Si PD Circuit e
Si PD Circuit e
Low-light-level detection circuit ing a circuit board made from material having high insulation
resistance. As countermeasures against current leakage from
Low-light-level detection circuits require measures for reducing
the surface of the circuit board, try using a guard pattern or el-
electromagnetic noise in the surrounding area, AC noise from
evated wiring with teflon terminals for the wiring from the pho-
the power supply, and internal op amp noise, etc.
todiode to op amp input terminals and also for the feedback
Figure 4 shows one measure for reducing electromagnetic
resistor (Rf) and feedback capacitor (Cf) in the input wiring.
noise in the surrounding area.
Hamamatsu offers the C6386-01, C9051 and C9329 photosen-
sor amplifiers optimized for use with photodiodes for low-light-
Figure 4 Low-light-level sensor head
level detection.
(a) Example using shielded cable to connect to photodiode
+5 V
Rf1 SW1 +
10μ
0
Figure 5 Photosensor amplifiers
Rf2 SW2 +
10 μ -5 V
Metal package (a) C6386-01 (b) C9051
PD Cf -
- IC2 Vo
IC1 +
Isc Shielded +
cable 10-turn
1 potentiometer
BNC Metal shielded box
coaxial
cable,
etc.
KSPDC0051EC
(b) Example using metal shielded box that contains entire circuit (c) C9329
Rf1 SW1 + μ +5 V
10 0
Rf2 SW2 +
10 μ -5 V
Cf
PD
-
-
IC2 Vo
The photodiodes, and coaxial
ISC IC1 +
+ cables with BNC-to-BNC
10-turn
potentiometer plugs are sold separately.
Metal shielded box
KSPDC0052EB
43 Si Photodiodes
Application circuit examples
Light absorption meter High-speed photodetector circuit (1)
This is a light absorption meter using a dedicated IC and two The high-speed photodetector circuit shown in Figure 13 utiliz-
photodiodes which provides a logarithmic ratio of two current es a low-capacitance Si PIN photodiode (with a reverse voltage
inputs (See Figure 11). By measuring and comparing the light applied) and a high-speed op amp current-voltage converter
intensity from a light source and the light intensity after trans- circuit. The frequency band of this circuit is limited by the op
mitting through a sample with two photodiodes, light absor- amp device characteristics to less than about 100 MHz.
bance by the sample can be measured. When the frequency band exceeds 1 MHz, the lead inductance
To make measurements, optical system such as the incident of each component and stray capacitance from feedback resis-
aperture should first be adjusted to become the output volt- tance Rf exert drastic effects on device response speed. That
age Vo to 0 V so that the short circuit current from the two Si effect can be minimized by using chip components to reduce
photodiodes is equal. Next, the sample is placed on the light the component lead inductance, and connecting multiple resis-
path of one photodiode. At this point, the output voltage value tors in series to reduce stray capacitance.
means the absorbance by the sample. The relationship be - The photodiode leads should be kept as short as possible and
tween the absorbance A and the output voltage Vo can be di- the pattern wiring to the op amp should be made as short and
rectly read as A=-Vo [V]. If a filter is interposed before the light thick as possible. This will lower effects from the stray capaci-
source as shown in the figure 11, the absorbance of specific tance and inductance occurring on the circuit board pattern of
light spectrum or monochromatic light can be measured. the op amp inputs and also alleviate effects from photodiode
lead inductance. Moreover, a ground plane structure utilizing
Figure 11 Light absorption meter copper plating at ground potential across the entire board sur-
+15 V face will prove effective in boosting device performance.
Sample Isc1
- A ceramic capacitor should be used as the 0.1 μF capacitor
PD connected to the op amp power line, and the connection to
A Vo
+ ground should be the minimum direct distance.
Filter Isc2
Hamamatsu offers C8366 photosensor amplifier for PIN photo-
100 p
diodes with a frequency bandwidth up to 100 MHz.
-15 V
A : Log amp Figure 13 High-speed photodetector circuit (1)
PD: S5870, etc. Rf
10 k ISC 51 Ω
PD
+15 V Vo
Vo = log (ISC1/ISC2) [V] + +15 V
10 μ 0.1 μ 7
KPDC0025EC 2-
0.1 μ
IC
+ 14 6
3
Total emission measurement of LED 0.1μ
-15 V
Since the emitting spectral width of LEDs is usually as narrow
PD: High-speed PIN photodiode (S5971, S5972, S5973, etc.)
as about several-ten nanometers, the amount of the LED emis- Rf : Two or more resistors are connected in series to eliminate parallel capacitance.
sion can be calculated from the Si photodiode photosensitivity IC : AD745, LT1360, HA2525, etc.
at a peak emission wavelength of the LED. In Figure 12, the in- Vo = -Isc × Rf [V]
KPDC0020ED
ner surface of the reflector block B is mirror-processed so that
it reflects the light emitted from the side of the LED towards
the Si photodiode. Therefore, the total amount of the LED Figure 14 Photosensor amplifier C8366
emission can be detected by the Si photodiode.
PD A
Po
LED
B
High-speed photodetector circuit (2)
A : Ammeter, 1 mA to 10 mA
PD: S2387-1010R The high-speed photodetector circuit in Figure 15 uses load
B : Aluminum block, inner Au plating resistance R L to convert the short circuit current from a low-
S : Photosensitivity of Si photodiode
Refer to the spectral response chart in the datasheets. capacitance Si PIN photodiode (with a reverse voltage applied)
S2387-1010R: S ≈ 0.58 A/W (λ=930 nm)
Po : Total emission to a voltage, and amplifies the voltage with a high-speed op
amp. There is no problem with gain peaking based due to
Po ≈ Isc [W] phase shifts in the op amp. A circuit with a frequency band-
S
KPDC0026EA width higher than 100 MHz can be attained by selecting the
correct op amp. Points for caution in the components, pattern
and structure are the same as those listed for the “High-speed
photodetector circuit (1)”.
Si Photodiodes 44
Figure 15 High-speed photodetector circuit (2) Figure 17 AC photodetector circuit (2)
+5 V +15 V
10 k
10 k 10 μ
0.1 μ + 10 μ
PD 0.1 μ + 10 +
Isc 3 +7 6 1k
51 Ω
RL
IC
A Vo 0.1 μ
2 - 4 0.1 μ 0.1 μ
Vo
PD 1000 p
R ISC FET
Rf
RL
-5 V 1M
RS 0.1μ
PD : High-speed PIN photodiode
(S5971, S5972, S5973, S9055, S9055-01, etc.)
R L, R, Rf : Determined by recommended conditions of the op amp PD : High-speed PIN photodiode (S2506-02, S5971, S5972, S5973, etc.)
IC : AD8001, etc. RL : Determined by sensitivity and “time constant of Ct” of photodiode
Rs : Determined by operation point of FET
Rf
Vo = Isc × R L × (1 + ) [V] FET: 2SK362, etc.
R KPDC0034EA
KPDC0015EE
R
Rf
-5 V
PD : High-speed PIN photodiode
(S5971, S5972, S5973, S9055, S9055-01, etc.)
R L, R, Rf, r : Determined by recommended conditions of the op amp
IC : AD8001, etc.
Vo = Isc × R L × (1 + Rf ) [V]
R
KPDC0034EA
45 Si Photodiodes