Standard Products

UT28F64/LV and UT28F256/LV PROMs

Programming User Guide
Legacy Products
June 2011

PROM PROGRAMMING FLOW FOR UT28F64, UT28F256, UT28F64LV and UT28F256LV PROM
for Legacy Products

The UT28F64 and UT28F256 are 5-volt parts. The UT28F64LV and UT28F256LV are 5-volt parts that have been characterized for
3V operation. All four of these parts should follow the same flow for Post-Program Conditioning. These parts will be burned in at
7.0V and the Verify on the Prom Board Tester shall be performed at 4.5V and 5.5V. The UT28F64LV and UT28F256LV will not be
damaged when tested at the higher voltages.

Parts are programmed and verified using a Data I/O 2900, 3900, 3980, or 3980xpi Programmer. After programming, the parts go
through Post-Programming Conditioning (PPC). PPC is used to enhance the reliability (and radiation tolerance) of the Aeroflex
UTMC PROMs following programming. PPC consists of a 64-hour unbiased bake and a 64-hour dynamic burn-in. Parts are veri-
fied using the Data I/O Programmer and the Aeroflex UTMC PROM Board Tester. This verification identifies parts that fail after
PPC. The PROM Board Tester verifies the product by doing an at-speed test using the same functional test as the production tester.
After the parts have been through this flow (see Figure 1), they are ready for use in your system.

1
 Setup Data I/O Programmer (see Appendix 1)

Program and Verify Device (see Appendix 1)

Post-Program Bake
(see Appendix 2)
64 hours (-0/+8hrs) Unbiased
200C(+/-2oC)

Post-Program Burn-In (see Appendix 2)

64 hours (-0/+8 hrs) Dynamic 7.0V
150C(+/-2oC)

Verify on Data I/O (see Appendix 1)

Verify on Prom Board Tester (see Appendix 3)

At 4.5V and 5.5V

Part ready for use in system

Figure 1. PROM Programming Flow

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 APPENDIX 1

DATA I/O Programming Set-Up Guide

The following reviews the installation of programming software for the UT28F64/UT28F256 and UT28F64LV/UT28F256LV
PROM. To program the PROMs with an industry standard data file, the user simply loads the programming algorithm and data file
into the DATA I/O programming hardware.

HiTerm Software:

1) Insert diskette with appropriate algorithm into DATA I/O floppy drive.

From the Main Menu:

2) Choose: Select Device (This will bring up the Manufacturer List)
3) Choose: UTMC (This will bring up the part menu for UTMC)
4) From the Part Menu select:
- UT28F256
- UT28F256-FP
- UT28F64
- UT28F64-FP

PROMlink or TASKLink Software:

1) Insert diskette with appropriate algorithm into DATA I/O floppy drive.

2) Choose Setup from the menu bar

3) From the Setup menu choose: Select Device (This will bring up a Manufacturer List)
4) From the Manufacturer List choose: UTMC (This will bring up a UTMC device menu)
5) Select one of the following device types from the UTMC Device Menu:
- UT28F256
- UT28F256-FP
- UT28F64
- UT28F64-FP

3
Programming All Unused Bit Locations
Aeroflex UTMC requires that you program all bits in the UT28F64/UT28F256 and the UT28F64LV/UT28F256LV. If
your program does not require all of the space within the PROMs, you should program the unused locations with a
default value, or configure the DATA I/O programmer to write zero’s to the unused bit locations. The following instruc-
tions describe the steps required by HighTerm, TaskLink, and PROMLink to properly configure the DATA I/O system
to program zeros into all unused bit locations.

HighTerm Software:
From the Main Menu:

1) Choose: More Commands (This will bring up a list of command menus)

2) Choose: Edit Data (This will bring up a list of data editing options)
3) Choose: Fill Memory (This will bring up the memory configuration options)
4) From the Fill Memory page:
-Set Memory Begin Address to “0”
-Set Block Size to “2000” (hexadecimal) (UT28F64/UT28F64LV)
or Set Block Size to “8000” (hexadecimal) (UT28F256/UT28F256LV)
-Set Fill Variable to “0”
-Hit the [ENTER] key

TaskLink/PROMLink Software:

1) Choose Setup from the menu bar

2) From the Setup menu choose: Memory Parameters
(This will bring up memory configuration parameters)

3) Set the following option in the Memory Parameters menu:

Under “Automatic RAM Fill”, click between the parenthesis ( ) next to
“Specific: 00”. You will see ( ) next to “Specific: 00” when the item is
properly selected. The default value for the RAM fill is 00h, and is displayed
by the two zeros next to “Specific:”. If you want the default fill value to be
something other than 00h, you can click on the field next to “Specific:” and
change the number to a desired hexadecimal value.

4
Notes:

1. For programming, make sure that the continuity check, fuse verify and functional test are on. Failure to have these parameters
properly set could result in an improperly programmed device that appears as a “PASS” after programming.

Setting up the programmer to perform continuity check and functional verification under
HiTerm, PROMLink, and TASKLink is described below.

In Highterm:
From the Main Menu:

1) Choose: More Commands (This will bring up a list of command menus)

2) Choose: Configure System (This will bring up a list of system configuration options)
3) Choose: Edit (This will bring up the option to set up the programming configuration)
4) Choose: Programming (This will bring up the the programming configuration options)
5) From the Edit Programming Parameters page:
- Set Logic Verification to “A”
- Set Continuity Check to “Y.”

In TASKLink/PROMLink:
From the Main Menu Bar:

1) Choose: Setup
2) From the Setup menu choose: General Parameters
(This will show general programmer configuration settings)

3) Set the following options in the General Parameters menu:

- Set Verify Passes to “TWO VCC LOW/HIGH.”
- Click on the Check Box next to Continuity Checking
(The box should have an “X” when enabled.)

Now return to the Setup menu, and perform the following:

1) From the Setup menu choose: Logic Parameters:

2) Configure the following option from the Logic Parameter menu:
- Set Verify Options to “FUSE VERIFY AND FUNCTIONAL TEST.”

2. If the part fails continuity when attempting to program, try again with the part reseated in the socket. If that fails, make sure
the part is correctly oriented in the Data I/O programmer. DIPs must be oriented as per the diagram on the programmer base.
Flatpack parts must be oriented in their carriers correctly (see attached carrier orientation diagram).
3. The DATA I/O 2900, 3900, 3980, 3980xpi “Blank Check” utility does not function properly on the UT28F64/LV and
UT28F256/LV PROM.
4. Programmer Pin Interface (PPI) boards are available from DATA I/O. (see Table 1)

5
UT28F64/LV and UT28F256/LV PROM Alignment Within Carrier
The following diagram shows the alignment of the UT28F64/UT28F256 and UT28F64LV/UT28F256LV PROM within its carrier.
It is very important that the PROM is properly aligned in the carrier during programming. If you attempt to program the PROM
when it is not properly aligned, the Data I/O programmer will fail continuity check.

No. 28 No. 1

of the UT28F64/LV and

Bottom Side

UT28F256/LV

No. 15 No. 14

MARK/LID DOWN

Figure 2. Diagram of the UT28F64/LV and UT28F256/LV PROM 28 Pin Flat Pack in Carrier

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Programmer Options
Data I/O supports PROM on the following programmers:
2900
3900
3980
3980xpi

Table 1: DATA I/O Platforms for PROM

DATA I/O
Product DATA I/O DATA I/O
3900, 3980
Type 2900 Uni-Site
and 3980xpi

PROM Yes Yes Not Available

DIP BASE: DIP BASE:

29BASE-0102 39BASE-0101

PPI BASE: PPI BASE:

29BASE 9901 39BASE 9901
PPI-1004 (FP) PPI-1004 (FP)

7
 APPENDIX 2

UTRH00SC Burn-In Stimulus Controller

Stimulus Controller and Post-Program Conditioning Operating Instructions

Introduction:
The following reviews the setup and operation of the PROM Burn-In Stimulus Controller, and discusses the post-program condi-
tioning process. The Stimulus Controller is used to supply all the appropriate signals to the PROM Burn-In boards during post-pro-
gram conditioning. The post-program conditioning is required to optimize the performance, and increase the reliability of the
UT28F64/LV and UT28F256/LV PROMs.

Stimulus Controller Setup:

Please refer to Figure 1 to assist with these instructions.

1) Insert the PROMs into the burn-in board using standard ESD procedures.

2) The burn-in board is supplied with approximately 5 feet of Teflon ribbon cable. The cable and burn-in board will withstand
152oC maximum temperature. Place the cable through the port of the burn-in oven, with the burn-in board on a flat surface.

3) Connect the Teflon ribbon cable from the burn-in board to one of the connectors on the Stimulus Controller. The Stimulus Con-
troller is capable of driving two burn-in boards. Note that the cable connector is keyed such that the notch will face away from
the power jacks.

4) Supply power to the Stimulus Controller using two banana plug cables. The power supply must limit a maximum of 1 Amp of
current at +12VDC (-0V/+0.5V). Insert the cable attached to the GROUND output of the power supply to the BLACK banana
jack located on the end of the Stimulus Controller. Insert the cable attached to the +12Volt output of the power supply to the
RED banana jack located on the end of the Stimulus Controller. Turn on the power supply and verify that the POWER ON LED
is lit up, and that the FREQ. ON LED is flashing. Check the burn-in board with a voltmeter between the GND and the PS1
(VDD) terminals for 7.0VDC (-0.2V/+0V). Turn off the power supply.

5) The post-program Stimulus Controller is now ready for operation. After the burn-in oven has reached 150oC, turn on the power
supply and check the voltages as in step 4 above. Be careful not to be harmed by hot metal surfaces in the oven as you verify that
there is 7.0VDC (-0.2V/+0V) between the PS1 and GND terminals on the burn-in board.

NOTE: Verify that the power supply is set to +12VDC (-0V/+0.5V) before applying power to the Stimulus Controller.
.

GN
FREQ. ON D
U T M C
UTRH00SC
S/N. +1
XXXXXXXX
POWER ON 2V

REV. A

Figure 1. Aeroflex UTMC Stimulus Controller

8
Post-Program Conditioning Flow:
The post-program conditioning is a very important step in the PROM programming process. It performs two major tasks:

1) Increases the reliability of the UT28F64/LV and UT28F256/LV PROM

2) Optimizes the performance of the UT28F64/LV and UT28F256/LV PROM

The required post-programming flow is shown on page 1 of the User Guide. The user first programs the
UT28F64/LV and UT28F256/LV PROM on either the DATA I/O 2900, or the DATA I/O 3900/3980/3980xpi programmer.

Then the PROMs are placed on a tray suitable for burn-in temperatures, loaded into the burn-in oven, and are run through a 64 hour
(-0/+8Hrs), unbiased, post-program bake at 200oC (+2oC)*. The PROM does not need to be removed from the carrier.

Following this bake process, the temperature is decreased to 150oC (+2oC), the PROMs are loaded into the burn-in board, and the
Stimulus Controller is connected to the teflon ribbon cable on the burn-in board. Now the user will perform a 64 hour dynamic
burn-in with the stimulus applied to the burn-in board.

Finally, the user will remove the PROMs from the burn-in board, and verify full functionality with the DATA I/O programmer and
the PROM Board Tester.

Note: The burn-in board is only good up to 152oC maximum.

9
The Dynamic Burn-In Circuit:

The dynamic burn-in circuit is shown in Table 1 and Table 2. The circuit describes the bias to each pin of the UT28F64/LV and
UT28F256/LV PROM and the frequency that the stimulus is applied. Additionally, the power supply voltage (VDD) is set by the
Stimulus Controller at 7.0VDC +0/-0.2V, and the temperature for the burn-in process is described in the post-program conditioning
flow (Figure 2) as 150oC +2oC. The stimulus duty cycle is 50% +10% except for PE, and the dynamic frequency tolerance is +10%.
See Figures 3 and 4, for a description of the dynamic burn-in timing.

Table 1. UT28F64/LV Dynamic Burn-In Circuit

Pin Signal Name I/O Type Series Resistor Dynamic

1 NC Input 2.49K NC
2 A12 Input 2.49K 48.8Hz
3 A7 Input 2.49K 1.56KHz
4 A6 Input 2.49K 3.13KHz
5 A5 Input 2.49K 6.25KHz
6 A4 Input 2.49K 12.5KHz
7 A3 Input 2.49K 25KHz
8 A2 Input 2.49K 50KHz
9 A1 Input 2.49K 100KHz
10 A0 Input 2.49K 200KHz
11 DQ0 BiDirect 2.49K 6.1Hz
12 DQ1 BiDirect 2.49K 6.1Hz
13 DQ2 BiDirect 2.49K 6.1Hz
14 VSS Ground N/A Ground
15 DQ3 BiDirect 2.49K 6.1Hz
16 DQ4 BiDirect 2.49K 6.1Hz
17 DQ5 BiDirect 2.49K 6.1Hz
18 DQ6 BiDirect 2.49K 6.1Hz
19 DQ7 BiDirect 2.49K 6.1Hz
20 /CE Input 2.49K Ground
21 A10 Input 2.49K 195Hz
22 /OE Input 2.49K VDD
23 A11 Input 2.49K 97.7Hz
24 A9 Input 2.49K 391Hz
25 A8 Input 2.49K 781Hz
26 NC Input 2.49K NC
27 /PE Input 2.49K 400KHz
28 VDD Power N/A VDD

VDD = 7.0 + 0/- 0.2V

Temperature = 150 degrees Celsius
Time 64 hours -0/+8hrs
Duty Cycle 50% +/-10% except for /PE
Dynamic Frequency Tolerance = +/-10%

10
 Table 2. UT28F256/LV Dynamic Burn-In Circuit

Pin Signal Name I/O Type Series Resistor Dynamic

1 A14 Input 2.49K 12.2Hz
2 A12 Input 2.49K 48.8Hz
3 A7 Input 2.49K 1.56KHz
4 A6 Input 2.49K 3.13KHz
5 A5 Input 2.49K 6.25KHz
6 A4 Input 2.49K 12.5KHz
7 A3 Input 2.49K 25KHz
8 A2 Input 2.49K 50KHz
9 A1 Input 2.49K 100KHz
10 A0 Input 2.49K 200KHz
11 DQ0 BiDirect 2.49K 6.1Hz
12 DQ1 BiDirect 2.49K 6.1Hz
13 DQ2 BiDirect 2.49K 6.1Hz
14 VSS Ground N/A Ground
15 DQ3 BiDirect 2.49K 6.1Hz
16 DQ4 BiDirect 2.49K 6.1Hz
17 DQ5 BiDirect 2.49K 6.1Hz
18 DQ6 BiDirect 2.49K 6.1Hz
19 DQ7 BiDirect 2.49K 6.1Hz
20 /CE Input 2.49K Ground
21 A10 Input 2.49K 195Hz
22 /OE Input 2.49K VDD
23 A11 Input 2.49K 97.7Hz
24 A9 Input 2.49K 391Hz
25 A8 Input 2.49K 781Hz
26 A13 Input 2.49K 24.4Hz
27 /PE Input 2.49K 400KHz
28 VDD Power N/A VDD

VDD = 7.0 + 0/- 0.2V

Temperature = 150 degrees Celsius
Time 64 hours -0/+8hrs
Duty Cycle 50% +/-10% except for /PE
Dynamic Frequency Tolerance = +/-10%

11
 VDD

28
VDD
10 11
200KHz A0 D0
9 12
100KHz A1 D1
8 13
50KHz A2 D2
7 15
25KHz A3 D3
6 16 6.1Hz
12.5KHz A4 D4
5 17
6.25KHz A5 D5
4 18
3.13KHz A6 D6
3 19
1.56KHz A7 D7
25
781Hz A8
24
391Hz A9
21 20
195Hz A10 /CE
23 22
97.7Hz A11 /OE
2 27
48.8Hz A12 /PE 400KHz
26
24.4Hz A13
1
12.2Hz A14
VSS
14

VSS
Figure 2. UT28F64/LV and UT28F256/LV PROM BURN-IN CIRCUIT

Note: All resistors = 2.49K, Pins 1 and 26 are no connects for the UT28F64/LV

12
 VAMP = VIH
50% duty cycle, frequency as noted in
burn-in circuit

A(12:0) VIL
1 13
A(0) = 400KHz/2 , A(12)= 400KHz/2

tPERIOD
VAMP = VIH
50% duty cycle, frequency as noted in
burn-in circuit

DQ(7:0) VIL
16
DQ(7:0)= 400KHz/2

tPERIOD
VIH = VDD - 1.0V to VDD - 0.2V
VIL = 0 +/- 0.5V

t2 =156ns
VAMP = VIH

VIL
PE

Figure 3. UT28F64/LV Dynamic Burn-In Timing

13
 VAMP = VIH

A(14:0) VIL 50% duty cycle, frequency as noted in burn-in circuit

1 15
A(0) = 400KHz/2 , A(14)= 400KHz/2
tPERIOD
VAMP = VIH

DQ(7:0) VIL 50% duty cycle, frequency as noted in burn-in circuit

16
DQ(7:0)= 400KHz/2

tPERIOD
VIH = VDD - 1.0V to VDD - 0.2V
VIL = 0 +/- 0.5V

t2 =156ns
VAMP = VIH

VIL
PE

t1 =1092ns t3 =1252ns

tPERIOD= 2500ns

t0

Figure 4. UT28F256/LV Dynamic Burn-In Timing

14
 APPENDIX 3

PROM BOARD USER GUIDE

INTRODUCTION

The PROM Board Tester is used to verify all antifuses are programmed reliably after the PROM has been through Post-Program-
ming Conditioning.

The PROM data is read into the SRAM at 1.5mS for the initial capture of the PROM contents. CE and OE are held active during
this read. The PROM is then read in again at 25ns. During this read, CE and OE switch during each read cycle. This is a worst case
read condition for this part. The contents of the SRAM are compared for the low speed read and the high speed read. If there are
any differences they will be displayed with address location and data for that location. The user can then step through any addi-
tional failures.

TEST PROCEDURE

1. Turn on main power switch, S1.

2. Hit Reset, S4.

3. Parts must be tested at 4.5V and 5.5V. (Note: PROM test voltage is determined by power supply voltage supplied to the board.
UT28F64LV and UT28F256LV PROMs must be tested at 4.5V and 5.5V. The parts will not be damaged by the higher VDD).

4. Place part in socket (Address lines are in tristate mode on FPGA).

5. Turn on PROM Power switch, S2.

6. Hit Reset, S4.

7. Hit Start, S3.

8. If Error Count is 0, complete light will come on.

9. If Error Count is greater than 0, hit Step button, S5, to review all errors.

10. Complete light, D1, will come on when all errors have been reviewed.

11. Turn off Prom Power, S2, and go to step 4.

15
16
 PROM PROGRAMMING KITS - ORDER INFORMATION

Listed below are the part numbers to order the PROM Programming Kits for the
UT28F256, UT28F256LV, UT28F64, AND UT28F64LV PROMs

RH00VK Flat Pack Post Programming Conditioning Kit

Verification Card
4.5 foot cable
Stimulus Card
1/2 Size FP B/I Board
Instruction Manual

RH01VK DIP Post Programming Conditioning Kit

Verification Card
4.5 foot cable
Stimulus Card
1/2 Size DIP B/I Board
Instruction Manual

Listed below are the part numbers to order additional burn-in boards

RH00DPBB DIP Burn-in Board

1/2 size burn-in board is 13.50" by 11.45" and contains approximately 18 DIP sockets.
Instruction Manual

RH00FPBB Flat Pack Burn-in Board

1/2 size burn-in board is 13.50" by 11.45" and contains approximately 12 flat pack sockets.
Instruction Manual

Listed below are the part numbers to order Cards and Cable

RH00SC Stimulus Card

Burn-in board stimulus card, operates on a single DC supply voltage of 12VDC.
Instruction Manual

RH00VB Verification Card

Verification card, operates on a single DC supply voltage
Instruction Manual

RH00CB Cable
4.5 foot teflon ribbon cable
Instruction Manual

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