Trusted TMR 24 VDC Analog Input Module 40 Channel: Product Description

Trusted TMR 24 Vdc Analog
Input Module 40 Channel

PD-T8431 Issue 19
Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021

Supersedes PD-T8431 Issue 18 June 2018
Product Description Original Instructions

Trusted TMR 24 Vdc Analog Input Module 40 Channel
Important User Information

Read this document and the documents listed in the additional resources section about installation, configuration, and
operation of this equipment before you install, configure, operate, or maintain this product. Users are required to familiarize
themselves with installation and wiring instructions in addition to requirements of all applicable codes, laws, and standards.
Activities including installation, adjustments, putting into service, use, assembly, disassembly, and maintenance are required to
be carried out by suitably trained personnel in accordance with applicable code of practice.
If this equipment is used in a manner not specified by the manufacturer, the protection provided by the equipment may be
impaired.
In no event will Rockwell Automation, Inc. be responsible or liable for indirect or consequential damages resulting from the use
or application of this equipment.
The examples and diagrams in this manual are included solely for illustrative purposes. Because of the many variables and
requirements associated with any particular installation, Rockwell Automation, Inc. cannot assume responsibility or liability for
actual use based on the examples and diagrams.
No patent liability is assumed by Rockwell Automation, Inc. with respect to use of information, circuits, equipment, or software
described in this manual.
Reproduction of the contents of this manual, in whole or in part, without written permission of Rockwell Automation, Inc., is
prohibited.
Throughout this manual, when necessary, we use notes to make you aware of safety considerations.
WARNING: Identifies information about practices or circumstances that can cause an explosion in a hazardous environment, which may lead to
personal injury or death, property damage, or economic loss.
ATTENTION: Identifies information about practices or circumstances that can lead to personal injury or death, property damage, or economic loss.
Attentions help you identify a hazard, avoid a hazard, and recognize the consequence.
IMPORTANT Identifies information that is critical for successful application and understanding of the product.
Labels may also be on or inside the equipment to provide specific precautions.

SHOCK HAZARD: Labels may be on or inside the equipment, for example, a drive or motor, to alert people that dangerous voltage may be present.
BURN HAZARD: Labels may be on or inside the equipment, for example, a drive or motor, to alert people that surfaces may reach dangerous
temperatures.
ARC FLASH HAZARD: Labels may be on or inside the equipment, for example, a motor control center, to alert people to potential Arc Flash. Arc Flash will
cause severe injury or death. Wear proper Personal Protective Equipment (PPE). Follow ALL Regulatory requirements for safe work practices and for
Personal Protective Equipment (PPE).
2 Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021

Summary of changes
This manual includes new and updated information. Use these reference
tables to locate changed information.
Grammatical and editorial style changes are not included in this summary.
Global changes
This table identifies changes that apply to all information about a subject in
the manual and the reason for the change. For example, the addition of new
supported hardware, a software design change, or additional reference
material would result in changes to all of the topics that deal with that subject.
Change Topic
Updated branding. Throughout
New or enhanced features

This table contains a list of topics changed in this version, the reason for the
change, and a link to the topic that contains the changed information.
Topic Name Reason
About this publication Updated link for TechConnectSM Support Contract Access Level
and Features.
Removed instruction for using By Product when searching
Knowledgebase.
Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021 3

Table of Contents
Summary of changes About this publication ................................................................................ 7
Preface Download firmware, AOP, EDS, and other files....................................... 7
Additional resources ................................................................................... 7
Chapter 1
Product overview
Chapter 2
Description Field Termination Unit (FTU) ................................................................... 13
Field Interface Unit (FIU) .......................................................................... 13
Host Interface Unit (HIU) ......................................................................... 14
Front Panel Unit (FPU) .............................................................................. 14
Line Monitoring Thresholds ...................................................................... 15
Housekeeping ............................................................................................. 16
Fault detection and testing ........................................................................ 16
Sequence of Events characteristics ........................................................... 16
Chapter 3
Installation Module insertion and removal.................................................................. 17
Field cable selection ................................................................................... 17
Module pin-out connections ..................................................................... 18
Trusted module polarization and keying ................................................. 18
Chapter 4
Application Module configuration................................................................................ 21
T8431 Complex Equipment Definition ..................................................... 21
Rack 1: THRSHIN ................................................................................ 22
Rack 2: STATE ...................................................................................... 22
Rack 3: AI...............................................................................................23
Rack 4: THRSHOUT ............................................................................ 24
Rack 5: LINE_FLT ................................................................................ 25
Rack 6: DISCREP ................................................................................. 25
Rack 7: HKEEPING ............................................................................. 25
Rack 8: Information ............................................................................ 26
Sequence of Events configuration ........................................................... 28
System.INI file configuration .................................................................. 28
Chapter 5
Operation Front panel ................................................................................................ 29
Module status LEDs .................................................................................. 30
I/O status LEDs........................................................................................... 31

Table of Contents
Chapter 6
Fault finding and maintenance Fault reporting ........................................................................................... 33
Field wiring faults ...................................................................................... 33
Module faults .............................................................................................. 33
Companion slot .......................................................................................... 34
SmartSlot .................................................................................................... 34
Cold Start .................................................................................................... 34
Input Channel Calibration Check ............................................................. 35
Transfer between Active and Standby Modules....................................... 35
Chapter 7
Specifications
Appendix A
History of changes

Preface
About this publication This manual specifies the maintenance requirements and describes the
procedures to assist troubleshooting and maintenance of a Trusted® system.
Who should use this manual

This manual is for plant maintenance personnel who are experienced in the
operation and maintenance of electronic equipment and are trained to work
with safety systems.
Disclaimer
It is not intended that the information in this publication covers every
possible detail about the construction, operation, or maintenance of a control
system installation. You should also refer to your own local (or supplied)
system safety manual, installation, and operator/maintenance manuals.
Revision and updating policy

This document is based on information available at the time of its publication.
The document contents are subject to change from time to time. The latest
versions of the manuals are available at the Rockwell Automation Literature
Library: rok.auto/literature.
Latest product information

For the latest information about this product, review the Product
Notifications and Technical Notes issued by technical support. Product
Notifications and product support are available at the Rockwell Automation
Support Center: rok.auto/knowledgebase.
Some of the Answer IDs in the Knowledgebase require a TechConnectSM

Support Contract. For more information about TechConnect Support
Contract Access Level and Features, see Knowledgebase Document ID: IP622 -
TechConnect Support Contract - Access Level & Features.
Tip: Sign in to your Rockwell Automation account to view Knowledgebase articles.
Download firmware, AOP, Download firmware, associated files (such as AOP, EDS, and DTM), and
access product release notes from the Product Compatibility and Download
EDS, and other files Center at rok.auto/pcdc.
Additional resources These documents contain additional information concerning related

Rockwell Automation products.

Preface
Resource Description
Trusted TMR Safety Manual T8094, publication ICSTT- Provides the requirements that must be met at
RM459 different stages of a safety-related system to verify
that the safety-related objectives of a Trusted® TMR
System are achieved.
Industrial Automation Wiring and Grounding Provides general guidelines for installing a Rockwell
Guidelines, publication 1770-4.1 Automation industrial system.
Product Certifications website, Provides declarations of conformity, certificates, and
rok.auto/certifications other certification details.
You can view or download publications at http://rok.auto/literature.

Chapter 1
Product overview
The Trusted® TMR 24 Vdc Analog Input module interfaces to 40 sourcing field
input devices, acting as a current sink for all these devices. Comprehensive
diagnostic tests are performed on each input channel. Fault tolerance is
achieved through a Triple Modular Redundant (TMR) architecture within the
Module for each of the 40 input channels.
Using the built-in line-monitoring feature, the Module can detect open and
shorted field cables. Line monitoring functions are independently configured
for each input channel.
The Module provides onboard Sequence of Events (SOE) reporting with a

resolution of 1 ms. A change of state triggers an SOE entry. States are
determined by voltage thresholds that can be configured on a per channel
basis. When the field voltage and field return are connected to the auxiliary
input channels of the Module, thresholds can be specified as a ratio of the field
supply voltage.
Features
• 40 Triple Modular Redundant (TMR) input channels per Module.
• Comprehensive, automatic diagnostics and self-test.
• Selectable line monitoring per channel to detect open circuit and short
circuit field wiring faults.
• 2500V impulse withstand opto/galvanic isolation barrier.
• Onboard Sequence of Events (SOE) reporting with 1 ms resolution.
• Module can be hot-replaced online using dedicated Companion
(adjacent) Slot or SmartSlot (one spare slot for many modules)
configurations.
• Front panel input status Light Emitting Diodes (LEDs) for each
channel indicate input status and field wiring faults.
• Front panel module status LEDs indicate module health and
operational mode (Active, Standby, Educated).
• TϋV Certified IEC 61508 SIL 3.

Chapter 2
Description
The Trusted® TMR 24 Vdc Analog Input Module is a member of the Trusted
range of Input/Output (I/O) modules. All Trusted I/O Modules share common
functionality and form. At the most general level, all I/O Modules interface to
the Inter-Module Bus (IMB) which provides power and allows communication
with the Trusted TMR Processor. In addition, all Modules have a field
interface that is used to connect to module-specific signals in the field. All
Modules are Triple Modular Redundant (TMR).

Chapter 2 Description
Figure 1: Module Architecture

All High Integrity I/O Modules comprise four sections: Host Interface Unit
(HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU) and
the Front Panel Unit (or FPU).
Figure 2 shows a simplified functional block diagram of the Trusted 24 Vdc

Analog Input Module.
Figure 2: Functional Block Diagram
Field Termination Unit (FTU) The Field Termination Unit (FTU) is the I/O Module assembly that connects
all three FIUs to a field connector. The FTU primarily contains passive
components necessary for front-end signal conditioning. When installed in a
Trusted Controller or Expander Chassis, the FTU field connector mates to the
Field I/O Cable Assembly attached at the rear of the Chassis.
The SmartSlot link is passed from the HIU to the field connections via the
FTU. These signals go directly to the I/O cable assembly and maintain
isolation from the I/O signals on the FTU. The SmartSlot link is the intelligent
connection between Active and Standby Modules for coordination during
Module replacement.
Field Interface Unit (FIU) The Field Interface Unit (FIU) is the section of the Module that contains the
specific circuits necessary to interface to the particular types of field I/O
signals. Each Module has three FIUs, one per slice. For the TMR 24 Vdc Analog
Input Module, the FIU contains an analog to digital converter (ADC) for each
of the 40 field inputs.
The FIU receives isolated power from the HIU for logic. The FIU provides
additional power conditioning for the operational voltages required by the

FIU circuitry. An isolated 6.25 Mbit/sec serial link connects each FIU to one of
the HIU slices.
The FIU also measures a range of onboard “housekeeping” signals that assist
in monitoring the performance and operating conditions of the Module.
These signals include power supply voltages, current consumption, onboard
reference voltages and board temperature.
Host Interface Unit (HIU) The HIU is the point of access to the Inter Module Bus (IMB) for the Module.
It also provides power distribution and local programmable processing
power. The HIU is the only section of the I/O Module to directly connect to the
IMB Backplane. The HIU is common to most Trusted I/O Module types and
has type dependent and product range common functions. Each HIU contains
three independent slices, commonly referred to as A, B, and C.
All interconnections between the three slices incorporate isolation to prevent

any fault interaction between the slices. Each slice is considered a Fault
Containment Region (FCR), as a fault on one slice has no effect on the
operation of the other slices.
The HIU provides the following services common to the Modules in the
family:
• High Speed Fault Tolerant Communications with the TMR Processor

via the IMB interface.
• FCR Interconnect Bus between slices to vote coming IMB data and
distribute outgoing I/O Module data to the IMB.
• Optically isolated serial data interface to the FIU slices.
• Redundant power sharing of dual 24 Vdc chassis supply voltage and
power regulation for logic power to HIU circuitry.
• Magnetically isolated power to the FIU slices.
• Serial data interface to the FPU for Module status LEDs.
• SmartSlot link between Active and Standby modules for coordination
during Module replacement.
• Digital Signal Processing to perform local data reduction and self-
diagnostics.
• Local memory resources for storing Module operation, configuration,
and field I/O data.
• Onboard housekeeping, which monitors reference voltages, current
consumption and board temperature.
Front Panel Unit (FPU) The Front Panel Unit (FPU) comprises a Front Panel Termination Unit (FPTU)
and a Front Panel Display Unit (FPDU). The overall FPU contains the
necessary connectors, switches, logic, and LED indicators for the Front Panel.
For every type of Trusted I/O Module, the FPU contains the Slice Healthy,
Active/Standby and Educated indicators (LEDs), and the module removal
switches. Additional bicolor LEDs provide status indication for the individual

I/O signals. Serial data interfaces connect the FPU to each of the HIU slices to
control the LED status indicators and monitor the module removal switches.
Line Monitoring Thresholds The Module determines the contact state and line fault status by comparing
the input voltage level to four user programmed thresholds and two fixed
(minimum and maximum) thresholds. Hysteresis is provided on the
thresholds by upscale and downscale values, corresponding to the thresholds
for increasing and decreasing values respectively.
Table 1 Example Threshold Data (24 Vdc)
Note: The channel state value returned is dependent on the previous state value. If the input level is
increasing, then the lower state value will be returned. If the input level is decreasing, the higher
state value will be returned.
Default threshold values used for non-line monitored inputs are as follows (in
raw units):
Default = 448, 576, 1344, 1472, 2240, 2368, 3520, 3648, 5120

Housekeeping The Input Module automatically performs local measurements of several

onboard signals that can be used for detailed troubleshooting and verification
of Module operating characteristics. Measurements are made within each
slice’s HIU and FIU.
Fault detection and testing From the IMB to the field connector, the Input Module contains extensive
fault detection and integrity testing. As an input device, all testing is
performed in a non-interfering mode. Data input from the IMB is stored in
redundant error-correcting RAM on each slice portion of the HIU. Received
data is voted on by each slice. All data transmissions include a confirmation
response from the receiver.
Between the HIU and FIU, there are a series of optically isolated links for data
and power. The data link is synchronized and monitored for variance. Both
the FIU and HIU have onboard temperature sensors to characterize
temperature-related problems.
The power supplies for both the HIU and FIU boards are redundant, fully
instrumented and testable. Together, these assemblies form a Power Integrity
Subsystem.
The module field input is connected to a single bit ADC known as the ΣΔ input
circuit. These circuits, one per channel on each slice, produce a digital output
that naturally transitions between on and off. Any failure in the circuit causes
the output to saturate to stuck-on or stuck-off, which is automatically
detected. As the conversion process is dynamic and not gated like traditional
ADCs, failures are rapidly diagnosed and located.
By using the Σ∆ circuit, the analog path in the Module is short and does not
involve many components. This results in analog failures being contained to a
single channel on a single slice instead of causing a group of eight or more
inputs to fail.
Sequence of Events The Input Module automatically measures the field input voltage, compares
the value to the configurable thresholds, and determines the state of the field
characteristics input. An event occurs when the input transitions from one state to another.
When an input changes state, the onboard real-time clock value is recorded.
When the TMR Processor next reads data from the Input Module, the input
state and real-time clock values are retrieved. The TMR Processor uses this
data to log the input state change into the system Sequence of Events (SOE)
log. The user may configure each input to be included in the system SOE log.
Full details of SOE are contained in Trusted Sequence of Events and Process
Historian Package Product Description, publication ICSTT-RM243 (PD-
T8013).

Chapter 3
Installation
Module insertion and Before installation, visually inspect the module for damage. Ensure that the
module housing appears undamaged and inspect the I/O connector at the
removal back of the module for bent pins. If the module appears damaged or any pins
are bent, do not install the module. Do not try to straighten bent pins. Return
the module for replacement.
Ensure that the module is of the correct type.
Record the module type, revision and serial number of the module before
installation.
WARNING: The module contains static sensitive parts. Static handling precautions must be
observed. Specifically ensure that exposed connector pins are not touched. Under no
circumstances should the module housing be removed.
To install the module:

1. Ensure that the field cable assembly is installed and correctly located.
2. Release the ejector tabs on the module using the release key. Ensure
that the ejector tabs are fully open.
3. Holding the ejectors, carefully insert the module into the intended slot.
4. Push the module fully home by pressing on the top and bottom of the
module fascia.
5. Close the module ejectors, ensuring that they click into their locked
position.
The module should mount into the chassis with a minimum of resistance. If
the module does not mount easily, do not force it. Remove the module and
check it for bent or damaged pins. If the pins have not been damaged, try
reinstalling the module.
Field cable selection I/O cables suitable for use with the Trusted® TMR 24 Vdc Analog Input
Module are detailed in these publications:
• Trusted I/O Companion Slot Cables Product Description, publication

ICSTT-RM311 (PD-TC200)
• Trusted I/O SmartSlot Cables Product Description, publication ICSTT-
RM313 (PD-TC500)
The publications listed above also detail the types of Field Termination
Assembly (FTA) or Versatile Field Termination Assembly (VFTA) that may be
used with this type of module.

Chapter 3 Installation
Module pin-out connections This table describes the module pin-out connections:
Table 2 Field Connector Pin-out
C B A
1 SmartSlot Link C SmartSlot Link B SmartSlot Link A

2
3 Chan 28 (+) Chan 14 (+) Chan 0 (+)
4 Chan 28 (+) Chan 14 (+) Chan 0 (+)
5 Chan 29 (+) Chan 15 (+) Chan 1 (+)
6 Chan 29 (+) Chan 15 (+) Chan 1 (+)
7 Chan 30 (+) Chan 16 (+) Chan 2 (+)
8 Chan 30 (+) Chan 16 (+) Chan 2 (+)
9 Return Return Return
10 Chan 31 (+) Chan 17 (+) Chan 3 (+)
11 Chan 31 (+) Chan 17 (+) Chan 3 (+)
12 Chan 32 (+) Chan 18 (+) Chan 4 (+)
13 Chan 32 (+) Chan 18 (+) Chan 4 (+)
14 Chan 33 (+) Chan 19 (+) Chan 5 (+)
15 Chan 33 (+) Chan 19 (+) Chan 5 (+)
16 Chan 34 (+) Chan 20 (+) Chan 6 (+)
17 Chan 34 (+) Chan 20 (+) Chan 6 (+)
18 Chan 35 (+) Chan 21 (+) Chan 7 (+)
19 Chan 35 (+) Chan 21 (+) Chan 7 (+)
20 Return Return Return
21 Chan 36 (+) Chan 22 (+) Chan 8 (+)
22 Chan 36 (+) Chan 22 (+) Chan 8 (+)
23 Chan 37 (+) Chan 23 (+) Chan 9 (+)
24 Chan 37 (+) Chan 23 (+) Chan 9 (+)
25 Chan 38 (+) Chan 24 (+) Chan 10 (+)
26 Chan 38 (+) Chan 24 (+) Chan 10 (+)
27 Chan 39 (+) Chan 25 (+) Chan 11 (+)
28 Chan 39 (+) Chan 25 (+) Chan 11 (+)
29 Chan 40 (+) Chan 26 (+) Chan 12 (+)
30 Chan 40 (+) Chan 26 (+) Chan 12 (+)
32 Chan 41 (+) Chan 27 (+) Chan 13 (+)
32 Chan 41 (+) Chan 27 (+) Chan 13 (+)
Trusted module polarization All Trusted modules have been Keyed to prevent insertion into the wrong
and keying position within a chassis. The polarization comprises two parts: the module
and the associated field cable.
Each module type has been Keyed during manufacture. The organization
responsible for the integration of the Trusted System must key the cable by

Chapter 3 Installation
removing the keying pieces from the cable so that they correspond with the
bungs fitted to the associated module before fitting.
Figure 3: Module Polarization
For Cables with Companion Slot installations both keying strips must be
polarized.
For this module (T8431) remove keying pins 1, 4, and 5.

Chapter 4
Application
Module configuration There is no configuration required to the physical Input Module. All
configurable characteristics of the Module are performed using tools on the
Engineering Workstation (EWS) and become part of the application or
System.INI file that is loaded into the TMR Processor. The TMR Processor
automatically configures the Input Module after applications are downloaded
and during Active/Standby changeover.
The IEC 61131 TOOLSET provides the main interface to configure the Input
Module. Details of the configuration tools and configuration sequence are
provided in Trusted Toolset Suite Product Description, publication ICSTT-
RM249 (PD-T8082). There are three procedures necessary to configure the
Input Module. These are:
1. Define the necessary I/O variables for the field input data and module
status data using the Dictionary Editor of the IEC 61131 TOOLSET.
2. Create an I/O Module definition in the I/O Connection Editor for each
I/O Module. The I/O Module definition defines physical information,
e.g. Chassis and Slot location, and allows variables to be connected to
the I/O channels of the Module.
3. Using the Trusted® System Configuration Manager, define custom
LED indicator modes, per-channel threshold levels and noise filtering,
and other Module settings.
T8431 Complex Equipment The T8431 I/O Complex Equipment Definition includes eight I/O boards,
Definition referenced numerically by Rack number:
Table 3 Complex Equipment Definition
Rack I/O Board Description Data Type Direction No. of

channels
1 THRSHIN OEM Parameters - - -
Field Input Status Integer In 9
2 STATE Field Input State Integer In 40
3 AI Field Input Engineering Unit Integer In 40
4 THRSHOUT Threshold data Integer Out 11
5 LINE_FLT Line Fault Status Boolean In 40
6 DISCREP Channel Discrepancy Integer In 3
7 HKEEPING Housekeeping Registers Integer In 51
8 INFO I/O Module Information Integer In 11
There are two OEM parameters included in the first rack (THRSHIN Board).
These OEM parameters define the primary module position; declaring the
Module’s chassis and slot location. There is no need to define the secondary

Chapter 4 Application
module position within the IEC 61131 TOOLSET. Where systems may be
required to start-up with a Module in the secondary position as the Active
Module, e.g. primary module is not installed when application is started, the
secondary module’s position should be declared in the module definition of
the System Configuration Manager.
Table 4 OEM Parameters
OEM Parameter Description Notes
TICS_CHASSIS The number of the Trusted Chassis The Trusted Controller Chassis is 1, and
where the primary I/O Module is Trusted Expander Chassis are 2 to 15.
installed
TICS_SLOT The slot number in the Chassis The I/O Module slots in the Trusted
where the primary I/O Module is Controller Chassis are numbered from 1 to
installed 8.
The I/O Module slots in the Trusted
Expander Chassis are numbered from 1 to
12.
Rack 1: THRSHIN
This board allows the current thresholds for an analog input channel to be
read by the application, under control of the THRSHOUT board (see Rack 4:
THRSHOUT on page 24).
Table 5 Rack 1: Threshold Input Descriptions
Channel Description
1 Channel number being read. Range 0 to 41.

2 States 2 > 1 falling threshold
3 States 1 > 2 rising threshold
THRSHIN reads in the Module threshold values controlled by THRSHOUT in

Rack 4. See Table 1 for a graphical representation of the states and thresholds.
Rack 2: STATE
This board provides the majority voted numerical input state. This indicates
within which threshold band the field input is in and Module channel fault
status.

Table 6 Rack 2: STATE descriptions
Channel Description
1 Field input channel 1 state

The numerical input state is returned as an integer value.
Table 7 Rack 2: STATE Bit Descriptions
Channel Description
8-15 Internal channel fault on module

7 Unknown
6 Overrange
5 High-High
4 High
3 Normal
2 Low
1 Line fault
0 Underrange
The input channel has a value 7 (Unknown) when:
1. The input channel cannot be correctly measured by two or more slices

of the TMR Input Module.
2. The TMR Processor detects a 2oo3 channel discrepancy between the
three slices of the TMR Input Module.
3. The Module is simulated (not installed or the TMR Processor cannot
communicate with 2oo3 slices of the Module).
Rack 3: AI
The AI board returns the engineering units for the associated field input.
Table 8 Rack 3: Channel Field Engineering Units
Channel Description
1 Field input channel 1 voltage

The voltage is the median value taken from the triplicated Module. Field input
current is converted to voltage using a 250 Ω resistor on a standard field
termination assembly (FTA). This AI value may be used directly or scaled using
the IEC 61131 TOOLSET conversion tables. The voltage is reported as 1024
counts per volt. To allow easy scaling for 4-20 mA inputs, zero volts reports as -
1024, one volt reports as 0, and 5 volts reports as 4096.

Using a 250 Ω field loop configuration the following table represents normal
operating values.
Table 9 Rack 3: Normal Operating Values
Voltage Current Engineering Unit
Open Circuit -2048

0 0 mA -1024
1 4 mA 0
2 8 mA 1024
3 12 mA 2048
4 16 mA 3072
5 20 mA 4096
Rack 4: THRSHOUT
This board allows the current thresholds for an analog input channel to be
read or written by the application. The application can write new thresholds in
the THRSHOUT board for a particular channel, and it can read the current
thresholds from the THRSHIN board, under control of a channel in the
THRSHOUT board.
Note that channels 0 and 41 are internal reference channels, and are not
connected to the field. Channels 1 to 40 are field channels.
Table 10 Rack 4: THRSHOUT
Channel Description
1 Write the threshold data for a particular input

channel on channels 3 to 11 to the Module. The
data is written on a rising edge 0 to 1.
2 Read the threshold data for a particular channel
from the Module to the THRSHIN board. The data
is read on a rising edge 0 to 1.
3 Channel number to write/read threshold data.
Range 0 to 41.

Rack 5: LINE_FLT
This table describes Rack 5: LINE_FLT:
Table 11 Rack 5: LINE_FLT
Channel Description
1 Field input channel 1 line fault

The line fault input state is reported as true (logic ‘1’) for a line fault condition
(open circuit, indeterminate, or short circuit condition). The logic state is the
majority voted value.
Rack 6: DISCREP
This table describes Rack 6: DISCREP.
Table 12 Rack 6: DISCREP Bit Descriptions
Channel Description
1 Discrepancy status inputs 1 to 16

Each of the words reports the discrepancy status of 16 input channels. The
corresponding bit within the word is set to ‘1’ when a discrepancy condition is
detected on that input channel’s input state (rack 2).
Rack 7: HKEEPING
This table describes Rack 7: HKEEPING.
Table 13 Rack 7: Housekeeping
Channel Description
FCR Units (Full Scale Range)
1 A
2 B 24V2 Input Voltage -32768 32767 mV
3 C
4 A
Internal supply voltage (post
5 B -32768 32767 mV
regulator)
6 C
7 A
Internal supply current (post
8 B -32768 32767 mA
regulator)
9 C
10 A
11 B Input voltage (post isolation) -32768 32767 mV
12 C

13 A
14 B 24V1 Input Voltage -32768 32767 mV
15 C
16 A HIU Board Temperature
17 B (Note: Temperature, ºC = input -32768 32767 -
18 C value / 256)
19 A
20 B Front Panel Load Current -32768 32767 mA
21 C
22 A
23 B SmartSlot Link Voltage -32768 32767 mV
24 C
25 A
Reserved for FIU condensation
26 B 0 0 -
sensor
27 C
28 A
29 B FIU Internal Supply Voltage -32768 32767 mV
30 C
31 A
32 B FIU Internal Supply Current -32768 32767 mA
33 C
34 A
35 B FIU Unregulated input voltage -32768 32767 mV
36 C
37 A FIU Board Temperature
38 B (Note: Temperature, ºC = input -32768 32767 -
39 C value / 256)
40 A
41 B FIU Reference Voltage, DAC_X1 -32768 32767 mV
42 C
43 A
45 C
46 A
48 C
49 A
50 B Diagnostic error code
51 C
Each input within the housekeeping rack is reported as an integer. In general,

the application engineer will not normally require these inputs. They are
provided to aid fault finding and diagnosis and may be used for reporting and
display purposes. If a slice is Fatal, then all reported housekeeping inputs are
set to zero.
Rack 8: Information
This table describes Rack 8: INFO.

Table 14 Rack 8: INFO Descriptions
Channel Description
1 Active Module chassis number

2 Active Module slot number
3 Active Module healthy
4 Active Module mode
5 Standby Module chassis number
6 Standby Module slot number
7 Standby Module healthy
8 Standby Module mode
9 Fault Containment Region (FCR) status
10 Primary Module is active
11 Active Module is simulated
The Active Module chassis and slot numbers indicate the position of the
currently Active Module. These values will change to match the primary or
secondary module position, depending on their active status, i.e.
Active/Standby changeover will “swap” the values for the Active Module
chassis and slot number channels with those in the Standby Module chassis
and slot number channels. The chassis and slot numbers are set to zero if the
Module is not present.
The Active and Standby Module healthy channel is returned as an integer,
however only the least significant bit is used. A value of 0 indicates that a fault
has been detected, a nonzero value indicates that the Module is healthy.
The Active and Standby Module mode is an integer indicating the current
operating mode of the associated Module. The value indicates the current
internal operating mode of the Module.
Table 15 Rack 8: INFO Bit Descriptions
Value Module State
5 Shutdown
4 Maintain
3 Active
2 Standby
1 Configuration
0 Unknown, no module present
The FCR Status channel reports the fault status of the Active and Standby
Modules. The value is bit-packed as shown below, the least significant byte is
used with the most significant 8-bits set to zero:
Table 16 Rack 8: FCR Bit Descriptions
Bit Number
7 6 5 4 3 2 1 0
Standby Module Active Module
Ejectors FCR C FCR B FCR A Ejectors FCR C FCR B FCR A
open Healthy Healthy Healthy open Healthy Healthy Healthy

The ‘Primary Module is active’ channel is set to nonzero if the primary module
is the current Active Module, i.e. the Active Module is in the chassis and slot
numbers defined within the OEM parameters.
The ‘Active Module is simulated’ channel is set to nonzero if the Active Module
is being simulated, this will only be set if the Module is not present and the
simulation enable has been set within the module’s configuration in the
System.INI file.
Sequence of Events Each Boolean Input Variable can be configured for automatic Sequence of
Events (SOE) logging. This applies to the Input Status and Line Fault Status
configuration variables. A Boolean variable is configured for SOE during the variable
definition in the Data Dictionary Editor. To select SOE, press the Extended
Button in the Boolean Variable Definition Dialog Box to open the Extended
Definition Dialog. Then check the box for Sequence of Events to enable the
variable for automatic SOE logging.
During operation, the Input Module automatically reports time-stamped
change of state information for the input data. The TMR Processor
automatically logs change of state for configured SOE variables into the
system SOE Log. The SOE Log can be monitored and retrieved using the SOE
and Process Historian Package running on the EWS. This software package is
described in Trusted Sequence of Events and Process Historian Package
Product Description, publication ICSTT-RM243 (PD-T8013).
System.INI file There are many operating characteristics of the Input Module that can be
customized for a particular application. The System Configuration Manager
configuration is a tool that allows the user to configure the specific operating characteristics
for each Module. Descriptions of the items that may be configured for the
Trusted 24 Vdc Analog Input Module T8431 are contained in Trusted Toolset
Suite Product Description, publication ICSTT-RM249 (PD-T8082).
Certain characteristics apply to the entire Module and are considered Module
Configurable Items. Other characteristics apply to individual input channels
and are considered Channel Configurable Items. There are specific default
settings for each of the configurable items. If the default settings are
appropriate for a given application, customization of the module definition in
the System Configuration Manager is not required.

Chapter 5
Operation
Front panel Status LEDs on the front of the Module provide visual indications of the
module’s operational status and field input status. Each LED is a tri-color LED
of which for normal operation, only two colors are used; red and green. At the
top and bottom of each Module is an ejector lever that is used to remove the
Module from the Chassis. Limit switches detect the open/closed position of
the ejector levers. The ejector levers are normally latched closed when the
Module is firmly seated into the Controller or Expander Chassis.

Chapter 5 Operation
Figure 4: Module Front Panel
Module status LEDs There are six module status LEDs on the Module Front Panel; three Healthy,
one Active, one Standby, and one Educated. The Healthy indicators are
controlled directly by each module slice. The Active, Standby, and Educated
indicators are controlled by the FPU. The FPU receives data from each of the
module slices. The FPU performs a 2oo3 vote on each data bit from the slices
and sets the indicators accordingly.
The module status LED states and their meanings are described as follows:

Chapter 5 Operation
Table 17 Module Status Indicators
LED State Description
Healthy Off No power applied to the module.

Amber Slice is in the startup state (momentary after installation or
power-up).
Green Slice is healthy.
Red - flashing Fault present on the associated slice but the slice is still
operational, or one 24V feed to the chassis has failed.
Red (momentary) On installation – power applied to the associated slice.
Red The associated slice is in the fatal state. A critical fault has
been detected and the slice disabled.
Active Off Module is not in the Active state.
Green Module is in the Active (or Maintain) state.
Red - flashing Module is in the shutdown state if the Standby LED is off.
Red - flashing Module is in the fatal state if the Standby LED is also
flashing.
Standby Off Module is not in the Standby state.
Green Module is in the Standby state.
Red - flashing Module is in the fatal state. The Active LED will also be
flashing red.
Educated Off Module is not educated.
Green Module is educated.
Green - flashing Module is recognized by the Processor but education is not
complete.
Amber - flashing Active/Standby changeover in progress.
I/O status LEDs There are 40 input channel status LEDs on the Module Front Panel, one for
each field input. These indicators are controlled by the FPU. The FPU receives
data from each of the module slices. The FPU performs a 2oo3 vote on each
data bit from the slices and sets the indicators accordingly.
The input status LED mode is dependent upon the voltage level of the field I/O
signal. Each field input voltage is measured and compared to six threshold
levels (four configurable and two fixed) which produce seven threshold bands.
Each threshold band can be defined to have a particular indicator mode: off,
green, red, flashing green, or flashing red.
The configurable voltage thresholds and LED modes allow users to customize
the input measurement and status indications to suit individual application
requirements. Without customization, the default indicator modes are
suitable for analog inputs as described below:
Table 18 Default I/O Status Indicators
Channel Description
Off ’Normal’ (states 1,2,3)

Green - steady ‘High alarm’ (states 4,5)
Green – flashing Over-range (state 6)
Red-flashing Under-range (state 0) or Channel Fault (8 to 15)

Chapter 5 Operation
Tip: The LEDs indicating channel status may be configured to suit user requirements by
implementing the procedure for configuring the System.INI file detailed in Trusted Toolset Suite
Product Description, publication ICSTT-RM249 (PD-T8082).

Chapter 6
Fault finding and maintenance
Fault reporting Input Module faults are reported to the user through visual indicators (LEDs)
on the Front Panel of the Module. Faults are also reported via status variables
that may be automatically monitored in the application programs, and
external system communications interfaces. There are generally two types of
faults that must be remedied by the user; external wiring and module faults.
External wiring faults require corrective action in the field to repair the fault
condition. Module faults require replacement of the Input Module.
Field wiring faults The input circuits of the Module may be used to detect field wiring faults in
addition to alarm states. To achieve this, line monitoring components must
be fitted to the field device.
By comparing the input signal from the field with pre-configured alarm
thresholds, the Module can automatically detect field wiring faults. When a
field loop develops a line fault, the input channel status LED will adopt the
steady red state (default setting). The corresponding input state will be
reported and the line fault status for that channel will be set to ‘1’. All other
input channels will be unaffected, except in the case of common cause wiring
faults in the field.
Once the field wiring fault has been identified and corrected, the input status
and the input status LED will display the normal status of the field device and
field wiring.
Module faults Extensive diagnostics provide the automatic detection of module faults. The
TMR architecture of the Input Module and the diagnostics performed ensure
the validity of all critical circuits. Using the TMR architecture provides a Fault
Tolerant method to withstand the first fault occurrence on the Module and
continue normal input measurements without interruption in the system or
process. Faults are reported to the user through the Healthy status indicators
on the Front Panel of the Module and through the INFO and HKEEPING
variables. Under normal operations all three Healthy Indicators are green.
When a fault occurs, one of the Healthy Indicators will be flashing red. It is
recommended that this condition is investigated and if the cause is within the
Module, it should be replaced.
Module replacement activities depend on the type of spare module

configuration chosen when the system was configured and installed. The
Module may be configured with a dedicated Companion Slot or with a
SmartSlot for a spare replacement module.

Chapter 6 Fault finding and maintenance
Companion slot For a Companion Slot configuration, two adjacent slots in a Trusted® Chassis
are configured for the same input module function. One slot is the primary
slot and the other a unique secondary (or spare) slot. The two slots are joined
at the rear of the Trusted Chassis with a double-wide I/O Interface Cable that
connects both slots to common field wiring terminations. During normal
operations, the primary slot contains the Active Module as indicated by the
Active indicator on the Front Panel of the Module. The secondary slot is
available for a spare Module that will normally be the Standby Module as
indicated by the Standby indicator on the Front Panel of the Module.
Depending on the installation, a hot-spare Module may already be installed, or

a module blank will be installed in the standby slot. If a hot-spare Module is
already installed, transfer to the Standby Module occurs automatically when a
module fault is detected in the Active Module. If a hot-spare is not installed,
the system continues operating from the Active Module until a spare Module
is installed.
SmartSlot For a SmartSlot configuration, the secondary slot is not unique to each
primary slot. Instead, a single secondary slot is shared among many primary
slots. This technique provides the highest density of Modules to be fitted in a
given physical space. At the rear of the Trusted Chassis, a single-wide I/O
Cable connects the secondary slot directly to the I/O Cable connected to the
failed primary module. With a spare Module installed in the SmartSlot and
the SmartSlot I/O Cable connected to the failed primary module, the
SmartSlot can be used to replace the failed primary module.
Input Module Smart Slot jumper cable TC-306-02
SmartSlot between Chassis can be performed if the Chassis are version 2 (or
higher). These have the connector fitted to enable connection of a TC-006 that
ensures the 0 Volt of each Chassis is at the same potential.
Cold Start If an I/O Module has shut down (due, for example, to two existing faults), the
three Healthy LEDs will be red, the Active and Standby LEDs will be flashing
red and the Educated LED will be flashing amber. The I/O functions provided
by this Module will have been lost if a hot swap partner has not taken over
control. The Module can only be restarted by removing it from its slot and
reinserting it.
If an I/O Module is inserted into a functional system slot that previously had
no Active Module (e.g. removing and reinserting as above), then the Processor
will educate the Module once it has booted. Once educated, the Educated LED
will be steady green and the Active LED will be red flashing.
Input Modules will now be reading and reporting their inputs. Output
Modules have not yet energized their outputs. To activate outputs and to set

the Module’s Active LED and the Processor’s System Healthy LED steady
green, press the Processor Reset push button.
Input Channel Calibration It is recommended that a check is carried out at two yearly intervals on the
input channel calibration. This check will detect long-term drift and any
Check inaccuracy as a result. Refer to Appendix F of Trusted TMR Safety Manual
T8094, publication ICSTT-RM459.
Transfer between Active The TMR Processor is responsible for managing a pair of I/O Modules
through an Active/Standby changeover. The following rules apply to
and Standby Modules Active/Standby changeovers, though the TMR Processor and not the I/O
Module enforces them:
• The user must define the primary, and optionally the secondary, I/O
Module location for each I/O Module pair. Each primary module
location must be unique and is defined as part of the complex
equipment definition within the IEC 61131 TOOLSET. Secondary
module locations can be unique or shared between multiple secondary
modules and are defined within the module’s section within the
System.INI file. The system will automatically determine the
secondary module position if the primary module is installed and is
operable.
• On initial startup, if the primary module is installed, it will become the
Active Module by default. If the secondary module has been defined
within the System.INI file and no primary module is present, and if the
secondary module location is unique, the secondary module will
become the Active Module by default. If the secondary module is
installed with no primary module present, and the secondary module
location is not unique (as in a SmartSlot configuration), then NO
Module for that Module pair will become Active.
• In order for a Module to become the Active Module, the TMR Processor
will verify that the Module is the correct I/O Module type and that both
module removal switches are closed. At this point, the I/O Module is
configured and eventually placed in the Active state.
• A module in the Active state should never be removed.
• When a fault occurs on the Active Module, the TMR Processor will be
informed. Once it becomes aware of the fault, the TMR Processor will
attempt an Active/Standby changeover.
• An Active/Standby changeover starts with the TMR Processor checking
to see if a Standby I/O Module is installed. If no Standby I/O Module is
available, the TMR Processor will continue to use the Active Module
and will continue to check for an available Standby I/O Module. Once a
Standby Module is found, the TMR Processor will verify that the I/O
Module is of the correct type, that both module removal switches are
closed, and that the I/O Module is a part of the correct module pair by
using the SmartSlot link. At this point, the TMR Processor will
configure the Standby I/O Module with the same configuration
information as the currently Active I/O Module and place the Standby

I/O Module into the Standby state. The Active Module is then placed in
the Maintain state (which suspends field loop testing), and any
module-specific changeover data is transferred. The Educated light
flashes amber before the Active/Standby changeover takes place, to
indicate transfer of dynamic change over data (COD). The previous
Standby Module then becomes the Active Module and the original
Module becomes Standby. If the currently Active Module does not
successfully complete the self-tests, the TMR Processor will revert it to
the Standby state, and the Module in the Maintain state will revert to
the Active state.
• When both module removal switches are opened on an Active Module,
regardless of the module fault status, the TMR Processor will treat it as
a request to perform an Active/Standby changeover.
Under normal conditions, an Active/Standby changeover will only occur if the
new Active Module is fault free. Under some circumstances, it is desirable to
be able to force a changeover to a known faulted module. This can be
accomplished by opening the module removal switches on the currently Active
Module and pressing the reset push button on the TMR Processor. This will
force the changeover to proceed even if the new Active Module is not fault
free.

Chapter 7
Specifications
This table lists the module specifications:

Item Description
Backplane (IMB) Supply

Voltage 20 Vdc to 32 Vdc
Power 20 W
Field Supply N/A
Maximum Power Dissipation 20 W
Module Location T8100, T8300 I/O Module Slot
Isolation
Field Common 50 V Reinforced (continuous) 1
250 V Basic (fault) 2
[Type tested at 2436 Vdc for 60 s].
Channel to Channel None
Fusing None
Number of Inputs 40
Input
Impedance (FTA) 250 Ohm
Impedance (module) 3 16.967 K Ohm
Current 0 mA – 22 mA
Voltage 0 Vdc – 5.5 Vdc
Thresholds Configurable
Resolution (LSB) 3.906 μA
Safety Accuracy ±200 μA
Calibration Accuracy 4 ±0.15 %
Intrinsic Safety None - External barrier required
Sequence of Events
Event Resolution (LSB) 1 ms
Time stamp Accuracy ±10 ms
Operating Temperature 0 °C to +60 °C (+32 °F to +140 °F)
Storage Temperature -25 °C to +70 °C (-13 °F to +158 °F)
Relative Humidity – Operating and Storage 10% – 95%, noncondensing
Environmental Specifications Refer to Trusted 8000 Series International Safety and
Environmental Approvals, publication ICSTT-TD003
Dimensions
Height 266 mm (10.5 in)
1
50 Vrms Secondary circuit derived from Mains, OVC II up to 300V.
2
250 Vrms Mains circuit, OVC II up to 300V. Exposure to voltages at these levels shall
be temporally constrained consistent with the system MTTR.
3
In the case where partner modules are fitted then the effective Module input
impedance is halved.
4
Refer to T8094 Trusted Safety Manual for guidance on calibration maintenance.

Chapter 7 Specifications
Item Description
Width 31 mm (1.2 in)
Depth 303 mm (12.0 in)
Weight 1.149 kg (2.5 lb)

Appendix A
History of changes
This appendix contains the new or updated information for each revision of
this publication. These lists include substantive updates only and are not
intended to reflect all changes. Translated versions are not always available for
each revision.
Issue 19, August 2021
Change
Updated link for TechConnectSM Support Contract Access Level and

Features.
Removed instruction for using By Product when searching
Knowledgebase.
Updated branding.
Issue 18D, June 2018
Change
Updated Specification Table
Issue 17, March 2017
Change
Front Panel image (Figure 4) updated to show new label. In

Specifications section, "Field Common Isolation" changed to "Field
Common Insulation".
Issue 16, June 2016
Change
Rebranded and reformatted with correction to Relative Humidity

Range and Operating Temperature statement in the Specification
Section, also any typographical errors
Issue 15, April 2010
Change
Rack 7 minor change

Appendix A History of changes
Issue 14, November 2009
Change
Calibration checking information added
Issue 13, December 2008
Change
Channel LEDs
Issue 12, September 2007
Change
Threshold boards
Issue 11, December 2006
Change
Weights & Dims
Issue 10, September 2006
Change
Corrections
Issue 9, August 2006
Change
Corrections
Issue 8, June 2005
Change
Reformat
Sect 3.2.3
Table 9 Bit ref changed 0-9 & 10-14
0-20mA added Range +/-64 changed to 32

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Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021

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Product Description Original Instructions

Important User Information

Labels may also be on or inside the equipment to provide specific precautions.

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Updated branding. Throughout

New or enhanced features

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6 Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021

Who should use this manual

Revision and updating policy

Latest product information

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Additional resources These documents contain additional information concerning related

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You can view or download publications at http://rok.auto/literature.

8 Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021

The Module provides onboard Sequence of Events (SOE) reporting with a

Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021 9

Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021 11

Figure 1: Module Architecture

12 Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021

Figure 2 shows a simplified functional block diagram of the Trusted 24 Vdc

Figure 2: Functional Block Diagram

Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021 13

All interconnections between the three slices incorporate isolation to prevent

• High Speed Fault Tolerant Communications with the TMR Processor

14 Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021

Table 1 Example Threshold Data (24 Vdc)

Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021 15

Housekeeping The Input Module automatically performs local measurements of several

16 Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021

Ensure that the module is of the correct type.

To install the module:

• Trusted I/O Companion Slot Cables Product Description, publication

Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021 17

Table 2 Field Connector Pin-out

1 SmartSlot Link C SmartSlot Link B SmartSlot Link A

18 Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021

Figure 3: Module Polarization

Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021 19

Table 3 Complex Equipment Definition

Rack I/O Board Description Data Type Direction No. of

Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021 21

Table 4 OEM Parameters

OEM Parameter Description Notes

Table 5 Rack 1: Threshold Input Descriptions

1 Channel number being read. Range 0 to 41.

THRSHIN reads in the Module threshold values controlled by THRSHOUT in

22 Rockwell Automation Publication ICSTT-RM273Q-EN-P - August 2021

Table 6 Rack 2: STATE descriptions

1 Field input channel 1 state

40 Field input channel 40 state

The numerical input state is returned as an integer value.

Table 7 Rack 2: STATE Bit Descriptions

8-15 Internal channel fault on module