat sink..................................................................................................................................................... 45
Figure 32. DIMM installation ................................................................................................................................................................. 46
Figure 33. DIMM removal ....................................................................................................................................................................... 46
Figure 34. Attaching SATA cables ...................................................................................................................................................... 47
Figure 35. Removing SATA cables ..................................................................................................................................................... 47
Figure 36. System fan connector identification ........................................................................................................................... 48
Figure 37. Connecting system fan cables ....................................................................................................................................... 48
Figure 38. Removing system fan cables .......................................................................................................................................... 49

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List of Tables
Table 1. Intel® Server Board M10JNP2SB features/specifications ......................................................................................... 9
Table 2. Intel® Xeon® E-2100 processor family features list................................................................................................... 17
Table 3. Intel® Xeon® E-2200 processor family features list................................................................................................... 17
Table 4. DDR4 DIMM Attributes Table for “Identical” and “Like” DIMMs .......................................................................... 20
Table 5. DIMM population recommendations .............................................................................................................................. 21
Table 6. Memory RAS features ............................................................................................................................................................ 22
Table 7. One-slot PCIe* riser card slot description..................................................................................................................... 24
Table 8. 10/100/1000 Mbps LAN link/activity LED matrix ...................................................................................................... 25
Table 9. PWR1 pinout.............................................................................................................................................................................. 30
Table 10. PWR2 pinout ........................................................................................................................................................................... 30
Table 11. SATA connector pinout ...................................................................................................................................................... 31
Table 12. SATADOM connector pinout ........................................................................................................................................... 31
Table 13. SGPIO connector pinout .................................................................................................................................................... 31
Table 14. System fan connector pinout .......................................................................................................................................... 32
Table 15. Processor fan connector pinout ..................................................................................................................................... 32
Table 16. Front panel header pinout ................................................................................................................................................ 32
Table 17. Front panel USB 3.1 connector pinout ........................................................................................................................ 33
Table 18. LAN 3 activity LED header ................................................................................................................................................. 33
Table 19. LAN 4 activity LED header ................................................................................................................................................. 33
Table 20. TPM header pinout .............................................................................................................................................................. 33
Table 21. COM1 port pinout ................................................................................................................................................................. 33
Table 22. COM2 port pinout ................................................................................................................................................................. 34
Table 23. PSMI connector pinout ....................................................................................................................................................... 34
Table 24. IPMB header pinout ............................................................................................................................................................. 34
Table 25. Chassis intrusion header pinout ..................................................................................................................................... 34
Table 26. ID LED header pinout .......................................................................................................................................................... 34
Table 27. PEI phase .................................................................................................................................................................................. 53
Table 28. Server board components ................................................................................................................................................ 75

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1. Introduction
This user guide provides a high level overview of the features, functions, and architecture of the Intel® Server
Board M10JNP2SB. This document replaces the document previously known as the Technical Product
Specification (TPS).
This guide is divided in two main parts. Going from chapters 2–8, it provides information about the server
board features and functions, followed by instructions on how to install or service essential system
components on Chapter 9.
For additional information about this server board, refer to the documents listed in Appendix D.

1.1 Intel® Server Board Use Disclaimer

Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. It is the responsibility of the system
integrator to consult vendor datasheets and operating parameters to determine the amount of airflow
required for a specific system configuration and operating environment. Intel Corporation cannot be held
responsible if components fail or the server board does not operate correctly when used outside any of its
published operating or non-operating limits.

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2. Server Board Overview

The Intel® Server Board M10JNP2SB is a monolithic printed circuit board assembly with features for data
center and office environments running multiple applications under a continuous workload. This server
board is designed to support the Intel® Xeon® E 2200 processor family.

Figure 1. Intel® Server Board M10JNP2SB

2.1 Server Board Features Overview

Table 1. Intel® Server Board M10JNP2SB features/specifications
Feature Description
Processor support • One LGA1151 processor socket
• Supports one of the following processors:
o Intel® Xeon E-2224 processor
o Intel® Xeon E-2236 processor
o Intel® Xeon E-2278G processor
• Maximum supported Thermal Design Power (TDP) of up to 95 W
Note: Server Systems based on this server board may support a lower maximum Thermal
Design Power (TDP). Consult chassis vendor specifications for maximum supported processor
TDP limits.
Memory • Four DIMM Slots
• Two memory channels
• DDR4 UDIMM ECC, 2666 MT/s, 1.2V
• Up to 128GB total installed memory
Chipset Intel® C246 Chipset
Network Ports • Four 1GbE Base-T, RJ45
• One dedicated management port, RJ45

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Feature Description
Onboard Storage Support • Six SATA 6 Gbps ports (6 Gb/s, 3 Gb/s and 1.5 Gb/s transfer rates are supported)
• Two 7-pin SATA-DOM connectors
Embedded SATA software RAID
• Intel® VROC (SATA RAID)
PCIe* Add-in Card Slots • Slot 1: PCIe* 3.0 x8 slot (x4 electrical)
• Slot 2: PCIe* 3.0 x8 slot (x8 electrical)
• Slot 3: PCIe* 3.0 x16 slot (x8 electrical)
Riser Card Support Support for one PCIe 3.0 riser card on PCIe slot 3. (Sold separately. Optional Intel Accessory)

Video • Integrated 2D video controller

• 16 MB of DDR4 video memory
• One DB-15 external connector
• Two External Display Port connectors
USB • Four external USB 3.1 Gen2 ports
• One 2x10 pin connector providing front panel support for (2) USB 3.1 Gen1 ports
Serial Port • Two internal DH-10 serial port connectors

Server Management • Integrated baseboard management controller, IPMI 2.0 compliant

• Dedicated RJ45 management port
• Shared management interface
Security • Trusted platform module 2.0 support (China Version) – iPC JNPTPMCH
(accessory option)
• Trusted platform module 2.0 support (Rest of World) – iPC JNPTPM
(accessory option)
System Fan Support • Two 4-pin processor fan headers
• Six 6-pin front system fan headers
• One 4-pin rear system fan header
Front Panel Support • One 2x12 pin SSI front panel header

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2.2 Server Board Component / Feature Identification

Figure 2. Server board component / feature identification

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2.3 Server Board Mechanical Drawings

Figure 3. Server board mounting holes

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Figure 4. Component height restrictions

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Figure 5. Major components and connectors 1 of 2

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Figure 6. Major components and connectors 2 of 2

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2.4 Product Architecture Overview

The architecture of Intel® Server Board M10JNP2SB is developed around the integrated features and
functions of the Intel® Xeon® E-2200 processor family, the Intel® C246 Platform Controller Hub (PCH)chipset,
Intel® Ethernet Controller I210, and the ASPEED* AST2500 baseboard management controller (BMC).
Figure 7 provides an overview of the server board architecture, showing the features and interconnects of
each of the major subsystem components.

Figure 7. Intel® Server Board M10JNP2SB block diagram

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3. Processor Support
The server board includes one LGA1151 processor socket compatible with select models from the Intel®
Xeon® E-2100 and Intel® Xeon® E-2200 processor families with a maximum Thermal Design Power (TDP) of
95 W.
The Intel Server Board M10JNP2SB has been validated to support the following Intel processors:
• Intel® Xeon E-2104G processor
• Intel® Xeon E-2124 processor
• Intel® Xeon E-2124G processor
• Intel® Xeon E-2126G processor
• Intel® Xeon E-2134 processor
• Intel® Xeon E-2136 processor
• Intel® Xeon E-2146G processor
• Intel® Xeon E-2174G processor
• Intel® Xeon E-2176G processor
• Intel® Xeon E-2186G processor
• Intel® Xeon E-2224 processor
• Intel® Xeon E-2236 processor
• Intel® Xeon E-2278G processor

Table 3 and Table 2 provide a comparison of specifications between the supported processors.
Table 2. Intel® Xeon® E-2100 processor family features list
Max Intel® Intel®
Base Intel® UHD
Turbo Boost Smart
SKU Cores/threads Speed Graphics
Technology 2.0 Cache
(GHz) P630
Speed (GHz) (MB)
E-2186G 6/12 3.8 4.7 Yes 12
E-2176G 6/12 3.7 4.7 Yes 12
E-2174G 4/8 3.8 4.7 Yes 8
E-2146G 6/12 3.5 4.5 Yes 12
E-2144G 4/8 3.6 4.5 Yes 8
E-2136 6/12 3.3 4.5 No 12
E-2134 4/8 3.5 4.5 No 8
E-2126G 6/12 3.3 4.5 Yes 12
E-2124G 4/8 3.4 4.5 Yes 8
E-2124 4/8 3.3 4.3 No 8
E-2104G 4 3.2 N/A Yes 8

Table 3. Intel® Xeon® E-2200 processor family features list

Intel® Xeon® E-2224 Intel® Xeon® E-2236 Intel® Xeon® E-2278G
Features
Processor Processor Processor
Cores/Threads 4/4 6/12 8/16
Max Turbo Frequency 4.7 GHz 4.8 GHz 5.0 GHz
Base Frequency 3.5 GHz 3.4 GHz 3.8 GHz
Intel® Smart Cache 8 Mb 12 Mb 12 Mb
Intel® UHD Graphics P360 N/A P360
DDR4 ECC UDIMM 128 Gb 128 Gb 128 Gb

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3.1 Processor Features

The Intel® Xeon® E-2100 and Intel® Xeon® E-2200 processor families combine several key system
components into a single processor package, and include the following features:
• Intel® Virtualization Technology (Intel® VT-x)
• Intel® Active Management Technology 11.0 (Intel® AMT)
• Intel® Trusted Execution Technology (Intel® TXT)
• Intel® Streaming SIMD Extensions 4.2 (Intel® SSE4.2)
• Intel® Hyperthreading Technology (Intel® HT Technology)
• Intel® 64 Architecture
• Execute Disable Bit
• Intel® Turbo Boost Technology 2.0
• Intel® Advanced Vector Extensions 2 (Intel® AVX2
• Intel® Advanced Encryption Standards New Instructions (Intel® AES-NI)
• PCLMULQDQ (Perform Carry Less Multiplication Quad word) instruction
• Intel® Secure Key
• Intel® Transactional Synchronization Extensions (Intel® TSX-NI)
• PAIR – Power Aware Interrupt Routing
• SMEP – Supervisor Mode Execution Protection
• Intel® Boot Guard
• Intel® Software Guard Extensions (Intel® SGX)
• Intel Memory Protection Extensions (Intel® MPX)
• GMM Scoring Accelerator
• Intel® Processor Trace (Intel® PT)
• High Definition Content Protection (HDCP) 2.2

Note: Feature availability may vary between processor SKUs.

Refer to the Intel® Server Board M10JNP2SB Configuration Guide for a complete list of tested hardware.

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4. Memory Support

Figure 8. Memory subsystem architecture

The Intel® Xeon® E-2200 processor family includes an Integrated Memory Controller (IMC) capable of
supporting two memory channels that can accommodate up to two DIMM slots per channel. On the Intel®
Server Board M10JNP2SB, a total of four DIMM slots are provided as shown in Figure 9.

4.1 Supported Memory

The server board supports the following:
• Only DDR4 DIMMs are supported
• Error Correction Code (ECC) enabled and non-ECC UDIMMs are supported
• Total installed system memory of up to 128GB
• DIMM speeds of 2666/2400 MT/s
• DIMMs organized as Single Rank (SR) or Dual Rank (DR)

The following illustration shows the location of the DIMM slots on the server board.

Figure 9. DIMM slot identification

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Intel DDR4 DIMM Support Disclaimer:

Intel validates and will only provide support for system configurations where all installed DDR4 DIMMs
have matching “Identical” or “Like” attributes. See Error! Reference source not found.4. A system
configured concurrently with DDR4 DIMMs from different vendors will be supported by Intel if all other
DDR4 “Like” DIMM attributes match.
Intel does not perform system validation testing nor will it provide support for system configurations
where all populated DDR4 DIMMs do not have matching “Like” DIMM attributes as listed in Error!
Reference source not found.4.
Intel will only provide support for Intel server systems configured with DDR4 DIMMs that have been
validated by Intel and are listed on Intel’s Tested Memory list for the given Intel server product family.
Intel configures and ships pre-integrated L9 server systems. All DDR4 DIMMs within a given L9 server
system as shipped by Intel will be identical. All installed DIMMs will have matching attributes as those
listed in the “Identical” DDR4 DIMM4 Attributes column in Error! Reference source not found.4.
When purchasing more than one integrated L9 server system with the same configuration from Intel, Intel
reserves the right to use “Like” DIMMs between server systems. At a minimum “Like” DIMMS will have
matching DIMM attributes as listed in the table below. However, the DIMM model #, revision #, or vendor
may be different.
For warranty replacement, Intel will make every effort to ship back an exact match to the one returned.
However, Intel may ship back a validated “Like” DIMM. A “Like” DIMM may be from the same vendor but
may not be the same revision # or model #, or it may be an Intel validated DIMM from a different
vendor. At a minimum, all “Like” DIMMs shipped from Intel will match attributes of the original part
according to the definition of “Like” DIMMs in the following table.
Table 4. DDR4 DIMM Attributes Table for “Identical” and “Like” DIMMs
• DDR4 DIMMs are considered “Identical” when ALL listed attributes between the DIMMs match
• Two or more DDR4 DIMMs are considered “Like” DIMMs when all attributes minus the Vendor, and/or
DIMM Part # and/or DIMM Revision#, are the same.

“Identical” DDR4 “Like” DDR4

Attribute Possible DDR4 Attribute Values
DIMM Attributes DIMM Attributes

Vendor Match Maybe Different Memory Vendor Name

DIMM Part # Match Maybe Different Memory Vendor Part #

DIMM Revision # Match Maybe Different Memory Vendor Part Revision #

SDRAM Type Match Match DDR4

DIMM Type Match Match RDIMM, LRDIMM

Speed (MHz) Match Match 2666, 2933, 3200

Voltage Match Match 1.2V

DIMM Size (GB) Match Match 8GB, 16GB, 32GB, 64GB, 128GB, 256GB

Organization Match Match 1Gx72; 2Gx72; 4Gx72; 8Gx72; 16Gx72; 32Gx72

DIMM Rank Match Match 1R, 2R, 4R, 8R

DRAM Width Match Match x4, x8

DRAM Density Match Match 8Gb, 16Gb

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4.2 General Memory Population Rules

The following memory population rules apply when installing DIMMs:
• When only one DIMM is used in the channels A or B, it must be populated in the black DIMM slot.
• Mixing DIMMs of a different type or rank organization is not supported

The following table lists the recommended DIMM populations for the server board.
Table 5. DIMM population recommendations
DIMM Slot
# of installed
DIMMs DIMM_A0 DIMM_A1 DIMM_B0 DIMM_B1

1 
2  
1 
2  
2  
3   
3   
4    

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4.3 Memory RAS Features

Each processor within the Intel® Xeon® E-2200 processor family has support for advanced memory RAS
features as defined in the following table.
Table 6. Memory RAS features
RAS Feature Description
x8 Single Device Data Correction (SDDC) via static virtual
lockstep (Applicable to x8 DRAM DIMMs)
Adaptive Data Correction (SR) (Applicable to x4 DRAM DIMMs)
Device Data Correction x8 Single Device Data Correction + 1 bit (SDDC+1) (Applicable
to x8 DRAM DIMMs)
SDDDC + 1, and ADDDC (MR) + 1 (Applicable to x4 DRAM
DIMMs)
Full Memory Mirroring: An intra IMC method of keeping a
duplicate (secondary or mirrored) copy of the contents of
memory as a redundant backup for use if the primary memory
fails. The mirrored copy of the memory is stored in memory of
the same processor socket's IMC. Dynamic (without reboot)
failover to the mirrored DIMMs is transparent to the OS and
Memory Mirroring
applications.
Address Range/Partial Memory Mirroring: Provides further intra
socket granularity to mirroring of memory by allowing the
firmware or OS to determine a range of memory addresses to
be mirrored, leaving the rest of the memory in the socket in
non-mirror mode.

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5. Server Board I/O

5.1 PCIe* Add-In Card Support
The server board provides three PCI Express* (PCIe*) slots labeled: “PCIe#1”, “PCIe#2”, and “PCIe#3”. The
PCIe* interface of the Intel® Server Board M10JNP2SB is fully compliant with the PCIe* Base Specification,
Revision 3.0 supporting the following PCIe* bit rates: 3.0 (8.0 GT/s), 2.0 (5.0 GT/s), and 1.0 (2.5 GT/s).
PCIe add-in card slots and their properties are as follows:
• Slot 1: PCIe* 3.0 x8 slot (x4 electrical)
• Slot 2: PCIe* 3.0 x8 slot (x8 electrical)
• Slot 3: PCIe* 3.0 x16 slot (x8 electrical)

Figure 10. PCIe slot identification

5.1.1 PCIe* Enumeration and Allocation
The BIOS assigns PCI bus numbers in a depth-first hierarchy, in accordance with the PCI Local Bus
Specification, Revision 3.0. The bus number is incremented when the BIOS encounters a PCI-PCI bridge
device.
Scanning continues on the secondary side of the bridge until all subordinate buses are assigned numbers.
PCI bus number assignments may vary from boot to boot with varying presence of PCI devices with PCI-PCI
bridges.
If a bridge device with a single bus behind it is inserted into a PCI bus, all subsequent PCI bus numbers below
the current bus are increased by one. The bus assignments occur once, early in the BIOS boot process, and
never change during the pre-boot phase.
The BIOS resource manager assigns the PIC-mode interrupt for the devices that are accessed by the legacy
code. The BIOS ensures that the PCI BAR registers and the command registers for all devices are correctly set

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up to match the behavior of the legacy BIOS after booting to a legacy OS. Legacy code cannot make any
assumption about the scan order of devices or the order in which resources are allocated to them. The BIOS
automatically assigns IRQs to devices in the system for legacy compatibility. A method is not provided to
manually configure the IRQs for devices.

5.2 1U One-Slot PCIe* Riser Card Option (iPC – JNP1URISER)

The server board supports one riser card with a single PCIe 3.0 slot. Due to the size of the riser card (x16
mechanical) it can only be installed in PCIe* Slot #3 as shown in Figure 10.

Figure 11. 1U one-slot PCIe* riser card option (iPC – JNP1Uriser)

Table 7. One-slot PCIe* riser card slot description
Slot # Description
Slot-1 PCIe x8 elec, x16 mechanical

5.3 Networking
The Intel® Server Board M10JNP2SB includes five external RJ45 connectors that support the following
features:
• Four 1 Gb Network Interface Ethernet Ports
• One dedicated 1 Gb server management port

The following illustration shows the ports on the back edge of the server board.

Figure 12. Rear networking ports

The five onboard Ethernet ports have green and yellow LEDs that indicate LAN status. The following table
lists the different LED states.

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Table 8. 10/100/1000 Mbps LAN link/activity LED matrix

Speed/State Left LED Right LED

10 Link Green Off

Mbps Active Blinking Green Off

100 Link Green Green

Mbps Active Blinking Green Green

1000 Link Green Amber

Mbps Active Blinking Green Amber
No Link Off Off

5.3.1 MAC Address Definition

The Intel® Server Board M10JNP2SB has the following MAC addresses assigned at the factory:
• RJ45 Network Interface Ethernet Port 1 (base MAC address)
• RJ45 Network Interface Ethernet Port 2 (base MAC address + 1)
• RJ45 Network Interface Ethernet Port 3 (base MAC address + 2)
• RJ45 Network Interface Ethernet Port 4 (base MAC address + 3)
• Dedicated management port (base MAC address + 4)
• Shared management interface (through Ethernet port 4 – base MAC address +5)

5.4 USB
USB support is provided through onboard internal and external connectors as described in the following
sections.
5.4.1 External USB 3.1 Connectors
The server board includes four (stacked 2x2) USB 3.1 Gen2 ports on the back edge of the server board. Two
ports are located below the Dedicated Management port, while the other two are located above one of the
display port connectors as shown in Figure 13.

Figure 13. External USB 3.1 Gen2 ports

5.4.2 Front Panel USB 3.1 Connector
A blue 20-pin (2x10) shrouded connector on the server board (labeled “USB3_FPIO1”) provides the option of
routing two USB 3.1 ports to the front of a given chassis. Figure 14 provides the location of the connector on
the server board. See Section 7.4.2 for detailed connector pinouts.

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Figure 14. Front panel USB 3.0 connector

5.5 Onboard SATA Support

The server board includes an AHCI SATA controller embedded in the chipset, providing eight 6 Gb/sec SATA
ports with the following functionality:
• Two white single port 9-pin connectors labeled “SATADOM-1/SATA-0” and “SATADOM-2/SATA-1”,
supporting SATA DOM (Disk on Module) storage devices.
• Six SATA ports on the server board labeled “SATA2-7”

5.5.1 SATADOM support

The 9-pin connectors labeled “SATA-0/SATADOM-1” and “SATA-1/SATADOM-2” support SATADOM devices
and provide two additional pins to power a connected device. Figure 15 shows the pinout for the connectors.

PIN 1 2 3 4 5 6 7 P1 P2

Signal GND TXP TXN GND RXN RXP GND VCC 5V GND

Figure 15. SATADOM connector pinout

Note: The ports are located close to the front edge of the server board. Refer to the documentation of the
chassis where the server board will be installed for details on clearance at the front edge of the board to
determine the dimensions of the SATADOM devices that can be installed.

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5.6 I/O Shield Drawing

The Intel® Server Board M10JNP2SB includes the following I/O Shield.

Figure 16. I/O Shield 2D drawing

Caution: The I/O Shield includes a conductive gasket to protect the board and other system components
from Electrostatic discharges (ESD). Do not damage or remove the gasket from the I/O shield.

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6. Server Management
The Intel® Server Board M10JNP2SB includes an ASPEED* AST2500 Baseboard Management Controller
(BMC) that is IPMI 2.0 compliant, providing several management features that enable support for the
following:

• Control system functions – power system, ACPI, system reset control, system initialization, front panel
control, and system event log.
• Monitor various board and system sensors and regulate platform thermals and performance to
maintain (when possible) server functionality in the event of component failure and/or
environmentally stressed conditions.
• Monitor and report system health.
The integrated BMC supports the following features:
• Sensor monitoring
• In-Circuit BMC firmware update
• Chassis intrusion detection
• FRU information
• Logging and reporting
• Remote control
• Image redirection
• Power control
• Chassis identify
• Front panel control
• Configuration backup
• External user services
• Platform event filtering
• SMTP messaging
• Video recording
• User management
• Embedded firewall

6.1 Shared Management Interface

The Intel® Server Board M10JNP2SB provides a shared management interface that can be used to route
management traffic through Ethernet port #4 on the back edge of the server board. This feature is disabled
by default and can be enabled using the <F2> BIOS Setup Utility. Refer to the Intel® Server Board
M10JNP2SB BIOS Setup Guide for more details.

6.2 Integrated Baseboard Management Controller Web Console (Integrated BMC

Web Console)
BMC manageability provides an Integrated BMC Web Console, which exposes the management features of
the BMC. It is supported through the dedicated management port on the back edge of the server board or
the shared management interface (when enabled and configured). The web console user interface supports
the following client web browsers:
• Microsoft Internet Explorer*
• Mozilla Firefox*
• Google Chrome*
• Safari*

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User authentication is based on user ID and password.
The user interface presented by the web console authenticates the user before allowing a web session to be
initiated. The web interface also provides a launch point keyboard, video, and mouse (KVM) and media
redirection.
For additional information, refer to the Intel® Server Board M10JNP2SB Integrated BMC Web Console User
Guide.

Figure 17. Integrated BMC Web Console user interface

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7. Onboard Connector/Header Pinout Overview

This chapter identifies the pinouts for onboard connectors and headers on the Intel® Server Board
M10JNP2SB that provide an interface for system options and features, onboard platform management, and
other user accessible options or features. For more details on the location of the connectors in this chapter,
see Figure 2.

7.1 Power Connectors

The server board includes two power connectors labeled “PWR1” and “PWR2”. The following tables provide
the pinout for these connectors.
Table 9. PWR1 pinout
Signal Pin Pin Signal
+3.3 Vdc 1 13 +3.3 Vdc
+3.3 Vdc 2 14 -12 Vdc
GND 3 15 GND
+5 Vdc 4 16 PS_ON#
GND 5 17 GND
+5V 6 18 GND
GND 7 19 GND
PWR_OK 8 20 NC
5 VSB 9 21 +5 Vdc
+12 Vdc 10 22 +5 Vdc
+12 Vdc 11 23 +5 Vdc
+3.3 Vdc 12 24 GND

Table 10. PWR2 pinout

Signal Pin Pin Signal
GND 1 5 +12 Vdc
GND 2 6 +12 Vdc
GND 3 7 +12 Vdc
GND 4 8 +12 Vdc

Important Note: PWR1 and PWR2 must be connected to power for the server board to boot correctly.

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7.2 Onboard Storage Connectors

This section contains a functional overview and pinout of each connector that the server board provides in
support of several storage options.
7.2.1 SATA 6 Gbps Connectors
The server board includes six blue 7-pin SATA connectors capable of transfer rates of up to 6 Gbps. The
following table provides the pinout for all six connectors.
Table 11. SATA connector pinout
Pin Signal
1 GND
2 TXP
3 TXN
4 GND
5 RXN
6 RXP
7 GND

7.2.2 SATADOM 6 Gbps Connectors

The server board includes two white 9-pin SATADOM connectors capable of transfer rates of up to 6Gbps.
The following table provides the pinout for both connectors:
Table 12. SATADOM connector pinout
PIN Signal
1 GND
2 TXP
3 TXN
4 GND
5 RXN
6 RXP
7 GND
P1 VCC 5V
P2 GND

7.2.3 SATA SGPIO Connector

The server board includes a 10-pin SGPIO for storage sideband communications. The following table
provides the pinout for the connector:
Table 13. SGPIO connector pinout
Signal Pin Pin Signal
SCL 1 2 SD1/SDO1
SDA 3 4 SDO0
GND 5 6 SLOAD
KEY 7 8 SCLOCK
V3AUX 9 10 HDD_FAULT

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7.3 Fan Connectors

The server board supports a total of six fans: five in support of system cooling fans, and one in support of a
processor fan.
7.3.1 System Fan Connectors
The server board includes five 4-pin system fan connectors labeled SYS_FAN_# (1-5). The following table
provides the pinout for the connectors.
Table 14. System fan connector pinout
Pin 1 2 3 4
Signal GND P12V TACH PWM

7.3.2 Processor Fan Connectors

The server board includes one 4-pin processor fan connector labeled “CPU Fan”. The following table
provides the pinout for the connector:
Table 15. Processor fan connector pinout
Pin 1 2 3 4
Signal GND P12V TACH PWM

7.4 Front Panel Headers and Connectors

The server board includes several connectors that provide multiple front panel options. This section
provides a functional description and pinout for each connector.
7.4.1 Front Panel Header
Included on the left edge of the server board is a 2x12-pin SSI front panel header. The following table
provides the connector pinout.
Table 16. Front panel header pinout
Signal Pin Pin Signal
PWR_LED+ 1 2 FP_PWR
KEY 3 4 ID_LED+
PWR_LED- 5 6 ID_LED-
HDD_LED+ 7 8 FAULT_LED1-
HDD_LED- 9 10 FAULT_LED2-
PWR_SW# 11 12 LAN1 ACTLED+
GND 13 14 LAN1 ACTLED-
RST_SW# 15 16 SMBus SDA
GND 17 18 SMBus SCL
SYS_ID_SW# 19 20 INTRUSION#
TEMP_SENSOR 21 22 LAN2 ACTLED+
NMI_SW# 23 24 LAN2 ACTLED-

7.4.2 Front Panel USB 3.1 Connector

The server board includes a 20-pin header to connect two USB 3.0 ports that can be routed to the front of a
chassis. The following table lists the pinout.

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Table 17. Front panel USB 3.1 connector pinout
Signal Name Pin# Pin# Signal Name
1 P5V_USB_FP
P5V_USB_FP 19 2 USB3_04_RXN
USB3_01_RXN 18 3 USB3_04_RXP
USB3_01_RXP 17 4 GROUND
GROUND 16 5 USB3_04_TXN
USB3_01_TXN 15 6 USB3_04_TXP
USB3_01_TXP 14 7 GROUND
GROUND 13 8 USB2_13_DN
USB2_10_DN 12 9 USB2_13_DP
USB2_10_DP 11 10 USB3_ID

7.5 Dedicated LAN Activity LED Headers

The server board includes two LED headers for Ethernet ports 3 and 4, which can be routed to a front panel
that supports displaying LAN activity for 4 Ethernet controllers. The following tables describe their pinout.

Table 18. LAN 3 activity LED header

Signal Pin Pin Signal

VCC 3.3V 1 2 LAN3_LED_N

Table 19. LAN 4 activity LED header

Signal Pin Pin Signal

VCC 3.3V 1 2 LAN4_LED_N

7.6 Other Headers and Connectors

Table 20. TPM header pinout
Signal Pin Pin Signal
P3V3 1 2 LPC_FRAME_N
LPC_LAD0 3 4 KEY
LPC_LAD1 5 6 PLTRST_N
LPC_LAD2 7 8 GND
LPC_LAD3 9 10 CLK
IRQ_SERIAL 11 12 GND
FM_TPM_MOD_PRES_N 13 14 P3V3_AUX
P3V3(NI)/GND 15 16 RST_ESPI_RESET_N

7.6.1 Serial Port Connectors

Table 21. COM1 port pinout
Signal Pin Pin Signal
DCD 1 2 DSR
RXD 3 4 RTS
TXD 5 6 CTS
DTR 7 8 RI
GND 9 10 KEY-Pin

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Table 22. COM2 port pinout
Signal Pin Pin Signal
DC 1 2 DSR
RXD 3 4 RTS
TXD 5 6 CTS
DTR 7 8 RI
GND 9 10 KEY-Pin

7.6.2 Power Supply Monitoring Interface (PSMI) Connector

The server board includes a PSMI connector for the BMC to monitor and communicate with the installed
power supplies. The pinout for this connector is shown in the following table.
Table 23. PSMI connector pinout
Signal Pin Pin Signal
PSMI_CLK 1 2 PSMI_DAT
PSMI_ALERT 3 4 GND
VCC 5

7.6.3 IPMB Header

The server board includes an IPMB SMBUS* header. The following table provides the pinout for the header.
Table 24. IPMB header pinout
Signal Pin Pin Signal
IPMB_DATA 1 2 GND
IPMB_CLK 3 4 VCC

7.6.4 Chassis Intrusion Header

The server board includes a 2-pin chassis intrusion header, which can be used when the chassis is configured
with a chassis intrusion switch. The following table provides the pinout for the header.
Table 25. Chassis intrusion header pinout
Header State Signal Description
Pins 1 and 2 closed FM_INTRUDER_HDR_N is pulled HIGH Chassis cover is removed
Pins 1 and 2 open FM_INTRUDER_HDR_N is pulled LOW. Chassis cover is closed

7.6.5 ID LED Header

The server board includes a 2-pin header to connect a chassis-mounted ID LED. The following table provides
the pinout for the header.
Table 26. ID LED header pinout
Signal Pin Pin Signal
FP_IDLED_BTN_N 1 2 GND

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8. Reset and Recovery Jumpers

The server board includes two jumper blocks, which can be used to configure, protect, or recover specific
features of the server board. Figure 18 identifies the location of each jumper block on the server board. Pin 1
of each jumper block can be identified by the arrowhead (▼) silkscreened on the server board next to the
pin.

Figure 18. Board jumper identification

8.1 Clear CMOS Jumper Block

This jumper resets BIOS options, configured using the <F2> BIOS Setup Utility, back to their default factory
settings.

Note: This jumper does not reset administrator or user passwords.

To use the BIOS default jumper, perform the following steps:

1. Power off the system and unplug the power cord (s).
2. Open the system chassis and access the “Clear CMOS” jumper block.
3. Move the “Clear CMOS” jumper from pins 1–2 (normal operation) to pins 2–3 (reset BIOS options).
4. Wait five seconds then move the jumper back to pins 1–2.
5. Close the system chassis.
6. Plug in the power cord(s), power on the system and press <F2> during POST to access the BIOS setup
utility to configure and save desired BIOS options.

Note: The system time and date may need to be reset.

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8.2 BIOS Recovery Jumper

When the BIOS recovery jumper block is moved from its default pin position (pins 1–2), the server board
boots using a backup BIOS image to the UEFI shell, where a standard BIOS update can be performed. Refer
to the BIOS update instructions that are included with the firmware update package downloaded from Intel’s
download center website. This jumper is used when the BIOS has become corrupted and is non-functional,
requiring a new BIOS image to be loaded on to the server board.

Note: The BIOS Recovery jumper is only used to reinstall a BIOS image in the event the BIOS has become
corrupted. This jumper is not used when the BIOS is operating normally to update the BIOS from one version
to another.

Note: System firmware update files are included in the firmware update package posted to Intel’s download
center website at http://downloadcenter.intel.com.

To use the BIOS recovery jumper, perform the following steps:

1. Power off the system and unplug the power cord(s).
2. Open the system chassis and access the “BIOS Recovery” jumper block.
3. Move the “BIOS Recovery” jumper from pins 1–2 (default) to pins 2–3 (BIOS recovery position).
4. Close the system chassis, plug in the power cord(s) and power on the system. The system
automatically boots to the EFI shell.
5. Update the BIOS using the standard BIOS update instructions provided with the firmware update
package.
6. After the BIOS update has successfully completed, power off the system and unplug the power
cord(s).
7. Open the system chassis and access the “BIOS Recovery” jumper.
8. Move the “BIOS Recovery” jumper back to pins 1–2 (default).
9. Close the system chassis, plug in the power cord(s) and power on the system. During POST, press
<F2> to access the BIOS setup utility to configure and save desired BIOS options.

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9. Server Board and Essential System Component Installation

and Removal
This chapter provides instructions for installation and removal of the following components:
• I/O Shield
• Server board
• Processor
• Memory (DIMMs)
• SATA drives
• System fans

Before You Begin

Before working with your server board, observe the safety and ESD precautions found in the Product Safety
Overview section at the beginning of this manual.

Perform the following steps prior to install the server board into a chassis.
1. Make sure the selected chassis supports the Micro ATX board form factor.
2. Make sure the selected chassis has the necessary standoffs installed. These standoffs are usually metal
and are gold in color. Intel recommends using metal standoffs with screws that will fasten the server
board more securely in place. To confirm standoff placement, lay the server board inside the chassis and
align the mounting holes of the server board to the standoffs inside the chassis. Figure 19 shows the
location of the server board mounting holes. Some chassis include plastic standoffs instead of metal
ones.

Figure 19. Server board mounting hole location

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9.1 I/O Shield Installation / Removal

The included I/O shield is designed to be installed from the inside of the chassis, and it must be installed prior to
installing the server board. The procedures shown in this section illustrate the installation in a pedestal chassis, but can
be applied to other chassis types, provided the chassis has a matching I/O shield brace.

Caution: The I/O Shield includes a conductive gasket to protect the board and other system components
from Electrostatic discharges (ESD). Do not damage or remove the gasket from the I/O shield.

Installing I/O Shield

Figure 20. Installing the I/O shield

1. From the chassis inner side, align the I/O shield with the chassis rear I/O brace.
2. Press the I/O shield firmly to the chassis rear I/O brace until it clicks into place.
Note: To make the process easier, install one end of the I/O shield first and press (see letter A). Make
sure the I/O shield is correctly aligned to the chassis I/O brace (see letter B).
3. Complete the process by pressing the other end (see letter C).

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Removing I/O Shield

Figure 21. Removing the I/O shield

If the server board is installed, remove it by following the steps in Section 9.3.
1. From the chassis outer side, push firmly one end of the I/O shield to the inner part of the chassis rear
I/O brace (see letter A).
2. Once one end is released from the chassis I/O brace (see Letter B), pull it from the inside of the
chassis to release it (see letter C).

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9.2 Installing the Server Board

The instructions in this section describe the process of installing the server board in a chassis. The process
described is for reference purposes only. Refer to the selected chassis documentation to determine if
additional tools or steps are required.
Required Tools and Supplies
• Anti-static wrist strap and conductive foam pad (recommended)
• Screwdriver – Refer to the selected chassis documentation to determine the specific head required

1. Verify that all cables are clear of the area in which the server board will be installed.
2. Remove the server board from its packaging.
3. Carefully lower the server board into the chassis ensuring that the mounting holes are aligned with the
standoffs on the chassis.
4. Using a screwdriver, secure the server board with eight screws.

System Integration Guidance

The server board includes two power connectors labeled “PWR1” and “PWR2” that are required to be
connected to power for the server board to boot correctly. Select a power supply that includes power
harnesses for both connectors and the selected peripherals.

9.3 Server Board Removal

The instructions in this section describe the process for removing the server board from a chassis. The
process described is for reference purposes only. Refer to the selected chassis documentation to determine
if additional tools or steps are required.
Required Tools and Supplies
• Anti-static wrist strap and conductive foam pad (recommended)
• Screwdriver – Refer to the selected chassis documentation to determine the specific head required

1. Power off the system and remove the power cord(s).

2. Disconnect all externally attached cables.
3. Open the system chassis.
4. If present, remove any PCIe* add-in cards installed.
5. Disconnect and clear from the server board area all cables attached to connectors on the server board.
6. Remove the processor heat sink (see Section 9.6).
7. Remove the processor (see Section 9.7).
8. Remove all DIMMs (see Section 9.9).
9. Using a screwdriver, remove the eight screws used to secure the server board to the chassis.
10. Carefully lift the server board from the chassis and place it into an anti-static bag.

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9.4 Installing the Processor

Required Tools and Supplies
• Anti-static wrist strap and conductive foam pad (recommended)

Figure 22. Removing the socket protection cap

1. Remove the plastic socket protection cap.

Note: The plastic socket protection cap should be saved and re-used should the processor need to be
removed at any time in the future.

Figure 23. Opening the socket lever

2. Release the socket lever from the processor load plate by pushing down (see letter A), sliding it under the
load plate notch (see letter B) and lifting it up (see letter C).

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Figure 24. Opening the processor load plate

3. Lift open the processor load plate.

CAUTION: The pins inside the processor socket are extremely sensitive. Other than the processor, no object
should make contact with the pins inside the processor socket. A damaged processor socket pin will render
the socket inoperable and will produce erroneous processor or other system errors if used.

NOTE: The underside of the processor has components that may damage the socket pins if installed
improperly. The processor must align correctly with the socket opening before installation. Do not drop the
processor into the socket!

Figure 25. Installing the processor

4. Remove processor from its packaging. If present, carefully remove the protective cover from the bottom
side of the processor, taking care not to touch any processor contacts. Orient the processor with the
socket so that the gold key on it is aligned to the mark on the socket.

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Figure 26. Closing the load plate

5. Carefully lower down the load plate over the processor.

Figure 27. Closing the socket lever

6. Lock down the load plate with the locking lever by lowering it down (see letter A) and sliding it under the
notch in the load plate (see letter B).

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9.5 Processor Heat Sink Installation

The instructions in this section describe the process of installing a processor heat sink. The process
described is for reference purposes only. The selected heat sink to install on the server board may be
different.

Required Tools and Supplies

• Anti-static wrist strap and conductive foam pad (recommended)
• Phillips* head screwdriver

If present, remove the protective cover from the bottom of the heatsink to expose the thermal interface
material. Make sure the push pins on the heat sink are rotated clock-wise.

Figure 28. Installing the heat sink

1. Place the heat sink on top of the installed processor aligning the 4 plastic pins with the holes in the
server board (see letter A).
2. Push the pins through the holes on the server board doing two opposite corners at a time until they click
into place (see letter B).
3. Tighten the 4 screws on the push pin head using a Phillips head screwdriver.

Figure 29. Connecting the fan cable

4. Connect the fan cable to the 4-pin processor fan connector labeled “CPU Fan” on the server board to
complete the installation.
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9.6 Heat Sink Removal

The instructions in this section describe the process of removing a processor heat sink. The process
described is for reference purposes only. The installed heat sink on the server board may be different.
Required Tools and Supplies
• Anti-static wrist strap and conductive foam pad (recommended)
• Phillips* head screwdriver

Figure 30. Removing the fan cable

1. Remove the fan cable from the 4-pin processor fan connector labeled “CPU Fan” on the server board.

Figure 31. Removing the heat sink

1. Using a Phillips head screwdriver, loosen the screws on the head of the 4 push pins (see letter A).
2. Carefully lift the push pins to detach the heat sink from the server board (see letter B).
3. Lift the heat sink from the server board (see letter C).

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9.7 Removing the Processor

Required Tools and Supplies
• Anti-static wrist strap and conductive foam pad (recommended)
4. Unlatch the processor load plate (see Section 9.3 step 2).
5. Lift open the load plate (see Section 9.3 step 3).
6. Remove the processor by carefully lifting it out of the socket, taking care not to drop the processor as well
as not touching any pins inside the socket.
7. If a replacement processor is not being installed, install the socket protection cap.

9.8 Memory (DIMM) Installation

Figure 32. DIMM installation

1. Locate the DIMM slot for installation. Ensure that the DIMM ejection tabs at both ends of the DIMM slot
are pushed outward to the open position (see Letter A).
2. Carefully unpack the DIMM, taking care to only handle the device by its outer edges.
3. Align the notch at the bottom edge of the DIMM with the key in the DIMM slot (see Letter B).
4. Insert the DIMM into the slot (see Letter C) pushing down on the DIMM, until the ejection tabs snap into
place (see Letter D). Ensure that the ejection tabs are firmly in place (see Letter E).

9.9 Memory (DIMM) Removal

Figure 33. DIMM removal

1. Identify and locate the faulty DIMM. Ensure that the ejection tabs of adjacent DIMM slots are closed.
2. Open the DIMM ejection tabs at both ends of the selected DIMM slot (see Letter A). The DIMM will slightly
lift from the slot.
3. Holding the DIMM by its edges, lift it away from the slot (see Letter B).

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9.10 Connecting SATA Drives

This section describes the process of attaching SATA power and data cables (not included) when connecting
SATA drives to the server board.

Figure 34. Attaching SATA cables

1. Connect one end of the SATA data cable connector to the drive (see letter A).
2. Connect the other end of the SATA data cable to one of the SATA ports on the board (see letter B). See
Section 7.2.1 for details on port location.
3. Connect the SATA power cable to the power connector of the drive (see letter C).
4. Connect the 4-pin power connector to the system power supply (see letter D).

The server board does not include power connectors for SATA drives. Power for SATA drives must be
provided through a cable harness (not included) routed to the system power supply.

9.11 Removing SATA Drives

This section describes the process of detaching SATA power and data cables (not included) when detaching
SATA drives from the server board.

Figure 35. Removing SATA cables

1. Remove the end of the SATA data cable connected to the drive (see letter A).
Skip to step 3 if a replacement drive is being installed.
2. Remove the end of the SATA data cable from the server board (see letter B).
3. Remove the SATA power cable from the power connector of the drive (see letter C).
Skip step 4 if a replacement drive is being installed.
4. Remove the 4-pin power connector to the system power supply (see letter D).
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9.12 Connecting System Fans

The instructions in this section describe the process of attaching system fans to the server board. The
process described is for reference purposes only. Refer to the selected chassis documentation to determine
if additional tools or steps are required.
Required Tools and Supplies
• Anti-static wrist strap and conductive foam pad (recommended)

The server board includes five 4-pin system fan connectors labeled SYS_FAN_# (1-5). Figure 36 shows the
location of the connectors on the board.

Figure 36. System fan connector identification

Figure 37. Connecting system fan cables

Connect the system fan cable to the 4-pin connector on the server board as shown in Figure 37.
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9.13 Disconnecting System Fans

The instructions in this section describe the process of disconnecting system fans from the server board. The
process described is for reference purposes only. Refer to the selected chassis documentation to determine
if additional tools or steps are required.
Required Tools and Supplies
• Anti-static wrist strap and conductive foam pad (recommended)

Figure 38. Removing system fan cables

Locate and remove the fan cable from the 4-pin connector on the server board as shown in Figure 38.

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Appendix A. Usage Tips

When installing add-in cards, find the appropriate slot for the add-in card and insert the card firmly. Do not
force any add-in cards into any slots if they do not seat in place. It is recommended to try using another slot
or a different card rather than damaging both the server board and the add-in card.
It is recommended to install add-in cards in a staggered manner rather than making them directly adjacent to
each other. This approach allows air to circulate within the chassis more easily and improves cooling for all
installed devices.

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Appendix B. Getting Help

To obtain support for an issue with the server system, follow these steps:
1. Visit the following Intel support web page: http://www.intel.com/support/
This web page provides 24x7 support when you need it to get the latest and most complete technical
support information on all Intel® Server Products and Solutions. Information available at the support
site includes:
• Latest BIOS, firmware, drivers and utilities
• Product documentation, setup and service guides
• Full product specifications, technical advisories and errata
• Compatibility documentation for memory, hardware add-in cards, and operating systems
• Server and chassis accessory parts list for ordering upgrades or spare parts
• A searchable knowledge base to search for product information throughout the support site

2. If a solution cannot be found at Intel’s support site, send an email to Intel’s technical support center
using the online form available at:
http://www.intel.com/p/en_US/support/contactsupport
3. Lastly, contact an Intel support representative using one of the support phone numbers available at
http://www.intel.com/support/feedback.htm?group=server (charges may apply).
Intel also offers Channel Program members around-the-clock 24x7 technical phone support on Intel® server
boards, server chassis, server RAID controller cards, and Intel® Server Management at:
http://www.intel.com/reseller/.

Note: Access to the 24x7 number requires a login to the reseller site.

Warranty Information
To obtain warranty information, visit http://www.intel.com/p/en_US/support/warranty.

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Appendix C. POST Code Errors

The POST code checkpoints are the largest set of checkpoints during the BIOS pre-boot process. In the
Intel® Server Board M10JNP2SB the POST codes are visible on the lower right part of the screen during
POST. The following table describes the type of checkpoints that may occur during the POST portion of the
BIOS:

Checkpoint Ranges

Status Code Range Description

0x01 – 0x0B SEC execution

0x0C – 0x0F SEC errors

0x10 – 0x2F PEI execution up to and including memory detection

0x30 – 0x4F PEI execution after memory detection

0x50 – 0x5F PEI errors

0x60 – 0x8F DXE execution up to Boot Device Selection (BDS)

0x90 – 0xCF BDS execution

0xD0 – 0xDF DXE errors

0xE0 – 0xE8 S3 Resume (PEI)

0xE9 – 0xEF S3 Resume errors (PEI)

0xF0 – 0xF8 Recovery (PEI)

0xF9 – 0xFF Recovery errors (PEI)

Standard Checkpoints
SEC Phase

Status
Description
Code

0x00 Not used

Progress Codes

0x01 Power on. Reset type detection (soft/hard).

0x02 Application Processor(s) (AP) initialization before microcode loading

0x03 North Bridge initialization before microcode loading

0x04 South Bridge initialization before microcode loading

0x05 OEM initialization before microcode loading

0x06 Microcode loading

0x07 AP initialization after microcode loading

0x08 North Bridge initialization after microcode loading

0x09 South Bridge initialization after microcode loading

0x0A OEM initialization after microcode loading

0x0B Cache initialization

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SEC Error Codes

0x0C –
Reserved for future AMI SEC error codes
0x0D

0x0E Microcode not found

0x0F Microcode not found

SEC Beep Codes

None

Table 27. PEI phase

Status Code Description

Progress Codes

0x10 PEI Core is started

0x11 Pre-memory CPU initialization is started

0x12 Pre-memory CPU initialization (CPU module specific)

0x13 Pre-memory CPU initialization (CPU module specific)

0x14 Pre-memory CPU initialization (CPU module specific)

0x15 Pre-memory North Bridge initialization is started

0x16 Pre-Memory North Bridge initialization (North Bridge module specific)

0x17 Pre-memory North Bridge initialization (North Bridge module specific)

0x18 Pre-Memory North Bridge initialization (North Bridge module specific)

0x19 Pre-memory South Bridge initialization is started

0x1A Pre-Memory South Bridge initialization (South Bridge module specific)

0x1B Pre-memory South Bridge initialization (South Bridge module specific)

0x1C Pre-Memory South Bridge initialization (South Bridge module specific)

0x1D – 0x2A OEM pre-memory initialization codes

0x2B Memory initialization. Serial Presence Detect (SPD) data reading

0x2C Memory initialization. Memory presence detection

0x2D Memory initialization. Programming memory timing information

0x2E Memory initialization. Configuring memory

0x2F Memory initialization (other)

0x30 Reserved for ASL (see ASL Status Codes section below)

0x31 Memory Installed

0x32 CPU post-memory initialization is started

0x33 CPU post-memory initialization. Cache initialization

0x34 CPU post-memory initialization. Application Processor(s) (AP) initialization

0x35 CPU post-memory initialization. Boot Strap Processor (BSP) selection

0x36 CPU post-memory initialization. System Management Mode(SMM) initialization

0x37 Post-Memory North Bridge initialization is started

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Status Code Description

0x38 Post-Memory North Bridge initialization (North Bridge module specific)

0x39 Post-Memory North Bridge initialization (North Bridge module specific)

0x3A Post-Memory North Bridge initialization (North Bridge module specific)

0x3B Post-Memory South Bridge initialization is started

0x3C Post-Memory South Bridge initialization (South Bridge module specific)

0x3D Post-Memory South Bridge initialization (South Bridge module specific)

0x3E Post-Memory South Bridge initialization (South Bridge module specific)

0x3F – 0x4E OEM post memory initialization codes

0x4F DXE IPL is started

PCI Error Codes

0x50 Memory initialization error. Invalid memory type or incompatible memory speed

0x51 Memory initialization error. SPD reading has failed

0x52 Memory initialization error. Invalid memory size or memory modules do not match

0x53 Memory initialization error. No usable memory detected

0x54 Unspecified memory initialization error

0x55 Memory not installed

0x56 Invalid CPU type or speed

0x57 CPU mismatch

0x58 CPU self test failed or possible CPU cache error

0x59 CPU microcode is not found or microcode update is failed

0x5A Internal CPU error

0x5B Reset PPI is not available

0x5C – 0x5F Reserved for future AMI error codes

S3 Resume Progress Codes

0xE0 S3 Resume is started (S3 Resume PPI is called by the DXE IPL)

0xE1 S3 Boot Script execution

0xE2 Video repost

0xE3 OS S3 wake vector call

0xE4 – 0xE7 Reserved for future AMI progress codes

S3 Resume Error Codes

0xE8 S3 Resume Failed

0xE9 S3 Resume PPI not Found

0xEA S3 Resume Boot Script Error

0xEB S3 OS Wake Error

0xEC – 0xEF Reserved for future AMI error codes

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Recovery Progress Codes

0xF0 Recovery condition triggered by firmware (Auto recovery)

0xF1 Recovery condition triggered by user (Forced recovery)

0xF2 Recovery process started

0xF3 Recovery firmware image is found

0xF4 Recovery firmware image is loaded

0xF5 –
Reserved for future AMI progress codes
0xF7

Recovery Error Codes

0xF8 Recovery PPI is not available

0xF9 Recovery capsule is not found

0xFA Invalid recovery capsule

0xFB –
Reserved for future AMI error codes
0xFF

PEI Beep Codes

# of Beeps Description

1
Memory not installed
(repeatedly)

Memory was installed twice (InstallPEIMemory routine in PEI Core

1
called twice)

2 Recovery started

3 DXEIPL was not found

3 DXE Core Firmware Volume was not found

4 Recovery failed

4 S3 Resume failed

7 Reset PPI is not available

DXE Phase

Status Code Description

0x60 DXE Core is started

0x61 NVRAM initialization

0x62 Installation of the South Bridge Runtime Services

0x63 CPU DXE initialization is started

0x64 CPU DXE initialization (CPU module specific)

0x65 CPU DXE initialization (CPU module specific)

0x66 CPU DXE initialization (CPU module specific)

0x67 CPU DXE initialization (CPU module specific)

0x68 PCI host bridge initialization

0x69 North Bridge DXE initialization is started

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Status Code Description

0x6A North Bridge DXE SMM initialization is started

0x6B North Bridge DXE initialization (North Bridge module specific)

0x6C North Bridge DXE initialization (North Bridge module specific)

0x6D North Bridge DXE initialization (North Bridge module specific)

0x6E North Bridge DXE initialization (North Bridge module specific)

0x6F North Bridge DXE initialization (North Bridge module specific)

0x70 South Bridge DXE initialization is started

0x71 South Bridge DXE SMM initialization is started

0x72 South Bridge devices initialization

0x73 South Bridge DXE initialization (South Bridge module specific)

0x74 South Bridge DXE initialization (South Bridge module specific)

0x75 South Bridge DXE initialization (South Bridge module specific)

0x76 South Bridge DXE initialization (South Bridge module specific)

0x77 South Bridge DXE initialization (South Bridge module specific)

0x78 ACPI module initialization

0x79 CSM initialization

0x7A – 0x7F Reserved for future AMI DXE codes

0x80 – 0x8F OEM DXE initialization codes

0x90 Boot Device Selection (BDS) phase is started

0x91 Driver connecting is started

0x92 PCI Bus initialization is started

0x93 PCI Bus Hot Plug Controller initialization

0x94 PCI Bus Enumeration

0x95 PCI BUS Request Resources

0x96 PCI Bus Assign Resources

0x97 Console Output devices connect

0x98 Console Input devices connect

0x99 Super IO initialization

0x9A USB initialization is started

0x9B USB Reset

0x9C USB Detect

0x9D USB Enable

0x9E -0x9F Reserved for future AMI codes

0xA0 IDE initialization is started

0xA1 IDE Reset

0xA2 IDE Detect

0xA3 IDE Enable

0xA4 SCSI initialization is started

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Status Code Description

0xA5 SCSI Reset

0xA6 SCSI Detect

0xA7 SCSI Enable

0xA8 Setup Verifying Password

0xA9 Start of Setup

0xAA Reserved for ASL (see ASL Status Codes section below)

0xAB Setup Input Wait

0xAC Reserved for ASL (see ASL Status Codes section below)

0xAD Ready To Boot event

0xAE Legacy Boot event

0xAF Exit Boot Services event

0xB0 Runtime Set Virtual Address MAP Begin

0xB1 Runtime Set Virtual Address MAP End

0xB2 Legacy Option ROM initialization

0xB3 System Reset

0xB4 USB hot plug

0xB5 PCI bus hot plug

0xB6 Clean-up of NVRAM

0xB7 Configuration Reset (reset of NVRAM settings)

0xB8 – 0xBF Reserved for future AMI codes

0xC0 – 0xCF OEM BDS initialization codes

DXE Error Codes

0xD0 CPU initialization error

0xD1 North Bridge initialization error

0xD2 South Bridge initialization error

0xD3 Some of the Architectural Protocols are not available

0xD4 PCI resource allocation error. Out of Resources

0xD5 No Space for Legacy Option ROM

0xD6 No Console Output Devices are found

0xD7 No Console Input Devices are found

0xD8 Invalid password

0xD9 Error loading Boot Option (LoadImage returned error)

0xDA Boot Option is failed (StartImage returned error)

0xDB Flash update is failed

0xDC Reset protocol is not available

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DXE Beep Codes

# of Beeps Description

1 Invalid password

4 Some of the Architectural Protocols are not available

5 No Console Output Devices are found

5 No Console Input Devices are found

6 Flash update is failed

7 Reset protocol is not available

8 Platform PCI resource requirements cannot be met

ACPI/ASL Checkpoints

Status
Description
Code

0x01 System is entering S1 sleep state

0x02 System is entering S2 sleep state

0x03 System is entering S3 sleep state

0x04 System is entering S4 sleep state

0x05 System is entering S5 sleep state

0x10 System is waking up from the S1 sleep state

0x20 System is waking up from the S2 sleep state

0x30 System is waking up from the S3 sleep state

0x40 System is waking up from the S4 sleep state

System has transitioned into ACPI mode. Interrupt controller is in PIC

0xAC
mode.

System has transitioned into ACPI mode. Interrupt controller is in

0xAA
APIC mode.

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Appendix D. Additional References

Document Title Document Classification

Intel® Server Board M10JNP2SB Configuration Guide Public

Intel® Server Board M10JNP2SB BMC and EWS user guide Public

Intel® Server Board M10JNP2SB Bios Setup Guide Public

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Appendix E. Safety Instructions

WARNING: English (US)

The power supply in this product contains no user-serviceable parts. There may be more
than one supply in this product. Refer servicing only to qualified personnel.

Do not attempt to modify or use the supplied AC power cord if it is not the exact type
required. A product with more than one power supply will have a separate AC power cord
for each supply.

The power button on the system does not turn off system AC power. To remove AC
power from the system, you must unplug each AC power cord from the wall outlet or
power supply.
The power cord(s) is considered the disconnect device to the main (AC) power. The
socket outlet that the system plugs into shall be installed near the equipment and shall
be easily accessible.

SAFETY STEPS: Whenever you remove the chassis covers to access the inside of the
system, follow these steps:
1. Turn off all peripheral devices connected to the system.
2. Turn off the system by pressing the power button.
3. Unplug all AC power cords from the system or from wall outlets.
4. Label and disconnect all cables connected to I/O connectors or ports on the back of
the system.
5. Provide some electrostatic discharge (ESD) protection by wearing an antistatic wrist
strap attached to chassis ground of the system—any unpainted metal surface—when
handling components.
6. Do not operate the system with the chassis covers removed.

After you have completed the six SAFETY steps above, you can remove the system
covers. To do this:
1. Unlock and remove the padlock from the back of the system if a padlock has been
installed.
2. Remove and save all screws from the covers.
3. Remove the covers.

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For proper cooling and airflow, always reinstall the chassis covers before turning on the
system. Operating the system without the covers in place can damage system parts. To
install the covers:
1. Check first to make sure you have not left loose tools or parts inside the system.
2. Check that cables, add-in boards, and other components are properly installed.
3. Attach the covers to the chassis with the screws removed earlier and tighten them
firmly.
4. Insert and lock the padlock to the system to prevent unauthorized access inside the
system.
5. Connect all external cables and the AC power cord(s) to the system.

A microprocessor and heat sink may be hot if the system has been running. Also, there
may be sharp pins and edges on some board and chassis parts. Contact should be made
with care. Consider wearing protective gloves.

Danger of explosion if the battery is incorrectly replaced. Replace only with the same or
equivalent type recommended by the equipment manufacturer. Dispose of used batteries
according to manufacturer’s instructions.

The system is designed to operate in a typical office environment. Choose a site that is:
• Clean and free of airborne particles (other than normal room dust).
• Well ventilated and away from sources of heat including direct sunlight.
• Away from sources of vibration or physical shock.
• Isolated from strong electromagnetic fields produced by electrical devices.
• In regions that are susceptible to electrical storms, we recommend you plug your
system into a surge suppresser and disconnect telecommunication lines to your
modem during an electrical storm.
• Provided with a properly grounded wall outlet.
• Provided with sufficient space to access the power supply cord(s), because they serve
as the product’s main power disconnect.

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AVERTISSEMENT: Français
Le bloc d'alimentation de ce produit ne contient aucune pièce pouvant être réparée par
l'utilisateur. Ce produit peut contenir plus d'un bloc d'alimentation. Veuillez contacter un
technicien qualifié en cas de problème.

Ne pas essayer d'utiliser ni modifier le câble d'alimentation CA fourni, s'il ne correspond

pas exactement au type requis. Le nombre de câbles d'alimentation CA fournis
correspond au nombre de blocs d'alimentation du produit.

Notez que le commutateur CC de mise sous tension /hors tension du panneau avant
n'éteint pas l'alimentation CA du système. Pour mettre le système hors tension, vous
devez débrancher chaque câble d'alimentation de sa prise.

CONSIGNES DE SÉCURITÉ: Lorsque vous ouvrez le boîtier pour accéder à l’intérieur du

système, suivez les consignes suivantes:
1. Mettez hors tension tous les périphériques connectés au système.
2. Mettez le système hors tension en mettant l’interrupteur général en position OFF
(bouton-poussoir).
3. Débranchez tous les cordons d’alimentation c.a. du système et des prises murales.
4. Identifiez et débranchez tous les câbles reliés aux connecteurs d’E-S ou aux accès
derrière le système.
5. Pour prévenir les décharges électrostatiques lorsque vous touchez aux composants,
portez une bande antistatique pour poignet et reliez-la à la masse du système (toute
surface métallique non peinte du boîtier).
6. Ne faites pas fonctionner le système tandis que le boîtier est ouvert.

Une fois TOUTES les étapes précédentes accomplies, vous pouvez retirer les panneaux
du système. Procédez comme suit:
1. Si un cadenas a été installé sur à l’arrière du système, déverrouillez-le et retirez-le.
2. Retirez toutes les vis des panneaux et mettez-les dans un endroit sûr.
3. Retirez les panneaux.

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Afin de permettre le refroidissement et l’aération du système, réinstallez toujours les

panneaux du boîtier avant de mettre le système sous tension. Le fonctionnement du
système en l’absence des panneaux risque d’endommager ses pièces. Pour installer les
panneaux, procédez comme suit:
1. Assurez-vous de ne pas avoir oublié d’outils ou de pièces démontées dans le système.
2. Assurez-vous que les câbles, les cartes d’extension et les autres composants sont bien
installés.
3. Revissez solidement les panneaux du boîtier avec les vis retirées plus tôt.
4. Remettez le cadenas en place et verrouillez-le afin de prévenir tout accès non autorisé
à l’intérieur du système.
5. Rebranchez tous les cordons d’alimentation c. a. et câbles externes au système.

Le microprocesseur et le dissipateur de chaleur peuvent être chauds si le système a été

sous tension. Faites également attention aux broches aiguës des cartes et aux bords
tranchants du capot. Nous vous recommandons l'usage de gants de protection.

Danger d'explosion si la batterie n'est pas remontée correctement. Remplacer

uniquement avec une batterie du même type ou d'un type équivalent recommandé par le
fabricant. Disposez des piles usées selon les instructions du fabricant.

Le système a été conçu pour fonctionner dans un cadre de travail normal. L'emplacement
choisi doit être:
• Propre et dépourvu de poussière en suspension (sauf la poussière normale).
• Bien aéré et loin des sources de chaleur, y compris du soleil direct.
• A l'abri des chocs et des sources de vibrations.
• Isolé de forts champs électromagnétiques générés par des appareils électriques.
• Dans les régions sujettes aux orages magnétiques il est recommandé de brancher
votre système à un suppresseur de surtension, et de débrancher toutes les lignes de
télécommunications de votre modem durant un orage.
• Muni d'une prise murale correctement mise à la terre.
• Suffisamment spacieux pour vous permettre d'accéder aux câbles d'alimentation
(ceux-ci étant le seul moyen de mettre le système hors tension).

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WARNUNG: Deutsch
Benutzer können am Netzgerät dieses Produkts keine Reparaturen vornehmen. Das
Produkt enthält möglicherweise mehrere Netzgeräte. Wartungsarbeiten müssen von
qualifizierten Technikern ausgeführt werden.

Versuchen Sie nicht, das mitgelieferte Netzkabel zu ändern oder zu verwenden, wenn es
sich nicht genau um den erforderlichen Typ handelt. Ein Produkt mit mehreren
Netzgeräten hat für jedes Netzgerät ein eigenes Netzkabel.

Der Wechselstrom des Systems wird durch den Ein-/Aus-Schalter für Gleichstrom nicht
ausgeschaltet. Ziehen Sie jedes Wechselstrom-Netzkabel aus der Steckdose bzw. dem
Netzgerät, um den Stromanschluß des Systems zu unterbrechen.

SICHERHEISMASSNAHMEN: Immer wenn Sie die Gehäuseabdeckung abnehmen um an

das Systeminnere zu gelangen, sollten Sie folgende Schritte beachten:
1. Schalten Sie alle an Ihr System angeschlossenen Peripheriegeräte aus.
2. Schalten Sie das System mit dem Hauptschalter aus.
3. Ziehen Sie den Stromanschlußstecker Ihres Systems aus der Steckdose.
4. Auf der Rückseite des Systems beschriften und ziehen Sie alle Anschlußkabel von den
I/O Anschlüssen oder Ports ab.
5. Tragen Sie ein geerdetes Antistatik Gelenkband, um elektrostatische Ladungen (ESD)
über blanke Metallstellen bei der Handhabung der Komponenten zu vermeiden.
6. Schalten Sie das System niemals ohne ordnungsgemäß montiertes Gehäuse ein.

Nachdem Sie die oben erwähnten ersten sechs SICHERHEITSSCHRITTE durchgeführt

haben, können Sie die Abdeckung abnehmen, indem Sie:
1. Öffnen und entfernen Sie die Verschlußeinrichtung (Padlock) auf der Rückseite des
Systems, falls eine Verschlußeinrichtung installiert ist.
2. Entfernen Sie alle Schrauben der Gehäuseabdeckung.
3. Nehmen Sie die Abdeckung ab.

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Zur ordnungsgemäßen Kühlung und Lüftung muß die Gehäuseabdeckung immer wieder
vor dem Einschalten installiert werden. Ein Betrieb des Systems ohne angebrachte
Abdeckung kann Ihrem System oder Teile darin beschädigen. Um die Abdeckung wieder
anzubringen:
1. Vergewissern Sie sich, daß Sie keine Werkzeuge oder Teile im Innern des Systems
zurückgelassen haben.
2. Überprüfen Sie alle Kabel, Zusatzkarten und andere Komponenten auf
ordnungsgemäßen Sitz und Installation.
3. Bringen Sie die Abdeckungen wieder am Gehäuse an, indem Sie die zuvor gelösten
Schrauben wieder anbringen. Ziehen Sie diese gut an.
4. Bringen Sie die Verschlußeinrichtung (Padlock) wieder an und schließen Sie diese, um
ein unerlaubtes Öffnen des Systems zu verhindern.
5. Schließen Sie alle externen Kabel und den AC Stromanschlußstecker Ihres Systems
wieder an.

Der Mikroprozessor und der Kühler sind möglicherweise erhitzt, wenn das System in
Betrieb ist. Außerdem können einige Platinen und Gehäuseteile scharfe Spitzen und
Kanten aufweisen. Arbeiten an Platinen und Gehäuse sollten vorsichtig ausgeführt
werden. Sie sollten Schutzhandschuhe tragen.

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf
nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des
Herstellers entsprechend.

Das System wurde für den Betrieb in einer normalen Büroumgebung entwickelt. Der
Standort sollte:
• sauber und staubfrei sein (Hausstaub ausgenommen);
• gut gelüftet und keinen Heizquellen ausgesetzt sein (einschließlich direkter
Sonneneinstrahlung);
• keinen Erschütterungen ausgesetzt sein;
• keine starken, von elektrischen Geräten erzeugten elektromagnetischen Felder
aufweisen;
• in Regionen, in denen elektrische Stürme auftreten, mit einem
Überspannungsschutzgerät verbunden sein; während eines elektrischen Sturms sollte
keine Verbindung der Telekommunikationsleitungen mit dem Modem bestehen;
• mit einer geerdeten Wechselstromsteckdose ausgerüstet sein;
• über ausreichend Platz verfügen, um Zugang zu den Netzkabeln zu gewährleisten, da
der Stromanschluß des Produkts hauptsächlich über die Kabel unterbrochen wird.

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AVVERTENZA: Italiano
Rivolgersi ad un tecnico specializzato per la riparazione dei componenti
dell'alimentazione di questo prodotto. È possibile che il prodotto disponga di più fonti di
alimentazione.

Non modificare o utilizzare il cavo di alimentazione in c.a. fornito dal produttore, se non
corrisponde esattamente al tipo richiesto. Ad ogni fonte di alimentazione corrisponde un
cavo di alimentazione in c.a. separato.

L’interruttore attivato/disattivato nel pannello anteriore non interrompe l’alimentazione

in c.a. del sistema. Per interromperla, è necessario scollegare tutti i cavi di alimentazione
in c.a. dalle prese a muro o dall’alimentazione di corrente.

PASSI DI SICUREZZA: Qualora si rimuovano le coperture del telaio per accedere

all’interno del sistema, seguire i seguenti passi:
1. Spegnere tutti i dispositivi periferici collegati al sistema.
2. Spegnere il sistema, usando il pulsante spento/acceso dell’interruttore del sistema.
3. Togliere tutte le spine dei cavi del sistema dalle prese elettriche.
4. Identificare e sconnettere tutti i cavi attaccati ai collegamenti I/O od alle prese
installate sul retro del sistema.
5. Qualora si tocchino i componenti, proteggersi dallo scarico elettrostatico (SES),
portando un cinghia anti-statica da polso che è attaccata alla presa a terra del telaio
del sistema – qualsiasi superficie non dipinta – .
6. Non far operare il sistema quando il telaio è senza le coperture.

Dopo aver seguito i sei passi di SICUREZZA sopracitati, togliere le coperture del telaio del
sistema come seque:
1. Aprire e rimuovere il lucchetto dal retro del sistema qualora ve ne fosse uno installato.
2. Togliere e mettere in un posto sicuro tutte le viti delle coperture.
3. Togliere le coperture.

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 Intel® Server Board M10JNP2SB User Guide

Per il giusto flusso dell’aria e raffreddamento del sistema, rimettere sempre le coperture
del telaio prima di riaccendere il sistema. Operare il sistema senza le coperture al loro
proprio posto potrebbe danneggiare i componenti del sistema. Per rimettere le coperture
del telaio:
1. Controllare prima che non si siano lasciati degli attrezzi o dei componenti dentro il
sistema.
2. Controllare che i cavi, dei supporti aggiuntivi ed altri componenti siano stati installati
appropriatamente.
3. Attaccare le coperture al telaio con le viti tolte in precedenza e avvitarle strettamente.
4. Inserire e chiudere a chiave il lucchetto sul retro del sistema per impedire l’accesso
non autorizzato al sistema.
5. Ricollegare tutti i cavi esterni e le prolunghe AC del sistema.

Se il sistema è stato a lungo in funzione, il microprocessore e il dissipatore di calore

potrebbero essere surriscaldati. Fare attenzione alla presenza di piedini appuntiti e parti
taglienti sulle schede e sul telaio. È consigliabile l'uso di guanti di protezione.

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.

Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.

Il sistema è progettato per funzionare in un ambiente di lavoro tipo. Scegliere una

postazione che sia:
• Pulita e libera da particelle in sospensione (a parte la normale polvere presente
nell'ambiente).
• Ben ventilata e lontana da fonti di calore, compresa la luce solare diretta.
• Al riparo da urti e lontana da fonti di vibrazione.
• Isolata dai forti campi magnetici prodotti da dispositivi elettrici.
• In aree soggette a temporali, è consigliabile collegare il sistema ad un limitatore di
corrente. In caso di temporali, scollegare le linee di comunicazione dal modem.
• Dotata di una presa a muro correttamente installata.
• Dotata di spazio sufficiente ad accedere ai cavi di alimentazione, i quali rappresentano
il mezzo principale di scollegamento del sistema.

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 Intel® Server Board M10JNP2SB User Guide

ADVERTENCIAS: Español
El usuario debe abstenerse de manipular los componentes de la fuente de alimentación
de este producto, cuya reparación debe dejarse exclusivamente en manos de personal
técnico especializado. Puede que este producto disponga de más de una fuente de
alimentación.

No intente modificar ni usar el cable de alimentación de corriente alterna, si no

corresponde exactamente con el tipo requerido.
El número de cables suministrados se corresponden con el número de fuentes de
alimentación de corriente alterna que tenga el producto.

Nótese que el interruptor activado/desactivado en el panel frontal no desconecta la

corriente alterna del sistema. Para desconectarla, deberá desenchufar todos los cables de
corriente alterna de la pared o desconectar la fuente de alimentación.

INSTRUCCIONES DE SEGURIDAD: Cuando extraiga la tapa del chasis para acceder al

interior del sistema, siga las siguientes instrucciones:
1. Apague todos los dispositivos periféricos conectados al sistema.
2. Apague el sistema presionando el interruptor encendido/apagado.
3. Desconecte todos los cables de alimentación CA del sistema o de las tomas de
corriente alterna.
4. Identifique y desconecte todos los cables enchufados a los conectores E/S o a los
puertos situados en la parte posterior del sistema.
5. Cuando manipule los componentes, es importante protegerse contra la descarga
electrostática (ESD). Puede hacerlo si utiliza una muñequera antiestática sujetada a la
toma de tierra del chasis — o a cualquier tipo de superficie de metal sin pintar.
6. No ponga en marcha el sistema si se han extraído las tapas del chasis.

Después de completar las seis instrucciones de SEGURIDAD mencionadas, ya puede

extraer las tapas del sistema. Para ello:
1. Desbloquee y extraiga el bloqueo de seguridad de la parte posterior del sistema, si se
ha instalado uno.
2. Extraiga y guarde todos los tornillos de las tapas.
3. Extraiga las tapas.

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 Intel® Server Board M10JNP2SB User Guide

Para obtener un enfriamiento y un flujo de aire adecuados, reinstale siempre las tapas del
chasis antes de poner en marcha el sistema. Si pone en funcionamiento el sistema sin las
tapas bien colocadas puede dañar los componentes del sistema. Para instalar las tapas:
1. Asegúrese primero de no haber dejado herramientas o componentes sueltos dentro
del sistema.
2. Compruebe que los cables, las placas adicionales y otros componentes se hayan
instalado correctamente.
3. Incorpore las tapas al chasis mediante los tornillos extraídos anteriormente,
tensándolos firmemente.
4. Inserte el bloqueo de seguridad en el sistema y bloquéelo para impedir que pueda
accederse al mismo sin autorización.
5. Conecte todos los cables externos y los cables de alimentación CA al sistema.

Si el sistema ha estado en funcionamiento, el microprocesador y el disipador de calor

pueden estar aún calientes. También conviene tener en cuenta que en el chasis o en el
tablero puede haber piezas cortantes o punzantes. Por ello, se recomienda precaución y
el uso de guantes protectores.

Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente

pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para
deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

El sistema está diseñado para funcionar en un entorno de trabajo normal. Escoja un lugar:
• Limpio y libre de partículas en suspensión (salvo el polvo normal).
• Bien ventilado y alejado de fuentes de calor, incluida la luz solar directa.
• Alejado de fuentes de vibración.
• Aislado de campos electromagnéticos fuertes producidos por dispositivos eléctricos.
• En regiones con frecuentes tormentas eléctricas, se recomienda conectar su sistema a
un eliminador de sobrevoltaje y desconectar el módem de las líneas de
telecomunicación durante las tormentas.
• Provisto de una toma de tierra correctamente instalada.
• Provisto de espacio suficiente como para acceder a los cables de alimentación, ya que
éstos hacen de medio principal de desconexión del sistema.

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 ‫‪Intel® Server Board M10JNP2SB User Guide‬‬

‫אזהרה‪ :‬עברית‬
‫אספקת החשמל במוצר זה לא מכילה חלקים שניתנים לשירות על ידי משתמש‪ .‬ייתכן שיש יותר ממקור אספקת חשמל‬
‫אחד במוצר זה‪ .‬לקבלת שירות יש לפנות רק אל אנשים המוסמכים לכך‪.‬‬

‫אין לנסות לשנות את כבל החשמל ז"ח המסופק‪ ,‬או לשנותו‪ ,‬אם הוא לא מהסוג המדויק הנדרש‪ .‬למוצר עם יותר ממקור‬
‫אספקת חשמל אחד יצורף כבל חשמל נפרד לכל מקור אספקת חשמל‪.‬‬

‫מתג ההפעלה במערכת לא מכבה את מערכת חשמל ז"ח‪ .‬להסרת חשמל ז"ח מהמערכת‪ ,‬יש לנתק כל כבל חשמל ז"ח‬
‫משקע הקיר או מאספקת החשמל‪.‬‬
‫כבל(י) החשמל נחשב(ים) להתקן(ני) ניתוק מקור אספקת חשמל ז"ח‪ .‬שקע הקיר שאליו מחוברת המערכת יותקן בסמוך‬
‫לציוד ויהיה נגיש בקלות‪.‬‬

‫שלבי בטיחות‪ :‬בכל פעם שמסירים את מכסי המעטפת כדי לגשת לחלק הפנימי של המערכת‪ ,‬יש לבצע את הצעדים הבאים‪:‬‬
‫לכבות את כל ההתקנים ההיקפיים שמחוברים למערכת‪.‬‬ ‫‪.1‬‬
‫לכבות את המערכת על ידי לחיצה על מתג ההפעלה‪.‬‬ ‫‪.2‬‬
‫לנתק את כל כבלי חשמל ז"ח מהמערכת או משקעי הקיר‪.‬‬ ‫‪.3‬‬
‫לתייג את כל הכבלים המחוברים למחברי קלט‪/‬פלט או ליציאות בגב המערכת ולנתק אותם‪.‬‬ ‫‪.4‬‬
‫לספק הגנה מסוימת מפריקות אלקטרוסטטיות )‪ (ESD‬על ידי חבישת רצועת שורש כף יד אנטיסטטית שמחוברת‬ ‫‪.5‬‬
‫להארקת המעטפת של המערכת ‪ -‬כל משטח מתכת לא צבוע ‪ -‬בעת הטיפול ברכיבים‪.‬‬
‫אין להפעיל את המערכת כשמכסי המעטפת מוסרים‪.‬‬ ‫‪.6‬‬

‫לאחר השלמת ששת שלבי הבטיחות לעיל‪ ,‬באפשרותכם להסיר את מכסי המערכת‪ .‬כדי לעשות זאת‪:‬‬
‫‪ .1‬יש לפתוח את המנעול התלוי ולהסירו מגב המערכת אם אכן הותקן בה מנעול תלוי‪.‬‬
‫‪ .2‬יש להסיר את כל הברגים של המכסים ולשמור אותם‪.‬‬
‫‪ .3‬יש להסיר את המכסים‪.‬‬

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 ‫‪Intel® Server Board M10JNP2SB User Guide‬‬

‫לקירור ולזרימת אוויר תקינים‪ ,‬יש תמיד להתקין מחדש את מכסי המעטפת לפני הפעלת המערכת‪ .‬הפעלת המערכת ללא‬
‫המכסים במקומם‪ ,‬עלולה לגרום נזק לחלקי המערכת‪ .‬להתקנת המכסים‪:‬‬
‫יש לבדוק תחילה כדי לוודא שלא נשארו כלים או חלקים רופפים בתוך המערכת‪.‬‬ ‫‪.1‬‬
‫יש לבדוק שהכבלים‪ ,‬הלוחות הנוספים ורכיבים אחרים מותקנים כראוי‪.‬‬ ‫‪.2‬‬
‫יש לחבר את המכסים למעטפת עם הברגים שהוסרו קודם לכן ולהדק אותם בחוזקה למקומם‪.‬‬ ‫‪.3‬‬
‫יש להכניס את מנעול התליה למערכת ולנעול אותו כדי למנוע גישה בלתי מורשית לפנים המערכת‪.‬‬ ‫‪.4‬‬
‫יש לחבר את כל הכבלים החיצוניים ואת כבל(י) חשמל ז"ח למערכת‪.‬‬ ‫‪.5‬‬

‫מעבד המיקרו ומפזר החום עלולים להיות לוהטים כשהמערכת פועלת‪ .‬כמו כן‪ ,‬ייתכנו סיכות וקצוות חדים בחלקי לוח‬
‫ומעטפת שונים‪ .‬יש לגעת בזהירות‪ .‬יש לשקול עטיית כפפות מגן‪.‬‬

‫סכנת פיצוץ אם הסוללה מוחלפת באופן שגוי‪ .‬יש להחליף רק באותו סוג או שווה ערך שמומלץ על ידי יצרן הציוד‪ .‬יש‬
‫להשליך סוללות משומשות על פי הוראות היצרן‪.‬‬

‫המערכת נועדה לפעול בסביבה משרדית טיפוסית‪ .‬יש לבחור אתר שהוא‪:‬‬
‫נקי וחופשי מחלקיקים נישאים באוויר (למעט אבק שקיים באופן רגיל בחדר)‪.‬‬ ‫•‬
‫מאוורר היטב ורחוק ממקורות חום כולל אור שמש ישיר‪.‬‬ ‫•‬
‫יש להרחיק ממקורות רטט או זעזועים פיזיים‪.‬‬ ‫•‬
‫מבודד משדות אלקטרומגנטיים חזקים שנגרמים על ידי מכשירים חשמליים‪.‬‬ ‫•‬
‫באזורים שרגישים לסערות חשמל‪ ,‬אנו ממליצים לחבר את המערכת למדכא נחשול‪ ,‬ובמהלך סערה חשמלית לנתק קווי‬ ‫•‬
‫תקשורת שמחוברים למודם שלכם‪.‬‬
‫בעל שקע קיר מוארק כהלכה‪.‬‬ ‫•‬
‫בעל מספיק מקום לגישה חופשית לכבל(י) החשמל‪ ,‬מכיוון שהוא‪/‬הם משמש(ים) לניתוק רשת החשמל למוצר‪.‬‬ ‫•‬

‫‪71‬‬
 Intel® Server Board M10JNP2SB User Guide

Appendix F. Product Regulatory Information

This product has been evaluated and certified as Information Technology Equipment (ITE), which may be
installed in offices, schools, computer rooms, and similar commercial type locations. The suitability of this
product for other product certification categories and/or environments (such as: medical, industrial,
telecommunications, NEBS, residential, alarm systems, test equipment, etc.), other than an ITE application,
will require further evaluation and may require additional regulatory approvals.
Intel has verified that all L3, L6, and L9 server products1 as configured and sold by Intel to its customers
comply with the requirements for all regulatory certifications defined in the following table. It is the Intel
customer’s responsibility to ensure their final server system configurations are tested and certified to meet
the regulatory requirements for the countries to which they plan to ship and or deploy server systems into.

Intel® Server Board M10JNP2SB NOTES

“Juniper Pass” Intel Project Code Name
L3 – Board Only Product Integration Level
Product family identified
M10JNP2SB
on certification
Regulatory Certification
RCM DoC Australia & New Zealand  
CB Certification & Report (International - report to 

include all CB country national deviations)
China CCC Certification 
CU Certification (Russia/Belarus/Kazakhstan)  
Europe CE Declaration of Conformity  
FCC Part 15 Emissions Verification (USA / Canada)  
Germany GS Certification  
India BIS Certification  
International Compliance – CISPR32 & CISPR24  
Japan VCCI Certification  
Korea KC Certification  
Mexico Certification  
NRTL Certification (USA & Canada)  
South Africa Certification  
Taiwan BSMI Certification  
Ukraine Certification  

Table Key
Not Tested / Not Certified  
Tested / Certified – Limited OEM SKUs only  
Testing / Certification (Planned) (Date) 
Tested / Certified  

1An L9 product is a power-on ready server system with NO operating system installed. An L6 product requires
additional components to be installed in order to make it power-on ready. L3 products are component building block
options that require integration into a chassis to create a functional server system
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 Intel® Server Board M10JNP2SB User Guide

EU Directive 2019/424 (Lot 9)

Beginning on March 1, 2020, an additional component of the European Union (EU) regulatory CE marking
scheme, identified as EU Directive 2019/424 (Lot 9), will go into effect. After this date, all new server systems
shipped into or deployed within the EU must meet the full CE marking requirements including those defined
by the additional EU Lot 9 regulations.
Intel has verified that all L3, L6, and L9 server products2 as configured and sold by Intel to its customers
comply with the full CE regulatory requirements for the given product type, including those defined by EU
Lot 9. It is the Intel customer’s responsibility to ensure their final server system configurations are SPEC®
SERT™ tested and meet the new CE regulatory requirements.

Visit the following website for additional EU Directive 2019/424 (Lot9) information:
https://eur-lex.europa.eu/legal-content/EN/TXT/?uri=CELEX:32019R0424

In compliance with the EU Directive 2019/424 (Lot 9) materials efficiency requirements, Intel makes available
all necessary product collaterals as identified below:

• Product Serviceability Instructions and Product Specifications

o Intel® Server Board M10JNP2SB Technical Product Specification (TPS) – (This document)
o https://www.intel.com/content/www/us/en/support/articles/000055607/server-
products/server-boards.html?wapkw=m10jnp2sb

• System BIOS/Firmware and Security Updates – Intel® Server Board S2600ST family
o System Update Package (SUP) – uEFI only
o Intel® One Boot Flash Update (OFU) – Various OS Support
o https://www.intel.com/content/www/us/en/support/products/197378/server-
products/server-boards/intel-server-board-m10jnp-family.html

• Intel Solid State Drive (SSD) Secure Data Deletion and Firmware Updates
o Note: for system configurations that may be configured with an Intel SSD
o Intel® Solid State Drive Toolbox
o https://downloadcenter.intel.com/download/29205?v=t

• Intel® RAID Controller Firmware Updates and other support collaterals

o Note: for system configurations that may be configured with an Intel® RAID Controller
o https://www.intel.com/content/www/us/en/support/products/43732/server-products/raid-
products.html

2An L9 system configuration is a power-on ready server system with NO operating system installed.
An L6 system configuration requires additional components to be installed in order to make it power-on ready. L3 are
component building block options that require integration into a chassis to create a functional server system
73
 Intel® Server Board M10JNP2SB User Guide

Appendix G. Statement Of Volatility

This appendix describes the volatile and non-volatile components on the Intel® Server Board M10JNP2SB. It
is not the intention of this document to include any components not directly mounted to the server board,
including but not limited to: processors, memory, storage devices, or add-in cards.
The tables in this appendix provide the following data for each identified component.
Component Type
Three types of memory components are used on the server board assembly. These include:
• Non-volatile: Non-volatile memory is persistent, and is not cleared when power is removed from the
system. Non-Volatile memory must be erased to clear data. The exact method of clearing these areas
varies by the specific component. Some areas are required for normal operation of the server, and
clearing these areas may render the server board inoperable.
• Volatile: Volatile memory is cleared automatically when power is removed from the system.
• Battery powered RAM: Battery powered RAM is similar to volatile memory, but is powered by a
battery on the server board. Data in Battery powered Ram is persistent until the battery is removed
from the server board.

Size
The size of each component includes sizes in bits, Kbits, bytes, kilobytes (KB) or megabytes (MB).
Board Location
The physical location of each component is specified in the Board Location column. The board location
information corresponds to information on the silkscreen in the server board.
User Data
The flash components on the server board do not store user data from the operating system. No operating
system level data is retained in any listed components after AC power is removed. The persistence of
information written to each component is determined by its type as described in the table.
Each component stores data specific to its function. Some components may contain passwords that provide
access to that device’s configuration or functionality. These passwords are specific to the device and are
unique and unrelated to operating system passwords. The specific components that may contain password
data are:
BIOS: The BIOS provides the capability to prevent unauthorized users from configuring BIOS settings
when a BIOS password is set. This password is stored in BIOS flash, and is only used to set BIOS
configuration access restrictions.

BMC: The server board supports an Intelligent Platform Management Interface (IPMI) 2.0 conformant
baseboard management controller (BMC). The BMC provides health monitoring, alerting and remote
power control capabilities for the server board. The BMC does not have access to operating system
level data.

The BMC supports the capability for remote software to connect over the network and perform
health monitoring and power control. This access can be configured to require authentication by a
password. If configured, the BMC will maintain user passwords to control this access. These
passwords are stored in the BMC flash.
The server board includes several components that can be used to store data. A list of those components is
included in the following table.
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 Intel® Server Board M10JNP2SB User Guide

Table 28. Server board components

Part Volatility User Data
Size
Type Location Reference Yes No Yes No
SDRAM U11 BMC DDR4 Yes Yes TBD
Flash U12_IC BMC FW No Yes TBD
Flash U7_IC BIOS FW No Yes TBD
LAN1 TBD
U113 LAN1 FW No No
Flash
LAN2 TBD
U115 LAN2 FW No No
Flash
LAN3 TBD
U117 LAN3 FW No No
Flash
LAN4 TBD
U119 LAN4 FW No No
Flash
VR ISL69137I TBD
U193 No No
Controller RAZ-T
VR ISL69137I TBD
U200 No No
Controller RAZ-T
EEPROM U103 MB FRU No No TBD

75
 Intel® Server Board M10JNP2SB User Guide

Glossary
Term Definition
1U One rack unit (1.75 in.)
AC Alternating current
ACPI Advanced configuration and power interface
AES-NI Intel® Advanced Encryption Standard New Instructions
Intel® AMT Intel® Active Management Technology
BDS Boot device selection
BIOS Basic input output system; non-volatile firmware
BMC Baseboard management controller
A boot strap processor that is selected at boot time to be the primary processor in a multi-processor
BSP
system.
Chassis Casing containing the server board, fans and power supply
CMOS Complimentary Metal-oxide-semiconductor
CPU Central processing unit
CSM Compatibility support module
DC Direct current, the flow of electric charge in only one direction.
DIMM Dual inline memory module
Driver execution environment, a component of Intel® Platform Innovation Framework for EFI
DXE
architecture.
ECC Error correction code
EI Enhanced Intel
ESD Electrostatic discharge
FRU Field replaceable unit
GT/s Giga transfers per second
IIO Integrated IO modules
IMC Integrated memory controller, a memory controller integrated into the processor chip
IPL Initial program load
IPMB Intelligent platform management bus
Keyboard, video, and mouse, an attachment that mimics those devices and connects them to a remote
KVM
I/O user.
LAN Local area network
LED Light emitting diode
MAC Media access control
MT/s Mega transfers per second
NIC Network interface card
NMI Non-maskable interrupt
NVRAM Non-volatile random access memory
OEM Original equipment manufacturer
OS Operating system
PCH Platform Controller Hub
PCI Peripheral component interconnect, or CI local bus standard a.k.a. “Conventional PCI”
Peripheral component interconnect express, an updated form of PCI offering better throughput and
PCIe*
error management
PEI Pre EFI initialization, a component of the Intel® Platform Innovation Framework for EFI architecture
PEIM PEI module
POST Power on self test, the BIOS activity from Power On until the OS bot starts
PSU Power supply unit
Redundant Array of Inexpensive Disks. These provide data security by spreading data over multiple
RAID disk drives. RAID 0, RAID 1, RAID 10, and RAID 5 are different patterns of data on varying numbers of
disks to provide varying degrees of security and performance.
RAM Random access memory
RAS Reliability, availability, and serviceability
SATA Serial ATA, a high speed serial data version of the disk ATA interface

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 Intel® Server Board M10JNP2SB User Guide

Term Definition
SCSI Small computer system interface, a connection normally used for disks of various types
SDDC Single device data correction
SIO Super I/o
SMM Server management mode
SPD Serial presence detect
TDP Thermal design power
TPM Trusted platform module
Intel® TXT Intel® Trusted Execution Technology
USB Universal Serial Bus, a standard serial expansion bus meant for connecting peripherals.
VR Voltage regulator
Intel® VT-x Intel® Virtualization Technology

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