DQ45EK SpecUpdate08
DQ45EK SpecUpdate08
DQ45EK SpecUpdate08
DQ45EK
Specification Update
July 2010
Order Number: E53963-008US
The Intel® Desktop Board DQ45EK may contain design defects or errors known as errata, which may cause the product to deviate
from published specifications. Current characterized errata are documented in this Specification Update.
Revision History
Revision Revision History Date
-001 This document is the first Specification Update for the September 2008
Intel® Desktop Board DQ45EK
-002 Updated the Specification Changes Section October 2008
-003 Update to the General Information Section January 2009
-004 Updated the Specification Changes Section April 2009
-005 Updated the Specification Changes Section June 2009
-006 Updated the Specification Changes Section July 2009
-007 Updated the General Information Section May 2010
-008 Updated the General Information Section July 2010
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined”. Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
The Intel® Desktop Board DQ45EK may contain design defects or errors known as errata which may cause
the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
Intel, the Intel logo, and Intel Core are trademarks of Intel Corporation in the U.S. and other countries.
This document is an update to the specifications contained in the Intel® Desktop Board
DQ45EK Technical Product Specification (Order Number E35967). It is intended for
hardware system manufacturers and software developers of applications, operating
systems, or tools. It will contain Specification Changes, Errata, Specification
Clarifications, and Documentation Changes.
For specification updates concerning the Intel processor that may apply to this desktop
board, refer to the following:
• Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet (Order Number
318733)
• Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop
Processor E6000 and E4000 Sequence Specification Update (Order Number
313279)
• Intel® Pentium® Dual-Core Desktop Processor E2000 Sequence Specification
Update (Order Number 316982)
• Intel® Celeron® Dual-Core Processor E1000 Series Specification Update (Order
Number 318925)
• Intel® Celeron® Processor 400 Sequence Specification Update
(Order Number 316964)
• Intel® Xeon® Desktop Processor 3300 Series Datasheet (Order Number 319007)
• Intel® Xeon® Desktop Processor 3200 Series Datasheet (Order Number 316134)
• Intel® Xeon® Desktop Processor E3110 Series Datasheet (Order Number 319006)
• Intel® Xeon® Desktop Processor 3000 Series Datasheet (Order Number 314916)
Unless otherwise noted in this document, it should be assumed that any processor
errata for a given stepping are applicable to the Altered Assembly (AA) revision(s)
associated with that stepping.
Refer to the Intel® 4 Series Chipset Family Specification Update (Order Number
319971) for specification updates concerning the 82Q45 GMCH Controller and that
may apply to the desktop board DQ45EK. Unless otherwise noted in this document, it
should be assumed that any MCH errata for a given stepping are applicable to the
Altered Assembly (AA) revision(s) associated with that stepping.
Refer to the Intel® I/O Controller Hub 10 (ICH10) Family Specification Update (Order
Number 319974) for specification updates concerning the I/O Controller Hub and that
may apply to the desktop board DQ45EK. Unless otherwise noted in this document, it
should be assumed that any ICH10DO errata for a given stepping are applicable to the
Altered Assembly (AA) revision(s) associated with that stepping.
General Information
Basic Desktop Board DQ45EK Identification Information
AA Revision BIOS Revision Notes
E30149-204 CBQ4510H.86A.0051 1,2
E30149-205 CBQ4510H.86A.0059 1,2
E30149-206 CBQ4510H.86A.0059 1,2
E30149-207 CBQ4510H.86A.0063 1,2
E30149-209 CBQ4510H.86A.0107 1,2
E30149-210 CBQ4510H.86A.0119 1,2
E30149-211 CBQ4510H.86A.0119 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The G33 Chipset kit used on this AA revision consists of two components as follows:
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is a requirement. Intel recommends the use of a Thermally Advantaged Chassis
(TAC) for this desktop board. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area. For a
list of Thermally Advantaged Chassis (TAC) please refer to the following website:
http://www.intel.com/go/chassis
Table 27 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 27. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
For more information regarding Thermal Design Guidelines please refer to:
http://developer.intel.com/Products/Desktop/Chipsets/Q45/Q45-techdocs.htm
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.