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2955 Fa
Pushbutton On/Off
Controller with Automatic
Turn-On
Features Description
n Automatic Turn-On Via Voltage Monitor Input The LTC®2955 is a micropower, pushbutton on/off control-
n Wide Input Supply Range: 1.5V to 36V ler that manages system power by generating a clean enable
n Low Supply Current: 1.2µA output from the supply monitor input and the debounced
n ±25kV ESD HBM on PB Input pushbutton input. It features an interrupt output that
n ±36V Wide Input Voltage for PB Input notifies the system of a pushbutton or low supply event.
n Low Leakage EN Output Allows DC/DC Converter When the system is ready, it may use the power kill input
Control (LTC2955-1) to shut off power. If the pushbutton remains pressed for
n High Voltage EN Output Drives External P-Channel more than the configurable turn-off duration, the system
MOSFET (LTC2955-2) power is forced off.
n Simple Interface Allows Graceful µP Shutdown
The supply input covers a wide range from 1.5V to 36V.
n Adjustable Turn-Off Timer
n
The robust pushbutton input handles wide voltage swings
10-Lead 3mm × 2mm DFN and 8-Lead ThinSOT™
of ±36V and ESD strikes to ±25kV (human body model)
Packages
without latchup or damage. A low 1.2µA supply current
maximizes battery run time. Separate versions are avail-
Applications able for positive or negative enable polarities.
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and
n Desktop and Notebook Computers ThinSOT and PowerPath are trademarks of Linear Technology Corporation. All other trademarks
are the property of their respective owners.
n GPS Devices
n Portable Instruments
n Automotive Electronics
Typical Application
Automatic Turn-On with Power-Fail Indication Pushbutton On/Off with Interrupt
PGD INT
402k PB
INTERRUPT INTERRUPT
TMR GND 2955 TA01b
POWER-FAIL
2955 TA01a
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Pin Configuration
TOP VIEW
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Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 4: The KILL turn-on blanking time is the waiting period immediately
may cause permanent damage to the device. Exposure to any Absolute after the enable output is asserted. This blanking time allows sufficient
Maximum Rating condition for extended periods may affect device time for the regulator and the µP to perform power-up tasks. The KILL, PB,
reliability and lifetime. and ON inputs are ignored during this period.
Note 2: All currents into pins are positive; all voltages are referenced to Note 5: The enable lockout time is the waiting period immediately after the
GND unless otherwise noted. enable output is released. It allows an application to properly power-down
Note 3: Guaranteed by design, not subject to test. such that the next power-up sequence starts from a consistent powered
down configuration. PB and ON are ignored during this period.
Undervoltage Lockout vs
Supply Current vs Temperature Supply Current vs Supply Voltage Temperature
1.6 1.6 1.20
1.5
1.4 1.18
1.4
1.2
1.0 1.14
1.1
1.0
0.8 TA = –40°C 1.12
0.9 TA = 25°C
TA = 85°C
0.8 0.6 1.10
–50 –25 0 25 50 75 100 125 0 5 10 15 20 25 30 35 40 –50 –25 0 25 50 75 100 125
TEMPERATURE (°C) VIN (V) TEMPERATURE (°C)
2955 G01 2955 G02 2955 G03
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35
0.805 1000
34
tDB(ON) (ms)
VON/KILL (V)
tTMR (ms)
0.800 33 100
32
0.795 10
31
0.790 30 1
–50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125 1 10 100 1000
TEMPERATURE (°C) TEMPERATURE (°C) TMR EXTERNAL CAPACITANCE (nF)
2955 G04 2955 G05 2955 G06
TMR Pull-Up Current EN Output High Voltage vs EN Output High Voltage vs Supply
vs Temperature Temperature Voltage
–3.4 5.0 5.0
–3.3 4.8
4.0
–3.2
4.6
–3.1
ITMR(PU) (µA)
4.4
–3.0
4.2
2.0
–2.9
4.0
–2.8
1.0 TA = –40°C
–2.7 3.8 TA = 25°C
TA = 85°C
–2.6 3.6 0.0
–50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125 1 2 3 4 5 6 7
TEMPERATURE (°C) TEMPERATURE (°C) VIN (V)
2955 G07 2955 G08 2955 G09
–120
VEN/EN(VOL) (mV)
300
IPB (µA)
200
–40 100
VIN = 7V
150
0 50 TA = –40°C
100 TA = 25°C
TA = 85°C
50 40 0
–50 –25 0 25 50 75 100 125 –40 –20 0 20 40 0 10 20 30 40 50
TEMPERATURE (°C) PB VOLTAGE (V) EXTERNAL PB RESISTANCE TO GROUND (kΩ)
2955 G10 2955 G11 2955 G12
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VIN
900k
EN
(2955-2)
VLDO
EN CONTROL
2µA
LTC2955-2
VIN
REGULATOR VLDO ≈ 5.2V
EN
(2955-1)
EN CONTROL
VLDO
LTC2955-1
OSCILLATOR
f = 1kHz
900k EN CONTROL VLDO
PB –
LOGIC
2µA
DEBOUNCE
+
0.8V
ON OSCILLATOR
ON PGD*
+
OFF
0.8V –
INT
SEL* –
– KILL
+
0.8V
GND +
0.8V
TMR
2955 BD
*DFN ONLY
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t1 t2 t3
EN
(LTC2955-1)
2955 F01
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EN
(LTC2955-1)
PGD
2955 F02
t1 t2 t3 t4 t5 t6 t7
PB PB
PB IGNORED IGNORED
tDB(OFF) tEN(LOCKOUT)
KILL IGNORED
16 CYCLES
TMR
tTMR
INT
tINT(MIN)
EN
(LTC2955-1)
2955 F03
PB PB IGNORED
TMR
INT
2955 F04
tINT(MIN)
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t1 t2 t3 t4 t5
ON IGNORED
tINT(MIN)
KILL IGNORED
16 CYCLES
TMR
tTMR
INT
tEN(LOCKOUT)
EN
(LTC2955-1)
PGD
2955 F05
Figure 5. ON Pin Turn-Off Timing (DFN Only, VSEL > 1.2V and the Preceding Turn-On Sequence Was
Initiated by the ON Pin Rising Edge
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t1 t2 t3 t4 t5
ON PIN
PB PIN
PGD PIN
TURN-ON BY PB
EN PIN
2955 F06
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t1 t2 t3 t4 t5
ON PIN
TURN-OFF BY
PUSHBUTTON
PB PIN
TURN-ON BY ON
HIGH LEVEL TURN-ON BY ON
RISING EDGE
EN PIN
2955 F07
tEN(LOCKOUT) tEN(LOCKOUT)
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R2 R1
100k 10k
1%
VIN EN
C4 LTC2955TS8-1
VIN EN R1
0.1µF
C4 LTC2955TS8-1 10k INT
0.1µF INT
INT PB KILL
µP
PB KILL KILL + C3*
(OPEN DRAIN) ON GND TMR
0.01µF
ON GND TMR 2955 F08 CTMR*
1µF
CTMR* *OPTIONAL 2955 F09
1µF
*OPTIONAL
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TRACE
PB Pin in a Noisy Environment CAPACITANCE R6 VIN EN
5.1k LTC2955-1
The rugged PB pin is designed to operate in noisy environ- NOISE
PB INT
ments. Transients below ground and above VIN (–36V < TRACE
C5
0.1µF
KILL
INDUCTANCE GND TMR
VIN < 36V) will not damage the rugged PB pin. Additionally, 2955 F11
VOUT
M1
4.2V VOUT,TRIP POINT = 6V
+ SINGLE CELL R5* R9
Li-ION BATTERY 100k 100k
R1
VIN EN 649k
C4 LTC2955TS8-2 1%
0.1µF INT
+ 4.2V
SINGLE CELL
Li-ION BATTERY PB VTH = 0.8V INPUT OPTIONAL GLITCH
KILL
FILTER CAPACITOR
ON GND TMR R4
C3*
100k
CTMR* 0.1µF
1%
0.033µF
2955 F10
*OPTIONAL
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BATTERY
SHDN
R8
1k
Figure 14. Using a Slide Switch to Prevent Accidental
VIN EN
Turn-On/Off
R1
C4 LTC2955TS8-1 10k
10nF INT
INT
µP VIN VIN EN
PB KILL KILL
OFF SEL
ON 2955 F13
GND TMR ON
ON
CONT*
0.033µF LTC2955DDB-1
PB
*OPTIONAL GND
2955 F15
Layout Considerations
EN
1M Figure 18 shows example PCB layouts for placing the VIN
VIN TMR
LTC2955TS8-1 pin bypass capacitor. Position the bypass capacitor close
ON
INT
to the LTC2955 on the same side of the PCB and keep the
PB KILL
traces short. For the DFN package, a PCB via should be
GND placed near the LTC2955 to connect the PB pin (Pin 5)
2955 F16
to the pushbutton. This allows an unbroken trace to be
placed between the VIN pin and the bypass capacitor.
Figure 16. 2-Cell with 3.3V Output Placing the bypass capacitor close to the LTC2955 gives
the optimum protection against PB pin ESD transients.
If a higher VEN(VOH) is required, an external pull-up resistor
can be connected from the EN pin to any higher voltage LTC2955DDB LTC2955TS8
(<36V). The EN pin is designed to be able to sink at least 1 8
1mA of current during turn-off, so this external pull-up 1 10
2 7
2 9
resistor value must be selected to source less than 1mA 3 11 8
3 6 VIN
4 5
with EN at 0V. VIN 4 7
CVIN
The LTC2955-1 EN pin can also be connected to switching 5 6
LTC3204-3.3 LT1763-5
3.3V
1.8V VIN VOUT 12V VIN VOUT
2.2µF C+ 1µF
SHDN
2.2µF
GND C–
SHDN
EN
VIN PGD 1M
LTC2955DDB-1
EN ON
VIN 1M INT
5.1k*
LTC2955TS8-1 PB KILL µP
INT
TMR
PB KILL µP 0.1µF* SEL GND
2955 TA03
TMR GND ON
2955 TA02
LT3009
12V VIN VOUT 3.3V
SHDN
100k
1M
EN
VIN
LTC2955TS8-2
0.1µF
KILL
PB INT
TMR GND ON
2955 TA04
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DDB Package
10-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1722 Rev Ø)
0.64 ±0.05
(2 SIDES)
0.70 ±0.05
2.55 ±0.05
1.15 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.50 BSC
2.39 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.00 ±0.10
PIN 1 BAR PIN 1
(2 SIDES)
TOP MARK R = 0.20 OR
(SEE NOTE 6) 0.25 × 45°
0.64 ±0.05
(2 SIDES) CHAMFER
5 1 (DDB10) DFN 0905 REV Ø
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
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1.22 REF
PIN ONE ID
0.80 – 0.90
0.20 BSC
0.01 – 0.10
1.00 MAX
DATUM ‘A’
(NOTE 3)
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
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LTC4412
VIN GATE
EN
GND SENSE VIN
33nF
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