RTC

Application Guide

Issue 06

Date 2018-05-15
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 RTC
Application Guide About This Document

About This Document

Purpose
This document describes the RTC correction scheme, ensuring that the RTC counts correctly.

This document uses the Hi3536 as an example. Unless otherwise stated, Hi3521A/20D V300, Hi3531A,
Hi3518E V20X/16C V200, Hi3519 V100, Hi3519 V101, Hi3559 V100, Hi3556 V100, Hi3531D V100,
Hi3521D V100, Hi3536C V100, Hi3536D V100, Hi3520DV400, Hi3516C V300, Hi3559A V100,
Hi3559C V100, and Hi3536 contents are consistent.

Related Versions
The following table lists the product version related to this document.

Product Name Version

Hi3536 V100
Hi3521A V100
Hi3520D V300
Hi3531A V100
Hi3518E V200
Hi3518E V201
Hi3516C V200
Hi3519 V100
Hi3516C V300
Hi3519 V101
Hi3559 V100
Hi3556 V100
Hi3531D V100
Hi3521D V100
Hi3536C V100

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 RTC
Application Guide About This Document

Product Name Version

Hi3536D V100
Hi3520D V400
Hi3559A V100
Hi3559C V100

Intended Audience
This document is intended for technical support personnel.

Change History
Changes between document issues are cumulative. Therefore, the latest document issue
contains all changes made in previous issues.

Issue 06 (2018-05-15)
This issue is the sixth official release, which incorporates the following changes:
The contents related to the Hi3559A V100 and Hi3559C V100 are modified.

Issue 05 (2017-10-18)
This issue is the fifth official release, which incorporates the following changes:
Note is added to chapter 5.
Chapter 6 is added.

Issue 04 (2017-09-08)
This issue is the fourth official release, which incorporates the following changes:
The description of the Hi3536D V100 is added.
Section 5.1 and section 5.2 are modified.

Issue 03 (2017-07-14)
This issue is the third official release, which incorporates the following changes:
Section 1.3 is deleted.
Section 2.1 and 2.2 are updated.
Chapter 6 is added.

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 RTC
Application Guide About This Document

Issue 02 (2017-04-10)
This issue is the second official release, which incorporates the following changes:
The descriptions of the Hi3536C V100 and Hi3516A V200 are added.

Issue 01 (2016-12-01)
This issue is the first official release.

Issue 00B02 (2015-11-05)

This issue is the second draft release.

Issue 00B01 (2015-1-19)

This issue is the first draft release.

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 RTC
Application Guide Contents

Contents

About This Document ......................................................................................................................i

1 Overview ......................................................................................................................................... 1
1.1 RTC Classification ........................................................................................................................................... 1
1.2 RTC Working Mode ......................................................................................................................................... 1

2 Hardware Reference Circuit of the Crystal .............................................................................. 2

2.1 Hardware Reference Circuit ............................................................................................................................. 2
2.2 Selecting Crystal Oscillators ............................................................................................................................ 2
2.3 Selecting Capacitors ......................................................................................................................................... 3

3 Implementation of the Fixed Frequency-Division Mode ..................................................... 5

4 RTC Correction .............................................................................................................................. 6
5 HI_RTC Driver Usage .................................................................................................................. 7
5.1 Compilation ...................................................................................................................................................... 7
5.2 Usage ................................................................................................................................................................ 7

6 Usage of Standard RTC Kernel Driver Under Linux ........................................................... 10

6.1 Compilation .................................................................................................................................................... 10
6.2 Usage .............................................................................................................................................................. 10

7 Test Methods for Crystal Specifications ................................................................................ 12

7.1 Frequency Offset Test..................................................................................................................................... 12
7.2 Safety Factor Test ........................................................................................................................................... 12
7.3 Oscillator Startup Time Test ........................................................................................................................... 13
7.4 DL Test ........................................................................................................................................................... 14

8 Q&A ............................................................................................................................................... 16
8.1 No Oscillation on the Oscillator ..................................................................................................................... 16
8.2 200 kHz Frequency Output by the Oscillator ................................................................................................. 16
8.3 Incorrect Oscillation Frequency ..................................................................................................................... 17

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Application Guide Figures

Figures

Figure 2-1 Hardware reference circuit of the crystal ............................................................................................. 2

Figure 2-2 Actual CL diagram ............................................................................................................................... 3

Figure 5-1 Test sample program usage .................................................................................................................. 8

Figure 7-1 Safety factor test diagram .................................................................................................................. 13

Figure 7-2 Oscillator satartup time diagram ........................................................................................................ 14

Figure 8-1 Circuit for resolving the 200 kHz output frequency issue ................................................................. 17
Figure 8-2 Relationship between the frequency offset and the actual load capacitance CL ................................ 18

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 RTC
Application Guide 1 Overview

1 Overview

1.1 RTC Classification

Typically, real-time clocks (RTCs) are classified into three types:
 Non-integrated RTC: This RTC has only the RTC timing circuit but no integrated crystal
oscillator and temperature compensation circuit. The timing accuracy of this RTC
depends on the accuracy of the external crystal oscillator and is susceptible to
temperature change. Typically, the timing accuracy is high at ambient temperature, and
the timing deviation gradually increases when the temperature increases or decreases.
 RTC with integrated crystal oscillator: This RTC has integrated RTC timing circuit and
crystal oscillator but no temperature compensation circuit. The timing accuracy of this
RTC reaches the highest at ambient temperature but is also affected by temperature
change.
 Integrated RTC: This RTC has integrated RTC timing circuit, crystal oscillator, and
temperature compensation circuit (including the temperature sensor). It needs to be
calibrated before delivery. As this RTC has the temperature compensation circuit, it
features high timing accuracy and is slightly affected by temperature change.

1.2 RTC Working Mode

The embedded RTC of the Hi3536 supports the fixed frequency-division mode.
Similar to the non-integrated RTC, the embedded RTC of the Hi3536 uses the frequency-
division clock generated by the external crystal oscillator and oscillation circuit. The
frequency divider is fixed during working. In this mode, the RTC timing accuracy depends on
the frequency accuracy of the external crystal oscillator and is affected by ambient
temperature change. You can replace the non-integrated RTC with the embedded RTC of the
Hi3536 to reduce costs.
The Hi3536 RTC does not have internal temperature compensation circuit, and works only in
fixed frequency-division mode. If the frequency offset of the RTC is too large, you can adjust
the RTC frequency divider to fine-tune the RTC frequency. If high timing accuracy is required,
you are advised to select the external RTC with an embedded crystal oscillator or the RTC
with the temperature compensation function.

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 RTC
Application Guide 2 Hardware Reference Circuit of the Crystal

2 Hardware Reference Circuit of the Crystal

2.1 Hardware Reference Circuit

Crystals and capacitors need to be selected for the hardware reference circuit, as shown in
Figure 2-1.

Figure 2-1 Hardware reference circuit of the crystal

CL1

Hi3536 3 4
GND1 GND2

RTC_XIN 2

RTC_XOUT
CL2

2.2 Selecting Crystal Oscillators

The following specifications must be taken into account when you select crystal oscillators:
 Standard CL: Crystal oscillators impose strict requirements on the load capacitance. The
crystal oscillator frequency reaches the nominal value only when the actual load
capacitance is the same as the load capacitance defined in crystal oscillator specifications.
The Hi3536 crystal oscillation circuit is designed based on the 12.5 pF crystal oscillator.
You are advised to use the 12.5 pF crystal oscillator because this crystal oscillator is the
mainstream in 32.768 kHz crystal oscillators. If you want to use other crystal oscillators,
you need to select matched capacitors based on the factors that affect the RTC accuracy.
Series resistance: crystal resonance equivalent series resistance (ESR). Greater ESR
indicates that the crystal is more difficult to drive. The typical and maximum values of
Rs are specified in crystal specifications.

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Application Guide 2 Hardware Reference Circuit of the Crystal

The crystal oscillator whose maximum series resistance is less than 70 kilohms is
recommended for the Hi3536 crystal oscillation circuit. You are advised to choose
crystals that meet the specifications to ensure that the voltage of RTC_XOUT is greater
than or equal to 850 mV.
 Maximum drive level: maximum crystal oscillation amplitude. If the oscillation
amplitude exceeds a specified amplitude, the crystal oscillator is easy to be damaged.
Table 2-1 shows the constraints on crystal selection.

Table 2-1 Constraints on crystal selection

Parameter Symbol Specifications

MIN TYP MAX Unit

Series Resistance ESR - - 70 KΩ
Load Capacitance CL - 12.5 - pF
Shunt Capacitance C0 1 - 2 pF
Motional C1 2 - 6 fF
Capacitance

2.3 Selecting Capacitors

Figure 2-2 shows the actual CL diagram.

Figure 2-2 Actual CL diagram

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Application Guide 2 Hardware Reference Circuit of the Crystal

Typically, the values of CL1 and CL2 are the same on the Pierce oscillator. The values are
calculated as follows:
CL1 = CL2 = CL_SPEC x 2 – Stray capacitance
CL_SPEC is the load capacitance in crystal oscillator specifications. The stray capacitance
might be caused by the PCB and its value range is 3–5 pF. For example, if the load
capacitance of a crystal oscillator is 12.5 pF, the values of CL1 and CL2 are calculated as
follows: 12.5 pF x 2 – 3 pF = 22 pF. The stray capacitance varies according to the PCB.
Therefore, you can obtain the output frequency that is approximate to 32.768 kHz by selecting
an appropriate CL1 through the frequency offset test after the PCB is determined. For
methods for the frequency offset test, see relevant content in chapter7 "Test Methods for
Crystal Specifications."

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 RTC 3 Implementation of the Fixed Frequency-Division
Application Guide Mode

3 Implementation of the Fixed Frequency-

Division Mode

There is no temperature compensation for the RTC in fixed frequency-division mode. The
RTC clock is the one that is generated by the external crystal oscillator and oscillation circuit
and then is divided by 327.xx. The RTC timing accuracy depends on the accuracy of the clock
provided by the external crystal oscillator. The decimal frequency divider can be adjusted.
The timing accuracy in fixed frequency-division mode is close to that of the non-integrated
RTC.
In fixed frequency-division mode, the internal RTC registers whose offset addresses are 0x51,
and 0x52 need to be configured:
The registers whose offset addresses are 0x51 and 0x52 are combined to form a 16-bit register.
Their value determines the decimal frequency divider which is calculated as follows:
 Frequency divider = 327 + (Value read from the registers whose offset addresses are
0x51 and 0x52/3052)
 For example, the value read from the register whose offset address is 051 is 0x8, the
value read from the register whose offset address is 0x52 is 0x1b, and the value of the
combined 16-bit register is 0x81b (2075 in decimal). Therefore, the frequency divider is
calculated as follows: Frequency divider = 327 + (2075/3052) = 327 + 0.68 = 327.68
The decimal frequency divider can be fine-tuned to ensure that the frequency-division clock is
close to 100 Hz. In this way, the RTC timing accuracy is increased. You are advised to tune
the frequency divider when all clocks are faster or slower than the expected values. For
example, if the output frequency of the crystal oscillator is 32767.00 Hz and the default
frequency divider 327.68 is used, the frequency-division clock is 99.97 Hz, which is slower
than the expected value. If the frequency divider is 327.67, the frequency-division clock is
100 Hz, and timing deviation is decreased.

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 RTC
Application Guide 4 RTC Correction

4 RTC Correction

RTC logic correction is not supported. If the RTC frequency offset is too large, you can adjust
the RTC frequency divider to fine-tune the RTC frequency.

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 RTC
Application Guide 5 HI_RTC Driver Usage

5 HI_RTC Driver Usage

The Hi3536D V100/Hi3559A V100/Hi3559C V100 does not support the hi_rtc driver.

5.1 Compilation
Run the following commands in the RTC directory to generate the hi35xx_rtc.ko driver,
hi_rtc.ko driver, and sample program test:
cd rtc
make
cd test
make

The hi35xx_rtc.ko and hi_rtc.ko drivers respectively comprise the following:

 hi35xx_rtc.ko: Hi3518EV20X/ Hi3516CV200, Hi3519 V100, Hi3519 V101, Hi3559
V100, Hi3556 V100, and Hi3516C V300
 hi_rtc.ko: Hi3521A/ Hi3520DV300, Hi3531A, Hi3536, Hi3521D V100, Hi3520DV400,
Hi3531D V100, and Hi3536C V100

5.2 Usage
Run the following command to insert the hi35xx_rtc.ko driver module:
insmod hi35xx_rtc.ko

Run the following command to insert the hi_rtc.ko driver module:

insmod hi_rtc.ko

RTC driver functions are described in the test sample program running on the board, as shown
in Figure 5-1.

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Application Guide 5 HI_RTC Driver Usage

Figure 5-1 Test sample program usage

Configuring and Obtaining the RTC Time

Run the following command to configure the RTC time:
./test –s time <year/month/day/hour/minute/second>

Run the following command to obtain the RTC time:

./test –g time

Configuring and Obtaining the RTC Alarm Time

Run the following command to configure the RTC alarm time:
./test –s alarm <year/month/day/hour/minute/second>

Run the following command to obtain the RTC alarm time:

./test –g alarm

Run the following command to set whether an interrupt is generated when the alarm time
reaches. The driver interrupt routine is added by users.
./test –a ON/OFF

Reading and Configuring Registers in the RTC

Run the following command to read a register in the RTC. This function is used for auxiliary
tests.
./test –r <reg>

Run the following command to configure the register in the RTC. This function is used for
auxiliary tests.
./test –w <reg> <value>

For details about the reg value, see the real-time clock contents in the user guide for each chip.

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Application Guide 5 HI_RTC Driver Usage

Resetting the RTC

Run the following command to reset the RTC:
./test –reset

Fine-Tuning the Frequency Divider in Fixed Frequency-Division Mode

Run the following command to set the frequency divider for adjusting the clock forward or
backward:
./test -f <val>

<val> is 10000 times the frequency divider to be set. For example, if the frequency divider is
327.60, val is 3276000. Run ./test –f to view the current frequency divider. Due to calculation
errors, there may be little deviation between the obtained frequency divider and the
configured frequency divider. The frequency divider ranges from 327.60 to 327.70.

Enabling and Disabling Battery Level Monitoring

Run the following command to enable the RTC battery level monitoring function:
./test –b ON

Run the following command to disable the RTC battery level monitoring function:
./test –b OFF

This feature applies only to Hi3536, Hi3519 V100, Hi3519 V101, Hi3516A V200, Hi3516C
V300, Hi3559 V100/Hi3556 V100, Hi3521D V100, Hi3531D V100, Hi3520DV400, and
Hi3536C V100.

User Interface
See the hi_rtc.h file.

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 RTC 6 Usage of Standard RTC Kernel Driver Under
Application Guide Linux

6 Usage of Standard RTC Kernel Driver

Under Linux

6.1 Compilation
The Hi3536C V100, Hi3536D V100, Hi3559A V100, and Hi3559C V100 support the RTC
kernel driver. The RTC option in the kernel compilation is enabled by default.

6.2 Usage
Burn the kernel to the board, boot the board, and execute the following command:
ls /dev/rtc0

If the RTC devices can be viewed, the RTC kernel driver is properly loaded.
The RTC kernel driver supports calling the ioctl function from the system.

Table 6-1 ioctl instructions and functions supported by the RTC kernel driver

Instruction Function
RTC_ALM_READ Reads the alarm time.
RTC_ALM_SET Reads the time and date.
RTC_SET_TIME Sets the time and date.
RTC_PIE_ON Enables the RTC global interrupt.
RTC_PIE_OFF Disables the RTC global interrupt.
RTC_AIE_ON Enables the RTC alarm interrupt.
RTC_AIE_OFF Disables the RTC alarm interrupt.
RTC_UIE_ON Enables the RTC update interrupt.
RTC_UIE_OFF Disables the RTC update interrupt.
RTC_IRQP_SET Sets the interrupt frequency.

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 RTC 6 Usage of Standard RTC Kernel Driver Under
Application Guide Linux

Configuring and Obtaining the RTC Time

 Run the following command to configure the RTC time:
ioctl(fd, RTC_SET_TIME, &rtc_tm);

 Run the following command to obtain the RTC time:

ioctl(fd, RTC_RD_TIME, &rtc_tm);

User Interface
See the rtc.txt file in the Documentation directory of the kernel.

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 RTC
Application Guide 7 Test Methods for Crystal Specifications

7 Test Methods for Crystal Specifications

7.1 Frequency Offset Test

 Connect the frequency meter to a chip clock test pin (TEST_CLK) through a coaxial
cable. In the U-Boot, configure the register, make the pin multiplexed as the CLK_TEST
function, and then select the RTC signal for output to test the RTC frequency.
 It is highly recommended that you do not use the oscilloscope on the crystal oscillator
pin for direct measurement. The capacitance value of a typical passive probe is less than
10 pF and the input impedance is about 10 MΩ. Both values greatly influence the
operation mode of the crystal oscillator.
 When the measured frequency is too high, the load capacitor value must be added. When
the measured frequency is too low, the load capacitor value must be reduced. If the
frequency deviation of the crystal oscillator is specified to ± 30 ppm, the clock frequency
precision of 32768 Hz must be ± 0.9 Hz in room temperature.

The test_clk pin should be connected to the test points during the board design to facilitate
future crystal specification tests.

7.2 Safety Factor Test

As shown in Figure 7-1, add an RQ resistor that is connected with the crystal oscillator in
series. Add the RQ value till the crystal oscillator does not work, then the RQ resistor reaches
its maximum vaule, RQmax (It is recommended that the RQmax value is verified by the SMD
resistor instead of an adjustable potentiometer).

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Application Guide 7 Test Methods for Crystal Specifications

Figure 7-1 Safety factor test diagram

By leveraging the preceding test, you can measure the oscillation margin (OA) and safety
factor (SF) of the crystal oscillator circuit.
OA =RQmax + ESR
SF:

OA RQmax + ESR
SF = =
ESR ESR

Table 7-1 Safety factor constraints

Safety Factor Constraints
SF<2 Insecure
2≤SF<3 Applicable
3≤SF<5 Secure
SF≥5 Very secure

Note: It is required that the safety factor is greater than 3 at least.

For example, if the crystal ESR is 60 K and the RQmax of the additional resistor in series is
120 K, it just reaches the secure level.

7.3 Oscillator Startup Time Test

Generally, for RTC oscillation circuits, a startup time between hundreds of milliseconds and
several seconds is normal. The startup time of the crystal oscillator is determined by different
factors:

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Application Guide 7 Test Methods for Crystal Specifications

 The lower the frequency is, the longer the startup time becomes (compared with 24 MHz
system clock).
 The larger the load capacitor is, the longer the startup time becomes.
 The greater the crystal ESR is, the longer the startup time becomes (focused during
crystal selection).
 The larger the OA is, the faster the oscillator starts (namely, the larger the SF is, the
faster oscillator starts).
 The larger the crystal parasitic inductance is, the longer the oscillator startup time
becomes.
In view of above factors, give priority to SF and frequency offset tests before testing the
oscillator startup time.
Use an oscilloscope to measure the RTC_Xout waveform, capture the first rising edge of the
waveform, and measure the time from the first rising edge to stable frequency outputs, as
shown in Figure 7-2.

Figure 7-2 Oscillator satartup time diagram

7.4 DL Test
The oscillation amplitude of the pins RTC_XIN and RTC_XOUT are specified on the Hi3536
crystal oscillation circuit. The actual drive level (less than the maximum drive level in crystal
oscillator specifications) when the circuit works is calculated as follows:
DL_actual=0.35*Rs_max*(π*f*VppXOUT*CL)2/2

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 RTC
Application Guide 7 Test Methods for Crystal Specifications

in which
 Rs_max is the maximum series resistance in crystal specifications.
 f indicates the crystal resonance frequency.
 VppXOUT indicates the peak-to-peak voltage for the RTC_XOUT pin measured by using
the oscilloscope.
 CL is the standard load capacitance in crystal specifications.

Due to the parasitic resistance and capacitance effect of the oscilloscope probe during the voltage test,
the test result deviation may appear. Therefore, the preceding formula is just a simpler method for DL
estimation. You can ask crystal manufacturer for more accurate tests.

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 RTC
Application Guide 8 Q&A

8 Q&A

8.1 No Oscillation on the Oscillator

[Symptom]
The 32.768 kHz clock has no output, and the value of the second register on the RTC timing
circuit is constant.
[Analysis]
Use the oscilloscope probe to check oscillation waveforms on the RTC_XIN pin, and various
oscillation waveforms are caused in the following situations:
 If there is no oscillation waveform on the pin, the crystal oscillator may be damaged.
 If about 32 kHz sine waves are detected and the peak-to-peak amplitude is less than 600
mV, capacitance of CL1 and CL2 may be large, causing the oscillation circuit drive
capability to be insufficient and the peak-to-peak amplitude is smaller than that at 32.768
kHz frequency. Therefore, oscillation waveforms cannot pass the subsequent Schmitt
trigger.
 If about 200 kHz sine waves are detected and the peak-to-peak amplitude is less than 600
mV, capacitance of CL1 and CL2 may be small, causing the oscillation circuit to
oscillate to 200 kHz frequency at which the amplitude is smaller than that at 32.768 kHz
frequency. Therefore, oscillation waveforms cannot pass the subsequent Schmitt trigger.
[Solution]
 Replace the crystal oscillator if it is damaged.
 If about 32 kHz sine waves are detected and the peak-to-peak amplitude is small, check
whether capacitance of CL1 and CL2 is large and replace the capacitors with appropriate
capacitors.
 If about 200 kHz sine waves are detected and the peak-to-peak amplitude is small, check
whether capacitance of CL1 and CL2 is small and replace the capacitors with appropriate
capacitors.

8.2 200 kHz Frequency Output by the Oscillator

[Symptom]

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Application Guide 8 Q&A

The frequency output by the 32.768 kHz clock is approximate to 200 kHz, and the value of
the second register on the RTC timing circuit increases by 6 per second.
[Analysis]
If exceptions occur on the 32.768 kHz crystal oscillator, the crystal oscillator may oscillate
near to six times of the fundamental frequency because the resonance point of 6.1 times of the
fundamental frequency is available on this crystal oscillator.
[Solution]
Check whether capacitance of CL1 and CL2 is small. If the capacitances of the two capacitors
are appropriate and the oscillation frequency is 200 kHz, add an Rd whose value is 1/(2 π x
32768 x CL2) to the circuit, as shown in Figure 8-1. The Rd and CL2 form an RC filter,
reducing the loop gain at 6.1 times of the fundamental frequency.

Figure 8-1 Circuit for resolving the 200 kHz output frequency issue

You are not advised to add an Rd to the circuit. Ensure that the signal amplitude on the RTC_XOUT pin
is not small before adding an Rd to the circuit.

8.3 Incorrect Oscillation Frequency

[Symptom]
The frequency output by the 32.768 kHz clock is not 32.768 kHz.
[Analysis]
The crystal oscillator and load capacitance work together to determine the oscillation
frequency on the oscillation circuit. The crystal oscillator determines the frequency range

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 RTC
Application Guide 8 Q&A

(frequencies corresponding to the frequency offset 0 in Figure 8-2, and the actual load
capacitance determines the frequency offset (the value of the frequency offset 0 in Figure 8-2).

Figure 8-2 Relationship between the frequency offset and the actual load capacitance CL

[Solution]
Firstly, ensure that crystal oscillator pin bending does not apply stress to the internal crystal
oscillator and the soldering temperature complies with specifications in the data sheet.
Secondly, check whether capacitance of CL1 and CL2 are appropriate and replace the two
capacitors with appropriate ones.

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