LM812 Page 1 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module Revised 15/MAR/2021

Host Controller Interface (HCI) via USB Interface Datasheet Version 1.2
Ordering Options See last page

Android XP Vista 7 8 10

3.3V 5V

IPEX IC

1.85mm
Features
WiFi 802.11 b/g/n/e/i

Bluetooth® v4.2
(Backward compatible with Bluetooth® v2.0, v2.1, v3.0, v4.0)
25mm
WPA, WPA-PSK, WPA2, WPA2 -PSK and
WEP (64bit & 128bit) encryption schemes
12mm
Full speed Bluetooth® Piconet and Scatternet

5V IC Antenna or 3.3V IPEX Connector module options

25mm x 12mm x 1.85mm
USB 2.0
Linux (Kernel v2.6.24 - v5.1), Android 9.x and
Supports sophisticated WiFi / Bluetooth® coexistence Windows XP – 10 compatible
to enhance performance
See our website for this products certifications.
Supports Bluetooth® adaptive power management RoHS, REACH and WEEE compliant.

Overview
The LM812 combination module offers coexistence for Bluetooth® (Dual Mode) and WiFi operations, allowing the host computer to
wirelessly communicate with other Bluetooth® and WiFi enabled devices. This cost-effective module saves valuable PCB space within
your product.

The LM812 module supports IEEE 802.11b/g/n/e/i and Bluetooth® v2.0, v2.1, v3.0, v4.0 and v4.2 standards.

Compatible with Linux (Kernel v5.1), Android 9.x and Windows XP – 10 platforms.

The LM812 module also offers low power consumption and an intelligent coexistence mechanism, ideal for communicating with many
wireless devices such as tablets, smart phones and laptops.

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 LM812 Page 2 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

General Specification

Wireless Standard WiFi:

802.11 b/g/n/e/i

Bluetooth®:

v2.1+EDR/v3.0/v4.0/v4.2

Module Type Host Controller Interface (HCI)

OS Compatibility Linux (Kernel v2.6.24 - v5.1), Android 1.6 – 2.3, Android 4.0 – 9.x, Windows XP – 10

Security WiFi;

WPA, WPA-PSK, WPA2, WPA2 -PSK, WEP (64bit & 128bit) ,IEEE 802.11x, ,IEEE 802.11i

Bluetooth®;

Simple Paring

Network Architecture WiFi;

Ad hoc mode (Peer-to-Peer) and Infrastructure mode Software AP; WiFi Direct

Bluetooth®;

Pico Net; Scatter Net

Chipset Realtek

Antenna Onboard Chip Antenna or IPEX Connector

Interfaces USB 2.0

Tx Output Power WiFi;

17dBm – 802.11b@11Mbps

15dBm – 802.11g@6Mbps

14dBm – 802.11g@54Mbps

13dBm – 802.11n@MCS0_HT20

13dBm – 802.11n@MCS7_HT20

13dBm – 802.11n@MCS0_HT40

13dBm – 802.11n@MCS7_HT40

Bluetooth®:

Maximum 10dBm

Rx Sensitivity WiFi;

-82dBm – 802.11b@11Mbps -71dBm – 802.11g@54MBps -67dBm – 802.11n@MCS7_HT20

-64dBm - 802.11n@MCS7_HT40

Bluetooth®:

-89dBm@1Mbps -90dBm@2Mbps -83dBm@3Mbps

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 LM812 Page 3 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

General Specification (Continued)

Power Consumptiom Average: TBA Peak: TBA

Range (in open space) WiFi: Up to 180m Bluetooth®: Up to 10m
Data Transfer Rate WiFi:

802.11b: 11, 5.5, 2, 1 Mbps

802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps

802.11n: MCS0 to 7 for HT20MHz

802.11n: MCS0 to 7 for HT40MHz

Bluetooth®:

Basic rate: 1Mbps

Enhanced data rate: 2, 3 Mbps

Low Energy: 1Mbps

Frequency 2.4GHz to 2.4835 GHz
Modulation Scheme WiFi:

802.11b: CCK, DQPSK, DBPSK

802.11g: 64QAM, 16QAM, QPSK, BPSK

802.11n: 64QAM, 16QAM, QPSK, BPSK

Bluetooth®:

8DPSK, π/4 DQPSK, GFSKFSK

Spread Spectrum WiFi:

IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)

IEEE 802.11g/n: OFDM (Orthogonal Frequency Division Multiplexing)

Bluetooth®:

FHSS (Frequency Hopping Spread Spectrum)

Operating Channels WiFi (2.4GHz):

11: (Ch. 1-11) – United States

13: (Ch. 1-13) – Europe

14: (Ch. 1-14) – Japan

Bluetooth® (2.4GHz):

Ch. 0 to 78

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 LM812 Page 4 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

General Specification (Continued)

Physical Characteristics

Operating Temperature -20°C to +80°C ambient temperature 0 to 95 % (non-condensing)

Storage Temperature -30°C to +85°C ambient temperature 0 to 95 % (non-condensing)
Dimensions (L x W x H) 25mm x 12mm x 1.85mm
Weight 1.10g +/- 0.25g tolerance
Certifications See our website for this products certifications.
Compliance RoHS, REACH and WEEE

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 LM812 Page 5 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

Pin Outs

14 1
15 16 17 18 19 20
13 2
12
3
TOP VIEW
4

5
11 10 9 8 7
6

Pin Assignments

Pin Signal Type Description

1 HOST_WAKE_BT Input Shared with GPIO 13.

2 VDD Power Supply DC 3.3V for LM812 (IPEX Connector Module) / Supply DC 5V for LM812 (IC Antenna Module).

3 HSDM I/O USB D- signal

4 HSDP I/O USB D+ signal.

5 GND - Ground.

6 BT_WAKE_HOST Output Shared with GPIO 14. Bluetooth® device wake up host.
7 NC - Do not connect to ground (IC pin GPIO3).

8 NC - Do not connect to ground (IC pin GPIO2).

9 NC - Do not connect to ground (IC pin GPIO1).

10 NC - Do not connect to ground (IC pin GPIO0).

11 EXT_XIN - No connection, leave floating.

12 GND - Ground.

13 ANT RF WiFi / Bluetooth® RF port (if you are NOT using the IPEX connector).

14 GND - Ground.

15 WL_WAKE_HST Output WLAN device wake up host (IC pin GPI08).

16 WL_WAKE_WL Input Host wake up WLAN device (IC pin BT_GPI014).

17 NC - No Connection. Do not connect to ground.

18 BT_DIS# Input Bluetooth disable. Default pull high, external pull low disable BT.

19 WL_DIS# Input WLAN disable. Default pull high, external pull low disable WLAN.

20 3DD_SEL - No Connection. Do not connect to ground (IC pin GPI06).

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 LM812 Page 6 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

DC Power Input
Module Min Typical Max Unit Important Warning
Do NOT use the wrong voltage on your module.

DC 5V (IC Antenna) 4.75 5 5.25 V 3.3V IPEX connector products must only use 3.3V
DC 3.3V (IPEX Connector) 3.135 3.3 3.465 V 5V IC Antenna products must only use 5V

Power Consumption
DC power for 5V DC power for 3.3V
Description Performance Description Performance

Typical Units Typical Units

Off 10 uA Off 16 uA
Unassociated idle 40 mA Unassociated idle 90 mA
Associated idle for 2.4GHz band 70 mA Associated idle for 2.4GHz band 141 mA
Data transfer for 2.4GHz 103 mA Data transfer for 2.4GHz 168 mA

NB: Data transfer test unsing the Linux driver: Linux_v4.3.6_1184.20140714

Module Block Diagram

ANT

USB Host Interface Realtek Chipset

XTAL
40MHz

LM812

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 LM812 Page 7 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

Module Placement Notes

In order to get a better performance please don’t put any Considering antenna field pattern it is better to put
metal shielding in the surrounding area of module and try the module in horizontal way with the chassis board.
to leave the module placed in the corner of chassis board
as close as possible.

Corner of the chassis board

PCB Footprint
25mm 0.2

0.2
12mm

6.5mm

No
Grounding

7.4mm

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 LM812 Page 8 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

Chip Antenna
The antenna area in the module should protrude Keep the distance at least 13cm long with WLAN or
outside the Ground at least 5mm another antenna of the same frequency band, to avoid the
interference or deteriorate the performance.

At least 5mm No Ground

At least 5mm Ov
er
13c
m

RF Out
This RF out pin needs the input impedance of 50 Ohm

50 Ohm Feed line

RF Out

No Ground

RF Connector 50 Ohm Feed Line

H1 20 - 60 mil

Er1 4.2
C2 W2 D1
C1 T1 W1 20 mil

W2 20 mil

D1 5 mil
H1 Er1
C1 0.7 mil

C2 0.7 mil
W1
T1 1.4 mil (1 oz)

Impedance 51 - 53 Ohm

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 LM812 Page 9 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

Physical Dimensions
SIDE VIEW
25mm 0.2

1.85mm
0.6+0.15
2.21
0

0.2
R0.3
0.2
2x2
12mm
9.12mm

TOP VIEW 1 1.5x5

7 2x5
8.5
1

1
BOTTOM VIEW

High limit
0mm
FRONT VIEW
10

1.5x4

PCB Footprint
25mm 0.2
The recommended layout pads.
1.5x5
1.5X2

8.5mm

0.2
12mm

1.05
7.6mm

2x5
1
0.45
1
10 1.5x4
1
1.1

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 LM812 Page 10 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

RF Connector Dimensions
2.60±0.10

0.25±0.050
ø2.00±0.050
0.25

ø1.85±0.050

1.80±0.050

2.60±0.10
0.60
0.10
A
3.10

A A

MAX

0.60 A

0.25±0.050
0.60

0.050 A B

A ø1.70±0.050

ø1.00
30.0
1.25±0.050

0°
B ø0.50±0.050
0.10

Ground Contact
0.15
0.05

Housing
0.90±0.05
0.35

SECT A-A
Contact

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 LM812 Page 11 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

PCB Drying Conditions

Please refer below to the conditions for drying before the solder reflow processes. (Extracted from IPC/JEDEC J-STD-033B.1)

1. If the system PCBA is double side design please reflow the side without this module first.
2. Don’t let the solder machine temperature over 250 °C or follow solder paste vender’s recommended temperature.
3. The Ramp-up temperature speed is 1~4 °C per second, the Ramp-down temperature speed is 1~4 °C per second.
4. This temperature reflow chart is for reference only, it depends on the manufaturing machine’s characters requirement.

Bake @ 125 °C Bake @ 90 °C Bake @ 40 °C

Exceeding floor Life by Exceeding floor Life by Exceeding floor Life by Exceeding floor Life by Exceeding floor Life by Exceeding floor Life by
> 72h ≤ 72h > 72h ≤ 72h > 72h ≤ 72h

9 hours 7 hours 33 hours 23 hours 13 days 9 days

Soldering Reflow Chart

320
300
280
260
240
200
Temperature °C

180
160
140
120
100
80
60
40
20
0
0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380

Time (s) #1 #2 #3 #4 #5

Name Zone 1 Zone 2 Zone 3 Zone 4 Zone 5 Zone 6 Zone 7 Zone 8

Max 180.0 180.0 170.0 170.0 180.0 210.0 260.0 245.0
Min 180.0 180.0 170.0 170.0 180.0 210.0 260.0 245.0
Length 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0

Probe Liquidus Line Maximum / Minimum Slope

Rising 110.00-190.00 Above 230.0 Max Min Positive Negative

#1 119.00 47.50 245.50 27.30 2.56 -1.69

#2 116.50 49.00 247.10 27.70 2.69 -1.60
#3 116.00 46.50 245.80 29.30 2.04 -1.57
#4 117.00 46.50 244.90 29.20 2.60 -1.31
#5 119.50 50.00 248.10 29.60 2.44 -1.64

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 LM812 Page 12 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

Tray Packaging

Tray Dimensions

144 mm 40 Piece Tray: 8 x 5

Tray Depth
20mm

314 mm

Quantities Notes
40 modules per Tray Anti-Static PS Tray, Black.
3 Trays per Inner Box Material Thickness: 1mm
120 modules per Inner Box Height of Tray: 20mm
8 Inner Boxes per Outer Carton Carton Dimensions (L x W x H):
960 modules per Outer Carton 340mm x 290mm x 385mmm

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 LM812 Page 13 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

Tape and Reel Packaging

Tape Dimensions
1.75mm

2.0mm 16mm 1.50mm 4.0mm

20.2mm

25.6mm
40mm
44mm
0.3mm

12.60mm

2.4mm

Reel Dimensions

Quantities
1500 modules per Tape & Reel
1 Tape & Reel per Inner Box
5 Inner Boxes per Outer Carton
330mm
7500 modules per Outer Carton

Notes

Inner Box Dimensions (L x W x H):

360mm x 360mm x 60mm
Outer Carton Dimensions (L x W x H):
395mm x 360mm x 305mm
100mm

49.4mm

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 LM812 Page 14 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

Packaging for Tape & Reel / Tray

The Tape & Reel / Tray are inserted into an anti-static vacuum bag with a Humidity Indicator Card and Drying Agent.
On the outside of the vacuum bag are MSL (Moisture Sensitivity Levels), MPN and an Anti-Static Labels.

Tape & Reel Tray

Reels are placed within a vacuum bag. Trays are stacked with an empty tray on the top and placed within a vacuum bag.

Humidity Drying MSL MPN Anti-Static Humidity Drying MSL MPN Anti-Static
Indicator Agent Label Label Label Indicator Agent Label Label Label
LM LM

Vacuum bag. Vacuum bag.

MPN Label MPN Label

LM LM
The vacuum bag is placed inside the inner box with a The vacuum bag is placed inside the inner box with a
MPN Label stuck on the front-side of each box. MPN Label stuck on the front-side of each box.

inner box inner box

inner box inner box

inner box inner box

1 bags max per inner box 3 bags max per inner box
(1500 pcs) (40 pcs x 3 = 120 pcs)

Outer Carton Outer Carton

) Outer Carton ) Outer Carton
Label Label
CLC CLC

Each Outer Carton contain 5 inner boxes max Each Outer Carton contain 8 inner boxes max
(7500 pcs) (120 pcs x 8 = 960 pcs)

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 LM812 Page 15 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

Datasheet Version Notes

v1.0 5 MAR 2021 Initial datasheet release.

v1.1 8 MAR 2021 Power Consumption and Packing information added.
v.1.2 15 MAR 2021 Pin Out 3 and 4 Description error amended. D- D+

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 LM812 Page 16 of 16

LM812 WiFi and Bluetooth® 4.2 Dual Mode USB Module

Host Controller Interface (HCI) via USB Interface

Ordering Options

RF Country Bands
Our default radio region is ETSI. Unless specified otherwise when ordering, units will be shipped using the ETSI radio bands.

Ordering Code 5V Module with IC Antenna

812-8121-000 MOD SMT HCI 802.11n BT4.2 -20c 5v IC ANT D-Type SP

5V 812-8121-001 MOD SMT HCI 802.11n BT4.2 -20c 5v IC ANT D-Type TRAY
IC 812-8121-002 MOD SMT HCI 802.11n BT4.2 -20c 5v IC ANT D-Type T&R

Ordering Code 3.3V Module with IPEX Connector

812-8120-000 MOD SMT HCI 802.11n BT4.2 -20c 3.3V IPEX SP

3.3V
812-8120-001 MOD SMT HCI 802.11n BT4.2 -20c 3.3V IPEX TRAY
IPEX 812-8120-002 MOD SMT HCI 802.11n BT4.2 -20c 3.3V IPEX T&R

Product User Guides, Manuals and Configuration Software can be downloaded via our website - http://www.lm-technologies.com/downloads

LM Technologies Ltd
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