Ansi Tia 607 C 2015

ANSI/TIA-607-C
Generic Telecommunications Bonding and Grounding (Earthing) for Customer Premises
Table of Contents
FOREWORD ............................................................................................................................................... vii
1 SCOPE .................................................................................................................................................. 1
2 NORMATIVE REFERENCES ............................................................................................................... 1
3 DEFINITIONS, ACRONYMS AND ABBREVIATIONS, UNITS OF MEASURE .................................. 2
3.1 General ........................................................................................................................ 2
3.2 Definitions .................................................................................................................... 2
3.3 Acronyms and abbreviations ........................................................................................ 6
3.4 Units of measure .......................................................................................................... 8
4 REGULATORY ..................................................................................................................................... 9
4.1 National requirements .................................................................................................. 9
4.2 Local code requirements .............................................................................................. 9
5 OVERVIEW OF TELECOMMUNICATIONS BONDING AND GROUNDING SYSTEMS .................. 10
5.1 General .......................................................................................................................10
5.2 Overview of the telecommunications bonding infrastructure........................................10
5.2.1 General ................................................................................................................10
5.2.2 Primary bonding busbar (PBB) ............................................................................12
5.2.3 Telecommunications bonding conductor (TBC)....................................................12
5.2.4 Telecommunications bonding backbone (TBB) ....................................................13
5.2.5 Secondary bonding busbar (SBB) ........................................................................13
5.2.6 Backbone bonding conductor (BBC) ....................................................................13
6 TELECOMMUNICATIONS BONDING COMPONENTS .................................................................... 14
6.1 General .......................................................................................................................14
6.2 Busbars ......................................................................................................................14
6.2.1 Primary bonding busbar (PBB) ............................................................................14
6.2.2 Secondary bonding busbar (SBB) ........................................................................14
6.2.3 Rack bonding busbar (RBB) ................................................................................15
6.3 Conductors .................................................................................................................15
6.3.1 General ................................................................................................................15
6.3.2 Sizing the telecommunications bonding backbone (TBB) .....................................15
6.3.3 Sizing the telecommunications bonding conductor (TBC) ....................................16
6.3.4 Sizing the backbone bonding conductor (BBC) ....................................................16
i
ANSI/TIA-607-C
6.3.5 Use of structural metal .........................................................................................16

6.3.5.1 General .........................................................................................................16
6.3.5.2 Connections to the PBB/SBB ........................................................................16
6.4 Connectors .................................................................................................................17
6.5 Identification................................................................................................................17
6.5.1 Conductors ..........................................................................................................17
6.5.2 Labels ..................................................................................................................17
7 DESIGN REQUIREMENTS ................................................................................................................ 18
7.1 General .......................................................................................................................18
7.1.1 Telecommunications entrance room or space ......................................................18
7.1.2 Distributor rooms .................................................................................................18
7.1.3 Computer rooms ..................................................................................................19
7.1.4 Cabinets and racks ..............................................................................................19
7.1.5 Metallic pathways ................................................................................................20
7.1.6 Structural metal....................................................................................................20
7.2 Primary bonding busbar (PBB)....................................................................................21
7.2.1 General ................................................................................................................21
7.2.2 Bonds to the PBB ................................................................................................21
7.2.3 Connections to the PBB .......................................................................................22
7.3 Secondary bonding busbar (SBB) ...............................................................................22
7.3.1 General ................................................................................................................22
7.3.2 Bonds to the SBB ................................................................................................22
7.3.3 Connections to the SBB .......................................................................................23
7.4 Rack bonding busbar (RBB) .......................................................................................23
7.4.1 General ................................................................................................................23
7.4.2 Bonds to the RBB ................................................................................................23
7.4.3 Connections to the RBB .......................................................................................23
7.5 Conductors .................................................................................................................23
7.5.1 General ................................................................................................................23
7.5.2 Bend radius and included angle ...........................................................................23
7.5.3 Telecommunications bonding conductor (TBC)....................................................24
7.5.4 Telecommunications bonding backbone (TBB) ....................................................24
7.5.5 Backbone bonding conductor (BBC) ....................................................................25
7.5.6 Coupled bonding conductor (CBC) ......................................................................25
ii
ANSI/TIA-607-C
7.5.7 Bonding conductors for connections to the mesh-BN or RBB ..............................25

7.5.8 Telecommunications equipment bonding conductor (TEBC) ................................26
7.5.8.1 General .........................................................................................................26
7.5.8.2 Separation ....................................................................................................27
7.6 Bonding equipment cabinets/equipment racks to the TEBC ........................................27
7.7 Structural bonding of equipment cabinets/equipment racks ........................................28
7.8 Supplementary bonding networks ...............................................................................29
7.8.1 Mesh-BN..............................................................................................................30
7.8.2 Mesh-IBN .............................................................................................................31
7.8.3 Bonding conductor for connections to the supplementary bonding network .........32
7.9 Administration .............................................................................................................32
8 EXTERNAL GROUNDING ................................................................................................................. 33
8.1 Grounding resistance ..................................................................................................33
8.1.1 Minimum requirements ........................................................................................33
8.1.2 Enhanced requirements .......................................................................................33
8.2 Grounding electrode system design ............................................................................33
8.2.1 General ................................................................................................................33
8.2.2 Soil resistivity testing............................................................................................33
8.2.3 Low resistance .....................................................................................................33
8.2.4 Potential equalization ...........................................................................................34
8.2.5 Design configuration ............................................................................................34
9 PERFORMANCE AND TEST REQUIREMENTS ............................................................................... 35
9.1 Two-point ground/continuity testing .............................................................................35
9.2 Grounding electrode system testing ............................................................................35
9.2.1 Three-pole fall-of-potential method ......................................................................35
9.2.2 Clamp-on test meter ............................................................................................37
9.3 Soil resistivity testing...................................................................................................38
9.3.1 General ................................................................................................................38
9.3.2 Four-point method ...............................................................................................38
9.3.2.1 General .........................................................................................................38
9.3.2.2 Test procedure..............................................................................................39
Annex A (informative) BONDING METHODS .......................................................................................... 42
Annex B (informative) GROUNDING ELECTRODES ............................................................................. 43
B.1 General .......................................................................................................................43
iii
ANSI/TIA-607-C
B.2 Ground rods ................................................................................................................43

B.3 Electrolytic ground rods ..............................................................................................44
B.4 Ground plate electrodes ..............................................................................................44
B.5 Wire mesh ..................................................................................................................44
B.6 Concrete encased electrode .......................................................................................45
B.7 Ground ring electrodes ...............................................................................................45
B.8 Ground radial electrodes .............................................................................................45
B.9 Enhanced grounding materials ...................................................................................46
B.10 Grounding conductors .............................................................................................47
Annex C (informative) TOWERS AND ANTENNAS ................................................................................ 48
C.1 General .......................................................................................................................48
C.2 Grounding electrode system .......................................................................................48
C.2.1 External grounding ...............................................................................................48
C.2.2 Bonding busbars ..................................................................................................48
C.2.3 Grounding systems ..............................................................................................49
C.2.3.1 Type 1 sites ..................................................................................................49
C.2.3.2 Type 2 sites ..................................................................................................50
C.2.4 Tower grounding ..................................................................................................50
C.2.4.1 Guyed metallic towers...................................................................................51
C.2.4.2 Self-supporting metallic towers .....................................................................53
C.2.4.3 Wooden structures (poles) ............................................................................54
C.2.5 Building/shelter and outdoor cabinet grounding ...................................................56
C.2.6 Rooftop sites grounding system ...........................................................................57
C.2.6.1 Down conductors ..........................................................................................60
C.2.6.2 Roof conductors............................................................................................60
C.2.7 Transmission line grounding at antenna locations ................................................60
C.2.8 Ancillary objects requiring bonding and grounding ...............................................61
C.2.8.1 Fence grounding ...........................................................................................61
C.2.8.2 Generators....................................................................................................63
C.2.8.3 Satellite dishes..............................................................................................64
C.2.9 Internal bonding and grounding ...........................................................................64
C.2.9.1 Components .................................................................................................64
C.2.9.2 Installation ....................................................................................................64
C.2.9.3 Bonding to the external ground electrode system .........................................64
iv
ANSI/TIA-607-C
Annex D (informative) TELECOMMUNICATIONS ELECTRICAL PROTECTION .................................. 65

Annex E (informative) ELECTRICAL PROTECTION FOR OPERATOR-TYPE EQUIPMENT
POSITIONS ................................................................................................................................................. 67
Annex F (informative) CROSS REFERENCE OF TERMS ...................................................................... 69
Annex G (informative) BIBLIOGRAPHY .................................................................................................. 70
List of Figures
Figure 1 Relationship between relevant TIA standards ........................................................... ix
Figure 2 Elements of generic cabling topology ........................................................................ 3
Figure 3 Illustrative example of a multi-story large building ....................................................11
Figure 4 Illustrative example of a single story large building ...................................................12
Figure 5 Illustrative example of a smaller building ..................................................................12
Figure 6 Example PBB ...........................................................................................................14
Figure 7 Example SBB ...........................................................................................................15
Figure 8 Label for bonding and grounding conductors............................................................17
Figure 9 Example of three methods to bond equipment and racks .........................................20
Figure 10 Illustration of bend radius and included angle .........................................................24
Figure 11 Bonding to the service equipment (power) ground .................................................24
Figure 12 Example TEBC to rack bonding conductor connection ...........................................26
Figure 13 Example of a TEBC routed on cable tray................................................................27
Figure 14 Illustration of connection point to a rack from a TEBC ............................................28
Figure 15 Illustration of a bond connection from a cabinet to the cabinet door .......................29
Figure 16 A mesh-BN with equipment cabinets, frames, racks and CBN bonded together ....30
Figure 17 A mesh-IBN having a single point of connection.....................................................32
Figure 18 Illustration of test instrument connections ...............................................................37
Figure 19 Four-point method ..................................................................................................39
Figure 20 Example of multiple test locations ..........................................................................40
Figure 21 Recommended resistivity table layout ....................................................................41
Figure 22 Illustrative views of typical ground rods ..................................................................43
Figure 23 Illustrations of a vertical and horizontal electrolytic ground rod ...............................44
Figure 24 Illustrative view of a concrete-encased electrode ...................................................45
Figure 25 Illustrative view of a ground radial electrode ...........................................................46
Figure 26 Illustrative example of ground enhancement materials surrounding a grounding
conductor and a ground rods ....................................................................................................47
Figure 27 Illustrative example view of a site grounding electrode system ...............................48
Figure 28 Illustration of a parallel ground rod installation ........................................................50
v
ANSI/TIA-607-C
Figure 29 Illustration of a guyed tower grounding example.....................................................52

Figure 30 Illustration of guy wire grounding ............................................................................53
Figure 31 Illustration of a monopole tower grounding example...............................................54
Figure 32 Illustrative view of a wooden pole grounding example ............................................55
Figure 33 Illustrative view of a cabinet grounding system .......................................................56
Figure 34 Illustrative rooftop tower example ...........................................................................58
Figure 35 Illustrative view of roof-mounted antenna mast grounding with a supplemental
grounding electrode system ......................................................................................................59
Figure 36 Illustrative view of side-mounted antenna grounding using copper strap down
conductor ..................................................................................................................................60
Figure 37 Illustration of a fence bonding example ..................................................................62
Figure 38 Illustrative view of a fence fabric and deterrent wiring bonding example .................63
Figure 39 Illustrative view of a generator grounding example .................................................64
Figure 40 Electrical protection for operator-type equipment positions ....................................68
List of Tables
Table 1 TBB/BCC conductor size vs length ............................................................................16
Table 2 Stake distance...........................................................................................................36
Table 3 Cross reference of terms ...........................................................................................69
vi
ANSI/TIA-607-C
FOREWORD
(This foreword is not considered part of this Standard)
This Standard was developed by TIA Subcommittee TR-42.16.
Approval of this Standard

This Standard was approved by TIA Subcommittee TR-42.16, TIA Engineering Committee
TR-42, and the American National Standards Institute (ANSI).
ANSI/TIA reviews standards every 5 years. At that time, standards are reaffirmed, withdrawn, or
revised according to the submitted updates. Updates to be included in the next revision should
be sent to the committee chair or to ANSI/TIA.
Contributing organizations
More than 60 organizations within the telecommunications industry (including manufacturers,
consultants, end users, and other organizations) contributed their expertise to the development
of this Standard.
Documents superseded
This Standard supersedes ANSI/TIA-607-B dated September, 2011, and its addenda.
Significant technical changes from the previous edition

Significant changes from the previous edition include:
The contents of Addendum 1 (external grounding) and Addendum 2 (structural metal)
were incorporated.
References were updated.
Terms were changed to harmonize with ISO/IEC 30129 (see annex E).
Illustrative example added for single story large building.
Recommendations for bonding connections for separately derived systems added.
Added component and design requirements for rack bonding busbars.
Added minimum bend radius and included angle requirements for bonding conductors.
Clarified that a backbone bonding conductors needs to be, at a minimum, the same size
as the largest telecommunications bonding backbone to which it is connected.
Expanded the list of conductors that are required to green and clarified that the require-
ment applies only to insulated conductors.
Added recommendation for minimum 0.6 m (2 ft) grid spacing for mesh bonding net-
works.
Added requirement that patch panels for shielded cabling be bonded.
Clarified that bonding requirements apply to all metallic telecommunications pathways.
Added requirement that exothermic two-hole lugs be listed.
Annexes
There are six annexes to this Standard. Annexes A through F are informative and not consid-
ered a part of this Standard.
vii
ANSI/TIA-607-C
Relationship to other TIA standards and documents

The following are related standards regarding various aspects of structured cabling that were
developed and are maintained by Engineering Committee TIA TR-42. An illustrative diagram of
the ANSI/TIA-568 Series relationship to other relevant TIA standards is given in figure 1.
Generic Telecommunications Cabling for Customer Premises (ANSI/TIA-568.0-D)
Commercial Building Telecommunications Cabling Standard (ANSI/TIA-568.1-D)
Balanced Twisted-Pair Telecommunications Cabling and Components Standard
(ANSI/TIA-568-C.2)
Optical Fiber Components Standard (ANSI/TIA-568-C.3)
Broadband Coaxial Cabling and Components Standard (ANSI/TIA-568-C.4)
Telecommunications Pathways and Spaces (ANSI/TIA-569-D)
Residential Telecommunications Infrastructure Standard (ANSI/TIA-570-C)
Administration Standard for Telecommunications Infrastructure (ANSI/TIA-606-B)
Customer-Owned Outside Plant Telecommunications Infrastructure Standard
(ANSI/TIA-758-B)
Structured Cabling Infrastructure Standard for Intelligent Building Systems
(ANSI/TIA-862-B)
Telecommunications Infrastructure Standard for Data Centers (ANSI/TIA-942-A)
Telecommunications Infrastructure Standard for Industrial Premises (ANSI/TIA-1005-A)
Healthcare Facility Telecommunications Infrastructure Standard (ANSI/TIA-1179)
Telecommunications Infrastructure Standard for Educational Facilities (ANSI/TIA-4966)
viii
ANSI/TIA-607-C
Common Premises Cabling &

Standards Standards Component
Standards
ANSI/TIA-568.0 ANSI/TIA-568.1 ANSI/TIA-568.2

(Generic) (Commercial) (Balanced twisted-
pair)
ANSI/TIA-569 ANSI/TIA-570 ANSI/TIA-568.3

(Pathways and (Residential) (Optical fiber)
spaces)
ANSI/TIA-606 ANSI/TIA-942 ANSI/TIA-568.4

(Administration) (Data centers) (Broadband
coaxial)
ANSI/TIA-607 ANSI/TIA-1005
(Bonding and (Industrial)
grounding
[earthing])
(Outside plant) (Healthcare)
(Intelligent (Educational)
building
systems)
Figure 1 Relationship between relevant TIA standards

Introduction
Telecommunications, as used in this Standard, refers to the transmission of all forms of infor-
mation (e.g., voice, data, video, security, audio, industrial, building control). Telecommunications
equipment used to support these wide varieties of systems that rely on the electronic transport
of information require an effective building infrastructure. This infrastructure encompasses
spaces, pathways, cables, connecting hardware, and a bonding and grounding system. For reli-
able operation of any telecommunications equipment or system, bonding and grounding (earth-
ing) is essential regardless of the cabling technology or media. This Standard focuses on the
bonding and grounding portion of this infrastructure.
ix
ANSI/TIA-607-C
NOTE tandard is
The bonding and grounding approach in this Standard is intended to work in concert with prem-
ises cabling, equipment, spaces and pathways specified within the TIA Engineering Committee
TR-42. The requirements specified in this Standard in conjunction with a basic understanding of
bonding and grounding concepts and methodologies will aid in achieving a reliable solution
when applied to telecommunications installations.
Several sources of bonding and grounding information exist within the telecommunications in-
dustry. For example, the NEC specifies requirements regarding the safety aspects of bonding
and grounding of equipment and systems. Yet another example is that of ATIS 0600318, Elec-
trical Protection Applied to Telecommunications Network Plant at Entrances to Customer Struc-
tures or Buildings, which provides information on bonding and grounding to support electrical
protection considerations.
Purpose
The purpose of this Standard is to enable and encourage the planning, design, and installation
of generic telecommunications bonding and grounding systems within premises with or without
prior knowledge of the telecommunications systems that will subsequently be installed. While
primarily intended to provide direction for the design of new buildings, this Standard may be
used for existing building renovations or retrofit treatment. Design requirements and choices are
provided to enable the designer to make informed design decisions.
Stewardship
Telecommunications infrastructure affects raw material consumption. The infrastructure design
and installation methods also influence product life and sustainability of electronic equipment life
cycling. These aspects of telecommunications infrastructure impact our environment. Since
building life cycles are typically planned for decades, technological electronic equipment up-
grades are necessary. The telecommunications infrastructure design and installation process
magnifies the need for sustainable infrastructures with respect to building life, electronic equip-
ment life cycling and considerations of effects on environmental waste. Telecommunications
designers are encouraged to research local building practices for a sustainable environment
and conservation of fossil fuels as part of the design process.
Specification of criteria
Two categories of criteria are specified; mandatory and advisory. The mandatory requirements
are designated by the word "shall;" advisory requirements are designated by the words "should,
"may," or "desirable," which are used interchangeably in this Standard.
Mandatory criteria generally apply to protection, performance, administration and compatibility;
they specify the minimally-compliant requirements. Advisory or desirable criteria are presented
when their attainment will enhance the general performance of the cabling system in all its con-
templated applications.
A note in the text, table, or figure is used for emphasis or offering informative suggestions, or
providing additional information.
x
ANSI/TIA-607-C
Metric equivalents of United States customary units

The dimensions in this Standard are metric or United States customary with approximate con-
versions to the other.
Life of this Standard
This Standard is a living document. The criteria contained in this Standard are subject to revi-
sions and updating as warranted by advances in building construction techniques and telecom-
munications technology.
xi
ANSI/TIA-607-C
1 SCOPE
This Standard specifies requirements for a generic telecommunications bonding and grounding
infrastructure and its interconnection to electrical systems and telecommunications systems.
This Standard may also be used as a guide for the renovation or retrofit of existing systems.
2 NORMATIVE REFERENCES
The following standards contain provisions which, through reference in this text, constitute pro-
visions of this Standard. At the time of publication, the editions indicated were valid. All stand-
ards are subject to revision, and parties to agreements based on this Standard are encouraged
to investigate the possibility of applying the most recent editions of the standards indicated be-
low. ANSI and TIA maintain registers of currently valid national standards published by them.
ANSI/NECA/BICSI 607-2011, Standard for Telecommunications Bonding and Grounding
Planning and Installation Methods for Commercial Buildings
ANSI/TIA-606-B, 2012, Administration Standard for Telecommunications Infrastructure
ATIS 0600313-2013, Electrical Protection for Telecommunications Central Offices and
Similar Type Facilities
ATIS 0600318-2010, Electrical Protection Applied to Telecommunications Network Plant
at Entrances to Customer Structures or Buildings
ATIS 0600321-2010, Telecommunications Electrical Protection For Network Operator-
Type Equipment Positions
ATIS 0600333-2013, Grounding And Bonding Of Telecommunications Equipment
ATIS 0600334-2013, Electrical Protection Of Communications Towers And Associated
Structures
IEEE C2-2012, National Electrical Safety Code® (NESC®)
IEEE 1100-2005, Recommended Practice for Powering and Grounding Electronic
Equipment
ITU-T Recommendation K.27 1996, Protection against Interference Bonding Configu-
rations and Earthing inside a Telecommunication Building
NFPA 70-2014, National Electrical Code® (NEC®)
NFPA 780-2014, Standard for the Installation of Lightning Protection Systems
1
ANSI/TIA-607-C
3 DEFINITIONS, ACRONYMS AND ABBREVIATIONS, UNITS OF MEASURE
3.1 General
For the purposes of this Standard, the following definitions, acronyms, abbreviations and units
of measure apply.
3.2 Definitions
access floor: A system consisting of completely removable and interchangeable floor panels
that are supported on adjustable pedestals or stringers (or both) to allow access to the area be-
neath.
access provider: The operator of any facility that is used to convey telecommunications sig-
nals to and from a customer premises.
administration: The method for labeling, identification, documentation and usage needed for
installation, moves, additions and changes of the telecommunications infrastructure.
backbone: A facility (e.g., pathway, cable or bonding conductor) for Cabling Subsystem 2 and
Cabling Subsystem 3.
backbone bonding conductor: A telecommunication bonding connection which interconnects
telecommunications bonding backbones (formerly known as the grounding equalizer).
bonding: The joining of metallic parts to form an electrically conductive path.
bonding conductor: A conductor that joins metallic parts to form an electrically conductive
path.
bonding network (telecommunications): A set of interconnected conductive structures that
provides a low impedance path for the associated telecommunications infrastructure.
building backbone: 1) Pathways or cabling between telecommunications service entrance
rooms, equipment rooms, telecommunications rooms, or telecommunications enclosures within
a building. 2) Cabling for interconnecting telecommunications spaces from the telecommunica-
tions entrance facility to a horizontal cross-connect within a building.
cabinet: A container that may enclose connection devices, terminations, apparatus, wiring, and
equipment.
cable: An assembly of one or more insulated conductors or optical fibers, within an enveloping
sheath.
cable sheath: A covering over the optical fiber or conductor assembly that may include one or
more metallic members, strength members, or jackets.
cabling: A combination of all cables, jumpers, cords, and connecting hardware.
Cabling Subsystem 1: Cabling from the equipment outlet to Distributor A, Distributor B, or Dis-
tributor C.
Cabling Subsystem 2: Cabling between Distributor A and either Distributor B or Distributor C
(if Distributor B is not implemented).
Cabling Subsystem 3: Cabling between Distributor B and Distributor C.
Note See figure 2 below for an illustration of the generic cabling topology for
Cabling Subsystem 1, Cabling Subsystem 2, Cabling Subsystem 3, Distrib-
2
ANSI/TIA-607-C
utor A, Distributor B, Distributor C, an optional consolidation point and the

equipment outlet. Cabling subsystems do not include equipment cords.
DC
3 3
DB DB
2 2
2
1
DA DA DA
1
1 1 1 1
1 1 1
1
CP CP CP CP CP
EO EO EO EO EO EO EO EO EO EO
Legend:
DA Distributor A Cabling
1 Subsystem 1
DB Distributor B cable
DC Distributor C Cabling
2 Subsystem 2
EO Equipment outlet cable
CP Optional consolidation point Cabling

3 Subsystem 3
Optional tie cabling cable
NOTE All elements shown represent cables and connecting hardware,

not spaces or pathways.
Figure 2 Elements of generic cabling topology
campus: The buildings and grounds having legal contiguous interconnection.
coaxial cable: A telecommunications cable consisting of a round center conductor surrounded
by a dielectric surrounded by a concentric cylindrical conductor (shield) and an optional insulat-
ing sheath.
common bonding network: The set of metallic components that are interconnected to form the
principle means for effectively bonding equipment inside a building to the grounding electrode
system.
compression connection: A means of permanently bonding a conductor to a connector by
permanently deforming the connector using a compression tool.
3
ANSI/TIA-607-C
computer room: An architectural space whose primary function is to accommodate data pro-
cessing equipment.
conduit: 1) A raceway of circular cross-section. 2) A structure containing one or more ducts.
connecting hardware: A device providing mechanical cable terminations.
consolidation point: A connection facility within Cabling Subsystem 1 for interconnection of
cables extending from building pathways to the equipment outlet.
cord: 1) An assembly of cord cable with a plug on one or both ends. 2) An assembly of optical
fiber cable with a connector on each end.
cord cable: A cable used to construct patch, work area, and equipment cords .
customer premises: Building(s), grounds and appurtenances (belongings) under the control of
the customer.
Distributor A: Optional connection facility in a hierarchical star topology that is cabled between
the equipment outlet and Distributor B or Distributor C.
Distributor B: Optional intermediate connection facility in a hierarchical star topology that is ca-
bled to Distributor C.
Distributor C: Central connection facility in a hierarchical star topology.
distributor room: An enclosed architectural space designed to contain Distributor A, Distributor
B or Distributor C.
earth: See ground.
earthing: See grounding.
electromagnetic interference: Radiated or conducted electromagnetic energy that has an un-
desirable effect on electronic equipment or signal transmissions.
entrance facility (telecommunications): An entrance to a building for both public and private
network service cables (including wireless) including the entrance point of the building and con-
tinuing to the entrance room or space.
entrance point (telecommunications): The point of emergence for telecommunications ca-
bling through an exterior wall, a floor, or from a conduit.
entrance room or space (telecommunications): A space in which the joining of inter or intra
building telecommunications cabling takes place.
NOTE An entrance room may also serve as a distributor room.
equipment cord: see cord.
equipment outlet: Outermost connection facility in a hierarchical star topology.
equipotential bonding: Bonding between metallic components to achieve a substantially
equal potential.
exothermic weld: A method of permanently bonding two metals together by a controlled heat
reaction resulting in a molecular bond.
grid: A collection of adjacent cells.
4
ANSI/TIA-607-C
ground: A conducting connection, whether intentional or accidental, between an electrical cir-

cuit (e.g., telecommunications) or equipment and the earth, or to some conducting body that
serves in place of earth.
grounding: The act of creating a ground.
grounding electrode: A conductor, usually a rod, pipe or plate (or group of conductors) in di-
rect contact with the earth for the purpose of providing a low-impedance connection to the earth.
grounding electrode conductor: The conductor used to connect the grounding electrode to
the equipment grounding conductor, or to the grounded conductor of the circuit at the service
equipment, or at the source of a separately derived system.
grounding electrode system: One or more grounding electrodes that are connected together.
infrastructure (telecommunications): A collection of those telecommunications components,
excluding equipment, that together provide the basic support for the distribution of information
within a building or campus.
listed: Equipment included in a list published by an organization, acceptable to the authority
having jurisdiction, that maintains periodic inspection of production of listed equipment, and
whose listing states either that the equipment or material meets appropriate standards or has
been tested and found suitable for use in a specified manner.
mechanical connection: A reversible means of connecting a conductor to a connector through
the use of a set screw or other bolt and nut device.
mesh bonding network: A bonding network to which all associated equipment (e.g., cabinets,
frames, racks, trays, pathways) are connected using a bonding grid, which is connected to
multiple points on the common bonding network.
mesh isolated bonding network: A mesh bonding network that has a single point of connec-
tion to either the common bonding network or another isolated bonding network.
patch cord: A cord used to establish connections on a patch panel.
patch panel: A connecting hardware system that facilitates cable termination and cabling ad-
ministration using patch cords.
pathway: A facility for the placement of telecommunications cable.
primary bonding busbar: A busbar placed in a convenient and accessible location and bond-
ed, by means of the telecommunications bonding conductor, to the buildings service equipment
(power) ground (formerly known as the telecommunications main grounding busbar).
primary protector: The protector located at the building telecommunications entrance point.
primary protector grounding conductor: The conductor connecting the primary protector to
ground.
protector: A device consisting of one or more protector units and associated mounting assem-
blies intended to limit abnormal voltages or currents on metallic telecommunications circuits.
rack: Supporting frame equipped with side mounting rails to which equipment and hardware
are mounted.
rack bonding busbar: A busbar within a cabinet, frame or rack.
rack bonding conductor: Bonding conductor from the rack or rack bonding busbar to the tele-
communications equipment bonding conductor.
5
ANSI/TIA-607-C
secondary bonding busbar: A common point of connection for telecommunications system

and equipment bonding to ground, and located in the distributor room (formerly known as the
telecommunications grounding busbar).
secondary protector: A device that protects against electrical transients passed through the
primary protector or generated within the customer premises.
sheath: See cable sheath.
shield: 1) A metallic layer placed around a conductor or group of conductors. 2) The cylindrical
outer conductor with the same axis as the center conductor that together form a coaxial trans-
mission line.
sleeve: An opening, usually circular, through the wall, ceiling, or floor to allow the passage of
cables.
soil resistivity: The measure of a soil's ability to retard the conduction of an electric current.
space (telecommunications): An area used for housing the installation and termination of tel-
ecommunications equipment and cable.
splice: A joining of conductors, meant to be permanent.
supplementary bonding grid: A set of conductors or conductive elements formed into a grid or
provided as a conductive plate that is part of a bonding network.
star topology: A topology in which telecommunications cables are distributed from a central
point.
telecommunications: Any transmission, emission, or reception of signs, signals, writings, im-
ages, and sounds, that is, information of any nature by cable, radio, optical, or other electro-
magnetic systems.
telecommunications bonding backbone: A conductor that interconnects the primary bonding
busbar to the secondary bonding busbar.
telecommunication bonding conductor: A conductor that interconnects the telecommunica-
tions bonding infrastructure to the building's service equipment (power) ground (formerly known
as the bonding conductor for telecommunications).
telecommunications equipment bonding conductor: A conductor that connects the primary
bonding busbar or secondary bonding busbar to equipment racks or cabinets.
telecommunications infrastructure: See infrastructure (telecommunications).
unit bonding conductor: A bonding conductor from equipment or a patch panel to a rack
bonding conductor or a rack bonding busbar.
wire: An individually insulated solid or stranded metallic conductor.
work area cord: See cord.
3.3 Acronyms and abbreviations

ac alternating current
ACEG alternating current equipment ground
AHJ authority having jurisdiction
ANSI American National Standards Institute
6
ANSI/TIA-607-C
ATIS Alliance for Telecommunications Industry Solutions

AWG American Wire Gauge
BBC backbone bonding conductor
BN bonding network
CBC coupled bonding conductor
CBN common bonding network
CP consolidation point
dc direct current
EMI electromagnetic interference
ENT electrical nonmetallic tubing
EO equipment outlet
ESD electrostatic discharge
FCC Federal Communications Commission
HVAC heating, ventilation and air conditioning
IACS International Annealed Copper Standard
IBN isolated bonding network
IEC International Electrotechnical Commission
ISO International Organization for Standards
ITE information technology equipment
ITU-T International Telecommunication Union - Telecommunication sector
mesh-BN mesh bonding network
mesh-IBN mesh isolated bonding network
®
NEC National Electrical Code®
NECA National Electrical Contractors Association
NESC® National Electrical Safety Code®
NFPA National Fire Protection Association
NRTL nationally recognized testing laboratory
PBB primary bonding busbar
PDU power distribution unit
RBB rack bonding busbar
RBC rack bonding conductor
RF radio frequency
SBB secondary bonding busbar
SBG supplementary bonding grid
7
ANSI/TIA-607-C
SPC single point connection

TBB telecommunications bonding backbone
TBC telecommunications bonding conductor
TEBC telecommunications equipment bonding conductor
TEF telecommunications entrance facility
TIA Telecommunications Industry Association
UBC unit bonding conductor
3.4 Units of measure

cm centimeter
ft feet, foot
in inch
kcmil thousand circular mils
km kilometer
m meter
mm millimeter
ohms-cm ohms-centimeter
V volt
8
ANSI/TIA-607-C
4 REGULATORY
4.1 National requirements

This Standard is intended to conform to the National Electrical Code (NEC ; NFPA-70) and the
National Electrical Safety Code (NESC ; IEEE C2).
4.2 Local code requirements

This Standard does not replace any code, either partially or wholly. Local code requirements
shall be followed. The local code requirements should be reviewed with the local authority hav-
ing jurisdiction (AHJ). The review should confirm the currently adopted code and edition and any
exceptions to the code that are adopted by the governing authority (the AHJ). If no code has
n-
sible for code enforcement in that geographic area.
9
ANSI/TIA-607-C
5 OVERVIEW OF TELECOMMUNICATIONS BONDING AND GROUNDING SYSTEMS
5.1 General
The basic principles, components, and design of telecommunications bonding and grounding
infrastructure specified in this Standard shall be followed amongst buildings of differing designs
and structures.
NOTE The requirements in this Standard differ from utility service provider re-
quirements, which are specified in ATIS 0600313. ATIS 0600313 specifications
support a robust level of service appropriate to a service provider. Users of this
Standard are encouraged to refer to ATIS 0600313 where robust service re-
quirements exist.
Bonding and grounding systems within a building are intended to have one electrical potential.
This is achieved to a large extent by following the requirements and guidelines in clauses 6 and
7 of this standard. For an enhanced bonding infrastructure that facilitates a greater degree of
equipotential bonding, the supplementary bonding infrastructure specifications in clause 7.8
should be used.
While the bonding and grounding of the electrical service entrance is outside the scope of this
Standard, coordination between electrical and telecommunications bonding and grounding sys-
tems is essential for the proper application of this Standard. For example, electrical room and
associated electrical panelboard(s) are not part of the telecommunications infrastructure, but
they are depicted in this Standard because they are integral to the telecommunications bonding
and grounding system. See 7.2.1, 7.2.2, 7.3.1 and 7.3.2 for more information regarding bonding
to electrical panelboards.
When installed, the lightning protection system should meet the requirements of the authority
having jurisdiction (AHJ).
Where a tower or antenna is installed, the installation shall meet the bonding and grounding re-
quirements of ATIS 0600334. See annex B for information regarding bonding and grounding of
towers and antennas.
5.2 Overview of the telecommunications bonding infrastructure
5.2.1 General
Within a building (see illustrative examples figure 3, figure 4 and figure 5), the generic telecom-
munications bonding infrastructure originates at the electrical entrance facility ground and ex-
tends throughout the building. It includes the following major components:
a) primary bonding busbar (PBB);
b) telecommunications bonding conductor (TBC);
and may also include the following:
c) telecommunications bonding backbone (TBB);
d) secondary bonding busbar (SBB); and,
e) backbone bonding conductor (BBC).
These telecommunications bonding
communications pathways and spaces, installed cabling, and administration system.
10
ANSI/TIA-607-C
Distributor Distributor
room room
Backbone
bonding
Equipment conductor Equipment
SBB (BBC) SBB
Pathways
Distributor Distributor
room room
Equipment
Equipment
SBB SBB
Telecommunications
bonding backbone (TBB)
Electrical
entrance
facility Telecommunications Distributor
entrance facility (TEF) room
Equipment
Equipment
Primary bonding busbar (PBB) Secondary bonding busbar

(SBB)
Grounding
Electrode
Conductor
Telecommunications LEGEND
bonding conductor
Grounding (TBC) Structural
Panelboard
electrode metal
system
Busbar
Building spaces
Bonding conductor as labeled

Service equipment
Figure 3 Illustrative example of a multi-story large building
11
ANSI/TIA-607-C
Telecommunications
bonding conductor
(TBC)
Electrical
entrance Primary bonding busbar (PBB) Secondary bonding busbar (SBB)
facility
Equipme nt Equipme nt
Telecommunications Distributor
entrance facility (TEF) room
Telecommunications
bonding backbone (TBB)
LEGEND
Pathways Panelboard
Busbar Building spaces
Bonding conductor
Service equipment as labeled
Figure 4 Illustrative example of a single story large building

Electrical LEGEND
entrance
facility Telecommunications
entrance facility (TEF) Structural metal
Equipment Busbar
Primary bonding busbar

(PBB) Service equipment
Grounding
electrode
conductor
Telecommunications Panelboard
bonding conductor
(TBC)
Grounding electrode system
Building spaces
Bonding conductor as labeled
Figure 5 Illustrative example of a smaller building
5.2.2 Primary bonding busbar (PBB)

The PBB serves as the dedicated extension of the building grounding electrode system for the
telecommunications infrastructure. The PBB also serves as the central attachment point for the
TBB(s) and equipment. See 6.2.1 and 7.2.
5.2.3 Telecommunications bonding conductor (TBC)

The TBC bonds the PBB to the service equipment (power) ground. See 6.3.3 and 7.5.2.
12
ANSI/TIA-607-C
5.2.4 Telecommunications bonding backbone (TBB)

The TBB is a conductor that interconnects all SBBs with the PBB. The intended function of a
TBB is to reduce or equalize potential differences. A TBB is not intended to serve as a ground
fault current return path. The TBB originates at the PBB, extends throughout the building using
the telecommunications backbone pathways, and connects to the SBBs in distributors. See
6.3.2 and 7.5.4.
5.2.5 Secondary bonding busbar (SBB)

The SBB is the bonding connection point for telecommunications systems and equipment in the
area served by a distributor. See 6.2.2 and 7.3.
5.2.6 Backbone bonding conductor (BBC)

When there are multiple TTBs, the BBC is employed to interconnect them through the associat-
ed busbars, either on the same floor in a multi-story building or in the same general area of a
single story building. See 6.3.4 and 7.5.5.
13
ANSI/TIA-607-C
6 TELECOMMUNICATIONS BONDING COMPONENTS
6.1 General
This clause specifies components of the telecommunications bonding infrastructure. Where the
l ponent, the component shall be listed to the ap-
plicable standard(s) through a nationally recognized testing laboratory (NRTL).
6.2 Busbars
6.2.1 Primary bonding busbar (PBB)

The PBB shall:
a) be a busbar provided with holes for use with correctly matched listed lugs and hardware;
b) be made of copper, or copper alloys having a minimum of 95% conductivity when an-
nealed as specified by the International Annealed Copper Standard (IACS);
c) have minimum dimensions of 6.35 mm (0.25 in) thick x 100 mm (4 in) wide and variable
in length; and,
d) be listed.
See 7.2.1 for installation requirements.
Figure 6 illustrates an example of a PBB. Hole spacing, size and pattern may vary.
16 mm 8 mm
(5/8 in) (5/16 in) 13 mm 11 mm dia. (7/16 in), typ
typ typ dia (½ in) 25 mm (1 in)
100 mm
(4 in)
Min.
29 mm 50 mm 11 mm dia 29 mm
(1-1/8 in) (2 in) (7/16 in) (1-1/8 in)
typ Mounting holes, typ typ
Figure 6 Example PBB
6.2.2 Secondary bonding busbar (SBB)

The SBB shall:
a) be a busbar provided with holes for use with correctly matched listed lugs and hardware;
b) be made of copper, or copper alloys having a minimum of 95% conductivity when an-
nealed as specified by the IACS;
c) have minimum dimensions of 6.35 mm (0.25 in) thick x 50 mm (2 in) wide and variable in
length; and,
d) be listed.
14
ANSI/TIA-607-C
Figure 7 illustrates an example of a SBB. Hole spacing, size and pattern may vary.
8 mm 11 mm 13 mm
16 mm (5/16 in) (7/16 in) (½ in)
(5/8 in) dia 11 mm
(7/16 in) dia.
25 mm
50 mm (1 in)
(2 in)
mounting holes
29 mm
(1-1/8 in)
Figure 7 Example SBB
6.2.3 Rack bonding busbar (RBB)

The RBB shall:
a) have a minimum cross-sectional area equal to a 6 AWG wire; and,
b) be listed.
See figure 9 for examples of the use of rack bonding busbars.
6.3 Conductors
6.3.1 General
All bonding conductors shall be copper and may be insulated. When conductors are insulated,
they shall be listed for the application. The bonding conductors shall not decrease in size as the
bonding path moves closer to the termination point of the grounding electrode system.
6.3.2 Sizing the telecommunications bonding backbone (TBB)

The minimum TBB conductor size shall be a 6 AWG. The TBB should be sized at 2 kcmil per
linear foot of conductor length up to a maximum size of 750 kcmil. See table 1.
Improved bonding performance at high frequencies can be achieved by using structural metal in
place of or in addition to a TBB as sized in this clause. See 6.3.5.
15
ANSI/TIA-607-C
Table 1 TBB/BCC conductor size vs length

TBB/BBC linear length Conductor size
m (ft) (AWG)
less than 4 (13) 6
4 6 (14 20) 4
6 8 (21 26) 3
8 10 (27 33) 2
10 13 (34 41) 1
13 16 (42 52) 1/0
16 20 (53 66) 2/0
20 26 (67 84) 3/0
26 32 (85 105) 4/0
32 38 (106 125) 250 kcmil
38 46 (126 150) 300 kcmil
46 53 (151 175) 350 kcmil
53 76 (176 250) 500 kcmil
76 91 (251 300) 600 kcmil
Greater than 91 (301) 750 kcmil
6.3.3 Sizing the telecommunications bonding conductor (TBC)

The TBC shall be, as a minimum, the same size as the largest TBB.
6.3.4 Sizing the backbone bonding conductor (BBC)

The BBC shall be, as a minimum, the same size as the largest TBB to which it is connected.
6.3.5 Use of structural metal
6.3.5.1 General
place of a TBB, a BBC or both. Before utilizing structural metal in place of a TBB or a BBC,
building plans (including as-builts as applicable) and specifications shall be reviewed to ensure
the structural metal is electrically continuous or can be made so. Additionally, the two point con-
tinuity test as described in 9.1, or equivalent, should be performed on the structural metal to ver-
ify electrical continuity and acceptable resistance along the paths used as bonding conductors.
Concrete reinforcing steel shall not be used as a TBB or a BBC.
6.3.5.2 Connections to the PBB/SBB

The bonding conductor from the structural metal to the PBB or SBB shall be sized according to
table 1. Additionally, this conductor should be no smaller than any conductor that comprises the
telecommunications bonding backbone system. Bonds to structural metal shall be made using
listed exothermic welding, listed compression, or listed mechanical connectors and shall be ac-
16
ANSI/TIA-607-C
cessible. Bonds to the PBB or SBB shall be made as specified in 7.2.2 and 7.3.2, respectively.
Components to be connected to the PBB or SBB shall be as specified in 6.2.1 and 6.2.2, re-
spectively.
6.4 Connectors
All bonding connectors shall be listed for the application.
NOTE Connectors are listed for the application (e.g., above ground, direct bur-
ied).
The surface of all bonding connectors used on a PBB and an SBB shall be of a material that
provides an electro-chemical potential of <300 mV between connector and bonding busbar.
6.5 Identification
6.5.1 Conductors
Where insulated, the TBC and each TBB, BBC, TEBC, RBC and UBC, shall be green, green
with yellow stripe, or marked with a distinctive green color.
6.5.2 Labels
Labels shall include the information depicted in figure 8.
IF THIS CONNECTOR OR CABLE IS

LOOSE OR MUST BE REMOVED,
PLEASE CALL THE BUILDING
TELECOMMUNICATIONS
MANAGER
Figure 8 Label for bonding and grounding conductors
17
ANSI/TIA-607-C
7 DESIGN REQUIREMENTS
7.1 General
Metallic sheaths of outside plant cables entering a facility shall be bonded to ground as close as
.
Where the building backbone telecommunications cabling incorporates a shield or metallic
member, this shield or metallic member shall be bonded to the primary bonding busbar (PBB) or
the secondary bonding busbar (SBB) o-
able sheath.
When secondary protection is provided, the secondary protector grounding conductor (or termi-
nal) shall be connected to the nearest PBB or SBB using the shortest practical path.
Grounding through the equipment alternating current (ac) power cord does not meet the intent
of this Standard. It is intended that the information technology equipment (ITE) be provided a
supplementary and specific ground path for the equipment over and above the required ac or
direct current (dc) power ground path. While the ac or dc powered equipment typically has a
power cord that contains a grounding/bonding wire, the integrity of this path to ground cannot be
easily verified. Rather than relying wholly on the ac or dc power cord grounding/bonding wire, it
scribed in
this Standard.
NOTE Many types of equipment do not require individual bonding conductors
and as such do not have an attachment point for bonding conductors. Equipment
that does not have attachment points for bonding conductors may be bonded ei-
documentation for guidelines.

Metallic pathways under 1 m (3 ft) in length (e.g., wall and floor sleeves, J-hooks) are not re-
quired to be bonded. Additionally, this Standard does not require bonding of the steel bars of a
reinforced concrete building.
See ANSI/NECA/BICSI-607 for installation information on telecommunications bonding and
grounding.
7.1.1 Telecommunications entrance room or space

The telecommunications entrance room or space is the entrance point within a building where:
a) the telecommunications facilities enter;
b) the joining of campus and building backbone facilities takes place; and,
c) the grounding of these facilities is accomplished.
The entrance room or space may also include antenna cable entrances (see annex B), and
electronic equipment serving telecommunications functions.
It is desirable that all utilities enter the building in close proximity to each other.
7.1.2 Distributor rooms

Each distributor room shall contain either a PBB or a minimum of one SBB. Distributor A and
Distributor B shall contain a minimum of one SBB. The PBB and the SBB shall be located within
the distributor room so as to provide the greatest flexibility and accessibility for telecommunica-
18
ANSI/TIA-607-C
tions system bonding (minimizing practical lengths and number of bends of bonding conductors
to the SBB).
7.1.3 Computer rooms

Each computer room shall contain a SBB (or PBB when specified in the design) and should also
contain a supplementary bonding network that is bonded to the SBB or PBB. This supplemen-
tary bonding network may be in a form as identified in 7.8 but is typically a mesh-bonding net-
work (mesh-BN).
T
mesh-BN, mesh isolated bonding network (mesh-IBN), or other form of bonding network (BN),
within the same room. The supplementary bonding conductor network shall be bonded to the
BB. The BN may also provide for electromagnetic shielding in varying degrees
based upon its design and installation.
A recommended augmentation to a BN (especially a mesh-BN) is a supplementary bonding grid
(SBG). Upon installation and connection of the SBG to the BN (primary components are cabi-
nets, racks and frames), the SBG becomes part of the overall BN. The SBG typically covers the
entire computer room or a local area within a room.
The minimum density of the bonding grid shall be 3 m (10 ft) centers or one that corresponds to
the computer room cold-or-hot aisles and the aisles running perpendicular to the cold-and-hot
aisles. For better high-frequency performance or lower impedance a minimum spacing of 0.6 m
(2 ft) is recommended.
7.1.4 Cabinets and racks

Metallic enclosures, including telecommunications cabinets and racks, shall be bonded to the
mesh-BN, SBB, or PBB using a minimum sized conductor of 6 AWG.
Cabinets, racks, and other enclosures shall not be bonded serially; each shall have their own
dedicated bonding conductor to the mesh-BN, SBB, PBB or TEBC.
Equipment containing metallic parts and patch panels for shielded cabling in cabinets and racks
shall be bonded to the telecommunications bonding system in accordance with the manufactur-
er instructions. Where instructions are not given, all bonding conductors that connect these in-
stalled products shall be a minimum sized conductor of 12 AWG. Rack bonding busbars (RBBs)
are recommended for cabinets and racks that need to support multiple unit bonding conductors.
There are three methods to bond the equipment located in the equipment rack or cabinet to the
telecommunications bonding system, see figure 9.
When an RBB is used as the bonding means within a rack or cabinet, the rack or cabinet shall
be bonded to the RBB. When there is no RBB, and the equipment is bonded through individual
unit bonding conductors to an RBC, the rack or cabinet shall be bonded to the RBC.
Rack isolation pads should be provided when racks are installed on conductive surfaces (e.g.,
steel-reinforced concrete slabs).
Cabinets and racks with DC powered equipment may require that the RBB be isolated from the
cabinet. In this case, the cabinet/rack and RBB would each have their own 6 AWG or larger
bonding conductor to the mesh-BN, SBB, or PBB.
19
ANSI/TIA-607-C
Telecommunications equipment bonding conductor (TEBC)

To PBB/SBB
Irreversible crimp connector Top-mounted RBB
Rack bonding
conductors All
conductors routed
to PBB/SBB
Unit bonding
conductors
2U
4U 4U
4U Unit bonding
Individual equipment
conductors
bonding conductors
from each piece of 2U 2U
equipment and rack to
the rack bonding
conductor
2U 2U 2U
Vertically-
mounted RBB
2U 2U 2U
2U 2U 2U
2U 2U
Individual
equipment
Rack bonding
grounding terminal
conductor extended to
(typical each piece
bottom of rack to
of equipment)
accommodate future
growth
Rack isolation
pads (if
applicable)
Example A Example B Example C
Figure 9 Example of three methods to bond equipment and racks
7.1.5 Metallic pathways

In order to limit the potential difference between telecommunications pathways or between tele-
communications pathways and power pathways, all metallic telecommunications pathways shall
be bonded to the PBB or SBB. Additionally, to achieve the objectives of potential equalization,
cable tray sections shall be bonded together and shall be bonded to the PBB or SBB.
7.1.6 Structural metal

Where structural metal is accessible and in the same room as the PBB/SBB, the PBB/SBB shall
be bonded to structural metal using a minimum sized conductor of 6 AWG. When practical, be-
cause of shorter distances and where horizontal steel members are permanently electrically
bonded to vertical column members, the PBB/SBB may be bonded to these horizontal members
in lieu of the vertical column members. When the structural metal is external to the room, but
readily accessible, it should be bonded to the PBB/SBB using a minimum sized conductor of
6 AWG. Structural metal should be tested to verify its conductivity to earth.
NOTE Modern building construction techniques will bond structural metal to the
main ac power entrance or another grounding source. Ensure that when working
in existing buildings that the structural metal is bonded to a suitable ground
source (e.g., electrical power grounding electrode[s], building ground ring).
20
ANSI/TIA-607-C
7.2 Primary bonding busbar (PBB)
7.2.1 General
The length of the PBB is not specified within this Standard. It is desirable that the busbar be
electrotin-plated for reduced contact resistance. The busbar shall be cleaned and an anti-
oxidant should be applied prior to fastening connectors to the busbar.
The desirable location of the PBB is in the telecommunications entrance room or space. Typi-
cally, there should be a single PBB per building.
NOTE For buildings with more than one electrical service entrance, each of
which serves telecommunications equipment, the user is urged to consult with a
licensed engineer for guidance on locating the PBB.
The PBB shall be as close as practical to the panelboard (electrical power panel) and shall be
installed to maintain clearances required by applicable electrical codes. A practical location for
the PBB is to the side of the panelboard (where provided). The vertical location of the PBB
should be determined by considering whether the bonding conductors are routed in an access
floor or overhead cable support. Its placement should provide for the shortest and straightest
practical routing of the telecommunications bonding conductor (TBC) and the primary protector
grounding conductor (see annex C for more information on telecommunications electrical pro-
tection primary protector grounding). Additionally, the PBB shall be insulated from its support
using an insulator that is listed for the purpose by a nationally recognized testing laboratory
(NRTL). A minimum of 50 mm (2 in) separation from the wall is recommended to allow access
to the rear of the busbar.
When a panelboard for telecommunications equipment is not installed in the telecommunica-
tions entrance room or space, the PBB should be located near the backbone cabling and asso-
ciated terminations. In addition, the PBB should be located so that the TBC is as short and
straight as practical.
The PBB should serve telecommunications equipment that is located within the same room or
space. The PBB serves as the central bonding busbar for the telecommunications bonding in-
frastructure. It also serves as the bonding busbar for equipment located in the telecommunica-
tions entrance room or space.
7.2.2 Bonds to the PBB

When a panelboard is located in the same room or space as the PBB t-
ing current equipment ground (ACEG) bus (when equipped) or the panelboard enclosure shall
be bonded to the PBB.
The primary protector grounding conductor shall be connected to the PBB. This conductor is
intended to conduct lightning and ac fault currents from the telecommunication primary protec-
tors. A minimum of 0.3 m (1 ft) separation shall be maintained between this conductor and any
dc power cables, switchboard cable, or high frequency cables, even when placed in metal con-
duit.
When the outside plant cables in the telecommunications entrance room or space incorporate a
cable shield isolation gap, the cable shield on the building side of the gap shall be bonded to the
PBB.
All metallic pathways for telecommunications cabling located within the same room or space as
the PBB shall be bonded to the PBB. However for metallic pathways containing bonding con-
21
ANSI/TIA-607-C
ductors where the pathway is bonded to the bonding conductor, no additional bond to the PBB
is required.
7.2.3 Connections to the PBB

The connections of the TBC and the telecommunications bonding backbone (TBB) to the PBB
shall utilize exothermic welding, listed compression two-hole lugs, or listed exothermic two-hole
lugs.
The connection of conductors for bonding telecommunications equipment and telecommunica-
tions pathways to the PBB shall utilize exothermic welding, listed compression two-hole lugs, or
listed exothermic two-hole lugs.
7.3 Secondary bonding busbar (SBB)
7.3.1 General
The length of the SBB is not specified within this Standard. It is desirable that the busbar be
electrotin-plated for reduced contact resistance. The busbar shall be cleaned and an anti-
oxidant should be applied prior to fastening connectors to the busbar.
The SBB shall be as close as practical to the panelboard and shall be installed to maintain
clearances required by applicable electrical codes. A practical location for the SBB is to the side
of the panelboard (where provided). The vertical location of the SBB should be determined by
considering whether the bonding conductors are routed in an access floor or overhead cable
support. Additionally, the SBB shall be insulated from its support using an insulator that is listed
for the purpose by a NRTL. A minimum of 50mm (2 in) separation from the wall is recommend-
ed to allow access to the rear of the busbar.
When a panelboard for telecommunications equipment is not installed in the same room or
space as the SBB, that SBB should be located near the backbone cabling and associated ter-
minations.
The bonding conductor between a TBB and an SBB shall be continuous and routed in the
shortest practical straight-line path.
Multiple SBBs may be installed within the same Distributor to aid in minimizing bonding conduc-
tor lengths and minimizing terminating space.
7.3.2 Bonds to the SBB

Where a panelboard is located in the same room or space as the SBB
bus (when equipped) or the panelboard enclosure shall be bonded to the SBB.
When a panelboard for telecommunications equipment is not in the same room or space as the
SBB, that SBB should be bonded to the panelboard that feeds the distributor.
The TBBs and other SBBs within the same space shall be bonded to the SBB with a conductor
the same size as the TBB. In all cases, multiple SBBs within a room shall be bonded together
with a conductor the same size as the TBB or with splice bars.
Where a backbone bonding conductor (BBC) is required, it shall be bonded to the SBB.
All metallic pathways for telecommunications cabling located within the same room or space as
the SBB shall be bonded to the SBB. However, for metallic pathways containing bonding con-
ductors where the pathway is bonded to the bonding conductor, no additional bond to the SBB
is required.
22
ANSI/TIA-607-C
7.3.3 Connections to the SBB

The connection of the TBB to the SBB shall utilize exothermic welding, listed compression two-
hole lugs, or listed exothermic two-hole lugs.
The connection of conductors for bonding telecommunications equipment and telecommunica-
tions pathways to the SBB shall utilize exothermic welding, listed compression two-hole lugs, or
listed exothermic two-hole lugs.
7.4 Rack bonding busbar (RBB)
7.4.1 General
The length of the RBB is not specified in this Standard. The busbar shall be cleaned and a
compatible anti-oxidant should be applied prior to fastening connectors to the busbar. The RBB
shall be installed horizontally or vertically on the rack using insulators which provide a minimum
of 19 mm (0.75 in) separation.
7.4.2 Bonds to the RBB

The RBB shall be bonded to either the rack bonding conductor or to the telecommunications
equipment bonding conductor and to the rack.
7.4.3 Connections to the RBB

The connection of the rack bonding conductor or the telecommunications equipment bonding
conductor to the rack shall utilize exothermic welding, listed compression two-hole lugs, or listed
exothermic two-hole lugs.
The unit bonding conductor should be connected to the RBB using a listed compression con-
nector and to the grounding post of the telecommunications equipment if provided.
7.5 Conductors
7.5.1 General
Bonding conductors for telecommunications should not be placed in ferrous metallic conduit. If it
is necessary to place bonding conductors in ferrous metallic conduit the conductors shall be
bonded to each end of the conduit using a grounding bushing or using a minimum sized con-
ductor of 6 AWG at both ends of the conduit.
7.5.2 Bend radius and included angle

Bends of bonding conductors terminating at the PBB or SBB shall have a minimum inside bend
radius of 200 mm (8 in). At other locations, bends in bonding conductors should be made with
the greatest practical inside bend radius. A minimum bend radius of 10 times the bonding con-
ductor diameter is recommended. In all cases, a minimum included angle of 90º shall be used.
See figure 10 for illustrations of bend radius and included angle.
23
ANSI/TIA-607-C
Bend
radius
90° minimum
Figure 10 Illustration of bend radius and included angle
7.5.3 Telecommunications bonding conductor (TBC)

The TBC shall bond the PBB to the service equipment (power) ground. Figure 11 schematically
depicts this connection to the service equipment (power) ground.
Electrical entrance Telecommunications
facility entrance facility
TBB
Service
equipment
N
Equipment
G PBB
Telecommunications
Grounding bonding conductor
electrode (TBC)
system Outside the scope of this Standard
Within the scope of this Standard
Figure 11 Bonding to the service equipment (power) ground
7.5.4 Telecommunications bonding backbone (TBB)

The type of building construction, building size, general telecommunications requirements, and
the configuration of the telecommunications pathways and spaces should be considered when
designing the TBB. Specifically, the design of a TBB shall:
a) be connected to the PBB;
b) be consistent with the design of the telecommunications backbone cabling system (e.g.,
follow the backbone pathways);
c) permit multiple TBBs as necessary (e.g., multiple distributors per floor; see figure 2);
24
ANSI/TIA-607-C
d) be continuous from the PBB to the furthest SBB to which it is connected (i.e., not be dai-
sy-chained from busbar to busbar); and,
e) minimize, to the extent practical, the lengths of the TBB(s).
TBB conductors shall be protected from physical and mechanical damage. The TBB conductors
should be installed without splices, however, where splices are necessary, the number of splic-
es should be minimized. Splices shall be accessible and be located in telecommunications
spaces. Joined segments of a TBB shall be joined by means of a listed exothermic weld, listed
irreversible compression-type connectors, or equivalent. All joints shall be adequately supported
and protected from damage.
Metallic cable shield(s) or any metal pathway for cable (e.g., conduit) shall not be used as a
TBB nor shall water piping systems be used as a TBB
7.5.5 Backbone bonding conductor (BBC)

Whenever two or more TBBs are used within a multistory building, the TBBs shall be bonded
together with a BBC at the top floor and at a minimum of every third floor in between to the low-
est floor level (see figure 3). Whenever two or more TBBs are used within a large single-story
building, the TBBs shall be bonded together with a BBC at the location farthest from the PBB
and at a maximum distance of every 10 m (33 ft) back to the PBB.
7.5.6 Coupled bonding conductor (CBC)

CBCs provide protection against electromagnetic interference (EMI) through close proximity and
may be integral to the cabling system. The CBC:
a)
b) may be separate conductors that are tie wrapped to communication cables; and,
c) are typically sized at 10 AWG, although 6 AWG is recommended.
7.5.7 Bonding conductors for connections to the mesh-BN or RBB

Bonding conductors used to bond components to the mesh-BN or RBB shall:
a) be stranded copper conductors;
b) be neatly routed and no longer than practical to bond the component to the mesh-BN or
RBB;
c) be secured at no greater than 0.9 m (3 ft) intervals;
d) not be routed so as to create a tripping hazard or impair access to equipment;
e) not be attached with any method that could damage the conductors;
f) be listed as suitable for bonding applications;
g) be available for use in the space in which they will be placed;
h) have a green jacket or green jacket with yellow stripe, or where bare conductors are de-
ployed, they shall be supported by standoff insulators at intervals no greater than 0.6 m
(2 ft) or be contained in electrical nonmetallic tubing (ENT). Bare bonding conductors
shall not be in contact with metallic surfaces or other conductors that are not part of the
telecommunications bonding system;
i) be installed using low-emission listed exothermic welds, where exothermic welds are
specified and within a room with electronics; and,
25
ANSI/TIA-607-C
j) where placed in ferrous metallic conduit that is greater than 0.9 m (3 ft), be bonded to
each end of the conduit using a grounding bushing or with a minimum sized conductor
of 6 AWG.
7.5.8 Telecommunications equipment bonding conductor (TEBC)
7.5.8.1 General
The TEBC connects the PBB/SBB to equipment racks/cabinets. More than one TEBC may be
installed from the PBB/TBG (e.g., a separate TEBC per rack). The TEBC shall be a continuous
copper conductor that is sized not less than a 6 AWG or as the largest size equipment ground-
ing conductor in the ac branch power circuit(s) serving the racks/cabinet lineup.
NOTE Cable shields, metal conduit, cable runway or ladder, or any other me-
tallic cable pathway do not satisfy the requirements for a TEBC.
Connections to the TEBC shall be made with listed irreversible compression connectors, suita-
ble for multiple conductors, and with the rack bonding conductors (RBCs) routed toward the
PBB/SBB, see figure 12.
The TEBCs may be routed within cable trays, on the outside of ladder rack, tray supported at no
greater than 0.9 m (3 ft) intervals, or along equipment platforms, see figure 13. Examples of ac-
ceptable means of supporting the TEBCs include the use of lay-in lugs, cable brackets, and
other brackets designed for this purpose.
An alternative method to running TEBCs overhead is to route them under an access floor. All
requirements set forth for running the bonding conductors specified in this Standard shall apply.
Irreversible compression
connection
TEBC (Telecommunications
equipment bonding
conductor)
Rack bonding
conductor
Figure 12 Example TEBC to rack bonding conductor connection
26
ANSI/TIA-607-C
Cable tray bonding

conductor. Typical at each
section connection point
Telecommunications To PBB/SBB
equipment bonding
Irreversible
conductor (TEBC)
crimp connector
Figure 13 Example of a TEBC routed on cable tray
7.5.8.2 Separation
TEBCs shall be separated a minimum of 50.8 mm (2 in) from conductors of other cable groups
such as power or telecommunications cables. For mm
(2 in) under or off the side of a cable tray. An exception may be when conductors are grouped
together to enter or exit a cabinet or enclosure. Grouping only at this point is acceptable, pro-
vided the conductors are suitably separated on either side of the opening.
TEBCs shall be separated from ferrous material by a distance of at least 50 mm (2 in) where
achievable, or be effectively bonded to the ferrous material.
7.6 Bonding equipment cabinets/equipment racks to the TEBC

The TEBC shall be connected to the cabinets/equipment racks, to an RBC or to a verti-
cal/horizontal RBB. Each cabinet or equipment rack shall have a suitable connection point to
which the bonding conductor can be terminated. Properly sized listed two-hole compression
lugs or listed terminal blocks with two internal hex screw or equivalent torque characteristics
shall be used at this connection point. See figure 14.
27
ANSI/TIA-607-C
Figure 14 Illustration of connection point to a rack from a TEBC
7.7 Structural bonding of equipment cabinets/equipment racks

For a welded cabinet/equipment rack, the welded construction serves as the method of bonding
the structural members of the cabinet/rack together.
For a bolted cabinet/equipment rack, bonding continuity cannot be assumed through the use of
normal frame bolts used to build or stabilize equipment cabinets and racks. Bonding hardware,
such as bolts, washers, nuts and screws, specifically designed to accomplish integral bonding of
the cabinet and rack assembly, frame and support, and tested to meet applicable NRTL re-
quirements are an acceptable bonding means. However, if bolts, nuts and screws for cabinet
and rack assembly and support are not specifically designed for bonding purposes, the paint
shall be removed from all bonding contact areas. In any case, removal of the paint from all
bonding contact areas is recommended.
All detachable, metallic parts of equipment cabinets (e.g. frame, door, side panel, top panel)
shall be bonded, either directly by means of bonding jumpers or through the cabinet frame, to
the connection point on the cabinet where the cabinet bonding conductor connects to the cabi-
net.
When a detachable, metallic part of an equipment cabinet is connected by a bonding jumper,
the jumper shall be a minimum sized conductor of 12 AWG stranded, high strand count, insulat-
ed copper conductor with green or green with yellow stripe jacket. Also, the bonding jumper
should have an easily visible quick connect to facilitate detaching and attaching the panel or
door. See Figure 15.
28
ANSI/TIA-607-C
Figure 15 Illustration of a bond connection from a cabinet to the cabinet door
7.8 Supplementary bonding networks

The supplementary bonding network is in addition to the infrastructure bonding network speci-
fied in clause 6. The supplementary bonding network provides for a greater degree of equipo-
tential bonding to that provided by the required bonding conductors. Supplementary bonding
networks are always bonded to the CBN within the building. Equipotential bonding may help mit-
igate issues caused by steady-state and transient voltages and currents generated by lightning,
power systems, power circuit ground faults and EMI.
Supplementary bonding networks are described in detail in ITU-T K.27, ATIS 0600333 and
IEEE 1100 and identified for ITE as the following primary topologies:
a) mesh-BN Generally, the default topology as most ITE has intra/inter intentional and
unintentional metallic interconnections. A mesh-BN augments the CBN by increasing the
local density of conductors and functions by attempting to diversify and limit the radio
frequency (RF) capture-loop area of the current paths such that the current density on
any conductor or conductive loop is reduced to an acceptable level.
NOTE IEEE -CBN)
- hangeable, de-
pending on application and context. However, within this Standard, the term
mesh-BN is used.
b) mesh-isolated bonding network (IBN) Generally can be described as a mesh-BN func-
tional system block that is arranged into a single point bonding entity that is isolated from
the CBN except for at one controlled location a single point connection (SPC). The IBN
topology is known to provide high robustness to building lightning and power fault cur-
IBN. The IBN topology functions by attempting to block extraneous currents (such as
29
ANSI/TIA-607-C
lightning) from flowing within the CBN and then entering and traversing through the IBN.
This topology is especially robust to transients occurring in the CBN.
c) Star IBN An IBN deployed into a star network instead of a mesh network.
7.8.1 Mesh-BN
A mesh-BN is a bonding network to which all associated equipment cabinets, frames and racks
and cabling pathways are bonded together as well as at multiple points to the CBN (see figure
16).
Figure 16 A mesh-BN with equipment cabinets, frames, racks and CBN bonded
together
If the mesh-BN is constructed from flat conductors, the mesh-BN should be prefabricated of
minimum 0.4 mm (0.0159 in; 26 gauge) x 50 mm (2 in) wide copper strips with all crossings and
joined sections properly welded.
30
ANSI/TIA-607-C
Where the mesh-BN is constructed from bare round wire, the conductors shall be a minimum
sized conductor of 6 AWG copper conductors joined together via exothermic welding, brazing,
listed compression connectors, or listed grounding clamps at each of the crossing points.
If the mesh-BN is constructed using the access-floor pedestals, the flooring system shall be
electrically continuous. The mesh-BN shall be bonded together no further than every 3.7 m (12
ft) (approximately 6 pedestals) in each direction using a minimum sized conductor of 6 AWG
copper and listed pedestal grounding clamps. Bonding is recommended at least every 2.4 m (8
ft) (approximately 4 pedestals) in every direction.
The mesh-BN shall have the following connections:
a) 6 AWG or larger bonding conductor to the PBB or SBB in the computer room:
b) 6 AWG or larger bonding conductor to each ITE cabinet and rack cabinets and racks
shall not be bonded serially;
c) A bonding conductor to the ground bus for each power distribution unit (PDU) or panel
board serving the room, sized per NEC mmenda-
tions;
d) 6 AWG or larger bonding conductor to heating, ventilating, and air-conditioning (HVAC)
equipment Each piece of HVAC equipment shall be bonded individually to the mesh-
BN;
e) 6 AWG or larger bonding conductor to each structural metal column in the computer
room;
f) 6 AWG or larger bonding conductor to each metallic cable tray and cable runway in the
room they may be bonded in series;
g) 6 AWG or larger bonding conductor to each metallic conduit, water pipe, metallic air duct
in the room they may be bonded in series;
h) 6 AWG or larger bonding conductor to every 4 to 6 access floor pedestal in each direc-
tion.
7.8.2 Mesh-IBN
A mesh-IBN is a mesh-topology bonding network that has a SPC to either the CBN or another
IBN (see figure 17). The mesh-IBN is typically limited to a restricted area within a building such
as in a computer room. The mesh-IBN is not typical (but can be utilized) for a commercial envi-
ronment or computer room but is recognized and sometimes utilized in the access provider cen-
tral office and computer room. The primary benefit of the IBN is the blocking of building currents,
such as lightning and power faults, from entering into the IBN.
NOTE -
are described in ITU-T K.27 and IEEE 1100.
The mesh-IBN components such as associated equipment cabinets, frames, racks and cabling
pathways are insulated from the CBN except for one controlled SPC location to the CBN. The
SPC location applies to all bonding conductors (including power circuits) entering or exiting the
mesh-IBN. Due to isolation from the CBN, except at the controlled SPC, the mesh-IBN is said to
For a mesh-IBN, an under-access-floor, the SBG is typically only directly connected to the serv-
ing PBB or SBB in order to not violate the isolation requirements for the mesh-IBN. An above
cabinet/rack SBG can be more easily incorporated where desirable into the mesh-IBN by means
of insulating devices between the bonding grid and any nearby CBN components.
31
ANSI/TIA-607-C
To PBB or SBB
Figure 17 A mesh-IBN having a single point of connection
7.8.3 Bonding conductor for connections to the supplementary bonding network

Bonding conductors used to bond components to the supplementary bonding network shall:
a) be copper conductors;
b) be neatly routed in as straight a line as practical and be no longer than required to bond
the component to the supplementary bonding network;
c) be secured at no greater than 0.9 m (3 ft) intervals;
d) not be routed so as to create a tripping hazard or impair access to equipment;
e) not be attached with any method that could damage the conductors;
f) be listed as suitable for bonding/grounding applications;
g) as available for use in space in which they will be placed, have a green jacket or green
jacket with yellow stripe, or where bare conductors are deployed, they shall be support-
ed by standoff insulators at intervals no greater than 0.6 m (2 ft) or be contained in elec-
trical non-metallic tubing (ENT). Bare bonding conductors shall not be in contact with
metallic surfaces that are not part of the telecommunications bonding system;
h) be installed using low-emission listed exothermic welds, where exothermic welds are
specified and within a room with electronics; and,
i) where placed in ferrous metallic conduit that is greater than 0.9 m (3 ft), be bonded to
each end of the conduit using a grounding bushing or with a minimum 6 AWG conductor.
7.9 Administration
Each telecommunications bonding conductor shall be labeled at its points of termination. Labels
shall be located on conductors as close as practical to their points of termination in a readable
position. Refer to ANSI/TIA-606-B for additional labeling requirements.
32
ANSI/TIA-607-C
8 EXTERNAL GROUNDING
8.1 Grounding resistance
8.1.1 Minimum requirements

The requirements of this clause are met by the use of an NFPA 70 compliant grounding elec-
trode system.
The grounding electrode system shall be designed to have a resistance of 25 ohms or less for a
single grounding electrode. If 25 ohms cannot be achieved or maintained throughout the year
with a single grounding electrode, then the grounding electrode shall be augmented by at least
one additional grounding electrode. One should take into account the soil resistance due to
seasonal fluctuations. It is recommended to use two grounding electrodes as the minimum in-
stallation, even if 25 ohms is achieved with a single grounding electrode.
8.1.2 Enhanced requirements

The grounding electrode system for sites that are critical in nature (e.g., public safety facilities,
military installations, data centers, web hosting facilities, central offices) shall be designed to
have a resistance of 10 ohms or less, preferably 5 ohms or less. The grounding electrode sys-
tem design should take into account seasonal fluctuations such as moisture and temperature.
8.2 Grounding electrode system design
8.2.1 General
A telecommunications grounding electrode system is supplemental and connected to the struc-
ectrode system. Whereas the primary purpose of the electrical
stem is
intended to provide enhanced equipment protection and system performance.
Adequate design measures should be taken to obtain a low resistance grounding electrode sys-
tem. Poor soil conditions or limited space may make this difficult to achieve. Potential equaliza-
tion is of greater importance than low resistance. Proper design methods should focus on estab-
lishing an equal potential ground plane, which has the lowest practicable ground resistance.
8.2.2 Soil resistivity testing

Soil resistivity tests shall be conducted for all sites prior to the design of the grounding electrode
system. See 9.3.
8.2.3 Low resistance

The single largest factor impacting grounding electrode system resistance is soil resistivity.
Therefore, it is imperative to have this measurement before designing the grounding electrode
system. Of secondary importance are the soil physical characteristics and the area available for
installation. Soil resistivity varies with the composition of the soil (e.g., clay, sand, gravel), depth
of the soil (e.g., stratification of soil compositions), soil temperature, and the amount of moisture
content in the soil. Once the soil resistivity values have been determined using the 4 point test-
ing method (see 9.3.2), and the soil physical characteristics and area available have been de-
termined, an effective grounding electrode system can be designed. It is possible to estimate
ground resistance by performing simple calculations. However, software design tools are the
33
ANSI/TIA-607-C
most common means of designing grounding electrode systems due to their ability to model soil
conditions in detail.
8.2.4 Potential equalization

Where telecommunications equipment is distributed throughout a structure and may be inter-
connected by metallic links, the minimally required grounding system (Section 3.1.2) may not be
adequate. Facilities with advanced requirements (see Section 3.1.3) or distributed equipment
will benefit from the addition of a building perimeter ground loop. The ground loop shall be:
a) constructed with a minimum of a 2 AWG solid tinned copper conductor (4/0 AWG
stranded is preferred);
b) buried at least 75 cm (30 in) deep, and at least 15 cm (6 in) below the frost line;
c) located at least 1 m (3 ft) from the building wall, preferably beyond the drip line; and
d) located no more than 2 m (6 ft) from the building wall.
Ground rods used in conjunction with the building perimeter ground loop shall be listed, at least
3 m (10 ft) in length, and at least 16 mm (0.625 in) nominal in diameter. Ground rod spacing be-
tween any two ground rods should be at least the sum of their driven lengths.
The ground loop shall be connected to steel columns around the perimeter of the structure at
intervals averaging not more than 18 m (60 ft).
Where separately derived electrical systems are present, they should be bonded to the same
ground ring electrode.
Test wells should be provided to give access to the ground loop for future ground testing pur-
poses.
8.2.5 Design configuration

There are multiple grounding electrode system configurations available to the designer such as
ground loop conductors, radials and ground grids. Soil resistivity, soil physical characteristics
and area will be the determining factor when choosing the configuration. Ground rods are the
most common form of electrode because they can be driven into the earth with limited excava-
tion and backfilling. However, there are also different types of electrodes that can lower the re-
sistivity of the grounding electrode system such as electrolytic ground rods and low resistance
backfill material. It is common to combine these different options, depending upon the soil con-
ditions, in an electrode system installation. See Annex B for details related to the different types
of electrodes available. Annex C provides grounding details specific to towers and antennas.
Regardless of the grounding design configuration, all grounding electrodes for a given facility
shall be bonded into a single grounding electrode system. In addition, underground metallic pip-
ing within 2 m (6 ft) of the building perimeter shall be bonded to the grounding electrode system.
34
ANSI/TIA-607-C
9 PERFORMANCE AND TEST REQUIREMENTS
9.1 Two-point ground/continuity testing

This procedure will help determine if there is an acceptable level of resistance between any
point in the telecommunications bonding system and the
trode system. The test is performed using an earth ground resistance tester that is configured
for a continuity test, otherwise known as a two-
The earth ground resistance tester generates a specific alternating current (ac) test current; this
current is less susceptible to the influences of stray currents in the grounding system. This
makes the ground resistance test a more accurate testing device than a standard volt-ohm-
milliammeter.
Prior to two-point ground testing, a visual inspection shall be performed to verify that the bond-
ing system is installed according to the guidelines in this Standard. Due to the possibilities of
ground faults traveling through the telecommunications bonding system, a voltage test should
be performed prior to conducting the two-point continuity test and verified with the test equip-
does not interfere with this test.

The test is typically performed by connecting one
grounding electrode and the other test lead to a specific point on the telecommunications bond-
ing system such as the PBB. This same test can also verify continuity between any two points of
the telecommunications bonding system such as between the PBB and a SBB.
It is recommended that this test be performed in the following areas:
a) PBB/SBB to the electrical ground in Distributors
b) PBB/SBB to the structural metal (if present)
c) PBB to SBB
d) Structural metal (if present) to the electrical ground.
In order for this test to be valid it should be done before the telecommunications equipment is
installed otherwise parallel paths may invalidate test results.
The recommended maximum value for resistance between any point in the telecommunications
milliohms. In the
case of long TBB and BBC conductor runs, the resistance of the conductor shall be factored into
the total resistance. For example 1 km of a 3/0 AWG conductor has a resistance of
0.2028 ohms. (0.06180 ohms per 1000 ft).
9.2 Grounding electrode system testing
9.2.1 Three-pole fall-of-potential method

The three-pole fall-of-potential measurement method measures the ability of an earth ground
system, or individual electrode, to dissipate energy from a site. The test instrument manufactur-
-pole fall-of-potential resistance meas-
urement.
Typically, the measurement method involves disconnecting the earth electrode from its connec-
tion to the site, placing two earth stakes in the soil in a direct line away from the earth electrode
and connecting the test instrument cords.
35
ANSI/TIA-607-C
WARNING Connecting and removing connections to a bonding and grounding

system could have hazardous consequences.
The distance between the stakes and the ground electrode may vary depending upon the test
instrument instruction. A general stake distance is given in table 2 and illustrated in Figure 18.
A known energy potential is generated by the instrument between the outer stake and the earth
electrode. The drop in potential is measured between the inner stake and the earth electrode.
To test the accuracy of the results, and to ensure that the ground stakes are outside the
spheres of influence, reposition the inner stake (probe) 1 m (3 ft) in either direction and take a
fresh measurement. If there is a significant change in the reading (30 %), increase the distance
between the ground rod under test, the inner stake (probe) and the outer stake (auxiliary
ground) until the measured values remain fairly constant when repositioning the inner stake
(probe).
Table 2 Stake distance
Depth of ground electrode Distance to inner stake Distance to the outer stake
2m 15 m 25 m
3m 20 m 30 m
6m 25 m 40 m
10 m 30 m 50 m
36
ANSI/TIA-607-C
Figure 18 Illustration of test instrument connections
9.2.2 Clamp-on test meter

-on test instrument when
making a ground resistance measurement. The instrument has a transmitter and receiver built
into a split core head that allows the instrument to clamp onto the ground under test. The in-
strument can be used in multi-grounded systems without disconnecting the ground under test.
However, the clamp-on test instrument should not be used in the following situations:
a) to commission new grounds, as they will not likely be connected to the utility power sup-
ply, and hence no return path exists for the test current;
37
ANSI/TIA-607-C
b) to measure soil resistivity (electrical conductivity properties of the soil); this requires the
use of a four-terminal tester (see 9.3.2);
c) to test any complex ground system where a metallic loop exists; test current will return
through metal and not be forced into the soil. These include systems such as ring
grounds, counterpoise, substation grounds, and various other multiple interconnected
ground systems; and
d) to perform any test where a client or third party require conformance to a reference
standard; the clamp-on test method has not been incorporated into any independent
standard.
Before taking a clamp-on ground resistance measurement, ensure that the meter is calibrated.
Once calibrated, attach the clamp to the electrode to be measured and read the ground re-
sistance from the display.
9.3 Soil resistivity testing
9.3.1 General
Soil resistivity testing measures a volume of soil to determine its conductivity. The soil composi-
tion, moisture content, and temperature affect soil resistivity. Additionally, the resistivity of the
soil will vary geographically, and at different soil depths.
There are several testing methods that can be utilized to measure soil resistivity from taking soil
samples for lab testing to a number of different methods that provide the best indication of con-
ditions at the site. The most common method utilized for measuring soil resistivity is the four-
point method using the equally spaced Wenner arrangement.
9.3.2 Four-point method
9.3.2.1 General
The manufacturer s instructions shall be followed when using the four-point test instrument
when making a soil resistivity measurement. The test instrument uses four terminals to make
this measurement. Four stakes are driven into the earth, all at depth B and spaced (in a straight
line) at equal distance intervals A. The test current I is passed between the two outer stakes (C1
and C2), and the potential V is measured between the two inner stakes (P1 and P2). The re-
Figure 19 shows an example of the four-point
method.
38
ANSI/TIA-607-C
Figure 19 Four-point method
9.3.2.2 Test procedure

The conditions at the site should be noted including weather and soil conditions. The weather
history for the three days prior to testing should also be included in the test documentation. A
series of readings should be taken at various stake spacings and locations around the site (see
figure 20). The test results should be reported in a data table format as represented in figure
21. This will provide a set of resistivity values which, when plotted against pin spacing, indicates
whether there are distinct layers of different soil or rock; and gives an idea of their respective
resistivities and depth.
The results can be used to develop a model of the soil resistivity at the site. Many designers
take an average of the readings and use formulas for uniform soil to calculate the resistance of
a ground electrode system design. Computer programs are available to the designer that can
create more sophisticated multi-layer soil models for analysis of the ground electrode system.
39
ANSI/TIA-607-C
Second location
First location Third location
Fifth location
Fourth location
Figure 20 Example of multiple test locations
40
ANSI/TIA-607-C
Figure 21 Recommended resistivity table layout
41
ANSI/TIA-607-C
Annex A (informative) BONDING METHODS
This annex is informative and is not part of this Standard.

Bonding connections are made by means of listed exothermic welds, listed irreversible com-
pression connectors, or listed mechanical connectors.
Exothermic welding is a method of making permanent welded electrical connections without ex-
ternal power, such as electricity or gas. It is an exothermic chemical reaction (exothermic means
to release heat). The temperature of the molten metal created during the reaction is sufficient to
fuse the metal of the conductors, resulting in a welded molecular bond. Exothermic welding can
be used to produce welded connections of copper to copper and copper to steel. The advantage
of exothermic connections over compression and mechanical connections is that exothermic
connections produce a molecular bond with all the strands of the conductors, while compression
or mechanical connectors do not. All underground connections are made following manufacturer
recommendations with the exothermic welding process that use the proper mold and weld metal
materials.
A listed irreversible compression connection is made by using specific fittings and a high ton-
nage compression tool. These connections are considered maintenance free; however they
may not be when used underground. When making a listed irreversible compression connec-
tion, all surfaces should be properly cleaned and the components properly sized for the conduc-
tors being bonded.
Mechanical connections are only to be used above ground and in areas where it is impractical
to use either an exothermic or irreversible high compression connection. When making a me-
chanical connection, all surfaces should be properly cleaned and the components tightened to
the correct torque rating of the hardware. Additionally, the correct material is used so as not to
form a galvanic couple.
42
ANSI/TIA-607-C
Annex B (informative) GROUNDING ELECTRODES
B.1 General
Grounding electrodes connect electrical systems and equipment to earth. Grounding electrodes
may be ground rods, metal plates, concrete encased electrodes, ground rings, electrolytic
ground rods, the metal frame of the building or structure, and metal underground water pipes.
Metallic underground gas piping is not used as a grounding electrode, but is bonded on the cus-
tomer side of the meter (see NFPA-70 [NEC ] and NFPA-780).
B.2 Ground rods

Ground rods should be constructed from copper clad steel, solid copper, hot-dipped galvanized
steel or stainless steel and be listed by a nationally recognized testing laboratory (NRTL). The
rods should be a minimum of 2.4 m (8 ft) in length and 12.7 mm (0.5 in) in diameter. For areas
highly prone to lightning, a minimum rod length of 3 m (10 ft) should be used. Ground rods
should not have a non-conductive coating. Typical ground rods are illustrated in figure 22.
Figure 22 Illustrative views of typical ground rods
43
ANSI/TIA-607-C
B.3 Electrolytic ground rods

Electrolytic ground rods are available in vertical and horizontal configurations (see figure 23)
and in various lengths, typically 3 m (10 ft) to 6 m (20 ft) but may be longer. Electrolytic ground
rods are constructed of 54 mm (2.125 in) diameter hollow (tube) copper or stainless steel. This
tube is filled with a mixture of hygroscopic electrolytic salts; typically 60-percent sodium chloride
and 40-percent calcium chloride. Electrolytic grounds rods help lower soil resistance by absorb-
ing moisture out of the air and forming an electrolytic solution within the tube, then leaching out
the rod into the surrounding soil. Additionally, the rod is encased in a conductive non-corrosive
carbon based backfill material.
Listed electrolytic ground rods should be considered for use where standard ground rods do not
produce an acceptable grounding electrode system resistance. Unacceptable grounding elec-
trode system resistance may be found at sites where there is high soil resistivity, (i.e., above
25 000 ohms-cm), areas with limited space or areas where the grounding electrode system is
covered by non-porous materials such as concrete or asphalt. In all cases, manufacturer rec-
ommendations should be followed when installing electrolytic ground rods.
Breather holes
Covered
Finished test well Exothermic connection
grade
Finished
Breather grade 2 AWG minimum
holes copper conductor
Exothermic 2 AWG minimum

connection copper conductor
Weep
Backfill Weep
holes
holes
Figure 23 Illustrations of a vertical and horizontal electrolytic ground rod
B.4 Ground plate electrodes

Ground plate electrodes are constructed from copper having a minimum thickness of 1.5 mm
(0.06 in) or from steel having a minimum thickness of 6.35 mm (0.25 in).
A listed ground plate electrode should be installed a minimum of 0.75 m (2.5 ft) below grade and
below permanent moisture level if practical. If soil conditions do not allow the ground plate elec-
trode to be buried at this depth, they should be buried as deep as practical.
Ground plate electrodes should only be used if soil conditions prohibit the use of standard
ground rods, or they are specifically engineered into the grounding electrode system.
B.5 Wire mesh

Wire mesh is typically fabricated from solid copper or copper clad steel wire, ranging from
6 AWG to 12 AWG. The wires are brazed together in a grid form with spacing between conduc-
tors ranging from 50 mm (2 in) through 1.2 m (4 ft). All joints should be silver brazed or equiva-
lent.
Listed wire mesh should be used where ground rod electrodes cannot be driven or are ineffec-
tive because of soil conditions or where it is desirable to establish a superior ground plane.
44
ANSI/TIA-607-C
B.6 Concrete encased electrode

A concrete encased electrode is an electrode encased by at least 50 mm (2 in) of concrete and
located horizontally or vertically near the bottom of a concrete foundation or footing that is in
direct contact with the earth. It consists of at least 6 m (20 ft) of one or more bare or zinc galva-
nized or other electrically conductive coated steel reinforcing bars or rods of not less than
12.7 mm (0.5 in) diameter or of at least 6 m (20 ft) of bare copper conductor not smaller than
4 AWG. (See figure 24).
4 AWG copper wire
12.7 mm (0.5 in)

steel reinforcing bar
(typical) 6 m (20 ft)
minimum
Side view End view
Figure 24 Illustrative view of a concrete-encased electrode
B.7 Ground ring electrodes

Ground ring electrodes encircle the building or structure and are in direct contact with the earth.
They should be installed to a minimum depth of 0.75 m (2.5 ft) below grade or below the frost
line, whichever is deeper. The ground ring conductor should be 2 AWG or larger bare, solid,
tinned or un-tinned copper conductor. For areas with high lightning events, larger conductors
such as 1/0 AWG or larger should be considered. Stranded conductors should be used with
these larger sizes; tinned conductors are recommended.
Ground ring electrodes may also incorporate the use of driven ground rods.
B.8 Ground radial electrodes

Radial conductors should be a bare tinned or untinned copper conductor, minimum 2 AWG.
There should be a minimum of three conductors of different lengths; equally spaced from one
another as much as practical. The minimum length of each radial should be 7.6 m (25 ft) and a
maximum of 24.4 m (80 ft). Radial grounding conductors should be installed in direct contact
with the earth and should be installed to a minimum depth of 0.75 m (2.5 ft) below grade or be-
low the frost line, whichever is deeper.
Radial grounding conductors may also incorporate the use of driven ground rods.
Radial grounding conductors should be installed horizontally in the ground and radiate away
from the building or structure (see figure 25).
45
ANSI/TIA-607-C
9 m (30 ft) mimimum

between tower and
building (preferred)
Figure 25 Illustrative view of a ground radial electrode
B.9 Enhanced grounding materials

Enhanced grounding materials are high conductivity materials, which lower ground system re-
sistance in high resistance soil conditions. These materials should be manufactured from a high
quality relatively sulfur-free carbon source. Many lower grade carbons contain sulfur which is
very corrosive especially when encased in concrete. Enhanced grounding materials should be
environmentally safe and approved by the authority having jurisdiction (AHJ).
Enhanced grounding materials should be considered for use around ground rod electrodes and
grounding electrode rings in high soil resistance conditions (see figure 26).
46
ANSI/TIA-607-C
Figure 26 Illustrative example of ground enhancement materials surrounding a ground-

ing conductor and a ground rods
B.10 Grounding conductors

Grounding conductors are used to connect equipment or the grounded circuit of a wiring system
to a grounding electrode or a grounding electrode system. These conductors should connect
grounding electrodes together, form buried ground rings and connect objects to the grounding
electrode system. Grounding conductors may be solid, stranded, tinned, or un-tinned and may
be bare or insulated. Above ground conductors should be jacketed with green or green with yel-
low striping insulation.
Unless otherwise stated, all below-ground ground electrode conductors should be a bare solid
copper conductor not smaller than 2 AWG. Bare stranded copper conductor not smaller than
1/0 AWG, tinned conductors is recommended.
When installing grounding electrode conductors, they should be installed in one continuous
length without splices unless using listed exothermic connections or listed irreversible compres-
sion-type connectors. The conductor runs should be as short and straight as practical. Bends in
the conductor should be made toward the ground location. See 7.5.2 for information on mini-
mum bend radii and included angles.
47
ANSI/TIA-607-C
Annex C (informative) TOWERS AND ANTENNAS
C.1 General
This clause describes specific electrical protection considerations for antenna support structures
(towers).
C.2 Grounding electrode system
C.2.1 External grounding

Figure 27 illustrates an example view of a tower and antenna site grounding electrode system.
Figure 27 Illustrative example view of a site grounding electrode system
C.2.2 Bonding busbars

The purpose of a bonding busbar is to provide convenient bonding points for various elements
of a telecommunications system and ancillary support apparatus. There are several types of
bonding busbars:
a) External bonding busbar
The purpose of the external bonding busbar is to provide convenient termination points
for the sheath (shield) of antenna transmission lines and other telecommunications ca-
bles prior to their entry into a building or shelter.
48
ANSI/TIA-607-C
b) Internal bonding busbar

The purpose of the internal bonding busbar is to provide convenient termination points
on all metallic items within a building or shelter in an effort to provide potential equaliza-
tion.
c) Tower bonding busbar
The purpose of the tower bonding busbar is to provide a convenient termination point on
the tower for multiple transmission lines with metallic sheaths (i.e. coaxial cable).
Bonding busbars are sized to meet immediate application requirements while taking into con-
sideration future growth.
The external bonding busbar is installed at the point where the antenna transmission lines and
other telecommunications cables enter the building or shelter. It is connected directly to the
grounding electrode system using 2 AWG or larger bare, solid or stranded, tinned or un-tinned
copper conductor. This conductor is installed in a direct manner with no sharp bends or narrow
loops. Larger conductor sizes such as 4/0 AWG are recommended in high lightning prone are-
as. Connection of the grounding electrode conductor to the external bonding busbar is by a
listed exothermic connection or listed irreversible compression connection.
The tower bonding busbar is installed below the transmission line ground kits, near the area of
the tower at the point where the antenna transmission lines extend from the tower to the build-
ing or shelter. It is connected to the tower grounding electrode system with a 2 AWG or larger
bare, solid tinned copper conductor. For reduced impedance to earth, the tower bonding busbar
is directly bonded to the tower, thereby utilizing the tower as the down conductor. Care is also
taken to select the proper materials so as to prevent a dissimilar metal reaction. To maintain
equal potential between the transmission lines and the tower, busbars are installed at the top
and bottom of the tower, providing termination points for bonding the transmission lines cable
shields to the tower. If the tower is greater than 60 m (200 ft) in height, busbars are installed
every 15 m (50 ft), they are bonded to the tower and to the transmission line cable shields.
C.2.3 Grounding systems
C.2.3.1 Type 1 sites

Type 1 sites are considered non-critical to the operation of the telecommunications system.
NOTE The owner of the telecommunications equipment or the authority having
jurisdiction (AHJ) determines whether the site is Type 1 or Type 2.
Type 1 sites may not have a tower on the site, may be located in a commercial office or resi-
dence, and may not be part of a larger system. Type 1 sites should have a grounding system
resistance of 25 ohms or less. If 25 ohms or less cannot be achieved with one grounding elec-
trode, another ground electrode should be installed no closer than 1.8 m (6 ft) (see figure 28). It
is recommended to install at least two grounding electrodes even if the 25 ohms objective is
achieved with one. In the case of new construction the reinforcing steel in the foundation should
be bonded to the grounding electrode system.
49
ANSI/TIA-607-C
Figure 28 Illustration of a parallel ground rod installation
C.2.3.2 Type 2 sites

Type 2 sites are considered critical to the operation of the telecommunications system.
NOTE The owner of the telecommunications equipment or the authority having
jurisdiction (AHJ) determines whether the site is Type 1 or Type 2.
Type 2 sites may have a tower on the site, may have a telecommunications dispatch center,
may have a base station/repeater site, and may be critical to public safety or on a military instal-
lation. Type 2 sites should have a grounding system resistance of 5 ohms or less.
NOTE Equal-potential bonding and grounding is the most important considera-
tion when designing a grounding electrode system to protect against lightning
events.
C.2.4 Tower grounding

The tower grounding electrode system helps disperse lightning energy before it is able to enter
the associated telecommunications structure and its related equipment. See figure 27.
There are several types of towers. Typical tower types include:
a) Guyed metallic towers
These are structures with upright support members (legs) mounted on a foundation or
pier that require multiple anchors and down guys.
b) Self-supporting metallic towers
50
ANSI/TIA-607-C
These are free-standing structures with upright support members (legs) mounted on a
foundation or pier that need no other supporting elements.
c) Wooden structures (poles)
These are either free-standing or guyed structures either mounted on a foundation or
partially buried.
The tower ground ring conductor should be a bare tinned or untinned copper conductors, mini-
mum 2 AWG, that is buried to a depth at least 0.75 m (2.5 ft) or 150 mm (6 in) below the frost
line, whichever is deeper. It should be installed at least 0.6 m (2 ft) away from the tower base or
footing using at least two ground rods, 2.4 m (8 ft) minimum length and 16 mm (0.625 in) diame-
ter, driven to a depth of not less than 3 m (10 ft) below the depth of the tower ground ring and
attached to the ground ring using a listed exothermic weld. The ground rods should be made
from copper, copper clad steel, stainless steel or galvanized steel and be listed for the purpose.
The ground rods should be located at opposite ends of the ground ring. The tower ground ring
should bonded to the equipment building/cabinet ground ring in at least two points using the
same size conductor and buried to the same depth as the tower and equipment building/cabinet
reinforcing steel elec-
trically connected to the tower holding bolts.
C.2.4.1 Guyed metallic towers

The bottom plate of a guyed tower should be bonded to the tower ground ring using three equal-
ly spaced conductors, or each leg should be bonded to the tower grounding ring using a con-
ductor of the same size as the tower ground ring (see figure 29). These conductors should be
short and straight as practical. The connections to the tower should be made with listed exo-
thermic connections unless specifically directed otherwise by the tower manufacturer. The con-
nections to the ground ring should be made with listed exothermic welds or listed irreversible
high compression connectors.
51
ANSI/TIA-607-C
Figure 29 Illustration of a guyed tower grounding example

A ground rod should be installed at each anchor point and connected to each guy wire using
materials that help prevent the formation of a galvanic couple (See figure 30).
52
ANSI/TIA-607-C
Figure 30 Illustration of guy wire grounding
C.2.4.2 Self-supporting metallic towers

For towers not exceeding 1.5 m (5 ft) in base width (including monopoles), the tower ground ring
should consist of at least two ground rods and grounding conductor and installed in accordance
with Annex B.
For towers equal to or exceeding 1.5 m (5 ft) in base width, the tower ground ring should consist
of at least one ground rod per tower leg and a grounding conductor sized and installed in ac-
cordance with Annex B. Each tower leg should be connected to the tower ground ring using the
same size conductor as the tower ground ring. These conductors should be installed to be as
short and straight as practical. The connections to the tower should be made with listed exo-
thermic connections unless specifically directed otherwise by the tower manufacturer. The con-
nections to the ground ring should be made with exothermic welds or listed irreversible high
compression connectors.
For monopole towers equal to or exceeding 1.5 m (5 ft) in base width, the tower ground ring
should consist of at least four equally spaced ground rods and a grounding conductor sized and
installed according to Annex B. There should be four equally spaced bonding conductors con-
nected to the monopole tower and to the tower ground ring using the same size conductor as
53
ANSI/TIA-607-C
the tower ground ring. These conductors should be installed to be as short and straight as prac-
tical. The connections to the tower should be made with listed exothermic connections unless
specifically directed otherwise by the tower manufacturer. The connections to the ground ring
should be made with listed exothermic connections or listed irreversible high compression con-
nectors (see figure 31).
Figure 31 Illustration of a monopole tower grounding example
C.2.4.3 Wooden structures (poles)

Wooden poles should be installed using a 2 AWG or larger solid bare tinned or un-tinned copper
vertical down conductor for its entire length. This down conductor should be connected to two
ground rods or a grounding radial conductor using listed exothermic welding or other fittings that
are listed for that purpose. These ground rods and conductors should be sized and installed ac-
cording to Annex B (see figure 32).
54
ANSI/TIA-607-C
2 AWG minimum
bare copper wire
routed from opposite side
from transmission line
Ground kits
Ground
rods
Figure 32 Illustrative view of a wooden pole grounding example

Common bonding and grounding principles used on separate building and tower sites should
also apply in this case. In addition, the following should apply to this type of installation.
a) Any electric power conduit should extend and terminate above any telephone attach-
ment (cable, wire, or drop) at a point where the weatherhead is near the power circuit at-
tachments or warning light.
55
ANSI/TIA-607-C
b) The conduit from the weatherhead to the power meter should be at least 6 m (20 ft) long.
This aids the operation of the power arrester at the weatherhead (poles).
C.2.5 Building/shelter and outdoor cabinet grounding

All dedicated telecommunications shelters and outdoor cabinets should have a properly in-
stalled external grounding electrode system that meet the ground resistance requirements listed
in C.2.3.1 or C.2.3.2 depending on what type of structure it is. Figure 33 illustrates an example
of a cabinet grounding system.
The building/shelter and outdoor cabinet should be encircled by a ground ring consisting of a
bare solid tinned or un-tinned copper conductor, minimum 2 AWG buried to a depth at least
0.75 m (2.5 ft) or 150 mm (6 in) below the frost line, whichever is deeper. It should be installed
at least 0.9 m (3 ft) away from the building. Ground rods, 2.4 m (8 ft) minimum length and
16 mm (0.625 in) diameter should be driven to a depth of not less than 3 m (10 ft) below the
depth of the ground ring and attached using listed exothermic connections or listed irreversible
compression connections. These ground rods should be constructed per B.2. There should be a
minimum of four grounding rods located at each corner of the building/shelter or outdoor cabi-
net. The building/shelter and outdoor cabinet ground ring should be bonded to the tower ground
ring in at least two points using the same size conductor and buried to the same depth as the
t-
ings) should have the reinforcing steel electrically connected to the building ground ring.
Figure 33 Illustrative view of a cabinet grounding system
56
ANSI/TIA-607-C
C.2.6 Rooftop sites grounding system

When the antenna support or tower is mounted on the roof of a building, a grounding system
should be designed to:
a) use regular lightning protection conductors and hardware following the recommenda-
tions of NFPA-780;
b) place a wire ring (roof ring) around the antenna support or tower;
c) connect the tower base footings to the:
1) tower ground ring;
2) waveguide, or coaxial, outer conductor;
3) lighting alternating current (ac) branch circuit metallic conduit and green wire alter-
nating current equipment ground (ACEG);
4) lightning arrester ground.
d) connect:
1) antenna metal members to the tower or antenna support structure;
2) antenna support structure to ring;
3) lightning protection system perimeter conductors;
4) ring to any other metallic object on the roof within flashover range.
NOTE Coordinate the lightning protection system of the building and the
grounding system for the tower.
See figure 34, figure 35, and figure 36 for examples of rooftop site grounding systems
57
ANSI/TIA-607-C
To PBB
Figure 34 Illustrative rooftop tower example
58
ANSI/TIA-607-C
Transmission line ground kit
2 AWG minimum Antenna

bare copper Antenna support structure
conductors
Electrical service
Ground rods
Figure 35 Illustrative view of roof-mounted antenna mast grounding with a supple-

mental grounding electrode system
59
ANSI/TIA-607-C
Antenna mount Antenna
2 AWG minimum bare Transmission line ground kit

copper conductor
Bonding busbar
Electrical
service
2 AWG minimum bare Ground rods

Copper conductor
50 mm (2 in) strap
recommended
Figure 36 Illustrative view of side-mounted antenna grounding using copper strap

down conductor
C.2.6.1 Down conductors

A roof-mounted tower or antenna mast of any size should have at least two down conductors
from opposite sides of the roof ground ring down the building wall to connect to either a buried
ground ring around the building (preferred), or two or more rods.
Additional down conductors should be used for each 30 m (100 ft) of building length.
NOTE These down conductors are in addition to the ones used in the lightning
protection system.
C.2.6.2 Roof conductors

Roof conductors should be supported every 0.9 m (3 ft) using listed fasteners or supports.
C.2.7 Transmission line grounding at antenna locations

Waveguide and coaxial cable shields should be bonded to the tower at the top and bottom of
the tower. If the tower is greater than 60 m (200 ft) in height, the waveguide or coax shield
should also be bonded at the tower midpoint or every 15 m (50 ft).
Where the waveguide or coaxial cable enters the building, the waveguide or coaxial shield
should be bonded to the bui minimum 2 AWG
60
ANSI/TIA-607-C
conductor. Once inside the building, the waveguide or coaxial cable shield should be bonded to
minimum. 2 AWG conductor, as close
as practical to the entrance.
If there is a metallic waveguide or coaxial cable entrance plate, the entrance plate should be
bonded to both the exterior and interior grounding system with a minimum 2 AWG conductor.
The waveguide or coaxial cable shield should be bonded to the metallic entrance plate on both
the outside and inside of the building with a minimum 2 AWG conductor.
The coaxial cable should be protected by a lightning surge arrester, which is bonded to the exte-
rior grounding electrode system with the proper size grounding conductor specified by the man-
ufacturer.
If the tower is lighted, the conduit for the lighting power conductors should be bonded to ground
as described for waveguide and coaxial cable shields.
C.2.8 Ancillary objects requiring bonding and grounding
C.2.8.1 Fence grounding

If there is a metal fence within 1.8 m (6 ft) of the building, the building ground ring should be
bonded to the fence with a minimum 2 AWG solid bare copper conductor. Similar rules apply for
bonding a monopole or satellite-mounting ground ring to the equipment building ground ring or
fence (see figure 37 and figure 38).
61
ANSI/TIA-607-C
Bonded at
Tower ground all corner
ring fence posts
Tower
Metallic Bonding
fence busbar
Communication External
site ground
ring
Gate posts Gates bonded to gate posts
Figure 37 Illustration of a fence bonding example
62
ANSI/TIA-607-C
Deterrent wire bonding clamps
Exothermic weld connections
Fence fabric bonding clamp

(1 of 3)
Soft drawn tinned solid

copper conductor bonding
fence fabric to ground
Gate jumpers with

exothermic welds
Bonding conductor with
exothermic weld
Connect fence bonding

conductors to grounding
electrode system using
exothermic welds or irreversible
high-compression connectors
Figure 38 Illustrative view of a fence fabric and deterrent wiring bonding example
C.2.8.2 Generators
Generators installed outside and within 1.8 m (6 ft) of the structure should be bonded to the
nearest point on the building's grounding electrode system using a minimum 6 AWG copper
conductor, see figure 39. If this conductor is placed underground, then the minimum conductor
size shall be 2 AWG or larger.
Generators installed more than 1.8 m (6 ft) away from the structure shall have a ground rod
driven near the generator and bonded to the generator and to the building's grounding electrode
system using a 2 AWG or larger bare, solid, tinned or un-tinned copper conductor
63
ANSI/TIA-607-C
Figure 39 Illustrative view of a generator grounding example
C.2.8.3 Satellite dishes

Satellite dish mountings should have a grounding electrode system consisting of a ground ring
and ground rods. The metallic frame supporting a satellite dish should be bonded to the ground
ring with a minimum 2 AWG conductor, which should be as short and straight as practical.
C.2.9 Internal bonding and grounding
C.2.9.1 Components
C.2.9.2 Installation
Radio equipment buildings with nonmetallic walls should have an interior ground ring consisting
of a minimum 2 AWG conductor mounted, with nonmetallic connections, to the interior wall with-
in 0.3 m (1 ft) of the ceiling.
Radio equipment buildings with metallic walls should have an interior ground ring consisting of a
minimum 2 AWG conductor mounted directly to the interior wall within 0.3 m (1 ft) of the ceiling.
C.2.9.3 Bonding to the external ground electrode system

The interior ground ring should be bonded to the exterior ground ring with a minimum 2 AWG
conductor, routed as straight as practical, using listed exothermic connections or listed connect-
ors.
64
ANSI/TIA-607-C
Annex D (informative) TELECOMMUNICATIONS ELECTRICAL PROTECTION

Telecommunications circuit protectors are used in telecommunications facilities to mitigate volt-
age and current transients. There are three basic types of telecommunications surge protectors:
a) primary protectors;
b) secondary protectors; and,
c) data and fire alarm protectors.
The telecommunications infrasturcture is often subject to electrical disturbances arising from
lightning and commercial alternating current (ac) power line disturbances. To help safeguard
persons and property from the effects of these disturbances, primary telecommunications elec-
trical protection is placed at the telecommunications entrance to the building or structure by the
network telecommunications utility access provider. The National Electrical Code (NEC ) speci-
fies the minimum primary protection requirements,
be located in, on or immediately adjacent to the structure or building served and as close as
m-
munications utilities, in addition to conforming to the NEC requirements, also provide primary
telecommunications electrical protection where they deem their network plant potentially ex-
posed to lightning or commercial ac power disturbances. An exception to this may be in urban
areas where tall, steel-framed buildings may provide shielding from lightning, the large mass of
underground metallic structures dissipates lightning energy, and power conductors are placed
underground in conduit separate from telecommunications conductors. In such areas, primary
telecommunications electrical protection is generally not necessary as there may be limited
lightning or power exposure.
A critical consideration when placing the primary protector is the length of the primary protector
grounding conductor. The primary protector grounding conductor provides the grounding path
between the primary protector ground terminal and the building or structure power grounding
electrode system. During a lightning event to the network telecommunications plant, substantial
voltages can be developed in the primary protector grounding conductor. The magnitude of the
voltage is dependent both on the waveshape of the disturbance and the impedance of the
grounding conductor which is directly proportional to conductor length. For this reason, network
telecommunications utility practices recommend:
a) locating the telecommunications entrance as close as practicable to the power entrance
to minimize the length of the primary protector grounding conductor. The NEC empha-
sizes this by requiring a means for intersystem bonding between power and other sys-
tems, such as telecommunications systems.
b) placing the primary protector to allow for the shortest and most direct routing of the pri-
mary protector grounding conductor.
While the telecommunications network is only one means by which lightning voltages can be
introduced into a building or structure (power phase conductors, the power neutral conductor,
and a strike to the building itself are others), consideration should also be given to providing
surge protection devices at the electrical entrance and direct strike lightning protection to the
facility. The requirements for and the need to provide this broader protection is contained in
NFPA-780.
65
ANSI/TIA-607-C
Maximum effort should be made to keep the primary protector grounding conductor as short as
practical. This may be accomplished by locating the primary protector in close proximity to the
power service entrance at the building or structure. In addition to the primary protector ground-
ing conductor, the overall conductor path between the primary protector and the power service
ground should be kept as short as practical. This path may include the telecommunications
bonding conductor (TBC) as illustrated in figure 3 and figure 5 of this Standard. The length of
the TBC may be minimized by locating the primary bonding busbar (PBB) as close as practica-
ble to the electrical entrance facility.
Requirements for telecommunications electrical protection, bonding and grounding at building or
structure entrances are contained in the NEC , Chapter 8. Additional detailed electrical protec-
tion, bonding and grounding considerations and criteria are contained in ATIS 0600318. The
reader is directed to these documents for guidance regarding the primary protector, and the
placement, routing, and length of the primary protector grounding conductor.
Consideration should be given to installing secondary protectors and data and fire alarm protec-
tors.
66
ANSI/TIA-607-C
Annex E (informative) ELECTRICAL PROTECTION FOR OPERATOR-TYPE EQUIPMENT

POSITIONS

Technology devices are increasingly being deployed at the equipment outlet (EO), including one
or more computers, phones, printers, etc. In telecommunications-intensive operations, person-
nel may wear voice headsets connected to headset interface equipment in addition to the typical
EO devices.
At these locations, personnel use a variety of electronic equipment including a headset, headset
interface equipment, other electronic equipment such as a computer keyboard and video display
terminal, and the work station furniture. Frequently, workstations are arranged in clusters con-
sisting of several positions. These positions are typically used at reservation bureaus, telemar-
keting agencies, and such.
Operator-type equipment positions (workstations) should be bonded to ground in accordance
with ATIS 0600321.
Electrical disturbances may appear at operator-type equipment positions arising either from
electrostatic discharge (ESD), or from sources that are internal or external to the building such
as lightning or alternating current (ac) power disturbances.
ATIS 0600321 covers new installations of network operator-type equipment positions in which
personnel are required to access a computer terminal keyboard while continually wearing a
headset. This standard presents measures that are intended to help control ESD in the network
operator-type environment. ATIS 0600321 also presents additional measures that are intended
to help minimize the effects of lightning, surges from commercial alternating current (ac) power
lines, and power switching operations, both at the facility (building) level and at the network op-
erator-type equipment position. These measures provide for equipotential bonding and ground-
ing at the telecommunications entrance facility (TEF) and the power entrance facility, as well as
for equipotential bonding and grounding, where necessary, and electrical protection at the net-
work operator-type equipment positions. Although ATIS 0600321 deals specifically with network
locations, the measures outlined in the standard are applicable to non-network installations, as
well as at existing installations.
The electrical protection measures included in ATIS 0600321 are intended to minimize potential
differences at the network operator-type equipment position (work station) but are not intended
to guarantee against damage or injury that may result from ESD or other similar occurrences.
Refer to figure 40.
General electrical safety and protection requirements that may be applied to work areas are
contained in the NEC .
67
ANSI/TIA-607-C
Brance circuit outlet box
ACEG provided in Video

supply cords
Electrical
closet
External surge
protection
device
Position
bonding
terminal
Processor/controller
Distributor
room
Equipment
Headset intergace
SBB
Telecommunications
bonding backbone (TBB) External secondary
protector
Electrical
entrance Telecommunications
facility entrance facility (TEF)
Bond to structural metal

Equipment
Bond to furniture
Primary bonding
busbar (PBB)
Grounding
Electrode
Conductor
Telecommunications LEGEND
bonding conductor
Grounding (TBC) Structural
Panelboard
electrode metal
system
Busbar Outside scope of Standard
Service equipment Bonding conductor
Figure 40 Electrical protection for operator-type equipment positions
68
ANSI/TIA-607-C
Annex F (informative) CROSS REFERENCE OF TERMS

Table 3 provides a cross reference between terms used in this Standard and other, commonly-
used industry terms, including terms from previous editions of this Standard.
Table 3 Cross reference of terms
Preferred terms
Other industry terms
used in this Standard
backbone bonding conductor grounding equalizer (GE)1
(BBC) horizontal equalizer
building principal ground (BPG)
CO GRD Bus
COG
facility ground
main earthing terminal (MET)
master ground bar (MGB)
primary bonding busbar (PBB)
OPGPB
PGP bus
principal ground point (PGP)
reference point 0 (RP0)
telecommunications main grounding busbar (TMGB)1
zero potential reference point
rack bonding busbar rack grounding busbar1
approved floor ground
extended reference point 0 (Extended RP0)
secondary bonding busbar (SBB)
floor ground bar (FGB)
telecommunications grounding busbar (TGB)1
equalizer
equalizing conductor
telecommunications bonding
grounding equalizer (GE)
backbone (TBB)
vertical equalizer
vertical ground riser
telecommunications bonding
bonding conductor for telecommunications (BCT)1
conductor (TBC)
Notes:
1. Term used in previous editions of this Standard.
69
ANSI/TIA-607-C
Annex G (informative) BIBLIOGRAPHY

The following documents contain requirements and guidelines relevant to the requirements of
this Standard:
EN 50310, Application Of Equipotential Bonding And Earthing In Buildings With Infor-
mation Technology Equipment
FIPS PUB 94 1983, Guideline on Electrical Power for ADP Installations
MIL-HDBK-419A 1987, Grounding, Bonding, And Shielding For Electronic Equipments
And Facilities Basic Theory
The organizations listed below can be contacted to obtain referenced information:
ANSI
American National Standards Institute
25 W 43rd St, 4th Floor
New York, NY 10036
USA
(212) 642-4900
www.ansi.org
ATIS
Alliance for Telecommunications Industry Solutions
1200 G Street, NW
Suite 500
Washington, DC 20005
USA
(202) 628-6380
www.atis.org
BICSI
BICSI
8610 Hidden River Pkwy
Tampa, FL 33637
USA
(813) 979-1991
www.bicsi.org
FIPS
Federal Information Processing Standards Publications
National Institute of Standards and Technology (NIST)
Information Technology Laboratory
100 Bureau Dr, M/S 8900
Gaithersburg, MD 20899-8900
USA
(301) 975-2900
http://www.itl.nist.gov/fipspubs/
70
ANSI/TIA-607-C
IEC
International Electrotechnical Commission
3, rue de Varembe
PO Box 131
1211 Geneva 20
Switzerland
+41 22 919 02 11
www.iec.ch
IEEE
IEEE
445 Hoes Ln
Piscataway, NJ 08854-4141
USA
(732) 981-0060
www.ieee.org
ISO
International Organization for Standards
1, ch. de la Voie-Creuse
CP 56
CH-1211 Geneva 20
Switzerland
+41 22 749 01 11
www.iso.org
ITU
International Telecommunication Union
Place des Nations
1211 Geneva 20
Switzerland
+41 22 730 5111
www.itu.int
MIL
Department of Defense
Defense Standardization Program
8725 John J Kingman Rd
Stop 5100
Fort Belvoir, VA 22060-6220
USA
(703) 767-6888
www.dsp.dla.mil
NECA
National Electrical Contractors Association
3 Bethesda Metro Center
Suite 1100
Bethesda, MD 20814
USA
(301) 657-3110
www.necanet.org
71
ANSI/TIA-607-C
NFPA
National Fire Protection Association
1 Batterymarch Park
Quincy, MA 02169-7471
USA
(617) 770-3000
www.nfpa.org
TIA
Telecommunications Industry Association
1320 N Courthouse Rd
Suite 200
Arlington, VA 22201
USA
(703) 907-7700
www.tiaonline.org
72
THE TELECOMMUNICATIONS INDUSTRY ASSOCIATION
TIA represents the global information and communications technology (ICT)
industry through standards development, advocacy, tradeshows, business
opportunities, market intelligence and world-wide environmental
regulatory analysis. Since 1924, TIA has been enhancing the
business environment for broadband, wireless, information
technology, cable, satellite, and unified communications.
TIA members’ products and services empower communications

in every industry and market, including healthcare, education,
security, public safety, transportation, government, the utilities.
TIA is accredited by the American National Standards Institute (ANSI).

Ansi Tia 607 C 2015

Uploaded by

Document Informationclick to expand document information

Copyright:

Available Formats

Ansi Tia 607 C 2015

Uploaded by

Document Information

Original Description:

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Ansi Tia 607 C 2015

Uploaded by

Copyright:

Available Formats

ANSI/TIA-607-C

Generic Telecommunications Bonding and Grounding (Earthing) for Customer Premises

6.3.5 Use of structural metal .........................................................................................16

7.5.7 Bonding conductors for connections to the mesh-BN or RBB ..............................25

B.2 Ground rods ................................................................................................................43

Annex D (informative) TELECOMMUNICATIONS ELECTRICAL PROTECTION .................................. 65

Figure 29 Illustration of a guyed tower grounding example.....................................................52

Approval of this Standard

Significant technical changes from the previous edition

Relationship to other TIA standards and documents

Common Premises Cabling &

ANSI/TIA-568.0 ANSI/TIA-568.1 ANSI/TIA-568.2

ANSI/TIA-569 ANSI/TIA-570 ANSI/TIA-568.3

ANSI/TIA-606 ANSI/TIA-942 ANSI/TIA-568.4

Figure 1 Relationship between relevant TIA standards

Metric equivalents of United States customary units

3 DEFINITIONS, ACRONYMS AND ABBREVIATIONS, UNITS OF MEASURE

utor A, Distributor B, Distributor C, an optional consolidation point and the

CP Optional consolidation point Cabling

NOTE All elements shown represent cables and connecting hardware,

ground: A conducting connection, whether intentional or accidental, between an electrical cir-

secondary bonding busbar: A common point of connection for telecommunications system

3.3 Acronyms and abbreviations

ATIS Alliance for Telecommunications Industry Solutions

SPC single point connection

3.4 Units of measure

4.1 National requirements

4.2 Local code requirements

5 OVERVIEW OF TELECOMMUNICATIONS BONDING AND GROUNDING SYSTEMS

5.2 Overview of the telecommunications bonding infrastructure

SBB (BBC) SBB

Primary bonding busbar (PBB) Secondary bonding busbar

Bonding conductor as labeled

Figure 3 Illustrative example of a multi-story large building

Busbar Building spaces

Figure 4 Illustrative example of a single story large building

Primary bonding busbar

Bonding conductor as labeled

Figure 5 Illustrative example of a smaller building

5.2.2 Primary bonding busbar (PBB)

5.2.3 Telecommunications bonding conductor (TBC)

5.2.4 Telecommunications bonding backbone (TBB)

5.2.5 Secondary bonding busbar (SBB)

5.2.6 Backbone bonding conductor (BBC)

6 TELECOMMUNICATIONS BONDING COMPONENTS

6.2.1 Primary bonding busbar (PBB)

Figure 6 Example PBB

6.2.2 Secondary bonding busbar (SBB)

Figure 7 Example SBB

6.2.3 Rack bonding busbar (RBB)

6.3.2 Sizing the telecommunications bonding backbone (TBB)

Table 1 TBB/BCC conductor size vs length

6.3.3 Sizing the telecommunications bonding conductor (TBC)

6.3.4 Sizing the backbone bonding conductor (BBC)

6.3.5 Use of structural metal

6.3.5.2 Connections to the PBB/SBB

IF THIS CONNECTOR OR CABLE IS