Dell EMC PowerEdge R450

Technical Specifications

Part Number: E74S

Regulatory Type: E74S001
December 2022
Rev. A03
Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2021 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other
trademarks may be trademarks of their respective owners.
 Contents

Chapter 1: Technical specifications............................................................................................... 4

Chassis dimensions............................................................................................................................................................. 5
System weight......................................................................................................................................................................6
Processor specifications.................................................................................................................................................... 6
PSU specifications.............................................................................................................................................................. 6
Supported operating systems...........................................................................................................................................6
Cooling fans specifications................................................................................................................................................ 7
System battery specifications.......................................................................................................................................... 8
Expansion card riser specifications................................................................................................................................. 8
Memory specifications....................................................................................................................................................... 8
Storage controller specifications..................................................................................................................................... 9
Drives......................................................................................................................................................................................9
Ports and connectors specifications...............................................................................................................................9
USB ports specifications..............................................................................................................................................9
NIC port specifications............................................................................................................................................... 10
Serial connector specifications................................................................................................................................. 10
VGA ports specifications............................................................................................................................................10
IDSDM.............................................................................................................................................................................10
Video specifications...........................................................................................................................................................10
Environmental specifications........................................................................................................................................... 11
Particulate and gaseous contamination specifications....................................................................................... 12
Thermal restrictions.....................................................................................................................................................12

Contents 3
 1
Technical specifications
The technical and environmental specifications of your system are outlined in this section.
Topics:
• Chassis dimensions
• System weight
• Processor specifications
• PSU specifications
• Supported operating systems
• Cooling fans specifications
• System battery specifications
• Expansion card riser specifications
• Memory specifications
• Storage controller specifications
• Drives
• Ports and connectors specifications
• Video specifications
• Environmental specifications

4 Technical specifications
Chassis dimensions

Figure 1. PowerEdge R450 Chassis dimensions

Table 1. Chassis dimensions

Drives Xa Xb Y Za Zb Zc
4 x 3.5-inch 482 434 mm 42.8 22 mm (0.866 inches) 677.8 mm (26.685 inches) 712.95 mm
mm (17.08 mm(1.68 without bezel (28.069 inches)
(Ear to PSU surface)
(18.976 inches) 5
35.84 mm (1.41 inches) with (Ear to PSU
inches) inches) 691.07mm (27.207 inches)
bezel handle without
(Ear to butterfly L bracket velcro strap)
housing)

8 x 2.5-inch 482 434 mm 42.8 22 mm (0.866 inches) 627.03 mm (24.686 inches) 662.19 mm
mm (17.08 mm(1.68 without bezel (26.070 inches)
(Ear to PSU surface)
(18.976 inches) 5
35.84 mm (1.41 inches) with (Ear to PSU
inches) inches) 640.3 mm (25.209 inches)
bezel handle without
(Ear to butterfly L bracket velcro strap)
housing)

NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Technical specifications 5
System weight
Table 2. PowerEdge R450 system weight
System configuration Maximum weight (with all drives/SSDs/bezel)
4 x 3.5-inch system 18.62 kg (41.05 pound)
8 x 2.5-inch system 16.58 kg (36.55 pound)

Processor specifications
Table 3. PowerEdge R450 processor specifications
Supported processor Number of processors supported
3 rd Generation Intel Xeon Scalable processors with up to 24 Up to two
cores

PSU specifications
The PowerEdge R450 system supports up to two AC or DC power supply units (PSUs).

Table 4. PowerEdge R450 PSU specifications

PSU Class Heat Frequency Voltage AC DC Current
dissipation
(maximum) High line Low line
200–240 100–120 V
V
1100 W DC NA 4265 BTU/ NA -48–(-60) V NA NA 1100 W 27 A
hr
800 W Platinum 3000 BTU/ 50/60 Hz 100–240 V 800 W 800 W NA 9.2 A-4.7 A
Mixed Mode hr AC,
autoranging
NA 3000 BTU/ NA 240 V DC, NA NA 800 W 3.8 A
hr autoranging
600 W Platinum 2250 BTU/ 50/60 Hz 100–240 V 600 W 600 W NA 7.1 A-3.6 A
Mixed Mode hr AC,
autoranging
NA 2250 BTU/ NA 240 V DC, NA NA 600 W 2.9 A
hr autoranging

NOTE: This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240
V.

NOTE: Heat dissipation is calculated using the PSU wattage rating.

NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system
power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Supported operating systems

The PowerEdge R450 system supports the following operating systems:
● Canonical Ubuntu Server LTS
● Citrix Hypervisor

6 Technical specifications
● Microsoft Windows Server with Hyper-V
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
● VMware ESXi
For more information, go to www.dell.com/ossupport.

Cooling fans specifications

The PowerEdge R450 system supports Standard (STD) fans, and High performance SLVR fans .

NOTE: For more information about the fan support configuration or matrix, see Thermal restriction matrix.

Table 5. PowerEdge R450 cooling fan specifications

Fan type Abbreviation Also known Label Label image
as color

Standard
STD STD No label
fan

Figure 2. Standard fan

High NOTE: New cooling fans comes with the High Performance
performan Silver Grade label. While the older cooling fans has the High
HPR (SLVR) HPR Silver
ce (Silver
Performance label.
grade) fan

Technical specifications 7
Table 5. PowerEdge R450 cooling fan specifications (continued)
Fan type Abbreviation Also known Label Label image
as color

Figure 3. High performance (Silver grade) fan

System battery specifications

The PowerEdge R450 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge R450 system supports up to two PCI express (PCIe) Gen 4 expansion cards.

Table 6. Expansion card slots supported on the system board

PCIe slot Riser PCIe slot height PCIe slot length PCIe slot width
Slot 1 Riser 1 Low Profile Half length x16
Slot 3 Riser 2c Low Profile Half length x16

NOTE: For information on the expansion card installation guidelines, see the system specific Installation and Service
Manual available at https://www.dell.com/poweredgemanuals.

Memory specifications
The PowerEdge R450 system supports the following memory specifications for optimized operation.

8 Technical specifications
Table 7. Memory specifications
Single processor Dual processors
DIMM Minimum
DIMM type DIMM rank Minimum DIMM Maximum DIMM Maximum DIMM
capacity DIMM
capacity capacity capacity
capacity
Single rank 8 GB 8 GB 64 GB 16 GB 128 GB
16 GB 16 GB 128 GB 32 GB 256 GB
RDIMM
Dual rank 32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB

Table 8. Memory module sockets

Memory module sockets Speed
16, 288-pin 2933 MT/s, 2666 MT/s

Storage controller specifications

The PowerEdge R450 system supports the following controller cards:

Table 9. PowerEdge R450 storage controller cards

Internal controllers External controllers
● PERC H345 ● HBA355e
● PERC H355 ● PERC H840
● PERC H745
● PERC H755
● HBA355i
● S150
● Boot Optimized Storage Subsystem (BOSS-S1): HWRAID
2 x M.2 SSDs

Drives
The PowerEdge R450 system supports:
● 4 x 3.5-inch Chip SATA (HDD/SSD) drives.
● 4 x 3.5-inch hot-swappable SAS, SATA (HDD/SSD) drives.
● 8 x 2.5-inch SAS, SATA (HDD/SSD) drives.

Ports and connectors specifications

USB ports specifications
Table 10. PowerEdge R450 USB ports specifications
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0- One USB 2.0- One Internal USB 3.0- One
compliant port compliant port compliant port

Technical specifications 9
Table 10. PowerEdge R450 USB ports specifications (continued)
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
Micro-USB 2.0- One USB 3.0- One
compliant port for compliant port
iDRAC Direct

NOTE: The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NIC port specifications

The PowerEdge R450 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on
the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.

Table 11. NIC port specification for the system

Feature Specifications
LOM card 1 GbE x 2
OCP card (OCP 3.0) 1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The PowerEdge R450 system supports one optional card type serial connector on rear of the system, which is a 9-pin
connector, Data Terminal Equipment (DTE), 16550-compliant .
The process to install the optional serial connector card is similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R450 system supports two DB-15 VGA ports, one each on the front and rear panels of the system.

IDSDM
The PowerEdge R450 system supports Internal Dual SD module (IDSDM).
The IDSDM supports two SD cards and is available in the following configurations:

Table 12. Supported SD card storage capacity

IDSDM card
● 16 GB
● 32 GB
● 64 GB

NOTE: One IDSDM card slot is dedicated for redundancy.

NOTE: Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.

Video specifications
The PowerEdge R450 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

10 Technical specifications
Table 13. Supported video resolution options for the system
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications
NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet located
with the Documentation > Regulatory Information on www.dell.com/support/home.

Table 14. Operational climatic range category A2

Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 10–35°C (50–95°F) with no direct sunlight on the equipment
2953 ft)
Humidity percent ranges (non-condensing at all 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F)
times) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900
m (2953 Ft)

Table 15. Shared requirements across all categories

Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15
operation and non-operation) minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE: * - Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.

Non-operational temperature limits -40 to 65°C (-40 to 149°F)

Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)

Table 16. Maximum vibration specifications

Maximum vibration Specifications
Operating 0.26 G rms at 5 Hz to 350 Hz (all operation orientations)
Storage 1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Technical specifications 11
Table 17. Maximum shock pulse specifications
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms
Storage Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that prevent the damage to the IT equipment and/or, or both failure from particulate
and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in
equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the
responsibility of the customer.

Table 18. Particulate contamination specifications

Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit.
NOTE: This condition applies to data center environments
only. Air filtration requirements do not apply to IT
equipment designed to be used outside a data center, in
environments such as an office or factory floor.

NOTE: Air entering the data center must have MERV11 or

MERV13 filtration.

Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data
center environments.

Corrosive dust ● Air must be free of corrosive dust.

● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.

Table 19. Gaseous contamination specifications

Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013

NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restrictions
Table 20. Thermal restriction matrix for processor and fans
Configuration / 4 x 3.5-inch configuration 8 x 2.5-inch SAS/SATA Maximum Ambient
Processor TDP configuration Temperature
Rear Storage Rear 3 LP Rear 3 LP N/A
105 W STD fan STD fan 40°C

12 Technical specifications
Table 20. Thermal restriction matrix for processor and fans (continued)
Configuration / 4 x 3.5-inch configuration 8 x 2.5-inch SAS/SATA Maximum Ambient
Processor TDP configuration Temperature

STD HSK STD HSK

120 W STD fan STD fan 40°C

STD HSK STD HSK

135 W STD fan STD fan 40°C

STD HSK STD HSK

150 W STD fan STD fan 40°C

STD HSK STD HSK

165 W STD fan STD fan 35°C

STD HSK STD HSK

165 W 8 cores, 3.6 GHz HPR (SLVR) fan HPR (SLVR) fan 35°C
HPR HSK HPR HSK

185 W / 190 W HPR (SLVR) fan HPR (SLVR) fan 35°C

HPR HSK HPR HSK

● Processor blank is required for single processor configuration.

● Two fan blanks are required to be installed on fan slot 1 and fan slot 2 for 5 fans configuration.

Table 21. Label reference

Label Description
LP Low Profile
HPR (SLVR) High performance (silver grade)
HPR High Performance
HSK Heat sink

NOTE: DIMM blank is not required.

Table 22. Thermal restriction matrix for ASHRAE A2, A3 and A4

Dell EMC PowerEdge Server Standard Operating Dell EMC PowerEdge Server Dell EMC PowerEdge
Support (ASHRAE A2 compliant) Extended Inletient 40 ° C Server Extended
NOTE: All options supported unless otherwise noted. Operating Support (ASHRAE A3 Inletient 45 ° C
compliant) Operating Support
(ASHRAE A4 compliant)
● HPR Silver Fan is required for CPU >165 W ● Processor TDP greater than 150 W ● Does not support A4
● The following OCP3.0 NIC only support optic cable are not supported. environment.
with thermal Spec 85 °C and power <=1.2 W ● BOSS M.2 is not supported.
Intel Columbiaville DP 25 GbE SFP28 in 8x2.5-inch ● Non-Dell qualified peripheral cards
SAS/SATA configuration only are not supported.
Broadcom Thor QP 25 G SFP28 in both ● NIC consuming power >= 25
configurations. W. Example: CX6 card is not
supported.
Mellanox CX5 DP 25 GbE SFP28 in both
configurations. ● Configuration with RM is not
supported.
Solarflare Medford2 DP 25 GbE SFP28 in both
configurations. ● OCP transfer rate >25 G or cooling
tier > 10 is not supported.
● The following PCIe NIC only support optic cable with
thermal spec 85°C and power <= 1.2 W: ● Optic cable with spec 85 °C power
< 1.2 W is required.

Technical specifications 13
Table 22. Thermal restriction matrix for ASHRAE A2, A3 and A4
Dell EMC PowerEdge Server Standard Operating Dell EMC PowerEdge Server Dell EMC PowerEdge
Support (ASHRAE A2 compliant) Extended Inletient 40 ° C Server Extended
NOTE: All options supported unless otherwise noted. Operating Support (ASHRAE A3 Inletient 45 ° C
compliant) Operating Support
(ASHRAE A4 compliant)
○ Solarflare Medford2 DP 25 GbE SFP28 in 8x2.5- ● Two PSUs are required. System
inch SAS/SATA configuration. performance may be reduced in the
○ Broadcom 100 G 2P QSF in both configurations. event of a PSU failure.
○ Mellanox CX6 DP 25 G SFP28 in both
configurations.
● The following PCIe NIC only support optic cable with
thermal spec 85°C and power <= 2.5 W
○ Mellanox CX6 DP 100 GbE in both configurations
○ Intel Columbiaville 100 G 2P Q28 in both
configurations
● PCIe SSD: Intel P4800X 750 G and 375 G are only
supported in PCIe slot2 and PCIe slot3 in 4x3.5-inch
configuration. No restriction in 8x2.5-inch SAS/SATA
configuration.

14 Technical specifications