5ess2000 Hardware Reference Manual
5ess2000 Hardware Reference Manual
5ESS®-2000 Switch
3B21D Computer Hardware Reference Manual
Document: 235-105-510
Issue Date: July 1999
Issue Number: 3.00A
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However, information is subject to change.
This IP describes certain hardware, software, features, and capabilities of Lucent Technologies products. This IP is
for information purposes; therefore, caution is advised that this IP may differ from any configuration currently
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Interference Information: Part 15 of FCC Rules - Refer to the 5ESS®-2000 Switch Product Specification IP.
Trademarks
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Management organization. Customer-modified hardware and/or software is not covered by this warranty.
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Acknowledgment
1. INTRODUCTION
1.1 PURPOSE
This Hardware Reference Manual describes the 3B21D computer, providing both physical and functional
information. It is part of a documentation set that supports the 3B21D computer. See Section 10 for other Lucent
Technologies documents that support the 3B21D computer.
Along with other network switching products, the 5ESS® switch product line is being positioned to support Service
Net-2000 (SN-2000). Therefore, the name of the switch has been changed to 5ESS®-2000 switch. However, these
name changes have not been carried forward into software-influenced items, such as input/output messages,
Master Control Center screens, Recent Change/Verify screens, etc.
This manual is reissued to add information about the UN376E and UN597 circuit packs, and is a complete update
for the 5E13 software release. And Chapter 4 was reorganized into three chapters. (See Section 1.3 DOCUMENT
ORGANIZATION.)
The Lucent Technologies Network Systems organization reserves the right to revise this document for any reason.
The reasons for revision will include, but are not limited to: conformity with standards declared by ANSI, the
Electronic Industrial Association (EIA), International Telecommunications Union-Telecommunications
Standardization Sector (ITU-T), International Telegraph and Telephone Consultative Committee (CCITT),
International Standards Organization (ISO), or similar agencies; advances in the state of the technical arts; or
changes in the requirements of communications systems or equipment.
This manual is organized into the following sections and reference information (Table of Contents, Glossary, and
Index). Specific topics are referenced in the "Table of Contents" and in the "Index" with page number locations. The
"Glossary" defines the terms used in this manual.
This manual provides physical and functional descriptions of the 3B21D computer. The remainder of this document
is organized into the following sections:
Section 6 , Control Unit Functional Descriptions MAS, MASU, DMA, DSCH, UC, and EX
Section 7 , Peripheral Device Functional Descriptions DFC, IOP, PC, and PSSDB
Glossary
Index.
The producers of this manual are constantly striving to improve quality and usability. The user feedback form is
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missing or your comments will not fit, you can write to the following address:
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Please include the issue number and/or date of the manual, your complete mailing address, and telephone number.
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See Support Telephone Numbers on the back of the front cover page of this document.
1.5 DISTRIBUTION
This manual is distributed by the Lucent Technologies Customer Information Center in Indianapolis, Indiana. Most
operating telephone companies should place orders through their documentation coordinator. Some companies may
allow customers to order directly from the Customer Information Center; however, the majority do not. Companies
that use documentation coordinators to manage their orders receive a significant discount.
Customers not represented by a documentation coordinator and Lucent employees can order the documentation for
the 5ESS®-2000 switch directly from the Lucent Technologies Customer Information Center. Proper billing
information must be provided. These orders may be mailed to the following address:
Lucent Technologies Customer Information Center
Order Entry
2855 N. Franklin Road
Indianapolis, IN 46219
See Ordering Information on the back of the front cover page of this document.
Technical assistance for the 5ESS®-2000 switch can be obtained by calling the North American Regional Technical
Assistance Center (NARTAC) at 1-800-225-RTAC. This telephone number is monitored 24 hours a day, 7 days a
week. During regular business hours, your call is answered by your local NARTAC. Outside of normal business
hours, all calls are answered at a centralized Technical Assistance Center where service-affecting problems are
immediately dispatched to your local NARTAC. All other problems are referred to your local NARTAC on the next
regular business day.
2. SYSTEM OVERVIEW
The 3B21D computer is a high-speed, high-reliability, fault-tolerant, duplex computer. It is a bit-compatible version of
the 3B20D computer, which is used in various roles in Lucent Technologies switching products. All major functional
units are duplicated to ensure uninterrupted and reliable service.
The hardware contains self-checking and error-correction circuitry. The software detects faulty processes and
equipment, reconfigures or reinitializes the system, and diagnoses and identifies faulty equipment.
2.2 APPLICATIONS
The 3B21D computer is used as the administrative module (AM) in the 5ESS®-2000 switch.
The high-level architecture of the 3B21D computer is similar to that of the 3B20D computer except for the addition of
Expansion (EX) slots in the 3B21D computer Control Unit (CU) complex, the maximum main store memory
configuration is increased from 64 MB to 128 MB (see Note), and the support of Small Computer System Interface
(SCSI) peripheral devices. The 3B21D computer hardware is packaged differently.
NOTE: The current maximum configuration of the main store memory is 128 MB; however, the system buses and
registers support a 28-bit address to accommodate a future main store memory maximum of 256 MB.
The advantages of the 3B21D computer are reduced floor space and higher reliability because of a reduction in
integrated circuits.
Each Control Unit is half of the duplexed Central Processing Unit (CPU) system. The CC, MAS, UC, EX, and
input/output (I/O) functions are duplicated for reliability. Local control of the 3B21D computer for normal operation
and manual recovery procedures is via the Emergency Action Interface (EAI) to a Maintenance TTY (MTTY) and
Receive-Only Printer (ROP).
The 3B21D Central Control (CC) is a microprogram-driven machine modeled after the 3B20D CC. The CC contains
the following functional subsystems:
MicroController (MC)
The Expansion (EX) slots provide an interface for new (future) hardware features to access the MAS and CC via the
Central Control Input/Output (CCIO) bus and the Main Store Bus (MASB). Each CU has two EX slots, EX 0 and EX
1.
The Utility Circuit (UC) is an optional function that monitors operations between the CC and the main memory
(cache or main store) for the purpose of program debugging and testing. One UC circuit pack (UN379) is optionally
equipped in each CU.
The Cache Storage Unit (CSU) provides a small, high-speed CC cache memory for the most recently accessed
MAS words. The CC accesses the CSU concurrently with the MAS access on the MASB. The CSU is part of the CC
circuit pack (KLW31).
The Main Store (MAS) provides a minimum of 32 MB to a maximum of 256 MBs of Dynamic Random Access
Memory (DRAM). One MAS circuit pack (KLW32, KLW40, KLW48, KLW64, or KLW128) is equipped in each CU.
The same size MAS circuit pack is used in each CU. The KLW32 circuit pack is initially equipped with 32 MB of
DRAM. The KLW40 circuit pack is initially equipped with 40 MB of DRAM. The KLW48 circuit pack is initially
equipped with 48 MB of DRAM. The KLW64 circuit pack is initially equipped with 64 MB of DRAM. The KLW128
circuit pack is initially equipped with 128 MB of DRAM. Additional memory is added to a MAS circuit pack in either 8
MB or 32 MB increments. The addition of three 32-MB Single In-line Memory Modules (SIMMs) to a KLW32 circuit
pack provides a current maximum of 128 MBs of DRAM. Twenty eight bits of address is designed into the system
buses and registers for future expansion to 256 MB. Store data is 36 bits (32 data bits and 4 parity bits). However, in
the MAS circuit pack, store data is 39 bits wide (32 data bits and 7 parity/check bits). The MASs in both CUs are
kept coherent using the Update Bus. If control must be switched from the on-line processor to the other processor,
the contents of both the off-line memory and the on-line memory must be identical. If the MASs are not coherent, the
on-line processor must copy its data to the off-line MAS before the switch takes place.
The Direct Memory Access (DMA) provides peripheral devices access to the MAS via the MASB and provides the
CC access to the peripheral devices through the CCIO bus. Each DMA supports connections for a maximum of 16
peripheral devices.
Peripheral devices are connected to the DMA through the Dual Serial Channel (DSCH). These devices have a
dual-ported DSCH interface that allows them to communicate with either CU 0 or CU 1. Two DMA circuit packs
(KBN15s) can be equipped in each CU. DMA 0 is standard and DMA 1 is optional.
DMA 0 and DMA 1 each provide four channels. DMA 0 supports channels 11, 12, 13, and 14. DMA 1 supports
channels 16, 17, 18, and 19.
The IOP provides connections to terminals, networks, and some tape devices. The DFC provides connection to
peripherals with SCSI interfaces, which include disk and tape drives. The third device, CM/CNI, represents
application peripheral hardware. The term "DFC" is not accurate since support is not limited to disk peripherals;
however, the nomenclature is retained from the 3B20D computer.
Note that the 3B21D computer differs from the 3B20D computer in that 9-track tape is an SCSI peripheral device
supported by the DFC in the 3B21D computer while it is supported by the IOP in the 3B20D computer. Also note that
3B21D computer DFC channel and device allocations differ from the 3B20D computer in that there are fewer
devices per channel.
The 3B21D computer can have three DFCs (DFC 0 through DFC 2). DFC 0 is equipped in the Processor Cabinet,
Processor Unit 0 at EQuipment Location (EQL) 28-170 and EQL 28-178. DFC 1 is equipped in the Processor
Cabinet, Processor Unit 1 at EQL 53-170 and EQL 53-178. DFC 2 is equipped in the Processor Cabinet, Growth
Unit at EQL 11-172 and EQL 11-180. Each DFC provides two SCSI buses (SBUS A and SBUS B). A maximum of
seven SCSI peripheral devices can be equipped on an SCSI bus. Therefore, each DFC can support a maximum of
14 SCSI devices. DFC 0 provides two SCSI buses, SBUS 0(A) and SBUS 2(B). DFC 1 provides two SCSI buses,
SBUS 1(A) and SBUS 3(B). DFC 2 provides two SCSI buses, SBUS 4(A) AND SBUS 6(B).
The 3B21D computer can have three DFCs (DFC 0 through DFC 2). DFC 0 is equipped in the Processor Cabinet,
Processor Unit 0 at EQL 28-178. DFC 1 is equipped in the Processor Cabinet, Processor Unit 1 at EQL 53-178.
DFC 2 is equipped in the Processor Cabinet, Growth Unit at EQL 11-180. Each DFC provides two SCSI buses
(SBUS A and SBUS B). A maximum of seven SCSI peripheral devices can be equipped on an SCSI bus. Therefore,
each DFC can support a maximum of 14 SCSI devices. DFC 0 provides two SCSI buses, SBUS 0(A) and SBUS
2(B). DFC 1 provides two SCSI buses, SBUS 1(A) and SBUS 3(B). DFC 2 provides two SCSI buses, SBUS 4(A)
and SBUS 6(B).
The 3B21D computer can have four IOPs (IOP 0 through IOP 3) equipped in the Processor Cabinet. IOP 0 is
equipped in Processor Unit 0 at EQL 19-065. IOP 1 is equipped in Processor Unit 1 at EQL 45-065. IOP 2 is
equipped in the Growth Unit at EQL 11-011. IOP 3 is equipped in the Growth Unit at EQL 62-011.
Functionally, an IOP can support four peripheral controller communities with each community supporting four
peripheral controllers. Therefore, 16 peripheral devices can be supported by an IOP. IOP 0 and IOP 1 are
exceptions. IOP 0 and IOP 1 each support up to 15 Peripheral Controller (PC) slots. IOP 2 and IOP 3 each support
up to 16 PC slots. The maximum number of available PC slots in a Processor Unit is 15; the maximum number of
available PC slots in a Growth Unit is 16.
For IOP 0 and IOP 1, peripheral community 0, slot 0 (PC00) is always equipped with a TN983, UN583, or UN597
MTTY Controller (MTTYC) circuit pack. Also, IOP 0 and IOP 1, peripheral community 0, slot 2 (PC02) is reserved for
a UN33D or UN933 Scanner and Signal Distributor circuit pack, which provides scan and signal distributor point
interfaces for the 3B21D computer.
The Port Switch and Scanner-Distributor Buffer (PSSDB) switches the MTTY and the local receive-only printer
(ROP) between the MTTY Controller (MTTYC) circuit pack (TN983, UN583, or UN597) in IOP 0 and IOP 1. The
PSSDB also buffers the scanner and signal-distributor controller from non-3B21D computer circuits such as office
alarms, smoke detectors, and security monitoring devices. One port switch is equipped in Processor Unit 1. In the
3B21D computer, the PSSBD is located in CU 1. (Note that in the 3B20D computer, the PSSBD is located in CU 0.)
For Release 1, the 3B21D computer system is packaged in one, two, or three cabinets. The Processor Cabinet
(J3T060A-1) is always required. One or two Peripheral Growth Cabinets (J3T059A-1) are provided as necessary
when 9-track SCSI tape drives are required as part of the configuration. The Peripheral Growth Cabinets are always
located to the right of the Processor Cabinet.
Each cabinet measures about 72 inches (183 cm) high by 30 inches (76 cm) wide by 24 inches (60 cm) deep. A
three-cabinet lineup occupies an area about 90 inches (229 cm) wide by 24 inches (60 cm) deep.
The 3B21D computer uses Complementary Metal Oxide Semiconductor (CMOS) Gate Array Technology in the form
for Application Specific Integrated Circuits (ASICs). The ASICs are fabricated in a one-micron, two- or three-layer,
metal process.
All 3B21D computer gate arrays are in surface-mounted packages. The largest package is a 240-pin Plastic Quad
Flat Pack (PQFP). Plastic-Leaded Chip Carriers (PLCCs) are used for ASICs requiring 100 or fewer pins. Table 2-1
summarizes the 3B21D computer ASIC surface-mounted packages.
b. Two Store Interfaces are used for the SAI and SDI function.
The functional blocks shown in Figure 2-1 are physically represented by the following circuit pack designs:
KBN10 Input/Output Processor (IOP) circuit pack contains the DSCH and IOMI interface functions.
KBN15 Direct Memory Access (DMA) circuit pack contains the DMAC and Channel functions.
KLW31 Central Control (CC) circuit pack contains the CC and Cache Storage Unit (CSU) functions.
KLW32, KLW40, KLW48, KLW64, or KLW128 The Main Memory (MM) circuit pack contains the MAS and Update
functions. The KLW32 is initially equipped with 32 MB; KLW40 is initially equipped with 40 MB;
KLW48 is initially equipped with 48 MB; KLW64 is initially equipped with 64 MB; KLW128 is
initially equipped with 128 MB.
TN1820 Input/Output Processor Power Switch (IOPPS) circuit pack is similar to the TN1821 circuit pack
with additional onboard DC-to-DC (12 V and -5 V) power converters.
TN1821 Control Unit Power Switch (CUPS) circuit pack contains power and control for the Central
Control fault group.
TN1839 Synchronous Link Peripheral ControllerX.25 Network Level 2 Interface (NET2) circuit pack.
TN2116 and UN373 Disk File Controller A (UN373) and Disk File Controller B (TN2116) circuit packs contain the
DSCH interface and SCSI host adapter functions.
UN375 SCSI Disk circuit pack contains a 3.5-inch SCSI Moving Head Disk (MHD) drive, power
converters for the drive, and power control. This circuit pack provides the MHD functions for the
AM. On the UN375E series, an MHD with a single-ended SCSI interface is used. The UN375E
series requires the addition of a differential-to-single-ended translation circuit.
UN376 SCSI Tape circuit pack contains a 3.5-inch SCSI Digital Audio Tape (DAT) drive, power
converters for the drive, and power control.
UN377 Port Switch and Scanner-Distributor Buffer (PSSDB) circuit pack contains the PSSDB function.
UN379 Utility Circuit circuit pack contains the utility circuit function.
UN580 Disk File Controller circuit pack combines the functionality of TN2116 and UN373 into one
circuit pack. The UN580B does not use an external power converter.
UN582 The UN582 circuit pack is a Synchronous Data Link, High-Speed Synchronous Data Link, and
an Asynchronous Data Link Peripheral Controller that replaces the TN82B, TN74B, TN75C, and
TN1839 circuit packs.
UN583 Maintenance TTY Controller circuit pack that replaces the TN983.
UN597 Maintenance TTY Controller circuit pack that replaces the UN583.
UN933 New Scanner and Signal Distributor circuit pack that replaces the UN33 with identical
functionality.
The 3B21D computer system offers cost-effective configurations for small switching offices and can be grown from
a small office configuration to a large office configuration. The minimum configuration is packaged in one Processor
Cabinet. The maximum Release 1 configuration is packaged in one Processor Cabinet and two Peripheral Growth
Cabinets.
See Section 3 for a description of the 3B21D computer configuration and growth information.
The 3B21D computer is more reliable than the 3B20D computer because of a reduction in the number of integrated
circuits, circuit packs, backplanes, and cables. This reduction in the number of components and interconnections is
the result of extensive use of Application Specific Integrated Circuits (ASICs).
The 3B21D computer makes use of the following features that contribute to the reliability and maintainability of the
system:
Various system sanity mechanisms with subsequent automatic recovery are used.
Standard equipment designation strips for power and circuit pack labeling.
Forced air cooling is used to keep components within their rated temperature ranges.
The 3B21D computer system is factory assembled and is following environmental stress ESSTM switch
screening to increase product reliability.
Except for the PC community circuit pack slots, all circuit pack slots are keyed to prevent the installation of a
wrong circuit pack. The PC community slots are keyed to accept the installation of several different circuit pack
types.
Cabling design follows specific rules to enhance the reliability and maintainability of the system as follows:
All cables are stamped with the appropriate cable EQuipment Location (EQL) information.
Total cable length for a differential SCSI bus is 20 meters (65.6 feet), because of internal circuit limits.
Fault detection algorithms make extensive use of local matching circuits, parity techniques on all buses, and
hamming detection with single-bit error correction on the main store. Technology-dependent fault
detection/correction strategies on disks, and numerous sanity timers throughout the control unit and peripherals are
used as the primary fault-detection techniques. In addition, routine diagnostics are used to detect failures in the
fault-detection hardware itself. Finally, system integrity checks catch certain subtle problems that are not caught by
unique detectors.
When any of the unique detectors determine an error condition, an error interrupt (or error report in the case of
certain peripherals) is registered in the processor. The most severe of these will result in automatic hardware
sequences that switch the activity of the processors (hard switch). Less severe errors result in microinterrupts that
enter microcode and software charged with recovery of the system.
Self-checking is made possible by carrying a parity check bit per byte in the processor. Since each microinstruction
may involve a data transfer from one register to another via a common data bus, an effective parity check is done by
trapping the data off the bus and checking for correct parity during the next clock interval (that is, the source bus
parity error). This avoids added delay in the normal operation. The data in the destination register is not checked.
However, when used as the source, the data is then checked. For any arithmetic or logical operations, the data goes
through the DMU. The DMU is divided into two parts (DMU 0 and DMU 1) for checking purposes. The results from
one is used as data, whereas parity check bits derived from the result of the second is used with the data. As data
leaves the DMU, the common bus parity check is performed [that is, the Data Manipulation Unit (DMU) parity error].
In the microprogram store, additional bits are provided to check the control section of the processor (that is, the
microcontrol parity error).
The Main Memory (MM) detects and corrects one-bit errors. All data is checked when read. All data is continually
checked during refresh cycles. In a systematic way, all memory locations are checked over a time period dependent
on the amount of memory equipped. The MM detects most multiple bit errors (two-bit and greater errors). Both
classes of errors are recorded in the Error Register (ER) and generate a microinterrupt. Registers in the MM are
accessible via software to assist in fault recovery.
The microcode and recovery software provides a layered approach to the recovery architecture. Fault-recovery
strategies are based on the fault-tolerant architecture of the 3B20D computer. Major hardware units are fully
duplicated. This duplication provides a high probability that a combination of operational units can be retained in the
face of faults. The mate processors are only loosely coupled; interprocessor connections are limited to the
maintenance channel and memory update circuitry. This architecture forms the foundation of the hardware recovery
strategy used in the 3B21D computer, namely to isolate an entire faulty processor as opposed to attempting fault
resolution at the subunit level.
The UNIX® Real-Time Reliable (RTR) system is a modular operating system that provides a wide range of
protection from various types of classical errors. Examples include write-protected memory areas, memory ranges
that are used only for text execution, and protected virtual address spaces. Thus, much of the recovery from these
types of errors is built into the operating system. Recovery actions that are required are greatly simplified by the
underlying architecture. Hard faults and other conditions requiring recovery actions are treated according to their
severity. Fault categories that are described individually are: hard faults, Sanity Timer time-out, software-requested
recovery, and threshold-exceeded faults.
Different types of faults can result in different actions. The most severe action taken is a system initialization or boot.
The boot sequence is discussed later in this section.
The 3B21D computer has built-in self-checking circuitry designed to detect hard faults as soon as they occur. This
circuitry simplifies recovery since early fault detection limits the possible damage done by the fault. Faults in this
category indicate that the processor is no longer capable of proper operation and results in an immediate stop of the
currently running processor and a switch to the other processor (stop-and-switch). Since the other processor does
not match the active processor instruction by instruction, an initialization sequence is required to start execution
properly.
Each processor has a Sanity Timer (ST) that will result in an initialization if it times out and is not inhibited (disable
Sanity Timer request). The System Integrity Monitor process in the active processor maintains both its own and the
standby ST so that if the active processor is out of control, an initialization of the standby processor will be triggered
by a Sanity Timer time-out.
The system provides an Operating System Trap (OST) for use by software to request an initialization. This capability
is used by critical system processes when they encounter errors that preclude performance of a critical system
function. Initializations occur when an error or fault has been detected that cannot be recovered without a change in
hardware and/or software status. A stop-and-switch to the other processor may or may not be associated with any
given initialization. All initializations include actions of varying severity, depending on what is required to deal with
various faults and errors.
Some types of faults and errors are not severe enough to justify an immediate stop-and-switch recovery action.
Examples of errors of this kind are hardware faults, which are detected in the standby processor memory, and
software errors, such as write-protection violations. Another type of error in this category is hardware faults that are
handled by self-correcting circuitry. Although most faults are detected by self-checking, some units, such as main
memories, have fault rates that justify self-correcting capabilities. Disks are also self-correcting via cyclic
redundancy codes. All errors in this class are reported to the recovery system as error interrupts.
Recovery software classifies the interrupt by type, gathers and saves all available information about the interrupt,
and reports the error to the system configuration management package. If a particular software process is
suspected as the cause of the interrupt, such as in a software-triggered event, the process that was running at the
time of the interrupt is faulted and entered at its fault entry after a stable system configuration is guaranteed. The
fault entry of a process contains recovery and initialization sequences that are special to the process involved.
All error interrupts are reported to configuration management. Errors are logged against the failing unit and error
rates are compared to allowed error thresholds. If the affected threshold is exceeded, further action is required and
is based on several factors. If the faulty unit is essential to the system and a mate unit is available, the faulty unit will
be removed from service and scheduled for diagnostic testing. If there is no available mate unit, the faulty unit will be
initialized and returned to service since, in the case of essential units, it is better to have a faulty unit than no unit.
Nonessential units are removed and scheduled for diagnostic testing whenever their error thresholds are exceeded.
The following simplified description of the UNIX® RTR system boot sequence addresses the actions taken by the
hardware, micro-code, and system software during and after a boot.
The first event in a hardware-initiated or manual initialization sequence is a hardware-supported transfer to a fixed
location [Maintenance Reset Function (MRF)] in the CU microstore. Software-requested initializations begin
executing at MRF without hardware assistance.
Data about the initialization trigger is first saved in temporary registers and later copied to Main Store. A decision is
made to bring this processor on-line or stop for the off-line initialization. If the current initialization is level two or
higher, the writable microstore, appropriate processes, and databases are loaded from the mass-storage device
(disk or tape). These and other boot time decisions that are made are supported by the System Status Register
(SSR).
The UNIX® RTR system kernel initialization or bootstrap routine is then called to restart system processes or to fault
active processes as appropriate. The initialization is now complete and the system has returned to normal operation.
2.5.2.6.4 Reboot
If an initialization does not recover the system to an operational state, another and more severe initialization will
occur. Any initialization that occurs during a window of time following the previous initialization will escalate to the
next higher level. The length of the initialization interval is a system-generation parameter that is established by the
application.
In addition to the UNIX® RTR system-initialization levels, provision is made for an application to specify
software-controlled "application levels."
Data about various recovery actions taken by the system is supplied to provide much information about what went
wrong. This information can be used by maintenance personnel to assist them in isolating difficult faults. Recovery
data is provided in several forms. Each error interrupt is accompanied by a printout containing available information
about the state of the processor when the interrupt occurred. A more difficult problem is presented by initializations.
Since they are more severe than interrupts and represent a discontinuity in processing, gathering and preserving
error data is more difficult. Initializations, as well as interrupts, can occur at a rate much too fast for data to be
printed. The solution is to save all pertinent data in a protected area of memory for printing after the system has
recovered.
Various kinds of error data are not generally printed as a part of the standard system output but instead are saved in
error files on the system disks. Examples of this data are device driver errors and failing memory data.
One piece of data output by the system that is not saved in error files are the Processor Recovery Messages
(PRMs). These are low-level one-line messages that are printed in real time. The PRMs thus represent progress
marks through the recovery sequences and are extremely useful in those cases where stability cannot be achieved
or postmortem data cannot be gathered.
The maintainability of the 3B21D computer is a vital component that guarantees the overall high availability required
of the system. There are conditions where automatic recovery is unable to restore the system to a fully-functioning
state. This is where maintainability is critical to satisfying UNIX® RTR system's high availability requirements. The
hardware requirements imposed by the maintainability needs are not as obvious as those prescribed by other
portions of the system. This section describes the maintenance capabilities provided by UNIX® RTR system. The
3B21D computer hardware has been designed to ease in the implementation of these features.
The basic premise of maintainability is to provide basic data-gathering and data-analysis mechanisms as well as the
ability to act on the results of that analysis. These mechanisms must be able to collect and analyze diagnostic and
debugging information from various hardware and software components in the system to isolate the error. These
mechanisms must then allow the craft to control and modify the configuration of the system based on the diagnostic
and debugging information collected. Furthermore, these mechanisms must yield their information as quickly as
possible while disturbing the rest of the system as little as possible.
Maintainability includes such areas as diagnostics, transient error analysis, routine maintenance procedures, field
utilities, and plant measurements. Once an error has been isolated and analyzed, the problem must then be
corrected as quickly and benignly as possible. This is termed updatability, and includes such aspects as growth and
retrofit for hardware, emergency fixes, function update, and system update for software. Maintainability is partitioned
into diagnostics (hardware) and the various field utilities (software). However, the craft interface to the various
maintenance facilities in the system is central to the craft's ability to maintain and control the 3B21D computer
hardware and software. This is an important capability of the craft interface system. The craft interface provides the
craft and others with the means to request diagnostics, receive error analysis reports, initiate emergency recovery
procedures, gather plant measurements data, and exercise routine maintenance programs. In addition, the craft
interface system allows configuration control by providing access to growth and retrofit procedures, system and
function update capabilities, emergency fix facilities, and the various field utilities.
One component of the maintainability required of UNIX® RTR-based systems is the ability of these systems to
accept hardware and software changes in a way that does not interfere with their primary tasks. In other words, a
UNIX® RTR-based system must be able to accept changes without disturbing call processing, networking, or other
critical functions. UNIX® RTR system supports this through the following aspects of updatability: growth, retrofit,
software update, and program update.
2.5.3.2.1 Growth
The first aspect of updatability is growth. Growth is the ability to add or remove hardware and related software
components to the running system. Growth extends from physically connecting new equipment (such as memory
boards, disks drives, tape drives, and other units) through informing the system of its existence, exercising it,
logically connecting it into the system's configuration, and committing to its use in the system. Other subsystems,
such as hardware and software fault recovery and diagnostics, then take over to ensure that the new system
component continues to be sane and usable.
2.5.3.2.2 Retrofit
The second aspect of updatability is retrofit. Retrofit is the ability to replace hardware components in the system with
similar components of a different vintage or with different capabilities or interface characteristics. Retrofit procedures
may remove (de-grow) old units and then grow or add new ones. They also may add the new units first and then
transition work from the old units to the new. Thus, retrofit of units may involve extensive periods of time where old
and new units coexist in the system. Retrofit may also involve substantial software changes to interact with new
units and to recognize the existence of both old and new units.
The third component of updatability, software update, deals exclusively with software and data file changes in the
UNIX® RTR system. Such changes are done logically, on a file-by-file or functional level. Just as with growth and
retrofit, software update can install new or replace system programs or files, inform the system about them, logically
connect them into the system, exercise them in that state, and then commit to or back out of them. Software update
is intended primarily for installing fixes or small features that do not disturb the system's architecture.
The fourth updatability component, program update, allows program and data changes of much greater magnitude,
up to complete software program replacement. A bootstrap is required to install the changes for any program
update. By using disk redundancy or backup copies of sections of UNIX® RTR program disks, program update can
prepare a new, partial, or total version of the program on disk and then switch to it (and back, if necessary). Where
software update performs a logical change of files, program update does a physical change of a set of partitions (file
systems and/or file partitions).
The 3B21D computer diagnostic system follows a systematic approach for isolating hardware failures and provides
a suspect pack list to the user. For each circuit pack or unit, the diagnostic software does the following:
(1) Runs the self-test of the Boundary Scan Master (BSM) chip if the chip is used on the circuit pack.
(2) Runs the boundary-scan integrity test followed by the boundary-scan interconnect test.
(3) Instructs all the ASICs on the unit under test to run their internal device level Built-In Self Test (BIST) and
analyze their results.
System diagnostics are organized on a unit basis. Unit diagnostics are structured in subunit test phases. Test
phases are executed to first test the most elementary operations, and then proceed to the more detailed subunit
operations.
All diagnostic programs avoid interference with the normal system functions. Special driver functions handle error
conditions generated by the diagnostic tests, thus avoiding the normal error handling routines.
The diagnostic system also provides maintenance personnel with interactive diagnostic commands. These can be
used to do the following:
Run a diagnostic up to a specified point in the data table and then stop.
See 235-600-700, Input Message Manual, and 235-105-220, Corrective Maintenance Procedures.
The 3B21D computer hardware uses Built-In Self Test (BIST) and Boundary Scan (BS) features at the circuit pack
and ASIC device levels to reduce the testing difficulties and increase fault coverage. Additional circuits have been
incorporated in the 3B21D computer hardware design to provide BS cells adjacent to each chip's input/output pins to
control and observe the signals. BS cells are like test points that are interconnected as shift register chains. A
separate BS bus is used to assess and control the BS cells.
Boundary scan cells can be operated in either a normal or test mode. In the test mode, the BS cells can accept test
instructions and data, and scan out the test responses. They are used to perform interconnection tests or internal
tests (BIST).
Software diagnosis is performed on the off-line processor complex through the maintenance channel. The
maintenance channel connects the active and the standby processors. The diagnosis is initiated from the active
processor. Diagnostic commands issued by the active processor are passed via the maintenance channel link.
These commands are then received, interpreted, and reissued to the Boundary Scan Master (BSM) device through
the Generic Processor Interface (GPI) by the Maintenance Channel (MCH).
The inclusion of on-chip circuitry to provide test vectors or to analyze output responses is called Built-In Self Test
(BIST). The BIST reduces the complexity and cost of an external tester by including some or all tester functions in
the chip itself.
The use of BIST and Boundary Scan (BS) provides a higher percentage of fault coverage. The BIST and BS
hardware is accessed via diagnostic software that executes the ASIC BIST test and the circuit pack BS test.
The 3B21D computer system hardware is designed to automatically restart following a power interruption. To
support this feature, the 3B21D computer unit power switches must be in the ON position. The unit power switch ON
position allows auto-restart when power is applied to the unit. This feature provides for unattended system
operation. The Auto Restart feature is available in RTR Release 21.5 and later.
The 3B21D computer design enables fault isolation to a circuit pack level. This is accomplished by the following:
ASIC technology, which places complete functions on one circuit pack, making it easier to isolate a fault though
functional testing.
Built-In Self Test (BIST), which allows a more thorough test at the ASIC and circuit pack level.
CAUTION: All circuit packs must be removed and installed with the power OFF. The "hot card" replacement of
circuit packs is not supported.
Before a 3B21D circuit pack is removed or installed in an apparatus housing, the power to the circuit pack must be
removed. However, the SCSI peripherals can be installed without powering down the associated SCSI bus. The
DFC, PSSDB, and SCSI peripheral circuit packs have their own board-mounted power converters and power
switches. This is equivalent to a "hot card" replacement, because the other units on the SCSI bus are not affected.
See 235-105-110, System Maintenance Requirements and Tools, for more information about spare pack handling,
circuit pack removal, and installation.
The 3B21D computer system, J3T061A-1, offers cost-effective configurations for small switching offices (1K to 6K
lines) and can be grown from a small office configuration to a large office configuration with minimum system
interruption. The minimum 3B21D computer system configuration is packaged in one cabinet called the Processor
Cabinet, J3T060A-1. The maximum 3B21D computer system configuration is packaged in three cabinets, one
Processor Cabinet and up to two Peripheral Growth Cabinets (PGC 0 and PGC 1), J3T059A-1.
A Maintenance Teletypewriter/Terminal (MTTY) and Receive-Only Printer (ROP) are also part of any 3B21D
computer configuration.
Figure 3-1 shows the maximum system equipage supported by J3T061A-1. (J3T061A-1 is the 3B21D computer
system Super J-Drawing.) The Peripheral Growth Cabinets are always located to the right of the Processor Cabinet,
as viewed from the front of the cabinets. The cabinets each measure about 72 inches (183 cm) high by 30 inches
(76 cm) wide by 24 inches (60 cm) deep.
The customer can order any of the configurations supported by the Super J-Drawing, J3T061A-1. Some
configuration examples are provided in the following paragraphs.
The initial (basic) system configuration consists of the Processor Cabinet equipped with the following major units:
See Figure 3-2 for equipage information. The basic system configuration provides the following equipment:
Direct Memory Access (DMA) 0 is part of the basic system. DMA 1 is optional.
Disk File Controller (DFC) 0 and DFC 1 supporting seven Small Computer System Interface (SCSI) peripheral
units (SPUs). An SPU slot can be equipped with a UN375 Moving Head Disk (MHD) circuit pack or a UN376
Digital Audio Tape (DAT) circuit pack. DFC 0 supports four SPUs; DFC 1 supports three SPUs. There are five
dedicated SPU slots in the basic units (Processor Units 0 and 1). Optionally, two additional SPUs (SPU04 and
SPU05) can be grown instead of equipping Input/Output Processor (IOP) Peripheral Controller (PC) community
3 (PC31 and 32). The PC30 slot in each Processor Unit is always available for use as a PC. One DAT drive
(SPU54) is controlled by DFC 0. See Table 3-1 for SPU controller and bus assignments.
NOTE: DFC 0 and DFC 1 could be equipped with either a UN580 or with both a TN2116 and a UN373.
Configuration Example 1 for the Processor Cabinet contains the following major units:
See Figure 3-3 for equipage information. Note that the first Growth Unit can be equipped at either vertical position
57 (Figure 3-1 ) or vertical position 06 in the Processor Cabinet. Example 1 installs the Growth Unit at position 57
and provides the following equipment:
CU 0 and CU 1.
DFC 0 and DFC 1 supporting 12 SPUs. An SPU slot can be equipped with a UN375 MHD circuit pack or a
UN376 DAT circuit pack. DFC 0 supports 6 SPUs; DFC 1 supports 6 SPUs. There are 5 dedicated SPU slots in
the basic units (Processor Units 0 and 1). Optionally, 2 additional SPUs (SPU04 and SPU05) can be grown
instead of equipping IOP PC community 3 (PC31 and 32). The PC30 slot in each Processor Unit is always for
available use as a PC. One DAT drive (SPU54) is controlled by DFC 0.
Five SPUs can be equipped in the Growth Unit. Three of the Growth Unit SPUs are connected to DFC 1, SBUS
1; two of the Growth Unit SPUs are connected to DFC 0, SBUS 0. See Table 3-1 for SPU controller and bus
assignments.
NOTE: DFC 0 and DFC 1 could be equipped with either a UN580 or with both a TN2116 and a UN373.
Either IOP 2 or IOP 3 with Peripheral Communities 0 and 1, depending on where the Growth Unit is equipped in
the Processor Cabinet. The growth unit can be optionally equipped to provide a Peripheral Community 2, a
Peripheral Community 3, or SPUs in this configuration as shown in Figure 3-3 .
Configuration Example 2 for the Processor Cabinet contains the following major units:
See Figure 3-4 for equipage information. The growth units can be optionally equipped to provide Peripheral
Community 2, Peripheral Community 3, or SPUs in this configuration as shown in Figure 3-4 . Configuration
Example 2 provides the following equipment:
CU 0 and CU 1.
DFC 0 and DFC 1 supporting 17 SPUs. An SPU slot can be equipped with a UN375 MHD circuit pack or a
UN376 DAT circuit pack. DFC 0 supports nine SPUs; DFC 1 supports eight SPUs. There are five dedicated
SPU slots in the basic units (Processor Units 0 and 1). Optionally, two additional SPUs (SPU04 and SPU05)
can be grown instead of equipping IOP PC community 3 (PC31 and 32). The PC30 slot in each Processor Unit
is always available for use as a PC. One DAT drive (SPU54) is controlled by DFC 0.
Five SPUs can be equipped in each Growth Unit. Five of the Growth Unit SPUs are connected to DFC 1; five of
the Growth Unit SPUs are connected to DFC 0. See Table 3-1 for SPU controller and bus assignments.
NOTE: DFC 0 and DFC 1 could be equipped with either a UN580 or with both a TN2116 and a UN373.
Figure 3-2 Processor Cabinet, J3T060A-1 Basic System Configuration, Front View
Configuration Example 1 for the Peripheral Growth Cabinet provides the first Peripheral Growth Cabinet equipped
with one SCSI 9-track tape drive, KS-23909. This is the first 9-track tape drive (SPU57) in the 3B21D computer
system.
A single SCSI bus cable connects a 9-track tape drive to any available SCSI bus (SBUS 0, 1, 2, or 3).
The 9-track tape drives are AC powered and plug directly into an AC power outlet. The drives can be configured to
use either 50- or 60-Hertz power.
Configuration Example 2 for the Peripheral Growth Cabinet provides the second SCSI 9-track tape drive, KS-23909
(SPU56) in the first Peripheral Growth Cabinet.
Configuration Example 3 for the Peripheral Growth Cabinet provides the second Peripheral Growth Cabinet
equipped with one SCSI 9-track tape drive, KS-23909. This is the third 9-track tape drive (SPU59) in the 3B21D
computer system.
Configuration Example 4 for the Peripheral Growth Cabinet provides the fourth SCSI 9-track tape drive, KS-23909
(SPU58) in the second Peripheral Growth Cabinet.
Figure 3-5 Peripheral Growth Cabinet, J3T059A-1 Configuration Example 1, Front View
Figure 3-6 Peripheral Growth Cabinet, J3T059A-1 Configuration Example 2, Front View
Figure 3-7 Peripheral Growth Cabinet, J3T059A-1 Configuration Example 3, Front View
Figure 3-8 Peripheral Growth Cabinet, J3T059A-1 Configuration Example 4, Front View
Table 3-1 identifies the DFC and SCSI bus assignments for the various SPUs as they apply to the previously
described configuration examples for Release 1.
The naming convention for the two SCSI buses provided by a DFC designates the buses "BUS A" and "BUS B." The
3B21D computer system designations for the SCSI buses are different, as follows:
The SCSI BUS A and BUS B provided by DFC 0 are designated "SBUS 0" and "SBUS 2," respectively.
The SCSI BUS A and BUS B provided by DFC 1 are designated "SBUS 1" and "SBUS 3," respectively.
A DFC could include a UN373 (DFCA) and TN2116 (DFCB), powered by a 410AA (DC-to-DC converter). The
equipment locations (EQLs) for DFC 0 and DFC 1 are as follows:
DFC 0 is in the Processor Cabinet, Processor Unit 0, at 28-170 (TN2116), 28-178 (UN373), and 28-188
(CONVE).
DFC 1 is in the Processor Cabinet, Processor Unit 1, at 53-170 (TN2116), 53-178 (UN373), and 53-188
(CONVE).
Or, a DFC could include a UN580 (DFCA/DFCB), powered by a 410AA (DC-to-DC converter). When using a UN580
circuit pack, EQLs for DFC 0 and DFC 1 are as follows:
DFC 0 is in the Processor Cabinet, Processor Unit 0, at EQL 28-178 (UN580) and 28-188 (CONVE).
DFC 1 is in the Processor Cabinet, Processor Unit 1, at EQL 53-178 (UN580) and 53-188 (CONVE).
Or, a DFC could include a UN580B (DFCA/DFCB), which is powered by an onboard DC-to-DC converter. When
using a UN580B circuit pack, EQLs for DFC 0 and DFC 1 are as follows:
4.1 CABINETS
The 3B21D computer system is packaged in one, two, or three cabinets. The Processor Cabinet, J3T060A-1, is
always required. One or two Peripheral Growth Cabinets, J3T059A-1, are provided as necessary when 9-track
Small Computer System Interface (SCSI) tape drives are required as part of the configuration. The Peripheral
Growth Cabinets are always located to the right of the Processor Cabinet, as viewed from the front of the cabinets.
Each cabinet measures about 72 inches (183 cm) high by 30 inches (76 cm) wide by 24 inches (60 cm) deep.
Figure 4-1 shows the unit equipage of the Processor Cabinet and the two Peripheral Growth Cabinets. Figure 4-2
provides a general equipment configuration overview of the Processor Cabinet. The front doors of the cabinets are
not shown in these figures.
The Processor Unit, J3T060AA-1, supports the Central Control (CC), Direct Memory Access (DMA), Main Memory
(MM), Disk File Controller (DFC), SCSI peripheral units (SPUs), DC-to-DC power conversion, power control, port
switch with RS-232 interface, and IOP/PC functions. The SPUs include the UN375/UN375E circuit pack,
UN376/UN376E circuit pack, and 9-track tape. The MM can be a KLW32, KLW40, KLW48, KLW64, or KLW128
circuit pack. The Processor Unit also provides two KLW-size slots (EX 0 and EX 1) for future expansion capability.
Figure 4-3 shows apparatus housing layout details for the Processor Units 0 and 1. Table 4-1 identifies the
equipage of the Processor Unit 0 and Processor Unit 1 in the Processor Cabinet.
Controller
UN33D/UN933 PC10 (BLACK) 19-130 45-130
PC11 (BLACK) 19-138 45-138
PC12 (BLACK) 19-146 45-146
Scanner and
PC13 (BLACK) 19-154 45-154
Signal Distributor
Controller
PC20 (GREEN) 28-094 53-094
PC21 (GREEN) 28-102 53-102
PC22 (GREEN) 28-110 53-110
PC23 (GREEN) 28-118 53-118
PC30 (GREEN) 28-130 53-130
PC31 (GREEN) 28-138 53-138
PC32 (GREEN) 28-146 53-146
UN373 or UN580 DDSBS/DSCH Interface DFC0 (PURPLE) UN373 or UN580 28-178
UN373 or UN580 DDSBS/DSCH Interface DFC1 (PURPLE) UN373 or UN580 53-178
UN375 SCSI Disk SPU 00 UN375 28-162
UN375 SCSI Disk SPU 01 UN375 53-162
UN375 SCSI Disk SPU 02 19-170
UN375 SCSI Disk SPU 03 45-170
UN376 SCSI Tape (MT) UN376 SPU 54 19-186
UN377 PSSDB PSSD (BLACK) 45-186
UN379 Utility Circuit UC (RED) 19-050 45-050
The Growth Unit, J3T060AB-1, supports the equipage of additional SCSI peripheral units (SPUs) and IOP/PC circuit
packs to provide a system growth capability. Two Growth Units can be equipped in the Processor Cabinet. Figure
4-4 shows apparatus housing layout details for the Growth Units. Table 4-2 identifies the equipage of the IOP
2-SPU and IOP 3-SPU Growth Units in the Processor Cabinet.
peripheral
controllers.
Equipage is PC10 (RED) 62-072
PC11 (RED) 62-080
PC10 (RED) 11-072
application
PC11 (RED) 11-080
PC12 (RED) 62-088
dependent PC13 (RED) 62-096
PC12 (RED) 11-088
and includes PC13 (RED) 11-096
peripheral
controllers.
IOP Community 2 or SPUs 24 PC20 (BLACK) 62-108
through 27. Equipage is PC21 (BLACK) 62-116
SPU 27 62-116
application dependent and PC20 (BLACK) 11-108
includes peripheral controllers PC21 (BLACK) 11-116
and/or SCSI peripheral units. SPU 26 11-116
PC22 (BLACK) 62-124
PC23 (BLACK) 62-132
SPU 25 62-132
PC22 (BLACK) 11-124
PC23 (BLACK) 11-132
SPU 24 11-132
Equipage is application PC30 (BLACK) 62-140
dependent and includes PC31 (BLACK) 62-148
SPU 23 62-148
peripheral controllers and/or PC30 (BLACK) 11-140
SCSI peripheral units. PC31 (RED) 11-148
SPU 22 11-148
PC32 (RED) 62-156
PC33 (RED) 62-164
SPU21 62-164
PC32 (RED) 11-156
PC33 (RED) 11-164
SPU 20 11-164
Equipage is application SPU 18 11-180
dependent and includes SCSI SPU 19 62-180
peripheral units.
Figure 4-5 shows the fuse assignments for the Processor Cabinet.
The Peripheral Growth Cabinet, J3T059A-1, is used to provide mounting space for two 9-track SCSI tape units. The
first Peripheral Growth Cabinet (PGC 0) contains the first (SPU57) and second (SPU56) 9-track tape units at EQLs
42 and 10, respectively. The second Peripheral Growth Cabinet (PGC 1) contains the third (SPU59) and fourth
(SPU58) 9-track tape units at EQLs 42 and 10, respectively.
The 9-track SCSI tape unit is a KS-23909. KS-23909 is either a 120 V AC, 60 Hz, 1600/6250 BPI, 125 IPS tape unit
or 240 V AC, 50 Hz, 1600/6250 BPI, 125 IPS unit.
The Printed Wiring Board (PWB) general characteristics are summarized in Table 4-3 for the UN, TN, KLW, and
KBN circuit pack types. All PWBs are manufactured per Fastech® electronic packaging system standards. See the
To prevent a circuit pack from being installed in an inappropriate position, backplane keys are used to permit only
those circuit pack types with the appropriate connector plug arrangement to be installed in a given apparatus
mounting position. Table 4-4 lists the backplane keys and associated circuit pack connector plugs used for the
Processor Unit, J3T060AA-1. Table 4-5 lists the backplane keys and associated circuit pack connector plugs used
for the Growth Unit, J3T060AB-1. Figure 4-6 shows a typical key holder.
The UN375 and UN376 circuit packs are keyed so that they can be installed in a UN373 slot, a UN377 slot, or in a
PC community slot.
The UN373 and UN580 circuit packs are keyed so that they can be installed in a UN373 slot or a UN580 slot.
Also note that the UN377 slot and the Main Memory (MM) slot (KLW32, KLW40, KLW48, KLW64, or KLW128 circuit
pack slot) have the same backplane key code. However, since the UN-type circuit pack and the KLW-type circuit
pack are different sizes, they cannot be mistakenly interchanged.
b. Located in CU 0.
The optional Utility Circuit (UC) circuit pack (UN379), along with the Generic Access Package (GRASP) software or
the Enhanced Generic Access Package (EGRASP) software, monitors operations between the Central Control (CC)
and Main Memory (cache or main store) for the purpose of program debugging and testing. One UC circuit pack
(UN379) is optionally equipped in each Control Unit (CU).
The CM369A Micro Level Test Set (MLTS) interface circuit module plugs into two connectors on the faceplate of the
CC circuit pack (KLW31). The MLTS interface circuit module provides the connections between the MLTS host
(TN16) and the CC. Four 8-foot ribbon cables are used to connect the MLTS and the CM369A MLTS interface
circuit module.
NOTE: The MLTS is not available via the Super J-Drawing, J3T061A-1. The MLTS is intended for laboratory use
only.
The MLTS interface circuit module is powered by the MLTS and has no intelligence of its own. All MLTS
interface functions are controlled by the MLTS. The MLTS is used to do the following:
Determine the condition of a failed 3B21D computer when other recovery actions have failed.
The Expansion (EX) slots provide an interface for new (future) hardware features to access the Main Store (MAS)
and CC via the Central Control Input/Output (CCIO) bus and the Main Store Bus (MASB). Each CU has two EX slots
(EX 0 and EX 1).
The Processor Unit and Growth Unit backplanes are designed to minimize the amount of external wiring needed to
complete circuit pack connections.
The following external wires are used on the Processor Unit backplane.
The CC circuit pack (KLW31) has 11 interrupt status register inputs from the SREG0 ASIC that are brought out to
the backplane. These are wired to interrupt signals from the two expansion slots and the two DMA Controller slots.
These signals are routed to a pin field alongside the CC connector as shown in Table 4-6 . This permits the signals
to be easily connected using either machine-made wire straps or an external connector card in any fashion as
needed.
The Central Control (CC) circuit pack (KLW31) identity as CU 0 or CU 1 is determined by the backplane in which the
circuit pack is installed. In CU 1, EQLs 038-000T and 038-001T are wired together. The KLW31 is set for CU 0 as a
default. Grounding the CCID0 pin tells the KLW31 it is CU 1.
For normal operation, straps are used with the DMA controller. However, each KBN15 DMA circuit pack has an
input that can disable quad word memory access. By default, quad word memory access is disabled with no plans to
enable it at present. If quad word memory access needs to be disabled, a strap is added on the backplane to
disable quad word access for each KBN15 circuit pack. Four straps are required, as follows:
The DMA positions also have an input that provides DMA identity, but it is permanently wired in the backplane.
If for some reason quad work memory access needs to be enabled, remove the four straps previously mentioned.
The expansion slots do not need external wires. An expansion slot ID input is provided that is permanently wired in
the backplane.
There are no wires on this backplane. All connectivity is via the printed circuits within the backplane.
4.9 CABLING
Total cable length for differential SCSI bus does not exceed 25 meters.
SCSI stub length is from backplane connector to SCSI device driver pin. The differential SCSI bus stub length
does not exceed 0.2 meter per stub.
All cables are stamped with the appropriate cable EQL information.
Cable wires and connectors are UL®-recognized components and have a flammability rating of 94V-1 or better.
Cables are routed away from sharp edges and from moving parts.
See Section 12 for a listing of logic and power cables required for the 3B21D computer system.
Designation strips are used on the units to identify the circuit pack positions. In most cases, the information on the
designation strips includes the equipment location (EQL) and circuit pack type designation. In other cases, SPU,
MHD, and MT numbers are on the designation strips. Optional peel-off labels are provided to designate
application-specific devices. Circuit pack positions are color-coded on the designation strips with respect to the
DC-to-DC converter supplying power to the circuit pack.
Figure 4-5 shows the labeling for the Processor Cabinet fuses.
Processor Cabinet cooling is accomplished using a Bidirectional Cooling Unit, J5D003FH-2. The cooling unit is
located at the middle of the Processor Cabinet at EQL 36. The upper half of the Processor Cabinet (Processor Unit
1 and IOP 3-SPU Growth Unit) is cooled by pulling the air through the front door, pushing it up through the front
three fans, over the circuit packs, and then exhausting the air flow out at the top of the cabinet. The bottom half of
the Processor Cabinet (Processor Unit 0 and IOP 2-SPU Growth Unit) is cooled by pulling the air through the rear
door, pushing the air flow down the rear three fans, over the circuit packs, and exhausting the air flow out at the
bottom of the cabinet. This cooling technique provides more efficient cooling due to lower air resistance and
temperature rise at equipment exhaust. The cooling unit is capable of delivering air flow at 450 to 500 CFM with
three single-high apparatus housings fully equipped with UN-type circuit packs.
Unoccupied slots in an apparatus housing are covered with standard Fastech press-on plastic filler plates to contain
the cooling air flow. The filler plates present the same appearance as the circuit pack faceplates.
For the Peripheral Growth Cabinet, cooling is provided by each of the 9-track tape units.
The Bidirectional Cooling Unit, J5D003FH-2, is equipped in the Processor Cabinet at EQL 36. The unit contains two
groups of fans and an alarm circuit. Three fans are in each group. The fan motors operate on -48 V DC. One group
blows air upward to cool Processor 1 and IOP 3-SPU Growth Unit; the other group blows downward to cool
Processor 0 and IOP 2-SPU Growth Unit.
Each fan includes an integral Fan Performance Sensor (FPS) that operates from +5 V obtained from a
Board-Mounted Power Module (BMPM) in the alarm circuit. If one or more fans fail, the circuit latches an alarm state
on its scan point output. The SD point is used to retire the alarm. A switch on the cooling unit can also be used to
manually retire the alarm.
Figure 5-1 is a functional block diagram of the 3B21D computer. Each of the functional areas defined in Figure 5-1
is described in this section. The 3B21D computer is a duplexed, 32-bit machine with a 28-bit addressing capability
(28 address bits plus 4 parity bits). Data paths in the Control Units (CUs) are 36 bits wide (32 data bits plus 4 parity
bits). Store data is 39 bits wide (32 data bits and 7 parity/check bits).
Communication between the CUs and peripheral devices is via Direct Memory Access (DMA) dual-ported Dual
Serial Channels (DSCHs).
Each CU is half of the duplexed Central Processing Unit (CPU) system. The CC, MAS, UC, EX, and input/output
(I/O) functions are duplicated for reliability.
Local control of the 3B21D computer for normal operation and manual recovery procedures is via the Emergency
Action Interface (EAI) to a Maintenance TTY (MTTY) and Receive-Only Printer (ROP).
The 3B21D CC is a microprogram driven processor of the 3B21D computer and is contained on one circuit pack
(KLW31). Each CU is equipped with one KLW31 circuit pack.
The EX slots provide an interface for new (future) hardware features to access the Main Store (MAS) and CC via the
Central Control Input/Output (CCIO) bus and the Main Store Bus (MASB). Each CU has two EX slots (EX 0 and EX
1).
The UC is an optional function that monitors operations between the CC and the main memory (cache or main
store) for the purpose of program debugging and testing. One UC circuit pack (UN379) is optionally equipped in
each CU.
The CSU provides a small, high-speed CC cache memory for the most recently accessed Main Store (MAS) words.
The CC accesses the CSU concurrently with the MAS access on the Main Store Bus (MASB). The CSU is part of
the CC circuit pack (KLW31).
The MAS provides a minimum of 32 MB to a maximum of 256 MBs of Dynamic Random Access Memory (DRAM).
One MAS circuit pack (KLW32, KLW40, KLW48, KLW64 or KLW128) is equipped in each CU. The same size MAS
circuit pack is used in each CU. The KLW32 circuit pack is initially equipped with 32 MB of DRAM. The KLW40
circuit pack is initially equipped with 40 MB of DRAM. The KLW48 circuit pack is initially equipped with 48 MB of
DRAM. The KLW64 circuit pack is initially equipped with 64 MB of DRAM. The KLW128 circuit pack is initially
equipped with 128 MB of DRAM. Additional memory is added to a MAS circuit pack in either 8 MB or 32 MB
increments. The addition of three 32 MB Single In-line Memory Modules (SIMMs) to a KLW32 circuit pack provides
a current maximum of 128 MBs of DRAM. Twenty eight bits of address is designed into the system buses and
registers for future expansion to 256 MB. Store data is 36 bits (32 data bits and 4 parity bits); however, within the
MAS circuit pack store data is 39 bits wide (32 data bits and 7 parity/check bits). The MASs in both Control Units
(CUs) are kept coherent using the Update Bus. If control must be switched from the on-line processor to the other
processor, the contents of both the off-line memory and the on-line memory must be identical. If the MASs are not
coherent, the on-line processor must copy its data to the off-line MAS before the switch takes place.
The Direct Memory Access (DMA) provides peripheral devices access to the MAS via the MASB, and provides the
CC access to the peripheral devices through the CCIO bus. Each DMA supports connections for a maximum of 16
peripheral devices.
Peripheral devices are connected to the DMA through the Dual Serial Channel (DSCH). These devices have a dual
ported DSCH interface that allows them to communicate with either CU 0 or CU 1. Two DMA circuit packs (KBN15s)
can be equipped in each CU. DMA 0 is standard and DMA 1 is optional.
DMA 0 and DMA 1 each provide four channels. DMA 0 supports channels 11, 12, 13, and 14. DMA 1 supports
channels 16, 17, 18, and 19.
Figure 5-1 shows three types of peripheral devices: the Input/Output Processor (IOP), Disk File Controller (DFC),
and Communications Module/Communications Network Interface (CM/CNI). The IOP provides connections to
terminals, networks, and some tape devices. The DFC provides connection to peripherals with Small Computer
System Interface (SCSI) interfaces, which include disk and tape drives. The third device, CM/CNI, represents
application peripheral hardware. The term "DFC" is not accurate since support is not limited to disk peripherals;
however, the nomenclature is retained from the 3B20D computer.
Note that the 3B21D computer differs from the 3B20D computer in that the 9-track tape is an SCSI peripheral device
supported off of the DFC in the 3B21D computer while it is supported off of the IOP in the 3B20D computer. Also
note that 3B21D computer DFC channel and device allocations differ from the 3B20D computer in that there are
fewer devices per channel.
The 3B21D computer can have three DFCs (DFC 0 through DFC 2) all equipped in the Processor Cabinet as
follows:
A TN2116 at equipment location (EQL) 28-170 and a UN373 at EQL 28-178, or either a UN580 or UN580B
at EQL 28-178.
A TN2116 at EQL 11-170 and a UN373 at EQL 53-178, or either a UN580 or UN580B at EQL 53-178.
A TN2116 at EQL 11-172 and a UN373 at EQL 11-180, or either a UN580 or UN580B at EQL 11-180.
Each DFC provides two SCSI buses (SBUS A and SBUS B). A maximum of seven SCSI peripheral devices can be
equipped on an SCSI bus. Therefore, each DFC can support a maximum of 14 SCSI devices. DFC 0 provides two
SCSI buses, SBUS 0(A) and SBUS 2(B). DFC 1 provides two SCSI buses, SBUS 1(A) and SBUS 3(B). DFC 2
provides two SCSI buses, SBUS 4(A) and SBUS 6(B).
The 3B21D computer can have four IOPs (IOP 0 through IOP 3) equipped in the Processor Cabinet. IOP 0 is
equipped in Processor Unit 0 at EQL 19-065. IOP 1 is equipped in Processor Unit 1 at EQL 45-065. IOP 2 is
equipped in the Growth Unit at EQL 11-011. IOP 3 is equipped in the Growth Unit at EQL 62-011.
Functionally, an IOP can support four peripheral controller communities with each community supporting four
peripheral controllers. Therefore, 16 peripheral devices can be supported by an IOP. IOP 0 and IOP 1 are
exceptions. IOP 0 and IOP 1 each support up to 15 Peripheral Controller (PC) slots. IOP 2 and IOP 3 each support
up to 16 PC slots. The maximum number of available PC slots in a Processor Unit is 15; the maximum number of
available PC slots in a Growth Unit is 16.
For IOP 0 and IOP 1, Peripheral Community 0, slot 0 (PC00) is always equipped with a TN983, UN583, or UN597
MTTY Controller circuit pack. Also, IOP 0 and IOP 1, Peripheral Community 0, slot 2 (PC02) is reserved for a
UN33D or UN933 Scanner and Signal Distributor circuit pack, which provides scan and signal distributor point
interfaces for the 3B21D computer.
The Port Switch and Scanner-Distributor Buffer (PSSDB) switches the maintenance terminal (MTTY) and the local
receive-only printer (ROP) between the MTTY Controller (MTTYC) circuit pack (TN983/UN583/UN597) in IOP 0 and
IOP 1. The PSSDB also buffers the scanner and signal-distributor controller from non-3B21D computer circuits such
as office alarms, smoke detectors, and security monitoring devices.
One port switch is equipped in Processor Unit 1. In the 3B21D computer, the PSSBD is located in CU 1. (Note that
in the 3B20D computer the PSSBD is located in CU 0.)
Figure 5-2 is a functional block diagram of the Central Control (CC) circuit pack (KLW31). The CC is a
microprogram-driven processor that contains the following functions:
MicroController (MC)
Following a description of the CC interfaces, each of these functions is described in this section.
5.2.1 CC Interfaces
The Central Control Input/Output (CCIO) bus interfaces the Central Control (CC), Direct Memory Access Controller
(DMAC), and the expansion slots (EX 0 and EX 1).
The CCIO bus is summarized in Table 5-1 . Figure 5-3 is a functional block diagram of the CCIO bus.
application peripherals
E0INT00 Expansion Slot 0 Interrupt IN NC NC OU NC
T
E1INT00 Expansion Slot 1 Interrupt IN NC NC NC OU
T
Notes:
a. The machine is provided with D0INT00 and D0INT10 interrupts connected to the SIS10 input.
b. NC = No Connection.
Figure 5-3 Central Control Input/Output (CCIO) Bus Functional Block Diagram
The CCIO bus consists of data, data parity, address, control, response, and interrupt signals as follows.
The CCIO data (CCIOD) bus is 32-bit bus. The bus connects the DMAC to the Channel Data Register (CDR) on the
CC circuit pack.
Even parity is maintained across each byte of the CCIO data bus. Parity is checked on the DMAC side of the CCIO
bus when the CC writes a command to the DMAC. The parity bits are designated CCIOD(35-32)1.
The 6-bit CCIO address (CCIOAD) bus is driven by the Channel Address Register (CAR) field of the CC Hardware
Status Register (HSR) bits 15 through 10. A 3-out-of-6 code is used for the addresses. Table 5-2 provides DMAC
CCIO address information. The addresses for channels 10 through 19 are used for the DMACs and the associated
DSCHs. The other channel addresses (00 through 09) are reserved for the expansion slots (EX 0 and EX 1).
15-10 (HEX)
EX 0 EX 0 (CHANNEL 00) 000111 0x07
EX 0 EX 0 (CHANNEL 01) 001011 0x0B
EX 0 EX 0 (CHANNEL 02) 001101 0x0D
EX 0 EX 0 (CHANNEL 03) 001110 0x0E
EX 0 EX 0 (CHANNEL 04) 010011 0x13
EX 1 EX 1 (CHANNEL 05) 010101 0x15
EX 1 EX 1 (CHANNEL 06) 010110 0x16
EX 1 EX 1 (CHANNEL 07) 011001 0x19
EX 1 EX 1 (CHANNEL 08) 011010 0x1A
EX 1 EX 1 (CHANNEL 09) 011100 0x1C
DMAC 0 DMAC 0 (CHANNEL 10) 100011 0x23
DMAC 0 DSCH 0 (CHANNEL 11) 100101 0x25
DMAC 0 DSCH 1 (CHANNEL 12) 100110 0x26
DMAC 0 DSCH 2 (CHANNEL 13) 101001 0x29
DMAC 0 DSCH 3 (CHANNEL 14) 101010 0x2A
DMAC 1 DMAC 1 (CHANNEL 15) 101100 0x2C
DMAC 1 DSCH 0 (CHANNEL 16) 110001 0x31
DMAC 1 DSCH 1 (CHANNEL 17) 110010 0x32
DMAC 1 DSCH 2 (CHANNEL 18) 110100 0x34
DMAC 1 DSCH 3 (CHANNEL 19) 111000 0x38
Control leads are driven by CC registers. Ten control pulses are driven by Pulse Point Register (PPR) bits 05-00 and
10-07. An I/O inhibit signal is driven by combining (logical OR) the System Status Register (SSR) bits 09 and 30.
Acknowledge (CIOACK[0-5]1)
The DMAC acknowledges the receipt of any control pulse by returning a 3-out-of-6 code on the acknowledge
leads. Each DMAC returns its address. The DMAC 0 returns a 100011 acknowledge pattern. The DMAC 1
returns a 101100 acknowledge pattern. If a valid acknowledge is not returned, the CC Error Register bits 17
and 18 are asserted.
All-Seems-Well (CIOASW0)
The All-Seems-Well signal indicates the absence of errors. Its status is stored in HSR bit 4. An
All-Seems-Well failure asserts the CC Error Register bit 17.
Ready (CIORDY0)
The Ready is returned to the CC by the DMAC to synchronize the CC with the addressed channel. When the
CC is reading data from a channel, Ready is asserted when the data is gated to the CCIO bus. For other
control signals, Ready is returned immediately. Ready is stored in the CC as HSR bit 7. A Ready failure
asserts the CC Error Register bit 17.
Table 5-3 summaries the CCIO response signals and identifies the Pulse Point Register (PPR) bit control pulse
that triggers the response. Only one of these operations is active at any time. The violation of a 1-out-of-11 check
causes a hardware error and asserts the CC Error Register bit 18 (ER18).
RDY Ready
ACK Acknowledge
Six interrupts (two for each DMAC channel and one for each expansion slot) are part of the CCIO bus. Each
channel interrupt signal is a summary of the interrupt requests coming from the channel peripheral devices.
The Main Store Bus (MASB) is used to transfer data to and from the Main Memory (MM) and the Central Control
(CC), Direct Memory Access 0 (DMA 0), Direct Memory Access 1 (DMA 1), Expansion Slot 0 (EX 0), and Expansion
Slot 1 (EX 1). The MASB consists of data, data parity, address, address parity, command, control, error, store
requests, arbitrations, update control, and miscellaneous signals. Table 5-4 summarizes the MASB signals. Figure
5-4 is a functional block diagram of the MASB. The Update bus shown in Figure 5-4 is discussed in "Main Store
(MAS) and Main Store Update (MASU)" in Section 6 .
data bits
ADDRESS SA(27-0)1 Tri a 28 bits, noninverted OUT OUT OUT IN
SA(35-32)1 Uni a 4 bits, even parity OUT OUT OUT IN
COMMAND SWRT0 Tri a Write 0/Read 1 command OUT OUT OUT IN
SBYTE0 Access size byte active 0 OUT OUT OUT IN
SHALF0 Access size half word active 0 OUT OUT OUT IN
SQUAD0 Access size quad word active 0 OUT OUT OUT IN
SRMW0 Read-Modify-Write command OUT OUT OUT IN
SMAINT0 Maintenance access command OUT OUT OUT IN
SCOMP1 Even parity bit over command OUT OUT OUT IN
bits
CONTROL DS0 Tri a Quad word access only OUT OUT OUT IN
Uni a
PMSCM0 Uni a Processor My-Store-Complete IN NC b NC OUT
POSCM0 Processor IN NC NC OUT
Other-Store-Complete
CAINVL0 Address Strobe-Cache IN NC IN OUT
Invalidate
D0SCM0 DMAC 0 Store Complete NC IN NC OUT
D1SCM0 DMAC 1 Store Complete NC IN NC OUT
E0SCM0 EX 0 Store Complete NC NC IN OUT
E1SCM0 EX 1 Store Complete NC NC IN OUT
ERROR MYSERA0 Uni a My-Store-Error A IN IN IN OUT
MYSERB0 My-Store-Error B IN IN IN OUT
MYSERC0 My-Store-Error C IN IN IN OUT
MYSERD0 My-Store-Error D IN NC IN OUT
OSTERA0 Other-Store-Error A IN NC NC OUT
OSTERB0 Other-Store-Error B IN NC NC OUT
OSTERC0 Other-Store-Error C IN NC NC OUT
OSTERD0 Other-Store-Error D IN NC NC OUT
STORE PSGO01 Uni a Processor request for Main OUT NC NC IN
REQUESTS Store Bus
D0SGO0 DMAC 0 request for Main Store NC OUT NC IN
Bus
D1SGO0 DMAC 1 request for Main Store NC OUT NC IN
Bus
E0SGO0 EX 0 request for Main Store Bus NC NC OUT IN
E1SGO0 EX 1 request for Main Store Bus NC NC OUT IN
ARBITRA- PABUS0 Uni a Processor address enable IN NC NC OUT
TION
D0ABUS0 DMAC 0 address enable NC IN NC OUT
D1ABUS0 DMAC 1 address enable NC IN NC OUT
E0ABUS0 EX 0 address enable NC NC IN OUT
E1ABUS0 EX 1 address enable NC NC IN OUT
SDBUS0 Processor data enable IN NC NC OUT
D0DBUS0 DMAC 0 data enable NC IN NC OUT
D1DBUS0 DMAC 1 data enable NC IN NC OUT
E0DBUS0 EX 0 data enable NC NC IN OUT
E1DBUS0 EX 1 data enable NC NC IN OUT
UPDATE SISOU0 Uni a Isolate other side request OUT NC NC IN
CONTROL
SISOD0 Isolate DMAC0/1 request OUT NC NC IN
SISOE0 Isolate EX0/1 request OUT NC NC IN
PUPD0 Processor in update OUT NC NC IN
PONL0 Processor on-line OUT NC NC IN
MISC. OSTIME0 Uni a Other store access time-out IN NC NC OUT
SCR161 Cache Go Signal OUT NC NC IN
SCR251 Arbiter reset OUT NC NC IN
CACWT0 MM waits for invalidate OUT NC OUT IN
CLER150 Clear Other store access OUT NC NC IN
time-out
CPWRCLR0 Power-up clear IN IN IN IN
Notes:
a. Tri = Tristate; Bid = Bidirectional; Uni = Unidirectional.
b. NC = No Connection.
The Maintenance Channel Link (MCHL) provides a direct connection between the Central Control (CC) units in
Control Unit 0 (CU 0) and Control Unit 1 (CU 1). This link is needed for the duplexed operation of the CC. There is a
Maintenance Channel (MCH) circuit on both ends of the link. A CC unit can request its MCH to send instructions to
the MCH in the other CU. These instructions, called slave commands, tell the receiving MCH to read and write its
MIS buses, read and write its interface, read its MTC bus, or to clear and set certain status bits. The MCHL is also
used to carry the stop and switch command from one CU to the other CU. These functions are further described in
"Maintenance Channel (MCH)" in this section.
The MCHL interface is identical in the 3B20D and 3B21D computers in that the same format is used in the Dual
Serial Channel (DSCH) interface. There are five signals in the MCHL interface. These five signals are driven
electrically as five differential pairs as shown in Table 5-5 . The REQAP/N pair carries the stop and switch signal
that requests the receiving CC to go on-line. The REQA signal is used separately from the other four signals in the
MCHL that are used for other data transfer and command functions. The CLKA and XCKA signals are used as
timing references for the data. The CLKA signal is an input for received data. The XCKA signal is sent out with the
transmitted data. The data transmission contains an 8-bit start code and can optionally include 32 data bits and 4
parity bits. The data is split in two halves. The high-order bits are sent on the DAHA signal; the low-order bits are
sent on the DALA signal. The data parity bits are used as parity bits in the MCHL. The MCHL protocol uses odd
parity, requiring the 3B21D computer MCH circuits to do parity conversion on these bits.
Figure 5-5 shows the MCHL protocol. Table 5-5 summarizes the MCHL signals. Figure 5-6 is a functional block
diagram of the MCHL.
The Micro Level Test Set (MLTS) link connects the MLTS host and the MLTS interface circuits. Figure 5-7 is a
functional block diagram of the MLTS link.
Figure 5-7 Micro Level Test Set (MLTS) Link Functional Block Diagram
A Boundary Scan (BS) bus is a serial bus used to link the components being tested. A component under test can be
a circuit pack or a device on a circuit pack. Each boundary scan-compatible component has a Test Access Port
(TAP).
All Application Specific Integrated Circuits (ASICs) on the Central Control (CC) circuit pack have a TAP. The serial
test data input (TDI) and serial test data output (TDO) of each TAP interface with each other using a ring topology.
The BS Master (BSM) can access ten different rings. The BSM is located on the KLW31 CC circuit pack and is
controlled by the MCH. Ring selection is accomplished using an 8-bit register with a 1-to-10 demultiplexer and a
10-to-1 multiplexer. The demultiplexer and multiplexer select the active ring by driving a Test Mode Selection (TMS)
signal and receiving an output data stream (TDO). Only one ring is active (selected) at a given time. Note that the
MCH loads the idle value (0X00) between legal values to prevent simultaneous multiple ring accesses. The 8-bit
register is loaded via the MCH. Table 5-6 lists the 8-bit codes used to select the BS rings.
Figure 5-8 is a functional block diagram of a typical boundary scan ring. Figure 5-9 is a functional block diagram
showing the boundary scan architecture for the 3B21D computer.
TCK The boundary scan clock (TCK) is a free-running clock signal. All latches and registers retain their
states while TCK is low.
TMS The test mode selection (TMS) signal selects the test mode and is clocked on the rising edge of
TCK. In the test mode, the boundary scan cells accept test instructions and data, and scan out the
test responses.
TRST The test reset (TRST) signal is an active low asynchronous reset for the TAP controller. The TRST
signal does not initialize any system logic. For the 3B21D computer, the TRST signal is not on the
boundary scan bus. The TRST input on each ASIC is connected to either an internal power reset or
to a system power reset signal.
TDI The serial test data input (TDI) signal feeds test data to the device under test and is clocked into
internal data or instruction registers on the rising edge of TCK.
TDO The serial test data output (TDO) signal feeds test data out of the device under test and changes
state on the falling edge of TCK.
The 3B21D computer BS bus goes to all circuit packs except the power converters. Figure 5-9 shows that the BS
bus consists of a primary bus, a secondary bus, and a growth bus. All boundary scan operations are controlled by
the CC; however, additional circuitry is provided by the Input/Output Processor Power Switch (IOPPS) circuit pack
(TN1820) for access to the secondary and growth buses.
Figure 5-8 Typical Boundary Scan (BS) Bus Functional Block Diagram
Circuit pack self-identification is done using the boundary scan bus for all circuit pack positions except for the IOP
and the power converters. The power converters do not support self-identification. The KBN10 IOP circuit pack
supports self-identification by accessing an internal memory via the dual serial channel.
The initial release of the 3B21D computer will not have a functioning circuit pack self-identification feature. The
circuit pack self-identification circuits are designed into all new circuit packs; however, the components will not be
installed on the circuit packs. The components consist of an EPROM, containing the self-identification data, and a
boundary scan interface (test access port) to access the EPROM from the boundary scan bus.
The self-identification data is stored in a separate EPROM on all 3B21D computer circuit packs supporting circuit
pack self-identification. The EPROM is programmed when the circuit pack is manufactured. In general, circuit pack
self-identification is invoked by commands to the Maintenance Channel (MCH). The active CU instructs the MCH on
the inactive CU to scan for self-identification data. The KBN10 IOP self-identification EPROM is read via the dual
serial channel.
Figure 5-8 shows how the boundary scan bus is used for circuit pack self-identification. A shorting strap is used to
maintain the continuity of the boundary scan bus when the self-identification feature is not used.
In Figure 5-9 , the primary chain begins at the CC circuit pack. The CC has 10 separate boundary scan links to the
CC, Main Memory (MM), Direct Memory Access 0 (DMA 0), Direct Memory Access 1 (DMA 1), Utility Circuit (UC),
Control Unit Power Switch (CUPS), Expansion Slot 0 (EX 0), Expansion Slot 1 (EX 1), Input/Output Processor
Power Switch 0 (IOPPS 0), and the Input/Output Processor Power Switch 1 (IOPPS 1) circuit packs. The CC's TDI
and TMS outputs are common to all circuit packs in the primary boundary scan chain, while the corresponding TCK
output and TDO input are individually accessed one at a time by a multiplexer circuit in the CC.
The TAPs in the CC circuit pack are provided in sequence for the Self-Identification (SELF-ID), Store Data Interface
(SDI), Special Registers 1 (SREG1), Store Address Interface (SAI), MicroSequencer (MSEQ), Data Manipulation
Unit (DMU), Store Address Translator (SAT), Cache Controller (CAC), Special Registers 0 (SREG0) ASICs.
The secondary bus is distributed from the IOPPS circuit pack. The four boundary scan leads (TCK, TMS, TDI, and
TDO) are connected in parallel to 21 units in the Processor Unit backplane. Individual select leads are routed to
each unit to activate a boundary scan port. The IOPPS and CC circuit packs are cross coupled on CU 0 and CU 1 to
provide fault redundancy. Differential cables are used to span between backplanes. The IOPPS receives a
processor on-line output from both CC circuit packs in this cross coupled arrangement. Its boundary scan circuitry
will be under the control of the on-line Processor Unit.
The IOPPS circuit pack has an expansion port that allows a differential cable to be attached to the Processor Unit
backplane and a Growth Unit backplane. This cable carries the four boundary scan signals plus an on-line signal. If
an IOPPS is installed in a Growth Unit backplane, it will interface directly to the IOPPS in the Processor Unit
backplane, under control of the on-line Processor Unit.
All circuit pack positions in a Processor Unit backplane and Growth Unit backplane have boundary scan access,
except for the power converter positions. Access is shown in Figure 5-10 .
Although the boundary scan bus is provided to all PC community positions, in the Growth Unit and Processor Unit
backplanes, certain circuit packs (TN74, TN75, TN82, TN983/UN583/UN597, and UN33D) do not have boundary
scan capability. In addition, the boundary scan port is located on the fifth and sixth columns of the UN-type
connectors. Therefore, a four-column TN-type circuit pack installed in a PC slot cannot use the boundary scan port
unless a jumper cable is provided.
The boundary scan bus is routed to the DFCB position. The current DFCB circuit pack (TN2116) does not support
boundary scan. The port is routed to pin fields not used by the TN2116, allowing any future circuit packs that may be
installed here to support boundary scan, if desired.
The Bidirectional Gating Bus (BGB) is a 36-bit bus (32 data bits and 4 parity bits). The BGB is used to pass data
between the Central Control (CC) and various maintenance and diagnostic units. It is used to load and unload the
Writable MicroStore (WMS). Table 5-7 summarizes the BGB. Figure 5-11 is a functional block diagram of the
BGB.
The MLTS Interface and the CC are bus masters and have active control over the BGB. The MCH and UC are
passive receivers on the bus.
The MicroInstruction Store (MIS) memory is accessed over the MicroStore (MS) bus by the MicroSequencer
(MSEQ), Maintenance Channel (MCH), or by the Micro Level Test Set (MLTS) Interface. The MicroStore Address
(MSA) bus is driven by only one of these devices at any instance. The MSEQ buffers the MSA data onto the RAM
MicroStore Address (RMSA) bus when the RMSA enable signal from the MIS is asserted. The MIS disables the
RMSA bus during BGB Static Random Access Memory (SRAM) accesses.
The MicroStore Address (MSA) bus connects the MicroController (MC), MicroInstruction Store (MIS), Maintenance
Channel (MCH), and the Micro Level Test Set (MLTS) Interface.
The MSA bus is 18-bits (16 address bits and 2 parity bits).
MSA bus bit 17 (MAS[17]1) is the even parity bit over MSA bits 15-08; MSA bus bit 16 (MAS[16]1) is the even parity
bit over MSA bits 07-00. MS address parity is checked by the MSEQ on each memory access. The MSEQ
compares the address parity bits against the MIR parity bit (MIR[63]1). A parity error asserts the MCPARE0 signal at
the end of the current microinstruction cycle. The MCPARE0 (error register bit 1) signal remains asserted until the
end of the next microinstruction cycle. The MIS does not check MSA parity.
The MicroStore Data (MSD) bus connects the MicroController (MC), MicroInstruction Store (MIS), Maintenance
Channel (MCH), and the Micro Level Test Set (MLTS) Interface.
The MSD bus is 64 bits (56 data bits and 8 parity bits). MSD bus bit 56 is the even parity bit over MSD bits 07-00.
MSD bus bit 57 is the even parity bit over MSD bits 15-08. MSD bus bit 58 is the even parity bit over MSD bits
23-16. MSD bus bit 59 is the even parity bit over MSD bits 31-24. MSD bus bit 60 is the even parity bit over MSD
bits 39-32. MSD bus bit 62 is the even parity bit over MSD bits 47-40. MSD bus bit 62 is the even parity bit over
MSD bits 55-48. MSD bus bit 63 is the even parity bit over the command.
The Source (SRC) and Destination (DST) buses are 36-bit buses (32 data bits and 4 parity bits). The SRC and DST
buses work together to pass data from a Central Control (CC) register through the Arithmetic Logic Unit (ALU) or
ALU bypass logic to another CC register.
The SRC and DST buses are summarized in Table 5-8 . Figure 5-12 is a functional block diagram of the SRC and
DST buses.
At the start of a MicroInstruction execution sequence, an SRC bus enable code is sent to gate a register onto the
SRC bus. Depending on the MicroInstruction, the data either passes through the ALU or ALU bypass logic in the
Data Manipulation Unit (DMU). The result is driven onto the DST bus by the DMU. At the end of the MicroInstruction,
a DST clock is generated to gate the DST bus data into a CC register.
The MicroController (MC) sends two sets of six signals that the receiving ASICs use to generate Destination (DST)
Clocks. Each set of six signals is used to clock half of a CC register and parity over the other half of the CC register.
Each set consists of six signals, a 5-bit code, and a master clock signal. The 5-bit code is generated and sent by the
MC at the start of the MicroInstruction execution. The 5-bit code represents the CC register to be clocked. The MC
sends the master clock signal at the end of the MicroInstruction execution. The ASICs receive these signals, decode
the 5-bit code, and combine the results with the master clock to control the CC registers in each ASIC. For some
ASICs, this decoding is done in the MSEQ and individual DST clocks are sent to the ASIC to save pins on the
receiving ASIC.
Figure 5-12 Source (SRC) and Destination (DST) Bus Functional Block Diagram
The Maintenance (MTC) bus is a 36-bit bus (32 data bits and 4 parity bits). The MTC bus is used primarily during
maintenance and diagnostics operations for status information from the Central Control (CC) to the Maintenance
Channel (MCH) and Micro Level Test Set (MLTS) Interface. The MTC bus is summarized in Table 5-9 . Figure
5-13 is a functional block diagram of the Maintenance (MTC) bus.
The Cache Memory bus is used by the Store Address Interface (SAI) and Store Data Interface (SDI) to access the
Cache Storage Unit (CSU). The CSU is discussed in "Cache Storage Unit (CSU)" in this section. The Cache
Memory bus consists of the Cache Data (CD) bus, the Cache Address (CA) bus, command leads, and control leads.
Table 5-10 summarizes the cache memory bus.
bits
ADDRESS CA(27-00)1 Unidirec- 28 address bits OUT NC IN
tional
CA(35-32)1 4-byte even parity bits over 32 data OUT NC I/O
bits
COMMAND SWRT0 Unidirec- Write 0/Read 1 command OUT NC IN
tional
SCRI211 Access size byte OUT NC IN
SCRI221 Access size half word OUT NC IN
SQUAD0 Access size quad word OUT NC IN
SRMW0 Read-Modify-Write command OUT NC IN
SCRI311 Maintenance access command OUT NC IN
CONTROL SCRI161 Unidirec- Access enable (SCR bit 16) OUT NC IN
tional
SSR131 Cache bypass mode (from SREG) NC NC IN
CACHER0 Cache detected an error (to SREG) NC NC OUT
CAHIT0 Cache hit IN NC OUT
CARDY0 Cache is ready with data IN NC OUT
SCRI231 Subroutine stack access OUT NC IN
PMSCM0 Processor My-Store-Complete (from NC NC IN
MASC)
THIT1 ATB Translation Hit and no ATB NC NC IN
error from SAT
Notes:
a. NC = No Connection.
The Cache Data (CD) bus is a 36-bit, bidirectional bus (32 data bits and 4 parity bits) that conveys data among the
Store Data Interface (SDI), Cache Storage Unit (CSU), and the Utility Circuit (UC).
The Cache Address (CA) bus is a 32-bit, unidirectional bus (28 address bits and 4 parity bits) that conveys physical
cache address information to the Cache Storage Unit (CSU) from the Store Address Interface (SAI).
The MicroController (MC) consists of the MicroSequencer (MSEQ) ASIC, MicroInstruction Register (MIR), two
programmable logic devices, and a 33-MHz oscillator.
The 33-MHz crystal-based oscillator is the primary CC timing source. The oscillator has a symmetry of 45 percent to
55 percent and an accuracy of 100 parts per million. Buffered versions of this primary CC timing source are
distributed throughout the CC complex as various processor clock signals.
The MC fetches and decodes MicroInstructions from the CC MicroInstruction Store (MIS) and controls the resulting
execution sequences among the other CC subsystems.
The MC operates from a 33-MHz oscillator and provides the following functions:
Interprets and presents the current MicroInstruction in the MicroInstruction Register (MIR).
Checks parity on each MicroInstruction fetched and the MicroInstruction address using the parity information
stored with the data.
Verifies the contents of the MIR by comparing its parity result with the MicroInstruction parity bits.
Provides wait logic in the event of a MicroInstruction and MAS operational conflict.
The MicroInstruction Store (MIS) provides a 4-K by 64-bit EPROM and a 32-K by 64-bit SRAM for CC
microinstruction storage. Each MIS memory location contains microinstruction data with parity. The SRAM is read or
written using the Bidirectional Gating Bus (BGB). Both the EPROM and the SRAM are read through the MicroStore
(MS) bus interface.
The EPROM and Control Interface Logic receive and decode 16 Main Store Address (MSA) bus bits (64 K
words). The MSA bus is driven by the Maintenance Channel (MCH), the MicroSequencer (MSEQ), or by the
Micro Level Test Set (MLTS).
The SRAM and Control Interface Logic allows bidirectional data transfers, reads, and writes over the
Bidirectional Gating Bus (BGB).
The MIS generates data parity during BGB read transactions. The data written to the MIS SRAM includes
microinstruction parity bits that are checked during instruction execution.
The MIS operates in either the Normal mode or in the MicroCode Debug mode. In the Normal mode, the MSA
EPROM address range is from 0x000 to 0xFFF; the RAM MicroStore Address (RMSA) and BGB SRAM
address range is from 0x1000 to 0x8FFF. In the MicroCode Debug mode, the MSA and BGB bus SRAM
address range is from 0x0000 to 0x7FFF and the EPROM cannot be accessed.
This dual address feature is used to test software without programming EPROMs; instructions are executed
only from SRAM. See Note.
NOTE: In the Normal mode, EPROM addressing, MSA bus logical addresses 0x000 to 0xFFF correspond to
physical location 0x000 to 0xFFF. In the MicroCode Debug mode, the EPROM cannot be accessed.
In the Normal mode, SRAM addressing, the RMSA and BGB logical addresses 0x8000 to 0x8FFF
correspond to physical addresses 0x0000 to 0x0FFF and logical addresses 0x1000 to 0x7FFF correspond
to physical addresses 0x1000 to 0x7FFF. In the MicroCode Debug mode, SRAM addressing, the RMSA
and BGB logical addresses 0x0000 to 0x7FFF correspond to physical addresses 0x0000 to 0x7FFF.
The Store Data Interface (SDI) function is provided by a Store Interface (SI) ASIC operating in the SDI mode.
In the SDI mode, the SI ASIC provides a Store Data Register Pipeline (SDRP), partial Bidirectional Gating Register
(BGR), partial Store Control Register (SCR), Store Sequencer (SSEQ), and SI Decoder.
The SDR holds the source data during a write to Main Memory (MM) and is the destination of data for a MM
read operation. The SDR can be loaded from the DST bus or from the MAS bus. Similarly, the SDR can be
read from the SRC bus or placed onto the MAS bus.
The Store Instruction Register (SIR) contains the next macroinstruction fetched from the MM. The SIR can also
The Instruction Buffer (IB) contains the current macroinstruction under execution by microcode. The IB can be
loaded from the Halfword Multiplexer (HM) or DST bus. The content of the IB can also be gated to the SRC bus
under MSEQ control.
A partial Bidirectional Gating Register (BGR) is provided, bits 35-32, and 27-12. The BGR interfaces to the SRC
and DST buses and provides the MicroController (MC) an interface to and from the BGB.
Store Data Register (SDR) bits 31 and 15, SDR(31,15)1, are provided to the DMU. The DMU selectively
multiplexes these signals to the MSEQ flag bits, VALU(A,B)(0,1)0.
The SRC bus multiplexer is used to gate the SIR, SDR, IB, or HM to the SRC bus as selected.
Store Clocks and Selects combine duplicated clocks with control functions for the SDI registers. These clocks
and selects are generated by the Store Decoder.
A Store Decoder provides outputs that are used to generate clocks and selects for the SDI register.
The SSEQ coordinates activities between the SAT, CSU, and MM. During a memory access, intermediate
results are checked and MM interactions with the CC are controlled by the SSEQ.
The SDI provides the CC bidirectional data interface with the MASB, SD(35-32,27-00)1. The data transceivers
are enabled by the MM arbiter. Transceiver direction is controlled by the SAI.
Cache Data (CD) bus latches are provided for the UC.
The Store Address Interface (SAI) function is provided by a Store Interface (SI) ASIC operating in the SAI mode.
In the SAI mode, the SI ASIC provides a Store Control Register (SCR), a Store Sequencer (SSEQ), a set of SI
decoders, and the Store Address Update Registers (SAURs).
The SAI provides a DST bus interface for loading the Program Address (PA) counter, Store Address Register
(SAR), or SCR. The SAR is loaded with new information each time the MM is accessed. The SAI increments
the SAR by one word during an autofetch cycle or the MC writes the address (virtual or physical) over the DST
bus to the SAR. The SCR contains the control information for MM accesses.
The SAI provides an SRC bus interface for gating the contents of the PA, SAR, or SCR to the SRC bus.
The SAUR configuration allows either auto-increment or branch manipulations on both the PA and SAR. A
parity predict circuit determines new parity for the incremented value.
During CC MAS bus accesses, the SAI generates the MAS bus master control signals.
The SAI provides an SSEQ to coordinate activities between the Store Address Translator (SAT), Store Data
Interface (SDI), Cache Storage Unit (CSU), and Main Memory (MM) during CC memory accesses. The SSEQ
coordinates MM accesses.
The Store Address Translator (SAT) function is provided by the SAT ASIC, a set of MASB buffers, and a set of
The SAT provides a logical address interface between the virtual byte segments of the Store Address Register
(SAR), SAR(35-33,27-08)1, and the corresponding segments of the CA bus, CA(35-33,27-08)1. The least significant
SAR byte, SAR(07-00)1, and its parity bit, SAR(33)1, are passed directly to the Cache Storage Unit (CSU) and/or to
the MASB; no translation is necessary. SAR(10-08)1 are used with translated address bits (15-11)1 when
generating the parity bit, CA(33)1, for CA bus byte 3, CA(15-08)1.
The SAT contains the Address Translation Buffers (ATBs). The ATBs are a two-way set associative memory that
can be selectively read or written by microcode over the SRC or DST buses, respectively. ATB words or blocks are
invalidated using Store Control Register (SCR) interface signals, SCR(29-27,10-00)1, from the SAI.
The SAR provides either a virtual or a physical address to the SAT for processing.
If the address is a virtual address, the SAT determines if a physical translation exists in either ATB set. If a physical
translation exists, the SAT checks the read/write/execute permissions and generates a macrointerrupt if a violation
occurs. If no violation is detected, the SAT generates a translated physical address with correct parity. This
information is provided to the CSU and to the UC. If a physical translation does not exist, the SAT generates a
microinterrupt to the MicroSequencer (MSEQ) so that microcode can access and load the proper page table entry to
the appropriate ATB location.
If the address is a physical address, the ATBs are bypassed and the physical address flows through the SAT. If the
ATBs are not bypassed and a physical address is provided, a macrointerrupt or a microinterrupt is likely to occur.
The SAT accesses, controls, and maintains a two-way set associative ATB. Functions include hit detection
logic, protection check logic, associative addressing logic, ATB write logic (including invalidation), ATB read
logic, and error detection logic.
The SAT receives a virtual address and determines if a physical translation exists in either ATB set.
The SAT provides an SRC and DST bus interface for reading and writing selective ATB entries or locations.
A CC address interface to the MASB, SA(35-32,27-00)1, is also provided. The address drivers are enabled by
the bus arbiter on the Main Memory (MM).
The SAT ASIC also provides the SREG, SSR(03-00)1, and parity logic for the Instruction Multiplexer (IM),
Processor Status Word (PSW), Pulse Point Register (PPR), Channel Data Register (CDR), and the Central
Control Input/Output Data (CCIOD).
The Cache Storage Unit (CSU) function is provided by the Cache Controller (CAC) ASIC, six 32-K by 9-bit SRAM
devices, three sets of tristate buffers for bus isolation, and one set of data transceivers for TAG RAM maintenance.
The CSU increases CC performance by reducing the average main memory access time. It provides two distinct
high-speed memory functions as follows:
The CSU provides a 16-K word (64-K byte) direct-mapped data and instruction cache memory. The memory
control logic recognizes, stores, and provides the contents of the most recently accessed MM locations.
A write-through scheme is used to maintain cache and main memory coherency during write operations.
A CSU memory read cycle completes within two clock cycles (60 nanoseconds), not including two cycles for
address translation.
The Cache Address (CA) bus parity, supplied by the SAT, is checked while the address is supplied to RAM. If
parity is correct and the upper address segment matches the corresponding tag entry, a cache "hit" occurs and
the corresponding data is written to or read from the cache data memory. During a write operation, the data is
also written to MM. If the upper address segment and tag entry do not match, a cache "miss" occurs and the
SAI accesses MM. During a read "miss," the MM data word is written into the cache data memory and the
corresponding tag memory location is updated with the new address information. During a write "miss," no
changes to cache memory are made.
The cache is not affected during Direct Memory Access (DMA), Expansion (EX) circuit pack, and Other Store
(OS) read operations. DMA, EX circuit pack, and OS write cycles require cache activity. DMA, EX, and OS write
accesses to MM transfer one word or four words (a quad word) of data in sequence. During single word DMA,
EX, and OS write operations, a cache tag memory location is indexed and its contents are compared with the
MAS address. If a match occurs, a hit is generated and the cache tag is invalidated. During DMA and EX quad
word write cycles, all four tag entries are checked for "hits." Any "hit" results in the invalidation of the
corresponding tag entry.
A cache bypass mode is provided that inhibits the hit detect logic during read cycles, thus forcing all accesses
to MM. In the bypass mode, the cache is updated during all read operations and is invalidated on MM writes
when a hit occurs. Write operations are not affected by the bypass mode and are performed the same as in
normal operation. The cache is, therefore, kept current with MM when bypassed. All cache errors are disabled
in the bypass mode.
Bypass mode selection can change states only during initialization. This is because of the interrupt stack data
stored in the cache data RAMs. The CSU may have the only copy of this data when the bypass is asserted.
The CSU provides data during byte and halfword memory read accesses when a "hit" occurs. Byte and
halfword memory write accesses result in a CSU update if a "hit" occurs.
The Data Manipulation Unit (DMU) function is provided by the DMU ASIC. The DMU ASIC contains data
manipulation logic, Find-Low-Zero (FLZ) logic, Bypass ALU logic, temporary registers, firmware registers, and a
partial Bidirectional Gating Register. The ASIC also provides parity checking and redundant logic for error detection
and reporting.
The data manipulation logic provides data rotation, bit masking, and an Arithmetic Logic Unit (ALU) that
performs arithmetic and logical operations on 32-bit words. The Data Manipulation Logic receives data from the
SRC bus and gates the resulting data to the DST bus.
The FLZ logic identifies the bit position of the first zero found from the least significant end of the data word or
source register.
The Bypass ALU logic transfers data from the SRC bus to the DST bus without any manipulation.
Sixteen Temporary 32-bit (one word) registers are provided for "scratch pad" storage.
Sixteen Firmware 36-bit (one word, 32 data bits and 4 parity bits) registers are provided for instruction storage.
A partial Bidirectional Gating Register (BGR), bits 31-28 and 11-00, is provided. The BGR interfaces with the
SRC and DST buses and accommodates the MC interface to and from the BGB.
Because parity cannot be passed through the ALU, the ALU function is duplicated for error detection. The
output results from each unit are compared with each other to detect data discrepancies. (The DMU General
and Q registers do not have parity protection.)
The MTC bus parity generation logic is provided. Bus parity is calculated and transferred to the MCH as bits
MTC(35-32)1.
Most of the Special Register (SREG) function is provided by two SREG ASICs; one SREG ASIC operates as
SREG0, the other ASIC operates as SREG1. Discrete logic provides the Special Register Programmable Array
Logic (SRPAL). Special registers are 32-bit data storage elements used to hold hardware and software information.
The least significant bits of the 32-bit registers (bits 15-00) are provided by SREG0. The most significant bits of the
32-bit registers (bits 31-16) are provided by SREG1.
The HSR, SSR, ER, and IS register are 32-bit registers. The PSW register, PPR, IM register, and CDR are 36-bit
registers (32 data bits with 4 parity bits). Register interfaces are provided to the SRC, DST, CCIO, and MTC buses.
The MTC bus is used to verify the proper operation of the processor.
The TR provides a Sanity Timer, Interrupt Timer (IT), and prescalars for the RTC and IT.
The CCIO backplane interface is provided. This interface includes data, address, and control signals.
The Hardware Status Register (HSR) contains control and status information. Bits 07-04 are read only, and bit 05 is
wired to zero. All other bits can be written and read.
The HSR is loaded from the DST bus (except for the read-only bits), and read via the source bus and the destination
bus.
The Processor Status Word (PSW) register controls program function and records program status. The PSW
outputs are read and tested by microcode.
The PSW is loaded via the DST bus (except for read-only bits) and is read via the SRC bus and the MTC bus.
The Pulse Point Register (PPR) is used to generate control pulses. The PPR normally contains all zeros. An
immediate data microinstruction asserts a bit via the destination register, and another immediate microinstruction
then clears (negates) the bit. PPR points are used as miscellaneous control points under microinstruction control.
The PPR is read via the SRC bus. The PPR is cleared on power up.
The PPR bits and resulting actions when they are asserted are summarized in Table 5-13 .
The System Status Register (SSR) contains processor status information. The SSR is loaded via the DST bus
(except for read-only bits) and is read via the SRC bus and the MTC bus. The SSR is asserted low; that is, an
asserted bit reads back as a zero. The bits in the SSR are summarized in Table 5-14 .
The Error Register (ER) consists of 32 bits that are asserted by hardware faults. The ER is asserted low; that is,
asserted bits signifying errors are read as zeros. The ER is read via the SRC bus and the MTC bus. Most bits in the
ER are individually clearable via the DST bus; however, some can only be cleared by resetting the circuitry that
caused the error. The bits and the resulting actions when they are set are summarized in Table 5-15 .
The Interrupt Mask (IM) register bits are set or cleared by the microprogram via the DST bus. The IM is also read
via the SRC bus. Each bit in the IM register corresponds to a bit in the Interrupt Set (IS) register. A bit set in the IM
register prevents the recognition of the corresponding interrupt set in the IS register.
The 32 bits of the Interrupt Set (IS) register are set by external signals or interrupts. The IS register is also known as
the Interrupt Source register. If a bit in the IS is set and the corresponding bit in the IM is cleared, an interrupt signal
is generated. The IS is read via the SRC bus.
The Channel Data Register (CDR) is used to interchange data between the SRC or DST bus and the CCIO bus. It is
loaded from either the DST bus or the CCIO bus and is read from either the SRC bus or the CCIO bus. It is loaded
from the DST bus as part of a move microinstruction and loaded from the CCIO bus in response to an I/O
microinstruction. Thus, there are no interference problems; the CDR cannot be loaded from two different sources at
the same time.
The CCIO bus is used to transmit data, address, and control signals between the Central Control (CC) and the main
I/O channels. These I/O channels are the Direct Memory Access Controller (DMAC) and the Dual Serial Channels
(DSCH).
The Real-Time Clock (RTC) is a 32-bit synchronous counter that is normally incremented at a 1-ms rate. The RTC
is read via the SRC bus and is loaded via the DST bus. For diagnostics, the RTC can be single stepped using the
HSR and PPR. The RTC is used as a systems clock when time, day, or date is required.
The timers are used as prescalars for the RTC, as interrupt timer prescalar, interrupt timer, and sanity timer. The
timers are readable via the SRC bus and loadable via the DST bus. The timer bits and their functions are
summarized in Table 5-16 .
The Maintenance Channel (MCH) function is provided by an MCH ASIC, MCH microcode EPROMs, a set of
bidirectional latches, a group of RS-422 transceivers, and a 20-MHz clock oscillator.
The Maintenance Channel provides diagnostic and maintenance access to the 3B21D computer. Both processors
are linked via a serial interface called the Maintenance Channel Link (MCHL). The MCH circuitry sits at both ends of
the MCHL. A processor sends commands and data to its MCH using the Bidirectional Gating Bus (BGB). In turn,
this MCH can relay this information across the MCHL to the MCH in the other processor for processing. Therefore,
an MCH can respond to master commands from its processor or to slave commands from the other processor. In a
3B21D computer running in duplex mode, the MCH in the active or on-line processor is called the master MCH; the
MCH in the inactive or off-line side is called the slave MCH.
The active processor stops and then uses the MCH to signal the other processor to switch on line (stop and
switch). This can be performed by the processor logic directly activating the STPSW0 input to the master MCH.
Alternately, it can be done under microprogram control where a command is sent to the MCH. In both cases,
the MCH responds by sending an interrupt to the other MCH using the REQA signal in the MCHL. When the
other MCH receives this interrupt, it activates its MRF0 output, which causes the other processor to go on-line.
If the other processor is already on-line, and not disabled, the receiving MCH does not activate MRF0. Instead,
an error is recorded.
The MCH interfaces with the Boundary Scan Master (BSM) device on the KLW31 circuit pack. Both master and
slave commands are available to access the BSM interface, allowing a processor to communicate with the BSM
devices on both the active and inactive CUs. Diagnostics only accesses the inactive CU's BSM device. The
BSM interface to the MCH uses an 8-bit parallel data bus.
The active MCH interprets and executes commands received from the active processor via the BGB.
Commands fall into the following categories:
The slave MCH can also execute the previously described commands. However, it is normally expected to
execute slave commands received across the MCHL, as its processor is expected to be inactive. The slave
commands include the following:
Read and report MTC bus data. The slave MCH can report on the SRC bus, DST bus, Hardware Status
Register (HSR), Error Register (ER), Processor Status Word (PSW), and the System Status Register
(SSR).
Read and write the MSA and MSD buses. In conjunction with the ability to step the microsequencer, this
capability allows microcode to be loaded into the Writable MicroStore (WMS) and to execute it one
microcommand at a time.
Figure 5-15 is a functional block diagram of the MCH. Table 5-17 summarizes the MCH signals. The internal logic
of the MCH is under microprogram control. Although two 8-K by 8-bit EPROMs contain the MCH microcode, the
MCH only uses 2 K of address space. The differential signals in the MCHL are converted by the RS-422 circuitry to
logic signals for the MCH. The 64-bit MSD bus is multiplexed and requires the external registers. The BSM interface
allows the MCH to control BIST and boundary scan activities. Note that the MCH boundary scan port is not used.
(MCHL)
DAHAN RS-422 I/O Serial link high-order bits, negative phase.
ALAP RS-422 I/O Serial link low-order bits, positive phase.
DALAN RS-422 I/O Serial link low-order bits, negative phase.
XCKAP RS-422 IN Serial link clock input, positive phase.
XCKAN RS-422 IN Serial link clock input, negative phase.
CLKAP RS-422 OUT Serial link clock output, positive phase.
CLKAN RS-422 OUT Serial link clock output, negative phase.
TXEN0 OUT Enable external DAHA and DALA RS-422
drivers.
RXEN0 OUT Enable external DAHA and DALA RS-422
receivers.
REQAP RS-422 I/O Link stop and switch interrupt, positive
phase.
REQAN RS-422 I/O Link stop and switch interrupt, negative
phase.
BOUNDARY SCAN TDO OUT Test Data Output.
TEST ACCESS PORT TDI IN Test Data Input.
TMS I/O Test Mode Selection.
TCK I/O Test Clock.
TRST IN Test Reset. TRST is not connected to the
boundary scan bus. TRST is connected to
either an internal power reset or to a system
power reset signal.
MISCELLANEOUS MCHMCD(19-00)1 IN MCH microcode ROM data input.
MCHMCA(9-0)1 OUT MCH microcode ROM address output.
STPSET0 Open OUT Set Central Control (CC) stop. Pulsed as a
Collector result of a slave command.
STPCLR0 Open OUT Clear Central Control (CC) stop. Pulsed as a
Collector result of a slave command.
CLRER0 Open OUT Clear system error register. Pulsed as a
Collector result of a slave command.
PTRST0 Open OUT Program (sanity) Timer Reset.
Collector
TRIST0 IN Tristate MCH outputs.
MISC. (Contd) TESTOUT OUT Used in MCH ASIC component parametric
test.
STOP0 IN Stop Central Control (CC) sequencing (from
MLTS).
STPSW0 IN Stop and switch from local SREG.
PINT0 Open OUT Panel Interrupt, set on receipt of particular
Collector slave command, interrupts CC.
MDISA0 Open OUT To Special Register (SREG). Pulsed as a
Collector result of slave command.
MDISB0 Open OUT To Special Register (SREG). Pulsed as a
Collector result of slave command.
SCLK201 IN Maintenance Channel clock input (20 MHz).
PONL0 IN Processor On-Line (from SREG).
DISAB0 IN Disable (from SREG).
MLTMCR0 IN Micro Level Test Set to Maintenance
Channel bus release signal.
MLTMCI0 IN Micro Level Test Set to Maintenance
Channel inhibit signal.
MCHINT0 IN Maintenance Channel Initialize (from SREG).
MCHER0 Open OUT Maintenance Channel Error. Pulsed on
Collector inappropriate slave commands or on
inappropriate MCHL interrupt signals.
MRF0 Open OUT Maintenance Reset Function, commands
Collector inactive processor to become active. Pulsed
in response to MCHL interrupt signal.
STEP0 Open OUT Single Step (pulsed under microprogram
Collector control).
BOUNDARY SCAN BSMDATA I/O BSM Port serial data to/from the BSM.
MASTER (BSM) PORT
BSMDS OUT BSM Port Strobe paces serial data to/from
the BSM.
BSMADRS(1-0) OUT BSM Port Address, controlled by the BSM
Port control and status register.
BSMRD OUT BSM Port Read.
BSMINT IN BSM Port Interrupt.
BSMSELCLK OUT Boundary scan chain selector clock.
BSMTCLK OUT BSM Timing Clock references supplied to the
BSM by the MCH.
The BGB interface is used by the processor to communicate with the MCH. Associated with this data bus are control
signals that are driven by bits in the Hardware Status Register (HSR) and Pulse Point Register (PPR). Table 5-18
summarizes these controls. All signals are asserted low.
Therefore, MCH transactions are executed by setting up the Hardware Status Register for the proper read/write
condition, and then asserting the appropriate pulse points to transfer the data on the BGB bus.
NAME NAME
BGBPP00 PPR 0 Executes MCH Command.
BGBPP10 PPR 1 Resets MCH microsequencer.
BGBPP20 PPR 2 Writes MCH Master Command.
BGBPP30 PPR 3 Writes Data to MCH.
BGBPP40 PPR 4 Clears Panel Interrupt.
BGBRW0 HSR16 1 to read BGB, 0 to write BGB.
BGBRS00 HSR17 1 to read status, 0 to read data.
BGBEN0 BGBEN20 Enables previous commands. Active when HSR[23-20] = 1010.
MCH commands are placed on the BGB bus and the write master command pulse point is asserted. Then the
execute command pulse point must follow. The master command is a 16-bit word written to the 36-bit BGB bus.
BGB bits 35-16 are ignored. Most commands will take at least 40 MCH clock cycles to execute. If a command
results in a slave transaction, execution time can take 140 to 200 cycles. The MCH has a bit in an internal status
register that is zero while the MCH is executing a command. This register can be read at any time to determine the
MCH status; that is, to see if the MCH is idle.
MCH data is read and written on the 36-bit BGB bus. This data can consist of internal status register information,
register data sent from the other processor, microstore addresses and data, and BSM data.
The MCH microsequencer uses a 32-bit command word. It has the capability to branch anywhere in its 2-K address
space. Although the MTC bus is read only, the MCH microsequencer can move data between the major MCH
external bus interfaces, MSD, MSA, MTC, BGB, and BSM. An internal accumulator with increment, decrement, byte,
and bit rotation capability is provided.
The MCH uses the BSM interface to access the BSM device and the KLW31 boundary scan select logic. The
internal MCH BSM control register is programmed to allow the MCH to access either the BSM or the BSM select
logic.
Asserting the STPSW0 input to the MCH ASIC causes it to send an interrupt on the MCHL link. The same result can
be achieved by entering the "sendsw" master command. When the STPSW0 approach is used, the resulting
REQAOUT interrupt from the MCH is used with the STPSW0 signal to automatically set the STOP flipflop. When a
master command is used, the processor must stop itself.
On receipt of a stop and switch interrupt, the MCH ASIC activates the Maintenance Reset Function (MRF0) output.
This initiates a reset on the previously inactive processor. If the MCH senses that the processor is already on-line,
and not disabled, then it will NOT assert MRF0. Instead, a maintenance channel error is indicated by asserting the
MCHER0 output.
The Emergency Action Interface (EAI) function provides the following capabilities:
The Emergency Action Interface (EAI) function provides a means of manually forcing certain system recovery
configurations if the automatic system error recovery is unsuccessful. The EAI is accessed via the Maintenance
Terminal Controller (MTTYC) through the maintenance terminal. Emergency action requests can also be entered
remotely via the Switching Control Center (SCC). The EAI also captures the Processor Recovery Messages (PRMs)
and forwards them to the MTTYC.
MTTYC Initiated Operations: The EAI receives and decodes a serial message from the MTTYC and carries
out the requested action. The action might involve changing the state of the emergency action nodes, initializing
the EAI, initializing the CC, or returning a status message.
CC Initiated Operations: The EAI responds to stimuli from the CC by accepting data, performing maintenance
operations, or signaling the MTTYC that a significant system event has occurred.
EAI Initiated Operations: The EAI can signal the MTTYC that an EAI internal audit has failed.
Table 5-19 summarizes the EAI force functions. Table 5-20 summarizes the EAI initialization functions. Table
5-21 summarizes the EAI Pulse Point Latch Clear Register. Table 5-22 summarizes the 3B21 computer EAI
normal pulse point functions. Table 5-23 summarizes the 3B21D computer EAI maintenance pulse point functions
Table 5-24 summarizes the 3B21D computer EAI maintenance commands. Note that the 3B21D computer uses
both the 3B20D computer and 3B21D computer maintenance pulse point functions.
The Emergency Action Interface function on the Central Control (CC) circuit pack is provided by a
microprocessor-based circuit with an 8-MHz clock. Figure 5-16 is a functional block diagram of the EAI.
FUNCTION DESCRIPTION
Clear EAI (CLREAI) Causes the outputs from the EAI to the CC to be reset, and clears the EAI RAM
associated with the initialization parameter (IP) buffer.
EAI Maintenance Reset Function Forces the associated CC to initialize (MRF).
(EAIMRF)
Input Initialization Parameter (INIP) Transfers 64 bits of 3B21D computer system initialization parameter (IP) from the
MTTYC to the EAI, where it is buffered in RAM.
Output Initialization Parameter (OUTIP) Transfers the contents of the EAI IP buffer to the MTTYC for verification.
Output EAI Status (OUTSTAT) Transfers a status message to the MTTYC.
Output PRM (OUTPRM) Transfers the 64-bit Processor Recovery Message (PRM) output buffer to the MTTYC.
The EAI microprocessor is a 16-bit processor. The 16-bit, time-multiplexed address/data bus (AD) carries address
and data to all functional areas of the EAI. The processor contains programmable chip-select generation logic that is
used to implement the EAI address map. Each functional area (EPROM, RAM, Port A, Port B, Error Register, and
others) is assigned an initial address that is used to access a particular EAI device.
CC Status
CC status signals are read via EAI input Port A via the Address/Data (AD) bus bits 08-00. EAI Port A is
defined in Table 5-26 .
Initialization Parameter (IP)/Processor Recovery Message (PRM) Buffer The CC sends a 64-bit Processor
Recover Message (PRM) to the EAI or reads the Initialization Parameter (IP) from the EAI during various
phases of initialization. The PRM is transferred over the low 4-bits of the CC System Status Register to the
Diagnostic/Recovery Data (DRD) bus under the control of pulse points PP110, PP220, and PP230. The
MTTYC writes the IP at initialization. The CC reads the IP from the EAI SRAM. These messages are
transferred as sixteen 4-bit nibbles.
0 1 0 Reads the DRD and stores the four bits in the buffer at the location pointed to by the
Array Pointer.
1 0 0 Causes the DRD to be used as the new Array Pointer and places the nibble of the IP
buffer on the PB as indicated by the Array Pointer.
1 1 0 Indicates the start of a 3B21D computer initialization sequence.
0 0 1 Resets the EAI microprocessor and hardware, then begins power-on firmware
initialization sequence.
0 1 1 Halts the EAI microprocessor and isolates the PB, FONL, FOFL, DTIM, EAEN,
EAIMRF, FBDP, and FBDS signals from the CC until a CC power-up or a EAI pulse
point reset (PPR23=0, PPR22=0, PPR11=1) occurs.
1 0 1 Clears Error Register nibbles 0 and 1.
1 1 1 Causes the DRD to be used as the new Error Array Pointer and places the nibble of
the Error Register on the PB as indicated by the Error Array Pointer.
The EAI EPROM contains the EAI firmware. The program memory consists of two 32-K by 8-bit EPROM devices.
Data is output to the Address/Data (AD) bus.
The EAI RAM consists of two 32-K by 9-bit SRAM (25 ns) devices. The RAM is used by the EAI firmware for
temporary storage, data buffers, flag registers, and stack data.
The Processor Recover Message (PRM) is also stored in the RAM. The PRM is sent to the EAI by the CC during
various phases of system initialization via the 4-bit DRD bus. The DRD bus is the output of the CC System Status
Register (SSR), bits 03-00, under the control of three pulse points (PP11I0, PP22I0, PP23I0). The EAI forwards this
information to the maintenance TTY controller for display on the maintenance terminal.
Emergency action requests are entered via a maintenance terminal. This interface is an RS-422 operating at 9600
baud with even parity and 7 bits per character. Status changes and processor recover information sensed by the
EAI are sent to the maintenance terminal via the RS-422 interface. Table 5-29 summarizes the EAI/MTTYC
RS-442 signals.
The EAI status information is displayed via five light-emitting diode (LED) indicators as defined in Table 5-30 . The
indicators are located on the Central Control (CC) circuit pack (KLW31) faceplate.
The Micro Level Test Set (MLTS) Interface circuit is on a circuit module (CM369A) that plugs into the Central
Control (CC) circuit pack (KLW31).
Figure 5-17 is a functional block diagram of the MLTS Interface. The MLTS Interface circuit provides the
connections between the MLTS host (TN16) and the CC. The functions supported by the MLTS Interface circuit are
as follows:
Break point matcher stops the CC when a pattern on the MSA bus is recognized.
MCH circuit inhibit, which isolates the MCH circuit, preventing it from interfering with the MLTS control of the
CC.
Bus access provides the capability of reading and writing to the major CC buses (BGB, MSD, MSA, and MTC
buses).
MicroStore access provides the capability of reading the entire microstore and writing to the entire Writable
MicroStore (WMS).
Power clear provides the capability of power clearing the CC for master initialization.
Clear and set provides the capability of clearing (negating) or setting (asserting) a number of important CC bits
or registers such as Panel Interrupt, STOP bit, Sanity Timer, Disable bit, and the Error register.
Figure 5-17 Micro Level Test Set Interface Functional Block Diagram
6. CONTROL UNIT FUNCTIONAL DESCRIPTIONS MAS, MASU, DMA, DSCH, UC, and
EX
The purpose of the Main Memory (MM) circuit pack is to provide the 3B21D computer main storage memory, which
includes the following functions:
DRAM Control
Refresh/Error Scrubbing
Update/Arbitration
Figure 6-1 is a functional block diagram of the Main Memory circuit pack (KLW32, KLW40, KLW48, KLW64, or
KLW128). Main Memory is accessed via the Main Store Bus (MASB) or through the Update Bus. The MASB allows
CC, DMA 1, DMA 0, the other CC, and the two expansion slots (EX 0 and EX 1) access to MM. The Update Bus
links the active memory (My Store) to the off-line or standby memory (Other Store) and provides a Backup
Maintenance Channel. The MASB allows asynchronous communication with the CC, DMAs, and expansion slots.
The backup Maintenance Channel is via the Update Bus cabling, but has no functionality to the memory. The
Backup Maintenance Channel is a group of four CC signals that are passed through the MM circuit pack and
through the Update Bus cabling. These four CC signals are not connected with any logic in the MM circuit pack but
enable the two processors to communicate if the regular Maintenance Channel has failed.
MAINTENANCE (negative)
CHANNEL LINK PODISAP OUT Pulse Point Register bit 14 to other side
(positive)
PODISBN Differential OUT Pulse Point Register bit 15 to other side
(negative)
PODISBP OUT Pulse Point Register bit 15 to other side
(positive)
BACKUP (Contd) PUDISAN Differential IN Pulse Point Register bit 14 from other side
(negative)
PUDISAP IN Pulse Point Register bit 14 from other side
(positive)
PUDISBN Differential IN Pulse Point Register bit 15 from other side
(negative)
PUDISBP IN Pulse Point Register bit 15 from other side
(positive)
The memory array is made up of Dynamic Random Access Memory (DRAM). The 3B21D computer simplex system
contains a minimum of 32 MB of memory and a maximum of 128 MB in increments of 32 MB. The system is
designed to accommodate 28-bit address buses and registers for future expansion to 256 MB. The current design
uses only 27 of the 28 address bits. Even parity is maintained across data, command, and address.
The DRAM interfaces to the system via the MASB. The arbitration circuitry determines priority of the requester and
allows read and write access. The data signals from the MASB are buffered and conditioned by error and correction
circuitry. The store data is 39 bits wide (32 data bits, 7 parity/check bits). The physical addressing is 27 bits wide
with 4 bits of even parity. The address and parity signals are buffered and then control circuitry multiplexes the
address bits into row and column addresses for DRAM accesses. Parity is verified across the bus.
The update circuitry interfaces the active CU's DRAM to the other CU's DRAM maintaining a memory image on the
other Store to provide a clean processor switch over.
The memory array consists of 4-megabit (Mb) by 4-bit DRAM devices with 80-ns access times. The 32-MB
configuration uses twenty discrete 16-Mb DRAMs. To expand memory size by 32 MBs, Single In-line Memory
Modules (SIMM) with twenty 4-Mb by 4-bit devices are inserted. The module is 8 Mb deep by 40 bits wide and meets
the standard Joint Electron Device Engineering Council (JEDEC) outline. Three 72-pin SIMM connectors are used to
upgrade the system in 32-MB increments to 128 MB. These connectors seat the SIMMs at a 22.5-degree angle. The
input and output data is multiplexed to the same data pins, controlled by an enable. The device addressing requires
an 11-row, 11-column address multiplexing with a 2-K refresh in 32 milliseconds. The 16-Mb devices are packaged
differently from other DRAM devices. The lead-on chip with center board (LOCCB) maintains uniform input pin
capacitance. Two metal bus lines run parallel above the length of the device to connect dual Vcc and Vss pins. This
structure reduces resistance, inductance, and electrical noise.
The following list of DRAM control signals provide the correct timing protocol to the DRAM devices:
Data
Address
Different protocols exist for the corresponding operations. A normal read or write access requires single row and
column address strobes (RAS and CAS) with the multiplexed address. The OE signal controls the direction of the
data to/from the DRAM and WE signals read or write operations. The read-modify-write mode selects a single row
and column address while changing the control signals. Fast page mode allows reading or writing of several words
by supplying a single row address and strobing consecutive column addresses. Fast page mode provides the
protocol for quad word accesses. The DMAs and Expansion (EX) slots use this feature. The memory controller
supports the following cycle types:
The full word is identified as having 32 bits and 4 parity bits. The half word and byte addressing is controlled by
address bits 1 and 0 (SA01 and SA00), the control signals for half word (SHALF,SUHALFP/N), and byte
(SBYTE,SUBYTEP/N). See Table 6-2 .
Data from a bus master is passed with even parity on each valid byte. When a byte(s) is invalid, odd parity is passed
with that byte(s). Parity bit SDP0 corresponds to parity over byte 0 with the remaining parity bits SDP3-1
representing the bytes 3-1.
Other commands are necessary for defining writes and reads (SWRT), quad word transfers (SQUAD),
read-modify-writes (SRMW), and store maintenance access (SMAINT). An even parity bit is provided across the
command signals.
The DRAM Control is invisible to the MASB and Update Bus. Command signals are passed across these buses to
provide information to the DRAM controller.
A Memory Controller with Error Regulation and Test (MCERT) ASIC device is used to perform several memory
functions. The MCERT device runs at 33 MHz to provide input signals to the DRAMs. The MCERT device requires
the CC to program up to 17 registers for the control mode. The CC can gain access to these registers through an
expanded address map in the maintenance mode. The device has two modes of operation: control (MC) and data
(DP). The MCERT device is used for the DRAM control, refresh, Error Detection and Correction (EDC), parity
checking, memory test, and power up functions on the MM pack. The MCERT device reduces board area that would
be required by discrete components. Additional parity checking is needed because the MCERT device addresses
based on word boundaries (for example, quad word, half word, or full word) and assumes even parity. This affects
byte 3 where bits 0 and 1 are not used.
Refresh interval/generation
Error status
The MCERT device has a programmable data and address First-In First-Out (FIFO), providing a maximum depth of
four entries. A full and a full -1 flag are also programmable for use in quad word transfers to hold the bus master
from putting more data/address information on the MASB or Update Bus. This also enables the device to look
ahead to the row and column addresses. Accesses to consecutive addresses allow the device to shorten what
would be two full access cycles to a long single access (that is, remove the precharge and leave RAS low while
bringing CAS low consecutively with new column address information).
The refresh function is required due to the nature of DRAM devices. An RAS-only refresh cycle is used with error
checking and correcting performed (error scrubbing). The 4-Mb by 4-bit DRAM configured with 11 rows and 11
columns requires a 2-K refresh in 32 milliseconds. The MCERT provides a refresh rate of 15.3 microseconds for the
2048 rows, performing a full DRAM refresh in 31.33 milliseconds. An address counter and a watchdog timer are
used to ensure each row is refreshed in the required time frame. If the first refresh request is not performed and the
request reset, a second refresh is requested. If the controller is still busy, the controller aborts its operation and does
two refresh cycles sequentially. An abort error flag is set and latched in the MCERT device running in the control
mode. A general error signal is output from the MCERT device to signal the error.
The refresh function interfaces the DRAM controller, the DRAM devices, the EDC function, and error reporting to the
CCs. The refresh function is invisible to the rest of the system unless an error occurs and requires reporting to the
CCs.
Memory array refresh is performed by the DRAM control circuitry (MCERT) using an internal timer, an address
counter and error address latch, automatic correction of single bit errors, and error reporting of single and multiple
bit errors during the scrub function. The refresh/error scrubbing functions are internal to the MCERT device. The
functions are accomplished through the connection of two MCERT devices; one in the MC mode, performing the
refresh and one in the DP mode for error checking. The hardware will RAS-only refresh on all 16-MB increments,
but error scrub each 16-MB bank individually and continue to the next 16-MB bank.
6.1.4 Update/Arbitration
The update function is used in fault tolerant design to maintain a mirror image of memory on the other side for
switch over, if it is in standby. Update is performed when the DRAM is written. When the write is not controlled by
the CC, then a signal (CAINVL0) is sent to the CC to invalidate the cache.
The arbitration function is software changeable. Arbitration is done on the devices that have access to the MASB
and Update Bus. These are the CC, DMA 0, DMA 1, the other CU, and the two expansion slots (EX 0 and EX 1).
The function allows software to set priorities to each possible bus requester. If two or more requesters are asking for
the bus with the same priority, a round-robin scheme is used. The highest priority is other CU access, followed by
"my" CC access.
Both the update and arbitration functions use the MASB and the Update Bus for memory accesses. Each device
has a set of signals that make up the memory access protocol. These signals are Store Go, Abus, Dbus, Data
Strobe, and Store CoMplete. The functional hardware accepts requests, arbitrates to provide the six possible
requesters access, then provides address and data enables and cycle complete signals. The arbitration circuit
informs the memory control logic that a memory access has started.
When the DMAs, Expansion slots, or the other CU are bus masters, the arbitration circuitry provides a cache
invalidate signal (CAINVL0) for a write or read-modify-write cycles. The cache in the other CU is not invalidated on
updates to memory from the active side.
Memory array EDC uses the flow-through method. During a word write, the data flows through the EDC device and
seven check bits derived through an algorithm on the data are output. The 39 bits are then stored in DRAM. When a
word read is requested, the data (39 bits) is sent to the EDC device to check for errors. Syndrome bits are created
to define the bit or multiple bits in error. If a single bit error is detected, data is corrected and an error flagged and
reported. If a multiple bit error is encountered, data is not corrected, and a multiple bit error is flagged and reported.
The address at the time of the error is latched and can be read via the maintenance addressing of the MCERT
device.
When byte or half-word write cycles occur, a read from that address in DRAM must extract the non-modified data
and overlay it with the new data, then create new check bits. Now the 39 bits of data are placed in memory.
The EDC function interfaces to the control function circuitry for reads, writes, and refreshes. It also reports errors
that go to My CC via the MSB and to the Other CC via the Update Bus. The data paths are to and from the MSB and
to and from the DRAM.
The MCERT device is also used for the EDC function on the memory pack. It is connected to the other MCERT
device used for the DRAM control functions. The device uses a seven-bit hamming algorithm to identify single-bit
errors given the syndrome bits. Multiple-bit errors are identified but not corrected. The correction of data is done
internally using temporary registers and providing good data in the read data queue.
The MM reports five types of errors to the CC. Their severity can cause a stop and switch. The address is latched
when an error occurs. The five error types are as follows:
MYSERC Multiple-bit data error. CC Error Register bit 8, Stop and Switch.
MYSERD Single-bit data error. CC Error Register bit 20, Single bit correctable or Stop and Switch for
multiple bit error.
OSTIMEOUT Other Store access time-out (5.6 microseconds). CC Error Register bit 15.
OSTIMEOUT is a time-out started by the "go" signal and ended with the "complete" signal. The CC contains a timer
that watches the CU's memory for cycle completion. It is called the MYTIMEOUT and is located in CC Error Register
bit 7.
The MYSER(A,B,C,D) signals belong to the MASB. These signals go to DMA 0, DMA 1, Special Registers (SREGs)
0 and 1, the cache storage unit (CSU), and the Store Address Interface (SAI). The active memory circuit pack feeds
the My Store Errors to the other store through the Update Bus [SUERR(A,B,C,D)]. The other store passes these
signals to its SREG [OSTER(A,B,C,D)]. My Store also receives the Other Store Errors [SUOERR(A,B,C,D)] and
sends them to the SREGs [OSTER(A,B,C,D)].
The Self-ID (SLFID) circuit provides the means for a Central Control (CC) to interrogate the MM circuit pack for
identification information (version, issue, and so forth). The circuit operates independently from the other circuit pack
functions.
The circuitry consists of transceivers to interface the SLFID bus with the circuit pack, an ID field that is the bus
address of the circuit pack, an address register to store the incoming bus address, a comparator to compare the ID
field to the bus address, a binary counter to generate the programmable read-only memory (PROM) address, and a
PROM that contains the circuit pack ID information and control lead interface and logic.
The Boundary Scan (BS) interface to the MM circuit pack is via the primary BS bus. The BS bus is a serial bus used
to test (diagnose) components. All boundary scan functions are controlled by the CC.
The Backup (or emergency) Maintenance Channel is a second processor-to-processor communications link. The
Backup Maintenance Channel used when the regular maintenance channel is either not functional or when it is
necessary for the active processor to maintenance reset the other processor. The Backup Maintenance Channel
consists of four signals. The outputs from Pulse Point Register (PPR) bits 14 and 15 in each processor are
connected to logic in the other processor. The signal connections are made by routing the pulse points from the
KLW31 circuit pack to the MM circuit pack (KLW32, KLW40, KLW48, KLW64, or KLW128). At the MM circuit pack,
the logic signals are converted to differential signals and included as part of the update cable between the
processors. Therefore, eight wires are used to carry the four signals in the Update Bus. The transmitting side of the
Backup Maintenance Channel is the PPR. The receiving end includes the Hardware Status Register (HSR), System
Status Register (SSR), and the reset logic.
As shown in Figure 6-2 , pulse points 14 and 15 (PPR14 and PPR15) from the other processor come in as signals
PDISA0 and PDISB0 to the HSR where they are registered as HSR bits 8 and 9. They also go to reset logic. Pulsing
PDISA0 and PDISB0 in certain sequences will disable the receiving processor and then cause it to reset. To disable
the processor, PDISA0 and PDISB0 are pulsed in sequence. This action will also set SSR bit 30, and IO is inhibited
to that processor. If the next pulse is a PDISA0, then that processor will do a maintenance reset. The pulses are
activated by writing sequentially to PPR14 and PPR15 in the active processor. This is done by the software when it
deems vital to reset the other processor and the regular maintenance channel is determined to be not working.
6.2 DIRECT MEMORY ACCESS (DMA) AND DUAL SERIAL CHANNEL (DSCH)
Figure 6-3 is a functional block diagram of the DMA circuit pack (KBN15). The 3B21D computer supports two
DMAC/DSCH units (KBN15 circuit packs). For a description of the Central Control Input/Output (CCIO) bus, Main
Store Bus (MASB), and Boundary Scan (BS) bus, see "Central Control (CC)" in Section 5 .
The Direct Memory Access and Dual Serial Channel circuit pack (KBN15) transfers data between peripheral devices
and main memory. It allows programmed I/O between peripheral devices and the CC. The DMAC/DSCH consists of
one direct memory access controller and four I/O channels. Each I/O channel supports four peripheral devices.
Therefore, a DMAC supports 16 peripheral devices.
The specific functions of the DMAC/DSCH (DMA circuit pack) are as follows:
Interfaces with the Duplex Dual Serial Bus Selector (DDSBS) in the Disk File Controller (DFC), Input/Output
Processor (IOP), and application peripherals through the DSCH interface.
Converts the dual serial streams of data received from the DDSBS into a 36-bit (32 data bits and 4 parity bits)
parallel format.
Decodes and arbitrates the interrupts, DMA setup requests, and DMA transfer requests received across the
DSCH interface from the peripheral devices.
Translates the virtual addresses used by the peripheral devices to physical addresses used by the main
memory.
Transfers data to and from the peripheral devices as full 36-bit (32 data bits and 4 parity bits) words or as
sixteen 36-bit word blocks.
Interfaces with the CC through the CCIO bus. The CC performs programmed I/O (PIO) operations to the
DMAC, the channels, and the peripheral devices through this interface.
The DMAC Main Memory Interface implements the 3B21D computer MASB protocol and controls full and quad word
transfers between the DSCHs and the Main Memory. The DMAC transfers data to and from Main Memory as full
36-bit words. The DMAC can also transfer data to and from the Main Memory in groups of four words. The DMAC
determines when to do a quad word transfer by checking the quad word alignment of the address.
The DMAC/DSCH ASIC with its microcoded PROM provides the control and sequencing for the CCIO interface,
MASB interface, and the Dual Serial Channel interfaces. The DMAC/DSCH ASIC is divided into five functional
partitions as follows:
CCIO Interface
Control
Channel Interface.
The DMAC Control logic consists of a microprogram controller and the associated logic that controls the sequencing
and timing of itself and the other functional partitions within the ASIC. The Control logic also contains the request
logic that arbitrates the DSCH channel and CC requests for DMAC.
The Device Priority Logic arbitrates the DMA service requests from the peripheral devices.
The Channel Interface consists of four DSCHs that control the transfer of data, commands, status, and requests
between the peripheral devices and the DMAC. Each DSCH supports up to four peripheral devices.
6.2.3 PROM
The PROM (microcoded PROM) is 40 bits wide and 8 K deep. The 40 bits are divided into 12 fields as follows:
Bits 22-19 identify the source registers and also contain the four-way branch enables.
Bits 39-35 contain the 5 parity bits across the 5 bytes that make up the 40-bit word.
The 20-MHz clock provides the primary clock stream for the DMAC/DSCH ASIC and the microcoded PROM. It
consists of a 40-MHz oscillator and a divide-by-2 circuit.
The CCIO interface on the circuit pack is a set of buffers and tristate bus transceivers that are used to interface
signals between the CCIO bus and the DMAC/DSCH.
The MASB interface circuitry on the circuit pack interfaces the 36-bit, tristate bus from the ASIC to a 32-bit Main
Store Address Bus and a 36-bit Main Store Data Bus. The ASIC multiplexes the Main Store address (28 address
bits and 4 parity bits) and data (32 data bits and 4 parity bits) to and from the 32-bit tristate bus. A register is
provided on the circuit pack to store the address with its parity bits. Tristate drivers (32) interface the address
register to the Main Store tristate bus. The data register is internal to the ASIC. After the address has been set up in
the address register, the data register is gated to the 36-bit tristate bus. The data can then be transferred. A set of
36 tristate transceivers interface the data register to the 36-bit tristate MASB.
There are four independent DSCHs. Each channel can interface four peripheral devices, but only one device on
each channel at a time. The complementary circuit in the peripheral device that communicates with the DSCH is
called the Duplex Dual Serial Bus Selector. The DSCH and DDSBS operate in a half-duplex mode, alternating
between sending and receiving. In each transmission, 36 bits are sent simultaneously by sending two 18-bit streams
called high data and low data. Requests for service are initiated by peripheral devices over their dedicated request
lead. The physical cable link is implemented with RS-422 drivers and receivers.
The DSCH interface is the interface between the DMA I/O channels and the peripheral devices, such as DFCs and
IOPs. The DSCH interface consists of five differential signals that pass between the DMAC/DSCH and the Duplex
Dual Serial Bus Selector (DDSBS) as follows:
HIGH DATA Signal used for the serial transmission of the high half-word of each 32-bit data word.
LOW DATA Signal used for the serial transmission of the low half-word of each 32-bit data word.
TRANSMIT CLOCK A clock signal transmitted by the I/O channel to the peripheral device.
RECEIVE CLOCK A clock signal received by the I/O channel from the peripheral device.
REQUEST Signal used by the peripheral device to transmit requests to the I/O channel. There are
three types of requests: DMA transfer, DMA setup, and Interrupt. The DMA setup
request is used when the peripheral device wants a virtual memory address translated to
a physical address. The DMA transfer request is used when the peripheral device wants
to access main memory. The Interrupt request sends an interrupt to the CC from the
DMAC/DSCH (KBN15) unit over the CCIO interface.
The SLFID circuit provides the means for a Central Control (CC) to interrogate the DMA circuit pack for identification
information (version, issue, and so forth). The circuit operates independently from the DMAC/DSCH ASIC.
The circuitry consists of transceivers to interface the SLFID bus with the circuit pack, an ID field that is the bus
address of the circuit pack, an address register to store the incoming bus address, a comparator to compare the ID
field to the bus address, a binary counter to generate the PROM address, and a PROM that contains the circuit pack
ID information and the control lead interface and logic.
The Boundary Scan (BS) interface to the DMA circuit pack is via the primary BS bus. The BS bus is a serial bus
used to test (diagnose) components. All boundary scan functions are controlled by the CC.
A pin is provided on the backplane for disabling quad word transfers. When the pin is grounded, requests for quad
word transfers result in single-word transfers.
A ground is provided on an input pin in the DMA 1 backplane position to provide the card identity to the ASIC and
also provides a ground to the power controller when a DMA circuit pack is inserted in the DMA 1 backplane slot. The
ground to the power controller allows it to decide whether to generate an alarm because the B power supply is not
installed. That is, an alarm is generated if DMA 1 is installed and the B power supply is not installed. No alarm is
generated if DMA 1 is not installed and the B power supply is not installed.
If the leads from the power programming resistor are open or shorted to some other circuit, the power supply
associated with the DMA circuit pack will not supply power.
The optional Utility Circuit (UC) circuit pack (UN379), along with the Generic Access Package (GRASP) software,
monitors operations between the CC and Main Memory (cache or main store) for the purpose of program debugging
and testing. Figure 6-4 is a high-level functional block diagram of the UC.
The UC matcher circuits monitor both main memory reads and main memory writes and can compare both virtual or
physical addresses. The UC can be configured to interrupt the processor on one unique condition or on several
program states.
The Transfer-trace circuitry records both program transfers and process changes [Utility IDentification (UID)
changes]. Program transfers include direct program transfers, calls to and returns from subroutines, and transfers
to/from interrupt routines. Process changes are recorded each time program execution changes from one process
to another. Data History alone or Data History with Simultaneous Program Transfer Trace can be recorded by the
Trace Memory.
Compare and match on Virtual or Physical Addresses, Data, Address Range (Block Match), Memory Access
(Read/Write, Instruction Fetch, etc.), and Process Transfer (UID Change).
Provide four triggers that can accept input from any matcher or combination of matchers and generate an
interrupt.
Record Trace Memory, which is controlled by the Trigger Function outputs. The Trace Memory can record until
ordered to halt, record during a window defined by trigger outputs, or record until full.
Configure Trace Memory to monitor and record Data History. In this mode the data, data address, and program
address are recorded.
Configure Trace Memory to monitor and record the FROM and TO addresses and UID values of Program
Transfers, UID Changes, Function Calls, and Function Returns. In addition, any of these program trace modes
can be used simultaneously with Data History Trace.
The Internal Data Bus in the UC is designated as DATB. The DATB connects the various data sources and
destinations in the UC. This 32-bit bus provides the means to program the UC and to read results from the UC via
the Bidirectional Gating Bus (BGB).
The BGB is used to program the UC circuit pack for specific conditions and operations. The BGB is also used to
read trace memory and status data from the UC circuit pack via the DATB.
The input logic for the Address Matcher, Address Block Matcher, and Data Matcher accepts the data that the UC will
use for matching and possible triggering. This data includes the Virtual Address (SAR[27-11]), Physical Address
(CA[27-00]), Cache Data (CD[31-00]), and FTCH, WRT, HALF, and BYTE. The Address Data (SAR[27-11],
CA[27-00]) and Cache Data (CD[31-00]) is buffered on the CC circuit pack with transparent latches to provide hold
time. Enabling of this latch is done by a signal provided by the Store Interface.
The Access Counter/Latch stores FTCH, WRT, HALF, and BYTE signals at the beginning of each store access.
This latch is clocked by ACCCK1. The Data Counter/Latch stores the Cache Data Bus. This latch is clocked by
DATCK1. Input to the Address Counter/Latch is provided by the output of the Address Multiplexer, which multiplexes
either the physical address (CA[27-11]) or Virtual Address (SAR[27-11]) into the upper 17 bits of the latch. The lower
11 bits are driven by the Physical Address offset (CA[10-00]).
All three latches can be configured as counters for programming the matchers and for testing the UC circuit pack.
The CC can clear the latches to logical zeros and then increment the counter/latches until the desired value is
reached.
The matcher logic includes five matcher circuits. Each matcher circuit provides outputs that drive each of the four
trigger circuits.
The Data Matcher uses a 256- by 16-bit RAM configured as four matchers to match any data pattern output from
the Data Counter/Latch.
The Address Matcher uses a 256- by 16-bit RAM configured as four matchers to match any address pattern output
from the Address Counter/Latch.
The Access Matcher uses a 16- by 4-bit RAM to match on any access type (FTCH0, WRT0, HALF0, or BYTE0).
The UID Matcher uses a 256- by 12-bit RAM to match on UID values output by the UID Map.
The Address Block Matcher circuits each contain four 256- by 16-bit RAMs. The RAM outputs are connected to logic
that detects whether the data in the Address Counter/Latch is within the address range indicated by the matcher
programming.
The Utility IDentification (UID) Map is an 8-word by 24-bit RAM addressed by the Address Translation Buffer (ATB)
select bits TAA(10-08). These three bits indicate the current process UID. Microcode writes new UID values to the
UID Map using BGBPP(2)0. When a nonsequential access occurs (BRANCH0 is active), the new value of
TAA(10-08) is compared to the old value. An indication of any UID change is output to the Trigger Logic, which
decides if a trigger function should be enabled.
The Trigger Logic stores the trigger conditions programmed via the BGB in the "freeze" mode. In the "run" mode,
the Trigger Logic accepts outputs from all matcher circuits and compares the matcher circuit outputs to the
programmed conditions. When matches are made, the Trigger Logic activates the appropriate trigger output to the
Control Logic that controls the Trace Memory recording.
The Trace Memory records store accesses (Cache or Main Store) under the control of the Trigger and Access
Control circuitry. It consists of a 16-K by 97-bit RAM. Address, data, UID values, and other data is stored in various
combinations depending on the GRASP-generated programming.
The UC generates a CC-interrupt signal called UTLINT0. This signal, when active, tells the CC that the UC Trace
Memory is full. This allows the CC to inform the user via GRASP that the UC can no longer monitor operations
between the CC and Main Memory.
The Self-Identification (SLFID) circuit provides the means for a Central Control (CC) to interrogate the UC circuit
pack for identification information (version, issue, etc.). The SLFID circuit operates independently from the other UC
functions.
The initial release of the 3B21D computer and the UC circuit pack will not have a functioning circuit pack
self-identification feature. The circuit pack self-identification circuits are designed into all new circuit packs; however,
the components will not be installed on the circuit packs.
The Boundary Scan (BS) bus interface is used only to read the UC circuit pack self-identification data stored in the
SLFID circuit. No gate array devices supporting boundary scan diagnostics are used by the UC circuit pack.
The Expansion Slots (EX 0 and EX 1) provide an interface for new hardware features to access the MAS and for the
CC to access the new hardware through the CCIO bus or the MASB.
The Disk File Controller (DFC) connects peripherals that use the Small Computer System (SCSI) Interface, which
includes disk and tape drives, with the Direct Memory Access Dual Serial Channels. The DFC consists of Disk File
Controller A (DFCA), DFCB, and a 410AA power converter. Each DFC provides two independent SCSI buses (see
Note). The DFC connects to the Control Unit via the Dual Serial Channel (DSCH) interface.
NOTE: The naming convention for the two SCSI buses provided by a DFC designates the buses "BUS A" and
"BUS B." The 3B21D computer system designations for the SCSI buses are as follows.
The SCSI BUS A and BUS B provided by DFC 0 are "SBUS 0" and "SBUS 2."
The SCSI BUS A and BUS B provided by DFC 1 are "SBUS 1" and "SBUS 3."
The SCSI BUS A and BUS B provided by DFC 2 are "SBUS 4" and "SBUS 6."
Figure 7-1 is a functional block diagram of the DFC, which shows six blocks of information (in dashed boxes) as
follows:
Two blocks are called DFCA and represent the hardware in a UN373 circuit pack. The UN373 circuit pack
provides the SCSI bus interface.
The DFCB block represents the logic in the TN2116 SCSI Host Adapter circuit pack that supports SCSI-1.
Therefore, the TN2116 controls the SCSI bus.
The fourth block is the power supply. For the UN580, power is supplied by the 410AA power converter circuit
pack. For the UN580B, power is onboard the UN580B circuit pack.
The fifth block shows the UN580 circuit pack, which consists of combined blocks DFCA and DFCB. Therefore,
the UN580 circuit pack replaces the functionality of both UN373 and TN2116 circuit packs in one circuit pack.
Remember that power is supplied by the 410AA circuit pack.
The sixth block (UN580B) consists of the DFCA and DFCB blocks and a power supply located on the UN580B
circuit pack. Therefore, the UN580B circuit pack replaces the functionality of the UN373, TN2116, and 410AA
circuit packs in one circuit pack.
SCSI-1 is a byte-wide data transfer protocol that uses a 50-pin interface. SCSI-2 is a 32-bit, four-byte-wide data
transfer protocol that is called "wide SCSI." The SCSI Host Adapter circuit packs (UN373 and TN2116, or UN580, or
UN580B) support only SCSI-1. None of these circuit packs support the 32-bit SCSI-2.
In later versions of the 3B21D computer, the DFCA and DFCB blocks were combined into a single circuit pack
called the UN580. This allowed the DFC to be realized with one logic circuit pack (UN580) and one power supply
(410AA). When a DFC is equipped with a UN580, the UN580 installs in the slot previously used for a UN373. Then,
the TN2116 is not needed, although it could be installed without doing any harm.
Shortly after the release of the UN580 circuit pack, a UN580B version was released that combined the DFCA,
DFCB, and power supply blocks. This allowed the DFC to be realized with one logic circuit pack (UN580B). Thus, in
the UN580B series circuit pack, the TN2116 and 410AA circuit packs were eliminated, and the UN373 or UN580
was replaced by the UN580B.
When a DFC is equipped with a UN580B, the UN580B installs in the slot previously used for a UN373 or UN580.
There is an unused circuit pack position on both sides of a UN580B.
The SCSI DFC controls the hard disk drives and tape drives. It consists of a Duplex Dual Serial Bus Selector
(DDSBS), a Bus Interface Controller (BIC) that provides an interface to the Control Unit (CU), an SCSI Host Adapter
(HA), and power control circuitry. The SCSI HA has two parts: a microprocessor-based control section and an SCSI
interface. A description of each of these functional blocks follows. A high-level block diagram of the DFC is shown in
Figure 7-1 .
The DDSBS provides an interface between the Dual Serial Channel (DSCH) and SCSI HA. Each DFC has a
DDSBS that connects to two DSCHs; one on each duplex processor. This allows both CUs of the duplex processor
(CU 0 and CU 1) to have access to the peripherals. The specific functions of a DDSBS are as follows:
To select which DSCH can currently communicate with the peripheral device.
To convert between the dual serial bit-stream protocol used by the DSCH to the 36-bit (32 data and 4 parity)
format used by the peripheral device's BIC.
To provide maintenance functions such as request generation and data loop-around for diagnostic testing.
To provide logic that allows the device to send DMA setup requests, DMA transfer requests, and interrupt
requests to the DMAC.
The control portion of the HA is a 32-bit, microprocessor-based design that allows the HA to run autonomously. The
specific functions of the control portion are as follows:
Read and write all memory on the HA, including memory-mapped registers.
Arbitrate between the HA CPU and HA Direct Memory Access Controller (DMAC) for control of the HA
microbus.
Provide memory for operational firmware, onboard diagnostics, and data buffering.
The SCSI portion of the HA controls data transfers between two independent SCSI buses and the rest of the HA.
The specific functions of the SCSI are as follows:
Provide high-speed data transfers between the SCSI buses, HA memory, and the BIC.
Support both the SCSI-1 and SCSI-2 bus protocols (see Note).
NOTE: The UN373 DFCA circuit pack and the TN2116 SCSI Host Adapter circuit pack support SCSI-1 only.
Neither circuit pack supports 32-bit SCSI-2.
The DFC is an independent fault group and has its own power supply and power switch. The UN373 and UN580
circuit pack provides the power control function.
The UN373 circuit pack incorporates a self-identification (SLFID) and boundary scan function into the boundary
scan function. Self-identification is done using the boundary scan bus. The contents of a ROM identifying the circuit
pack is returned via the boundary scan bus when the ROM is addressed. The UN373 circuit pack self-identification
circuits are part of the circuit pack design; however, the circuit components are not installed.
The UN580 circuit pack does not have any self-identification functionality. The self-identification function was put
back on the UN580B; however (like the UN373), the circuit components are not installed.
The 3B21D computer can have four IOPs (IOP 0 through IOP 3). IOP 0 is equipped in Processor Unit 0 at EQL
19-065. IOP 1 is equipped in Processor Unit 1 at EQL 45-065. IOP 2 is equipped in the Growth Unit at EQL 11-011.
IOP 3 is equipped in the Growth Unit at EQL 62-011.
Functionally, an IOP can support four peripheral controller communities with each community supporting four
peripheral controllers. Therefore, 16 peripheral devices can be supported by an IOP. IOP 0 and IOP 1 are
exceptions. IOP 0 and IOP 1 each support up to 15 Peripheral Controller (PC) slots. IOP 2 and IOP 3 each support
up to 16 PC slots. The equipage of SCSI Peripheral Units (SPUs) like the UN375 SCSI Disk circuit packs in the
Processor Unit reduces the number of available PC slots. Therefore, the maximum number of available PC slots in
a Processor Unit is 15 with the UN375s. The equipage of each growth SPU reduces the number of available PC
slots by 2.
For IOP 0 and IOP 1, Peripheral Community 0, slot 0 (PC00) is always equipped with a TN983, UN583, or UN597
MTTY Controller circuit pack. Also, IOP 0 and IOP 1, Peripheral Community 0, slot 2 (PC02) is reserved for a
UN33D or UN933 Scanner and Signal Distributor circuit pack.
An IOP is a front-end processor for low- and medium-speed I/O peripheral units. Such units include asynchronous
terminals, asynchronous data links, synchronous data links, and point scanner/signal distributors. The maintenance
receive-only printer (ROP), maintenance teletypewriter/terminal (MTTY), and maintenance data link are examples of
these units. The IOP provides an intermediate level of I/O processing between the CU and the various I/O PCs to
handle low-level I/O processing. The IOP performs the following intermediate-level functions:
Concentrates interrupts from the peripheral controllers, thus off-loading a significant processing burden from
the CU
Performs low-level mediation for the peripheral controllers with the Direct Memory Access Controller (DMAC)
for the transfer of commands, responses, and data to/from the Main Store
Monitors and reports the operational status of the peripheral controllers to the CU
Isolates defective/babbling peripheral controllers to prevent them from affecting the performance of other
peripheral controllers
Sets the operational status (in service or out of service) of the peripheral controllers on command from the CU.
Figure 7-2 is a functional block diagram of the IOP circuit pack (KBN10). The IOP consists of the following
functional blocks:
The Duplex Dual Serial Bus Selector (DDSBS) connects to two Dual Serial Channels (DSCH) (one from each side
of the duplex processor). This allows both CUs of the processor to access the IOP. The functions of a DDSBS are
as follows:
To select which DSCH can currently communicate with the peripheral device.
To convert between the dual serial bit-stream protocol used by the DSCH to the 36-bit (32 data and 4 parity)
format used by the peripheral device's BIC.
To provide maintenance functions such as request generation and data loop-around for diagnostic testing.
The Bus Interface Controller (BIC) provides an interface between the DDSBS and the Peripheral Interface Controller
(PIC). The specific functions of the BIC are as follows:
To translate between the 36-bit (32 data and 4 parity bits) data format used by the DDSBS and the 18-bit (16
data and 2 parity bits) format used by the PIC.
To buffer data passing between the IOP peripherals and the DDSBS.
To provide logic that allows the device to send DMA setup requests, DMA transfer requests, and interrupt
requests to the DMAC.
The Peripheral Interface Controller (PIC) is the central processing unit of the IOP, which allows the IOP to run
independently from the CU. The specific functions of the PIC are as follows:
To provide the MicroControl Store (MCS) that holds the IOP software
To control data transfers between the IOP peripherals and the BIC
To handle interrupts.
The Input/Output Microprocessor Interface (IOMI) connects the PIC with up to four communities of peripheral
controllers (PCs). Each PC community can contain up to four PCs. The functions of the IOMI are as follows:
Act as an interface between the 16-bit PIC and the 8-bit PCs.
Each Peripheral Controller (PC) communicates with the IOMI via three request leads (error, interrupt, and service), a
control signal acknowledge lead, and a PC select lead. Each community of four PCs share an 8-bit plus 1 parity bit
data bus, a 16-bit memory address bus, and an 8-bit bus containing control signals.
To communicate with a PC, the IOP performs a DMA operation, which loads information into a dual-port memory
(DPM) located on the PC. The IOP uses the PC select register to choose which PC to communicate with. Only the
PC that is selected responds to the information loaded in the other registers. The DPM address that the IOP wants
to access is loaded into the Microprocessor Memory Address (MPMADD) counter. A demultiplexer controlled by the
PC select register routes this 16-bit address to the appropriate PC.
For DPM write operations, the first 16 bits of data to be transferred to the PC are loaded into the Microprocessor
Data (MPDATA) Register. Again, the PC select register routes the data to the proper PC. While the IOP interface to
PC select register is a 16-bit interface, the PC side is only 8 bits wide. Therefore, the IOP can load the PC select
register in one access; however, two accesses must be made to send this information to the PCs.
For read operations, the information from the PC is loaded into the MPDATA Register in two 8-bit operations. Then
the IOP can read 16-bits at a time.
The IOP controls the DMA operation by asserting bits in the PC Control Register. Some of these control register bits
are used to control events on the IOP itself, such as incrementing or decrementing the MPMADD counter, or
determining whether the high byte or low byte of the data in the MPDATA register is being read or written. Eight of
the signals form a control bus that is sent to the selected PC. In return (Response), the IOP receive four signals
from each PC.
Table 7-1 summarizes the IOMI bus signals. The X in the signal names is the PC community designator and is 0,
1, 2, or 3.
tional
SELECT PCSELX(3-0)0 Unidirec- PC select (one per PC) OUT IN
tional
CONTROL CINTX0 Unidirec- Command Interrupt OUT IN
tional
CLRPCX0 Clear PC OUT IN
DMAOCX0 DMA Operation Complete OUT IN
DMARQX0 DMA Request OUT IN
DMAWRX0 DMS Write OUT IN
RISL8X0 Reset PC Isolate OUT IN
SISL8X0 Set PC Isolate OUT IN
RESPONSE CSAX(3-0)0 4-Bit Control Signal Acknowledge (one per PC) IN OUT
ERX(3-0)0 Error Detected (one per PC) IN OUT
INTX(3-0)0 Interrupt Request (one per PC) IN OUT
SRX(3-0)0 Service Request (one per PC) IN OUT
The Boundary Scan (BS) interface to the IOP circuit pack is via the secondary BS bus when equipped in the
Processor Unit and is via the growth boundary scan cable when equipped in the Growth Unit. The BS bus is a serial
bus used to test (diagnose) components. All boundary scan functions are controlled by the CC.
TN983, UN583, or UN597 Maintenance TTY Peripheral Controller [The UN583 is a Multipurpose Peripheral
Controller (MPC) that can be used to replace the TN983 and TN83B peripheral controllers.]
TN1839 Synchronous Data Link Peripheral ControllerX.25 Network Level 2 Interface (NET2)
UN582 MPC Can be used to replace the TN74B, TN75C, TN82B, and TN1839 circuit packs at a reduced
cost per port.
The TN74B circuit pack is an asynchronous terminal controller that provides two EIA RS-232C channels operating
at 300, 1200, 2400, 4800, and 9600 bps. It is used to provide data communication between the computer and a wide
variety of asynchronous serial communications equipment.
The data throughput capabilities of the TN74 are shown in Tables 7-2 , 7-3 , and 7-4 .
The TN75C circuit pack provides two independent X.25 level 2 interfaces (channel 0 and channel 1), with automatic
dial-out on channel 0. It is used to provide interfaces to packet switching networks, personal computers, or
machine-to-machine links via dialup, private, or leased lines. The TN75C is compatible with EIA RS-232C and EIA
RS-449 modems. The TN75C operates at 9600 bps, full duplex. Typical configurations are one channel operating at
9600 bps or two channels operating at 4800 bps.
It handles Byte-Control Protocol (BCP) such as Digital Data Communication Message Protocol (DDCMP), and
bit-oriented protocols such as Synchronous Data Link Control (SDLC), High-Level Data Link Control (HDLC), and
Advanced Data Communications Control Procedures (ADCCP).
The TN82B circuit pack provides a single, high-speed serial data link that implements the X.25 level 2 protocol. It is
used to provide a high-performance interface to packet switching networks or machine to machine links via dialup,
private, or leased lines. The TN82B is compatible with EIA RS-232C, EIA RS-449, and CCITT V.35 modems.
It handles bit-oriented protocols such as SDLC, HDLC, and ADCCP. The channel provides the necessary control
signals that meet the EIA RS-232C interface standard for data rates up to 19.2 Kbps and CCITT V.35 interface for
20 Kbps and up to a maximum of 64 Kbps. The TN82B circuit pack can operate as one 64-Kbps, full duplex, data
link channel.
PC00 is reserved for a TN983, UN583, or UN597 Maintenance TTY Controller (MTTYC) in IOP 0 and IOP 1. See
Figure 7-3 . The TN983/UN583/UN597 circuit pack provides RS-232C and RS-422 interfaces to monitor and control
the 3B21D computer as follows:
One RS-232C asynchronous input/output channel used for a local operator terminal and one synchronous port
for remote operator terminals. The local operator terminal is the MTTY.
One RS-232C input/output channel used for the local Receive-Only Printer (ROP).
Two RS-422 input/output channels that are switchable to one universal asynchronous receiver-transmitter for
communication with the Emergency Action Interface (EAI).
The local ROP and MTTY are automatically or manually switched to the appropriate TN983, UN583, or UN597
circuit pack input/output channel via the UN377 Port Switch and Scanner-Distributor Buffer circuit pack. The local
ROP and MTTY cables are the same but with different equipment locations (EQLs).
The TN983, UN583, and UN597 circuit packs have different Emergency Action Interface cables going to or from the
Central Control circuit pack (KLW31). Also, the TN983/UN583/UN597 circuit packs have the same EQLs, which are
19-094 for IOP 0 and 45-094 for IOP 1.
CAUTION: All backplanes shipped with UN583s or UN597s have two pins, located at EQLs 19-094-022 and
45-094-022, that must be isolated for the UN583/UN597 to operate. If you are retrofitting a UN583 or
UN597 in place of a TN983 on an older backplane, make sure these two pins are isolated. The
UN583/UN597 will not operate if these two pins are not isolated.
Figure 7-3 TN983/UN583/UN597 Maintenance TTY Controller Circuit Pack Functional Block Diagram
The TN1420 circuit pack provides a single, high-speed serial data link that implements the X.25 level 2 protocol. It is
used to provide a high-performance interface to packet switching networks or machine-to-machine links via dialup,
private, or leased lines. The TN1420 is compatible with EIA G.703 and CCITT V.36 modems.
It handles bit-oriented protocols such as SDLC, HDLC, and ADCCP. The channel provides the necessary control
signals that meet the EIA RS-232C interface standard for data rates up to 19.2 Kbps and CCITT V.36 interface for
20 Kbps and up to a maximum of 64 Kbps. The TN1420 circuit pack can operate as one 64 Kbps, full duplex, data
link channel.
The TN1839 circuit pack is similar to the TN75 circuit pack, but the TN1839 circuit pack meets the NET2
requirements. The TN1839 circuit pack provides two independent X.25 level 2 interfaces (channel 0 and channel 1),
with automatic dial-out on channel 0. It is used to provide interfaces to packet switching networks, personal
computers, or machine-to-machine links via dialup, private, or leased lines. The TN1839 is compatible with EIA
RS-232C and EIA RS-449 modems. The TN1839 operates at 9600 bps, full duplex. Typical configurations are one
channel operating at 9600 bps or two channels operating at 4800 bps.
It handles Byte-Control Protocol (BCP) such as Digital Data Communication Message Protocol (DDCMP), and
bit-oriented protocols such as SDLC, HDLC, and ADCCP.
The MPC provides a common hardware platform to the 3B20D and 3B21D computer that reduces the cost per port
and is a technology upgrade for peripheral controller. The UN582 and UN583 have similar hardware, but have
different firmware resident in the nonvolatile memory, and are used as follows:
UN582 replaces the TN74B, TN75C, TN1839, TN82, and TN82B peripheral controllers.
UN582B replaces the UN582 and adds NET2 compliance to the V.28 and V.36 physical interfaces.
PC02 in IOP 0 and IOP 1 is reserved for a UN33D or UN933 Scanner and Signal Distributor (SCSD) circuit pack.
IOP 0, PC02 is SCSD Controller 0 (SCSDC 0); IOP 1, PC02 is SCSD Controller 1 (SCSDC 1).
The UN33 or UN933 consists of circuitry for monitoring 48 scan (SC) points and controlling 32 signal distributor (SD)
points (see Figure 7-4 ). A scan point is defined as an open pair of leads connected to a monitored current source
on the UN33 or UN933.
Each SC point is examined every 48 milliseconds, and the scan map (in the UN33 or UN933 circuit pack) is
updated with any change.
A point must remain in the new state for two scans (96 ms) for the change to be reported to the CU.
SD points are activated by commands from the CU. Only one point at a time may be activated or deactivated.
Operate
Clear
Flash continuously
The SC and SD points are connected to each unit of the 3B21D computer except the 9-track tape drive. The power
switch circuits of the units all use SC and SD points and have similar responses. The following are the expected
responses from the units:
Switching the Request-Out-of-Service/Restore (ROS/RST) switch to ROS requests removal of the unit from
service.
The Request-In-Progress (RQIP) indicator is on when a request (either a remove or restore) is in progress. If a
remove request is denied, the RQIP indicator is flashed several times and then extinguished. Remove and
restore commands made from the unit do not operate the RQIP indicator.
Switching the ROS/RST switch to RST requests a diagnostic and restoral of the unit to service.
Diagnostics will not be run on power up if the ROS/RST switch is left in the ROS position.
Switching the Alarm Cutoff-Test (ACO-T) switch to ACO-T and back again retires an alarm associated with the
particular powered down unit.
NOTE: The other functions (MOR, indicator test, and the ROS indicator) do not interface with the SCSDC. The
power switch on the KS-23909 9-track tape drive does not interface with the SC and SD points.
The UN377 circuit pack has six pairs of SC that reflect the state of the port switch. These SC points are as follows:
One UN33D or UN933 circuit pack in each IOP has two pairs of SC points that report the status of the fuses for both
processors. A blown fuse is indicated by a closed scan point.
Figure 7-4 UN33 or UN933 Scanner and Signal Distributor Circuit Pack Functional Block Diagram
Each SCSD circuit pack (UN33 or UN933) provides 48 SC points and 32 SD points. The basic 3B21D computer
complex requires two base UN33 or UN933 circuit packs. One base UN33 or UN933 circuit pack is equipped in IOP
0, PC02; and the other base UN33 or UN933 circuit pack is equipped in IOP 1, PC02. The number of SC and SD
points required for a basic 3B21D computer complex consisting of two CUs, four IOPs, two DFCs, six disks, one
Digital Audio Tape (DAT), one MTTY, one ROP, a Bidirectional Cooling Unit, and a Fuse and Filter Unit is 42 SC
points and 32 SD points. In addition, eight SD points (four SD points per base UN33 or UN933 circuit pack) are
assigned for the software generated alarms (critical, major, minor, and retire functions). The following rules are used
for assigning the scan and signal distributor points:
Minimum of one SCSD circuit pack (UN33 or UN933) per IOP 0 and IOP 1.
Duplicate SC and SD points (if required) must be assigned to the same points on the duplicate controllers.
Scan groups, that is SC and SD points from one power switch, must be assigned to the same SCSDC (UN33 or
UN933).
SCSDC 0 is equipped in IOP 0, PC slot 02, and monitors the 3B21D computer equipment with even numbers,
for example, CU 0, DFC 0, SPU 0, SPU 2, etc. SCSDC 1 is equipped in IOP 1, PC slot 02, and monitors the
3B21D computer equipment with odd numbers. The exceptions to this rule are IOP 0 and IOP 1, which are
monitored from SCSDC 1 and SCSDC 0, respectively.
Applications assign their equipment to the remaining SC and SD points and/or add additional SCSD packs
(UN33 or UN933) if needed.
Table 7-5 lists the SC and SD points on SCSDC 0 and SCSDC 1 of the 3B21D computer for a small office. Table
7-6 lists the SC and SD points on SCSDC 0 and SCSDC 1 of the 3B21D computer for a large office. These tables
show what points are assigned to a particular unit and their scan and/or signal distributor functions. The SC and SD
point assignments for an application are noted in both tables. These table entries are not part of the 42 SC and 40
SD points required for the basic 3B21D computer complex, inclusive of the software-generated alarms.
Table 7-5 Small Office Scan and Signal Distributor Point Assignments
SC/SD SCSDC 0 (IOP 0, PC02) EQL 19-110 SCSDC 1 (IOP 1, PC02) EQL 45-110
POINT UNIT SC FUNCTION SD FUNCTION UNIT SC FUNCTION SD FUNCTION
00 a CMU 0 Y(POWER) OOS CMU 0 Y(POWER) OOS
01 a CMU 0 X(ROS/RST) RQIP CMU 0 X(ROS/RST) RQIP
02 a CMU 0 W( ) DIAGNOSTICS CMU 0 W( ) DIAGNOSTICS
03 a CMU 0 V( ) CMU 0 V( )
03 a NCLK 0 OOS NCLK 0 OOS
04 a CMU 1 Y(POWER) OOS CMU 1 Y(POWER) OOS
05 a CMU 1 X(ROS/RST) RQIP CMU 1 X(ROS/RST) RQIP
06 a CMU 1 W( ) DIAGNOSTICS CMU 1 W( ) DIAGNOSTICS
07 a CMU 1 V( ) CMU 1 V( )
07 a NCLK 1 OOS NCLK 1 OOS
08 3B FAN FAN RESET 3B FAN FAN RESET
09 b b b b b b
10 a MISC FAN FAN RESET MISC FAN FAN RESET
11 b b b b b b
12 ALARM b CRITICAL ALARM b CRITICAL
13 ALARM b MAJOR ALARM b MAJOR
14 ALARM b MINOR ALARM b MINOR
15 ALARM b RETIRE ALARM b RETIRE
16 SPU 54 X(ROS/RST) OOS
17 SPU 54 Y(POWER) RQIP
18 SPU 04 X(ROS/RST) OOS SPU 05 X(ROS/RST) OOS
19 SPU 04 Y(POWER) RQIP SPU 05 Y(POWER) RQIP
20 IOP 2 Y(POWER) OOS IOP 3 Y(POWER) OOS
21 IOP 2 X(ROS/RST) RQIP IOP 3 X(ROS/RST) RQIP
22 IOP 1 Y(POWER) OOS IOP 0 Y(POWER) OOS
23 IOP 1 X(ROS/RST) RQIP IOP 0 X(ROS/RST) RQIP
24 SPU 02 X(ROS/RST) OOS SPU 03 X(ROS/RST) OOS
25 SPU 02 Y(POWER) RQIP SPU 03 Y(POWER) RQIP
26 SPU 00 X(ROS/RST) OOS SPU 01 X(ROS/RST) OOS
b. Inaccessible.
Table 7-6 Large Office Scan and Signal Distributor Point Assignments
SC/SD POINT SCSDC 0 (IOP 0, PC02) EQL 19-110 SCSDC 1 (IOP 1, PC02) EQL 45-110
UNIT SC FUNCTION SD FUNCTION UNIT SD
SC FUNCTION
FUNCTION
00 a 3B GROWTH FAN RESET 3B GROWTH FAN RESET
FAN FAN
01 b b
02
03
04
05
06
07
08 3B FAN FAN RESET 3B FAN FAN RESET
09 b b b b b b
10 a MISC FAN FAN RESET MISC FAN FAN RESET
11 b b
12 ALARM b CRITICAL ALARM b CRITICAL
13 ALARM b MAJOR ALARM b MAJOR
14 ALARM b MINOR ALARM b MINOR
15 ALARM b RETIRE ALARM b RETIRE
16 SPU 54 X (ROS/RST) OOS
17 SPU 54 Y (POWER) RQIP
18 SPU 04 X (ROS/RST) OOS SPU 05 X (ROS/RST) OOS
19 SPU 04 Y (POWER) RQIP SPU 05 Y (POWER) RQIP
20 IOP 2 Y (POWER) OOS IOP 3 Y (POWER) OOS
21 IOP 2 X (ROS/RST) RQIP IOP 3 X (ROS/RST) RQIP
22 IOP 1 Y (POWER) OOS IOP 0 Y (POWER) OOS
b. Inaccessible.
To verify the operation of either the scan points or the distributor points, manual action is required. To verify SCSD
operations, follow the procedures in the following paragraphs.
Operation of the scanner portion of the SCSD is controlled by the following messages:
OP:SCSD Reports the inhibit status and the state of the scan points on the SCSD.
Obtain physical scan point assignments from schematic drawings or office records. The physical and logical
assignments of scan points are recorded in the Equipment Configuration Data (ECD) and can be accessed via the
recent change and verify (RC/V) mechanism. To determine logical and physical scan point assignments using the
RC/V mechanism, use the following procedure.
MML RCV:MENU:DATA,RCVECD,DB="root",NREVIEW;
(3) Enter: In block number 1, a temporary file name, for example, /tmp/scsd
PDS DUMP:FILE:ALL,FN"/tmp/scsd"!
MML DUMP:FILE:DATA,ALL,FN="tmp/scsd";
The contents of the file /tmp/scsd are printed. A list of the SCSD option names and logical names make up
the contents.
The remainder of the form is populated. Column 9 contains scan point assignments and column 11 contains
SD point assignments.
To verify the operation of an SD point, the selected point must be identified by either physical or logical assignment.
The method of identification is the same as was used to identify scan point assignments.
Once identified, the SD points can be placed in any of four states using the ORD:SCSD input message. The four
states are as follows:
OPERATEset
RELEASEclear
REPEATflash continuously.
To verify operation of the selected SD point, use the ORD:SCSD message to flash the point while observing the
state of associated lamps and indicators.
(1) Identify SD point assignment. From the office records, MHD 0 SD points are assigned as follows:
(2) Using information from the previous step, enter the following command:
(3) At MDG 0, observe the Other Store (OS) lamp. If the SD point is operating, the lamp will flash for 8 seconds.
You should have access to the SCSD assignments and should be familiar with using the OP:SCSD and ORD:SCSD
commands.
SCSD diagnostics test the circuitry on the pack but do not loop through the outside connections. For problems with
single scan points, the point should be manually operated. The transition of the point can then be verified with the
OP:SCSD command. A problem with a single signal distributor point can be investigated using the ORD:SCSD
command. The operation of all lamps can be tested with the ACO-T switch on the power switch (TN2, TN3, TN5,
and TN6).
The Port Switch and Scanner-Distributor Buffer (PSSDB) circuit pack (UN377) performs the following functions:
Switches the maintenance terminal (MTTY) and the local printer (ROP) between the TN983, UN583, or UN597
Maintenance TTY Controller (MTTYC) in IOP 0 and the TN983, UN583, or UN597 MTTYC in IOP 1.
Buffers the scanner and signal distributor controller (SCSDC) from non-3B21D computer circuits, such as office
alarms, smoke detectors, door access mechanisms, etc.
NOTE: The terms "Maintenance Terminal," "Maintenance Teletypewriter," and "Maintenance TTY (MTTY)" refer to
the same type of terminal.
The UN377 faceplate has a three-position rocker switch and two indicators for each peripheral device. The MTTY is
controlled by the "A" switch; the ROP is controlled by the "B" switch. Figure 7-6 shows the layout of the UN377
circuit pack faceplate. Table 7-7 defines the UN377 switch positions. Table 7-8 defines the UN377 indicators.
Figure 7-5 Port Switch and Scanner-Distributor Buffer (PSSDB) Functional Interface Diagram
7.4.2 Buffering
The UN377 circuit pack provides isolation between the 3B21D computer (UN33 circuit pack) and external circuits.
Buffers (opto-isolators) are provided for 12 SC and 12 SD points.
An external circuit must provide a current through the UN377 scanner buffer of 5 mA to 20 mA for a logical 1; 0 mA
for a logical 0. The SD buffers handle a current of 20 mA for an SD state of 1 and are protected by avalanche diodes
rated at 68 V 5%.
The UN377 circuit pack is supplied power from two sources. The Test Access Port (TAP) and SELF-ID circuits are
supplied +5 V power from CONVC. The port switch circuits are supplied +5 V power from a Board-Mounted Power
Module (BMPM). The BMPM is supplied -48 V from the Modular Fuse and Filter Unit. The UN377 includes a voltage
monitor that checks the circuit pack +5 V power. When the +5 V power is out of range, the voltage monitor
generates a power alarm.
This section describes the various Small Computer System Interface (SCSI) peripheral units and the other 3B21D
computer peripheral devices.
The SCSI Peripheral Units (SPUs) provide Moving Head Disk (MHD) drive and Magnetic Tape (MT) drive
capabilities for the 3B21D computer. Magnetic tape drives include Digital Audio Tape (DAT) and 9-track tape drives.
The other 3B21D computer peripheral devices include the Maintenance Terminal (MTTY) and Receive-Only Printer
(ROP) that provide the principle operator interface for the computer.
The following storage and peripheral devices are described in this section:
UN375/UN375E 3.5-Inch 1000-MB SCSI Hard Disk Drive (KS-23908) Circuit Packs
UN376/UN376E 3.5-Inch SCSI DAT Cartridge Tape Drive (NCR006-3503341) Circuit Packs
NCR006-3503341 (UN376)
8.2 UN375/UN375E 3.5-INCH 1000-MB SCSI HARD DISK DRIVE (KS-23908) CIRCUIT PACK
The UN375 circuit pack provides a board-mounted, 3.5-inch, differential SCSI hard disk drive with a formatted
capacity of 1000 MB (where 1 MB is 106 bytes).
The UN375E circuit pack (KS-23908,L41/Comcode 407207762) provides a board-mounted, 3.5-inch, single-ended
SCSI hard disk drive with a formatted capacity of 4 gigabytes.
Figure 8-1 shows the UN375/UN375E circuit pack faceplate controls and indicators. Figure 8-2 shows the power
and SCSI connectors on the KS-23908 disk drive. The SCSI device address selection pin field is cabled to the SCSI
ID selector pushbutton switch on the circuit pack faceplate.
The SCSI ID for the UN375/UN375E circuit pack is set to any available device address in the range of 0 to 6,
inclusive, using the ID selector pushbutton switch; see Note. A device address (SCSI ID) is available if it does not
conflict with any other device on the same SCSI bus; see Caution. SCSI ID 7 is assigned to the SCSI Host Adapter
and is not an available selection on the ID pushbutton switch.
NOTE: Set the SCSI ID for the UN375/UN375E circuit pack when the circuit pack is powered OFF. The SCSI ID will
take effect when the circuit pack is powered ON.
CAUTION: Take extreme care to ensure that there are no SCSI ID conflicts. If two or more devices have the same
ID, the results are unpredictable.
Figure 8-3 shows the general layout of the UN375/UN375E circuit pack, the location of the SCSI power header,
and differential and single-ended SCSI connectors (headers) on the UN375/UN375E circuit boards. Table 8-1
identifies the standard differential SCSI connector pins. Table 8-2 identifies the standard single-ended SCSI
connector pins associated with the UN375 circuit pack.
An SCSI power cable connects the SCSI power header (J3) on the circuit board and the disk drive DC power
connector.
For the UN375, an SCSI differential cable connects the differential SCSI header (J4) on the circuit board and
the differential disk drive SCSI connector.
For the UN375E, an SCSI single-ended cable connects the single-ended SCSI header (J4) on the circuit board
and the single-ended disk drive SCSI connector.
An SCSI identification cable connects the SCSI ID switch on the faceplate and the SCSI ID header on the disk
drive.
Note that different SCSI ID connectors are provided for the KS-23908,L20 disk drive and KS-23908,L10 disk
drive SCSI ID headers as shown in Figure 8-3 . Only one of these SCSI ID connectors is used, depending on
which disk drive is used in the circuit pack.
Figure 8-2 UN375/UN375E (KS-23908) 3.5-Inch Hard Disk Drive Rear View
Table 8-2 Standard Single-Ended SCSI Connector Pins Associated with UN375
Figure 8-4 is a functional block diagram of the UN375/UN375E circuit pack. The UN375/UN375E circuit pack
includes the following major functions:
Latch switch
Power switch circuit providing power control, power alarm, scan point, and signal distributor point functions
+5 V power supplies
Voltage monitors
When the UN375/UN375E circuit pack is inserted into the apparatus housing, the -48 V power is not applied to the
circuit pack until the Latch Switch is closed. Power is then applied only to the board-mounted power module (BMPM)
supplying the 5-V DC power control for the circuit pack. The Latch Switch also mechanically locks the circuit pack in
place when it is closed (pushed in). The ST/ON/OFF switch controls the application of power to the logic and drive
circuits after control power is applied to the circuit pack.
The Power Switch Circuit provides power controls and indicators, power alarms, and an interface for Scan (SC) and
Signal Distributor (SD) points. Figure 8-1 shows the UN375/UN375E circuit pack faceplate.
Table 8-3 defines the UN375/UN375E circuit pack switch functions. Table 8-4 defines the UN375/UN375E circuit
pack indicator functions. Table 8-5 defines the UN375/UN375E circuit pack scan point outputs.
The MAJOR ALARM (MJ) is generated when any converter alarm is active, an input voltage is out of range, or when
the -48 V is lost and the alarm cutoff-test (ACO-T) switch is off. The MJ is cleared when power is reapplied.
The POWER ALARM is generated when either ALM50 or ALM120 alarms are present and -48 V is present (ON).
The POWER ALARM is independent of the position of the ACO-T switch.
Figure 8-4 UN375/UN375E 3.5-Inch SCSI Hard Disk Drive Functional Block Diagram
e. X = Don't care.
The JW030B +12 V board-mounted power module is a 30-watt DC-to-DC converter that operates from -48 V and
provides a +12 V output for operation of the disk drive.
The ME005A +5 V board-mounted power module is a 5-watt DC-to-DC converter that operates from -48 V DC and
provides a +5 V DC output. The ME005A module provides power to the power control and alarm circuits. This
separate power module is used for the power control and alarm circuits to increase system reliability. If the power
from the +12 V converter or the other +5 V converter fails, the power control and alarm circuits will still operate to
The JW030A +5 V board-mounted power module is a 30-watt DC-to-DC converter that operates from -48 V DC and
provides a +5 V DC output. The JW030A module supplies +5 V to the faceplate-mounted disk drive.
The TW070AB board-mounted power module provides +5 V and +12 V DC on some disk drive circuit packs. It is a
70-watt converter that operates from -48 V DC. It is specifically designed for use with disk drives and it replaces a
JW030B when used.
The ME005A +5 V power output is monitored by a voltage supervisor that generates an INIT0 signal for the
automatic restart of the circuit pack if the ST/ON/OFF switch is ON and the ACO-T switch is OFF. The JW030A
+5 V power output is monitored by a voltage supervisor that generates the RST0 signal for controlling the power
on relay. The +5 V power must be greater than +4.5 V for the operation of the circuit pack.
The JW030B or TW070AB +12 V power output is monitored by a voltage comparator that generates a power
alarm and lights the ALM indicator when the voltage falls below 11.4 V.
The -48 V power is monitored by a voltage comparator that generates a remote shutdown of the BMPMs when
the voltage falls below -38 V.
The 3.5-inch hard disk drive is used to boot the system and to provide random access data storage. Each disk drive
provides 1000 MB of formatted data storage, where 1 MB is 10 6 bytes.
8.3 UN376/UN376C/UN376E 3.5-INCH SCSI DAT CARTRIDGE TAPE DRIVE CIRCUIT PACK
The UN376 series of circuit packs are referred to in a generic sense as UN376 and are identified specifically as
follows:
UN376 (NCR006-3503341)
The UN376 provides a faceplate-mounted, 3.5-inch, single-ended SCSI, Digital Data Storage (DDS) formatted
Digital Audio Tape (DAT) drive. The DAT drive uses 4 millimeter (3.81 mm) wide tape in 90-, 60-, and 30-meter
cartridges (cassettes). Tape media cartridges with the DDS logo are required in the DAT drive unit. DAT tapes with
the DDS logo meet the requirements of the European Computer Manufacturers Association (ECMA-130) and ANSI
X3.206 standards.
The usable storage capacity provided by the DAT drive varies with the length of tape and the recording mode. Table
Figure 8-5 shows the front view of the UN376 circuit pack faceplate using the NCR006-3503341,
NCR006-3300608/Comcode 407545243, and KS-24367,L1/Comcode 407771260 SCSI DAT drive. Table 8-7
defines the functions of the NCR006-3503341 DAT drive cassette and drive indicators.
Table 8-8 defines the functions of the NCR006-3300608/Comcode 407545243 and KS-24367,L1/Comcode
407771260 SCSI DAT drive cassette and drive indicators. The cassette and drive indicators are light-emitting diodes
(LEDs) located on the front of the SCSI DAT drive.
Figure 8-6 shows the rear view of the power and SCSI connectors on the NCR006-3503341,
NCR006-3300608/Comcode 407545243, and KS-24367,L1/Comcode 407771260 DAT drive. Table 8-1 identifies
the standard differential SCSI connector pins. Table 8-9 identifies the standard single-ended SCSI connector pins
associated with the UN376 circuit pack.
The SCSI device identification for the UN376 circuit pack is set to any available device address in the range of 0 to
6, inclusive, using the three SCSI device identification switches on the circuit pack. A device address (SCSI ID) is
available if it does not conflict with any other device on the same SCSI bus. SCSI ID 7 is assigned to the SCSI Host
Adapter and is not allowed as a UN376 SCSI device identification. The SCSI device identification pins at the rear of
the drive are connected to three switches (SW8-SW6) on the UN376 circuit board by a 6-wire cable assembly.
Figure 8-7 shows the general layout of the UN376 circuit pack and the location of the SCSI device identification
switches and connectors (headers) on the UN376 circuit board. Table 8-10 identifies the switch settings for the
various SCSI device identification addresses.
Figure 8-8 shows the option select switches on the NCR006-3503341, NCR006-3300608/Comcode 407545243,
and KS-24367,L1/Comcode 407771260 SCSI DAT drive. The option switches in Figure 8-8 are set as indicated
and are NOT to be changed. The states of the option switches are read when power is applied to the drive and
determine various drive functions. For the NCR006-3503341 DAT, the option select switches 1 through 8 are set to
00111100, respectively. (1 is the "ON" state.) For the NCR006-3300608/Comcode 407545243 and
KS-24367,L1/Comcode 407771260 DAT, the options select switches 1 through 8 are set 01111111, respectively.
An SCSI power cable connects the SCSI power header (J3) on the circuit board and the DAT drive DC
connector.
An SCSI single-ended cable connects the single-ended SCSI header (J4) on the circuit board and the
single-ended DAT drive SCSI connector.
An Out-Of-Service (OOS) indicator cable connects the OOS indicator header (J5) on the circuit board and the
OOS indicator on the faceplate.
An ALM indicator cable connects the ALM indicator header (J6) on the circuit board and the ALM indicator on
the faceplate.
A Request-Out-of-Service/Restore (ROS/RST) switch cable connects the ROS/RST switch header (J7) on the
circuit board and the ROS indicator on the faceplate.
An ACO-T switch cable connects the ACO-T switch header (J8) on the circuit board and the ACO-T switch on
the faceplate.
An SCSI identification cable connects the SCSI ID switches SW8-SW6 on the circuit board (via J9, a 6-pin
header) and the SCSI ID header on the DAT drive (via a paddleboard).
Table 8-9 Standard Single-Ended SCSI Connector Pins Associated with UN376
PIN SIGNAL FUNCTION
odd Ground All odd pins except pin 25 are ground.
02 DB(0)0 Data Bus bit 0.
04 DB(1)0 Data Bus bit 1.
06 DB(2)0 Data Bus bit 2.
08 DB(3)0 Data Bus bit 3.
10 DB(4)0 Data Bus bit 4.
12 DB(5)0 Data Bus bit 5.
14 DB(6)0 Data Bus bit 6.
16 DB(7)0 Data Bus bit 7. Bit 7 is the most significant bit and has the highest priority during arbitration.
18 DB(P)0 Data Bus parity bit. Parity is odd. The use of parity is a system option. The system is configured to
either have all SCSI devices generate and detect parity or no devices generate and detect parity.
Parity is not valid during the Arbitration phase.
20-24 Ground
25 Open (no connection).
26 TERMPWR Optional terminator power is supplied through a backflow diode.
28-30 Ground
32 ATN0 Attention signal is driven by an initiator to indicate the Attention condition.
34 Ground
36 BSY0 Busy signal is an "OR-tied" signal that indicates the bus is being used.
38 ACK0 Acknowledge signal is driven by an initiator to indicate an acknowledgment for a REQ/ACK data
transfer handshake.
40 RST0 Reset is an "OR-tied" signal that indicates the Reset condition.
42 MSG0 Message signal is driven by a target during the Message phase.
44 SEL0 Select signal is used by an initiator to select a target or by a target to reselect an initiator.
46 C/D0 Control/Data signal is driven by a target to indicate whether control or data information is on the data
bus. True (active) indicates control.
48 REQ0 Request signal is driven by a target to indicate a request for a REQ/ACK data transfer handshake.
50 I/O0 Input/Output signal is driven by a target that controls the direction of data movement on the data bus
with respect to an initiator. True (active) indicates input to the initiator. The signal is also used to
distinguish between Selection and Reselection phases.
Figure 8-8 UN376 SCSI DAT Drive Option Select Switches Bottom View
The DAT uses DDS-grade 4-millimeter-wide tape in 90-, 60-, and 30-meter cartridges (cassettes). The 120-meter
DDS-2 cartridges are not supported by the NCR006-3503341, the NCR006-3300608/Comcode 407545243, or the
KS-24367,L1/Comcode 407771260 DATs, and cannot be used.
The recommended maximum use for a tape is 2000 passes over any particular area of the tape. This includes
retries. The recommended maximum number of times a tape should be loaded into a drive is 100. Data should be
transferred to a new tape and the old tape discarded if either of these "useful life" thresholds are reached.
Worn tapes and tapes at or near end of "useful life" may cause excessive read-after-write error recovery and high
error-correction counts to occur. The following are indicators that a tape is worn or has exceeded one of the "useful
life" thresholds:
The "Media Wear Caution" signal is displayed. Also, this indicates that cleaning may be needed. "Media Wear
Caution" is signaled by the Cassette Indicator LED (green) and Drive Indicator LED (alternately flashing green
and amber). (See Table 8-7 for DAT drive indicators.)
The "Cleaning Needed" signal LED does not extinguish after cleaning. "Cleaning Needed" is signaled by the
Cassette Indicator LED (any) and Drive Indicator LED (pulse amber). (See Table 8-8 for DAT drive indicators.)
The "Cleaning Needed" signal LED extinguishes after cleaning, but reappears following the next tape access.
"Cleaning Needed" is signaled by the Cassette Indicator LED (any) and Drive Indicator LED (pulse amber).
(See Table 8-8 for DAT drive indicators.)
The "Caution" signal is displayed. "Caution" is signaled by the Cassette Indicator LED (green) and Drive
Indicator LED (alternately flashing green and amber). (See Table 8-8 for DAT drive indicators.)
Figure 8-9 is a functional block diagram of the UN376 circuit pack. The UN376 circuit pack includes the following
major functions:
Latch switch
Power switch circuit providing power control, power alarm, scan point, and signal distributor point functions
+5 V power supply
Self-identification circuit.
When the UN376 circuit pack is inserted into the apparatus housing, the -48 V power is not applied to the circuit
pack until the Latch Switch is closed. When the Latch Switch is pushed in and the ACO-T switch is off, the UN376
circuit pack power-up sequence is started. Power is first applied to the BMPM supplying the +5 V DC power control
for the circuit pack and then a power-up sequence is started for logic and drive circuits. The Latch Switch functions
as the on/off switch for the circuit pack and mechanically locks the circuit pack in place when it is closed (pushed in).
The Power Switch Circuit provides power controls and indicators, power alarms, and an interface for SC and SD
points. Figure 8-5 shows the UN376 circuit pack faceplate controls and indicators.
Table 8-11 defines the UN376 circuit pack switch functions. Table 8-12 defines the UN376 circuit pack indicator
functions. Table 8-13 defines the UN376 circuit pack scan point outputs.
The MAJOR ALARM (MJ) is generated when any converter alarm is active, an input voltage is out of range, or when
the -48 V is lost and the ACO-T switch is off. The MJ is cleared when power is reapplied.
The POWER ALARM is generated when either ALM50 or ALM120 alarms are present and -48 V is present (ON).
The POWER ALARM alarm is independent of the position of the ACO-T switch.
Figure 8-9 UN376/UN376C/UN376E 3.5-Inch SCSI DAT Drive Functional Block Diagram
e. X = Don't care.
The JW030B +12 V board-mounted power module is a 30-watt DC-to-DC converter that operates from -48 V and
provides a +12 V output for operation of the tape drive.
The ME005A +5 V board-mounted power module is a 5-watt DC-to-DC converter that operates from -48 V DC and
provides a +5 V DC output. The ME005A module provides power to the power control and alarm circuits. This
separate power module is used for the power control and alarm circuits to increase system reliability. If the power
from the +12 V converter or the other +5 V converter fails, the power control and alarm circuits will still operate to
control shutdown, alarms, and the display indicators.
The JW030A +5 V board-mounted power module is a 30-watt DC-to-DC converter that operates from -48 V DC and
provides a +5 V DC output. The JW030A module supplies +5 V to the faceplate-mounted tape drive and to the
Differential-to-Single-Ended SCSI Converter circuit.
The ME005A +5 V power output is monitored by a voltage supervisor that generates an INIT0 signal for the
automatic restart of the circuit pack if the Latch Switch is closed and the ACO-T switch is OFF. The JW030A +5
V power output is monitored by a voltage supervisor that generates the RST0 signal for controlling the power on
relay. The +5 V power must be greater than +4.5 V for the operation of the circuit pack.
The JW030B +12 V power output is monitored by a voltage comparator that generates a power alarm and lights
the ALM indicator when the voltage falls below 11.4 V.
The -48 V power is monitored by a voltage comparator that generates a remote shutdown of the board-mounted
power modules when the voltage falls below -38 V.
The 3.5-inch DAT drive provides a low-cost cartridge tape capability for the 3B21D computer.
Interfaces the 3B21D computer differential SCSI bus and the single-ended SCSI device bus.
Figure 8-7 and Table 8-10 show the placement and settings for the SCSI ID switches.
CAUTION: Take extreme care to ensure that there are no SCSI ID conflicts. If two or more devices have the same
ID, the results are unpredictable.
The DAT drive may be in any one of seven states with respect to the cartridge tape. Table 8-14 defines the
cartridge tape drive states. These states do NOT directly relate to the state of the drive and cassette indicators
defined in Table 8-7 .
CAUTION: When a cassette tape is write-protected, the tape log cannot be updated. This means that the history of
tape use will be inaccurate.
A cartridge (cassette) tape is write-protected by sliding the tab on the rear of the cassette so that the hole is open.
When write-protected, data can only be read from the tape. A cassette tape is write-enabled when the hole is
closed.
CAUTION: Although the manufacturer has provided pins to prevent the cassette from being over-inserted,
excessive insertion force will damage the drive mechanism components. The cassette should be
inserted gently into the drive. Very little force is required to cause the drive to grab the cassette; after
that, the drive will pull the cassette into the drive.
Gently insert the cartridge tape (cassette) into the drive until the drive takes hold of the cartridge. The cartridge tape
loading sequence is as follows:
(1) The drive threads the tape and rewinds the tape to the Beginning of Media (BOM). The tape is then moved to
the Beginning of Partition (BOP) for Partition 0. The Reference area is then checked to determine the tape
format (DDS, audio, and so forth.).
(2) If the tape is blank, the drive leaves the tape at the BOP for Partition 0 and waits for the next command.
(3) If the error rate is high, Caution is signaled on the front panel indicators by lighting the Cassette indicator
green and alternately flashing the drive indicator green and amber.
(4) The system area on the tape is then accessed, and the tape log is read into the drive.
NOTE: If the NCR006-3503341 DAT drive is power-cycled while a cassette is loaded, the drive performs a load
sequence and goes on-line.
CAUTION: To protect the media from damage, remove the cassette from the drive before powering down the
UN376 circuit pack.
The cassette tape can be removed from the NCR006-3503341 (UN376), NCR006-3300608/Comcode 407545243
(UN376C), or KS-24367,L1/Comcode 407771260 (UN376E) DAT drive by pressing the Unload button on the drive.
The Unload button ejects the cassette from the drive.
(2) If the tape is write-enabled, a copy of the tape log held in the drive RAM is written back to the tape.
(3) The tape is rewound to the BOM, unthreaded from the drive mechanism, and ejected.
Clean the UN376 tape heads when the cassette indicator is green and the drive indicator alternately flashes
green and amber.
Clean the UN376C/UN376E tape heads when either of the following conditions occur:
The cassette indicator is in any state and the drive indicator pulses amber, or
The cassette indicator is green and the drive indicator alternately flashes green and amber.
Use a (Hewlett-Packard part number C5709A or equivalent) 4-mm cleaning cassette to clean the drive. Insert the
cleaning cassette into the drive and the drive will automatically load the cassette, clean the heads, and eject the
cassette. When the operation is complete, record the date on the cassette label to maintain a history of use. After 25
uses, replace the cleaning cassette.
The KS-23909 9-Track SCSI Tape Drive is a vertically-mounted, half-inch, reel-to-reel magnetic tape drive. The use
of 9-track tape media that complies with ANSI standard 3.40-1983 (or later issue) or ECMA-62 specification is
recommended.
The KS-23909,L10 drive is a 1600/6250 Characters Per Inch (CPI), dual-density, automatically-loaded drive with a
512-kilobyte buffer operating at 42 Inches Per Second (IPS) in either electronic start/stop or streaming modes, or
operating at 125 IPS in the streaming mode.
The KS-23909,L21 drive is a 1600/6250 CPI, dual-density, manually loaded drive with a 1 megabyte buffer operating
at 125 IPS in either electronic start/stop or streaming modes.
The drives can operate in either a buffered or unbuffered mode. In the buffered mode, either a 512-kilobyte or
1-megabyte electronic cache buffer allows the system designs to maintain streaming performance.
Data is recorded in either the 1600 CPI Phase Encoded (PE) method or the 6250 CPI Group Coded Recording
(GCR) method. (A megabyte is 220 bytes of data.)
The differential buffered SCSI permits the location of the tape unit to be up to 82 feet (25 meters) from the SCSI
host adapter. The 9-track tape units are located in Peripheral Growth Cabinets, to the right of the Processor
Cabinet.
Table 8-15 identifies the available KS-23909 9-track drives. Table 8-1 identifies the standard differential SCSI
connector pins.
The KS-23909 9-track tape drive accepts 6.25-, 7-, 8.5-, and 10.5-inch tape reels of 0.5-inch wide magnetic tape.
Table 8-16 summarizes the data storage capabilities available with the various sizes of reels and recording
methods.
See the vendor manuals provided with the 9-track tape drive unit for functional information. KS-23909,L10 is
documented in the vendor manual KS-23909,L40. KS-23909,L21 is documented in the vendor manual
KS-23909,L30.
(1) Wait for the OK indication at the end of the power-on sequence.
(2) Ensure that a write-enable ring is installed on the tape reel to permit writing, or is removed to prevent
over-writing the existing data.
(3) Ensure that the tape end is free. For new reels, remove the adhesive strip and/or rubber block constraining
the free end of the tape to the tape pack.
(5) Place the tape reel onto the self-centering supply hub with the write enable ring side towards the casting.
Push the tape reel onto the self-centering hub in the loading chamber. The pushing action both locates the
reel and locks it onto the hub.
(6) Close the loading door. When the loading door is closed, the auto-threading procedure is started. The unit
checks that the reel is not inverted. The tape is then threaded to the take-up spool, tensioned, and advanced
to the Beginning of Tape (BOT). The display should indicate LOCATING, quickly followed by LOADING.
(7) When the BOT is indicated, the load sequence is complete. Check the Loading/Unloading Indications for
other indications that might be displayed during the loading sequence.
To remove a tape reel from the unit with power on, perform the following steps:
(1) Set the KS-23909,L10 unit off-line either by pressing the RESET button, or, if in the diagnostic mode, by
pressing the DIAG button once.
(2) If "Offline" is displayed, press and hold down the RESET button, and then press RWD/UNL. The tape will
rewind with REW/UNLD indicated through to the BOT.
(3) Wait for the OK indication, and then press the center of the supply hub to release the tape reel.
If power to the KS-23909,L10 unit is OFF, and it is essential that the tape be removed, the tape reel may be
rewound manually by performing the following steps:
(2) Open the loading door, and then rotate the supply reel counter-clockwise until all of the tape has been
rewound.
(3) Press the hub release button, and then lift off the unclamped tape reel.
(2) Slide a tape reel, free end to the right, over the center of the supply hub until the rollers retain the reel.
(3) Manually thread the tape following the tape path to the take-up reel.
(4) Secure the end of the tape on the take-up reel, and rotate the reel two times.
To remove a tape reel from the KS-23909,L21 unit with power on, perform the following steps:
(3) Open the tape door. Note that if the door is opened before the unload cycle is complete, the supply hub
fingers may not completely retract. Manual retraction of the supply hub fingers will then be required. Push and
hold the tape lock/unlock lever, and turn the supply hub counter clockwise to manually retract the supply hub
fingers.
The 3B21D computer maintenance terminal, Maintenance Teletypewriter (MTTY), is a KS-23996 Color Video
Terminal. The KS-23996 Color Video Terminal is a low-cost color video terminal with the following characteristics:
Supports two RS-232C ports: one for connection to the 3B21D computer [Data Terminal Equipment (DTE)
configuration] and one for connection to a serial printer [Data Communications Equipment (DCE) configuration].
Keyboard is a QWERTY layout with standard alphanumeric keys, a numeric keypad, programmable function
keys, private function keys, and a set of arrow keys (Figure 8-10 ).
Figure 8-11 is a rear view of the Color Video Terminal Base Unit, KS-23996,L10 or L15, and shows the location of
the power, Parallel, Aux, EAI (Emergency Action Interface), Video, and Kybd connections. These connections are
as follows:
Power for the domestic (U.S.) MTTY is 120-V AC, 60 Hz; the international version is 240-V AC, 50-Hz power.
There are no user adjustable voltage settings. KS-23996,L1 is the domestic (U.S.) version of the MTTY, and
KS-23996,L5 is the international version. Note that the installing organization (the application) is responsible for
supplying the power cords for the international version because of variations in plug/receptacle configurations in
international installations. The domestic (U.S.) version, KS-23996,L1, comes with two detachable, 6-foot, 3-wire
power cords (one cord for the Monitor and one cord for the Base Unit).
The EAI connector is the primary 3B21D computer port. This is a 25-pin D connector providing an RS-232C
serial port configured for Data Terminal Equipment (DTE). Figure 8-12 shows the pinout for the EAI connector.
The EAI port on the Base Unit is connected to the 3B21D computer UN377 Port Switch and Scanner-Distributor
Buffer (PSSDB) circuit pack with an ED-3T076-20,G7B (50 feet), ED-3T076-20,G7D (100 feet), or an
ED-3T076-20,G7F (250 feet) MTTY cable. The connection to the UN377 circuit pack is at the Processor Unit 1
backplane at EQL 045-186-332.
The Aux connector is a secondary host port for connection to a serial printer or to a second host computer
(host computer or modem). This is a 25-pin D connector providing a port configured for Data Communications
Equipment (DCE). No adapter is needed to connect a serial printer to the Aux port (generally a DTE device);
however, a null modem adapter may be needed if the port is connected to a host computer or modem
(generally a DCE device). Figure 8-12 shows the pinout for the Aux connector.
The Parallel connector is a Centronics parallel port for connection to a printer or other parallel device. Figure
8-13 shows the pinout for the Parallel 25-pin D connector.
The Color Video Monitor connects to the Video connector on the Color Video Base Unit.
There are two types of printers available that can be used as the Receive-Only Printer (ROP). One is a Lucent
Technologies Model 577 dot-matrix printer intended for large office applications where the workload is greater than
8000 pages/month of typical ROP output.
The other is the Lucent Technologies Model 602 dot-matrix printer intended for small office applications where the
workload is equal to or less than 8000 pages/month of typical ROP output.
The ROP is connected to the 3B21D computer UN377 Port Switch and Scanner-Distributor Buffer (PSSDB) circuit
pack with one of the following ROP cables:
The connection to the UN377 circuit pack is at the Processor Unit 1 backplane at EQL 045-186-132.
Figure 9-1 shows the typical -48 V DC distribution arrangement for the 3B21D computer Processor Cabinet. The
primary power source for the 3B21D computer is -48 V DC from a local battery plant. Power is distributed to the
computer via power feeders from a Power Distribution Cabinet (PDC). In international applications, the power
feeders connect to dedicated power line Electromagnetic Interference (EMI) filters above the computer cabinet. The
EMI filter outputs are routed to the Fuse and Filter Unit (FFU) where they are split into branches to the equipment
units and cooling fans. In domestic applications, the power feeders from the PDC connect directly to the FFU. In the
equipment units, DC-to-DC converters generate the voltages used by the circuit packs. The cooling fans and a few
circuit packs directly use -48 V DC. The DC-to-DC converters are -48 V DC to +5 V DC supplies that plug into the
backplane or are board-mounted power modules (BMPMs) that provide power directly to the circuit pack on which
they are mounted.
The 3B21D computer complies with the European Telecommunication Standardization Institute (ETSI) extended
voltage limits.
CAUTION 1: Equipment damage can result if the PDC fuses are installed without first unseating the
associated 3B21D computer circuit packs that draw -48 V current. To prevent equipment damage,
unseat the circuit packs associated with the PDC feeder before installing the PDC fuse for that feeder.
CAUTION 2: Fuse failure will result if the 3B21D computer FFU fuse for a 410AA DC-to-DC converter is installed
without first unseating the 410AA converter. To prevent fuse failure, unseat a 410AA converter before
installing its fuse in the FFU. Reinstall the 410AA converter after its fuse is installed.
Figure 9-2 is a rear view of the FFU in the Processor Cabinet showing how blocks of fuses split the feeders into
branches to the internal units. Table 9-1 identifies the -48 V DC loads for associated power feeder, fuse, and
branch.
Power feeders originating from PDC Buses 0 and 1 terminate in the FFU in the 3B21D computer Processor Cabinet.
Note that some 3B20D computer applications refer to these buses as Bus A and Bus B, respectively. The left half of
the FFU distributes power from PDC Bus 0 (6 feeders) to Processor Unit 0; the right half distributes power from
PDC Bus 1 (6 feeders) to Processor Unit 1.
In the FFU, blocks of fuses split the feeders into branches to the internal units. Each branch is protected with a
single fast-blow fuse. The fuse blocks contain a "fuse-alarm" light-emitting diode (LED) associated with each fuse
position and two alarm outputs that signal a fuse blowing event. The failure of any fuse is indicated via a LED
indicator on the indicator strips above the cabinet doors at the front and rear of the Processor Cabinet. Fuse blowing
transients are minimized by capacitors (one per feeder). Each 4700 F capacitor has a 10-K ohm bleeder resistor.
Each processor can require up to 33 branches (2 to 9 branches per feeder).
Since the 3B21D computer FFU has electrolytic filter capacitors on the input power feeders, a charging tool must be
used when installing 3B21D computer fuses at the Power Distribution Cabinet (PDC). See Caution 1.
Also note that when installing a fuse in the 3B21D computer FFU that protects a 410AA DC-to-DC converter, the
410AA must be unseated to prevent fuse failure. After a 410AA fuse is installed, the associated 410AA can be
installed because the converter latch switch circuit limits the inrush current and prevents fuse failure. See Caution 1
and Caution 2.
SPU05]
4.15 [5.3]
E(0,1) D(5,15) 050D,150D PWR E e N48V15 1.5 10 14
C(5,15) 050C,150C DFC 0, DFC 1 N48V14 0.2 3.0 16
B(5,15) 050B,150B SPU00, SPU01 N48V16 1.3 3.0 16
A(5,15) 050A,150A SPU02, SPU03 N48V17 1.3 3.0 16
E(0,1) D(6,14) 059D,141D SPU54, PSSDB N48V18 1.0 3.0 16
C(6,14) 059C,141C PWR H e N48V19 1.5 10 16
B(6,14) 059B,141B SPU18, SPU19 N48V20 0.2 [1.3] 3.0 16
[DFC 2,]
A(6,14) 059A,141A PC32-33 N48V21 0.1 [1.3] 3.0 16
[SPU20, SPU21]
7.1 [9.4]
F(0,1) D(7,13) 073D,127D PWR F N48V22 3.1 10 14
C(7,13) 073C,127C IOPPS N48V23 2.0 5.0 16
B(7,13) 073B,127B PC00-01 N48V24 0.1 3.0 16
A(7,13) 073A,127A PC02-03 N48V25 0.1 3.0 16
F(0,1) D(8,12) 082D,118D spare N48V26
C(8,12) 082C,118C spare N48V27
B(8,12) 082B,118B PC10-11 N48V28 0.1 3.0 16
A(8,12) 082A,118A PC12-13 N48V29 0.2 3.0 16
F(0,1) D(9,11) 091D,109D PWR G* [spare] f N48V30 3.1 [0.0] 10 16
C(9,11) 091C,109C PC20-21 N48V31 0.1 [1.3] 3.0 16
[SPU26, SPU27]
B(9,11) 091B,109B PC22-23 N48V32 0.1 [1.3] 3.0 16
[SPU24, SPU25]
A(9,11) 091A,109A PC30-32 N48V33 0.1 [1.3] 3.0 16
[SPU22, SPU23]
9.0 [9.5]
Notes:
a. The power feeder designation "(0,1)" connects to Processor 0 and 1 from PDC Bus 0 and Bus 1, respectively.
e. PWR E, PWR H, N48V15, and N48V19 are not equipped if DFC 0 and DFC 1 use a UN580B.
f. PWR G (410AA) is omitted if N48V21, N48V31, N48V32, and N48V33 feed SPUs.
Figure 9-2 Processor Cabinet Fuse and Filter Unit -48 V DC Distribution (Rear View)
The Peripheral Growth Cabinet provides mounting space for Small Computer System Interface (SCSI) 9-track tape
drives. The tape drives require either 120-V AC, 60-Hz or 240-V AC, 50-Hz power. The 9-track tape drives plug
directly into AC outlets located within 6 feet of the cabinet.
Figure 9-3 shows how fuse alarms are reported via scan points. When an FFU fuse blows, the LED next to the
fuse lights, and a fuse alarm signal is activated. The failure of any fuse is also indicated via an LED on the indicator
strips above the cabinet doors at the front and rear of the Processor Cabinet.
The Processor Cabinet FFU outputs two fuse alarm leads: FA10 monitors the fuses for Processor 1; FA00 monitors
the fuses for Processor 0. Each alarm lead is cabled to both the Input/Output Processor (IOP) and Control Unit (CU)
power switches, TN1820 and TN1821, where they are converted to scan points (CSCZ and ISCZ). Since all IOP
scan and signal-distributor points are cross-connected between processors, a blown fuse is reported by two scan
points (one in each processor). This permits reporting the failure of a fuse that protects a power switch
(TN1820/TN1821) or a Scanner and Signal Distributor Controller (SCSDC) circuit pack (UN33). The failure is also
reported via an output message on the Receive-Only Printer (ROP).
The Processor Unit has three fault groups: CU, Disk File Controller (DFC), and IOP. The power for these fault
groups is independently generated and controlled. The minimum entry computer is equipped with DC-to-DC
converters CONVA and CONVC. The DC-to-DC converters CONVB and CONVD are added as the CU and IOP
communities grow. Some systems that use earlier DFC controllers will have a CONVE.
The Growth Unit has two fault groups: DFC and IOP. The growth apparatus unit is used to expand the number of
Peripheral Controllers (PCs) and/or the number of SCSI peripheral units (SPUs). SPU expansion is done by adding
a DFC, SPUs, and a DC-to-DC converter (CONVH). PC expansion is done by using SCSI bus extension cables
from DFC 0 and DFC 1 or by adding another DFC. Additional IOPs can be grown in either Growth Unit by adding
IOP circuit packs. The power converter provided with the IOP circuit pack powers the first and second PC
communities (0 and 1) in each Growth Unit. Additional power converters are required to power PC communities 2
and 3 in each Growth Unit.
The 3B21D computer Processor Unit can contain up to five power converters (CONVA through CONVE). Figure 9-4
shows these five converters, and the circuit packs they serve. Two of the converters, CONVA and CONVC, are
always equipped. CONVB and CONVD are optionally equipped. Control for the power converters is in the TN1821
Control Unit Power Switch (CUPS), TN1820 [IOP Power Switch (IOPPS)], and the UN373 (DFCA) circuit packs. The
power converters and their controllers require -48 V DC as a supply voltage. DFCA (UN373) is unlike the other two
power control circuit packs in that power control is only a small part of its functionality. DFCA also uses the 5 V from
an onboard converter to supply its internal logic. Earlier DFCA configurations will receive a CONVE.
Figure 9-4 shows there are 18 separate -48 V branches to the Processor Unit backplane. Each converter and
power switch has a fused power input. Likewise, each SCSI peripheral has a fused input. In PC Communities 0, 1,
and 2, two -48 V branches are provided per community, with one branch per slot pair. The primary purpose of these
-48 V feeds are to power optional SCSI units in the PC community. The only current PC card supported by the
3B21D requiring -48 V is the UN33 and UN933. In PC community 3, one -48 V branch supplies all three slots.
Finally, 5 V from CONVC is routed to the SPU54/Port Switch and Scanner-Distributor Buffer (PSSDB) position for
use by the PSSDB. The PSSDB uses -48 V from the backplane and 5 V from CONVC. The SPU54 uses only -48 V
from the backplane.
The PC Communities also require 12 V and -5 V, which are provided by the IOPPS. The 12 V supplies on the
IOPPS are rated at 50 watts each. As indicated in Figure 9-4 , the -48 V return is isolated from frame and logic
ground. All other supply voltages have their returns tied to logic and frame ground.
The circuit pack designation strips on the unit are color-coded to show which DC-to-DC converters supply power to
the various circuit pack positions. Figure 9-4 identifies this color-coding for each of the converters.
CAUTION: It is strongly emphasized that hot insertion or removal of circuit packs into any of these positions is NOT
an allowable procedure. Equipment damage can result. Remove power from the circuit pack(s) using the
appropriate power switch(es) before installing or removing circuit packs.
The power interlocks in the Processor Unit are designed to shut down the power converters if any critical circuit
packs are removed while the power switch and converters are in operation. The power interlocks also prevent
powering up if the critical circuit packs are not installed. For the Control Unit (CU) power group, the critical circuit
packs are the MM (KLW32, KLW40, KLW48, KLW64, or KLW128), DMA 0 (KBN15), and CC (KLW31). For the IOP
power group, the critical circuit pack is the IOP (KBN10). Finally, for the DFC power group, the critical pack is the
DFCB (TN2116) when the UN373 is equipped. Otherwise, the UN580 and UN580B do not use interlocks.
Figure 9-5 shows the interlocks are passed through each power group's primary converter and then to the critical
circuit packs. The CINTA0, IINTA0, and DINTA0 inputs to each power group must sense a logic "0" for normal
operation. A break in the primary interlock connection causes the power converter to activate its major alarm output.
If the attached power converter had been operating, it is turned off. If the break occurs during converter start up, the
converter is not started. Therefore, hot removal of any critical circuit pack or converter will shut down that power
group. Likewise, hot insertion is not possible, since power is not applied unless all critical circuit packs are installed.
On the CU and IOP power groups, secondary interlock inputs are provided that are intended to detect the need for a
growth power controller. Installation of a circuit pack at the DMA 1, EX 0, or EX 1 positions requires power converter
CONVB to be installed. Installation of a circuit pack in any of the positions in PC communities 2 or 3 requires
CONVD to be installed. The secondary interlocks are shown in Figure 9-5 as CINTB0 and CINTC0 for the CUPS,
and as IINTB0 and IINTC0 for the IOPPS. If either one of the secondary interlock circuits is closed, and the other
open, the corresponding power switch will activate its major alarm output and turn off both the primary and
secondary power converters. If CONVD is installed but there are no circuit packs in the associated PC slots, the
power is not turned off because there is nothing to shut down. If there is a PC circuit pack installed in a PC slot
associated with CONVD, but CONVD is not installed, an alarm is activated.
Note that PC communities 0 and 1 are not interlocked. Circuit packs in these positions may be removed or installed
with power on without detection by the IOPPS power switch. Furthermore, if at least one circuit pack is installed in
PC communities 2 or 3, then hot insertion/removal of packs at other positions will not activate the IOPPS interlock.
The CUPS is interlocked with the DMA 1, EX 0, and EX 1 positions as an OR'd function. If one position is equipped,
the other two positions may be installed/removed without detection by the CUPS interlocks. See Caution.
The PC community interlocks do not apply when an SCSI peripheral circuit pack is installed. The SCSI circuit packs
contain their own power converters and power switches. A SCSI circuit pack may be installed into a PC community
slot without affecting either the 5-V power or the logic connections to the remainder of the community.
The 3B21D computer Growth Unit can contain up to three power converters (CONVF, CONFG, and CONVH).
Figure 9-6 illustrates these three converters and the circuit packs they serve. Control for the power converters is in
the TN1820 (IOPPS) and the UN373 or UN580 (DFCA) circuit packs. The power converters and their controllers
require -48 V DC as a supply voltage. DFCA (UN373) is unlike the other two power control circuit packs in that
power control is only a small part of its functionality. DFCA also uses the 5 V from the converter it controls to supply
its other internal logic. The UN580B, if equipped as DFCA, has onboard power converters and does not require
CONVH.
Figure 9-6 shows there are 13 separate -48 V branches to the growth backplane. Each converter and power switch
has a fused power input. Likewise, each SCSI peripheral has a fused input. In PC Communities 0, 1, 2, and 3, two
-48 V branches are provided per community, with one feed per slot pair. The primary purpose of these -48 V feeds
are to power optional SCSI units in the PC community. The only current PC circuit pack supported by the 3B21D
computer requiring -48 V is the UN33 and UN933 circuit pack.
CONVF supplies +5 V to the PC Communities 0 and 1. CONVG supplies +5 V to the PC Communities 2 and 3. The
PC Communities also require 12 V and -5 V, which are provided by the IOPPS. The 12 V supplies on the IOPPS
are rated at 50 to 150 watts each, depending on which version of the IOPPS is equipped.
As indicated in Figure 9-6 , the -48 V return is isolated from frame and logic ground. All other supply voltages have
their returns tied to logic and frame ground.
The circuit pack designation strip on the unit is color-coded to show which DC-to-DC converters supply power to the
various circuit pack positions. Figure 9-6 identifies this color-coding for each of the DC-to-DC converters.
CAUTION: It is strongly emphasized that hot insertion or removal of circuit packs into any of these positions is NOT
an allowable procedure. Equipment damage can result. Remove power from the circuit pack(s) using the
appropriate power switch(es) before installing or removing circuit packs.
The power interlocks in the Growth Unit are designed to shut down the power converters if any critical circuit packs
are removed while the power switch and converters are in operation. The power interlocks also prevent powering up
if the critical circuit packs are not installed. For the IOP power group, the critical circuit pack is the IOP (KBN10). For
the DFC power group, the critical pack is the DFCB (TN2116) when DFCA is the UN373. Otherwise, the UN580 and
UN580B do not use interlocks.
Figure 9-7 shows how the interlocks are passed through each power group's primary converter and then to the
critical circuit packs. The CINTA0, IINTA0, and DINTA0 inputs to each power group must sense a logic "0" for
normal operation. A break in the primary interlock connection causes the power converter to activate its major alarm
output. If the attached power converter had been operating, it is turned off. If the break occurs during converter start
up, the converter is not started. Therefore, hot removal of any critical circuit pack or converter will shut down that
power group. Likewise, hot insertion is not possible, since power is not applied unless all critical circuit packs are
installed.
Secondary interlock inputs are provided on the IOP power groups, which are intended to detect the need for a
growth power controller. Installation of a circuit pack in any of the positions in PC communities 2 or 3 requires
CONVG to be installed. The secondary interlocks are shown in Figure 9-7 as IINTB0 and IINTC0 for the IOPPS. If
either one of the secondary interlock circuits is closed, and the other open, the corresponding power switch will
activate its major alarm output and turn off both the primary and secondary power converters. If CONVG is installed
but there are no circuit packs in the associated PC slots, the power is not turned off because there is nothing to shut
down. If there is a PC circuit pack installed in a PC slot associated with CONVG, but CONVG is not installed, an
alarm is activated.
Note that PC communities 0 and 1 are not interlocked. Circuit packs in these positions may be removed or installed
with power on without detection by the IOPPS power switch. Furthermore, if at least one circuit pack is installed in
PC communities 2 or 3, then hot insertion/removal of packs at other positions will not activate the IOPPS interlock.
See Caution.
The PC community interlocks do not apply when an SCSI peripheral circuit pack is installed. The SCSI circuit packs
contain their own power converters and power switches. A SCSI circuit pack may be installed into a PC community
slot without affecting either the 5-V power or the logic connections to the remainder of the community.
CAUTION: When installing a fuse in the 3B21D computer Fuse and Filter Unit (FFU) for a 410AA converter, the
converter must be unseated. Fuse failure will result if the fuse for a 410AA DC-to-DC converter is
installed without first unseating the 410AA converter. To prevent fuse failure, unseat a 410AA converter
before installing its fuse in the FFU. Reinstall the 410AA converter after its fuse is installed.
The 410AA Power Converter is a 310-watt DC-to-DC converter that operates from -48 V DC and outputs +5 V DC at
62 amperes. Some of the 410AA converter features are as follows:
A latch switch mechanically locks the converter in place when closed (pushed in). When the latch switch is
open (pulled out), the latch switch circuit limits the inrush current when the converter is installed. See Caution.
Converter start is controlled by the associated power switch circuit pack (TN1820, TN1821, or UN373).
A red indicator used for any alarm or shutdown condition. For example, a low output voltage alarm turns on
this indicator.
Board-mounted power modules (BMPMs) provide power directly to the circuit pack on which they are mounted. The
following circuit packs use BMPMs:
The FE050B +12 V board-mounted power module is a 50-watt DC-to-DC converter that operates from -48 V and
provides a +12 V output. The FE050B is used on the TN1820 circuit pack.
The FE150B is a 150-watt version of the FE050B. The TN1820C uses two FE150B modules to provide its +12 V
and -12 V outputs. The TN1820D uses one FE150B for the 12-V output and one FE050B for the -12 V output.
The JW030A +5 V board-mounted power module is a 30-watt DC-to-DC converter that operates from -48 V DC and
provides a +5 V DC output. The JW030A module is used on the UN375, UN376, and UN580B circuit packs.
The JW030B +12 V board-mounted power module is a 30-watt DC-to-DC converter that operates from -48 V DC
and provides a +12 V DC output. The JW030B is used on the UN375 and UN376 circuit pack.
The ME005A +5 V board-mounted power module is a 5-watt DC-to-DC converter that operates from -48 V DC and
provides a +5 V DC output. The ME005A module provides power to the power and alarm circuits. This separate
power module is used for the power control and alarm circuits to increase system reliability. If the power from the
+12 V converter or the other +5 V converter fails, the power control and alarms circuits will still operate to control
shutdown and the display indicators. The ME005A is used on the TN1820, TN1821, UN375, UN376, and UN377
circuit packs.
The TW070AB board-mounted power module is a 70-watt converter that operates from -48 V DC and provides a +5
V and +12 V DC output. It is used on the UN375E to power the disk drive.
The power for the three processor fault groups is controlled by power switch functions contained in three circuit
packs types: the TN1821 CU Power Switch (CUPS), the TN1820 IOPPS, and the UN373, UN580, or UN580B DFCA
circuit pack.
Figure 9-8 shows the UN373 DFCA circuit pack. A description of the 3B21D computer power switches and LEDs is
given in Tables 9-2 and 9-3 .
NOTE: The 3B21D computer power switch faceplate differs from the 3B20D computer. The ON and OFF
momentary contact pushbuttons are replaced by a 3-position START/ON/OFF rocker switch to provide the
auto-restart feature.
All power switch functions have the Scanner and Signal Distributor (SCSD) interface described in Tables 9-4 and
9-5 .
SWITCH b , c SCX/Y d
ON ON 0 RST 00
ON ON 0 ROS 10
ON ON 1 Xe 01
X OFF X X 11
OFF X X X 11
Notes:
a. +5 V in the CU and DFC. +5 V and 12 V in the IOP.
e. X = Don't care.
Standard +5 V is distributed to the CU circuit packs via the multilayer backplane (see P5VA and P5VB in Figure 9-9
).
The CU (Processor Unit) backplane is divided into two power segments. Each segment is supplied by a dedicated
FastechTM -48 V to +5 V DC-to-DC converter. CONVA supplies power to the CC, DMA 0, UC and MEMORY circuit
packs; CONVB supplies the DMA 1 pack and two Expansion Slots. Both CONVA and CONVB are controlled by the
CU Power Switch circuit pack. The CU Power Switch (CUPS) provides power control, alarms, power reset signals,
and the craft interface. In the minimum configuration, only segment A is equipped. CONVB is added when DMA 1
and/or the expansion slots are needed. Backplane power pins are protected from short circuit damage by
Programmable Over-Current Shutdown (POCS) via leads CPA(N,P) and CPB(N,P).
The 3B21D computer CU Power Switch (CUPS) provides the following functions:
Provides the craft interface (switches and LEDs) to the CU power system
Provides self-identification.
The IOP fault group includes an IOP Controller and four Peripheral Controller (PC) communities with up to four PC
circuit packs per community. A fully equipped 3B21D computer can support four IOPs. IOP 0 and IOP 1 are
equipped in the Processor Unit for CU 0 and CU 1. IOP 2 is equipped in the Growth Unit at EQL 11-011. IOP 3 is
equipped in the Growth Unit at EQL 62-011. Figure 9-10 shows the IOP Power Distribution and Control for a
Processor Unit. Figure 9-11 shows the IOP Power Distribution and Control for a Growth Unit.
PC circuit packs require standard +5 V DC along with miscellaneous voltages including 12 V for EIA bus interface
circuits (N12E and P12E), and +12 V DC (P12M), and -5 V DC (N5M). A common +12 V supply is used for the P12E
and P12M. Therefore, only the P12E is shown in Figures 9-10 and 9-11 .
The IOP is divided into two power segments. The first segment consists of the IOP Controller (KBN10) PC
Communities 0 and 1, and the PSSDB (UN377) circuit pack. The second segment consists of PC Communities 2
and 3. For IOP 0 or IOP 1, the CONVC supplies +5 V DC for the first segment; CONVD supplies +5 V DC for the
second segment. For IOP 2 or IOP 3, the CONVF supplies +5 V DC for the first segment; CONVG supplies +5 V DC
for the second segment. The miscellaneous voltages for both segments are generated by BMPMs on the TN1820
IOP Power Switch (IOPPS) circuit pack. All IOP power is controlled by the IOPPS. Backplane power pins are
protected from short circuit damage by Programmable Over-Current Shutdown (POCS) via leads CPC(N,P) and
CPD(N,P).
The IOP 1 unit also contains a Port Switch and Scanner-Distributor Buffer (PSSDB) circuit pack that switches MTTY
and ROP EIA buses to controllers in Processors 0 or 1, and interfaces office alarms and other non-3B21D computer
circuits to the Scanner/Signal-Distributor Controllers in Processors 0 and 1. The PSSDB is located in Processor 1
only; Processor 0 uses the dual function slot for SPU54. The PSSDB uses -48 V from the backplane and P5VC from
CONVC. The SPU54 uses only -48 V from the backplane.
The 3B21D computer IOP Power Switch (IOPPS) provides the following functions:
Provides the craft interface (switches and LEDs) to the IOP power system
Self-identification.
TN1820C: Provides 150-watt +12 and -12 V outputs. The TN1820C is required if the UN582 or UN582B circuit
packs are equipped in the IOP community.
TN1820D: Provides 150-watt +12 and 50-watt -12 V outputs. The TN1820D is required when the UN582 or
UN582B circuit packs are equipped in the IOP community. Also, the TN1820D provides full electrical isolation
between -48 V supply lines and the frame ground.
The DFC fault group consists of the DFC controller circuit packs and a power converter (not required for DFC
controllers that have onboard power converters). Figure 9-12 illustrates the power connections for a DFC
configured with a UN373, TN2116, and 410AA. For a DFC that uses a UN580, the TN2116 is not equipped, and the
existing connections to it are not used. For a DFC that uses a UN580B, the 410AA converter is not equipped, and
those connections are not used. Systems using the UN580B will not have the N48V15 and 48R15 feeders equipped,
so it is not possible to use the UN580 or UN373 circuit packs on these systems.
The 3B21D computer is provided with two DFCs. DFC 0 is equipped in Processor Unit 0, and DFC 1 is equipped in
Processor Unit 1. A third DFC, DFC 2, can be equipped in the Processor Cabinet, Growth Unit at EQL 11-172.
While current systems are shipped with the single DFC controller pack with onboard power (UN580B), earlier
systems may use a DFC controller configured with the UN580 and 410AA circuit packs, or the DFC controller may
be configured with a combination of UN373, TN2116, and 410AA circuit packs.
The power alarm, power control, power reset, and craft interface functions are still identical in all the different DFC
configurations. The same scan and SD points and alarm grid connections are used.
9.17 UN375 SCSI DISK DRIVE AND UN376 SCSI DAT DRIVE POWER CONTROL
The 3B21D computer UN375 Moving Head Disk (MHD) drive and UN376 DAT drive circuit packs contain drives with
SCSI bus interfaces, BMPMs, voltage monitors, and power switch circuits as shown in Figure 9-13 .
These packs are self powered. They contain board-mounted power modules that convert -48 V to +5 V and +12 V
for the power control circuits, SCSI bus interfaces (if equipped), and the SCSI tape or disk drive units.
Power switch circuits provide the power control, alarm, and interface functions.
See Section 8 for more information about the UN375 and UN376 circuit packs.
The Bidirectional Cooling Unit is equipped in the Processor Cabinet. The unit contains two groups of fans. One
group blows air upward to cool Processor 1 and IOP 3-SPU Growth Unit; the other group blows downward to cool
Processor 0 and IOP 2-SPU Growth Unit. Figure 9-14 is a functional block diagram of the Bidirectional Cooling Unit
power and alarm circuits.
The fan motors operate on -48 V. Fan groups 0 and 1 are supplied from FFU side 0 and 1, respectively. The alarm
circuit is powered by N48VFANC and N48VFANG that are OR'd within the alarm circuit board.
Each fan includes an integral Fan Performance Sensor (FPS) that operates from +5 V obtained from a BMPM in the
alarm circuit. If one or more fans fail, the circuit latches an alarm state on its scan point output and lights the
associated fan indicator (LED) on the cooling unit. A fan indicator is on when a fan is not running. The SD point is
used to retire the alarm. A switch on the cooling unit can also be used to manually retire the alarm.
The following 3B21D computer circuit packs have circuitry that is powered by isolated 48-V DC power. The listed
series shown in Table 9-6 will provide complete isolation between both of the 48-V supply leads and 3B21D
computer frame ground.
Some earlier series of the previous circuit packs contained voltage-monitoring circuitry that did not fully isolate the
48-V supply from the 3B21D computer frame ground. These are listed in Table 9-7 . These circuit packs will draw
about 225 microamperes per circuit pack between -48 V DC and frame ground.
In all cases, there is no connection between the +48 V supply line and frame or logic ground in the 3B21D computer.
The 3B21D computer mechanical drawings (J-drawings) and schematic drawings (SDs) are identified in Table 10-1
.
Table 10-2 lists the Lucent Technologies internal documents that provide detailed information on the
packaging/manufacturing technologies.
Table 10-3 identifies some of the specification drawings for 3B21D computer equipment.
10.4 REFERENCES
Table 10-4 lists the Lucent Technologies documents supporting the 3B21D computer.
This section identifies the standards that apply to the 3B21D computer system and briefly summarizes some of the
basic environmental specifications. See Table 11-1 . For detailed 3B21D computer system specification
information, contact your Lucent Technologies Service Representative.
11.2 STANDARDS
The Lucent Technologies 3B21D computer complies with regulatory and safety standards (requirements) specified
by the following standards:
This section identifies the various cable assemblies used for the 3B21D computer. The following Equipment
Drawings are included:
Paddleboards, 9824A
Table 12-1 identifies the connectorized switchboard cables. Figure 12-1 is a rear view of the Processor Cabinet,
J3T060A-1, showing the location of the connectorized switchboard cables.
Cable
062-011-506 028-075-313
ED-3T076-20, G1L Dual Serial Channel 1 IOP 3-SPU, IOP 3, CU 1, DMA 0,
Cable
062-011-706 053-075-313
ED-3T076-20, G1M Dual Serial Channel 1 IOP 2-SPU, DFC 2, CU 0, DMA 0,
Cable
011-180-106 028-075-332
ED-3T076-20, G1N Dual Serial Channel 1 IOP 2-SPU, DFC 2, CU 1, DMA 0,
Cable
011-180-119 053-075-332
ED-3T076-20, G2 Maintenance Terminal 1 CU 0, PC00 (TN983 CU 1, UN377
(MTTY) Control Cable
MTTYC), PSSDB,
019-094-345 045-186-345
ED-3T076-20, G2A Receive-Only Printer 1 CU 0, PC00 (TN983 CU 1, UN377
(ROP) Control Cable
MTTYC), PSSDB,
019-094-132 045-186-145
ED-3T076-20, G2B Maintenance Terminal 1 CU 1, PC00 (TN983 CU 1, UN377
(MTTY) Control Cable PSSDB,
MTTYC), 045-186-351
045-094-345
ED-3T076-20, G2C Receive-Only Printer 1 CU 1, PC00 (TN983 CU 1, UN377
(ROP) Control Cable MTTYC), 045-094-132 PSSDB,
045-186-151
ED-3T076-20, G2D Maintenance Terminal 1 CU 1, PC00 CU 1, UN377
(MTTY) Control Cable (UN583/UN597 PSSDB,
MTTYC), 019-094-132 045-186-345
ED-3T076-20, G2E Receive-Only Printer 1 CU 0, PC00 CU 1, UN377
(ROP) Control Cable (UN583/UN597 PSSDB,
MTTYC), 019-094-332 045-186-145
ED-3T076-20, G2F Maintenance Terminal 1 CU 1, PC00 CU 1, UN377
(MTTY) Control Cable (UN583/UN597 PSSDB,
MTTYC), 045-094-132 045-186-351
ED-3T076-20, G2G Receive-Only Printer 1 CU 1, PC00 CU 1, UN377
(ROP) Control Cable (UN583/UN597 PSSDB,
MTTYC), 045-094-332 045-186-151
ED-3T076-20, G3 Emergency Action 1 CU 0, PC00 CU 0, KLW31 CC,
Interface (EAI) Cable (TN983/UN597 019-038-500
MTTYC), 019-094-153
ED-3T076-40, G3A Emergency Action 1 CU 0, PC00 (TN983 CU 1, KLW31 CC,
Interface (EAI) Cable MTTYC), 019-094-149 045-038-500
ED-3T076-20, G3B Emergency Action 1 CU 1, PC00 (TN983 CU 1, KLW31 CC,
Interface (EAI) Cable MTTYC), 045-094-149 045-038-300
ED-3T076-20, G3C Emergency Action 1 CU 1, PC00 (TN983 CU 0, KLW31 CC,
Interface (EAI) Cable MTTYC), 045-094-153 019-038-300
ED-3T076-20, G4 Boundary Scan Bus 1 CU 0, KLW31 CC, CU 1, TN1820
Cable 019-038-506 IOPPS, 045-080-132
ED-3T076-20, G4A Boundary Scan Bus 1 CU 1, KLW31 CC, CU 0, TN1820
Cable 045-038-506 IOPPS, 019-080-132
ED-3T076-20, G5 Maintenance Channel 1 CU 0, KLW31 CC, CU 1, KLW31 CC,
(MCH) Cable 019-038-100 045-038-100
ED-3T076-20, G6 Boundary Scan Bus 1 CU 0, TN1820 IOPPS, IOP 2-SPU, TN1820
Cable 019-080-151 IOPPS, 011-026-132
ED-3T076-20, G6A Boundary Scan Bus 1 CU 1, TN1820 IOPPS, IOP 3-SPU, TN1820
Cable 045-080-151 IOPPS, 062-026-132
ED-3T076-20, G7B Maintenance Terminal 1 CU 1, UN377 PSSDB, MTTY
(MTTY) Cable (50 Feet) 045-186-332
ED-3T076-20, G7C Receive-Only Printer 1 CU 1, UN377 PSSDB, ROP
ADL
ED-3T076-20, G57 Peripheral Control Cable 1 VT100 UN582 - Provides A
(50 feet max) Null Modem RS232C
ADL
ED-3T076-20, Peripheral Control Cable 1 VT100 UN582 - Provides A
G57A (250 feet max) Null Modem RS232C
ADL
ED-3T076-20, G58 Peripheral Control Cable 1 Color VT UN582 - Provides
(50 feet max) RS232C ADL
ED-3T076-20, Peripheral Control Cable 1 Color VT UN582 - Provides
G58A (250 feet max) RS232C ADL
ED-3T076-20, G59 Peripheral Control Cable 1 Hardware Flow Control UN582 - Provides
(50 feet max) Data Set RS232C ADL
ED-3T076-20, G60 Peripheral Control Cable 1 Hardware Flow Control UN582 - Provides
(50 feet max) Data Set RS232C ADL
ED-3T076-20, G61 Peripheral Control Cable 1 2024A, 2048A, or UN582 - Provides
(50 feet max) 2096A Data Set RS449 DL
ED-3T076-20, G62 Peripheral Control Cable 1 2556B Data Set UN582 - Provides A
(50 feet max) V.35/V.36 DL
ED-3T076-20, G63 Peripheral Control Cable 1 V.35 Data Set UN582 - Provides A
(50 feet max) V.35 DL
ED-3T076-20, G64 Peripheral Control Cable 1 V.36 Data Set UN582 - Provides A
(50 feet max) V.36 DL
Notes:
a. Cables for Peripheral Community Synchronous Data Link Control (SDLC) devices are not included.
b. Sun, Sun Microsystems, and the Sun Logo are trademarks or registered trademarks of Sun
Microsystems Inc. in the United States and other countries.
Table 12-2 identifies the connectorized flex tape cables. Figure 12-2 is a rear view of the Processor Cabinet,
J3T060A-1, showing the location of the flex tape cables. KLW32 could also refer to KLW40, KLW48, KLW64, or
KLW128.
45-186-500 Drive 0 or 1
ED-3T076-40, G101 Processor 0 or 1 and 9-Track Tape 1 28-186-300 9-Track Tape Drive 2 or
Drive 2 or 3 SCSI Bus Cable 3
53-178-300
Table 12-3 identifies the formed cable assemblies. Figures 12-3 and 12-4 are rear views of the Processor
Cabinet, J3T060A-1, showing the location of the formed cable assemblies.
Table 12-4 identifies the paddleboard assemblies used on the Processor Unit backplane. All paddleboards contain
a network of series RC terminations to ground. The resistance value is 56 ohms and the capacitance is 47 pF. This
matches the line impedance of 65 ohms and assumes a series impedance of 10 ohms in the driving elements.
Paddleboard assembly BTR1 also contains pull-up resistors to Vcc for the Central Control Input/Output (CCIO) data
bus, CCIO addresses, and CCIO commands. The pull-up resistance is 1000 ohms. The pull-up resistors are on the
same power boundary (P5VA) as the CC and DMA 0 circuit packs.
Table 12-5 identifies the Small Computer System Interface (SCSI) bus terminators. Termination resistors for the
SCSI buses are mounted external to the backplane and circuit packs but not on paddleboards. A SCSI bus
terminator consists of a commercial resistor assembly that plugs into a connector cabled to the backplane. There
are four of these assemblies, two for each end of the two SCSI buses. Table 12-5 identifies all possible locations
for the SCSI bus terminators.
Table 12-6 lists the SCSI bus jumper locations. Figure 12-2 is a rear view of the Processor Cabinet, J3T060A-1,
showing the location of the 9824AN SCSI Bus Jumpers.
GLOSSARY
The following abbreviations, acronyms, and terms are used in this document.
-- GLOSSARY --
AC
Alternating Current
ACK
Acknowledge
ACO-T
Alarm Cutoff-Test
AD
Address/Data (bus)
ADCCP
Advanced Data Communications Control Procedures
ALM
Alarm
ALU
Arithmetic Logic Unit
AM
Administrative Module
AND
A logical operation that outputs a signal only if all inputs receive a signal.
ASIC
Application Specific Integrated Circuit
ASW
All Seems Well
ATB
Address Translation Buffer
BCP
Byte-Control Protocol
BGB
Bidirectional Gating Bus
BGR
Bidirectional Gating Register
BIC
Bus Interface Controller
BIST
Built-In Self Test
BMPM
Board-Mounted Power Module
BOM
Beginning of Media (associated with cartridge tape)
BOP
Beginning of Partition (associated with cartridge tape)
BOT
Beginning of Tape (associated with 9-track tape)
BPI
Bits Per Inch
BS
Boundary Scan (bus)
BSM
Boundary Scan Master
CA
Cache Address (bus)
CAC
Cache Controller
CAR
Channel Address Register
CAS
Column Address Strobe
CC
Central Control
CCIDI
CC Identification Input
CCIO
Central Control Input/Output
CCIOAD
Central Control Input/Output Address (bus)
CCIOD
Central Control Input/Output Data (bus)
CCITT
International Telegraph and Telephone Consultative Committee
CD
Cache Data (bus) or Carrier Detect
CDR
Channel Data Register
CLREAI
Clear Emergency Action Interface
CM
Communications Module
CNI
Communications Network Interface
CMOS
Complementary Metal Oxide Semiconductor
CMU
Communications Module Unit
CONV
Power Converter
CPI
Characters Per Inch
CPU
Central Processing Unit
CSU
Cache Storage Unit
CTS
Clear To Send
CU
Control Unit
CUPS
Control Unit Power Switch
DAT
Digital Audio Tape. A 3.5-inch tape drive that uses a removable 4-millimeter digital audio tape cartridge.
DATB
Internal Data Bus
DC
Direct Current
DCI
DSCH Computer Interconnect
DCE
Data Communications Equipment
DDCMP
Digital Data Communication Message Protocol
DDR
Diagnostic Data Register
DDS
Digital Data Storage (tape format)
DDSBS
Duplex Dual Serial Bus Selector
DFC
Disk File Controller
DFCA
Disk File Controller A (UN373 circuit pack)
DFCB
Disk File Controller B (TN2116 circuit pack)
DMA
Direct Memory Access
DMAC
Direct Memory Access Controller
DMU
Data Manipulation Unit
DPM
Dual-Port Memory
DRAM
Dynamic Random Access Memory
DRD
Diagnostic/Recovery Data bus
DSCH
Dual Serial Channel
DSR
Data Set Ready
DST
Destination (bus)
DSTC
Destination Clock
DTE
Data Terminal Equipment
DTIM
Disable Sanity Timer
DTR
Data Terminal Ready
DUART
Dual Universal Asynchronous Receiver/Transmitter
EAEN
Emergency Action Enabled
EAI
Emergency Action Interface
EAIMRF
EAI Maintenance Reset Function
EAIMSI
EAI Maintenance State Indication
ECD
Equipment Configuration Data
ECMA
European Computer Manufacturers Association
EDC
Error Detection and Correction
EGRASP
Enhanced Generic Access Package software; a debugger that is fully resident on the 3B21D computer.
EIA
Electronic Industrial Association
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
EPROM
Electrically Programmable Read-Only Memory
EQL
EQuipment Location
ER
Error Register
ESM
External Sanity Monitor
ETSI
European Telecommunication Standardization Institute
EX
Expansion (slot)
FA
Fuse Alarm
FBDP
Force Boot Device Primary
FBPAR
Force Bad Parity
FBDS
Force Boot Device Secondary
FCC
Federal Communications Commission
FFU
Fuse and Filter Unit
FG
Frame Ground
FIFO
First-In First-Out
FLZ
Find-Low-Zero
FOFL
Forced Off-Line or Force Off-Line
FONL
Forced On-Line or Force On-Line
FPS
Fan Performance Sensor
GCR
Group Coded Recording
GPI
Generic Processor Interface
GRASP
Generic Access Package software; a debugger that is fully resident on the 3B21D computer.
HA
Host Adaptor
HDLC
High Level Data Link Control
HM
Halfword Multiplexer
HSR
Hardware Status Register
I/O
Input/Output
IB
Instruction Buffer
IM
Instruction Multiplexer or Interrupt Mask (register)
INIP
Input Initialization Parameter
I/O
Input/Output
IOMI
Input/Output Microprocessor Interface
IOP
Input/Output Processor
IOPPS
Input/Output Processor Power Switch
IP
Initialization Parameter
IPS
Inches Per Second
IS
Interrupt Set (register) also known as Interrupt Source
ISO
International Standards Organization
IT
Interrupt Timer
ITU-T
International Telecommunications Union-Telecommunications Standardization Sector
JEDEC
Joint Electron Device Engineering Council
LED
Light-Emitting Diode
LOCCB
Lead-On Chip with Center Board
MAS
Main Store
MASB
Main Store Bus
MASU
Main Store Update
Mb
Megabit
MB
Megabyte. When referring to disk devices, a megabyte is 1 million bytes. When referring to main store memory,
a megabyte is 220 bytes (1,048,576 bytes).
MC
MicroController
MCERT
Memory Controller with Error Regulation and Test
MCH
Maintenance Channel
MCHL
Maintenance Channel Link
MCS
MicroControl Store
MHD
Moving Head Disk
mil
One-thousandth of an inch
MIR
MicroInstruction Register
MIS
MicroInstruction Store
MJ
Major Alarm
MLB
Multi-Layer Board
MLTS
Micro Level Test Set
MM
Main Memory
MOR
Momentary rocker switch that overrides the OFF lockout for emergency power off.
MPC
Multipurpose Peripheral Controller
MPDATA
Microprocessor Data (register)
MPMADD
Microprocessor Memory Address
MRF
Maintenance Reset Function
MS
MicroStore (bus)
MSA
MicroStore Address or Main Store Address (bus)
MSD
MicroStore Data (bus)
MSEQ
MicroSequencer
MT
Magnetic Tape
MTC
Maintenance (bus)
MTTY
Maintenance Teletypewriter or Maintenance Terminal
MTTYC
MTTY Controller
MUX
Multiplexer
NARTAC
North American Regional Technical Assistance Center
NCLK
Network Clock
NEBS
Network Equipment-Building System
NET2
X.25 Network Level 2 Interface
OE
Output Enable
OOS
Out Of Service
OR
A logical operation that outputs a signal if any input receives a signal.
OS
Other Store
OST
Operating System Trap
OUTIP
Output Initialization Parameter
OUTSTAT
Output EAI Status
OUTPRM
Output PRM
P/O
Part Of (a drawing or schematic)
PA
Program Address
PB
Parameter Bus
PC
Peripheral Controller
PC00
Peripheral Community 0, Slot 0
PDC
Power Distribution Cabinet
PE
Phase Encoded
PGC
Peripheral Growth Cabinet
PIC
Peripheral Interface Controller
PIO
Programmed Input/Output
PLCC
Plastic-Leaded Chip Carrier
POCS
Programmable Over-Current Shutdown
PONL
Processor On-Line
PPR
Pulse Point Register
PQFP
Plastic Quad Flat Pack
PRM
Processor Recovery Message
PROM
Programmable Read-Only Memory
PSSDB
Port Switch and Scanner-Distributor Buffer
PSW
Processor Status Word (register)
PTSW
Port Switch
PWB
Printed Wiring Board
RAM
Random Access Memory
RAS
Row Address Strobe
RC
Resistance/Capacitance
RC/V
Recent Change and Verify
RDY
Ready
REQ
Request
RMSA
RAM MicroStore Address (bus)
ROM
Read-Only Memory
ROP
Receive-Only Printer
ROS/RST
Request-Out-of-Service/Restore two-position rocker switch. Sends a request via scan points to remove the
associated unit from service or to restore the associated unit to service.
RQIP
ReQuest-In-Progress indicator (green). Lights via signal distributor point to indicate that either an ROS or RST
request has been recognized by the system. When the system denies a request, the RQIP flashes for a few
seconds. The RQIP indicator also lights when the ACO-T switch is pressed.
RTAC
See NARTAC.
RTC
Real-Time Clock
RTR
Real-Time Reliable
RTS
Request To Send
RXD
Receive Data
SAI
Store Address Interface
SAR
Store Address Register
SAT
Store Address Translator
SAURs
Store Address Update Registers
SC
Scan
SCC
Switching Control Center
SCR
Store Control Register
SCSD
Scanner and Signal Distributor
SCSDC
Scanner and Signal Distributor Controller 0 (SCSDC 0) is a UN33 or UN933 circuit pack equipped in IOP 0,
PC02. SCSDC 1 is a UN33 or UN933 circuit pack equipped in IOP 1, PC02.
SCSI
Small Computer System Interface
SCSI ID
The bit representation of the SCSI address referring to one of the signal lines DB(7-0).
SCSI initiator
An SCSI device that requests an operation to be performed by another SCSI device.
SCSI target
An SCSI device that performs an operation requested by an initiator.
SD
Signal Distributor or Schematic Drawing
SDI
Store Data Interface
SDLC
Synchronous Data Link Control
SDR
Store Data Register
SDRP
Store Data Register Pipeline
SEQ
Sequencer
SG
Signal Ground or System Generation
SI
Store Interface
SIMM
Single In-line Memory Module
SIR
Store Instruction Register
SLFID
The Self-Identification, Self-ID, or SELF-ID circuit provides the means for a Central Control (CC) to interrogate
the Main Memory circuit pack for identification information (version, issue, etc.). The circuit operates
independently from the other circuit packs functions.
SMAINT
Store Maintenance Access
SN-2000
Service Net-2000
SPU
SCSI Peripheral Unit
SQUAD
Quad Word Transfer
SRAM
Static Random Access Memory
SRC
Source (bus)
SREGs
Special Registers
SRMW
Read-Modify-Write
SRPAL
Special Register Programmable Array Logic
SSEQ
Store Sequencer
SSR
System Status Register
ST
Sanity Timer
STP
Signal Transfer Point
TAP
Test Access Port
TCK
Boundary Scan Clock
TDI
Test Data Input
TDO
Test Data Output
TMS
Test Mode Selection
TR
Timer Register
TRST
Test Reset
TXD
Transmit Data
UC
Utility Circuit (UN379 circuit pack)
UID
Utility IDentification
UV
Ultraviolet (light)
WE
Write Enable
WMS
Writable MicroStore
List of Figures
Figure 2-1 : 3B21D Computer System Block Diagram
Figure 3-2 : Processor Cabinet, J3T060A-1 Basic System Configuration, Front View
Figure 3-5 : Peripheral Growth Cabinet, J3T059A-1 Configuration Example 1, Front View
Figure 3-6 : Peripheral Growth Cabinet, J3T059A-1 Configuration Example 2, Front View
Figure 3-7 : Peripheral Growth Cabinet, J3T059A-1 Configuration Example 3, Front View
Figure 3-8 : Peripheral Growth Cabinet, J3T059A-1 Configuration Example 4, Front View
Figure 5-3 : Central Control Input/Output (CCIO) Bus Functional Block Diagram
Figure 5-7 : Micro Level Test Set (MLTS) Link Functional Block Diagram
Figure 5-8 : Typical Boundary Scan (BS) Bus Functional Block Diagram
Figure 5-12 : Source (SRC) and Destination (DST) Bus Functional Block Diagram
Figure 5-17 : Micro Level Test Set Interface Functional Block Diagram
Figure 7-3 : TN983/UN583/UN597 Maintenance TTY Controller Circuit Pack Functional Block Diagram
Figure 7-4 : UN33 or UN933 Scanner and Signal Distributor Circuit Pack Functional Block Diagram
Figure 7-5 : Port Switch and Scanner-Distributor Buffer (PSSDB) Functional Interface Diagram
Figure 8-2 : UN375/UN375E (KS-23908) 3.5-Inch Hard Disk Drive Rear View
Figure 8-4 : UN375/UN375E 3.5-Inch SCSI Hard Disk Drive Functional Block Diagram
Figure 8-8 : UN376 SCSI DAT Drive Option Select Switches Bottom View
Figure 8-9 : UN376/UN376C/UN376E 3.5-Inch SCSI DAT Drive Functional Block Diagram
Figure 9-2 : Processor Cabinet Fuse and Filter Unit -48 V DC Distribution (Rear View)
List of Tables
Table 2-1 : 3B21D Computer ASIC Summary
Table 7-5 : Small Office Scan and Signal Distributor Point Assignments
Table 7-6 : Large Office Scan and Signal Distributor Point Assignments
Table 8-2 : Standard Single-Ended SCSI Connector Pins Associated with UN375
Table 8-9 : Standard Single-Ended SCSI Connector Pins Associated with UN376