Sound Processors for BOOM BOX / Mini-component Stereo

Sound Processors
with Built-in 2-band Equalizers
BD3870FS,BD3871FS,BD3872FS,BD3873FS No.10086EAT02

●Description
The Sound Pr ocessor with built-in 2 Band Equalizer, incorporates functions required for BOOM BOX and mi ni-component
systems, such as input se lector, input gai n amp, vol ume, surroun d, tone (b ass, treble), an d lo ud speaker e qualizer
(BD3872FS only). These functions can be controlled through the two-wire serial control.

●Features
1) Using external components, center frequencies and Q factors of the bass characteristics are flexible.
2) Providing a mute switch onto one of the input pins allows cross-talk suppression.
3) A surround function can be constructed without external components.
4) Energy-saving design resulting in low current consumption, by utilizing the BiCMOS process

●Applications
BOOM BOX, mini-audio systems, and micro-audio systems.

●Line up matrix
Parameter BD3870FS BD38 71FS BD38 73FS BD3872FS
0, 5, 10, 19, 21,
Input Gain 0, 6, 12, 18dB 24, 26, 28dB 18, 21, 24, 27dB
23, 26, 28dB
Loud Speaker Equalizer (SEQ) No No No Yes

Input Selector Three inputs Three inputs Three inputs Five inputs
0 to -87dB/ 0 to -87dB/ 0 to –87dB/ 0 to -87dB/
Volume
1dB step, -dB 1dB step, -dB 1dB step, -dB 1dB step, -dB
2 band 2 band 2 band 2 band
Equalizer
(Bass, Treble) (Bass, Treble) (Bass, Treble) (Bass, Treble)
Surround Yes Yes Yes Yes

Serial Control Two-wire serial Two-wire serial Two-wire serial Two-wire serial

Package SSOP-A24 SSOP-A24 SSOP-A24 SSOP-A32

●Absolute maximum ratings (Ta=25℃)

Ratings
Prameter S ymbol Unit
BD3870FS BD3871FS BD3873FS BD3872FS
Power Supply Voltage Vcc 10 10 10 10 V
Power Dissipation Pd 800 *1 800 *1 800 *1 950 *2 mW
Operating Temperature Range Topr -25 to +75 -25 to +75 -25 to +75 -25 to +75 ℃
Storage Temperature Range Tstg -55 to +125 -55 to +125 -55 to +125 -55 to +125 ℃
*1 Reduced by 8.0 mW/℃ at 25℃ or higher, when installed on the standard board (Size: 70×70×1.6mm).
*2 Reduced by 9.5 mW/℃ at 25℃ or higher, when installed on the standard board (Size: 70×70×1.6mm).

●Operating voltage range

Ratings
Prameter S ymbol Unit
BD3870FS BD3871FS BD3873FS BD3872FS
Operating Voltage Range Vcc 4.5 to 9.5 4.5 to 9.5 4.5 to 9.5 4.5 to 9.5 V
*It must function normally at Ta=25℃.

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

●Electrical characteristics
(Ta=25 ℃ , VCC= 8V, f= 1kHz, V i=200mVrms, RL= 10kΩ, Rg= 600Ω, Input Gain= 0dB (BD387 0FS, BD3872F S onl y),
Input Gain= 24dB (BD38 71FS onl y), Input Gain= 18dB (BD3873F S onl y),Volume=0dB, Bass=0dB, T reble=0dB,
Surround=OFF, Loud Speaker Equalizer=OFF (BD3872FS only), unless otherwise noted)
Limits
Block

Parameter S ymbol Unit Con dition

Min. Typ. Max.

Circuit Current IQ - 8 21 mA At no signal

BD3870FS, BD3872FS
-2 0 2
Gv=20log(VOUT/VIN)
BD3871FS
Total Output Voltage Gain Gv 22 24 26 dB
Gv=20log(VOUT/VIN)
BD3873FS
16 18 20
Gv=20log(VOUT/VIN)
Total Harmonic Distortion ratio THD - 0.01 0.1 % BW=400 to 30kHz
THD=1%
Maximum Output Voltage Vom 1.6 2.1 - Vrms
BW=400 to 30kHz
BD3870FS, BD3872FS
- 4.5 15
Total

Rg=0Ω, BW=IHF-A
Total Output Noise Voltage Vno µVrms
BD3871FS, BD3873FS
- 40 80
Rg=0Ω, BW=IHF-A
Rg=0Ω, BW=IHF-A
Total Residual Noise Voltage Vmno - 4.5 15 µVrms
Volume=-dB
Rg=0Ω, BW=IHF-A
Cross-talk between Channels CTC - -80 -70 dB
VOUT=1Vrms
Cross-talk between Selectors CTS - -80 -70 dB Rg=0Ω, BW=IHF-A

35 50 65 BD3870FS, BD3871FS, BD3873FS

Input Impedance Rin kΩ
70 100 130 BD3872FS

Output Impedance Rout - - 50 Ω

Volume Control Range VRI -90 -87 -84 dB VR=20log(VOUT/VIN)

Volume

Maximum Volume Attenuation Vmin - - -90 dB BW=IHF-A

Volume Input Impedance Rvin 39 56 73 kΩ

Bass Boost Gain GBB 12 14 16 dB GB=20log(VOUT/VIN)

Bass

Bass Cut Gain GBC -16 -14 -12 dB GB=20log(VOUT/VIN)

Bass Step Resolution BR - 2 - dB

10 12 14 BD3870FS, BD3871FS, BD3873FS

Treble Boost Gain GTB dB
12 14 16 BD3872FS
Treble

-14 -12 -10 BD3870FS, BD3871FS, BD3873FS

Treble Cut Gain GTC dB
-16 -14 -12 BD3872FS

Treble Step Resolution TR - 2 - dB

Surround In-phase Gain Vsur1 -2 0 2 dB 2ch in-phase inputs

Surround

Surround Single-phase Gain Vsur2 4.3 6.3 8.3 dB 1ch input, 1ch grounded

Surround Opposite-phase Gain Vsur3 8 10 12 dB 2ch opposite-phase inputs

Loud Speaker Equalizer Gain
SEQ

Seq 357 dB f=10kHz

(BD3872FS only)
* For measurement, VP-9690A (Average value wave detection, Effective value display) IHF-A filter by Matsushita Communication Industrial is used.
* Phase relation between Input/Output signal terminals is the same.
* Note: This IC is not designed to be radiation-resistant.

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

●Timing chart

1) Signal Timing Conditions

・Data is read on the rising edge of the clock.
・Latch is read out on the falling edge of the clock.
・Latch signal must end with the LOW state.
・To avoid malfunctions, clock and data signals must terminate with the LOW state.
1byte=10bit

90% 90% 90% 90%

SC tsu twc twc
(CLOCK)

10% 10% 10%

thd ts t th tsd thd s1 th1

SI
90% 90% 90% 90% 90%
DATA twd twh tw1
LATCH
DATA DA 10% TA LATCH
10% 10%

End with Low

Fig.1

Limits
Parameter S ymbol Unit
Min. T yp. Max.

Minimum Clock Width Twc 2.0 - - µs

Minimum Data Width twd 2.0 - - µs

Minimum Latch Width Tw1 2.0 - - µs

Data Set-up Time (DATACLK) Tsd 1.0 - - µs

Data Hold Time (CLKDATA) Thd 1.0 - - µs

Latch Set-up Time (CLKLATCH) Ts1 1.0 - - µs

Latch Hold Time (DATALATCH) Th1 1.0 - - µs

Latch Low Set-up Time Ts 1.0 - - µs

Latch Low Hold Width Twh 2.0 - - µs

2) Voltage Conditions for Control Signals

Limits
Parameter Max. Unit Con dition
Min. T yp.
(≦Vcc)
“H” Input Voltage 2.2 - 5.5 V Vcc=4.5 to 9.5V

“L” Input Voltage 0 - 1.0 V Vcc=4.5 to 9.5V

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

3) Control Data Format List

Basic Configuration of Control Data Format
 Data input direction
MSB LSB
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Select
Data
Address

Control Data Format (BD3870FS, BD3871FS, BD3873FS)

 Data input direction
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

(1) Input Selector Input Gain Surround * * * 0 0

(2) V olume A Volume B * 0 1

(3) Bass Gain Treble Gain 1 0

(4) * ** *** * * 1 1

Control Data Format (BD3872FS)

 Data input direction
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

(1) Input Gain Input Selector * * 0 0

(2) V olume A Volume B * 0 1

(3) Bass Gain Treble Gain 1 0

(4) * * * * * * Surround SEQ 1 1

・”*” indicates 0 or 1.
・By ch anging the settin g of Select Ad dress, three or four dif ferent control forma ts (BD3871F S, BD387 2FS,
BD3873FS, plus BD3872FS) are selectable.
・In every power-on sequence, all of the address data must be initialized.
Example:
←Input direction
MSB LSB MSB LSB MSB LSB MSB LSB

Data(1) L Data(2) L Data(3) L Data(4) L

“L” indicates a latch.

・After power-on, for the second and subsequent times, only the necessary data can be selected for setting.

Example: When changing the volume,

←Input direction
MSB LSB

Data(2) L
“L” indicates a latch.

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

●Block diagram, application circuit, pin assignment (BD3870FS, BD3871FS, BD3873FS)

5.6k 5.6k DATA

OUT1 OUT2 VCC LATCH CLOCK
0.1μ 0.1μ 0.1μ 0.1μ

0.33μ 0.0022μ 0.0022μ 10μ 10μ

390k 390k
24 23 22 21 20 19 18 17 16 15 14 13

Logic
Treble1 Treble２ Bass2 Bass1
fc=8k Hz fc=8kHz
f0 =80Hz f0=80Hz
Surround

Vcc/2 Vcc/2

0dB
～
-87dB
-∞ Vcc/2

Vcc/2 V cc/2

50k 50k 50k 50k 50k 50k

1 2 3 4 5 6 7 8 9 10 11 12

47μ
10μ 10μ 10μ 10μ 10μ 10μ
10μ
4.7k 4.7k
A1 A2 B1 B2
10μ
C1 C2

Unit: Resistance =Ω, Capacitor = F

Fig.2

●Pin description (BD3870FS, BD3871FS, BD3873FS)

Pin No. Pin Name Description Pin No. Pin Name Description

1 VIN1 1ch volume input pin 13 SC Serial clock input pin

2 VIN2 2ch volume input pin 14 SI Serial data input pin

3 SEL2 2ch input selector output pin 15 VCC Power supply pin

4 SEL1 1ch input selector output pin 16 OUT2 2ch output pin

5 A1 1ch input pin A 17 OUT1 1ch output pin

6 A2 2ch input pin A 18 BOUT1 1ch bass filter setting pin

7 B1 1ch input pin B 19 BNF1 1ch bass filter setting pin

8 B2 2ch input pin B 20 BOUT2 2ch bass filter setting pin

9 C1 1ch input pin C 21 BNF2 2ch bass filter setting pin

10 C2 2ch input pin C 22 TNF2 2ch treble filter setting pin

11 FILTER 1/2 VCC pin 23 TNF1 1ch treble filter setting pin
Time constant setting pin for absorbing
12 GND Ground pin 24 CAP
surround switching shock sound

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

●Block diagram, application circuit, pin assignment (BD3872FS)

OUT1 OUT2 Vcc DATA CLOCK

LATCH

0.0022μ 0.0022μ 5.6K 5.6K

0.001μ 0.001μ
0.022μ 62K 0.1μ 0. 1μ 0.1μ 0.1μ
4.7μ 4.7μ 0.33μ

+ +
Vcc/2 Vcc/2
390K 390K
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

Loud Loud speaker Logic

Treble1 Treble2 Bass1 Bass2
speaker equalizer2 fc=10kHz fc=10kHz f 0=80Hz f0 =80Hz
Surround

Vcc/2 Vcc/2

Vcc/2

0dB 0dB
～ ～
-87dB -87dB
-∞ -∞

Vcc/2 Vcc/2
100k 1 00k 100k 100k 100k 100k 100k 100k 100k 100k

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

+
0.1μ 0.1μ 0.1μ 0.1μ 0.1μ 0.1μ 0.1μ 0.1μ 0.1μ 0.1μ
0.22μ 0.22μ 10μ
4.7k 4.7k

A1 A2 B1 B2 C1 C2 D1 D2 E1 E2

Unit: Resistance =Ω, Capacitor = F

Fig.3 Application to Cinema Surround

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

OUT1 OUT2 Vcc DATA CLOCK

LATCH
0.33μ 0.01μ 0.33μ 0.01μ 0.0022μ 0.0022μ 5.6K 5.6K
0.1μ 0.1μ 0.1μ 0.1μ
4.7μ 4.7μ 0.33μ

+ +
390K 390K
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

Loud speaker Loud speaker Logic

equalizer1 Treble1 Treble２ Bass1 Bass2
equalizer2 fc=10kHz fc=10kHz f0 =80Hz f0 =80Hz
Surround

Vcc/2 Vcc/2

Vcc/2

0dB 0dB
～ ～
-87dB -87dB
-∞ -∞

Vcc/2 Vcc/2
100k 1 00k 100k 100k 100k 100k 100k 100k 100k 100k

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

+
0.1μ 0.1μ 0.1μ 0.1μ 0.1μ 0.1μ 0.1μ 0.1μ 0.1μ 0.1μ
0.22μ 0.22μ 10μ
4.7k 4.7k

A1 A2 B1 B2 C1 C2 D1 D2 E1 E2

Unit: Resistance =Ω, Capacitor = F

Fig.4 Application to Loud Speaker Equalizer

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

●Pin description (BD3872FS)

Pin No. Pin Name Description Pin No. Pin Name Description

1 VIN1 1ch volume input pin 17 SC Serial clock input pin

2 SEL1 1ch input selector output pin 18 SI Serial data input pin

3 VIN2 2ch volume input pin 19 VCC Power supply pin

Time constant setting pin for absorbing
4 SEL2 2ch input selector output pin 20 CAP
switching shock sound
5 A1 1ch input pin A 21 OUT2 2ch output pin

6 A2 2ch input pin A 22 OUT1 1ch output pin

7 B1 1ch input pin B 23 BOUT2 2ch bass filter setting pin

8 B2 2ch input pin B 24 BNF2 2ch bass filter setting pin

9 C1 1ch input pin C 25 BOUT1 1ch bass filter setting pin

10 C2 2ch input pin C 26 BNF1 1ch bass filter setting pin

11 D1 1ch input pin D 27 TNF2 2ch treble filter setting pin

12 D2 2ch input pin D 28 TNF1 1ch treble filter setting pin

13 E1 1ch input pin E 29 SOUT2 2ch cinema surround or SEQ setting pin

14 E2 2ch input pin E 30 SQI2 2ch cinema surround or SEQ setting pin

15 FILTER 1/2 VCC pin 31 SOUT1 1ch cinema surround or SEQ setting pin

16 GND Ground pin 32 SQI1 1ch cinema surround or SEQ setting pin

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

●Description of operations
1) Bass filter
Using external components, center frequencies and Q factors of the bass characteristics are flexible
1
f0  (Hz)
R1R2R3  R4  C1C2
2π
IN + R2  R3  R4
-

R3 R4 R1R2R4C1C2

R2  R3  R4
Q
R1C1  C2 
R2
C1 C2 R2 R3  R4  C2
 1
R1 R1R2  R3  R4  C1
G(boost)  20log (dB)
R2R3 C2
 1
R1R2  R3  R4  C1
Fig.5 R2R3 C2
 1
R1R2  R3  R4  C1
Gٛcut ٛ 20log ٛ(dB)
R2(R3  R4 ٛ C2
 1
R1R2  R3  R4  C1

Standard values of R3, R4 (reference) G

(R1=5.6kΩ, R2=390kΩ, C1=C2=0.1µF)
Resistance (kΩ) * Typ.
Bass Boost Cut Amount
R3 R4
0dB 77.64 0
G
2dB 58.90 18.73
4dB 44.02 33.60
6dB 32.20 45.42 f
8dB 22.82 54.80 F0
10dB 15.36 62.26
12dB 9.44 68.18 G
14dB 4.78 72.84
* The actual boost cut amount may deviate from the standard values in some degree.

Fig.6

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

2) Treble filter
IN + OUT 1
fc = (Hz)
-
2πR2C
R1+R2+Zc
G (boost) = 20log (dB)
R2+Zc
R1
R2 R2+Zc
G (cut) = 20log ( dB)
R1+R2+Zc
1
Zc = (Ω)
jωc
C

Fig.7
G
Standard values of R1, R2 (reference)
Resistance (kΩ) * Typ.
Treble Boost Cut Amount 3dB
R1 R2
0dB 0 36.28 G
2dB 7.46 28.82
4dB 13.39 22.89 f
fc
6dB 18.10 18.18
8dB 21.84 14.44
G
10dB 24.81 11.47
12dB 27.20 9.08 3dB
14dB (BD3872FS only) 29.04 7.24
* The actual boost cut amount may deviate from the standard values in some degree.
Fig.8

3) Matrix surround
IN1 OUT1
+
L +
+
(4.14L/2 - 2.14R/2)

×1 /2
× 2.14
+
+ -

× 1/2
(4.14R/2 - 2.14L/2)
-
R +
+
OUT2
IN2 Fig.9

Matrix surround is constructed as shown above. Gains are defined as follows:

In-phase Gain: Gains obt ained on OUT 1 and OUT 2 again st IN1 when i nputting a sig nal of the eq uivalent level a nd
in-phase (L=R) to IN1 and IN2.
OUT1 OUT2  4.14 2.14 
  L L L 1 20log1 0 (dB)
IN1 IN2  2 2 
Single-phase Gain: Gains obtained on OUT1 and OUT2 against IN1 when inputting a signal to IN1 and AC-grounding IN2
(R=0).
OUT1 4.14
 L L  2,07 20log2.07 6.3 (dB)
IN1 2
OUT2 2.14 20log 1.07  0.59 (dB)
 L L   1.07
IN1 2
Opposite-phase Gain: Gains obtained on OUT1 and OUT2 against IN1 when inputting signals of the equivalent level and
opposite-phase (L-R) to IN1 and IN2.
OUT1 OUT2  4.14 2.14  20log3.14 10 (dB)
   L L  L  3.14
IN1 IN2  2 2 

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

1) Sound generation using Loud Speaker Equalizer (BD3872FS)

Using external components, one of the foll owing t wo func tions can be e stablished; one having an ef fect to localize the
vocal for ward and enhance it (Lou d Speaker Equa lizer) and t he oth er h aving an ef fect to clarif y the v ocal quality a nd
improve the Articulation Index (Cinema Surround). Those characteristic values can be adjusted by choosing the external
components with desirable constants. Details of above two functions are described below:

◎Cinema Surround
Constructing t he e xternal c omponents as sho wn b elow all ows the v ocals to be m oved for ward and enhanced.
Surround effect with enhanced vocal is achieved by turning on the built-in surround simultaneously.
Merging this ef fect, while pla ying movi es on a DVD pla yer, will make vocal liste ning clearer and s urround ef fect
more impactful.

32 31 30 29

Loud speaker Loud speaker

equalizer1 equalizer2

Fig.10
◎Loud Speaker Equalizer (SEQ)
BOOM BOX and Micro-sound systems are often restricted to using small-diameter speakers because of location space.
These speaker s, where the v ocal ra nge are attenuate d, ma y give a n im pression of ha ving a muf fled vocal sou nd
with res pect to its audi bility. Using t he L oud Speaker E qualizer, the vo cal q uality which de grades i n small-d iameter
speakers, can be improved and the Articulation Index is also increased.

IN OUT
Phase Shifter HPF

SEQ (30, 32pin) SOUT (29. 31pin)

C1 C2

Fig.11
・C1 can be selected to determine the frequency where the phase should be inverted.
C1 Frequency where the phase is inverted
Larger value Set to the lower frequency side
Smaller value Set to the higher frequency side

・C2 can be selected to determine the HPF cut-off frequency fc. The SEQ gain remains constant.

1
fc = ( Hz)
RC
GAIN

(Where R is a built-in resistance of 10kΩ)

G=5dB
(Constant)
3dB

Fc FREQUENCY

Fig.12

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

●Reference data

10 10 10

OUTPUT VOLTAGE (Vrms)

8
1 1

THD+N (%)
ICC (mA)

6
0.1 0.1

0.01 0.01
2

0 0.001 0.001
024 68 10 0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10

VCC (V) INPUT VOLTAGE (Vrms) INPUT VOLTAGE (Vrms)

Fig.13 Circuit Current - Power Supply Fig.14 Output Voltage - Input Voltage Fig.15 Total Harmonic Distortion
Voltage (BD3870FS) ratio - Input Voltage (BD3870FS)

20 30 15
At 18dB setting At 24dB setting +14dB
25 10
18

20 5 -14～+14dB
GAIN (dB)
GAIN (dB)

GAIN (dB)
16
2dB step
15 0
14
10 -5

12
5 -10
-14dB
10 0 -15
10 100 1000 10000 100000 10 100 1000 10000 100000 10 100 1000 10000 100000
FREQUENCY (Hz) FREQUENCY (Hz) FREQUENCY (Hz)

Fig.16 Current Gain - Frequency Fig.17 Voltage Gain - Frequency Fig.18 Bass Gain - Frequency
(BD3870FS, BD3873FS) (BD3871FS)

15 15 20
+12dB +14dB
10 10
15
-12～+12dB -14～+14dB
5 5 At oppoite-phase input
GAIN (dB)

2dB step
GAIN (dB)

GAIN (dB)

2dB step
0 0 10

-5 -5
5
-10 -10

-12dB -14dB 0
-15 -15
10 100 1000 10000 100000 10 100 1000 10000 100000 10 100 1000 10000 100000

FREQUENCY (Hz) FREQUENCY (Hz) FREQUENCY (Hz)

Fig.19 Treble Gain - Frequency Fig.20 Treble Gain - Frequency Fig.21 Surround Gain - Frequency
(BD3870FS,BD3871FS,BD3873FS) (BD3872FS)

10

8
GAIN (dB)

0
10 100 1000 10000 100000

FREQUENCY (Hz)

Fig. 22 Treble Gain - Frequency

(BD3872FS)

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

●Notes for use

1) Numbers and data in entries are representative design values and are not guaranteed values of the items.
2) Although ROHM is confide nt that the examp le application circuit reflects the best poss ible recommendations, be sure t o
verify circuit characteristics for your particular application. Modification of constants for other externally connected circuits
may cause variations in both static and transient characteristics for external components as well as this Rohm IC. Allow for
sufficient margins when determining circuit constants.
3) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings, such as the applied voltage or operating temperature range (Topr),
may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure, such as a fuse, should be implemented when using the IC at times
where the absolute maximum ratings may be exceeded.
4) GND potential
Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at
any time, regardless of whether it is a transient signal or not.
5) T hermal design
Perform thermal des ign, in which there are adequate margins, by taking into account the permissi ble dissipation (Pd) in
actual states of use.
6) Short circuit between terminals and erroneous mounting
Pay attention to the assembly direction of th e ICs. Wrong mounting direction or shorts between terminals, GND, or other
components on the circuits, can damage the IC.
7) Operation in strong electromagnetic field
Using the ICs in a strong electromagnetic field can cause operation malfunction.
8) Po wer-ON RESET
A built-in circuit for performing initialization inside the IC at power-ON is provided. In unstable systems it is recommended
that the data shall be sent to all the addresses during power-ON, until this operatio n cycle is completed. Mute should b e
applied during this cycle.

Function Initial Condition

Input Selector Input A
Input Gain 0dB
Loud Speaker Equalizer (BD3872FS only) OFF
Volume -dB
Surround OFF
Treble Gain 0dB
Bass Gain 0dB

9) 2-wire serial control

For the C L a nd DA termin als, the p atterned and other wirings sh ould b e routed as n ot to cause interference with th e
analog-signal-related lines.
10) Switching between functions
Shock sound is absorbed when switching between the volume, bass, and treble functions.
11) Input coupling capacitor
As described in the figure below, low frequency characteristics are determined depending on the external capacitor value
for input coupling, and the input impedance value inside the IC.

G
C

0
R A (f)

f
2
(2πfCR)
A(f) =
1+(2πfCR)2

Fig.23 Fig.24

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

12) S witching noise

For Surround and Loud Speaker Equalizer (BD3872FS only), external capacitor C is attached to the CAP pin as a measures
to control the switching noise. In the application circuit, a constant value as an example, is indicated by the CAP pin.
The time constant, which is used to charge/discharge the external capacitor C (varying between Vbe to 5Vbe (2.65V)) on
the CAP pin, controls the soft switching operation. The switching time constant T is stated as T=2.55×105×C.
Vbe has a temperature characteristic and may affect the time constant T.
13) Input Selector and Input Gain
When setting/changing Input Selector or Input Gain, the soft switching operation does not function and therefore noise is
not controlled. For this reason, it is recommended to provide a mute circuit constructed of the external components for the
set design.

MUTE setting example

MUTE
(L=ON, H=OFF)
SERIAL DATA
SERIAL DATA

500～600ms
40～60ms

INPUT SOURCE

Fig.25

●Thermal Derating Curve

1200

SSOP-A32
1000

SSOP-A24
Power Dissipation : Pd （mW)

800

600

400

200

0
0 25 50 75 100 125

Ambient Temperature: Ta(℃)

When installed ROHM standard board

(70×70×1.6mm Glass epoxy board)
Fig.26

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BD3870FS,BD3871FS,BD3872FS,BD3873FS Technical Note

●Ordering part number

B D 3870 F S - E 2

Part No. Part No. Package Packaging and forming specification

3870,3871,3873 FS: SSOP-A24 E2: Embossed tape and reel
3872 SSOP-A32

SSOP-A24
<Tape and Reel information>
10 ± 0.2 +6°
4° −4°
(MAX 10.35 include BURR) Tape Embossed carrier tape
24 13
Quantity 2000pcs
E2
Direction
7.8±0.3
5.4±0.2

The direction is the 1pin of product is at the upper left when you hold
of feed ( reel on the left hand and you pull out the tape on the right hand )
1.2±0.15
0.5±0.2

1 12
+0.1
0.17 −0.05
1.8±0.1
0.1±0.1

0.1 Direction of feed

0.8 0.38±0.1 1pin
(Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity.

SSOP-A32
<Tape and Reel information>
13.6 ± 0.2
(MAX 13.95 include BURR)
Tape Embossed carrier tape
32 17
Quantity 2000pcs
E2
Direction
The direction is the 1pin of product is at the upper left when you hold
7.8±0.3

5.4±0.2

of feed ( reel on the left hand and you pull out the tape on the right hand )
0.3MIN

1 16

0.15 ± 0.1
1.8±0.1

0.36 ± 0.1 0.1

0.11

0.8
Direction of feed
1pin
(Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity.

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 Datasheet

Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipm ent, telecommun ication e quipment, home el ectronic ap pliances, amuseme nt equi pment, etc.). If y ou
intend to use our Products in devices re quiring extremely high reliability (such as medic al equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safet y d evices, etc.) and whose malfuncti on or failure ma y caus e loss of human l ife, bodil y i njury or
serious damage to propert y (“Specific Ap plications”), please consult with the ROHM sal es representative in adv ance.
Unless otherwise agreed in writing by ROHM in advanc e, ROHM shall n ot be in an y way responsible or liable for a ny
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASS Ⅲ

2. ROHM desig ns and man ufactures its Products subj ect to strict qualit y co ntrol s ystem. Ho wever, semicon ductor
products can f ail or m alfunction at a c ertain rate. Pleas e be sure to im plement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are des igned and ma nufactured for us e und er stand ard cond itions and not u nder an y spec ial or
extraordinary environments or cond itions, as e xemplified b elow. Ac cordingly, RO HM shal l not be in any way
responsible or liab le for an y damages, exp enses or losses arising from the use of an y ROHM’s Prod ucts under an y
special or e xtraordinary e nvironments or conditi ons. If you inten d to use our Pr oducts un der any spec ial or
extraordinary environments or conditio ns (as exem plified bel ow), your inde pendent verification an d confirmatio n of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in pla ces where the Products are exposed to sea w ind or corros ive gases, inclu ding Cl 2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is rec ommended); or W ashing our Pr oducts b y usi ng water or water-soluble cl eaning a gents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particul ar, if a transient lo ad (a larg e a mount of loa d appl ied in a s hort per iod of time, such as pulse. is a pplied,
confirmation of performance characteristics after on-board mounting is strongl y recommended. Avoid applying po wer
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in a ny way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.

2. In principle, the reflo w soldering method must be used; if flo w s oldering method is pref erred, please consult with the
ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
 Datasheet

Precautions Regarding Application Examples and External Circuits

1. If change is made to th e constant of an e xternal circuit, please allow a s ufficient margin considering variations of th e
characteristics of the Prod ucts and e xternal com ponents, including transient ch aracteristics, as well as stati c
characteristics.

2. You agree that application notes, reference designs, and a ssociated data and in formation contained in this docum ent
are prese nted onl y as g uidance for Prod ucts use. Therefore, in cas e you use su ch informatio n, you are sol ely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive pro duct, which may be damaged due to electrostatic discharg e. Please take pro per
caution in your manufacturi ng process and storage so th at voltage e xceeding t he Pro ducts maxim um rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is stron gly recommended to c onfirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transpo rt cartons in the co rrect direction, which is in dicated on a carton with a s ymbol. Other wise bent le ads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Pro ducts might fall und er controlled goods pr escribed by the a pplicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All informatio n and data incl uding but not limited to appl ication e xample contain ed in this document is for reference
only. ROHM d oes not warrant that foregoi ng information or data will not infringe any intellectual property rights or a ny
other rights of an y third party regarding such information or data. ROHM shall not be in any way responsible or lia ble
for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.

Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be dis assembled, converted, modifi ed, reprod uced or otherwise change d without prior written
consent of ROHM.

3. In no eve nt shall you use in any way whatsoever the Pro ducts and the r elated technical information contained in the
Products or thi s document for an y military purposes, including but not limi ted to, the dev elopment of m ass-destruction
weapons.

4. The proper na mes of comp anies or pro ducts described in this document are trademarks or registered t rademarks of
ROHM, its affiliated companies or third parties.

Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
 Datasheet

General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.