DQ45EK SpecUpdate08

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Intel® Desktop Board

DQ45EK
Specification Update

July 2010
Order Number: E53963-008US

The Intel® Desktop Board DQ45EK may contain design defects or errors known as errata, which may cause the product to deviate
from published specifications. Current characterized errata are documented in this Specification Update.
Revision History
Revision Revision History Date
-001 This document is the first Specification Update for the September 2008
Intel® Desktop Board DQ45EK
-002 Updated the Specification Changes Section October 2008
-003 Update to the General Information Section January 2009
-004 Updated the Specification Changes Section April 2009
-005 Updated the Specification Changes Section June 2009
-006 Updated the Specification Changes Section July 2009
-007 Updated the General Information Section May 2010
-008 Updated the General Information Section July 2010

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,


EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
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OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT
INTENDED FOR USE IN MEDICAL, LIFE SAVING, LIFE SUSTAINING APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined”. Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.

The Intel® Desktop Board DQ45EK may contain design defects or errors known as errata which may cause
the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:

Intel Corporation
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* Other names and brands may be claimed as the property of others.

Copyright © 2008-2010 Intel Corporation.

2 Intel Desktop Board DQ45EK Specification Update


Contents

Specification Update for the Intel® Desktop Board DQ45EK...... 4


Terminology ............................................................................................ 5
General Information ................................................................................. 5
Summary of Changes ............................................................................... 6
Specification Changes ............................................................................... 7

Intel Desktop Board DQ45EK Specification Update 3


Specification Update for the
Intel® Desktop Board DQ45EK

This document is an update to the specifications contained in the Intel® Desktop Board
DQ45EK Technical Product Specification (Order Number E35967). It is intended for
hardware system manufacturers and software developers of applications, operating
systems, or tools. It will contain Specification Changes, Errata, Specification
Clarifications, and Documentation Changes.

For specification updates concerning the Intel processor that may apply to this desktop
board, refer to the following:
• Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet (Order Number
318733)
• Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop
Processor E6000 and E4000 Sequence Specification Update (Order Number
313279)
• Intel® Pentium® Dual-Core Desktop Processor E2000 Sequence Specification
Update (Order Number 316982)
• Intel® Celeron® Dual-Core Processor E1000 Series Specification Update (Order
Number 318925)
• Intel® Celeron® Processor 400 Sequence Specification Update
(Order Number 316964)
• Intel® Xeon® Desktop Processor 3300 Series Datasheet (Order Number 319007)
• Intel® Xeon® Desktop Processor 3200 Series Datasheet (Order Number 316134)
• Intel® Xeon® Desktop Processor E3110 Series Datasheet (Order Number 319006)
• Intel® Xeon® Desktop Processor 3000 Series Datasheet (Order Number 314916)
Unless otherwise noted in this document, it should be assumed that any processor
errata for a given stepping are applicable to the Altered Assembly (AA) revision(s)
associated with that stepping.
Refer to the Intel® 4 Series Chipset Family Specification Update (Order Number
319971) for specification updates concerning the 82Q45 GMCH Controller and that
may apply to the desktop board DQ45EK. Unless otherwise noted in this document, it
should be assumed that any MCH errata for a given stepping are applicable to the
Altered Assembly (AA) revision(s) associated with that stepping.

Refer to the Intel® I/O Controller Hub 10 (ICH10) Family Specification Update (Order
Number 319974) for specification updates concerning the I/O Controller Hub and that
may apply to the desktop board DQ45EK. Unless otherwise noted in this document, it
should be assumed that any ICH10DO errata for a given stepping are applicable to the
Altered Assembly (AA) revision(s) associated with that stepping.

4 Intel Desktop Board DQ45EK Specification Update


Terminology
Specification Changes are modifications to the current published specifications.
These changes will be incorporated in the next release of the specifications.
Errata are design defects or errors. Characterized errata may cause the desktop
board behavior to deviate from published specifications. Hardware and software
designed to be used with any given Altered Assembly (AA) and BIOS revision level
must assume that all errata documented for that AA and BIOS revision level are
present on all desktop boards.
Specification Clarifications describe a specification in greater detail or further
highlight a specification’s impact to a complex design situation. These clarifications
will be incorporated in the next release of the specifications.
Documentation Changes include typos, errors, or omissions from the current
published specifications. These changes will be incorporated in the next release of the
specifications.

General Information
Basic Desktop Board DQ45EK Identification Information
AA Revision BIOS Revision Notes
E30149-204 CBQ4510H.86A.0051 1,2
E30149-205 CBQ4510H.86A.0059 1,2
E30149-206 CBQ4510H.86A.0059 1,2
E30149-207 CBQ4510H.86A.0063 1,2
E30149-209 CBQ4510H.86A.0107 1,2
E30149-210 CBQ4510H.86A.0119 1,2
E30149-211 CBQ4510H.86A.0119 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The G33 Chipset kit used on this AA revision consists of two components as follows:

Device Stepping S-Spec Numbers


82Q45 A3 SLB8A
82801JDO B0 SLG8U

Intel Desktop Board DQ45EK Specification Update 5


Summary of Changes
The following table indicates the Specification Changes, Errata, Specification
Clarifications, or Documentation Changes that apply to the Intel® Desktop Board
DQ45EK. Intel intends to fix some of the errata in a future revision of the desktop
board, and to account for the other outstanding issues through documentation or
specification changes as noted.
The following notations are used in the table:
Doc: Document change or update that will be implemented.
PlanFix: This erratum may be fixed in a future revision of the desktop board, driver, or BIOS.
Fixed: This erratum has been previously fixed.
NoFix: There are no plans to fix this erratum.
Shaded: This erratum is either new or modified from the previous version of the document.

No. Plans Specification Changes


1 Doc Information was added to Section 2.6 Thermal Considerations of the Technical
Product Specification.
2 Doc Updated Section 3.6.1 Language Support in the Technical Product Specification.
3 Doc Support for up to 4 GB system memory has been changed to support for up to 8 GB
system memory.
No. Plans Errata
There is no characterized erratum for this product

6 Intel Desktop Board DQ45EK Specification Update


Specification Changes
The Specification Changes listed in this section apply to the Intel® Desktop Board
DQ45EK Technical Product Specification (Order Number E35967).

1. Information was added to Section 2.6 Thermal Considerations of the Technical


Product Specification. This includes a new Caution statement, changes to the
Thermal Considerations for Components table, as well as lead-in text and a new
table, Tcontrol Values for Components.

2.6 Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is a requirement. Intel recommends the use of a Thermally Advantaged Chassis
(TAC) for this desktop board. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area. For a
list of Thermally Advantaged Chassis (TAC) please refer to the following website:
http://www.intel.com/go/chassis

Table 27 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.

Table 27. Thermal Considerations for Components


Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates

Intel Q45 Express Chipset 105 oC


Intel 82801JDO (ICH10DO) 110 oC

To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 27. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.

It is important to note that the temperature measurement in the system BIOS is a


value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. Intel® Quiet System Technology

Intel Desktop Board DQ45EK Specification Update 7


(Intel® QST) monitors the embedded thermal sensor for system fan speed control. The
upper operating limit when monitoring this thermal sensor is Tcontrol.

Table 28. Tcontrol Values for Components


Component Tcontrol
Processor For processor Tcontrol, see processor datasheets and processor
specification updates

Intel Q45 Express Chipset 99 oC


Intel 82801JDO (ICH10DO) 111 oC

For more information regarding Thermal Design Guidelines please refer to:
http://developer.intel.com/Products/Desktop/Chipsets/Q45/Q45-techdocs.htm

2. Updated Section 3.6.1 Language Support in the Technical Product Specification.

3.6.1 Language Support


The BIOS Setup program and help messages are supported in US English, French,
Spanish, and German.

3. Support for up to 4 GB system memory has been changed to support for up to


8 GB system memory. Partial section of Table 1 shown below.

Table 1. Feature Summary


Form Factor Mini-ITX (6.70 inches by 6.70 inches [170.18 millimeters by 170.18 millimeters])
Processor Support for the following:
• Intel® Core™2 Quad processor (65 W) in an LGA775 socket
• Intel® Core™2 Duo processor in an LGA775 socket
• Intel® Pentium® Dual-Core processor in an LGA775 socket
• Intel® Celeron® Dual-Core processor in an LGA775 socket
• Intel® Celeron® processor Sequence 400 in an LGA775 socket
Memory • Two 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 800 MHz or DDR2 667 MHz DIMMs
• Support for up to 8 GB of system memory using DDR2 800 MHz or DDR2
667 MHz DIMMs

8 Intel Desktop Board DQ45EK Specification Update


1.5 System Memory
The board has two DIMM sockets and support the following memory features:
• 1.8 V DDR2 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR2 SDRAM DIMMs
• Dual channel interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 8 GB maximum total system memory using DDR2 800 MHz or DDR2 667 MHz
DIMMs; refer to Section 2.1.1 on page 47 for information on the total amount of
addressable memory.
• Minimum recommended total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 800 MHz or DDR2 667 MHz SDRAM DIMMs
• DDR2 667 MHz DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP)
• DDR2 800 MHz DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)

 NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.

Table 3. Supported Memory Configurations


Smallest usable Largest usable Maximum capacity
DIMM (one x16 DIMM (one x8 with four identical
DIMM SDRAM Single-sided Double-sided x8 Double-sided
Type Technology DIMM) DIMM) DIMMs
DDR2 667 512 Mbit 256 MB 1 GB 2 GB
DDR2 667 1 Gbit 512 MB 2 GB 4 GB
DDR2 667 2 Gbit 1 GB 4 GB 8 GB
DDR2 800 512 Mbit 256 MB 1 GB 2 GB
DDR2 800 1 Gbit 512 MB 2 GB 4 GB
DDR2 800 2 Gbit 1 GB 4 GB 8 GB

Intel Desktop Board DQ45EK Specification Update 9


2.1.1 Addressable Memory
The board utilizes 8 GB of addressable system memory. Typically the address space
that is allocated for PCI Express configuration space, BIOS (SPI Flash), and chipset
overhead resides above the top of DRAM (total system memory). On a system that
has 8 GB of system memory installed, it is not possible to use all of the installed
memory due to system address space being allocated for other system critical
functions. These functions include the following:
• BIOS/ SPI Flash (32 Mbits)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• Front side bus interrupts (17 MB)
• PCI Express configuration space (256 MB)
• GMCH base address registers, internal graphics ranges, PCI Express ports (up to
512 MB)
• Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards
• Base graphics memory support (1 MB or 8 MB)
• Intel® Management Engine Interface (Intel® MEI) single channel (8 MB) or dual
channel (16 MB)

10 Intel Desktop Board DQ45EK Specification Update


The amount of installed memory that can be used will vary based on add-in cards and
BIOS settings and operating system installed. Figure 8 shows a schematic of the
system memory map. All installed system memory can be used when there is no
overlap of system addresses.

Figure 8. Detailed System Memory Address Map

Intel Desktop Board DQ45EK Specification Update 11


Table 10 lists the system memory map.

Table 10. System Memory Map


Address Range Address Range
(decimal) (hex) Size Description
1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the PCI bus).
Dependent on video adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory

12 Intel Desktop Board DQ45EK Specification Update

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