Icepak V13新功能 - 20110111

ANSYS Icepak
13.0 Release
© 2010 ANSYS, Inc. All rights reserved. 11 ANSYS, Inc. Proprietary

Overview
• ANSYS Workbench Integration

• Meshing and Modeling Enhancements
• ECAD/MCAD Enhancements
• Solver Enhancements
• Postprocessing Enhancements
• ECAD/MCAD Enhancements
• Macro Enhancements

ANSYS Workbench
I t
Integration
ti

ANSYS Workbench – Introduction
• Integration of all core ANSYS applications

• Workflow automation for all applications
• Drag-and-drop multiphysics
• Easy
E reuse and d sharing
h i off workflows
kfl
• Powerful productivity boost for engineering design and analysis
ANSYS Workbench Integration
• ANSYS Icepak is data integrated

i t the
into th ANSYS Workbench
W kb h
environment
• Superior MCAD connectivity -
ANSYS Design Modeler and
Geometry Interfaces allow
translation and export of MCAD as
native
ti Icepak
I k objects.
bj t
• Workflow capability allows
unparalleled ease of use and
automation
• Postprocessing with ANSYS CFD
Post
• One-way fluid structure
interaction with ANSYS
Mechanical for thermal-stress
calculations

ANSYS Design Modeler (Electronics)
• Data transfer between DesignModeler and Icepak using

native Icepak objects
• Design Modeler decomposes and simplifies MCAD into
native Icepak objects
– No additional steps required in Icepak
• Many additional options to import MCAD into Icepak
via Workbench Geometry Interfaces



Interface to ANSYS Mechanical
• Temperature data from Icepak can be

imported into ANSYS Mechanical to
enable a thermal-stress simulation.
• Design
g Modeler serves as a startingg
point for both the CFD (ANSYS Icepak)
and the Structural (ANSYS Mechanical)
simulations

Model: Icepak & Ansys
CFD model
d l FEA model

Results: Temperature Contours
Icepak Results
Ansys WB12 Result

Results: Ansys WB, Structural
Total Deformation Equivalent (Von-Mises) stress

顯示卡的熱應力計算（1）
• 目的
– 評價作用在顯示卡上的熱應力
• 使用軟體
– ANSYS、Icepak
• 解析過程
– 1. 讀入CAD的形狀
– 2.
2 熱解析（Icepak）
– 3. 讀入溫度分佈結果
◈ 單向匹配（Icepak→ANSYS）
– 4. 計算熱應力（ANSYS）
Geometry Temperature
CAD Geometry ANSYS Icepak ANSYS Mechanical
Geometry
© 2010 ANSYS, Inc. All rights reserved. 13 ANSYS Japan K.K. Proprietary
• Workbench過程
讀入CAD形狀
（Design Modeler）
讀入CAD形狀（Icepak）
• 解析結果
溫度分佈、速度向量變形分佈（ANSYS）
（Icepak）
M hi
Meshing and
d
Modeling
Enhancements
© 2010 ANSYS, Inc. All rights reserved. 16

16 ANSYS, Inc. Proprietary
Meshing
HDM features – Sub-blocking
• HDM uses domain decomposition to

group geometries into blockings
• In each blocking, further block
decomposition used if geometries are
primitives
• Mesh generated in each sub-blocks
based on user specified
p size
requirements
Sub-blocking around
Heat sink a heat sink geometry
Meshing
HDM features: Sub-blocking
• Interaction between sub-blocking

meshes when 3D cutcut-cells
cells employed
might lead to
– Large mesh count
– Highly
Hi hl skewed
k d cells
ll
• Examples of situations
– CAD objects
– Non-uniform polygons
– Spheres, ellipsoids
– Intersecting cylinders
Mesh Count ~ 52k

Lowest quality= -0.24
Meshing
HDM New Features: Uniform Params
• New feature “Uniform Params”

effectively blocks interactions
between sub-blocking meshes
– Non-conformal mesh in sub-
bl k
blocks
– Uniform mesh sizes
– Lower mesh count
– Improved quality
Mesh Count ~ 20k

Lowest quality= 0.026
Meshing
Hanging Node Mesh Adaption
• Characterized by nodes on faces

that are not vertices of all the cells
sharing those faces
• IcePak uses the terminology
‘Multi-level meshing’
• Multi-level meshing Procedure:
– Process starts with a coarse
background mesh
– Series of refinements to resolve
fine-level features
– 3D cut-cell technique used for
body-fitting the mesh
Meshing
Multi-level Meshing: An Example
No Multi-level Mesh Multi-level Mesh

Mesh size = 0.4 mm; Count = 931k Mesh size = 2 mm; Count = 343k
Meshing
Multi-level Meshing: An Example
Multi-level Mesh Multi-level Mesh

Mesh size = 4 mm; Count = 169k Mesh size = 6 mm; Count = 125k
Meshing
Stair-stepped Meshing- Example
Zero-Slack Assembly
• Zero slack for nonnon-conformal

conformal assemblies
– Allows non-conformal interfaces to contact
object
bj t bboundaries
d i
– Enables solder balls, solder bumps, heat
sinks, etc. to be meshed as separate
assemblies
– Reduces cell count
– Avoids mesh bleeding

Zero-Slack Assembly (Cont’d)
• No mesh bleeding at
assembly boundaries
Assembly Boundary
Multi-level 2D Cut Cell Meshing
• Multi
Multi-level
level 2D cut cell meshing
– Significantly reduce mesh count of 2.5D models
• Useful for trace modeling
170K cells
35K cells
2D Objects with Cartesian Mesh
• ANSYS Icepak allows

Cartesian meshing (stair-
stepped
pp meshes)) for
complex geometry
• New capability
p y to associate
stair-step mesh faces with
2D objects
• Allows additional mesh
controls for Cartesian
meshing

O-Grid Around 2D Objects
• O-Grid
O G d foro 2D object
– Sub-blocking extended
j
around 2D objects
– Mesh density can be
localized around 2D objects
• Reduces cell count
• Improves mesh quality
• Better flow/thermal boundary
layer resolution

Mesh Transitioning in 2D Cut Cells
• Improve mesh quality in single axis,

intersecting extrusion
Additional cell splitting
Before (bumps and After (smooth transitions)

pinches throughout)

Complex Shaped Walls/Grilles:
CAD Shape Support for 2D Objects
• Allow shape of grilles, walls, openings and fans to be
defined directly by CAD geometry
• Allow inclusion of realistic shapes (instead of
approximation
i ti as simple
i l polygons)
l )
Grille Object

ANSYS Icepak Offers Two Methods for Fan Modeling
•Fan Curve Approximation for System Level
•MRF (Moving Reference Frame) for Component Level
9Use HDM
9Need CAD Data

Operating RPM
05
0.5
water)
0.4
Pressuure(in-w
0.3 1500
0.2 5000
0.1
0
0 10 20 30 40 50
Volumn Flow(CFM)
3000 RPM 5000 RPM 1500 RPM

MRF in Ansys Icepak

Need for MRF
• Simplified fan modeling with fan object

– Has serious limitations
– Pressure drop versus flow rate (P-Q) curve can be system
dependent
– Cannot model flow reversal in some regions on the fan surface
– How to quantify swirl?
– Effects of blade geometry
• Moving reference frame model more accurately represents the fan

flow characteristics

Need for MRF – Swirl
Wind tunnel comparison

• Swirl – radial & tangential
flow components are better
captured in MRF fan
• If swirl is not captured:

– Flow penetration is
exaggerated – usually
the case with fan object
– Fan object may show
excessive cooling ii.e.;
e;
lower temperature

MRF in Ansys Icepak
— Blower I

MRF in Ansys Icepak
— Blower I 速度場分佈

MRF in Ansys Icepak
— Sunflower with Fan
HDM Mesh

MRF in Ansys Icepak
— Sunflower with Fan 溫度場分佈

真實風扇扇葉幾何

風扇網格建立

後處理 - Temperature

後處理 - Temperature

後處理 - Velocity

後處理 – Particle trace

•Geometry
Icepak Fan object Icepak Blower

object
Real Fan geometry

•Mesh

object
Real Fan geometry

•Fin Temperature

object
Real Fan geometry

•Temperature

object
Real Fan geometry

•velocity

object
Real Fan geometry

•Icepak fan object的流場方向基本上是出風口平面的法線方向
•Icepak
Icepak type1 blower的流場方向基本上是圓柱面順著逆時針方向旋轉
出去
•以這個例子來看，是將軸流扇的風扇部分(裸扇)從外殼中取出，置於
放射鰭片中。在流場方向上，除了一般軸流扇法線方向的流場外，在
風扇側邊也有流場吹向旁變的鰭片。是結合軸流扇與離心扇的流場型
態
•首先在風扇的性能曲線上就已有變動，與之前量測的、測試時含有外
殼的風扇的性能不一樣，不能直接套用。
•所以不論是使用Icepak的fan或type 1 blower都無法準確分析出正確
的流場與鰭片溫度，必須要將風扇葉片的實際幾何轉入，直接給予風
扇轉速方可以分析出來
扇轉速，方可以分析出來。

Solver
S l
Enhancements

輻射的數值解析
輻射模型透明體半透明光學平行優點缺點
解析體解析考慮計算
•相對於P1模型而言，計算更快，更只能用於光學厚度比較大的情況
Rosseland 〤 △(τ>5) 〤 ○ 節省記憶體
•求解時間較少 •假定所有表面都是散射
P1 〤 △(τ>1) 〤 ○ •考慮擴散效應 •基於灰體輻射假設
•對於光學厚度比較大的問題，表現 •傾向於預測局部熱源或接受器的輻射
非常好通量
•使用曲線座標，容易處理複雜幾何
•能夠求解所有光學厚度區間的輻射
DO ○ ○ ○ ○ 問題
•能求解燃燒問題中的面對面輻射
•能求解半透明介質輻射
•記憶體和計算時間較適中
•模型較為簡單 •假定所有表面都是散射
DTRM ○ ○ 〤〤 •可以通過增加射線數量來提高計算 •基於灰體輻射假設
精度 •對於大數目的射線問題，非常耗費計
算時間
•非常適用於沒有介質的輻射問題 •假定所有表面都是散射
S2S ○ 〤〤 ○ •基於灰體輻射假設
•表面數量增加時，記憶體需求會非常
大
•不能用於週期邊界的模型中
•不能用於對稱邊界問題
•光學厚度：表示不透明度的一個無因次化常數，是選擇輻射模型的參考標準
•多數解析手法沒有考慮光學效果，在電子行業的應用顯得機能不足
© 2010 ANSYS, Inc. All rights reserved. ANSYS, Inc. Proprietary
Discrete Ordinates Model
•離散輻射DO是考慮四面八方，因此會有球體示意圖，取
其中一個象限這一個象限裡面就會有
其中一個象限，這一個象限裡面就會有Theta Divisions跟Phi
跟
Divisions。
•Theta Divisions跟Phi Divisions的數量越高，球體就會離散
出越多的計算區塊也就會越準但是電腦計算就會越久
出越多的計算區塊，也就會越準，但是電腦計算就會越久。
•Theta Pixels跟Phi Pixels是每塊離散出的弧面解析度。取
Theta Divisions=2與Phi Divisions =2，這樣八分之一球體中就
會有2乘2 4個的相位出現，而每個相位的弧面可以設定解
會有2乘2=4個的相位出現，而每個相位的弧面可以設定解
析度，可以切得很細讓軟體去內插。
•若曲面很多, 離散的數量就必須多 (Theta Divisions，Phi
Divisions 得高一點)，否則會算不準

Discrete Ordinates Model
優點
-光學的考慮
•可以對應到透明體(真空/空氣)、半透明體(玻璃)
•可以解析除流體外的固體內部(玻璃)的輻射現象(Icepak不支援)
可以解析除流體外的固體內部(玻璃)的輻射現象(Icepak不支援)
•可以對應鏡面反射(平滑的反射板)
-通常情況下為漫射
•可以對應在介面上的折射(Icepak不支援)
•可以對應是波長函數的材料性質(Icepak不支援)
-計算負荷
•可以通過方向的分割數來調整計算負荷和精度
可以通過方向的分割數來調整計算負荷和精度
•一開始可以使用較粗的分割
•在要求精度時可以使用較密的分割
•可以對應大規模解析
•計算負荷隨網格數線性增加
•可以對應平行計算

Radiation Enhancements
• New cluster
cluster-based
based ray tracing method for view factor
calculation
– Faster and more accurate versus discrete ordinates
Ray
ay ttracing
ac g view
e factor
acto model
ode Discrete
sc ete ordinates
o d ates radiation
ad at o model
ode

Ray tracing approach
•The S2S radiation model is computationally very expensive when you calculate
the radiation and view factors for a large number of surfaces
surfaces.
•To reduce the computational time as well as the storage requirement, the number
of surfaces is reduced by creating surface “clusters”.

Radiation Enhancements
• Support for solar loading

– Automatically account
for heat transfer due to
solar loading
• Date/Time
• Position

CSV Transient Data Import
• Allows transient data and data-to-object

j map
p to be set
up via a single CSV file import
• Cuts setup time to one single import step

P t
Postprocessing
i
Enhancements

Write CFD Post file Now
• All mesh types are supported:
– Polyhedral meshes
– Non-conformal meshes
– Adapted meshes and hanging nodes
– 2-D, axisymmetric (extruded)
• All physics models are supported:
– All 3-D and 2-D field data
– User defined memory (UDM) and user
defined scalars (UDS).
– Accurate quantitative: integrals of
solution variables are based on
element/face data.
• Tip: Use compact CDAT file format in
Icepak 12.0.
– Used automaticallyy when launching g
CFD-Post from Icepak 12.0

ANSYS CFD-Post Bundled with
ANSYS Icepak
• Included with Icepak

– On ANSYS FlexLM
• Improved graphics and
animations
• Handles models with
large mesh sizes

CFD Post-Workbench support – FSI

CFD Post - Case comparison
Click to
activate
Select two of the loaded

cases or two timesteps

CFD Post - Colour map editing
• Create your own colour maps

• Set the default colour map
p
• Transparency supported

CFD Post - Realistic water rendering
• Iso-surface of volume fraction

• Settings:
g
Or “Metal”
CFD Post - Reflection
• Example: model is symmetrical, only half is

solved
1.Change Default Instancing
– Set # of copies to 2
– Apply 180 degree rotation
– Apply
Appl reflection
2.Add “mirror” Plane
– Set to Sample (e.g. circular)
– Set Transparency to 0.5

• There are several built-in spherical backgrounds,
but you can create your own
Right Edit > Options > Viewer
Back
Front
Top Left
Right
Left
Back Front
Bottom Top
Bottom
Create
C t 6 pictures
i t
(90° angle views) Make single 1x6 image
CFD Post - Curved vectors

Icepak Post-prosessing CFD-Post 12


ECAD/MCAD
Enhancements

Modeling Traces

•Package與PCB內部都含有多層結構與佈線分佈。
•若每一層都要建立出詳細的佈線幾何，並進行每層佈線的熱傳
分析，則耗費的成本與資源將非常可觀。對於系統等級的模型
來說，也是相當不切實際。
•從熱傳分析來看，Package與PCB內部的材質特性並非是等向
從熱傳分析來看 P k 與PCB內部的材質特性並非是等向
性，在平面法線方向與平面方向的熱傳導係數值是不一樣的。
這其實與每一層的佈線分佈有關。

•可計算出封裝元件或PCB各區域不同的熱傳導係數值(kx, ky 與
kz) 。
•直接分析出非均勻分佈的佈線所造成的熱分佈影響，而不需要增
加網格數量。
•IC或PCB元件只需建立一block元件即可，不需連詳細之內部幾何
IC或PCB元件只需建立一bl k元件即可不需連詳細之內部幾何
都建立出來(VIA, top or bottom mask等)。
•因為只有單一元件，所以非常容易建立網格，網格品質也比較好。

Modeling Traces
Description of technique
• Import trace geometry from mcm/gerber
• Create a background mesh for traces on each layer
– kx, ky, kz on each cell are determined by local trace density and direction
• Create a physical model mesh for PCB outline
– Trace geometry is not included in the mesh
• Compute locally varying orthotropic conductivity
on board (kx, ky and kz)
– Mapped from background mesh to physical model mesh
• Y
You can import
i t the
th trace
t layout
l t off boards
b d for
f use
in heat transfer and fluid flow simulations. The file
pp
formats supported are MCM,, BRD files that were
created using EDA software such as Cadence
Allegro and Gerber files (.art, .gbr, .pho) that were
created using Cadence,
Cadence Synopsys
Synopsys, Zuken
Zuken, and
Mentor.
Trace and Via Modeling
• 3X improvement in memory requirements

• Detailed via modeling
– Via details imported while reading BRD / Gerber files
– Vias tab populated with via group name
name, diameter and layer
connectivity
– Users need to enter electroplating thickness and whether
filled/unfilled
– Can change dia.

PCB Modelling Traces: example

Trace layout on a PCB. Different colors show different layers of traces.

•在Icepak中可直接修改PCB
layout的厚度與線路材質

不同PCB建立方式比較
•利用等效熱傳導係數之PCB. •輸入實際layout trace之PCB
PCB Temperature 強制對流環境(最高溫/最低溫,℃)

利用等效熱傳導係數建立之PCB 86.56/20.03
輸入實際layout trace之PCB 93.93/27.48
•由溫度分佈可得知，輸入實際PCB layout線路與利用等效熱傳導係數建
立PCB的方式，不但連溫度分佈趨勢不同，PCB最高與最低溫相差7度。
Import ECAD via Ansoft Links
• Import Ansoft Neutral

Format (ANF) file
– ANF components
can be imported for
both block and
package objects
– ANF v2 format
• Import ECAD data
from Cadence, Mentor
G
Graphics
hi and d Zuken
Z k
via Ansoft Links

Icepak-SI Wave link

Icepak Feature:
Icepak SI Wave link
Icepak-SI
•SI wave 是Ansoft公司針對高性能IC封裝、PCB和

系統所推出全波電磁場模擬器軟體，用於PCB或IC
package的電源完整性(Power Integrate)及訊號完整
性(Signal Integrate)的設計及分析。
•工程師可用它來作高速PCB、Mixed Signal PCB、
RF PCB、Back Plane及Package的
SSN(Simultaneous Switching Noise)、Power and
Ground Bounce、Resonances、反射及傳輸線與板
間的耦合問題的設計及求解或解偶電容的最佳化設
計。
•SIwave可以完全融入到您的設計流程, 讓您從標準
的layout軟體，如Cadence Allegro/Advanced
Package Designer、Synopsys Encore、Mentor
Graphic Board Station/Expedition與Zuken CR-
5000，很容易地將layout直接輸入到SI wave 之中進
行分析。
行分析

Icepak Feature:
Icepak SI Wave link (cont.)
Icepak-SI (cont )
Power Integrity
Signal integrity
Parasitic Extraction Joule Heating
distribution input
for Icepak
Simulation Import Into

using SI wave cepa
Icepak

Icepak Feature:
Icepak SI Wave link (cont.)
Icepak-SI (cont )
•Conductivity of Joule heat region is high (copper)

9Both current prediction and localized
conductivity distribution are essential for accuracy

Example –
DC Voltage Drop Across a PWB
•This DCIR example is intended to
show you how to simulate the voltage
drop across a power plane between the
voltage regulator module (VRM) and an
asic
i controller.
t ll
•Due to the larger number of plane cut
outs, non-ideal current paths, vias and
signals on a PWB the power
distribution network (PDN) suffers
dramatically. This example will show
you to verify a PDN for I2R losses
losses.
•For this example, we will define a
voltage source and current sink on a
PWB to analyze the voltage drop as
the current approaches the ASIC
controller.

Example –
•Plotting of voltage gradient and current vectors
voltage gradient current density (A/m2)

Example –
•Model after trace import in Icepak

Example –
•Importing Joule Heat distribution from SI Wave to Icepak
Make Sure to turn on “All files”, since the SIwave

generated files carry “.out” extension
Example –
DC Voltage
g Drop
p Across a PWB
•Temperature on Board

0
Velocity cut plane

1
Temperature distribution with
component & board power

2
Temperature distribution with component
power only (trace heat loads deactivated)

3
Temperature distribution with board joule
heat only (component power turned off)

4
Effect of Joule Heating
• Temperature at Voltage Regulator without accounting for Board

Heating
– 38 ℃
• Temperature at Voltage Regulator after including Board Heating
– 42.5 ℃
• % change in Board temperature as a result of accounting for Board
heating = 25%

5
Macro
Macro
Enhancements

Macro: ATX Chassis
•可建立完整之ATX(三大二小)或Mirco-ATX(二大
一小) ，包含主機板、顯示卡、記憶體、軟硬碟
包含主機板顯示卡記憶體軟硬碟
機、光碟機與電源供應器完整之電腦系統

7
Macro: Rotate Block and plate
p
• This macro can be used to rotate a
group(s) of blocks through an arbitrary
angle about a given co-ordinate axis.
– The only limitation is that the blocks must
be prismatic in shape.
• The user first creates a g group,p, then
chooses it from the available list. Once all
groups have been chosen, accept will
rotate them about the pivot point + axis.axis
• If the group contains other objects, then
these will not be rotated.
• Icepak re-creates the blocks using
polygonal blocks.

8
Macro: Angled Fin Heat Sink
Fins
Base

9
Macro: Sunflower Heat Sink
Base
Fin

0
Macro: Sunflower Heat Sink with triangular fin
Base with Hub
Fin

1
Macro: Folded Fin
Fin
Base

2
Macro: Circular Based Pin Fin
Array Fin 1
Array Fin 2
Base

3
Macro: Cylinder
y - Plates
• Creates a cylinder by faceting

the surface with thin
conducting plates.
• Facets are specified per
quarter, and must be even in
number.
number

4
Macro: Polygonal
yg Enclosure
• Creates a cylindrical enclosure:

– 4 hollow polygonal blocks change
the shape of the cabinet into a
cylinder
li d
– Walls are then used to facet the
sides of the polygonal blocks in
contact with the fluid, and the
remaining sections of the cabinet.
•Facets
F t are per
Quarter and must be
even in number.
number

5
Macro: Hemisohere

6
Macro: 業界標準SOT封裝

7
Macro: 功率電阻
TO220 - Peripheral Flange Mounted TO252 - Axial Flange Mounted
TO263 - Plastic Surface Mounted

8
Macro: TECs
New TEC Macro
– Developed with Marlow
– Improved geometric fidelity
• Includes ceramic and copper
elements
–N
Nonlinear
li ttemperature
t
effects
• Seebeck coefficient
• Electrical resistivity
• Thermal conductivity
– Two modes
• Determine required current to
achieve
hi a specified
ifi d ttemperature
t
• Specify the current and
determine the temperature
– Remember to specify TEC
values (G-factor and # of
elements)

9
Macro: Heat Pipe
• Heat pipe modeled as network blocks

– Automatically creates appropriate network connections
Heat pipe internal

thermal network

0
Macro: JEDEC Chamber
•1.龐大的內建材料庫功能
內建各種測量標準平台
A>HeatSink
A> HeatSink測試風道環境
測試風道環境
A>固體材料
A> 固體材料
B>JEDEC標準之測試環境
B>JEDEC 標準之測試環境
B>流體材料
B>流體材料
C>表面材料
C> 表面材料
2.內建常用的電子零件
A>各廠牌的
A> 各廠牌的HeatSink
HeatSink((內建各廠牌型號的HeatSink
內建各廠牌型號的HeatSink))
B>各廠牌的
B> 各廠牌的TECSTECS致冷晶片
致冷晶片((內建各廠牌型號的TECS)
內建各廠牌型號的TECS)
C>散熱膏或錫膏
C> 散熱膏或錫膏( (內建各Thermal
內建各Thermal interface材料
interface材料))
D>各廠牌的風扇
D> 各廠牌的風扇((內建各廠牌型號風扇
內建各廠牌型號風扇PP-Q及轉速及轉速))
E>各廠牌的過濾器
E> 各廠牌的過濾器((內建各廠牌型號的Filters)
內建各廠牌型號的Filters)
F>各樣式的封裝
F> 各樣式的封裝Chip(
ICEPAK提供各種CHIP Chip(內建各種
內建各種PBGA
PBGA、
、Cavilty Down BGA、
BGA、FPBGA
FPBGA、
、Flip
Chip、
Chip 、QFP、
QFP、DUAL
在JEDEC的測試標準環 DUAL、
、SDBGA
SDBGA、
、LCC、
CC、FlipChip-
lipChip-BGA
BGA封裝結構
封裝結構)
封裝結構)
境
3.內建各種測量標準平台
A>HeatSink
A> HeatSink測試風道環境
測試風道環境
B>JEDEC標準之測試環境
B>JEDEC 標準之測試環境
1
Natural Convection (Still Air) Chamber,
JEDEC JESD51-2
JESD51 2
•與時間無關之穩態分析(steady state)
•自然對流分析(natural convention)
•邊界條件：wall, Heat transfer coefficient (h)=5
W/K-m2
•計算θJA、ψJB與ψJC

2
Natural Convection (Still Air) Chamber,
JEDEC JESD51-2
JESD51 2
JEDEC •The formula for θJA is:
T Board
Test B d θJA= (T
= (Tjunction– Tambient) / Q
) / Qtot
Package Where:
Tjunction = The maximum temperature of Die.
Fixture Tambient = Ambient temperature.
Qtot = Total power
power.
•The formula for ψJB is:

ψJB = (T
( junction – TBoard, mean
Board mean))/Qtot
Where:
Tboard, mean = The mean temperature of the package
projected
p j area on PCB.
Qtot = Total power.
•The formula for ψJC is:

ψJC = (T
(Tjunction – Tcase, mean)/Qtot
Where:
Internal Tjunction = The maximum temperature of Die.
Ambient Enclosure Tcase, mean = The mean temperature of the package
top molding surface
surface.
Qtot = Total power.

3
Forced Convection (Moving Air)
Chamber JEDEC JESD51
Chamber, JESD51-66
•強制對流分析(forced
強制對流分析(f d convention)
i )
•邊界條件：前後面為開放邊界，設定入風口速
度，四周為絕熱邊界(adiabatic)
•計算θ ψJB與ψJC (相關計算公式如下所示)
計算θJA、ψ

4
Forced Convection (Moving Air)
Chamber JEDEC JESD51
Chamber, JESD51-66
Inlet •The formula for θJA is:
P k
Package θJA= (T
= (Tjunction– Tambient) / Q
) / Qtot
Where:
JEDEC Test Board Tjunction = The maximum temperature of Die.
Tambient = Ambient temperature.
Qtot = Total power
power.
•The formula for ψJB is:

ψJB = (T
( junction – TBoard, mean
Board mean))/Qtot
Where:
Tboard, mean = The mean temperature of the package
projected
p j area on PCB.
Ambient
Qtot = Total power.
Temperature Probe
Wind Tunnel •The formula for ψJC is:

Exhaust ψJC = (T
(Tjunction – Tcase, mean)/Qtot
Where:
Tcase, mean = The mean temperature of the package top
molding surface.
surface
Qtot = Total power.

5
Junction-to-Board, JEDEC JESD51-8
•自然對流分析(natural
自然對流分析(natural convention)
•邊界條件：封裝下方之PCB的上方為
絕熱邊界(adiabatic)，PCB側面為
Outside temperature
temperature=0
0℃℃，強制熱量
強制熱量
往下方PCB處傳遞
•計算θJB (相關計算公式如下所示)

6
Junction-to-Board, JEDEC JESD51-8
PCB
等效K=(20, 20, 0.35)
Outside temperature=0℃
•The formula for θJB is:

θJB= (Tjunction– Tboard, mean) / Qtot
Where:
Tboard, mean = The mean temperature of the package projected area on
PCB
PCB.
Qtot = Total power.
7
Junction-to-Case, θJC
Heat transfer coefficient (h)=25 W/K-m2 •與時間無關之穩態分析(steady
state))
•自然對流分析(natural convention)
•邊界條件：封裝上方為wall,
Heat transfer coefficient (h)=25
W/K-m2 ，四周為絕熱邊界
(adiabatic)，強制熱量往上方傳遞
•計算θJC (相關計算公式如下所示)
g
•The formula for θJC is:

θJC= (Tjunction– Tcase, mean) / Qtot
Where:
Tcase, mean = The mean temperature of the package top molding surface.
Qtot = Total
T t l power.

8

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• ANSYS Workbench Integration

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• Integration of all core ANSYS applications

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• Data transfer between DesignModeler and Icepak using

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• HDM uses domain decomposition to

• Interaction between sub-blocking

Mesh Count ~ 52k

• New feature “Uniform Params”

Mesh Count ~ 20k

• Characterized by nodes on faces

No Multi-level Mesh Multi-level Mesh

Multi-level Mesh Multi-level Mesh

• Zero slack for nonnon-conformal

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• ANSYS Icepak allows

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• Improve mesh quality in single axis,

Before (bumps and After (smooth transitions)

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3000 RPM 5000 RPM 1500 RPM

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• Simplified fan modeling with fan object

• Moving reference frame model more accurately represents the fan

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Wind tunnel comparison

• If swirl is not captured:

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