Microchip Tech MCP1827S 5002E EB - C641174
Microchip Tech MCP1827S 5002E EB - C641174
Microchip Tech MCP1827S 5002E EB - C641174
MCP1826 MCP1826S
DDPAK-5 TO-220-5 DDPAK-3 TO-220-3
Fixed/Adjustable
1 2 3
1 2 3
1 2 3 4 5
1 2 3 4 5
SOT-223-5 SOT-223-3
6 4
1 2 3 4 5 1 2 3
PWRGD
R1
On 100 k
Off SHDN
1 VOUT = 1.8V @ 1000 mA
VIN = 2.3V to 2.8V VIN VOUT
GND
C1
C2
4.7 µF 1 µF
VADJ
R2
R1 20 k
On 40 k
Off SHDN
1 VOUT = 1.2V @ 1000 mA
VIN = 2.3V to 2.8V VIN VOUT
C1
C2
4.7 µF 1 µF
GND
PMOS
VIN VOUT
Undervoltage
Lockout
(UVLO)
ISNS Cf Rf
SHDN ADJ/SENSE
+
Driver w/limit
and SHDN EA
Overtemperature
Sensing –
SHDN
VREF
V IN
SHDN Reference
Soft-Start
Comp TDELAY
GND
92% of VREF
PMOS
VIN VOUT
Undervoltage Sense
Lockout
(UVLO)
ISNS Cf Rf
SHDN
+
Driver w/limit
and SHDN EA
Overtemperature
Sensing –
SHDN
VREF
V IN
SHDN Reference
Soft-Start
Comp TDELAY
GND
92% of VREF
PMOS
VIN VOUT
Undervoltage Sense
Lockout
(UVLO)
ISNS Cf Rf
SHDN
+
Driver w/limit
and SHDN EA
Overtemperature
Sensing –
SHDN
VREF
V IN
SHDN Reference
Soft-Start
PWRGD
Comp TDELAY
GND
92% of VREF
AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, VR=1.8V for Adjustable Output,
IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C
Power Supply Ripple Rejection PSRR — 60 — dB f = 100 Hz, COUT = 4.7 µF,
Ratio IOUT = 100 µA,
VINAC = 100 mV pk-pk,
CIN = 0 µF
Thermal Shutdown Temperature TSD — 150 — °C IOUT = 100 µA, VOUT = 1.8V,
VIN = 2.8V
Thermal Shutdown Hysteresis TSD — 10 — °C IOUT = 100 µA, VOUT = 1.8V,
VIN = 2.8V
Note 1: The minimum VIN must meet two conditions: VIN2.3V and VIN VOUT(MAX)VDROPOUT(MAX).
2: VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.
3: TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * Temperature). VOUT-HIGH is the highest voltage measured over the
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of VIN = VOUT(MAX) + VDROPOUT(MAX).
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above 150°C can impact device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
TEMPERATURE SPECIFICATIONS
140 0.10
VOUT = 1.2V Adj IOUT = 1 mA VOUT = 1.2V Adj
IOUT = 0 mA
Quiescent Current (μA)
FIGURE 2-1: Quiescent Current vs. Input FIGURE 2-4: Line Regulation vs.
Voltage (Adjustable Version). Temperature (Adjustable Version).
180 0.15
IOUT = 1.0 mA to 1000 mA
VOUT = 1.2V Adj
170 VOUT = 3.3V
0.10
Ground Current (μA)
160
0.05
150 VOUT = 1.8V
VIN = 5.0V
140 0.00
VIN = 3.3V VOUT = 0.8V
VOUT = 5.0V
130
-0.05
120
-0.10
110 VIN = 2.3V
100 -0.15
0 250 500 750 1000 -45 -20 5 30 55 80 105 130
Load Current (mA) Temperature (°C)
FIGURE 2-2: Ground Current vs. Load FIGURE 2-5: Load Regulation vs.
Current (Adjustable Version). Temperature (Adjustable Version).
140 0.411
VOUT = 1.2V Adj VOUT = 1.2V
135
Quiescent Current (μA)
130 0.410
125
VIN = 5.0V
120 VIN = 6.0V 0.409
115
110
0.408 VIN = 2.3V
105 VIN = 5.0V
100 VIN = 4.0V
95 0.407
VIN = 3.0V
90 VIN = 2.3V
85 0.406
-45 -20 5 30 55 80 105 130 -45 -20 5 30 55 80 105 130
FIGURE 2-3: Quiescent Current vs. FIGURE 2-6: Adjust Pin Voltage vs.
Junction Temperature (Adjustable Version). Temperature (Adjustable Version).
0.30 150
VOUT = 0.8V
IOUT = 0 mA
FIGURE 2-7: Dropout Voltage vs. Load FIGURE 2-10: Quiescent Current vs. Input
Current (Adjustable Version). Voltage.
0.34 150
IOUT = 1.0A VOUT = 2.5V
130 +130 C
0.28 VOUT = 5.0V Adj 120 +90 C
110 +25 C
0.25 0C
VOUT = 2.5V Adj 100 -45 C
0.22
90
0.19 80
-45 -20 5 30 55 80 105 130 3.0 3.5 4.0 4.5 5.0 5.5 6.0
FIGURE 2-8: Dropout Voltage vs. FIGURE 2-11: Quiescent Current vs. Input
Temperature (Adjustable Version). Voltage.
170 200
Power Good Time Delay (µS)
FIGURE 2-9: Power Good (PWRGD) FIGURE 2-12: Ground Current vs. Load
Time Delay vs. Temperature. Current.
130 0.040
IOUT = 0 mA VR = 2.5V
125
Quiescent Current (μA)
FIGURE 2-13: Quiescent Current vs. FIGURE 2-16: Line Regulation vs.
Temperature. Temperature.
0.50
VR = 0.8V 0.30
VOUT = 0.8V
0.40
0.20 VIN = 2.3V
0.00 -0.30
-45 -20 5 30 55 80 105 130 -45 -20 5 30 55 80 105 130
FIGURE 2-14: ISHDN vs. Temperature. FIGURE 2-17: Load Regulation vs.
Temperature (VOUT < 2.5V Fixed).
0.10 0.00
IOUT = 1 mA VOUT = 0.8V
IOUT = 1 mA to 1000 mA
VIN = 2.3V to 6.0V -0.05
Line Regulation (%/V)
IOUT = 50 mA -0.10
0.06 IOUT = 100 mA -0.15
-0.20
0.04 VOUT = 5.0V
-0.25
IOUT = 1A
0.02 -0.30
IOUT = 500mA
-0.35
0.00 -0.40
-45 -20 5 30 55 80 105 130 -45 -20 5 30 55 80 105 130
Temperature (°C) Temperature (°C)
FIGURE 2-15: Line Regulation vs. FIGURE 2-18: Load Regulation vs.
Temperature. Temperature (VOUT 2.5V Fixed).
0.30 10.000
VR=0.8V, VIN=2.3V COUT=1 μF ceramic X7R
CIN=10 μF ceramic
0.25
Dropout Voltage (V)
VOUT = 2.5V
Hz)
0.20 1.000 IOUT=200 mA
PV/
0.15
Noise (P
VR=3.3V, VIN=4.1V
VOUT = 5.0V
0.10 0.100
0.05
0.00 0.010
0 200 400 600 800 1000 0.01 0.1 1 10 100 1000
Load Current (mA) Frequency (kHz)
FIGURE 2-19: Dropout Voltage vs. Load FIGURE 2-22: Output Noise Voltage
Current. Density vs. Frequency.
0.34 0
IOUT = 1000 mA
0.32 -10
Dropout Voltage (V)
PSRR (dB)
0.28 -30
FIGURE 2-20: Dropout Voltage vs. FIGURE 2-23: Power Supply Ripple
Temperature. Rejection (PSRR) vs. Frequency (Adjustable).
0
2.00
VOUT = 0.8V -10
1.80
Short Circuit Current (A)
1.60 -20
1.40
PSRR (dB)
-30
1.20
1.00 -40 VR=3.3V Fixed
0.80 -50 COUT=22 μF ceramic X7R
0.60 VIN=3.9V
-60 CIN=0 μF
0.40
0.20 -70 IOUT=10 mA
0.00 -80
0 1 2 3 4 5 6 0.01 0.1 1 10 100 1000
Input Voltage (V) Frequency (kHz)
FIGURE 2-21: Short Circuit Current vs. FIGURE 2-24: Power Supply Ripple
Input Voltage. Rejection (PSRR) vs. Frequency.
FIGURE 2-25: 2.5V (Adj.) Start-up from FIGURE 2-28: Dynamic Line Response.
VIN.
3.1 Shutdown Control Input (SHDN) 3.5 Power Good Output (PWRGD)
The SHDN input is used to turn the LDO output voltage The PWRGD output is an open-drain output used to
on and off. When the SHDN input is at a logic-high indicate when the LDO output voltage is within 92%
level, the LDO output voltage is enabled. When the (typically) of its nominal regulation value. The PWRGD
SHDN input is pulled to a logic-low level, the LDO threshold has a typical hysteresis value of 2%. The
output voltage is disabled. When the SHDN input is PWRGD output is delayed by 200 µs (typical) from the
pulled low, the PWRGD output also goes low and the time the LDO output is within 92% + 3% (max hystere-
LDO enters a low quiescent current shutdown state sis) of the regulated output value on power-up. This
where the typical quiescent current is 0.1 µA. delay time is internally fixed.
3.2 Input Voltage Supply (VIN) 3.6 Output Voltage Adjust Input (ADJ)
Connect the unregulated or regulated input voltage For adjustable applications, the output voltage is
source to VIN. If the input voltage source is located connected to the ADJ input through a resistor divider
several inches away from the LDO, or the input source that sets the output voltage regulation value. This
is a battery, it is recommended that an input capacitor provides the user the capability to set the output
be used. A typical input capacitance value of 1 µF to voltage to any value they desire within the 0.8V to 5.0V
10 µF should be sufficient for most applications. range of the device.
MCP1826-ADJ
The MCP1826/MCP1826S requires a minimum output
capacitance of 1 µF for output voltage stability. Ceramic
VOUT
capacitors are recommended because of their size,
On R1
cost and environmental robustness qualities.
Off 1 2 3 4 5 C2
SHDN ADJ 1 µF Aluminum-electrolytic and tantalum capacitors can be
VIN
used on the LDO output as well. The Equivalent Series
Resistance (ESR) of the electrolytic output capacitor
C1 R2
4.7 µF GND must be no greater than 1 ohm. The output capacitor
should be located as close to the LDO output as is
practical. Ceramic materials X7R and X5R have low
temperature coefficients and are well within the
FIGURE 4-1: Typical adjustable output acceptable ESR range required. A typical 1 µF X7R
voltage application circuit. 0805 capacitor has an ESR of 50 milli-ohms.
The allowable resistance value range for resistor R2 is
from 10 k to 200 k. Solving the equation for R1
yields the following equation:
TJ = TJ(RISE) + TA(MAX)
TJ = 30.12°C + 60.0°C
TJ = 90.12°C
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Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
XXXXXXXXX MCP1826
XXXXXXXXX e3
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1 2 3 4 5 1 2 3 4 5
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Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
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A E B
SEATING
E2
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E
2 A
A1 E1
Q
H1
ØP
D2
D
D1
L1 C
1 2 N
2X e c 3X b2
e1 A2 3X b
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Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units INCHES
Dimension Limits MIN NOM MAX
Number of Terminals N 3
Terminal Pitch e .100 BSC
Overall Terminal Pitch e1 .200 BSC
Overall Height A .160 - .190
Tab Thickness A1 .045 - .055
Base to Lead A2 .090 - .115
Terminal Width b .025 .033 .040
Shoulder Width b2 .045 - .060
Terminal Thickness c .015 - .022
Overall Length D .560 - .590
Molded Package Length D1 .330 - .355
Exposed Pad Length D2 .474 - .507
Overall Width E .385 - .415
Exposed Pad Width E1 .300 REF
Allowable Stamping Irregularities Zone E2 - - .030
Tab Length H1 .234 - .258
Terminal Length L .540 - .560
Terminal Shoulder Length L1 .243 REF
Mounting Hole Diameter ØP .146 - .156
Mounting Hole Center Q .103 - .113
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
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