Comsol Booklet
Comsol Booklet
®
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C ontents
I ntroduction 3
D esign 4
M ultiphysics A nalysis 10
S olvers /P erformance 12
U ser I nterface 16
M odel N avigator 20
D ocumentation 22
F eatures 24
O verview 26
Comsol Multiphysics 28
Options 30
- AC/DC Module 32
- Acoustics Module 34
- CAD Import Module 36
- Chemical Engineering Module 38
- Earth Science Module 40
When one company deems that hiding the problem is not going - Heat Transfer Module 42
- Material Library 44
to solve it, great discoveries will be around the corner. - MEMS Module 46
- RF Module 48
With Comsol Multiphysics® we have redefined modeling for cross-discipline - Structural Mechanics Module 50
studies as well as for single-physics applications. We pioneered easy-to-use applica- Comsol Script 52
tion interfaces, unlimited multiphysics capabilities, and a fully flexible model setup. Options 54
While we work on expanding the scope of the comsol® product line we keep - Optimization Lab 56
these priorities clearly in mind. - COMSOL Reaction Engineering Lab 58
- Signals and Systems Lab 60
Comsol Multiphysics and its add-on products combine the power and versatility S pecifications 62
necessary to address complex problems. Its power is applicable not only to tradi- U ser S upport 70
tional physics disciplines but also to emerging technologies such as advanced L icense C hoices 72
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How do you make the future work for you?
Comsol Multiphysics slashes the metric of Comsol Multiphysics accelerates the testing
greatest value to computational scientists—time of design concepts with fast parametric stud-
to solution. This is a scientific-modeling environ- ies of geometries, materials, and other model
ment that reduces the complexity of today’s properties. Taken as a whole, the package
challenging scientific applications and thereby minimizes the time to solution for the most
increases overall engineering efficiency. complex engineering and scientific problems.
Comsol Multiphysics is based on partial dif- A multiphysics model becomes simplicity itself.
ferential equations (pde s)—the fundamental All types of physics phenomena are available
equations that describe the laws of science. We from the Model Navigator. Simply point and click
transform any coupled pde s into a form suitable to complete a model built upon any number of
for numerical analysis and solve it using the finite- different physics, or just pick an application with
element method with high-performance solvers. the multiphysics couplings already predefined.
m eaningful simulations of today’s complex Comsol Multiphysics runs on 64-bit computers CG - Conjugate Gradient
systems require arbitrary couplings between to complete large-scale modeling projects. Opti- GE -
GS -
Gaussian Elimination
Gauss-Seidel
different physics phenomena in one and the mized with extensive input from tuning special- MG -
SOR -
Multigrid
Successive Over Relaxation
same model–multiphysics. Therefore, a single ists, the numeric engine rapidly solves models
consistent interface to a general-purpose with tens of millions of degrees of freedom.
solver engine with automatic detection of
the model’s characteristics, for optimal solver Mesh generation is an automated process and, in
choice, is a pillar in our design philosophy. combination with easy-to-use interactive mesh-
ing, enables the flexibilty that has become the
Carefully implemented best-in-class solvers are distinguished feature of Comsol Multiphysics.
there for you. Our speed and accuracy stand out Even a moving mesh is brilliantly managed by
as superior in independent benchmark studies. the ale technique and is directly available in the
With advanced solver techniques and multicore rotating machinery multiphysics coupling.
The algorithms underlying mathematical modeling have
parallel solvers, Comsol Multiphysics optimizes improved at a rate even greater than the hardware we have
computationally intensive routines for maximum watched explode in capability in the past decades. The develop-
ers at comsol continually take advantage of these develop-
performance with respect to solution times and ments so we can offer the highest-performance codes running
memory consumption. on the highest-performance hardware.
C AD Physics Mesh
Built-in CAD tools Predefined interfaces for a wide Material library with temperature- Automatic mesh generation of triangular,
CAD import including assemblies range of physics depedent properties quadrilateral and tetrahedral elements
Nastran® mesh import Combine physics to create Flexible equation-based modeling Independent mesh size control for edges,
1D, 2D, and 3D geometries can be mixed coupled multiphysics models using any PDE surfaces and volumes
in the same model Predefined multiphysics modeling Physics and multiphysics in multiple Swept and mapped meshing
Geometry repair and defeaturing interfaces geometries in the same model Interactive mesh for separate meshing
Customize material properties, Model tree for easy access of of geometry parts
sources and sinks, transport terms model parameters Boundary layer meshing
and other entities as functions of Adaptive meshing
space, time, and field variables Parallelized meshing
High-performance direct solvers including State-of-the-art time-stepping based on DASPK2 Script for extensive parametric studies
multicore parallel solvers Interactive visualization of any variable or Built-in functions for model validation and calibration
Iterative solvers including geometric multigrid function in space and time Foreign file interface to C, Fortran, and Java
preconditioners Evaluations of arbitrary functions including line, Optional add-ons for reaction engineering, optimization,
Fully coupled or sequential solution coupling surface, and volume integrals and signal and systems processing
using the GUI-based solver script Interfaces for S-parameter and far-field analyses GUI-builder for customized interfaces
Parametric and segregated solvers
Here is where you begin the modeling session and control the overall set-
tings: space dimensions, physics, unit system, and gui language. Alternatively,
you can open an existing model you have created, or a complete model from
the suite of examples in the Model Library. Models can be saved as compo-
nents that can then be added or merged to other models with their settings
still intact.
You revisit the Model Navigator during the modeling session to add physics
or geometries. Other settings can also be changed during the session.
Inductive heating in a
metallurgical process.
Cooling of an electronics-
chip component.
Heat transfer in a
cylinder block.
Sharing multiphysics models and results couldn’t be easier. With the push of
a button, the Report Generator documents all of a model’s important attri-
butes. You choose the desired level of detail when printing reports or saving
them as extensible html files.
We take options for documentation even further with Model M-files and
the ability to continue work from within Comsol Scripttm or matlab ®.
Comsol Multiphysics quickly translates a model you have created in the
gui into a ready-to-run, modifiable, Model M-file that includes each model-
ing, simulation and visualization step in a concise, compact form.
clear all;
xfem=flload(‘boot_seal’);
edit boot_seal;
geom=xfem.geom;
geomplot(geom);
Heat Transfer
MEMS Module
Module C, F ortran , J ava , S pice , E xcel ®
Structural Mechanics
RF Module
M odule
C atia ®, I nventor ®, P ro /E ®,
S olid E dge ®, NX TM, + more CAD Import Material Library
M odule
S olid W orks ®
Key fe atures
• Acoustics
• Convection and diffusion
• Electromagnetics
• Electro-thermal interactions
• Fluid dynamics
• Fluid-thermal interactions
• Heat transfer
• Structural mechanics
Temperature profile in the Ti/Au supercon-
• PDE modeling
ducting Transition Edge Sensor, used to mea-
sure X-rays in the European Space Agency’s
XEUS telescope. Model, drawing and photo-
graph of sensor courtesy of Dr. Marcel Bruijn
of the Space Research Organization Nether-
lands (SRON), Utrecht, Netherlands.
The ac/dc Module sets the stage for modeling the performance
of capacitors, inductors, motors, and microsensors. Although these
devices are principally characterized by electromagnetics, they
are also affected by other types of physics. Thermal effects, for
instance, can change electrical properties of materials, while electro-
mechanical deflections and vibrations in generators need to be fully
understood during any design process.
Magnetic flux density and magnetic potential after • mems and Hall sensors
0.2 s in a rotating generator. Postprocessing
• Motors, generators and other
reveals the torque.
electromechanical machinery
• Peltier cooling
• Plasma modeling and
magnetohydrodynamics (mhd)
• Propagation of noise from
electromagnetic devices
Electric potential and magnetic flux density in • Resistive and inductive heating
a railgun that utilizes an electromagnetic force
• rfid tags and readers
to propel an electrically conductive projectile.
• Semiconductor fabrication,
wafer processing and induction
furnaces
• Acoustic-structure interaction
• Aeroacoustic propagation
• Hearing aids
• Loudspeaker and microphone
design and evaluation
• Medical ultrasound and tissue-
response simulation
• mems acoustics sensors
• Noise and vibration
characterization of machinery
• Noise reduction measures –
sound barriers, construction
material, insulation design
• Piezoelectric transducer design
• Reactive and absorptive
mufflers
• Simulation of non-destructive
testing (ndt)
• sonar response simulation
• sonar transducer design and
evaluation
• Sound-environment simulation
– placement of loudspeakers in
rooms and car interiors
• Teaching acoustics
Radiation of fan noise from the annular duct of a Acoustic wave eigenmodes in a testbench car Aeroacoustics in an aeroengine duct.
turbofan aeroengine. compartment.
Getting your cad geometries ready for fea modeling is easier than ever with the
cad Import Module. It facilitates the reading of industry-standard formats such
as step, iges, acis® (sat®) or Parasolid®. Extra add-ons support file formats for
packages that have their own geometry kernel.
The cad Import Module goes beyond just the reading of file formats. The interactive
repair feature assures that imported geometries are mathematically correct for fea
modeling. And, in order to cut down on unnecessary details in your cad geometries,
defeaturing tools that remove fillets, small faces, sliver faces, as well as spikes or short
edges are included.
A bidirectional link between CAD design in SolidWorks (left) and the simulation in
COMSOL Multiphysics (right) allows you to quickly examine the effects of changes
to the geometry, which you can steer from either environment.
• Elements
• Fe & Ni Alloys
• Al & Cu Alloys
• Mg & Ti Alloys
A stent is a wire-mesh tube used to open • Oxides
a coronary artery to improve blood flow
to the heart muscle, often using shape • Carbides, Cermets & Tool Steels
memory alloys. Shown here is the defor-
mation plot and relevant material prop- • Carbons & Thermal Insulation
erty functions of such a stent.
• Intermetallics, tbc & Refractory
Metals
• Polyamids & Polyesters
• Acetal, pvdf & eva
• Elastomers & Epoxies
• Misc. Polymers & Polymer
Composites
• Minerals, Rock, Soil & Woods
• Polypropylenes & pet
• Controlled Expansion &
Thermocouple Alloys
• Semi-conductors, Optical &
Other Materials
• Solders, Dental & Co Alloys
• Resistance & Magnetic Alloys
• Metal Matrix & Ceramic Matrix
Composites
• Salts, Fuel Cell, Battery &
Electro-ceramics
• Silicides & Borides
• Glasses, Metallic Glasses,
Nitrides & Beryllides
• Cast Irons & Mold Materials
• Accelerometers
• Actuators
• Cantilever beams and other
switches
• Chemical and biochemical
sensors
• dna chips and lab-on-chips
• Fluid-structure interaction in
microchannels
• Heterogeneous two-phase flow
Droplet release from an inkjet and velocity
field in the surrounding air.
in microchannels
• Inkjets
• mems acoustic transducers
• mems capacitors
Fluid flow and the concentration • mems thermal devices
profile in a microfluidic mixer.
• Microreactors, micropumps and
micromixers
• Microwave power sensors
• moems and vcsels
Conductivity and displacement of a • Piezoelectric and piezoresistive
piezoelectric button. devices
• rf mems devices
• Sensors
• Surface Acoustic Wave (saw)
sensors and filters
• S-parameter analyses of
antennas
• Stress-optical effects in
waveguides and photonics
• Thermo-structural effects in
antennas and waveguides
• Tissue heating from cell phones
• Transmission lines
• Acoustic-structure interaction
• Biomechanics and
bioengineering
• Buckling analysis
• Elasto-plastic and hyperelastic
analysis of materials
• Electromechanical machinery
The von Mises stress and axial stress in a
bridge.
• Fatigue analysis
• Fluid-structure interaction (fsi)
• Fracture mechanics
• Multiphysics contact
• Piezoelectric effects
• Polymer mechanics
• Stress-optical effects
• Thermal friction
• Thermal-structure interaction
• Viscoelasticity and thermal
Temperature distribution resulting from the creep
contact and electric current in a switch.
• Advanced postprocessing
• Advanced solution schemes
• Algorithms for linear algebra,
signal processing, automatic
control and optimization
• Arbitrary expression and
function evaluation
• Command-line debugger
• Control-flow statements
• Customize comsol
Multiphysics models with gui
design and control
• Customized data import and
manipulation
• Desktop gui with editor/
debugger
• Fully compatible with the
matlab® language
Based on the SNOPT and SQOPT codes developed by Philip E. Gill, UC San
Diego, and Walter Murray and Michael A. Saunders, Stanford University, it
contains solvers for the optimization of constrained linear, quadratic, and
nonlinear objective functions as well as constrained linear and nonlinear
least-squares problems. There may be a mixture of linear and nonlinear
constraints, and sparsity is exploited. A separate Nelder-Mead solver adds
functionality for unconstrained optimization of nonsmooth functions of rela-
tively few variables.
The command syntax allows you to state the components of your problem
easily. An algorithm then analyzes the problem and chooses the most appro-
priate optimization function.
An essential part of the Comsol Script product line, the Optimization Lab
is fully integrated with the other Labs. It is also available to optimize Comsol
Multiphysics models.
The Signals & Systems Lab contains over one hundred functions to support signal
processing, system simulation, system identification, design and analysis of control
systems, adaptive filtering, non-stationary signal analysis, and statistics.
All commands and algorithms can be accessed via the Comsol Script
command-line interfaces.
• Accurate uncertainty
descriptions and embedded
Monte Carlo simulations
• Adaptive filtering including
recursive estimation of time-
varying models and Kalman
filtering for state estimation
• arma time-series analyses
• Control-system analysis –
including computation of
impulse and step responses,
Bode diagrams, and Nyquist
plots
• Data preprocessing digital-filter
design, windowing, resampling/
interpolation, and detrending/
prefiltering
• Determination and examination
of impulse response
• Determination and visualization
of spectra
• Dynamic responses of siso/
mimo systems
• Frequency analysis using dtf,
ctf, and tfd
• Linear time-invariant (lti)
system analysis
Estimation of an autoregressive model produced • Parameter estimation using
from an EEG signal using a fast and a slow adaption nonlinear least square methods
rate. The GUI shows a spectral analysis of the for multiple data sets
input signal with two different estimation methods;
the Welsh and the AR6 models. • Probability density functions
• Signal analysis – Fourier
transform methods, frequency-
domain methods, Laplace
transforms, z-transforms, and
analyzing feedback systems
using transform methods
Acoustics
Time-harmonic Analysis
Eigenfrequency Analysis
Transient Analysis
Modal Analysis
Time-harmonic Analysis, Scattered-Field Analysis
Ultraweak Variational Formulation (UWVF) for Efficient Time-harmonic Simulation
Perfectly Matched Layers (PMLs)
Acoustics Damping:
General, Complex Material, Delany-Bazley, and Bulk Viscosity
Structural Damping:
Raleigh
Loss Factor
Boundar y Conditions:
Sound Hard, Sound Soft, Pressure, Normal Acceleration, Impedance, and Radiation
Matched Boundar y
Point Sources:
Flow, Intensity, and Power
Far-field Analysis
Fluid Mechanics
Navier-Stokes, Laminar Flow with Non-constant Viscosity
Non-Newtonian Flow, Carreau-Yasuda and Power Law
Flow with Variable Density
Nonisothermal Flow, Non-constant Density
Stokes Flow
Electrokinetic Flow
Compressible Potential Flow
k-e Turbulence Model for Turbulent Flow
k- Ω Turbulence Model for Turbulent Flow
Evaulation of Fluid Proper ties from Species Data
Porous Media Flow:
Brinkman’s Extension of Darcy’s Law
Darcy’s Law
Richards´ Equation for Variably Saturated Media
Multiphase Flow:
Bubbly Flow Model for Liquid/Gas Mixtures in Laminar and Turbulent Flow
Mixture Model for Solid Par ticles in Liquids or Emulsions in Laminar and Turbulent Flow
General Interface for Two-phase Flow using the Level Set Method
Heat Transfer
Bioheat Equation for Heat Transfer in Living Tissue
Conduction with Heat Sources and Sinks
Convection with Heat Sources and Sinks, Film Coefficient
Convection with Heat Sources and Sinks, coupled to Fluid Transpor t
Evaluation of Heat Transpor t Proper ties from Species Data
Heat Balances in Continuously Stirred Tank and Plug Flow Reactors
Radiation, Surface-to-Ambient
Radiation, Surface-to-Surface View-Factor Method
Thin Thermally Conducting Shells with Heat Sources and Sinks
Structural Linear
Static Analysis
Transient Analysis
Frequency Response (Harmonic) Analysis
Buckling
Modal Analysis
Damped Modal Analysis
Perfectly Matched Layers (PMLs)
Structural Damping:
Loss Factor
Raleigh
Equivalent Viscous
Mixed Formulation
Structural Nonlinear
Static Analysis
Transient Analysis
Buckling
Mixed Formulation
Geometric Nonlinear (Large Deformations)
Follower Loads
Material Models:
Elasto-plasticity
Hyperelasticity
Viscoelasticity
Creep
Structural Contact
Surface-Surface
Friction
Augmented Lagrangian Method
Dynamic Friction
Pretension
Multiphysics Contact
Terminal Contact
Structural Elements
Shells
Beams
Plates
Truss/Cables
Solvers
Suppor t for Shared-memor y Parallelism in Assembly and in a Range of Solvers
Stationar y Linear and Nonlinear Solver
Time-dependent Nonlinear Solver (DASPK)
Eigenvalue Solver (ARPACK)
Adaptive Mesh Refinement Solver
Parametric Linear and Nonlinear Solver
Segregated Solver
Direct Linear Solvers:
UMFPACK LU Factorization
SPOOLES LU and LDLT Factorization
PARDISO
TAUCS Cholesky Factorization
Incomplete LU Factorization
Iterative Linear Solvers:
Conjugate Gradients
FGMRES and GMRES
Algebraic Multigrid
Geometric Multigrid
Preconditoners/Smoothers:
Incomplete LU Factorization
Jacobi (Diagonal Scaling)
SOR, SSOR, and SSOR Vector
Algebraic Multigrid
Geometric Multigrid
Vanka
External Interfaces
MATLAB ® and Simulink ®
MatWeb ®
Simpleware +ScanFE TM
C and FORTRAN through C omsol Script
SolidWorks ® (CAD Impor t Module required)
Java ® (COMSOL Script required)
PSpice (via Netlist File Expor t-Impor t)
Comparison with Experimental Data
* Requires COMSOL Script
** Requires the CAD Impor t Module
*** Only for file formats that are suppor ted by the CAD Impor t Module
Parasolid is a registered trademark of UGS Corp, +ScanFE is a trademark of Simpleware Ltd. SolidWorks is a registered trademark of SolidWorks Corporation. ACIS and SAT are registered
trademarks of Spatial Corp. Other product or brand names are trademarks or registered trademarks of their respective holders.
COMSOL, COMSOL Multiphysics and COMSOL Reaction Engineering Lab are registered trademarks of COMSOL AB. COMSOL Script is a trademark of COMSOL AB.
MATLAB and Simulink are registered trademarks of the MathWorks, Inc.
The brilliance in Comsol Multiphysics is our Training courses held regularly in your area
simple philosophy, which transcends all aspects of focus on introductory, advanced, and application-
the user experience. We are committed to help- specific levels. They acquaint you with Comsol
ing our customers get the most from our soft- Multiphysics and get you up and running in no
ware. You focus on the modeling; we make sure time at all, modeling your own specialized applica-
your tools are set up to maximize productivity. tions with ease and confidence.
This commitment starts with a full year of tech- User meetings let you tap into the dynamic
nical support. Our dedicated staff of support knowledgebase of the rapidly growing Comsol
engineers will inspire you to even better solutions. Multiphysics user community. These meetings are
You also get free access to an extensive online rich with opportunities to get and provide insight
knowledgebase. into leading-edge modeling techniques and
applications.
In addition, you can take advantage of
Comsol´s vast Model Libraries, which include
hundreds of models from different fields of
science and engineering, from benchmarks to
real-world applications.
A variety of license options meets the require- Floating Network License (fnl ): At any time you
ments of any user, no matter what the size of the may have as many sessions of a Program in use
organization or the computer* setup: as you have agreed to license. If the Program has
the ability to run as a client and server on sepa-
Named Single User License (nsl ): A single named rate computers, only the fnl version gives you
individual may use at most one concurrent ses- the right to use the Program in this configuration.
sion of a Program. You may replace the named Only users connected to the network can access
user for the license on a temporary or perma- the Program.
nent basis provided that only one individual is
designated as the named user at any given time. Class Kit License (ckl ): As many as 30 concur-
rent students and two (2) teaching assistants can
cpu Locked Single User License (cpu ): Any participate in a class kit license. This license is for
individual may use one concurrent session of academic use only.
a Program on a single designated computer at
any given time, working from the console of that * Supported platforms: Windows, Linux, Solaris, and Macintosh
designated computer.