Slvaeb 1 A
Slvaeb 1 A
Application Note
Thermal Comparison of a DC-DC Converter in SOT23 and
the New SOT563
Sabrina Ramalingam
ABSTRACT
This application note compares the thermal performance of flip-chip on lead (FCOL) SOT563 package with the
conventional wire-bond SOT23 packages and FCOL SOT23 package. The document summarizes the packages
thermal results and explains the advantages and disadvantages for electronic board design. The results show
that FCOL packages have better thermal dissipation capabilities, with the SOT563 being on top a 65% smaller
package than SOT23.
Table of Contents
1 Introduction.............................................................................................................................................................................3
2 Describing the TLV62569 Package Technologies: SOT23-5, SOT23-6, and SOT563........................................................4
3 Understanding Thermal Performance and Junction Temperature Estimation................................................................. 5
3.1 Understanding Thermal Performance................................................................................................................................ 5
3.2 Estimating Junction Temperature.......................................................................................................................................5
4 Measurement Setup and Test Results.................................................................................................................................. 7
4.1 Efficiency Measurements................................................................................................................................................... 8
4.2 Thermal Measurements..................................................................................................................................................... 9
5 Thermal Performance Analysis for SOT23-5, SOT23-6, and SOT563 Packages............................................................. 11
5.1 Comparing SOT563 (DRL) and SOT23-6 (DDC)............................................................................................................. 11
5.2 Comparing SOT23-6 (DDC) and SOT23-5 (DBV)............................................................................................................11
5.3 Comparing SOT563 (DRL) and SOT23-5 (DBV)..............................................................................................................11
6 Summary............................................................................................................................................................................... 13
7 References............................................................................................................................................................................ 14
8 Revision History................................................................................................................................................................... 14
List of Figures
Figure 2-1. SOT563 package...................................................................................................................................................... 4
Figure 4-1. Case Temperature Measurement with a Thermal Camera....................................................................................... 7
Figure 4-2. Efficiency Measurements on TLV62569 EVMs for Vin = 5 V and Vout = 3.3 V.........................................................8
Figure 4-3. TPS563201 and TPS563202 Efficiency.................................................................................................................... 8
Figure 4-4. Case Temperature vs. Dissipated Power.................................................................................................................. 9
Figure 4-5. Case Temperature vs. Output Current...................................................................................................................... 9
Figure 4-6. Calculated Junction Temperature vs. Dissipated Power......................................................................................... 10
Figure 4-7. Calculated Junction Temperature vs. Output current.............................................................................................. 10
Figure 4-8. Case Temp Between TPS563201 and TPS563202................................................................................................ 10
Figure 5-1. SOT23 and SOT563 Package Size......................................................................................................................... 11
List of Tables
Table 1-1. Some 17V Part Number of SOT236 and SOT563 Package....................................................................................... 3
Table 2-1. Device Information...................................................................................................................................................... 4
Table 3-1. Variables Description for Junction Temperature Calculation.......................................................................................5
Table 3-2. Variables Description for IC Power Dissipation Calculation........................................................................................ 5
Table 3-3. IC Thermal Information............................................................................................................................................... 6
Table 3-4. Thermal Metric of TPS563201 and TPS563202 Package.......................................................................................... 6
Table 4-1. EVMs Used for Measurements................................................................................................................................... 7
Table 4-2. Output Current............................................................................................................................................................ 8
SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 1
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Trademarks www.ti.com
Table 4-3. Thermal Picture on TLV62569 EVMs at Vin = 5 V, Vout = 3.3 V, and Iout = 2 A.........................................................9
Table 4-4. Thermal Performance at Vin = 5 V, Vout = 3.3 V, and Iout = 2 A.............................................................................. 10
Trademarks
WEBENCH® is a registered trademark of Texas Instruments.
All trademarks are the property of their respective owners.
2 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com Introduction
1 Introduction
There is a strong trend towards smaller form factors in electronic board designs. At the same time, there
is also an increasing need for more power rails and, in some cases, higher currents to supply digital cores
like Micro-Controller Units (MCU), field-programmable Gate Arrays (FPGA), or other embedded processors.
In terms of power design, this translates into the need for integrated circuits (ICs) with higher power density
where thermal design becomes critical to achieve the required performance without compromising cost. This
application report focuses on DC/DC converters in SOT23 and the new, 65% smaller, SOT563 packages. More
specifically on the performance differences of a same non-isolated 5-V/2-A buck converter (TLV62569) in three
different packages: SOT 23-5, SOT23-6, and SOT563.
After an overview of the SOT23 and SOT563 packaging technology, this application report shows the thermal
performances of the TLV62569 in different packages and discusses the impact in specific power designs. It
also introduces the performance differences of 17 V/3 A series parts between SOT236 and SOT563 package.
TPS56x201/8 is 17 V 1~5 A series part with SOT236 package. TPS56x202/7 is 17V 2~3 A series part with
SOT563 package. Table 1-1 shows the part number of these two family parts. Finally, it summarizes the
advantages of each package to help the designer choose the right package for addressing key challenges in
his/her end equipment.
Table 1-1. Some 17V Part Number of SOT236 and SOT563 Package
Description SOT236 SOT563
17 V/1 A TPS561201/8
17 V/2 A TPS562201/8 TPS562202/7
TPS562202/7S
17 V/3 A TPS563201/8 TPS563202/7
TPS563202/7S
17 V/4 A TPS564201/8
17 V/5 A TPS565201/8
SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 3
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Describing the TLV62569 Package Technologies: SOT23-5, SOT23-6, and SOT563 www.ti.com
As of today, SOT23 packages are widely used in several applications because of their ease of use.
Even though the SOT23-5 (DBV) and SOT23-6 (DDC) share the same package appearance with the same
footprint dimensions, these two packages use different interconnection between silicon and package itself. The
SOT23-5 (DBV) is designed with a bonding wire interconnection structure whereas the SOT23-6 uses the Flip
Chip On Lead (FCOL) approach. Connecting the IC with wire bonds using copper, gold, or aluminum wires
inside the package has the advantage of being flexible and cost effective. However, it requires space and the
bonding wires add parasitic inductance and resistance on the pins. On the contrary, with the FCOL package
technology, copper bumps are used as interconnection and they are directly located on the die. Therefore there
is no additional parasitic inductance and resistance added due to the interconnection structure. For more details
on SOT23-5 and SOT23-6 packages, see the SOT23 Package Thermal Consideration Application Report.
Similar to the SOT23-6, the new SOT563 (DRL) package is also based on FCOL bonding structure. But
SOT563 package interconnection is also different with SOT236 package. Figure 2-1 shows SOT563(DRL)
package assembly technology. For SOT236 package, die is under leadframe. As for SOT563 package, die is on
leadframe. Obviously lead of SOT563 is shorter. Short lead will lead to small parasitic resister and inductance.
Thanks to innovations in packaging structures and lead frame designs, it is possible to achieve a 65% smaller IC
package compared to SOT23-5 and SOT23-6 for the same die area without compromising thermal performance.
Table 3-3 shows that the junction to top and junction to board thermal characteristics ψJT and ψJB are the
smallest for the DRL package, translating directly in a better heat dissipation of the junction to top and junction
to board. Table 3-4 shows TPS563201 and TPS563202 part thermal metric. ψJT of TPS563202 is smaller than
TPS563201 which also shows DRL package has a better heat dissipation of the junciton to top.
Mold
Silicon
Cu post
Lead
4 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com Understanding Thermal Performance and Junction Temperature Estimation
There are two options to estimate the IC power dissipation PIC,diss. The first and easiest option to estimate
PIC,diss is the WEBENCH® Power Designer Tool for the required operating conditions. The second option is to
use Equation 2:
It is important to model the dissipated power in the inductor to have a more reliable estimation of the junction
temperature. As a general rule, it is good enough to model only the DC losses of the inductor.
SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 5
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Understanding Thermal Performance and Junction Temperature Estimation www.ti.com
In this section, the different relevance of thermal performance across EE applications were explained and the
important parameters for good thermal performance evaluation were introduced. The next section focuses on
the specific thermal performance of the TLV62569 across the three different packages: SOT23-5, SOT23-6, and
SOT563. And introduces TPS563201 and TPS563202 performance.
6 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com Measurement Setup and Test Results
SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 7
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Measurement Setup and Test Results www.ti.com
98
TLV62569 SOT23-5
97 TLV62569 SOT23-6
TLV62569 SOT563
96
Efficiency (%)
95
94
93
92
91
90
0 0.5 1 1.5 2
IOUT (A) D001
Figure 4-2. Efficiency Measurements on TLV62569 EVMs for Vin = 5 V and Vout = 3.3 V
It also tests TPS563201 and TPS563202 performance. This test is on their public EVM board and test
condition is 12Vin to 1Vout with same BOM. Figure 4-3 shows efficiency comparison between TPS563201
and TPS563202. From the figure, efficiency is similar at light loading. At full 3A loading, TPS563201 efficiency is
a little higher than TPS563202.
100%
90%
80%
70%
60%
Efficiency
50%
40%
30%
20%
TPS563202
10% TPS563201
0
0.001 0.01 0.1 1 3
Iout(A)
8 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com Measurement Setup and Test Results
Case temperature: Tcase = 65°C Case temperature: Tcase = 53°C Case temperature Tcase = 72°C
The results of IC case temperature measurements over the entire load range up to 2 A are compiled in Figure
4-4. As a next step, the junction temperatures of the IC in the three different packages are deducted using
Equation 1. Figure 4-5 shows the results.
The thermal measurements are represented versus output current and IC power dissipation to demonstrate the
linear relation between IC temperature and IC power dissipation on each of the EVMs.
90 90
80 80
70 70
Temperature (qC)
Temperature (qC)
60 60
50 50
40 40
Figure 4-4. Case Temperature vs. Dissipated Power Figure 4-5. Case Temperature vs. Output Current
SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 9
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Measurement Setup and Test Results www.ti.com
90 85
80
80 75
70
70
Temperature (qC)
Temperature (qC)
65
60 60
55
50 50
45
40
40
Tcase (DBV) 35 Tcase (DBV)
30 Tcase (DDC) Tcase (DDC)
Tcase (DRL) 30 Tcase (DRL)
20 25
0 0.2 0.4 0.6 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2
Dissapated Power (W) D004
Output Current (A) D005
Figure 4-6. Calculated Junction Temperature vs. Figure 4-7. Calculated Junction Temperature vs.
Dissipated Power Output current
Thermal performances are critical for higher load current as power dissipation becomes a challenge with
conduction losses increasing.
Table 4-4. Thermal Performance at Vin = 5 V, Vout = 3.3 V, and Iout = 2 A
JUNCTION
DEVICE CASE TEMPERATURE TEMPERATURE RAISE
TEMPERATURE
SOT23-5 (DBV) 65°C 80°C ~15°C
SOT23-6 (DDC) 53°C 58°C ~5°C
SOT563 (DRL) 71.6°C 72°C ≤1°C
From graphs on Figure 4-2, Figure 4-4, and Table 4-4, three main observations can be made:
• SOT23-5 has the highest junction temperature.
• SOT23-6 has the lowest Junction and case temperature.
• SOT563 has the lowest junction to top temperature raise.
Figure 4-8 shows thermal comparison of TPS563201 and TPS563202. Because of different theta JA,
TPS563201 thermal performance is a little better than TPS563202.
100
90
Case Temperature/ oC
80
70
60
50
40
30
0.5 1 1.5 2 2.5 3
Loading/A
This section concentrated on the method to measure and estimate IC temperature and tangible results were
shown for the TLV62569. Moving forward, the focus is set on the analysis of these measurement results and the
meaning in terms of IC packaging.
10 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com Thermal Performance Analysis for SOT23-5, SOT23-6, and SOT563 Packages
1.6
2.9
65% smaller
1.6
1.45 max
0.6
SOT23 SOT563
Package size : 8.1 mm2 Package size : 2.6 mm2
SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 11
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Thermal Performance Analysis for SOT23-5, SOT23-6, and SOT563 Packages www.ti.com
For applications like Motor Drives Control Modules where thermal performance is a key concern, the SOT23-6
(DDC) package offers the lower junction and case temperature. For applications like Industrial PC, Security
Cameras, or SSD Memory Modules where size and temperature are critical for the system design SOT563
(DRL) offers the smallest IC size, 65% smaller than SOT23 (DBV, DDC) with very good thermal performance.
12 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com Summary
6 Summary
This application report compared the performance of a 5-V/2-A DC/DC converter (TLV62569) in three different
packages: SOT23-5 (DBV), SOT23-6 (DDC), and SOT563 (DRL).
While SOT23-5 (DBV) is widely used since many years, newer packages using FCOL technologies like SOT23-6
(DDC) and SOT563 (DRL) offer multiple advantages depending on the key requirements of the application. For
thermal critical applications where the solution size is not the key limiting factor, the SOT23-6 (DDC) package
offers the coolest solution between the three packages. For applications where solution size matters the most,
the SOT563 (DRL) package offers the smallest size with best light load efficiency among the three packages,
without compromising thermal performances and cost.
SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 13
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
References www.ti.com
7 References
• Texas Instruments, Semiconductor and IC Package Thermal Metrics application report.
• Texas Instruments, SOT23 Package Thermal Consideration application report.
• Texas Instruments, How To Use Psi Jt User Guide.
• Texas Instruments, TI's Journey to High-volume Copper Wire Bonding Production white paper.
• Texas Instruments, TLV62569 2-A High Efficiency Synchronous Buck Converter in SOT Package data sheet.
8 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
14 Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 SLVAEB1A – MARCH 2020 – REVISED OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated