IPC-1710A

OEM Standard for

Printed Board
Manufacturers'
Qualification Profile
Developed by the OEM council of the IPC, the MQP sets the standard for assessing
PWB manufacturers capabilities and allows PWB manufacturers to more easily
satisfy customer requirements.

IPC-1710A
May 2004 A standard developed by IPC
_____________________________________________________________________
_______________________
2215 Sanders Rd, Northbrook, IL
60062-6135
Tel. 847.509.9700 Fax
847.509.9798
www.ipc.org
IPC-1710A May 2004

NOTICE IPC standards and publications are designed to serve the public interest
through eliminating misunderstandings between manufacturers and
purchasers, facilitating interchangeability and improvement of products, and
assisting the purchaser in selecting and obtaining with minimum delay the
proper product for his particular need. Existence of such Standards and
Publications shall not in any respect preclude any member or non-member of
IPC from manufacturing or selling products not conforming to such Standards
and Publications, nor shall the existence of such Standards and Publications
preclude their voluntary use by those other than IPC members, whether the
standard is to be used either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without
regard to whether their adoption may involve patents on articles, materials or
processes. By such action, IPC does not assume any liability to any patent
owner, nor do they assume any obligation whatever to parties adopting the
recommended Standard or Publication. Users are also wholly responsible for
protecting themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the OEM Council of the
Institute for Interconnecting and Packaging Electronic Circuits.

© Copyright 2004. IPC, Northbrook, Illinois. All rights reserved under both international and Pan-American copyright conventions.

ii
May 2004 IPC-1710A
FOREWORD
It is not intended that this Manufacturers’ Qualification Profile (MQP) satisfies all the requirements of the customer,
however, conscientious maintenance of this document and or registration to ISO 9000 requirements should satisfy the major
concerns. Thus, audits should be simpler, required less frequently, and facilitate less paper work as customers and suppliers
work closer to meeting each others needs.

ACKNOWLEDGMENTS
The IPC is indebted to the members of the OEM council who participated in the development of this document. A note of
thanks is also expressed to the members of the IPC Presidents Council for their review and critique and construction
recommendations in finalizing the principles developed for the MQP.

Although the IPC is grateful for all the involvement and individual contributions made in completing the MQP a special
acknowledgment is extended to the following individuals. It was their dedication and foresight that made this publication
possible.

Rudolfo Archbold Rick Iantaffi Don Noel Mario Suarez-Solis

Digital Equipment Corp Northern Telecom Harris Corp. - Computer Sys. Div Encore Computer Corp.

Patrick Bernardi Sue Jones Rick Smith Gordon Wolfram

IBM Wilcox Electric Compaq Computer Corp. Raytheon Company
Vernon Brown Chuck Krzesicki Peter Solecky Jerald G. Rosser
Motorola, Inc. Honeywell Avionics Division IBM Hughes Missile Operations Div.

Don Holt Thomas Kurtz Joseph F. Sterba Jamie Zanios

Texas Instruments Hughes Defense Communications Honeywell, Inc. Wellborn Industries Ltd.

iii
IPC-1710A May 2004

CONTENTS
Sections: Pages:
1.1 Company Description 1
1.2 Site Description 2
2.1 Process 3-4
2.2 Electrical Test Equipment 5-7
2.3 Product Type 8-10
2.4 Product Complexity 11-14
2.5 Quality Development 15-16
3.0 Equipment Profile 17-21
Master Equipment Listing 22
4.0 Technology Profile Specifics 23-30
5.0 Quality Profile 31-41
6.0 Manufacturing History 42
7.0 Identification of Previous Audits 43
8.0 Financial Review 44
9.0 MQP Electronic Editing 45

iv
May 2004 IPC-1710A

DATE COMPLETED
SECTION 1.1 April 18, 2011
COMPANY DESCRIPTION
GENERAL INFORMATION
LEGAL NAME
Pho-Tronics, Inc.
PHYSICAL ADDRESS
8701 West Bradley Road
CITY STATE ZIP
Milwaukee WI 53224
PROVINCE COUNTRY
Milwaukee USA
TELEPHONE NUMBER FAX NUMBER TELEX NUMBER
414-355-5300 414-355-0593
E-MAIL ADDRESS MODEM NUMBER
DATE FOUNDED 1963
[email protected] PRIVATE
INTERNET URL FTP SITE
www.pho-tronics.com Pho-Tronics.com or password assigned
MANAGEMENT
PRESIDENT
Paul D Godbout
CHIEF OPERATING OFFICER
Paul Godbout
VICE PRESIDENT OF MANUFACTURING
Nick Koutsios
VICE PRESIDENT OF QUALITY
Donna Deberge
VICE PRESIDENT OF MARKETING/SALES
Jeffrey Godbout
VICE PRESIDENT OF CUSTOMER SERVICE

WASTE TREATMENT MANAGER (POLLUTION PREVENTION)

Mark Skaros
CORPORATE NUMBER OF EMPLOYEES
DESCRIPTION CORPORATE SITE COMMENTS
DESIGN AND DEVELOPMENT
1
ENGINEERING
10
MANUFACTURING CONTROL
1
MANUFACTURING DIRECT
45
INDIRECT
8
QUALITY QUALITY
CONTROL ENGINEERS 2
INTERNAL
AUDITORS Not dedicated personnel
GENERAL
MANAGEMENT 1
ADMINISTRATION
4
TOTAL 72

1
IPC-1710A May 2004

SECTION 1.2 DATE COMPLETED April 18, 2011

(TO BE COMPLETED FOR EACH SITE) ATTACH APPROPRIATE CHARTS (OPTIONAL)
SITE DESCRIPTION
MANUFACTURING FACILITY
COMPANY NAME Pho-Tronics, Inc.
PHYSICAL ADDRESS 8701 West Bradley Road
CITY Milwaukee STATE WI ZIP 53224
PROVINCE Milwaukee COUNTRY USA
TELEX
TELEPHONE NUMBER 414-355-5300 FAX NUMBER 414-355-
0593
MODEM NUMBER
E-MAIL ADDRESS sales@pho- YEARS IN BUSINESS 51
tronics.com
INTERNET URL www.pho-tronics.com FTP pho-tronics.com or assigned password
PRINCIPLE PRODUCTS/SERVICES/SPECIALTIES BUSINESS CHARACTERIZATION (HIGH VOLUME, QUICK TURN-AROUND, ETC.)
Rigid Multi-Layer Printed Circuit Boards thru 24 layers
Specialty materials BT, Polyimide, Taconic, Rogers, low DK High Mix – Prototype through Production

FACILITY MANAGEMENT TITLE REPORTS TO (Function/Job Title)

OVERALL OPERATION RESPONSIBILITY FOR THIS SITE
COO President
Paul Godbout
MANUFACTURING
Production Manager President
Nick Koutsios
TECHNICAL/ENGINEERING
Engineering Manager President
Bryan Gahn
MATERIALS/PRODUCTION CONTROL
Production Control/Materials Production Manager
Judy Thielecke
Mgr.
PURCHASING
Purchasing President
Tim Trier
QUALITY
Quality Manager President
Donna Deberge
SALES REPRESENTATIVE
Sales Manager President
Bobbie Rodriguez
WASTE MANAGEMENT
Chemical Technician Engineering Manager
Mark Skaros
BUILDINGS SYSTEMS (INDICATE % COVERAGE)
AGE AREA Construction Power Air Waste
Conditioning Heating Ventilation Conditioning Sprinklers Treatment Other
(Sq. Ft.) (Wood/Brick)
Office 34 5000 Brick 100 100 100 100 100 0
Manufacturing 34 5500 Brick 100 100 100 60 100 100
0
Storage 34 5000 Brick 100 100 100 5 100 0
Planned 0
additions
SAFETY AND REGULATORY AGENCY REQUIREMENTS
Are fire extinguishers functional and X YES NO What is the distance to the nearest
Accessible to employees? fire station? (in minutes) 2 Minutes {3 city Blocks}
Do you conform to local/federal environ- X YES NO Date of last OSHA visit 2006
ment protection agency requirements? Date of last EPA visit NEVER
Are you currently operating under a waiver YES X NO Other Agency Audits, UL, X UL # E35174 x ISO 9000# 2008
or in violation of local government ISO 9000, NECQ, CSA Approval X AS 9100 Rev. C x Other Mil 55110
requirements? and Number
Do you have a safety program? X YES NO Hazardous Waste Number
Describe below. Trade Waste Account Number
PLANT PERSONNEL (TOTAL EMPLOYEES)
Regular Contract Office Technical/ Production Full-Time Part-Time Union Non- Union Contract
Engineering QA QA Union Name Expires (Date)

72 0 5 10 45 12 0 x
COMMENTS

2
May 2004 IPC-1710A

3
May 2004 IPC-1710A
DATE COMPLETED
SECTION 2.1 4.18.11
PROCESS
This section is intended to provide overview information on the processes used to fabricate printed board products.

Site Capability Snapshot (Please Check all that apply)

Designators Remarks

A Conductor Forming Processes X Subtractive

Cupric I/L Etch & Amonia O/L Etch
X Thin Foil Subtractive less than .5 oz.
Semi-Additive

X Additive (Electro-less)

X Direct Metalization MacDermid Eclipse

Thick Film Paste and Fire
MacDermid Eclipse / Fliud Head
Thin Film Semi-conductor Sputtering Mechanicals

Other:

B PTH Materials and Processes X Acid Copper

Pyro-Phosphate Copper

X Full Built Electro-Less

Gold Paste

Copper Paste

Gold Conductor Sputtering

Nickel Conductor Sputtering

other:

C Permanent Over-plating X Tin

Tin-Lead

Tin-Nickel Alloy

X Nickel

X Nickel Gold (Hard)

X Nickel Gold (Soft)

Nickel Rhodium

Conductive Polymer

Other:

3
IPC-1710A May 2004
D Permanent Selective Plating X Tin

Tin-Lead

Tin-Nickel Alloy

X Nickel

X Nickel Gold (Hard)

X Nickel Gold (Soft)

Nickel Rhodium

X Other: Immersion Silver

E Permanent Mask or Coating X Photo Dry Film
Primary circuitry imaging
X Photo Liquid

X Image Transfer Screen Mask

Soldermask

X Conformal Coating Solder Mask Silkscreened Legend

Cover Coat
Soldermask
Other:

F Other Surface Finishes Tin-Lead Fused

X Immersion Tin

X Solder Leveled
Roll Soldered

Electro-less Solder Fused

Solder Bumped Lands

Solder Paste Fused

X Azole Organic Protective Covering

Flux Protective Covering

X Other: Immersion Silver

X Immersion nickel/gold

4
May 2004 IPC-1710A

DATE COMPLETED
SECTION 2.2 4.18.11
ELECTRICAL TEST EQUIPMENT
This section is intended to provide overview information on the test equipment and testing capability of the manufacturer.

Site Capability Snapshot (Please Check the column that applies furthest to the right.)
Designators Remarks
A Number of Nets <200

200

500

1000

2000

3000

4000

5000

x>5000

Other:

B Number of Nodes <500

500

1000

2000
3000

4000

5000
6000

x>6000

Other:

C Probe Point Pitch >1.0 [.040]

1.0 [.040]

0.8 [.032]

0.65 [.025]

0.50 [.020]

0.40 [.016]

0.30 [.012]

0.20 [.008]

X <0.20 [.008]

Other:

5
IPC-1710A May 2004
D Test % Single Pass None

<60%

60%

70%

80%

90%

95%

99%

X 100%

Other:

E Probe Accuracy (DTP) >0.2 [.008]

0.2 [.008]

0.15 [.006]

0.125 [.005]

0.1 [.004]

0.075 [.003]

X <0.075 [.003]

Other:

F Grid Density Single Side Grid

Double Sided Grid

Double Density Grid

Double Density Double Sided

Quad Density
Double Sided Quad Density

X Flying Probe

Other:

G Netlist Capability X Golden Board

X IPC-D-356

X Net List Extraction

X CAD/CAM Net List Compare

Other:

6
May 2004 IPC-1710A
H Test Voltage <20 VDC

20 VDC

40 VDC

60 VDC

80 VDC

X 100 VDC

500 VDC

1000 VDC

>1000 VDC
Other:

J Impedance Meas X Micro Section

X Onboard Circuit

X Coupon

X Manual TDR

Automated TDR

Other:

K Impedance Tolerance None

>20%

20%

15%
X 10%

7%

5%
2%

<2%

Other:

7
IPC-1710A May 2004

DATE COMPLETED
SECTION 2.3 4.18.11
PRODUCT TYPE
This section is intended to provide overview information on the printed board product types being fabricated by the
manufacturer.

Site Capability Snapshot (Please Check all that apply.)

Designators Remarks
A Product Type X Rigid Printed Board

Flex Printed Board

Rigid/Flex Board

X Rigid Back Plane

Molded Product

X Ceramic Printed Board

Multichip Module

Liminated Multichip Module

Deposited Dielectric Multichip Modules

X Other: Taconic, Rogers – low loss materials

B Circuit Mounting Type X Single Sided

X Double Sided

X Miltilayer

X Single-sided Bonded to Substrate

X Double-sided Bonded to Substrate

X Multilayer Bonded to Substrate

X Constrained Multilayer

Distributed Plane Multilayer

Other:

C Via Technology X No-Vias

X Thru Hole Vias

X Buried Vias

X Blind Vias

X Thru Hole & Blind Vias]

X Thru Hole & Buried Vias

X Thru Hole Buried & Blind Vias

X Buried & Blind Vias

X Other: Filled Vias

8
May 2004 IPC-1710A
D Laminate Material Phenolic

Epoxy Paper

X Epoxy Glass

X Modified Epoxy Composite

X Polyimide Film & Reinforce

Cynanate Ester

X Teflon

X Ceramic Glass Types

X Various Combinations
Taconic, Rogers
Other:
Rogers & Epoxy; BT & Epoxy

Rogers & BT; Rogers & Epoxy

E Core Material X No Core

Polymer

X Copper

X Aluminum

Graphite

X Copper Invar/Copper

X Copper Moly/Copper

Other:

F Copper Thickness (Oz.) 1/8 Minimum

X 1/4 Minimum
X 3/8 Minimum

X 1/2 Nominal

X 1 Nominal
X 2 Nominal

X 3-5 Max

X 6-9 Max
>10

Other:

G Construction X ≤4 Planes

X >4 Planes

X THK to TOL ≤0.2 mm

X THK to TOL >0.2 mm

X Bow/Twist ≤1%

X Bow/Twist >1%

X ≤0.3 mm Profile Tolerance

X>0.3 mm Profile Tolerance

Other:

9
IPC-1710A May 2004

H Coatings and Markings X ≤0.1 mm Mask Clearance

>0.1 mm Mask Clearance

X One Side (Legend)

X Two Side (Legend)

None (Legend)

X UL Material Logo
X U.L. V0 Logo

U.L. V1 Logo

U.L. V2 Logo

Other:

10
May 2004 IPC-1710A

DATE COMPLETED
SECTION 2.4 4.28.2011
PRODUCT COMPLEXITY
This section is intended to provide overview information on product complexity being fabricated by the manufacturer.

(Please check the column that applies farthest to the right)

Designators Remarks
A Board Size Diagonal <250 [10.00]

250 [10.00]

350 [14.00]

450[17.50]

550 [21.50]

650 [25.50]

X 750 [29.50]

850 [33.50]
>850 [33.50]

Other:

B Total Board Thickness 1,0 [.040]

1,0 [.040]

1,6 [.060]
2,0 [.080]

2,5 [.100]

3,5 [.135]
5,0 [.200]

X 6,5 [.250]

>6,5 [.250]

Other:

C Number Conductive Layers 1-4

5-6

7-8

9-12

13-16

17-20

X 21-24

25-28

>28

Other:

11
IPC-1710A May 2004
D Dia Drilled Holes >0,5 [.020]

0,5 [.020]

0,4 [.016]

35 [.014]

30 [.012]

25 [.010]

20 [.008]

0.15 [.006]

X <0,15 [.006]

Other:

E Total PTH TOL (Max-Min) >0,250 [.010]

0,250 [.010]

0,200 [.008]

0,150 [.006]

0,125 [.005]

0,100 [.004]

0,075 [.003]

X 0,050 [.002]

<0,050 [.002]

Other:

F Hole Location TOL DTP >0,50 [.020]

0,50 [.020]

0,40 [.016]
0,30 [.012]

0,25 [.010]

0,20 [.008]
0,15 [.006]

0,10 [.004]

x <0,10 [.004]

Other:

G Internal Layer Clearance (Min) >0,350 [.014]

0,350 [.014]

0,250 [.010]
0,200 [.008]

0,150 [.005]

0,125 [.005]
0,100 [.004]

X 0,075 [.003]

12
May 2004 IPC-1710A
<0,075 [.003]

Other:

H Internal Layer Conductor Width >0,250 [.010]

(Min)
0,250 [.010]

0,200 [.008]

0,150 [.006]

0,125 [.005]

0,100 [.004]

X 0,075 [.003]

0,050 [.002]

<0,050 [.002]

Other:

J Internal Layer Process >0,100 [.004]

Allowance
0,100 [.004]

0,075 [.003]

0,050 [.002]
0,040 [.0015]

0,030 [.0012]

0,025 [.001]
0,020 [.0008]

X <0,020 [.0008]

Other:

13
IPC-1710A May 2004
K External Layer Clearance (Min) >0,350 [.014]

0,350 [.014]

0,250 [.010]

0,200 [.008]

0,150 [.006]

0,125 [.005]

0,100 [.004]

X 0,075 [.003]

<0,075 [.003]

Other:

L External Layer Conductor >0,250 [.010]

Width (Min)
0,250 [.010]

0,200 [.008]

0,150 [.006]

0,125 [.005]

0,100 [.004]

X 0,075 [.003]

0,050 [.002]

<0,050 [.002]

Other:

M External Layer Process >0,100 [.004]

Allowance
0,100 [.004]

0,075 [.003]

0,050 [.002]

0,040 [.0015]

0,030 [.0012]

X 0,025 [.001]

0,020 [[.0008]

<0,020 [.0008]

Other:

14
May 2004 IPC-1710A
N Feature Location DTP >0,50 [.020]

0,50 [.020]

0,40 [.016]

0,30 [.012]

0,25 [.010]

0,20 [.008]

0,15 [.006]

X 0,10 [.004]

<0,10 [.004]

Other:

All Dimensions are in millimeters [inches shown in brackets]

15
IPC-1710A May 2004
DATE COMPLETED
SECTION 2.5 4.28.2011
QUALITY DEVELOPMENT
This section is intended to provide overview information on the quality systems in place in the manufacturing facility.

Site Capability Snapshot (Please Check all that apply.)

Designators Remarks
A Strategic Plan X Functional Steering Committee Formed

X TQM Plan & Philosophy Established & Published

X Documented Quality Progress Review

X Implementation & review of Project Team Recommendations

XTQM Communicated throughout organization

X Controlled New process Start-up

X Management Participates in TQM Audits

X Employee Recognition Program

Total TQM Plan/Involvement Customer Training

Other:

B Employee Involvement X Certified Training Available

X Training of Employee Base

X TQM Team Trained

Design of Experiment Training and Use

X New Process Implementation Training

X Support Personnel Training

X Advanced Statistical Training

XQuality Functional Deployment

X Ongoing Improvement Program for Employees

Other:

C Quality Manual X Quality Manual Started

X Generic Quality Manual for Facility

X 10% of manufacturing depts. have process specifications

X 25% of manufacturing depts. have process specifications

X 50% of manufacturing depts. have process specifications

X Non-manufacturing Manuals Developed

X 25% of all departments have quality manuals

X 50% of all departments have quality manuals

X All Manufacturing and support depts. have controlled quality

manual

Other:

16
May 2004 IPC-1710A
D Instructions X Work Instructions Started

X Quality Instructions Started

X 10% Work Instructions Completed

X 10% Quality Instructions Completed

X 25% Work Instructions Competed, Controlled

X 25% Quality Instructions Completed, Controlled

X 50% Work Instructions Completed, Controlled

X 50% Quality Instructions Completed, Controlled

X Quality and work Instruct. Completed, Controlled

Other:

E SPC Implementation IPC- X Plan Exists

PC-90
X Training Started

X Process Data Collected & Analyzed

All Employees Trained

X First Process Stable & Capable

X Several Major Processes Stable & Capable

XContinued Improvement of Stable Processes

XAdditional Mfg Processes under Control

All Processes Under Control

Other:

F Supplier Programs/Controls X Supplier Rating Program

X Monthly Analysis Program

X Key Problems Identified

X Supplier Reviews Performance Data provided

TQM Acceptance by suppliers

10% of Suppliers Using SPC

25% of Suppliers Using SPC

X 50% of Suppliers Using SPC

All Key Suppliers using Certified parts program

Other:

G Third Party IPC-QS-95 X Instrument Controls in Place

X Measurement System in Control IPC-PC-90

X Document Controls in Place

X Reduced Lot Sampling

X 10% of Processes Under Audit Control

X 50% or Greater of Processes Under Audit Control

ISO-9003 Certified

ISO-9002 Certified

17
IPC-1710A May 2004
X ISO-9001

X Other: AS9100

DATE COMPLETED
SECTION 3 4.28.2011
EQUIPMENT PROFILE (Pre-Site Audit)
* Examples of equipment limitations include:
min/max board size & min/max working area

3.1 PHOTOTOOL CAPABILITY YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) AOI of phototool X Camtek 1

B) AOI CAD reference (CAM) X Camtek

C) Photoplotting X Barco 1

D) Photo reductions X Barco 1

E) Film scan and conversion X Outsourced

F) Film processing x DuPont

air-dried force-dried
X processed in automatic processor
G) Media types x
X silver halide film glass
X diazo

3.2 DRILLING EQUIPMENT YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Manual X

B) Optical (single spindle) X

C) N.C. drill X Excellon 5

2
POSALUX 250k Spindle speed; contact
drilling/ control depth

3.3 ROUTING EQUIPMENT YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Edge beveler X 2

B) Hand router (pin router) X 1

C) N.C. router X Excellon 2

D) N.C. driller/router X Excellon 1

18
May 2004 IPC-1710A
E) Scoring (profile) X Accuscore 1

F) Scoring (straight line) X Accuscore

19
IPC-1710A May 2004
3.4 MECHANICAL EQUIPMENT YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Punch press X

B) Shear X

C) Milling machine X Bridgeport 1

3.5 HOLE PREPARATION (DESMEAR) YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Permagnate X 1

B) Plasma X Plasm-Etch 1

C) Mechanical X

D) Etchback X Plasma -Etch

3.6 PRIMARY IMAGE APPLICATION YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Dry film x Haukuto; DuPont ASL 3

B) Hand screening x S/M & legend 2

C) Machine screening x Sveca – S/M & legend 1

D) Wet film x

E) Liquid photoimageable x Circuit Automation – S/M DP 1

1500

3.7 TYPE OF TREATMENT FOR YES NO EQUIPMENT QTY EQUIPMENT LIMITS

MULTILAYER INNERLAYERS
A) Black oxide

B) Red oxide

C) Copper scrub x Schmid – Jet Pumice Scubber 1

D) Durabond

E) Alternative oxide X Horiozontal MacDermid 1

20
May 2004 IPC-1710A
3.8 LAMINATION YES NO MATERIAL QTY APPLICATION TECHNIQUE
A) High pressure X Accudyne 6 opening opening 1

B) High temperature X Accudyne

C) Vacuum X Accudyne 1

D) Vacuum assist PHI

E) Foil heat assist X Accudyne

F) Separate cool-down X Accudyne 1

3.9 ELECTROLESS COPPER PLATING YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Fully additive application X ME Baker Programmable 1
Automated Hoist

B) Electroless deposition x
(semiadditive)

C) Through-hole and via X ME Baker Automated

3.10 COPPER ELECTROPLATING YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Copper sulfate X Manual 1200 gal 3

B) Pyrophosphate X

C) Copper fluoborate X

D) Other

3.11 TIN/LEAD SURFACE YES NO EQUIPMENT QTY EQUIPMENT LIMITS

PLATINGS/COATINGS
A) Tin/lead electroplated x 1000 gal. Electro-plated Pure 1
Tin

B) Immersion tin or tin/lead x Out-Sourced

(electroless)

C) Hot air solder leveled (HASL) X Argus HASL Vertical 1

21
IPC-1710A May 2004
3.12 FUSING PROCESSES YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) I.R. reflow X

B) Hot oil reflow X 1

C) Horizontal (hot air level) X

D) Vertical (hot air level) X Argus 1

3.13 NICKEL SURFACE PLATING YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Electroless nickel X 1

B) Electroplated nickel X Out-Sourced

3.14 GOLD SURFACE PLATING YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Electroless gold X 1

B) Electroplated gold X Out-Sourced Full panel – Tabs

Internal

3.15 PALLADIUM SURFACE PLATING YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Electroless palladium X
(immersion)

B) Electroplated palladium X

3.16 SOLDERMASK YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Screened deposited image X 1

B) Dry film photoimageable X Dynachem - Conformask 1

C) Liquid photoimageable X Circuit Automation DP 1500 1

D) Dry film/liquid combination X

3.17 ORGANIC SURFACE PROTECTION YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Benzotriazole X

B) Imidazole X

C) Benzimidazole X

22
May 2004 IPC-1710A

23
IPC-1710A May 2004
3.18 MICROSECTION CAPABILITY YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Manual X Buehler 1

B) Single cavity automated X Buhler 1

C) Multiple cavity automated X Buehler 1

D) Plating thickness analysis X Nikon Micro-scope – Fisher X- 1

Ray

3.19 CHEMICAL ANALYSIS YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Etching chemistry x

B) Plating chemistry x Hull Cell – CVS-

C) Effluent (PPM) analysis x AA

3.20 ELECTRICAL TEST EQUIPMENT YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Continuity and shorts X TTI - MicroCraft Emma 2

B) Fixture development X Barco 1

C) Flying probe test X MicroCraft Emma 2

D) Impedance control X Polar 1

24