CBLC9 Module Datasheet

Version: 20220818

Online Version
 Contents

Contents

1 Overview 2
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2 Module interfaces 4
2.1 Dimensions and package . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.3 Definitions of test points . . . . . . . . . . . . . . . . . . . . . . . . . 5

3 Electrical parameters 7
3.1 Absolute electrical parameters . . . . . . . . . . . . . . . . . . . . . 7
3.2 Normal working conditions . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 RF power consumption . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4 Operating current . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

4 RF parameters 11
4.1 Basic RF features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2 Wi-Fi transmission performance . . . . . . . . . . . . . . . . . . . . . 11
4.3 Wi-Fi receiving performance . . . . . . . . . . . . . . . . . . . . . . . 12
4.4 Bluetooth LE transmission performance . . . . . . . . . . . . . . . . . 12
4.5 Bluetooth Low Energy (LE) receiving performance . . . . . . . . . . . 13

5 Antenna 14
5.1 Antenna type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 Antenna interference reduction . . . . . . . . . . . . . . . . . . . . . 14

6 Footprint information and production instructions 15

6.1 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2 Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.3 Production instructions . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.4 Recommended oven temperature curve and temperature . . . . . . . 18
6.5 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7 MOQ and packaging information 22

I
 Contents

8 Appendix: Statement 23

II
 Contents

CBLC9 is a low-power embedded Wi-Fi module that Tuya has developed. It consists
of a highly integrated RF chip BK7231N and a few peripherals, and not only sup-
ports the AP and STA dual-network-connection manner but supports the Bluetooth
LE communication manner.

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 1 Overview

1 Overview

CBLC9 is built-in with a 32-bit MCU with a running speed of up to 120 MHz, 2-MB
flash memory, and 256-KB RAM, so as to connect to the Tuya Cloud. The MCU’
s specially extended instructions for processing signals can effectively implement
audio encoding and decoding. Up to five ways of 32-bit PWM output make the chip
very suitable for high-quality LED control.

1.1 Features

• Embedded low-power 32-bit CPU, which can also function as an application

processor
• The clock rate: 120 MHz
• Operating voltage: 3 to 3.6V
• Peripheral: 5 PWMs
• Wi-Fi connectivity

– 802.11 b/g/n
– Channels 1 to [email protected] GHz
– Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES), WPA3 security modes
– Up to + 16dBm output power in 802.11b mode
– Support STA/AP/STA+AP working mode
– Support SmartConfig and AP network configuration manners for Android
and iOS devices
– Operating temperature: -40℃ to 105℃

• Bluetooth LE connectivity

– Support the Bluetooth LE V5.2

– Up to 6 dBm transmit power in bluetooth mode
– Bluetooth coexistence interface

1.2 Applications

• Intelligent building
• Smart household
• Smart home appliances
• Smart socket and light

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 1 Overview

• Industrial wireless control

• Baby monitor
• Network camera
• Intelligent bus

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 2 Module interfaces

2 Module interfaces

2.1 Dimensions and package

CBLC9 has two rows of pins with a spacing of 2±0.1 mm.

The CBLC9 dimensions are 15±0.35 mm (W)×16.8±0.35 mm (L) ×1.9±0.15 mm

(H).

2.2 Pin definition

Pin number Symbol I/O type Function

1 P9 I/O Support hardware

PWM and
correspond to P9
on the internal IC

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 2 Module interfaces

Pin number Symbol I/O type Function

2 P8 I/O Common I/O pin

and correspond to
P8 on the internal
IC
3 P6 I/O Support hardware
PWM and
correspond to P6
on the internal IC
4 P7 I/O Support hardware
PWM and
correspond to P7
on the internal IC
5 P24 I/O Support hardware
PWM and
correspond to P24
on the internal IC
6 VCC P Power supply pin
(3.3V)
7 P26 I/O Support hardware
PWM and
correspond to P26
on the internal IC
8 GND P Power supply
reference ground

Note: P indicates a power supply pin and I/O indicates an input/output pin.

2.3 Definitions of test points

Pin number Symbol I/O type Function

TP1 RF I/O RF test point

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 2 Module interfaces

Pin number Symbol I/O type Function

TP2 GND P Connection point

TP3 CEN I Reset pin, 3.3V,
pull-up resistor
TP4 U1_TXD I/O UART1_TX, user
serial interface TX
TP5 U1_RXD I/O UART1_RX, user
serial interface RX
TP6 U2_TXD I/O UART2_TX, LOG TX
TP8 CSN I Pull down
externally before
power on and RF
calibration

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 3 Electrical parameters

3 Electrical parameters

3.1 Absolute electrical parameters

Minimum Maximum
Parameter Description value value Unit

Ts Storage -55 125 ℃

temperature
VBAT Power supply -0.3 3.9 V
voltage
ESD voltage TAMB-25℃ -4 4 KV
(human body
model)
ESD voltage TAMB-25℃ -200 200 V
(machine
model)

3.2 Normal working conditions

Minimum Typical Maximum

Parameter Description value value value Unit

Ta Operating -40 - 105 ℃

tempera-
ture
VBAT Power 3 3.3 3.6 V
supply
voltage
VOL I/O low VSS - VSS+0.3 V
level
output
VOH I/O high VBAT-0. 3 - VBAT V
level
output

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 3 Electrical parameters

Minimum Typical Maximum

Parameter Description value value value Unit

Imax I/O drive - 6 20 mA

current

3.3 RF power consumption

Peak
Transmit value
Working power/re- Average (Typical
status Mode Rate ceive value value) Unit

Transmit 11b 11Mbps +16dBm 279 315 mA

Transmit 11g 54Mbps +14dBm 260 282 mA
Transmit 11n MCS7 +13dBm 257 277 mA
Receive 11b 11 Mbps Constantly 74 88 mA
receive
Receive 11g 54 Mbps Constantly 74 88 mA
receive
Receive 11n MCS 7 Constantly 74 88 mA
receive

3.4 Operating current

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 3 Electrical parameters

Working Maximum
status, Ta = value (Typical
Working mode 25°C Average value value) Unit

Quick network The module is 79 263 mA

connection in the fast
state network
(Bluetooth) connection
state and the
Wi-Fi indicator
flashes fast
Quick network The module is 80 310 mA
connection in the hotspot
state (AP) network
connection
state and the
Wi-Fi indicator
flashes slowly
Quick network The module is 97 316 mA
connection in the fast
state (EZ) network
connection
state and the
Wi-Fi indicator
flashes fast
Connected The module is 47 308 mA
state connected to
the network
and the Wi-Fi
indicator is
always on

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 3 Electrical parameters

Working Maximum
status, Ta = value (Typical
Working mode 25°C Average value value) Unit

Weakly The module 205 350 mA

connected and hotspot
state are in the
state of weak
connection
and the Wi-Fi
indicator light
is always on
Disconnected The module is 79 263 mA
state disconnected
and the Wi-Fi
indicator is
always off

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 4 RF parameters

4 RF parameters

4.1 Basic RF features

Parameter Description

Working frequency 2.412 to 2.480 GHz

Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps)
11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)
11n: HT20 MCS 0 to 7
Antenna type Ceramic patch antenna, gain 1.2dbi

4.2 Wi-Fi transmission performance

Minimum Maximum
Parameter value Typical value value Unit

Average RF - 16 - dBm
output power,
802.11b CCK
Mode 11M
Average RF - 14 - dBm
output power,
802.11g
OFDM Mode
54M
Average RF - 13 - dBm
output power,
802.11n
OFDM Mode
MCS7
Frequency -10 - 10 ppm
error

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 4 RF parameters

4.3 Wi-Fi receiving performance

Minimum Maximum
Parameter value Typical value value Unit

PER<8%, RX - -85 - dBm

sensitivity,
802.11b DSSS
Mode 11M
PER<10%, RX - -72 - dBm
sensitivity,
802.11g
OFDM Mode
54M
PER<10%, RX - -68 - dBm
sensitivity,
802.11n
OFDM Mode
MCS7
PER<10%, RX - -94 - dBm
sensitivity,
Bluetooth LE
1M

4.4 Bluetooth LE transmission performance

Minimum Maximum
Parameter value Typical value value Unit

Working 2402 - 2480 MHz

frequency
Air rate - 1 - Mbps
Transmit -20 6 20 dBm
power

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 4 RF parameters

Minimum Maximum
Parameter value Typical value value Unit

Frequency -150 - 150 kHz

error

4.5 Bluetooth Low Energy (LE) receiving performance

Minimum Maximum
Parameter value Typical value value Unit

RX sensitivity - -93 - dBm

Maximum RF -10 - - dBm
signal input
Inter- - - -23 dBm
modulation
Co-channel - 10 - dB
suppression
ratio

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 5 Antenna

5 Antenna

5.1 Antenna type

CBLC9 uses the 3216 ceramic patch antenna.

5.2 Antenna interference reduction

When the Wi-Fi module uses the ceramic patch antenna, to ensure optimal Wi-Fi
performance it is recommended that the antenna be at least 15 mm away from
other metal parts.

To prevent an adverse impact on the antenna radiation performance, avoid copper

or traces along the antenna area on the PCB.

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 6 Footprint information and production instructions

6 Footprint information and production instructions

6.1 Mechanical dimensions

The CBLC9 PCB dimensions are 15±0.35 mm (W)×16.8±0.35 mm (L) ×1±0.1 mm

(H).

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 6 Footprint information and production instructions

Note: The default outline dimension tolerance is ±0.35 mm, and the critical
dimension tolerance is ±0.15 mm. If you have specific requirements on dimen-

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 6 Footprint information and production instructions

sions, specify them clearly in the datasheet after communication.

6.2 Recommended footprint

Figure 1: image.png

6.3 Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual sol-
dering is less preferred. After being unpacked, the module must be soldered
within 24 hours. Otherwise, it must be put into the drying cupboard where
the RH is not greater than 10%; or it needs to be packaged under vacuum
again and record the exposure time (the total exposure time cannot exceed
168 hours).
2. Wave soldering devices and materials:

• Wave soldering equipment

• Wave soldering fixture
• Constant-temperature soldering iron
• Tin bar, tin wire, and flux
• Thermal profiler

3. Baking devices:

• Cabinet oven
• Anti-electrostatic and heat-resistant trays

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 6 Footprint information and production instructions

• Anti-electrostatic and heat-resistant gloves

4. The module needs to be baked in the following cases:

• The packaging bag is damaged before unpacking.

• There is no humidity indicator card (HIC) in the packaging bag.
• After unpacking, circles of 10% and above on the HIC become pink.
• The total exposure time has lasted for over 168 hours since unpacking.
• More than 12 months have passed since the sealing of the bag.

5. Baking settings:

• Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH
for tray package (please use the heat-resistant tray rather than a plastic
container)
• Time: 168 hours for reel package and 12 hours for tray package
• Alarm temperature: 50°C for reel package and 135°C for tray package
• Production-ready temperature after natural cooling: < 36°C
• Re-baking situation: If a module remains unused for over 168 hours after
being baked, it needs to be baked again.
• If a batch of modules is not baked within 168 hours, do not use the wave
soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond
the allowable time. In this case, if they are soldered at high temperatures,
it may result in device failure or poor soldering.

6. In the whole production process, take electrostatic discharge (ESD) protective

measures.
7. To guarantee the quality of products, you must pay attention to the following
items: The amount of soldering flux, the height of the wave peak, whether
the tin slag and copper content in the wave soldering tank exceed standards,
whether the window and thickness of the wave soldering fixture are appropri-
ate, and whether the wave soldering oven temperature curve is appropriate.

6.4 Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260°C±5°C.

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 6 Footprint information and production instructions

Recommended soldering temperature:

Suggestions on
oven temperature Suggestions on
curve of wave manual soldering
soldering temperature

Preheat 80 to 130 °C Soldering 360±20°C

temperature temperature
Preheat time 75 to 100s Soldering time ＜ 3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin 260±5°C NA NA
cylinder
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

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 6 Footprint information and production instructions

6.5 Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is

below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the
product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

Figure 2: HIC-In-line module.png

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 6 Footprint information and production instructions

Figure 3: HIC-In-line module.png

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 7 MOQ and packaging information

7 MOQ and packaging information

Shipping The number The number

packaging of modules of reels per
Product model MOQ (pcs) method per reel carton

CBLC9 4400 Tape reel 1100 4

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 8 Appendix: Statement

8 Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class
B digital device, according to part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if
not installed and used following the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which
can be determined by turning the device off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled
rolled environment. This device should be installed and operated with a minimum
distance of 20cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operating simultaneously
with other radios in the host system except following FCC multi-transmitter product
procedures. Additional testing and device authorization may be required to operate
simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are
country dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user.

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 8 Appendix: Statement

The host product manufacturer is responsible for compliance with any other FCC
rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing
with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as

shown in this manual, including “This product must be installed and operated with
a minimum distance of 20 cm between the radiator and user body”.

The RF module is considered as a limited modular transmitter according to FCC

rules. Even though the RF module gets an FCC ID, the host product manufacturer
can not use the FCC ID on the final product directly. In these circumstances, the
host product manufacturer integrator will be responsible for re-evaluating the end
product (including the transmitter) and obtaining the FCC authorization by a Class
II permissive change application or a new application.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module
product is in compliance with essential requirements and other relevant provisions
of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be
found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with
the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU).

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 8 Appendix: Statement

Instead, it should be disposed of by returning it to the point of sale, or to a municipal

recycling collection point.

The device could be used with a separation distance of 20cm to the human body.

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