RO4500 Series Cost Performance Antenna Grade Laminates

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Data Sheet

RO4500™ Series
Cost Performance
Antenna Grade Laminates
Features and Benefits:

Loss range (0.0020 to 0.0037), Dk range (3.3 to


3.5), low PIM response
• Wide range of application use
Thermoset resin system
RO4500™ Series High Frequency Laminates are cost/performance materials from Rogers • Compatible with standard PCB
Corporation, specifically engineered and manufactured to meet the specific demands of fabrication
the antenna markets. Excellent dimensional stability
• Greater yield on larger panels sizes
RO4533™, RO4534™, and RO4535™ laminates extend the capabilities of the successful Uniform mechanical properties
RO4000® product series into antenna applications. This ceramic-filled, glass-reinforced • Maintains mechanical form during
hydrocarbon based material set provides the controlled dielectric constant, low loss handling
performance and excellent passive intermodulation response required for mobile
High thermal conductivity
infrastructure microstrip antenna applications.
• Improved power handling
As with all RO4000 high frequency laminates, RO4500 laminates are fully compatible with
conventional FR-4 and high temperature lead-free solder processing. These laminates Typical Applications:
do not require special treatment needed on traditional PTFE-based laminates for plated
through-hole preparation. This product series is an affordable alternative to more
• Cellular infrastructure base station
conventional PTFE antenna technologies, thus allowing designers to optimize the price
antennas
and performance of their antennas. Moreover, RO4533 and RO4534 laminates are available
halogen-free to meet the most stringent “green” standards, and RO4535 laminates are • WiMAX antenna networks
available with our RoHS-compliant flame-retardant technology for applications requiring
UL94 V-0 certification.

The resin systems of RO4500 dielectric materials are designed to provide the necessary
properties for ideal antenna performance. The coefficients of thermal expansion (CTEs)
in both the X and Y directions are similar to that of copper. The good CTE match reduces
stresses in the printed circuit board antenna. The typical glass transition temperature of
RO4500 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated
through-hole reliability. These properties, in combination with a dimensional stability
value of less than 0.05%, make RO4500 laminates an excellent candidate for printed circuit
antenna applications. RO4500 materials also provide increased thermal conductivity over
equivalent PTFE/woven glass materials, allowing for design of antennas with increased
power handling capability.

In addition to these excellent thermo-mechanical properties, RO4500 laminates embody


electrical characteristics that antenna designers need. The laminates have a dielectric
constant (Dk) ranging from 3.3 to 3.5 (±0.08) and a loss tangent (Df ) of 0.0020 to 0.0037
measured at 2.5 GHz. These values allow antenna designers to realize substantial gain
values while minimizing signal loss. Materials are available with demonstrated low PIM
performance, with values better than –155 dBC using two 43 dBm swept tones at 1900
MHz.

100 S. Roosevelt Avenue, Chandler, AZ 85226


Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com

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Property Typical Values Direction Units Condition Test Method
RO4533 RO4534 RO4535
Dielectric Constant, er
[1] 10 GHz/23°C
3.3 ± 0.08 3.4 ± 0.08 3.44 ± 0.08 Z - IPC-TM-650,2.5.5.5
Process 2.5 GHz
0.0020 0.0022 0.0032 2.5 GHz/23°C
Dissipation Factor Z - IPC-TM-650, 2.5.5.5
0.0025 0.0027 0.0037 10 GHz/23°C
Reflected 43 dBm Summitek 1900b PIM
[2]
PIM (Typical) -157 -157 -157 - dBc swept tones Analyzer
Dielectric Strength >500 >500 >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2
mm/m
Dimensional Stability <0.2 <0.3 <0.5 X,Y after etch IPC-TM-650, 2.4.39A
(mils/inch)
13 11 16 X
Coefficient of
11 14 17 Y ppm/°C -55 to 288°C IPC-TM-650, 2.4.41
Thermal Expansion
37 46 50 Z
Thermal 0.6 0.6 0.6 - W/(m.K) 80°C ASTM C518
Conductivity

Moisture Absorption 0.02 0.06 0.09 - % D48/50 IPC-TM-650, 2.6.2.1


ASTM D570
IPC-TM-650,
Tg >280 >280 >280 - °C TMA A 2.4.24.3
Density 1.8 1.8 1.9 - gm/cm3 - ASTM D792
6.9 6.3 5.1 lbs/in 1 oz. EDC post
Copper Peel Strength - IPC-TM-650, 2.4.8
(1.2) (1.1) (0.9) (N/mm) solder float
Flammability NON FR NON FR V-0 - - - UL 94
Lead-Free Process
Yes Yes Yes - - - -
Compatible
[1] Typical values are a representation of an average value for the population of the property. RO4500 LoPro laminates use a modified version of the RO4000 resin system to bond
reverse treated foil. Values shown above are for RO4500 laminates without the addition of the LoPro resin. For double-sided boards, the LoPro foil results in a core thickness increase of
approximately 0.0007” (0.000018mm) while the resulting Design Dk is dependent on laminate thickness due to LoPro resin Dk being 2.4. Therefore, design Dk is highly dependent on core
thickness. For specification values contact Rogers Corporation or visit the Rogers Technology Support hub at http://www.rogerscorp.com.
[2] PIM Performance is heavily influenced by the copper choice. PIM values provided are based on testing of reverse-treat electrodeposited copper foils using Rogers’ internal test method
on a 0.060” laminate. Typical PIM rating on standard EDC foils are < -145 dBc. Refer to the laminate thickness and copper option table for material options.

Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The rate of change increases at higher temperatures
and is highly dependent on the circuit design. Although Rogers’ high frequency materials have been used successfully in innumerable applications and reports of oxidation resulting in
performance problems are extremely rare, Rogers recommends that the customer evaluate each material and design combination to determine fitness for use over the entire life of the
end product.

Standard Thicknesses Standard Panel Sizes: Standard Claddings


RO4533/RO4535 24” X 18” (610 X 457 mm) Electrodeposited Copper Foil
0.020” (0.508mm) +/- 0.0015” 24” X 21” (610 X 533 mm) ½ oz. (18µm) HH/HH
0.030” (0.762mm) +/- 0.0015” 24” X 36” (610 X 915 mm) 1 oz. (35µm) H1/H1
0.060” (1.524mm) +/- 0.0040” 48” X 36” (1219 X 915 mm)

RO4534 *Additional panel sizes available *Additional cladding weights available


0.020” (0.508mm) +/- 0.0015”
0.032” (0.813mm) +/- 0.0020”
0.060” (1.524mm) +/- 0.0040”

*Additional non-standard thicknesses available from 0.020” - 0.060” in


varying increments
*Contact Customer Service or Sales Engineering to inquire about additional available product configurations

The information in this data sheet is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not create any warranties express or implied, including any warranty of
merchantability or fitness for a particular purpose or that the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit materials for
each application.These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.
The Rogers’ logo, Helping power, protect, connect our world, RO4500, RO4533, RO4534, RO4535 and LoPro are trademarks of Rogers Corporation or one of its subsidiaries.© 2021 Rogers Corporation, Printed in U.S.A.,
All rights reserved. Revised 1597 080422 Publication #92-166

100 S. Roosevelt Avenue, Chandler, AZ 85226


Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com

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