High Speed PCB Design
Ride the Wave Workshop
Post Route Analysis of a High Speed PCB Design Design/Analysis for Power Delivery System (PDS)
Post Route Analysis of a High Speed PCB Design
Designing for the Future
In todays world, the demand for ultra-high-speed PCB design is on the rise Engineers are assigned the task of design mixed analog and fast rise-time digital boards, and have all signals arrive at their destination cleanly With the advance of highly specialized design and layout software, the design of these boards has become increasingly easy (automated) These physical design and layout tools can be provided with design constraints and auto-routed easily, resulting in increased productivity of the layout engineer and contributions to signal integrity problems
Designing for the Future
The advancement of design and layout software needs to be matched by the accompanying advancement in powerful ANALYSIS tools used to solve timing delays, mismatched line impedances, crosstalk, and dielectric loss on high speed lines Just as an auto-layout program cannot layout 100 percent of the nets on a complex, high-speed board, an analysis tool cannot default to 2dimensional field solvers and behavioral models on 100 percent of the nets on a PCB. Many nets on a board may be analyzed accurately using 2-d solvers. However, critical signals will require a full 3-d solver that does not default to an ideal case for the current return path. The full 3-d solver will take into account ground planes with holes, cutouts or that are split. Changes in reference planes, cutouts, and coupling to power/ground planes are other situations that require a full 3-d solver
Goals for this Presentation
Show the integration between Allegro and PCB/MCM Show mixed 2D and 3D extractions Show single net and multiple net simulations Show how to investigate signal integrity issues caused by meandering traces used for timing delays Show Crosstalk simulations on a victim net in the design Show how to setup up differential pair simulations Show comparison between full 3D PEEC solutions and mixed 2D/3D subcircuits
INTEGRATION
Automatic Translation
Net Name MAA4
2D Cross-section of every net in board
3D Via parasitics calculated for every via in board
3D Via Parasitics
A 3D model is used to calculate all via parasitics.
Single Net-by-Net Simulations
Risetime of 500 ps. Source Near End Far End
Single Net-by-Net Signal Integrity Violations
Quickly screen information for every net on the board for violations such as Propagation Delay and Settling times
Single Net-by-Net Simulations
Risetime of 200 ps. Source Near End Far End
Single Net-by-Net Simulations
Risetime of 200 ps. with coupling Source Near End Far End
Coupled traces
Crosstalk Simulation The Setup
Aggressor Nets MAA4, MAA5 Victim Net MAB9 Aggressor Nets MAA9, MAB10
Crosstalk Simulation The Setup
Create 2D cross-sections of single line and mutual parasitics for all 5 nets
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Apply 3.3V pulse to one terminal of MAA4, MAA5, MAA9 and MAB10, and put 75 ohm terminators on the other terminals
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Terminate net MAB9 with 75 ohm terminators at each end
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The above 3 steps are done by the program automatically. First run simulation with 0.5 ns rise/fall time, then run again with 0.2 ns rise/fall time
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Crosstalk Simulations
Risetime of 500 ps.
Near End Far End
Crosstalk Simulations
Risetime of 200 ps.
Near End Far End
MD32
Differential Pair
MD33
Differential Signaling with Linear Source
Near End First Via Second Via Risetime of 200 ps. Source
When to Analyze in 3D?
Vcc Plane Top View Bottom View
GND Plane
Split/partial Plane Via Coupling Change in Reference Plane Ground Discontinuity Correctly Model Return Path Power/ground Bounce
Comparison of Mixed 2D/3D with IBIS Driver/Receiver
IBIS Driver
IBIS Receiver
Mixed 2D/3D Parasitic Extraction
+ IBIS Receiver
IBIS Driver
PEEC Parasitic Extraction
+ -
IBIS Driver/Receiver with Mixed 2D/3D model
Source
Near End First Via Second Via
IBIS Driver/Receiver with 3D model
Source
Near End First Via Second Via
IBIS Waveforms
3D Model
Volts
t (seconds)
What did we learn?
How PCB/MCM is tightly integrated with Allegro How automatically mixed 2D and 3D extractions are performed How single net and multiple net simulations are performed How Crosstalk simulations on a victim net can be seen How differential signaling can be performed How the 3D PEEC model compared with the mixed 2D/3D simulations using an IBIS model
Design/Analysis for Power Delivery System (PDS)
The Impedance of PDS
I High-Speed Digital Device
Mag. of Z
Power V V Z= I Delivery System
Z target
|Z|
f
The Impedance see into PDS at the device should keep low from DC to several harmonics of clock frequency!
Target Impedance Calculation
Z Target
(Power Supply Voltage ) ( Allowed Ripple ) =
Current
Hardware Example
4A 3.3v"1.8v " Converter 2A
1.8v small plane
Z Target(1.8v) =
(1.8v ) (5% ) = 45m
2A
3.3v VRM
2A
3.3v plane
Z Target(3.3v) =
(3.3v ) (5% ) = 82.5m
2A
PDS Components
Voltage Regulator Module (VRM)
Linear model for VRM.
R0: the value of the resistor between the VRM sense point and the actual load and is usually only a few mOhms L_out: the output inductance of the VRM R_flat: the ESR of the capacitor associated with the VRM Ideal voltage source has the value of the power supply voltage L_slew is chosen so that current will be ramped up in the linear model in about the same time that it is ramped up in a real VRM.
Voltage Regulator Module (VRM)
R0 = 1mohm L_out = 4nH R_flat = 30mohm L_slew = 67.5nH
Linear model for VRM.
V = L*di/dt ! For a VRM to ramp this 20 A transient current either up or down in 15 us L _ slew = V = 0.05 1.8 V 15 sec = 67.5 nH
!
di dt
20 A
Simulation for VRM
Simulation for VRM (contd)
Bulk Capacitor
I = C*dv/dt Suppose there is a 20 A current transient, the VRM responds in 15us, and the PDS must remain within 5% of a 1.8V power supply
C = I = 20 A 15 sec = 3333 uF 1.8 V 0.05 dV dt
Simulation for VRM + Bulk Cap
Simulation for VRM + Bulk Cap (contd)
ESR of the Bulk Cap = 1 ESR of the Bulk Cap = 0.1 ESR of the Bulk Cap = 0.01 ESR of the Bulk Cap = 0.001
ESR of the Bulk Cap = 1 ESR of the Bulk Cap = 0.1 ESR of the Bulk Cap = 0.01 ESR of the Bulk Cap = 0.001
Simulation Impedance using Serenade Tune Mode
High Frequency Ceramic Capacitor
NPO capacitors have the lowest ESR and best temperature and voltage properties, but are only available up to a few nF. X7R capacitors have reasonable voltage and temperature coefficients and are available from several nF to several uF. X5R is similar to X7R, but with reduced reliability and are being extended to 100uF. Y5V dielectric is used to achieve high capacitance values, but has very poor voltage and temperature characteristics.
High Frequency Capacitor
Cap 1 10 nF 100 mohm 5 nH Cap 2 1 nF 100 mohm 5 nH Cap 3 1 nF 100 mohm 0. 5 nH
High Frequency Capacitor
Cap1 10nF 100m Ohm 5nH Cap2 10nF 100m Ohm 2nH Cap3 10nF 100m Ohm 0.5nH
Reducing the Parasitic Inductance for HF Cap
1. Reduce the length of via for decoupling capacitors (i.e.reduce the loop inductance) 2. Change the layout of decoupling capacitors 3. The thickness of high frequency capacitors 4. Parallel the decoupling capacitors with same value or multiple skew values (1) (2)
(3)
Simulation for Impedance of Parallel Capacitors
Both ESR and Inductance improved performance, but part count increased
Simulation for Impedance of Parallel Capacitors with Skewed Capacitance
Simulation for VRM+Bulk_cap+HF_cap
VRM Bulk capacitor HF capacitor
Simulation for VRM+Bulk_cap+HF_cap
(contd)
Z Target(3.3v) = 82.5m
Z Target(1.8v) = 45m
Plane Modeling
/10
/4
Problem Scale
SpiceLink (Quasi-Static/TEM)
TPA/PCB/MCM (PEEC) HFSS (Full-Wave)
frequency
DC
3D Distributed
PEEC
FULL WAVE
HFSS+Full Wave Spice SI_wave
Physical Design Using Full Wave Spice Model from HFSS
12 Layers PCB
S1 AGND S2 S3 AVCC_3.3v S4 S5 DVCC_3.3v S6 S7 DGND S8
(1,5)
V V
(7,5) (5,4)
22mA Current Sink 2*1nF
(6,4)
33mA Current 11*0.1uF Sink
21*10nF
(4,3) V
2A Current 21*1nF Sink
21*0.1uF 100uF 2.7uF 0.1uF 10nF 1nF
(1,1)
(7,1)
Plane Impedance w/ & w/o De-cap
Decoupling capacitors added
Voltage Transient w/ & w/o De-cap
0.2ns
0.2ns
Simulation for Extra AGND Plane Inserted
S1 AGND S2 S3
AGND
(1,5)
V V
(7,5) (5,4)
22mA Current Sink 2*1nF
AVCC_3.3v S4 S5 DVCC_3.3v S6 S7 DGND S8
(6,4)
33mA Current 11*0.1uF Sink
21*10nF
(4,3) V
2A Current 21*1nF Sink
21*0.1uF 100uF 2.7uF 0.1uF 10nF 1nF
(1,1)
(7,1)
Plane Impedance with Extra AGND Plane Inserted
After extra plane inserted
Voltage w/ & w/o Extra AGND Plane Inserted
After extra plane inserted
De-cap Enhancement for HF Range
Enhanced de-cap: 100nF*2, 50nF*2 25nF*2, 10nF*2 2.5nF*2, 1nF*10 100pF*2 are in parallel!!
Plane Impedance w/ & w/o Enhanced De-cap
With Enhanced De-cap
Voltage Transient w/ & w/o Enhanced De-cap
With Enhanced De-cap
0.2ns
0.2ns
Impedance Simulation using PEEC
Summary
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Impedance control from DC to GHz:
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Voltage Regulator Module (VRM) Bulk Capacitor High Frequency Ceramic Capacitor PCB Planes Schematic Capture Serenade HFSS PCB/MCM
Tools used for simulation:
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