0% found this document useful (0 votes)
193 views14 pages

Tle CSS9 Q4 M10

Uploaded by

Jared
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
193 views14 pages

Tle CSS9 Q4 M10

Uploaded by

Jared
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 14

TECHNOLOGY

AND LIVELIHOOD
EDUCATION
9
COMPUTER SYSTEMS SERVICING
Technology and Livelihood Education– Grade 9
Quarter 4 – Module 10: In-circuit Testing
First Edition, 2020

Republic Act 8293, section 176 states that: No copyright shall subsist in any work of
the Government of the Philippines. However, prior approval of the government agency or office
wherein the work is created shall be necessary for exploitation of such work for profit. Such
agency or office may, among other things, impose as a condition the payment of royalties.

Borrowed materials (i.e., songs, stories, poems, pictures, photos, brand names,
trademarks, etc.) included in this module are owned by their respective copyright holders.
Every effort has been exerted to locate and seek permission to use these materials from their
respective copyright owners. The publisher and authors do not represent nor claim ownership
over them.

Published by the Department of Education Division of Pasig City

Development Team of the Module


Writer: Neil O. Gagarino
Editors: Maria O. del Barrio, Jhoanna V. Navata
Reviewers: Maria O. del Barrio, Jhoanna V. Navata

Illustrator: Edison P. Clef


Layout Artist:
Management Team: Ma. Evalou Concepcion A. Agustin
OIC-Schools Division Superintendent
Carolina T. Rivera, CESE
OIC-Assistant Schools Division Superintendent
Manuel A. Laguerta EdD
Chief, Curriculum Implementation Division
Victor M. Javeña EdD
Chief, School Governance and Operations Division and

Education Program Supervisors


Librada L. Agon EdD (EPP/TLE/TVL/TVE)
Liza A. Alvarez (Science/STEM/SSP)
Bernard R. Balitao (AP/HUMSS)
Joselito E. Calios (English/SPFL/GAS)
Norlyn D. Conde EdD (MAPEH/SPA/SPS/HOPE/A&D/Sports)
Wilma Q. Del Rosario (LRMS/ADM)
Ma. Teresita E. Herrera EdD (Filipino/GAS/Piling Larang)
Perlita M. Ignacio PhD (EsP)
Dulce O. Santos PhD (Kindergarten/MTB-MLE)
Teresita P. Tagulao EdD (Mathematics/ABM)

Printed in the Philippines by Department of Education – Schools Division of Pasig City


T. L. E. 9
COMPUTER SYSTEMS SERVICING

Quarter 4
Self-Learning Module 10

In-circuit Testing
Introductory Message

For the facilitator:

Welcome to the Technology and Livelihood Education Module on Computer Systems


Servicing 9!

This module was collaboratively designed, developed and reviewed by educators from
Schools Division Office of Pasig City headed by its Officer-In-Charge Schools Division
Superintendent, Ma. Evalou Concepcion A. Agustin in partnership with the Local
Government of Pasig through mayor, Honorable Victor Ma. Regis N. Sotto.
The writers utilized the standards set by the K to 12 Curriculum using the Most
Essential Learning Competencies (MELC) while overcoming their personal, social,
and economic constraints in schooling.

This learning material hopes to engage the learners into guided and independent
learning activities at their own pace and time. Further, this also aims to help learners
acquire the needed 21st century skills especially the 5 Cs namely: Communication,
Collaboration, Creativity, Critical Thinking and Character while taking into
consideration their needs and circumstances.

In addition to the material in the main text, you will also see this box in the body of
the module:

Notes to the Teacher


This contains helpful tips or strategies that
will help you in guiding the learners.

As a facilitator you are expected to orient the learners on how to use this module.
You also need to keep track of the learners' progress while allowing them to manage
their own learning. Moreover, you are expected to encourage and assist the learners
as they do the tasks included in the module.
For the learner:

Welcome to the Technology and Livelihood Education Module on Computer Systems


Servicing!

The hand is one of the most symbolized part of the human body. It is often used to
depict skill, action and purpose. Through our hands we may learn, create and
accomplish. Hence, the hand in this learning resource signifies that you as a learner
is capable and empowered to successfully achieve the relevant competencies and
skills at your own pace and time. Your academic success lies in your own hands!

This module was designed to provide you with fun and meaningful opportunities for
guided and independent learning at your own pace and time. You will be enabled to
process the contents of the learning material while being an active learner.

This module has the following parts and corresponding icons:

Expectation - These are what you will be able to know after completing the
lessons in the module

Pre-test - This will measure your prior knowledge and the concepts to be
mastered throughout the lesson.

Recap - This section will measure what learnings and skills that you
understand from the previous lesson.

Lesson- This section will discuss the topic for this module.

Activities - This is a set of activities you will perform.

Wrap Up- This section summarizes the concepts and applications of the
lessons.

Valuing-this part will check the integration of values in the learning


competency.

Post-test - This will measure how much you have learned from the entire
module.
EXPECTATION
At the end of the lesson, the students should be able to:
A. discuss in-circuit-testing;
B. list down possible defects identified in in-circuit-testing;
C. appreciate the importance of in-circuit testing.

PRETEST

Directions: Write (True) if you agree with the statement (False) if the statement is
wrong. Write your answer on the space provided.
_________ 1. Software testing does power up testing and eliminates customer debug
needs to almost ZERO.
_________ 2. ICT sometimes fails to identify connector faults in high density, small
package size SMT components.
_________ 3. Dynamic testing has been known to cause mechanical failures such as
capacitor flex cracking and pad cratering.
_________ 4. ICT is a highly accurate form of testing that performs a “symbols
verification”.
_________ 5. In-Circuit Testing, ICT is a powerful tool for printed circuit board test,
which helps detect defective components by checking them individually.

RECAP
Yesterday we discussed Testing Strategies. Let us test your memory
if you can still recall. Below are the different testing strategies. Arrange the jumbled
letters. Read the description to answer it correctly.

Different Testing Strategies


1. SAVIPES SETTING – ________________________
It is a software testing technique that observes the system without
interaction.
2. TACIVE SETTING - _________________________
It involves interaction with the system.
3. MICADYN SETTING - _______________________
A kind of software testing technique using which the dynamic
behavior of the code is analyzed.
L E S S ON
In-circuit Testing
When you are building a printed circuit
board, you need the assurance that it will do
the job that was designed for by having it go
through rigorous testing. Yet, some contract
manufacturers don’t put the same effort into
testing their products as others.

This can lead to intermittent problems


or complete board failures. It’s bad enough to
deal with these problems when you are
debugging the PCB (printed circuit board) but when these failures happen in the
field, it can be a real disaster. To ensure your circuit boards don’t suffer from these
kinds of problems, you need them built by a CM (contact manufacturer) that will put
your boards through thorough PCB (printed circuit board) testing, thus, in-circuit-
testing is one of its best techniques.

In-circuit test (ICT) is an example of white box testing where an electrical


probe tests a populated printed circuit board (PCB), checking for shorts, opens,
resistance, capacitance, and other basic quantities which will show whether the
assembly was properly made-up.

What is In-Circuit Testing?


In-Circuit Testing (ICT) is a powerful
tool for printed circuit board test, which helps
detect defective components by checking
them individually. In-circuit testing is a
highly accurate form of testing that performs
a “schematic verification”.

It is a fully automated test, thus helps


detect defects in an assembly, which can be
replaced accordingly before making it final. It
is usually conducted in two parts such as
Power-off Tests and Power-on Tests. As the name implies, in Power-off Tests, tests
are conducted before power is applied and in the second part, tests are performed
after power is applied.
Printed circuit board (PCB) Testing Techniques Using In-Circuit Test (ICT)
In-circuit test (ICT) is a printed circuit board
testing system with multiple probes known as
bed of nails. The in-circuit testing (ICT) probes
make simultaneous contact with all of the test
points on the printed circuit board(PCB) to
electrically test its circuits for assembly
failures, such as shorts or bad solder joints. It
will also check critical component values,
overall board functionality, and can be
enhanced for more complex testing with other adapters and modules.
The printed circuit board (PCB) must also be designed with good design for
test (DFT) techniques to have maximum fault coverage, and an experienced
technician is required to develop and use the test software and equipment to their
fullest capabilities. For boards that are built in higher volume, however, in-circuit
testing (ICT) is usually the best test option.

In-circuit testing (ICT) failures & mechanical simulation


In-circuit testing has been known to cause mechanical failures such as
capacitor flex cracking and pad cratering. This typically occurs on a bed of nails
tester if there is excessive board flexure due to poor support placement or high probe
forces. It can be challenging to optimize for ideal support locations and probe forces
without spending resources designing and building an ICT fixture. Current methods
typically employ strain gaging or similar techniques to monitor board flexure. More
recently, some have looked at finite element simulation to proactively design or
adjust an in-circuit testing (ICT) fixture to avoid these mechanical failure modes.
Example test sequence
• Discharging capacitors and especially electrolytic capacitors (for
safety and measurement stability, this test sequence must be done
first before testing any other items)
• Contact Test (to verify the test system is connected to the Unit Under
Test (UUT)
• Shorts testing (test for solder shorts and opens)
• Analog tests (test all analog components for placement and correct
value)
• Test for defective open pins on devices
• Test for capacitor orientation defects
• Power up UUT
• Powered analog (test for correct operation of analog components such
as regulators and opamps)
• Powered digital (test the operation of digital components and
Boundary scan devices)
• Flash Memory, EEROM, and device programming
• Discharging capacitors as UUT is powered down
While in-circuit testers are typically limited to testing the above devices, it is
possible to add additional hardware to the test fixture to allow different solutions to
be implemented.

What are the possible defects in In-Circuit Testing?


A comprehensive test coverage is the prime reason why in-circuit-testing is
popular. Compared to other ways of testing, in-circuit testing(ICT) tests each
component on a board, one at a time. The method tests the following in a printed
circuit board.
• Component spacing, lead spacing, land sizes, and component sizes
• Component markings
• Soldering and process issues
• Shorts between traces and/or component leads
• Open circuits (“opens”) where electrical continuity should exist
• Values of resistors in the circuit
• Jumpers/switches in correct location/setting or not
• Presence/absence of passive components
• Presence/absence of active analog components
• Misoriented analog components
• Misoriented digital components
• Capacitance and inductance values
• Wrong or missing components
• Solder bridges
• Short circuits
However, integrated circuit testing (ICT) fails to detect multi power
connections missing, redundant power connections decoupling capacitors missing,
mechanical fixings, and overall look of the board among others.

Elements of In-Circuit Testing


There are several types of in-circuit test systems available on the market and
each differs with respect to the other in terms of performance, capability and testing
procedures. It is important that the printed circuit board (PCB) manufacturer should
employ the right tester to access required points on the circuitry. Whatever type you
choose, there are some components common to all integrated-circuit testing (ICT)
testers, they are the following:
• Controller
• Software
• Interface
• Fixture
• Analog Scanner
• Powered Analog Tests
• Analog Digital Opens
Integrated-Circuit Testing, which is a reliable, high-quality, high-volume
testing, ensures that the circuit has been manufactured correctly to perform to the
highest standard in applications.
Advantages of In-Circuit Testing
With the assurance of simple, fast and rapid, accurate fault location, In-circuit
testing is becoming more and more popular today. The testing method is vastly
employed due to its several advantages including:
• In-circuit tester is extremely easy to program to detect defects in
components, continuity and so on.
• There is a very little room for operator error.
• It will not take a long time to detect errors (usually 1-2 minutes per
assembly). Hence, the test is economical for larger volumes.
• It is a highly reliable and a comprehensive testing method as compared
to other testing methods.
• In-circuit testing assures high fault coverage for manufacturing
defects.
• Its test results are relatively easy to interpret.
• It is the best testing method for medium to high volume through-hole
conventional assemblies.
• In-circuit test (ICT), which has been around for many years now,
requires minimal maintenance costs.
Disadvantages of In-Circuit Testing
Every technology will have a set of drawbacks as well. In Circuit testing is also
not free from the same. The following are amongst the disadvantages associated with
In-circuit testing
• Its test fixtures are expensive.
• ICT sometimes fails to identify connector faults in high density, small
package size SMT (Surface Mount Technology) components.
• It shows inconsistent results if test pins do not make proper contact
with the appropriate test pads.
• Its test pins need to be regularly cleaned and replaced to prevent
failure.
• In-circuit testing are mostly the expense one of the test fixtures, which
can cost so much to build. Additionally, any modifications to the test
head are difficult and expensive.
Although the testing method has some flaws, the technology is still considered
as the best way to test a printed circuit board (PCB) assembly.

Importance of In-Circuit-Testing
1. It provides a useful and efficient form of printed circuit board test by
measuring each component.
2. It covers 100% testing so that all power and ground shorts are
detected.
3. It powers up testing and eliminates customer debug needs to almost
ZERO.
4. It does not take a very long time to perform, for example if flying probe
takes 20 minutes or so, in-circuit testing for the same time might take
a minute or so.
5. It checks and detects shorts, opens, missing components, wrong
value components, wrong polarities, defective components and
current leakages in the circuitry.
6. It is highly reliable and comprehensive test catching all
manufacturing defects, design faults, and flaws.
7. It’s testing platform available in Windows as well as UNIX, thus
making it slightly universal for most testing needs.
8. It tests development interface and operating environment is based on
standards for an open system with fast integration into an OEM
(original equipment manufacturers) customer’s existing processes.
9. It performs comprehensive testing on mature products, especially in
subcontract manufacturing.
10. It uses a bed-of-nails test fixture to access multiple test points on the
printed circuit board’s bottom side. With sufficient access points, ICT
can transmit test signals into and out of printed circuit board’s at
high speed to perform evaluation of components and circuits.

ACTIVITY

Directions: Answer the questions below. Write your answer on the space provided.
A. Briefly discuss in-circuit-testing.
_____________________________________________________________________
_____________________________________________________________________
_____________________________________.
B. List down at least five (5) possible defects identified in in-circuit testing
a. _______________________
b. _______________________
c. _______________________
d. _______________________
e. _______________________
WRAP–UP

In-Circuit Testing (ICT) is a powerful tool, which helps detect defective


components by checking them individually. ICT is a highly accurate form of testing
that performs a “schematic verification”.
Furthermore, to prove that you have learned something today, complete the
statement below:
I have learned that
__________________________________________________________________________________
__________________________________________________________________________________
___________________________________.

VALUING
1. Patience is one of the values you need to possess in performing an in-circuit-
Testing. What other traits or values is necessary to successfully perform in-
circuit-testing? Give example/s to support your answer.
___________________________________________________________________________
___________________________________________________________________________
______________________________.

POST TEST

Directions: Importance of In-Circuit-Testing. Write (/) if it is a positive effect of


in-circuit testing (X) if it is in a negative effect of in-circuit testing. Write
you answer on the space provided
__________ 1. ICT testing does power up testing and eliminates customer debug needs
to almost ZERO.
__________ 2. In-circuit tester is extremely easy software to detect defects in
components, continuity and so on.
__________ 3. It shows inconsistent results if test pins do not make proper contact
with the appropriate test pads.
__________4. It is a highly reliable and a comprehensive testing method as compared
to other testing methods.
__________ 5. ICT covers 100% testing so that all power and ground shorts are
detected.
Pretest Posttest Recap
1. False 1. ✓ 1. Passive testing
2. True 2. X 2. Active testing
3. False 3. X 3. Dynamic testing
4. False 4. ✓
5. True 5. ✓
Activities:
1. In-circuit test (ICT) is an example of white box testing where an
electrical probe tests a populated printed circuit board (PCB),
checking for shorts, opens, resistance, capacitance, and other basic
quantities which will show whether the assembly was properly made-
up.
2. Possible defects identified in in-circuit testing:
Component spacing, lead spacing, land sizes, and component sizes
Component markings, Soldering and process issues
Shorts between traces and/or component leads
Open circuits (“opens”) where electrical continuity should exist
Values of resistors in the circuit
Jumpers/switches in correct location/setting or not
Presence/absence of passive/active analog components
Misoriented analog/digital components
Capacitance and inductance values
Wrong or missing components
Solder bridges/Short circuits
KEYTOCORRECTION
R E F E R E N CE S
“Basic Things You Should Know About In-Circuit Testing.” Basic Things You Should
Know About In-Circuit Testing - Accelerated Assemblies Inc. Accessed October
17, 2020. https://www.acceleratedassemblies.com/blog/basic-things-you-
should-know-about-in-circuit-testing/.

Department, VSE | Test, Author: VSE | Test Department You have a need. We can
provide a solution. Building on 30 years of experience, Author: and You have a
need. We can provide a solution. Building on 30 years of experience. “4
Essential PCB Testing Techniques During Assembly and Manufacturing.” VSE,
September 10, 2019. https://www.vse.com/blog/2019/09/10/4-essential-
pcb-testing-techniques-during-assembly-and-manufacturing/.

DepEd-Bataan Follow. “Testing Strategies for Electronic Components.” SlideShare,


November 1, 2019. https://www.slideshare.net/boidren/testing-strategies-for-
electronic-components.

“EL.” EL Circuit Board Troubleshooting Introduction. Accessed October 17, 2020.


https://www.optotherm.com/el-
intro.htm?gclid=Cj0KCQjw7ZL6BRCmARIsAH6XFDLdjNYVPJC-
XNCrhC4xYDwJQwMrnn_77q-vACelCCnveuH1G0EBbrIaAgzUEALw_wcB.

“In Circuit Testing (ICT) - NexLogic Technologies.” Nexlogic, October 15, 2015.
https://www.nexlogic.com/pcb-testing/ict-testing/.

“In-Circuit Test.” Wikipedia. Wikimedia Foundation, June 23, 2020.


https://en.wikipedia.org/wiki/In-circuit_test.

Matric. “7 PCB Testing Methods You Need to Know.” Electronic Contract


Manufacturing Resources. Accessed October 17, 2020.
https://blog.matric.com/pcb-testing-methods.

You might also like