PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

PACKAGING INFORMATION
Orderable Device JM38510/07102BEA JM38510/07102BFA JM38510/30103B2A JM38510/30103BEA JM38510/30103BFA SN54LS112AJ SN54S112J SN74LS112AD SN74LS112ADR SN74LS112AN SN74LS112AN3 SN74LS112ANSR SN74S112AD SN74S112ADR SN74S112AN SN74S112AN3 SN74S112ANSR SNJ54LS112AFK SNJ54LS112AJ SNJ54LS112AW SNJ54S112FK SNJ54S112J SNJ54S112W
(1)

Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE OBSOLETE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Package Type CDIP CFP LCCC CDIP CFP CDIP CDIP SOIC SOIC PDIP PDIP SO SOIC SOIC PDIP PDIP SO LCCC CDIP CFP LCCC CDIP CFP

Package Drawing J W FK J W J J D D N N NS D D N N NS FK J W FK J W

Pins Package Eco Plan (2) Qty 16 16 20 16 16 16 16 16 16 16 16 16 16 16 16 16 16 20 16 16 20 16 16 2000 1 1 1 1 1 1 2500 25 2000 1 1 1 1 1 1 1 40 2500 25 None None None None None None None Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) None Pb-Free (RoHS) None Pb-Free (RoHS) Pb-Free (RoHS) None Pb-Free (RoHS) None None None None None None

Lead/Ball Finish Call TI Call TI Call TI Call TI Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU Call TI CU NIPDAU CU NIPDAU Call TI CU NIPDAU Call TI Call TI Call TI Call TI Call TI Call TI

MSL Peak Temp (3) Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-NC-NC-NC Call TI Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Call TI Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-NC-NC-NC Call TI Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

Addendum-Page 1

PACKAGE OPTION ADDENDUM

28-Feb-2005

temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

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