C1990HP Technical Data
C1990HP Technical Data
Technical Data
2.Features
(1) HPTC has almost as same yield strength, spring toughness and fatigue strength as mill-
Hardened Beryllium Copper for spring applications.
(2) Excellent bend formability provides severe bending design.
(3) Same chemical composition as conventional titanium copper means easy scrap control
and including no poison elements.
3.Chemical Composition
4.Physical Properties
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5.Mechanical Properties
Table 3. Mechanical Properties of HPTC
Tensile 0.2% offset
Strength Yield Strength Elongation Vickers Comment
(%) hardness
Temper (N/mm )2
(N/mm )
2
6.Bend Formability
“W” shaped bending test was performed to evaluate bend formability. The minimum bend radius
(MBR) without surface crack is determined. Table 4 shows MBR/t value, while fig. 1 shows outside
surface. It is apparent that HPTC gives much better bend formability.
Table 4. Minimum Bend Radius (MBR) of HPTC
MBR/t
Comment
good way bad way
EH(conventional) 1.0 4.0 comparison
HPTC-EH 0 1.0
HPTC-SH 0 2.0 Hyper Titanium Copper Alloy
HPTC-ESH 2.0 ≧5.0
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7.Fatigue Characteristic
Fatigue Characteristic is important when material is used as spring application such as connectors.
Fig. 2 shows results of fatigue tests. HPTC has almost as same fatigue strength as Beryllium
Copper.
800
700
600
Stress Loaded(N/mm2)
500
400
C1720R-1/2HM
300 HPTC-SH
200
100
0
1.E+04 1.E+05 1.E+06 1.E+07
Raputre Cycle
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8.Stress Relaxation Resistance
For connector system application, it becomes very important to maintain contact force over long
period at elevated temperature. Fig.3 shows data of stress relaxation test to evaluate materials’ such
ability. HPTC maintains 95% of initial load for 1,000hours at 150℃. It is apparent that HPTC gives
much better stress relaxation resistance than beryllium copper .
100
Stress Remaining (%)
95
90
85
80 HPTC-EH
HPTC-SH
75 HPTC-ESH
C1720R-1/2HM
70
0 200 400 600 800 1000
Time (hours) at 150℃
100
90
80
Stress Remaining (%)
70
60
50 HPTC-EH
HPTC-SH
40
HPTC-ESH
30 C1720R-1/2HM
20
10
0
0 100 200 300 400 500 600 700 800 900 1000
Time (hours) at 250℃
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9.Stress-Strain Curve
Fig. 4,5 and 6 show stress-strain curves of HPTC.
1200
1000
Nominal Stress (N/mm )
2
800
600
400
200
0
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22 0.24
Nominal Strain,ΔL/Lo
1200
1000
Nominal Stress (N/mm )
2
800
600
400
200
0
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22 0.24
Nominal Strain,ΔL/Lo
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1200
1000
600
400
200
0
0 0.02 0.04 0.06 0.08 0.1 0.12 0.14
Nominal Strain,ΔL/Lo
1200
1000
Nominal Stress(N/mm2)
800
600
400
200
0
0 0.02 0.04 0.06 0.08 0.1 0.12 0.14
Nominal Strain,ΔL/Lo
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1200
1000
Nominal Stress (N/mm )
2
800
600
400
200
0
0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08
Nominal Strain,ΔL/Lo
1200
1000
Nominal Stress (N/mm )
2
800
600
400
200
0
0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08
Nominal Strain,ΔL/Lo
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<Further
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