Technical Manual 26167V1

(Revision F)
Original Instructions

MicroNet TMR®
Digital Control

This manual replaces manual 85584

for the MicroNet TMR.

Installation and Operation Manual, Volume 1 of 2

 This is the safety alert symbol. It is used to alert you to potential personal
injury hazards. Obey all safety messages that follow this symbol to avoid
possible injury or death.
 DANGER—Indicates a hazardous situation which, if not avoided, will result in death
or serious injury.
DEFINITIONS  WARNING—Indicates a hazardous situation which, if not avoided, could result in
death or serious injury.
 CAUTION—Indicates a hazardous situation which, if not avoided, could result in
minor or moderate injury.
 NOTICE—Indicates a hazard that could result in property damage only (including
damage to the control).
 IMPORTANT—Designates an operating tip or maintenance suggestion.

The engine, turbine, or other type of prime mover should be equipped with an
overspeed shutdown device to protect against runaway or damage to the prime
mover with possible personal injury, loss of life, or property damage.
The overspeed shutdown device must be totally independent of the prime mover
control system. An overtemperature or overpressure shutdown device may also
be needed for safety, as appropriate.

Read this entire manual and all other publications pertaining to the work to be performed before
installing, operating, or servicing this equipment. Practice all plant and safety instructions and
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Any unauthorized modifications to or use of this equipment outside its specified mechanical,
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damage to the equipment. Any such unauthorized modifications: (i) constitute "misuse" and/or
"negligence" within the meaning of the product warranty thereby excluding warranty coverage
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To prevent damage to a control system that uses an alternator or battery-charging

device, make sure the charging device is turned off before disconnecting the battery
from the system.

To prevent damage to electronic components caused by improper handling, read

and observe the precautions in Woodward manual 82715, Guide for Handling and
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Woodward Governor Company reserves the right to update any portion of this publication at any time. Information
provided by Woodward Governor Company is believed to be correct and reliable. However, no responsibility is assumed
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© Woodward 2004
All Rights Reserved
Manual 26167V1 MicroNet TMR

Contents

IOLOCK. When a CPU or I/O module fails, watchdog logic drives it into an
IOLOCK condition where all output circuits and signals are driven to a known
de-energized state as described below. The System MUST be designed such that
IOLOCK and power OFF states will result in a SAFE condition of the controlled
device.

 CPU and I/O module failures will drive the module into an IOLOCK state.
 CPU failure will assert an IOLOCK signal to all modules and expansion
racks to drive them into an IOLOCK state.
 Discrete outputs / relay drivers will be non-active and de-energized.
 Analog and actuator outputs will be non-active and de-energized with zero
voltage or zero current.

The IOLOCK state is asserted under various conditions including:

 CPU and I/O module watchdog failures
 PowerUp and PowerDown conditions
 System reset and hardware/software initialization
 Entering configuration mode

NOTE: Additional watchdog details and any exceptions to these failure states
are specified in the related CPU or I/O module section of the manual.

This manual is divided into two volumes:

 Volume 1 contains Chapters 1–8 (manual 26167V1).
 Volume 2 contains Chapters 9–16 and the appendixes (manual 26167V2).

REGULATORY COMPLIANCE ...................................................................... VIII 

ELECTROSTATIC DISCHARGE AWARENESS .................................................. X 
CHAPTER 1. GENERAL INFORMATION ........................................................... 1 
1.1—Introduction ....................................................................................................1 
1.2—Specifications and Compatibility ....................................................................2 
CHAPTER 2. MICRONET™ TMR SYSTEMS ................................................... 3 
2.1—MicroNet TMR ................................................................................................3 
2.2—MicroNet TMR Operation .............................................................................14 
2.3—Module Replacement ...................................................................................15 
2.4—Latent Fault Detection ..................................................................................16 
CHAPTER 3. CHASSIS CONFIGURATIONS .................................................... 18 
3.1—TMR Main Chassis.......................................................................................18 
3.2—Expansion MicroNet Plus 8-Slot I/O ............................................................21 
3.3—Expansion MicroNet Plus 14-Slot I/O ..........................................................25 
3.4—Expansion MicroNet Simplex 6-Slot I/O.......................................................29 
3.5—Expansion MicroNet Simplex 12-Slot I/O.....................................................32 
CHAPTER 4. POWER SUPPLIES .................................................................. 36 
4.1—TMR Main Power Supplies ..........................................................................36 
4.2—TMR Main Power Supply Specifications ......................................................39 
4.3—TMR Main Power Supply Installation ...........................................................40 
4.4—TMR Kernel PS Module ...............................................................................42 
4.5—TMR Kernel PS Module Specifications ........................................................43 

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Contents

4.6—TMR Kernel PS Installation ..........................................................................44 

4.7—TMR System Power-up ................................................................................45 
4.8—TMR Power Supply Troubleshooting ...........................................................45 
4.9—MicroNet Plus 8/14 Chassis Power Supplies...............................................47 
4.10—MicroNet Simplex 6/12 Chassis Power Supplies .......................................53 
4.11—MicroNet Simplex Power Supply Specifications ........................................55 
4.12—MicroNet Simplex Power Supply Installation .............................................56 
4.13—MicroNet Simplex Power Supply Troubleshooting ....................................58 
CHAPTER 5. CPUS ....................................................................................60 
5.1—TMR5200 CPU Module ................................................................................60 
5.2—CPU_040 Module .........................................................................................67 
CHAPTER 6. COMMUNICATION ....................................................................77 
6.1—Remote RTN Module ...................................................................................77 
6.2—Main Transceiver (XCVR) Module ...............................................................85 
6.3—Remote Transceiver (XCVR) Module ..........................................................87 
6.4—Transceiver Accessories ..............................................................................90 
6.5—Ethernet Module ...........................................................................................92 
6.6—SIO Module ..................................................................................................96 
CHAPTER 7. DISCRETE I/O MODULES .......................................................101 
7.1—Introduction ................................................................................................101 
7.2—24/12 TMR Discrete I/O Module ................................................................101 
7.3—48/24 Discrete Combo Module ..................................................................114 
7.4—48 Channel Discrete Input Module ............................................................125 
7.5—32 Channel Discrete Output Module ..........................................................129 
7.6—64 Channel Discrete Output Module ..........................................................134 
CHAPTER 8. ANALOG I/O MODULES .........................................................138 
8.1—Introduction ................................................................................................138 
8.2—Combination I/O Modules ..........................................................................138 
8.3—TMR 24/8 Analog Module ..........................................................................138 
8.4—TMR Analog Combo Module......................................................................146 
8.5—24/8 Analog Module ...................................................................................162 
8.6—Dataforth® 24/8 Analog Module ................................................................170 
8.7—Analog Combo Module ..............................................................................181 
8.8—34 Ch High Density Versatile Input Module (HDVIM) ................................195 
8.9—Current Input Modules ...............................................................................204 
8.10—8 Ch Current Input (4–20 mA) Module.....................................................205 
8.11—Non-Standard 8 Ch Current Input (4–20 mA) Module .............................211 
8.12—Voltage Input Modules .............................................................................216 
8.13—8 Channel Voltage Input (0–10 Vdc) Module ...........................................216 
8.14—Current Output Modules...........................................................................221 
8.15—8 Ch Current Output (4–20 mA) Module ..................................................222 
8.16—8 Ch Current Output (0–1 mA) Module ....................................................227 
8.17—Voltage Output Modules ..........................................................................228 
8.18—8 Ch Voltage Output (0–5 Vdc ) Module ..................................................229 
8.19—8 Ch Voltage Output (0–10 Vdc) Module .................................................234 
8.20—Thermocouple Input Modules ..................................................................235 
8.21—8 Ch TC (Fail Low) Module ......................................................................236 
8.22—8 Ch TC (Fail High) Module .....................................................................242 
8.23—RTD Input Modules ..................................................................................243 
8.24—8 Ch RTD Input (10 ohm).........................................................................244 
8.25—8 Ch RTD Input (100 ohm).......................................................................250 

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Contents

8.26—8 Ch RTD Input (200 ohm) ......................................................................252 

8.27—8 Ch RTD Input (500 ohm) ......................................................................254 
8.28—4 Ch MPU/Proximity Module ....................................................................256 

Illustrations and Tables

Figure 1-1—MicroNet TMR System (Single Rack) ................................................2 

Figure 1-2— Expansion Chassis Options ..............................................................2 
Figure 2-1—Double Exchange and Vote Structure ................................................5 
Figure 2-2—Fault Tolerant Analog Input ................................................................7 
Figure 2-3—Fault Tolerant Discrete Input ..............................................................7 
Figure 2-4—Fault Tolerant Analog Output .............................................................9 
Figure 2-5—Fault Tolerant Single Coil Actuator Output .......................................10 
Figure 2-6—Fault Tolerant Dual Coil Actuator Output .........................................11 
Figure 2-7—Fault Tolerant Discrete Output .........................................................12 
Figure 2-8—Input Flow .........................................................................................13 
Figure 2-9—Output Flow ......................................................................................13 
Figure 2-10—Redundant Sensors ........................................................................13 
Figure 2-11—Redundant Inputs ...........................................................................14 
Figure 2-12—TCHAS_STAT Block ......................................................................16 
Figure 2-13—SYS_INFO Block ............................................................................17 
Figure 3-1—MicroNet TMR® Main Chassis ..........................................................18 
Figure 3-2—Outline Drawing of MicroNet TMR Main Chassis .............................19 
Figure 3-3—Mounting Template of MicroNet TMR Main Chassis........................20 
Figure 3-4—MicroNet Plus 8-Slot I/O Chassis .....................................................21 
Figure 3-5—MicroNet Plus 8-Slot Chassis ...........................................................22 
Figure 3-6—Outline Drawing of MicroNet Plus 8-Slot Chassis ............................24 
Figure 3-7—Mounting Template of MicroNet Plus 8-Slot I/O Chassis .................24 
Figure 3-8—MicroNet Plus 14-Slot I/O Chassis ...................................................25 
Figure 3-9—MicroNet Plus 14-Slot Chassis .........................................................26 
Figure 3-10—Outline Drawing of MicroNet Plus Chassis ....................................28 
Figure 3-11—Mounting Template of MicroNet Plus 14-Slot I/O Chassis .............29 
Figure 3-12—Simplex MicroNet Six Slot I/O ........................................................30 
Figure 3-13—Outline Drawing of MicroNet Six Slot I/O .......................................31 
Figure 3-14—Mounting Template of MicroNet 6 Slot I/O Chassis .......................32 
Figure 3-15—Simplex MicroNet 12 Slot I/O .........................................................33 
Figure 3-16—Outline Drawing of MicroNet 12 Slot I/O ........................................34 
Figure 3-17—Mounting Template of MicroNet 12 Slot I/O Chassis .....................35 
Figure 4-1—TMR Power Supply Diagram ............................................................36 
Figure 4-2—TMR Main Chassis PS Ribbon Cable Connections .........................37 
Figure 4-3—TMR PS Chassis PS Ribbon Cable Connections ............................37 
Figure 4-4—Chassis to Chassis Power Cable .....................................................38 
Figure 4-5—TMR Power Supply Modules (24 Vdc/120 Vac/dc) ..........................39 
Figure 4-6—TMR Main Power Supply..................................................................40 
Figure 4-7—Kernel Power Supply Module ...........................................................43 
Figure 4-8—MicroNet Kernel Power Supplies......................................................44 
Figure 4-9—Power Supply Module ......................................................................48 
Figure 4-10—Power Supply Modules ...................................................................54 
Figure 4-11—MicroNet Simplex Power Supply ....................................................56 
Figure 5-1—TMR5200 CPU Module ....................................................................60 
Figure 5-2—CPU Module Block Diagram.............................................................61 

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Illustrations and Tables

Figure 5-3—CPU Communications Port (DB9F) ..................................................65 

Figure 5-4—CPU Service Port (mini-DIN6F) ........................................................66 
Figure 5-5—040 CPU Module ..............................................................................67 
Figure 5-6—CPU Module .....................................................................................68 
Figure 5-7—CPU Module Block Diagram .............................................................69 
Figure 5-8—68040 CPU Communications Port ...................................................70 
Figure 6-1—Remote RTN Module ........................................................................77 
Figure 6-2—Remote RTN Module Block Diagram ...............................................78 
Figure 6-3—MicroNet TMR5200 System (copper, 3-rack) ...................................79 
Figure 6-4—MicroNet TMR5200 System (fiber, 2 locations) ...............................80 
Figure 6-5—RTN Service Port (mini-DIN6F) ........................................................84 
Figure 6-6—Main XCVR Module Block Diagram .................................................85 
Figure 6-7—Main XCVR Module ..........................................................................86 
Figure 6-8—Remote XCVR Module Block Diagram.............................................87 
Figure 6-9—Remote XCVR Module Jumpers ......................................................88 
Figure 6-10—Remote XCVR Module ...................................................................89 
Figure 6-11—T-Module (I/O XCVR-Module) ........................................................90 
Figure 6-12—Cables ............................................................................................90 
Figure 6-13—Expansion I/O Chassis ...................................................................91 
Figure 6-14—Termination.....................................................................................92 
Figure 6-15—Ethernet Module .............................................................................93 
Figure 6-16—SIO Module.....................................................................................96 
Figure 6-17—SIO Module Block Diagram ............................................................97 
Figure 6-18—RS-422 Terminator Locations ........................................................98 
Figure 6-19—RS-485 Terminator Locations ........................................................98 
Figure 6-20—Termination and Cable Connection Examples ...............................99 
Figure 6-21—Preferred Multipoint Wiring Using Shielded Twisted-Pair Cable with
a Separate Signal Ground Wire .....................................................100 
Figure 6-22—Alternate Multipoint Wiring Using Shielded Twisted-Pair Cable
without a Separate Signal Ground Wire ........................................100 
Figure 7-1—24/12 TMR Discrete I/O Module .....................................................101 
Figure 7-2—24/12 TMR Discrete I/O Module Block Diagram ............................102 
Figure 7-3—Example TMR System Configuration .............................................103 
Figure 7-4—Wiring Diagram for a FT Relay/Discrete Input Module...................104 
Figure 7-5—Optional Internal 24 Vdc Contact Wetting Configuration................105 
Figure 7-6—Optional External 24/125 Vdc Contact Wetting Configuration .......106 
Figure 7-7—TMR Discrete Output ......................................................................107 
Figure 7-8—Latent Fault Detection Verification Graph–18-32 Vdc Circuitry .....109 
Figure 7-9—Latent Fault Detection Verification Graph–18-132 Vac Circuitry ...109 
Figure 7-10—Latent Fault Detection Verification Graph–100–150 Vdc
Circuitry ..........................................................................................110 
Figure 7-11—Jumper and Relay Location Diagram ...........................................111 
Figure 7-12—FT Relay/Discrete Input Module Labels .......................................111 
Figure 7-13—Example Relay Output Wiring Diagram........................................112 
Figure 7-14—Discrete Combo Module ...............................................................115 
Figure 7-15—Configuration 1, One 48/24 Discrete FTM with Relay Module(s) .117 
Figure 7-16—Discrete Input Interface Wiring to a 24 Vdc 48/24 Discrete FTM .118 
Figure 7-17—Discrete Input Interface Wiring to a 125 Vdc 48/24 Discrete
FTM................................................................................................118 
Figure 7-18—Relay Output Interface Wiring to a 16 Ch Relay Module .............119 
Figure 7-19—Relay Output Interface Wiring to a 32 Ch Relay Module .............120 
Figure 7-20—Configuration 2, Two 24/12 Discrete FTMs ..................................120 
Figure 7-21—Discrete Input Interface Wiring to a 24/12 Discrete FTM .............121 
Figure 7-22—Relay Output Interface Wiring to a 24/12 Discrete FTM ..............122 
Figure 7-23—48/24 Discrete Combo Module Block Diagram ............................123 

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Illustrations and Tables

Figure 7-24—Discrete Input Module ..................................................................125 

Figure 7-25—48 Ch DI Module with two FTMs ..................................................126 
Figure 7-26—Discrete Input Interface Wiring with Internal Power Source to a 24
Vdc Discrete Input/Output FTM .....................................................127 
Figure 7-27—Discrete Input Interface Wiring with External Power Source to a
Discrete Input (with LEDs) FTM ....................................................127 
Figure 7-28—Discrete Input Module Block Diagram ..........................................128 
Figure 7-29—Discrete Output Module................................................................130 
Figure 7-30—32 Ch DO Module with Relay Modules ........................................131 
Figure 7-31—Relay Output Interface Wiring to a 16 Ch Relay Module .............131 
Figure 7-32—Relay Output Interface Wiring to a 32 Ch Relay Module .............132 
Figure 7-33—Discrete Output Module (32 Channel) Block Diagram .................133 
Figure 7-34—Discrete Output Module................................................................134 
Figure 7-35—64 Ch DO Module with Relay Modules ........................................136 
Figure 7-36—Relay Output Interface Wiring to a 16 Ch Relay Module .............136 
Figure 7-37—Relay Output Interface Wiring to a 32 Ch Relay Module .............137 
Figure 8-1—24/8 Analog Module .......................................................................139 
Figure 8-2—Example TMR System Configuration .............................................140 
Figure 8-3—Analog Input Wiring for a 24/8 Analog FTM ...................................141 
Figure 8-4—Analog Output Wiring for a 24/8 Analog FTM ................................142 
Figure 8-5—Analog Combo Module ...................................................................146 
Figure 8-6—Example Fault Tolerant System Configuration...............................148 
Figure 8-7—MPU/Proximity Interface Wiring to the TMR Analog Combo FTM .150 
Figure 8-8—Current Input Wiring for an Analog Combo Module FTM ...............151 
Figure 8-9—Voltage Input Wiring for an Analog Combo Module FTM ..............152 
Figure 8-10—Analog Output and Actuator Wiring for an Analog Combo FTM ..154 
Figure 8-11—MPU and Analog I/O Module FTM Fuse Locations......................162 
Figure 8-12—24/8 Analog Module .....................................................................163 
Figure 8-13—Simplex System Configuration Example ......................................165 
Figure 8-14—Analog Input Wiring for a 24/8 Analog FTM .................................166 
Figure 8-15—Analog Output Wiring for a 24/8 Analog FTM ..............................167 
Figure 8-16—Dataforth 24/8 Analog Module......................................................170 
Figure 8-17—Simplex Dataforth Configuration Example ...................................172 
Figure 8-18—Thermocouple Wiring to Simplex Dataforth FTM .........................173 
Figure 8-19—RTD Wiring to Simplex Dataforth FTM .........................................174 
Figure 8-20—Loop powered 4–20 mA Signal Wiring to Simplex Dataforth
FTM................................................................................................174 
Figure 8-21—Self-powered 4–20 mA Signal Wiring to Simplex Dataforth FTM 175 
Figure 8-22—0–5 Vdc Signal Wiring to Simplex Dataforth FTM ........................175 
Figure 8-23—Analog Output Signal Wiring to Simplex Dataforth FTM ..............176 
Figure 8-24—Dataforth Plug-in Modules ............................................................176 
Figure 8-25—Analog Combo Module .................................................................181 
Figure 8-26—Simplex System Configuration Example ......................................184 
Figure 8-27—MPU/Proximity Interface Wiring to the Analog Combo FTM ........185 
Figure 8-28—Current Input Wiring for an Analog Combo Module FTM .............187 
Figure 8-29—Voltage Input Wiring for an Analog Combo Module FTM ............188 
Figure 8-30—Analog Output and Actuator Wiring for an Analog Combo FTM ..190 
Figure 8-31—34 Channel HDVIM Module..........................................................195 
Figure 8-32—Simplex System Configuration Example ......................................199 
Figure 8-33—Wiring Diagram for 34 Ch HDVIM FTM ........................................200 
Figure 8-34—Analog Input Interface Wiring to the 34 Ch HDVIM Module for
Thermocouple Inputs .....................................................................202 
Figure 8-35—Analog Input Interface Wiring to the 34 Ch HDVIM Module for 4–20
mA Inputs .......................................................................................202 

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MicroNet TMR Manual 26167V1

Illustrations and Tables

Figure 8-36—4–20 mA Input Interface Wiring to the 34 Ch HDVIM Module for

4–20 mA on 4/20 mA/RTD Inputs ..................................................202 
Figure 8-37—RTD Input Interface Wiring to the 34 Ch HDVIM Module for RTDs
on 4–20 mA/RTD Inputs ................................................................202 
Figure 8-38—8 Channel Current Input (4–20 mA) Module ................................205 
Figure 8-39—8 Ch Current Input (4–20 mA) Module Configuration...................206 
Figure 8-40—Analog Input Wiring for an 8 Ch Current Input (0–25 mA)
Module ...........................................................................................208 
Figure 8-41—8 Ch Current Input (0–25 mA) Module Block Diagram.................209 
Figure 8-42—Non-standard 8 Channel Current Input (4–20 mA) Module .........211 
Figure 8-43—Non-Standard 8 Channel Current Input (4–20 mA) Module
Configuration .................................................................................212 
Figure 8-44—Analog Input Wiring for a Non-Standard 8 Ch Current Input
(0–25 mA) Module .........................................................................214 
Figure 8-45—8 Channel Voltage Input (0–10 Vdc) Module ...............................217 
Figure 8-46—8 Ch Voltage Input (0–10 Vdc) Module Configuration..................218 
Figure 8-47—Voltage Input Wiring for an 8 Channel Voltage Input (0–10 Vdc)
Module ...........................................................................................219 
Figure 8-48—8 Ch Voltage Input (0–10 Vdc) Module Block Diagram................220 
Figure 8-49—8 Channel Current Output (4–20 mA) Module .............................222 
Figure 8-50—8 Ch Current Output (4–20 mA) Module Configuration ................223 
Figure 8-51—Analog Output Wiring for an 8 Channel Current Output (4–20 mA)
Module ...........................................................................................225 
Figure 8-52—Current Output ( 4–20 mA) Module Block Diagram .....................226 
Figure 8-53—8 Channel Current Output (0–1 mA) Module ...............................227 
Figure 8-54—8 Channel Voltage Output (0–5 Vdc) Module ..............................229 
Figure 8-55—8 Ch Voltage Output (0–5 Vdc) Module Configuration .................230 
Figure 8-56—Analog Output Wiring for an 8 Channel Voltage Output (0–5 Vdc)
Module ...........................................................................................232 
Figure 8-57—8 Ch Voltage Output (0–5 Vdc) Module Block Diagram ...............233 
Figure 8-58—8 Channel Voltage Output (0–10 Vdc) Module ............................234 
Figure 8-59—8 Channel TC (Fail Low) Module..................................................236 
Figure 8-60—8 Ch TC (Fail Low) Module Configuration ....................................238 
Figure 8-61—8 Ch TC Input (Fail Low) Module Field Wiring .............................239 
Figure 8-62—Thermocouple Input Block Diagram .............................................240 
Figure 8-63—8 Channel TC (Fail High) Module .................................................242 
Figure 8-64—8 Channel RTD Input Module (10 ohm) .......................................244 
Figure 8-65—8 Ch RTD Module Configuration ..................................................245 
Figure 8-66—8 Ch RTD Input Module Field Wiring............................................247 
Figure 8-67—RTD Input Block Diagram .............................................................248 
Figure 8-68—8 Channel RTD Input Module (100 ohm) .....................................250 
Figure 8-69—8 Channel RTD Input Module (200 ohm) .....................................252 
Figure 8-70—8 Channel RTD Input Module (500 ohm) .....................................254 
Figure 8-71—4 Channel MPU/Proximity Module ...............................................256 
Figure 8-72—4 Ch MPU/Proximity Module ........................................................257 
Figure 8-73—MPU and Proximity Probe Interface Wiring ..................................259 
Figure 8-74—Digital Speed Sensor Module Block Diagram ..............................260 

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Illustrations and Tables

Table 2-1—AI Redundancy Manager Truth Table .................................................7 

Table 4-1—MicroNet TMR Power Supply Requirements.....................................42 
Table 4-2—Kernel Power Supply Troubleshooting ..............................................47 
Table 4-3—MicroNet Plus Power Supply Requirements .....................................51 
Table 4-4—MicroNet Simplex Power Supply Requirements................................57 
Table 5-1—Off-line Tests .....................................................................................71 
Table 5-2—Flash Codes.......................................................................................72 
Table 5-3—On-Line Tests ....................................................................................72 
Table 5-4—Test Failure Messages ......................................................................73 
Table 5-5—Operation Errors ................................................................................73 
Table 5-6—Numbered System Errors ..................................................................74 
Table 5-7—System Alarms...................................................................................75 
Table 5-8—System Alarms...................................................................................76 
Table 5-9—Numbered System Alarms.................................................................76 
Table 6-1—Remote XCVR Module Jumpers (JPR1–4) .......................................88 
Table 7-1—LED Indications of Failure ...............................................................113 
Table 7-2—Discrete Outputs/Relay Module Configuration ................................119 
Table 7-3—LED Indications of Failure ...............................................................123 
Table 8-1—LED Indications of Failure ...............................................................142 
Table 8-2—LED Indications of Failure ...............................................................155 
Table 8-3—LED Indications of Failure ...............................................................167 
Table 8-4—Module Accuracy .............................................................................171 
Table 8-5—LED Indications of Failure ...............................................................177 
Table 8-6—LED Indications of Failure ...............................................................190 
Table 8-7—LED Indications of Failure ...............................................................203 

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Regulatory Compliance
European Compliance for CE Marking:
These listings are limited only to those units bearing the CE Marking.
EMC Directive: Declared to 89/336/EEC COUNCIL DIRECTIVE of 03
May 1989 on the approximation of the laws of the
Member States relating to electromagnetic compatibility.

Conditions for Use:

This equipment is intended to be installed in a metal cabinet or enclosure. In
TMR systems with 3 expansion racks (a 4-rack system), the installation must use
an EMC enclosure to meet RF emission requirements. An EMC enclosure may
be used any time to improve performance, however it is only required when more
than one TMR chassis and two expansion racks are used.

Low Voltage Declared to 2006/95/EC COUNCIL DIRECTIVE of 12

Directive: December 2006 on the harmonization of the laws of the
Member States relating to electrical equipment designed
for use within certain voltage limits.

Other International Compliance:

GOST-R: Certified for use in ordinary locations within the Russian
Federation per GOST-R certificates РОСС US.
US.МЛ03.В00605 and POCC US. US.МЛ03.В00606

USE IN THE RUSSIAN FEDERATION—This equipment is considered

indicator equipment and is not to be used as metrology equipment.
All measurements need to be verified using calibrated equipment.

North American Compliance:

These listings are limited only to those units bearing the UL identification.
UL: UL Listed for Class I, Division 2, Groups A, B, C, & D, or
non-hazardous locations only for use in Canada and the
United States.
UL File E156028
The 16-channel relay interface modules are suitable for
ordinary or non-hazardous locations only.

Conditions for Safe Use:

This equipment may be suitable for use in Class I, Division 2, Groups A, B, C,
and D or non-hazardous locations only. The 16-channel relay interface modules
are suitable for ordinary or non-hazardous locations only.

Wiring must be in accordance with Class I, Division 2 wiring methods and in

accordance with the authority having jurisdiction.

A fixed wiring installation is required. Grounding is required by the input PE

terminal. Ground leakage current exceeds 3.5 mA.

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EXPLOSION HAZARD—Do not connect or disconnect while circuit is

live unless area is known to be non-hazardous.

Substitution of components may impair suitability for Class I,

Division 2 applications.

Do not remove or install power supply while circuit is live unless

area is known to be non-hazardous.

Do not remove or install modules while circuit is energized unless

area is known to be non-hazardous.

RISQUE D’EXPLOSION—Ne pas raccorder ni débrancher

tant que l’installation est sous tension, sauf en cas
l’ambiance est décidément non dangereuse.

La substitution de composants peut rendre ce matériel

inacceptable pour les emplacements de Classe I,
applications Division 2.

Ne pas enlever ni installer l’alimentation électrique pendant

que le circuit est sous tension avant de s’assurer que la
zone est non dangereuse.

Ne pas enlever ni installer les cartes pendant que le circuit

est sous tension sans s’assurer que la zone non
dangereuse.

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Electrostatic Discharge Awareness

All electronic equipment is static-sensitive, some components more than others.
To protect these components from static damage, you must take special
precautions to minimize or eliminate electrostatic discharges.

Follow these precautions when working with or near the control.

1. Before doing maintenance on the electronic control, discharge the static

electricity on your body to ground by touching and holding a grounded metal
object (pipes, cabinets, equipment, etc.).

2. Avoid the build-up of static electricity on your body by not wearing clothing
made of synthetic materials. Wear cotton or cotton-blend materials as much
as possible because these do not store static electric charges as much as
synthetics.

3. Keep plastic, vinyl, and Styrofoam materials (such as plastic or Styrofoam

cups, cup holders, cigarette packages, cellophane wrappers, vinyl books or
folders, plastic bottles, and plastic ash trays) away from the control, the
modules, and the work area as much as possible.

4. Do not remove the printed circuit board (PCB) from the control cabinet
unless absolutely necessary. If you must remove the PCB from the control
cabinet, follow these precautions:

 Do not touch any part of the PCB except the edges.

 Do not touch the electrical conductors, the connectors, or the

components with conductive devices or with your hands.

 When replacing a PCB, keep the new PCB in the plastic antistatic
protective bag it comes in until you are ready to install it. Immediately
after removing the old PCB from the control cabinet, place it in the
antistatic protective bag.

To prevent damage to electronic components caused by improper

handling, read and observe the precautions in Woodward manual
82715, Guide for Handling and Protection of Electronic Controls,
Printed Circuit Boards, and Modules.

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Chapter 1.
General Information

1.1—Introduction
The MicroNet™ control is a 32-bit microprocessor-based digital controller that is
programmable for many types of applications in the control of:
 Gas Turbines
 Steam Turbines
 Hydro Turbines
 Diesel Engines
 Gas Engines

The MicroNet platform provides a flexible system to control any prime mover and
its associated processes such as high speed control functions, system
sequencing, auxiliary system control, surge control, monitoring and alarming, and
station control. The MicroNet platform is available in simplex, redundant, and
triple modular redundant (TMR) configurations. This manual covers only TMR
based control configurations. Please refer to MicroNet Plus manual 26166 for
simplex and redundant based control configurations using the MicroNet Plus
CPU. Please refer to manual 26336 for information on VxWorks Operating
System tools used with the TMR5200 CPU module.

The MicroNet Operating System, together with Woodward’s GAP™ Graphical

Application Program, produces a powerful control environment. Woodward’s
unique rate group structure ensures that control functions will execute
deterministically at rate groups defined by the application engineer. Critical
control loops can be processed within 5 milliseconds. Less critical code is
typically assigned to slower rate groups. The rate group structure prevents the
possibility of changing system dynamics by adding additional code. Control is
always deterministic and predictable.

Synchronized inputs and outputs (I/O) are available for key control signals while
distributed I/O can be used for other less critical parameters.

The MicroNet platform provides several types of communications to program and

service the control as well as to interface with other systems (Plant DCS, HMI,
etc.). Woodward’s GAP and Ladder Logic programming tools are used to
generate Application code. A service interface allows the user to view and tune
system variables. Several tools are available to provide this interface (see
Engineering and Service Access). Communication protocols such as TCP/IP,
OPC, Modbus® *, and other current designs are included so that the user can
correctly interface the control to existing or new plant level systems.
*—Modbus is a trademark of Schneider Automation Inc.

The MicroNet TMR® platform is expandable into multiple chassis as required by

the system size and will support any mix of I/O, including networked and
distributed I/O. The MicroNet TMR main control chassis is only available in one
size with 18 VME slots. All slots are dedicated to the control section. The power
supply for the MicroNet TMR main control chassis is a separate chassis which
connects to either the lower right or left of the MicroNet TMR main control
chassis. The power supply chassis contains redundant power supplies.

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The MicroNet TMR control may be expanded to a multi-chassis system using the
Plus8 or Plus14 chassis options. For field upgrades, the expansion racks may
also be the older Simplex6 or Simplex12 chassis. Each expansion chassis has
dedicated power supply, control, and I/O sections located in a single chassis.
The expansion power supply architecture supports simplex or redundant power
supplies.

Figure 1-1—MicroNet TMR System (Single Rack)

MicroNet Plus MicroNet Plus MicroNet Simplex MicroNet Simplex

14 I/O Slot Chassis 8 I/O Slot Chassis 6 I/O Slot Chassis 12 I/O Slot Chassis

Figure 1-2— Expansion Chassis Options

1.2—Specifications and Compatibility

For environmental specifications and MicroNet compatibility information, please
refer to the appropriate appendix in Volume 2 of this manual.

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Chapter 2.
MicroNet™ TMR Systems

2.1—MicroNet TMR
The TMR Main chassis provides slots for kernel power supplies, CPU’s, and twelve
I/O Modules. This is the basis of the TMR systems whether using the TMR5200
processor or the TMR040 processor. NOTE: Kernel PS modules must be matched
to the type of CPU being used. The system may be expanded to 3 I/O chassis
using RTN networks with the TMR5200 processors. With the RTN each CPU has
access to the I/O so I/O in the expansion chassis is considered Shared I/O.

With the TMR040 processors, Transceiver modules and copper or fiber cables are
used to connect to multiple chassis to accommodate additional system I/O
requirements. In this case, I/O is dedicated to a specific CPU.

2.1.1—MicroNet TMR Main Chassis

In the MicroNet TMR Main Chassis, whether the TMR040 or TMR5200 CPUs are
used, the I/O modules are associated with a particular Kernel. If that Kernel fails,
the associated I/O modules are failed.

MicroNet TMR

 MicroNet TMR Chassis

 3 Kernel Power Supplies
 3 TMR CPU Modules
 4 I/O modules slots per Kernel
 Expandable to a 4-rack system.

2.1.2—MicroNet TMR Power Supply Chassis

The MicroNet TMR Power Supply Chassis, contains two redundant TMR power
supply modules. Power supply modules come in low voltage DC, AC/DC, and
high voltage AC/DC versions. Each module supplies power to the Kernel PS
Modules.

MicroNet TMR Power Supply Chassis

 1 or 2 TMR Power Supply Chassis can be configured.

 (2) Redundant PS Modules per Chassis
 PS Modules are load sharing
 3 Module versions available
 Low voltage DC
 120 VAC / VDC
 220VAC/VDC

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2.1.3 MicroNet TMR5200 Expansion Chassis

With the TMR5200 systems, connection to up to 3 Expansion chassis is
accomplished through Real Time Networks (RTNs) associated with each Kernel.
There are 3 RTN networks. The TMR5200 system supports the MicroNet Plus 8
or 14 chassis and MicroNet Simplex 6 or 12 chassis. The MicroNet Plus 8 or 14
chassis can have either 1 or 2 RTN modules. The MicroNet 6 or 12 chassis only
have 1 RTN module. The I/O in the Expansion Chassis is not associated with a
specific Kernel and is considered “shared” I/O. The failure of any Kernel does not
affect the ability for the other CPUs to access the I/O.

2.1.4—MicroNet TMR040 Expansion Chassis

With the TMR040 systems, each Kernel can be connected to up to 15 Expansion
I/O Chassis via Transceiver (XCVR) modules. The TMR040 system supports the
MicroNet 6 or 12 chassis. Refer to Chapters 6-2 through 6-4 for detailed
information on the use of XCVR modules. Each expansion chassis is associated
with a particular Kernel. If that Kernel fails, the associated I/O modules local and
expansion are failed.

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2.1.5—TMR CPU Theory

The basis of this control’s fault tolerance architecture is to detect control related
faults, annunciate these faults, and allow on-line service/replacement of modules
and/or transducers to correct these faults. A CPU fault tolerance logic of 3-2-0
allows the control to function normally with any CPU module failed or removed. A
power supply fault tolerance logic of 2-1-0 allows the control to function normally
with any one power supply failed or removed. I/O Fault tolerance can be
customized to meet the application reliability requirements. This is discussed in
more detail later.

In the TMR Main Chassis, three isolated kernel sections (A, B & C) each house a
Kernel Power Supply module, CPU module, and have 4 VME slots for I/O
modules. A single motherboard supplies nine electrically isolated data paths.
Each CPU has a data path to its VME modules and two separate data paths, one
to each of the other CPU modules. There is a total of six paths between CPUs
allowing for redundancy and error checking.

Each CPU module runs the identical software application as the other two. All
inputs from each kernel are distributed to the other two kernels. Each CPU then
compares the value it read, with the value the other two CPUs read, before
outputting a signal to the application software. Depending on the configuration, a
total of nine values for the same input parameter could be used in the voting logic
to provide the best signal to the application software. Even if a data value has
been corrupted along any one of the data paths shown in Figure 2-1, all CPUs
use the same correct data for their application calculations. All CPUs use the
same voted input signals in the same application calculations to generate the
same outputs.

Figure 2-1—Double Exchange and Vote Structure

All output values are exchanged between kernels, the results are voted and the
appropriate value is output from each kernel. Since the system can handle
significant single errors, even multiple errors may not shutdown a kernel section.
In the event of consistent errors from one of the kernel section, an alarm will be
annunciated and that particular kernel will be shut down.

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2.1.6—TMR Inputs and Outputs

In a full TMR application, I/O modules are also triplicated. Each Kernel would have
the same module and any expansion chassis would be triplicated. Specific TMR
I/O Modules and Field Terminal Modules (FTMs) are designed for this sort of
application. Inputs from a single field source are fanned out to 3 channels in 3
different I/O modules. After the control’s kernels double exchange their input
values, and vote out any erroneous values, the Application Software
Redundancy Manager then compares each kernel’s voted result to select a value
to be used within the application logic. Analog Outputs are summed together so
that up to two failures can be tolerated with no loss of output functionality. Relay
outputs are managed by fault tolerant relays.

Depending on the application, Critical field devices may also be replicated or

triplicated. In some cases more than 3 devices may be used. Application software
must be defined to manage this different configurations but specific Redundancy
Management software has been designed to address the most common cases.

Analog Input Example

Each analog input can withstand up to two failures with no loss of control
functionality. If any two of an analog input’s three “legs” are failed, the control
uses the third healthy leg’s sensed input signal to control with.

All analog inputs are connected to the control via a TMR FTM. An input’s
termination module is used to terminate customer control wiring and distribute
each input signal to all three kernels. After the control’s kernels double exchange
their input values and vote out any erroneous values, the Application Software
Redundancy Manager then compares each kernel’s voted result to select a value
to be used within the application logic. Figure 2-2 is a graphical view of a
control’s input architecture. Table 2-1 displays the redundancy manager’s input
selection logic for each possible input condition.

An analog input signal is determined to be faulty when the I/O Module or I/O
Channel fails or when it is below its “Fail Low Value” setting, or above its “Fail
High Value” setting. For a 4–20 mA input, these high and low failure level
settings typically correspond to 2 mA and 22 mA respectively. If an input is
determined to be failed, that input is removed from the control’s voting logic.

Input deviation alarms are used to annunciate if any of the input channels or
input legs are sensing a value that is different than the voted-good value used by
the application. If an input channel’s sensed value deviates from the voted-good
value, by a greater margin than its “Max Deviation” setting, an input channel
alarm will be issued. This type of annunciation can be used to indicate when an
input channel, or system transducer is going out of calibration. Max Deviation
settings are typically defaulted to 1% (deviation range = 0.1 to 10%) of the
configured input range. If a deviation alarm condition occurs, the alarmed input is
not removed from the control’s voting logic, and still can be used to control with,
in case all other channels fail.

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Figure 2-2—Fault Tolerant Analog Input

Table 2-1—AI Redundancy Manager Truth Table

Discrete Input Example

Each discrete input can withstand up to two failures with no loss of control
functionality. If any two of a discrete input’s three “legs” fail, the control uses the
third healthy leg’s sensed input signal to control with.

All discrete inputs are connected to the control via discrete termination modules
(DTMs). A DTM is used to terminate customer control wiring and distribute each
input signal to all three kernels. After the control’s kernels double exchange their
input values and vote out any erroneous inputs, the Application Software
Redundancy Manager then compares each kernel’s voted result to select a value
to be used within the application logic. Figure 2-3 is a graphical view of the
control’s discrete input architecture.

Figure 2-3—Fault Tolerant Discrete Input

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MicroNet TMR Manual 26167V1
A discrete input signal is determined to be faulty when the I/O Module or I/O
Channel fails or when it is determined to be different then the voted-good value
used by the application. If an input is determined to be faulty, the input is
removed from the control’s voting logic and an input channel alarm is issued.
Once the input fault is corrected the alarm condition can be reset by issuing a
control “Reset” command.

A-Fault B-Fault C_Fault Output of Block (Application Input)

FALSE FALSE FALSE 2 out of 3
FALSE FALSE TRUE A OR B
FALSE TRUE FALSE A OR C
FALSE TRUE TRUE A
TRUE FALSE FALSE B OR C
TRUE FALSE TRUE B
TRUE TRUE FALSE C
TRUE TRUE TRUE FALSE
Table 2-2. DI Redundancy Manager Truth Table

Readouts (Analog Outputs)

Each control readout can withstand up to two failures with no loss of output
functionality. Any leg of an output channel can drive a readout’s full 4–20 mA
current signal. Each CPU generates an analog output command using a
Redundancy manager and known good output channels. The analog output
commands are voted between the CPUs and the voted value is sent to the
respective output channel.

Precision resistors are used in each channel’s readback circuitry to measure and
verify the health of each output “leg”. If a fault condition is detected, the faulty
output leg is disabled, and the Redundancy Manager redistributes the output
signal to the remaining legs. In a case where two failures are experienced at the
same time within different legs, the single good channel (leg) will drive the entire
output. Figure 2-4 shows a Fault Tolerant Analog Output’s architecture. The
TMR Field Termination Module (FTM) combines each analog output signal from
all three kernels into one signal at the FTM’s terminal blocks.

Typically, an output is considered failed, and an alarm issued, when the I/O
Module or I/O Channel fails or if a channel’s combined output or any leg of the
output measures a difference of more than 10% from the output demand.

With this output architecture, any single output driver failure results in the output
signal only stepping to 66.66% of its original value. The time between when a
failure is sensed and when the control corrects for it by redistributing current
through the other drivers depends on the application software scheduling and the
I/O module response but can be as fast as 5 ms.

Upon the correction of an output failure, and a “Control Reset” command, each
failed output performs a continuity check though the its external load before
current is again redistributed evenly between all output drivers. This continuity
check outputs a small amount of current through the failed driver’s output load
and compares that value to the readback value.

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Manual 26167V1 MicroNet TMR

Figure 2-4—Fault Tolerant Analog Output

Actuator Outputs
Each actuator output can withstand up to two failures with no loss of output
functionality. Any leg of an output channel can drive an output’s full current signal
(4–20 mA or 20–160 mA). Each CPU generates an analog output command
using a Redundancy manager and known good output channels. The analog
output commands are voted between the CPUs and the voted value is sent to the
respective output channel.

Precision resistors are used in each channel’s readback circuitry to measure and
verify the health of each output “leg”. If a fault condition is detected, the faulty
output leg is disabled, and the Redundancy Manager redistributes the output
signal to the remaining legs. In a case where two failures are experienced at the
same time within different legs, the lone good channel (leg) will drive the entire
output. Figures 2-6 and 2-7 show a Fault Tolerant Actuator Output’s architecture.
The TMR Field Termination Module (FTM) combines each actuator output signal
from all three kernels into one signal at the FTM’s terminal blocks.

An output is considered failed, and an alarm issued, when the I/O Module or I/O
Channel fails or if a channel’s combined output or any leg of the output measures
a difference of more than 10% from the output demand.

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Actuator outputs are treated the same way as the other analog outputs, with the
exception of a an added precision resistor in the actuator output’s return path.
This resistor is used to measure and detect ground loops and coil shortages that
are possible when interfacing to an actuator. If a single coil actuator is being
driven, the dual coil terminal blocks are jumpered (wired) to the single coil
terminal blocks and the redundancy manager shares the current equally between
all three kernels. In the event of a fault, the Redundancy Manager will redistribute
the load.

If the actuator connected to is a dual coil actuator, the Redundancy Manager

shares half the current evenly between Kernels A & B outputs, and the other half
comes from the Kernel C output. In the event of a fault, the Redundancy
Manager redistributes load current.

With this output architecture, any single output driver failure results in the output
signal only stepping to 66.66% of its original value (possibly 50% for dual coil
applications). The time between when a failure is sensed and when the control
corrects for it by redistributing current through the other drivers depends on the
application software scheduling and the I/O module response but can be as fast
as 5 ms.

Upon the correction of an output failure, and a “Control Reset” command, each
failed output performs a continuity check though the actuator before current is
again redistributed evenly between all output drivers. This continuity check
outputs a small amount of current through the failed driver’s output load and
compares that value to the readback value.

Figure 2-5—Fault Tolerant Single Coil Actuator Output

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Figure 2-6—Fault Tolerant Dual Coil Actuator Output

Relay Outputs
A six relay configuration is used to form each fault tolerant relay output. When a
relay output is closed, the contacts of all six relays are closed. Because of the
series-parallel configuration that the relays are in, the failure of any individual
relay will not cause the output to be open. This series-parallel configuration also
allows any single relay of the six relay configuration to be removed and replaced
“on-line” with no affect on the state of the fault tolerant relay output.

When a relay output is open, the contacts of all six relays are open. Because of
the series-parallel configuration that the relays are in, the failure or removal of
any one relay will not cause the output to be closed. The relay output would
continue to be open.

Since this control’s fault tolerant architecture can tolerate a single fault, it is
possible for this fault to go undetected. This is called a latent fault. If a second
fault occurs while a latent fault exists, the state of the fault tolerant relay output
may be affected, possibly resulting in a shutdown condition. This is why it is
important to detect and annunciate latent faults in a fault tolerant system.

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Latent fault detection is provided with this control to detect any relay related
failure without effecting the state of the overall relay output. Each individual relay
output can be configured to use or not use latent fault detection. A latent fault
detection test is performed periodically or on command. The period of time
between tests can be set from 1 to 3000 hours.

A relay output is tested by cycling the output’s individual relays closed then open
(or vice-versa depending on the output state), to ensure that they are in the
correct state, and that they can change state. Position readback circuitry allows
the state of each relay contact to be detected. Any failures are annunciated, and
further testing is disabled without affecting the state of the relay output contact or
control operation.

Each fault tolerant relay configuration consists of 6 relays, driven by two discrete
outputs from each kernel (as shown in Figure 2-7). The relays are configured in
three legs of two relays each. Customer circuit power is connected to one side of
the resulting configuration, and customer load to the other side. Field selectable
jumpers, located on system FTMs, are provided to allow each output’s latent fault
detection logic to be compatible with the circuit being interfaced to. Latent fault
detection is used to monitor the actual contact positions of each of the six relays,
and to momentarily change states of each relay one at a time. This verifies each
relay’s “normally open” or “normally closed” contacts.

DTM
PW CIRCUIT
POWER
DISCRETE A1 B2 C2
MOD−A

DISCRETE
MOD−B B1 C1 A2
NO
DISCRETE
MOD−C LOAD

CM
A1 A2 B1 B2 C1 C2
A A B B C C
855−663
02−12−31

Figure 2-7—Fault Tolerant Discrete Output

Latent fault detection (LFD) is not usable with all applications or circuits. The
control’s LFD logic can only work with circuits using voltages between 18–32
Vdc, 100–150 Vdc, or 88–132 Vac. For latent fault detection to work, a small
leakage current is passed through the circuit’s load. Depending on the size of the
load, the leakage current may be enough to cause a load to be on or active,
when a relay contact is open. In this case, the individual relay’s latent fault
detection logic may be disabled, eliminating the leakage current, or a shunt
resister can be used across the load to reduce the leakage current.

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2.1.7—Simplex Inputs and Outputs

The TMR system can also use Simplex I/O modules and FTMs. Typically these are
used for non-critical signals although different levels of redundant and even TMR
configurations can be supported with the correct application software and the
correct selection and distribution of module and signals. Systems can consist of a
hybrid of TMR I/O and Simplex I/O.

Each I/O module has connectors on the faceplate. For analog and discrete I/O,
cables connect the module to a Field Terminal module (FTM). The FTM is used to
connect to the field wiring. For communication modules, FTMs are not used.
Cables are connected directly to the faceplate of the communications module. The
following diagram shows the flow of analog and discrete inputs from the field to the
application.

Figure 2-8—Input Flow

Figure 2-9—Output Flow

Redundant Input Examples

Two levels of redundancy are available. The first involves wiring two external input
devices to two separate input channels. See Figure 2-10. In the event of a failed
sensor or a failure in the connection from the sensor to the control, a valid input is
still available

Figure 2-10—Redundant Sensors

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The second level is wiring two external input devices to two separate I/O modules.
See Figure 2-11. In the event of a failure in one of the sensors, connections,
cables, FTMs, or I/ O modules, a valid input is still available.

Figure 2-11—Redundant Inputs

Redundant Output Examples

Redundancy can be added to the outputs as well. Additional external relays can be
used to prevent a faulted output from affecting the external device. For discrete
outputs, this would require four relays for each output. For the actuator outputs, a
dual coil actuator can be used. The dual coils will allow one coil to operate the
actuator in the event of a failure.

The value of redundancy is dependent on the ability of the application to detect the
failure. For analog and actuator outputs, current and/or voltage readback is
provided. For discrete outputs, fault detection requires sensing the relay contact
state.

2.2—MicroNet TMR Operation

2.2.1 Theory of Operation
MicroNet TMR systems are designed for 3-2-0 operation. Thus, to start a system,
at least 2 CPUs must be started with the same application. If the CPUs are started
individually, the first CPU will wait forever for a second CPU and 2 CPUs will wait
up to 10 seconds for the 3rd CPU. If the 3rd CPU does not join the 2 CPUs within
the 10 seconds the 2 CPUs will continue with only 2. NOTE: CPUs starting
together must have both the same application and same EE values (stored
tunables) to synchronize. If two CPUs are synchronized, a third CPU must have
the same application but it will copy EE values from the running CPUs.

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2.2.2 Loading Applications and Starting CPUs.

TMR5200
 Load and start the application on each CPU using AppManager.
 If the Control is given a CTRL_ID in the SYS_INFO block of the application
software, AppManager can interface with the three CPUs as one system.
 AppManager can be used to start the three CPUs together.
 Once an application has started, Auto-start will be set. The CPU will
automatically start on CPU initialization (whether from a power up or from a
reset).

TMR040
 Load the application on each CPU using a PCMCIA card or Ethernet module.
 The application will start once it has been loaded.
 After an application has been loaded, the CPU will automatically start on CPU
initialization when the Reset switch is toggled.

2.3—Module Replacement
TMR systems are designed to allow replacement of modules while running (hot-
swap). This is a key to maintaining the high level of availability for critical
applications. The hardware is fully capable of supporting hot-swap but care must
be taken in the application software design to ensure that a module hot-swap does
not adversely affect the application.

Chapter 14 contains installation procedures and Chapter 15 contains replacement

procedures for VME Modules, power supplies, relay boxes, and other devices.
Individual CPU and I/O module sections in Chapters 6 through 9 are an additional
reference for installation and replacement information.

Chapter 4 contains additional details for power supply installation and replacement.
Note that power must be removed from the power supply input before a module is
removed or inserted.

Live insertion and removal of the TMR5200 and Remote RTN

modules is allowed in a MicroNet TMR or Plus chassis. These
modules should be reset immediately before removing them from the
RESET chassis. This notifies the module that it will be removed and provides
! MODULE a graceful CPU shutdown or failover to another healthy Remote RTN
BEFORE REMOVAL module if available.

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2.4—Latent Fault Detection

Because a TMR system can tolerate single faults, it is possible for a fault to go
undetected. Undetected faults are termed latent faults. If another fault occurs when
a latent fault exists, the second fault could cause a shutdown. It is important to
detect a latent fault in a TMR system so that it may be repaired before another fault
occurs. For single, redundant, or TMR I/O points, fault detection is dependent on
the application software to detect its I/O faults.

Example of MicroNet TMR5200 fault information available from the

TCHAS_STATstatus block.

ALM: This output displays the status of the Kernels alarms. A true
indicates that the Kernel has an alarm.

ALM_NO: This output displays the Kernels Alarm number. See the
GAP help manual for a list of valid alarms.

CPU_X_FLT: This output displays the status of Kernel "X". A true

indicates that Kernel "X" has failed.

MFT_X_FLT: This output displays the status of the Kernel "X"

MFT(Minor Frame Timer). A true indicates that the Kernel "X"
MFT has failed.

PS1_FAIL: This output field goes true when a fault on the MAIN
TMR #1 Power Supply is detected.

PS2_FAIL: This output field goes true when a fault on the MAIN
TMR #2 Power Supply is detected.

TEMP_ALARM: This output field goes true when a high

temperature is detected in the chassis.

Figure 2-12—TCHAS_STAT Block

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Example of MicroNet TMR040 fault information available from the SYS_INFO
block.

SYS_ALM: The System Alarm Boolean will be set true any time
the operating system detects an alarm. This should be used in your
application for alarm indications.

SYS_FLT: The System Fault Boolean will be set true any time the
operating system detects a critical fault. It will cause an I/O lock to
be asserted.

PS_1_FLT: The Power Supply 1 Boolean will be set true when any
of the outputs from Power Supply 1 fail.

PS_2_FLT: The Power Supply 2 Boolean will be set true when any
of the outputs from Power Supply 2 fail.

FAN_ALM: The Aux. Fans Are Running Boolean will be set true
when the chassis exceeds a preset temperature and the second rack
of fans are on.

TEMP_ALM_x: Temperature alarm for Kernel A, B, or C. This

output is directly from a fan temperature switch which will trip at
60.0 °C. Only applicable to the MicroNet and MicroNet TMR
chassis.

A_FAULT: The CPU A Fault Boolean will be set true when CPU
A is not in sync. In a simplex system, A_FAULT, B_FAULT, and
C_FAULT are false.

B_FAULT: The CPU B Fault Boolean will be set true when CPU
B is not in sync. In a simplex system, A_FAULT, B_FAULT, and
C_FAULT are false.

C_FAULT: The CPU C Fault Boolean will be set true when CPU
C is not in sync. In a simplex system, A_FAULT, B_FAULT, and
C_FAULT are false.

Figure 2-13—SYS_INFO Block

Woodward 17
MicroNet TMR Manual 26167V1

Chapter 3.
Chassis Configurations

3.1—TMR Main Chassis

This chassis contains eighteen slots for kernel power supplies, CPU’s, and I/O
modules. Normally, this allows three kernel power supplies, three CPUs, and
twelve I/O modules. The power supply module will connect to either the lower
right or left of the chassis.

If an I/O module slot is not occupied, it must be filled with a blanking plate
(3799-301) to maintain proper cooling flow through the chassis.

Figure 3-1—MicroNet TMR® Main Chassis

3.1.1—Specification
The MicroNet™ control is designed around a modular six slot chassis (block).
Each block consists of a premolded cage with a fan for cooling and a
temperature switch for high temperature detection. The chassis are cooled by
forced air, and either a module or a module blank must be installed in every slot
to maintain correct air flow. The fans run whenever power is applied to the
system.

The eighteen-slot MicroNet TMR control chassis is composed of three blocks

with a motherboard inserted in the back of the assembly to make connections
between the fans, switches, power supply chassis, and all three kernels. See
Figure 3-2. The modules use the VERSAmodule Eurocard (VME) bus standard
for connector specification and data transfer. Kernel-to-kernel and slot-to-slot
logic and power connections are made through an etched-circuit motherboard.
I/O connections are made through cables from the front of the boards to field
termination modules (FTM’s) in the cabinet.

18 Woodward
Manual 26167V1 MicroNet TMR

From a module connector standpoint, any I/O module can be installed in any of
the slots designated for I/O modules. However, when the application software is
designed, each module will be assigned to a specific slot and thereafter, the
software will expect that specific I/O module to always be in its designated slot.

Chassis Outline Drawing

The MicroNet TMR dimensions are shown below.

Figure 3-2—Outline Drawing of MicroNet TMR Main Chassis

Woodward 19
MicroNet TMR Manual 26167V1

3.1.2—Installation
Figure 3-3 shows the mounting template and fasteners to bulkhead mount the
chassis. Rack mounting is not recommended. For proper airflow, the installation
should allow a 3” air gap above and below the chassis.

Figure 3-3—Mounting Template of MicroNet TMR Main Chassis

20 Woodward
Manual 26167V1 MicroNet TMR

3.2—Expansion MicroNet Plus 8-Slot I/O

Figure 3-4—MicroNet Plus 8-Slot I/O Chassis

The MicroNet Plus 8-slot chassis offers redundant RTN capability and more I/O
slots than the MicroNet 6, as well as improvements in airflow and overall system
reliability.

Features:
 A total of 8 RTN and I/O slots are available for use
 A new 2-slot wide, redundant, load sharing power supply is used
 Redundant Smart fans are used for early notification of fan-failure
 Chassis temperature switches exist on the motherboard and trip at
+65 °C
 Redundant, hot-swappable RTN s are supported

3.2.1—Specification
The MicroNet is designed around a modular 6-slot chassis (block). Each block
consists of a premolded cage with a fan for cooling and a temperature switch for
high temperature detection. The chassis are cooled by forced air, and either a
module or a module blank must be installed in every slot to maintain correct air
flow. The fans run whenever power is applied to the system.

Woodward 21
MicroNet TMR Manual 26167V1
The MicroNet Plus 8-slot chassis is composed of two blocks with a motherboard
inserted in the back of the assembly to make connections between the fans,
switches, power supplies, and control modules. See Figure 3-5. The modules
use the VERSAmodule Eurocard (VME) bus standard for connector specification
and data transfer. Slot-to-slot logic and power connections are made through an
etched-circuit motherboard. I/O connections are made through cables from the
front of the modules to field termination modules (FTM’s) the cabinet.

From a module connector standpoint, any I/O module can be installed in any of
the slots designated for I/O modules. However, when the application software is
designed, each module will be assigned to a specific slot and thereafter, the
software will expect that specific I/O module to always be in its designated slot.

Figure 3-5—MicroNet Plus 8-Slot Chassis

RTN Slots (A1, A8)

Chassis slots A1 and A8 are designated as RTN compatible slots. These slots
provide extra functionality for monitoring fan status, chassis temperature status,
and power supply status information. The RTN slots also support operation of
Redundant RTNs and the associated RTN Failover functions. The RTN slots are
identical except for slot address, thus a RTN can be installed in either one to
control the MicroNet system.

 For simplex systems, RTN slot A8 can also be used as an I/O module slot.
 Live Insertion and removal is supported for field repairability.
 RTNs are located under different fan sets to improve reliability, airflow, and
temperature performance.
 RTN slots use VME-64 connectors on the RTN module slots for improved
RTN HotSwap capabilities.

Power Supply Slots (PS1, PS2)

A smaller 2-slot wide power supply has been designed for the MicroNet Plus
chassis, thus allowing (2) more slots for I/O. Each power supply is located under
different fan sets for improved reliability. The redundant smart fans are located
above and below each power-supply for improved airflow. Each power supply
provides input failure (AC_FAIL) and output failure (PWR_ALM) fault information
to the RTN slots.

22 Woodward
Manual 26167V1 MicroNet TMR
 Power supplies are located under different fan sets to improve reliability,
airflow, and temperature performance.
 Three different 2-slot wide power supplies are available for use: a low
voltage (24 Vdc input), a high voltage (120 Vac/dc input), and a high voltage
220 Vac input version. Refer to the power-supply section for additional
information.

Redundant Smart Fans

Each smart-fan provides a tachometer output to the RTN slots. The RTN
monitors the fans for slow operation or fan-failure. A GAP application fault is
provided for each fan (See GAP help for CHAS_STAT block). Quick-connect
FAN connectors are utilized for improved field replacement. The motherboard
provides individual, short-circuit protected, +24 V Fan power to each fan.

Motherboard Terminal Block (TB1)

The MicroNet Plus chassis includes a terminal block that provides RTN1 and
RTN2 Remote reset inputs. The same terminal block provides access to +24 Vdc
motherboard power (3 terminals) through two separate 5 A fuses. If a direct short
of this power output occurs, the fuses will blow to protect the motherboard, and
the power supplies will shut down with a 24 Vdc power fault. Replacement fuses
can be ordered as Woodward P/N 1641-1004. The system must be shut down to
replace the fuses safely.

24 Vdc Motherboard Power

 TMR & Redundant systems—Not recommended for use.
 Simplex systems—This power may be used for local Ethernet switch
power. Consider carefully the possibility of shorts and the type of connector
wiring used.

The Motherboard +24 Vdc power outputs should be used locally in

the same MicroNet cabinet only in rare instances, as the quality of
this supply is critical to proper system operation.

RTN Remote Reset Inputs (RST1, RST2)

Each RTN may be reset by either using the front-panel reset button or a remote-
reset input provided on the motherboard. The remote-reset inputs are available
at the TB1 terminal block located at the bottom center of the chassis. The
individual remote resets for each RTN are designated RST1+, RST1– for slot A1
and RST2+, RST2– for slot A8. These inputs are optically isolated on each
respective RTN module and require both a 24 V(+) and a common(-) to be wired.
A momentary high will cause a RTN-reset.

Chassis Overtemp Alarm

The MicroNet Plus 8-slot chassis provides (2) over-temperature switches on the
motherboard. The over-temperature switches will trip at 65C  3C and
communicate this warning to the RTN and GAP application.

Chassis Outline Drawing

The MicroNet Plus 8-slot chassis is physically the same dimensions as the
MicroNet Simplex 6-slot chassis.

Woodward 23
Micro
oNet TMR Manual 26167V1

Figure 3-6—Outline Drawing

D of MicroNet Plus 8-Slot
8 Chassis

3.2.2
2—Installattion
Figure
e 3-7 shows the
t mounting template and d fasteners to bulkhead mo ount the
chasssis. Rack mou unting is not recommended
d. For proper airflow, the in
nstallation
shouldd allow a 3” air
a gap above and below thhe chassis.

Figure 3-7—
—Mounting Te
emplate of MiccroNet Plus 8-Slot
8 I/O Cha
assis

24 Woodward
Manual 26167V1 MicroNet TMR

3.3—Expansion MicroNet Plus 14-Slot I/O

Figure 3-8—MicroNet Plus 14-Slot I/O Chassis

The MicroNet Plus 14-slot chassis offers redundant RTN capability and more I/O
slots, as well as improvements in airflow and overall system reliability.

Features:
 A total of (14) RTN and I/O slots are available for use
 A new 2-slot wide, redundant, load sharing power supply is used
 Redundant Smart fans are used for early notification of fan failure
 Chassis temperature switches exist on the motherboard and trip at +65 °C
 Redundant, hot-swappable RTNs are supported

3.3.1—Specification
The MicroNet is designed around a modular 6-slot chassis (block). Each block
consists of a premolded cage with a fan for cooling and a temperature switch for
high temperature detection. The chassis are cooled by forced air, and either a
module or a module blank must be installed in every slot to maintain correct air
flow. The fans run whenever power is applied to the system.

Woodward 25
MicroNet TMR Manual 26167V1
The MicroNet Plus chassis is composed of three blocks with a motherboard
inserted in the back of the assembly to make connections between the fans,
switches, power supplies, and control modules. See Figure 3-8. The modules
use the VERSAmodule Eurocard (VME) bus standard for connector specification
and data transfer. Slot-to-slot logic and power connections are made through an
etched-circuit motherboard. I/O connections are made through cables from the
front of the modules to field termination modules (FTM’s) the cabinet.

From a module connector standpoint, any I/O module can be installed in any of
the slots designated for I/O modules. However, when the application software is
designed, each module will be assigned to a specific slot and thereafter, the
software will expect that specific I/O module to always be in its designated slot.

Figure 3-9—MicroNet Plus 14-Slot Chassis

RTN Slots (A1, A14)

Chassis slots A1 and A14 are designated as RTN compatible slots. These slots
provide extra functionality for monitoring fan status, chassis temperature status,
and power supply status information. The RTN slots also support operation of
Redundant RTNs and the associated RTN Failover functions. The RTN slots are
identical except for slot address, thus a RTN can be installed in either one to
control the MicroNet system.

 For simplex systems, RTN slot A14 can also be used as an I/O module slot.
 Live Insertion and removal is supported for field repairability.
 RTNs are located under different fan sets to improve reliability, airflow, and
temperature performance.
 RTN slots use VME-64 connectors on the RTN module slots for improved
RTN HotSwap capabilities.

Power Supply Slots (PS1, PS2)

A smaller 2-slot wide power supply has been designed for the MicroNet Plus
chassis, thus allowing (2) more slots for I/O. Each power supply is located under
different fan sets for improved reliability. The redundant smart fans are located
above and below each power-supply for improved airflow. Each power supply
provides input failure (AC_FAIL) and output failure (PWR_ALM) fault information
to the RTN slots.

26 Woodward
Manual 26167V1 MicroNet TMR
 Power supplies are located under different fan sets to improve reliability,
airflow, and temperature performance.
 Three different 2-slot wide power supplies are available for use: a low
voltage (24 Vdc input), a high voltage (120 Vac/dc input), and a high voltage
220 Vac input version. Refer to the power-supply section for additional
information.

Redundant Smart Fans

Each smart-fan provides a tachometer output to the RTN slots. The RTN
monitors the fans for slow operation or fan-failure. A GAP application fault is
provided for each fan. Quick-connect FAN connectors are utilized for improved
field replacement. The motherboard provides individual, short-circuit protected,
+24 V Fan power to each fan.

Motherboard Terminal Block (TB1)

The MicroNet Plus chassis includes a terminal block that provides RTN1 and
RTN2 Remote reset inputs. The same terminal block provides access to +24 Vdc
motherboard power (3 terminals) through two separate 5 A fuses. If a direct short
of this power output occurs, the fuses will blow to protect the motherboard, and
the power supplies will shut down with a 24 Vdc power fault. Replacement fuses
can be ordered as Woodward P/N 1641-1004. The system must be shut down to
replace the fuses safely.

24 Vdc Motherboard Power

 TMR & Redundant systems—Not recommended for use.
 Simplex systems—This power may be used for local Ethernet switch
power. Consider carefully the possibility of shorts and the type of connector
wiring used.

The Motherboard +24 Vdc power outputs should be used locally in

the same MicroNet cabinet only in rare instances, as the quality of
this supply is critical to proper system operation.

RTN Remote Reset Inputs (RST1, RST2)

Each RTN may be reset by either using the front-panel reset button or a remote-
reset input provided on the motherboard. The remote-reset inputs are available
at the TB1 terminal block located at the bottom center of the chassis. The
individual remote resets for each RTN are designated RST1+, RST1– for slot A1
and RST2+, RST2– for slot A14. These inputs are optically isolated on each
respective RTN module and require both a 24 V(+) and a common(-) to be wired.
A momentary high will cause a RTN-reset.

Chassis Overtemp Alarm

The MicroNet Plus chassis provides (3) over-temperature switches on the
motherboard. The over-temperature switches will trip at 65C  3 C and
communicate this warning to the RTN and GAP application.

Chassis Outline Drawing

The MicroNet Plus 14-slot chassis is physically the same dimensions as the
MicroNet Simplex 12-slot chassis.

Woodward 27
MicroNet TMR Manual 26167V1

Figure 3-10—Outline Drawing of MicroNet Plus Chassis

28 Woodward
Manual 26
6167V1 M
MicroNet TMR

3.3.2—Installation
Fig
gure 3-11 sho
ows the moun nting template
e and fastene
ers to bulkhea ad mount the
ch
hassis. Rack mounting
m is not recommen nded. For propper airflow, th
he installation
sh
hould allow a 3”
3 air gap aboove and beloww the chassiss.

Figure 3-1
11—Mounting
g Template off MicroNet Plu
us 14-Slot I/O
O Chassis

3..4—Expansion MicroNet Simplex 6--Slot I/O

Th
his chassis coontains six slo
ots for remotee transceiver and
a I/O modu ules. This
allows one Rem mote XCVR or RTN module O modules, redundant RTN
e and five I/O Ns
aree not allowed
d. In addition to
t the six I/O slots, two powwer supply po ositions are
proovided, which
h allows for re
edundant pow wer input. Eacch power supp ply module
oc
ccupies three slots of chasssis space. Th he total width of the chassiss is therefore
tw de, when counting both power supply an
welve slots wid nd I/O slots.

If a power supp dule slot is not occupied, it must be filled

ply or I/O mod d with a
blaanking plate (3799-301)
( to
o maintain prooper cooling fllow through thhe chassis.

The 6 slott expansion chassis

c shou
uld not be ussed for new
applicatioons. The 6 slo
ot expansionn chassis shoould only be e used in
retrofit sittuations whe
ere the chass
sis is already
y installed.

Woodward
d 2
29
MicroNet TMR Manual 26167V1

Figure 3-12—Simplex MicroNet Six Slot I/O

3.4.1—Specification
The MicroNet control is designed around a modular six slot chassis (block). Each
block consists of a premolded cage with a fan for cooling and a temperature
switch for high temperature detection. The chassis are cooled by forced air, and
either a module or a module blank must be installed in every slot to maintain
correct air flow. The fans run whenever power is applied to the system.

The six slot MicroNet expansion chassis is composed of two blocks with a
motherboard inserted in the back of the assembly to make connections between
the fans, switches, power supplies, and control modules. See Figure 3-13. The
modules use the VERSAmodule Eurocard (VME) bus standard for connector
specification and data transfer. Slot-to-slot logic and power connections are
made through an etched-circuit motherboard. I/O connections are made through
cables from the front of the modules to field termination modules (FTM’s) in the
cabinet.

From a module connector standpoint, any I/O module can be installed in any of
the slots designated for I/O modules. However, when the application software is
designed, each module will be assigned to a specific slot and thereafter, the
software will expect that specific I/O module to always be in its designated slot.

30 Woodward
Manual 26167V1 MicroNet TMR

Figure 3-13—Outline Drawing of MicroNet Six Slot I/O

Woodward 31
Micro
oNet TMR Manual 26167V1

3.4.2
2—Installation
e 3-14 shows
Figure s the mounting g template an
nd fasteners to bulkhead mount
m the
chasssis. Rack mou unting is not recommended d. For proper airflow, the in
nstallation
shouldd allow a 3” air
a gap above and below th he chassis.

Figure 3-1
14—Mounting
g Template off MicroNet 6 Slot
S I/O Chasssis

3.5—
—Expans
sion Micro
oNet Sim
mplex 12-S
Slot I/O
3.5.1—Descrription
This chassis
c contaains twelve slo
ots for remotee transceiver and
a I/O (inputt/output)
moduules. This allowws one Remo ove XCVR or RTN module and eleven I/O
moduules, redundan nt RTN modu ules are not alllowed. In add dition to the 12
XCVR R/RTN – I/O slots,
s wer supply positions are provided, which
two pow h allows for
redun
ndant power in nput. Each poower supply module
m occuppies three slotts of
chasssis space. Wh hen counting power
p supplyy and I/O slotss, the total wid
dth of the
chasssis is 18 slots wide.

If a po
ower supply or
o I/O module slot is not occcupied, it mu
ust be filled wiith a
blanking plate (379
99-301) to ma
aintain properr cooling flow through the chassis.
c

The
T 12 slot ex xpansion chhassis should
d not be used for new
applications.
a The 12 slot expansion chassis
c shouuld only be used in
retrofit
r situattions where the
t chassis isi already ins
stalled.

32 Woodward
Manual 26167V1 MicroNet TMR

Figure 3-15—Simplex MicroNet 12 Slot I/O

3.5.2—Specification
The MicroNet is designed around a modular six slot chassis (block). Each block
consists of a premolded cage with a fan for cooling and a temperature switch for
high temperature detection. The chassis are cooled by forced air, and either a
module or a module blank must be installed in every slot to maintain correct air
flow. The fans run whenever power is applied to the system.

The twelve slot MicroNet expansion chassis is composed of three blocks with a
motherboard inserted in the back of the assembly to make connections between
the fans, switches, power supplies, and control modules. See Figure 3-16. The
modules use the VERSAmodule Eurocard (VME) bus standard for connector
specification and data transfer. Slot-to-slot logic and power connections are
made through an etched-circuit motherboard. I/O connections are made through
cables from the front of the modules to field termination modules (FTM’s) in the
cabinet.

From a module connector standpoint, any I/O module can be installed in any of
the slots designated for I/O modules. However, when the application software is
designed, each module will be assigned to a specific slot and thereafter, the
software will expect that specific I/O module to always be in its designated slot.

Woodward 33
MicroNet TMR Manual 26167V1

Figure 3-16—Outline Drawing of MicroNet 12 Slot I/O

34 Woodward
Manual 26
6167V1 M
MicroNet TMR

3..5.3—Insttallation
gure 3-17 sho
Fig ows the moun nting template
e and fastene
ers to bulkhea ad mount the
ch
hassis. Rack mounting
m is not recommen nded. For propper airflow, th
he installation
sh
hould allow a 3”
3 air gap aboove and beloww the chassiss.

e of MicroNet 12 Slot I/O Chassis

Figure 3-17—Mountting Template C

Woodward
d 3
35
MicroNet TMR Manual 26167V1

Chapter 4.
Power Supplies

4.1—TMR Main Power Supplies

4.1.1—Module Description
The MicroNet TMR® main control power supply chassis uses redundant power
supplies. A motherboard located on the back of the power supply chassis allows
the two power supplies to form a redundant power system providing six
separately regulated 24 Vdc, 6 A outputs to the control. See Figure 4-1. Power
output regulation, including line, load, and temperature effects, is less that +5%.

Figure 4-1—TMR Power Supply Diagram

When redundant power supplies are running, current sharing circuitry balances
the load to reduce heat and improve the reliability of the power supplies. In the
event that one supply needs replacement, this feature also ensures hot
replacement of the power supplies without disrupting the operation of the control.

Each main power supply has four LEDs to indicate power supply health (OK,
Input Fault, Overtemperature, and Power Supply Fault). See MicroNet TMR
Power Supply Troubleshooting (Section 4.8) for a description of the LED
indications.

36 Woodward
Manual 26167V1 MicroNet TMR
Input power connections are made to the main power supply through terminals
on the front of the power supplies. A 50-pin ribbon cable is used for connecting
the power supply chassis to the control chassis.

The ribbon cable connects to a connector at the back underside of the TMR Main
Chassis. There are connectors beneath the A and C Kernels – either can be
used. See Figure 4-2. NOTE: It is also possible to use two TMR Power Supply
Chassis and connect one to each connector.

Figure 4-2—TMR Main Chassis PS Ribbon Cable Connections

On the Power Supply Chassis, the cable connects toward the back of the upper
side of the Chassis. See Figure 4-3. The Power Supply Ribbon cable is only 1
foot in length so the TMR PS Chassis must be located immediately beneath the
A or C Kernels of the TMR Main Chassis

Figure 4-3—TMR PS Chassis PS Ribbon Cable Connections

Woodward 37
MicroNet TMR Manual 26167V1
A second Chassis-to Chassis Power Cable can be used to provide redundant
connections. See Figure 4-4.

Figure 4-4—Chassis to Chassis Power Cable

The MicroNet TMR Main power supplies must have the input power
removed before installing or removing.

This equipment is suitable for use in Class I, Division 2, Groups A, B,

C, and D or non-hazardous locations only.

Wiring must be in accordance with Class I, Division 2 wiring methods

and in accordance with the authority having jurisdiction.

38 Woodward
Manual 26167V1 MicroNet TMR

Figure 4-5—TMR Power Supply Modules (24 Vdc/120 Vac/dc)

4.2—TMR Main Power Supply Specifications

4.2.1—Main PS TMR (24 Vdc Input)
Operating range: 18 to 36 Vdc
Nominal voltage rating: 20 to 32 Vdc, as on power supply label
Maximum current: 32 A
Maximum power: 576 W
Input power fuse/breaker rating: 50 A time delay
Holdup time: 5 ms @ 24 Vdc

4.2.2—Main PS TMR (120 Vac/dc Input)

AC
Operating range: 88 to 132 Vac (47 Hz to 63 Hz)
Nominal voltage rating: 98 to 120 Vac, as on power supply label
Maximum current: 13 A
Maximum power: 1150 VA
Input power fuse/breaker rating: 20 A time delay
Holdup time: 1 cycle @ 120 Vac

DC
Operating range: 100 to 150 Vdc
Nominal voltage rating: 111 to 136 Vdc, as on power supply label
Maximum current: 5.8 A
Maximum power: 576 W
Input power fuse/breaker rating: 10 A time delay
Holdup time: 7 ms @ 120 Vdc

Woodward 39
MicroNet TMR Manual 26167V1

4.2.3—Main PS TMR (220 Vac Input)

AC
Operating range: 180 to 264 Vac (47 Hz to 63 Hz)
Nominal voltage rating: 200 to 240 Vac, as on power supply label
Maximum current: 6.5 A
Maximum power: 1150 VA
Input power fuse/breaker rating: 10 A time delay
Holdup time: 1 cycle @ 220 Vac

DC
Operating range: 200 to 300 Vdc
Nominal voltage rating: 223 to 272 Vac, as on power supply label
Maximum current: 2.9 A
Maximum power: 600 VA
Input power fuse/breaker rating: 10 A time delay
Holdup time: 7 ms @ 200 Vdc

4.3—TMR Main Power Supply Installation

Figure 4-6—TMR Main Power Supply

40 Woodward
Manual 26167V1 MicroNet TMR

4.3.1—Input Power Wiring

MicroNet TMR controls require a fixed wiring installation for AC applications.
Ground leakage exceeds 3.5 mA AC. Maximum ground leakage for AC
installations is 7.2 mA at 60 Hz. A ground conductor connected to the chassis is
required for safety. The power supply grounding terminal(s) should also be
connected to earth to ensure grounding of the power supply printed circuit
boards. The grounding conductor must be the same size as the main supply
conductors.

Note that the control’s power supplies are not equipped with input
power switches. For this reason, some means of disconnecting input
power to each main power supply must be provided for installation
and servicing. A circuit breaker meeting the above requirements or a
separate switch with appropriate ratings may be used for this
purpose. To avoid nuisance trips, use only time-delay fuses or circuit
breakers.

Branch circuit fuses, circuit breakers, and wiring must meet appropriate codes
and authorities having jurisdiction for the specific country (CE, UL, etc). See
Table 4-1 for maximum recommended fuse or breaker ratings. Do not connect
more than one main power supply to any one fuse or circuit breaker. Use only
the wire sizes specified in Table 4-1 which meet local code requirements. Time
delay fuses or circuit breakers must be used to prevent nuisance trips.

Power requirements depend on the number and type of modules supplied for
each system. For a system with a single I/O chassis, size the input power source
according to the rating of the MicroNet TMR main power supply to which the
source is connected. Do not size the supply mains for the sum of the MicroNet
TMR main power supply ratings when redundant supplies are used. MicroNet™
supplies are redundant when installed in the same chassis. Redundant supplies
share the load between them equally, but each must provide for full load in the
event that one of the units is disabled. Table 4-1 gives the maximum overload
protection for supply mains connected to any single or redundant pair of
MicroNet main power supplies. It is not recommended that both MicroNet main
power supplies of a redundant pair be connected to a single source, since failure
of that source would disable the system.

Multiple chassis systems using MicroNet TMR main power supplies may have
power supplies of the same model, but in different chassis, connected to the
same source. In this case, each branch to a chassis must have its own
overcurrent protection sized according to Table 4-1, and the power source must
be sized for the sum of the branches.

Not all systems will require the full load capability of the MicroNet TMR main
power supply. If not otherwise indicated on a cabinet system nameplate, either
use the MicroNet TMR main power supply input ratings for sizing the system’s
source or consult Woodward for determining the minimum source requirements.

Table 4-1 provides fuse and wire size specifications for each power supply.

Woodward 41
MicroNet TMR Manual 26167V1

MAXIMUM MAXIMUM FUSE/

INPUT VOLTAGE C.B. RATING WIRE SIZE **
RANGE (Time Delay) (AWG/mm²)
18–36 Vdc 50 A 8 / 10 *
100–150 Vdc 10 A 14 / 2.5
88–132 Vac 47–63 Hz 20 A 12 / 4
200–300 Vdc 5 A 16 / 1.5
180–264 Vac 47–63 Hz 10 A 14 / 2.5
* must use wire rated for at least 75 °C for use at 30 °C ambient
** except as noted, wire sizes are rated 60 °C for 30 °C ambient

Table 4-1—MicroNet TMR Power Supply Requirements

When a cabinet is not supplied with the system, input power connections are
made through terminals on the front of each main power supply. These terminals
accept wires from 0.5 to 10 mm² (20–8 AWG). For a good connection, the
inserted wires should have the insulation stripped back 8–9 mm (0.33 in). Torque
to 0.5 to 0.6 Nm (0.37 to 0.44 lb-ft).

The 24 Vdc power supply model uses larger copper input terminals to
accommodate the required 10 mm² (8 AWG) wire.

A green/yellow wire connection of at least the same size as the supply wire must
be used for the PE ground.

4.4—TMR Kernel PS Module

4.4.1—Module Description
The MicroNet TMR control contains three kernel power supply modules. Each
kernel section (A, B, and C) will contain one kernel power supply module. The
kernel power supply will be located in the first slot of each kernel section. This
module receives 24 Vdc from the MicroNet main power supplies and regulates it
to 5 Vdc, 10 A for the rest of the kernel section and also creates a 5 Vdc
precharge voltage.

Kernel Power Supply 5466-318 MUST be used with the TMR040 CPU.
Kernel Power Supply 5466-1049 MUST be used with the TMR5200
CPU.

Each kernel power supply has one LED to indicate kernel power supply health.
See MicroNet TMR Kernel Power Supply Troubleshooting (Section 4.8.2) for a
description of the LED indication.

The MicroNet TMR Kernel Power Supply module must have all
modules in that kernel removed before installing or removing a
Kernel Power Supply module.

This equipment is suitable for use in Class I, Division 2, Groups A, B,

C, and D or non-hazardous locations only.

42 Woodward
Manual 26167V1 MicroNet TMR

Figure 4-7—Kernel Power Supply Module

4.5—TMR Kernel PS Module Specifications

Input Voltage: 24 Vdc ±10%
Output Voltage: 5 Vdc ±5%
Output Current: 10 A maximum

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MicroNet TMR Manual 26167V1

4.6—TMR Kernel PS Installation

Figure 4-8—MicroNet Kernel Power Supplies

The Kernel Power Supply must be installed in the first module slot
from the left for each sub-chassis (kernel). The Kernel CPU module is
installed in the next module slot directly to the right of each Kernel
Power Supply.

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Manual 26167V1 MicroNet TMR

4.7—TMR System Power-up

If at any time during this procedure the defined or expected result is not
achieved, begin system troubleshooting.

1. Verify that the entire MicroNet TMR control system has been installed.

2. Turn on the power for one power supply, and verify that the power supply’s
green LED is the only power supply LED that is on.

3. Turn on the power for the second power supply, and verify that the power
supply’s green LED is the only power supply LED that is on.

4. Verify that all of Kernel Power Supply’s red fault LEDs are off. If any of the
LEDs are on see the Kernel Power Supply Troubleshooting in section 4.8.2.

If the system is configured with the CPU_040 perform step #5 and skip step #6. If
the TMR system uses the CPU_5200 skip step #5 and perform step #6.

5. CPU_040: Momentarily toggle two of the CPU’s RESET switches up, then
back to their normal down position. Toggle remaining CPU RESET switch up,
then back to its normal down position. At this point the system will perform
off-line diagnostic testing, which could take several minutes. When all CPUs
have synchronized and completed their diagnostic tests, no red LEDs on the
CPU modules or I/O modules should be on, and the control will begin running
the application program.

6. CPU_5200: Wait until the CPUs finish their off-line diagnostics and the CPUs
are visible in AppManager. If the CPUs were running when the CPUs were
powered off, the CPUs will automatically start the Application that was
running when it was power off. If there was no Application running, select an
Application on each CPU in AppManager and select “Start”. The CPUs will
run the selected Application, synchronize and completed their diagnostic
tests. There should be no red LEDs on the CPU modules or I/O modules and
the control will be running the application program. The Green SYSCON and
RUN LED’s should be on and the Yellow STBY LED should be off.

4.8—TMR Power Supply Troubleshooting

4.8.1—TMR Main Power Supply
System diagnostic routines continuously monitor each main power supply for
proper operation. If a fault condition is detected, the fault is annunciated and the
supply’s output disabled. If necessary, use the power supply’s front panel LEDs
to assist in diagnosing any related problems. If all supply LEDs are off (not
illuminated), its probable that input power is not present, and verification should
be made.

4.8.1.1—TMR Main Power Supply LED Descriptions

OK LED—This green LED turns on to indicate that the power supply is operating
and that no faults are present.

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MicroNet TMR Manual 26167V1
INPUT FAULT LED—This red LED turns on to indicate that the input voltage is
either above or below the specified input range. If this LED is on, check the input
voltage, and correct the problem. Long-term operation with incorrect input
voltages may permanently damage the power supply. Once the input voltage is
within the supply’s input specifications, this LED will turn off. Refer to the power
supply input specifications.

OVERTEMPERATURE LED—This red LED gives an early warning of a thermal

shutdown. The LED turns on to indicate that the internal power supply
temperature has exceeded approximately 80 °C. If the internal supply
temperature rises to approximately 90 °C, the supply will shut down. Because of
the many variables involved (ambient temperature, load, thermal conductivity
variations), there is no accurate way of predicting the time between the indication
of overtemperature (LED illuminated) and power supply shutdown.

If this LED is turned on, verify that the fan in the power supply chassis is turning
and is free of dust and other obstructions, and that the temperature around the
power supply is less that 55 °C. If the power supply is cooled down without delay,
it can recover from this situation without shutting down. This LED will turn off
once the internal power supply heat sink temperature falls below approximately
75 °C.

POWER SUPPLY FAULT LED—This red LED turns on when one of the supply’s
four power converters has shut down. If this LED is on, check for a short circuit
on external devices connected to the control’s power supply. When the short
circuit has been removed, the supply will resume normal operation. If no short
circuit is found, reset the supply by removing input power for one minute. If the
power supply is still not functioning after input power has been restored, verify
that the supply is properly seated to the motherboard connector. If the supply is
properly seated but is not working, then replace the supply.

4.8.1.2—TMR Main Power Supply Checks

The following is a troubleshooting guide for checking areas which may present
difficulties. If these checks are made prior to contacting Woodward for technical
assistance, system problems can be more quickly and accurately assessed.

 Is the input power within the range of the control’s power supply input?
 Is the input power free of switching noise or transient spikes?
 Is the power circuit dedicated to the governor only?
 Are the control’s supplies indicating that they are OK?
 Are the control’s supplies outputting the correct voltage?

4.8.2—Kernel Power Supply Module

The status of this module’s power supplies and communication memories is
monitored by the CPU module that is installed in the adjacent slot.

4.8.2.1—Kernel Power Supply LED Description

KERNEL FAULT LED—This LED indicates that either the 5 V is not functioning
or that the 5 V precharge is not functioning.

4.8.2.2—Kernel Power Supply Checks

The following is a table to assist in troubleshooting the Kernel Power Supply and
the need for replacement.

46 Woodward
Manual 26167V1 MicroNet TMR

Possible Cause Result Corrective Action

5 V is not functioning The kernel will not Remove all modules from that kernel and
function. remove the Kernel Power Supply. Re-
install the Kernel Power Supply. If the
LED does not turn off, replace the
module.
5 V precharge is not The kernel is still Remove all modules from that kernel and
functioning functioning. remove the Kernel Power Supply. Re-
install the Kernel Power Supply. If the
LED does not turn off, replace the
module.

Table 4-2—Kernel Power Supply Troubleshooting

4.9—MicroNet Plus 8/14 Chassis Power Supplies

4.9.1—Module Description
The MicroNet Plus Expansion Chassis may use either single or redundant power
supplies. Each power supply module produces three regulated outputs: 24 V @
12 A (max), 5 V @ 32 A (max, derated above 55 degree C external ambient
temperature) , and 5 V Precharge @ 3 A (max). A motherboard located on the
back of the chassis provides the interconnection of the three outputs from each
power supply module into three corresponding power busses: 24 V bus, 5 V bus,
and 5 V precharge bus. The 24 V and 5 V busses are load shared between the
two power supply modules. The 5 V precharge bus is not load shared. Power
output regulation at the motherboard, including line, load, and temperature
effects, is less than ±10% for the 24 V bus, +/-5% for the 5 V bus, and +/-10% for
the 5 V Precharge bus. The 5 V and 5 V Precharge busses are not for external
use. The 24 V bus is accessible from the motherboard for external use (protected
by 5 A fuses on the source and return lines).

When redundant power supplies are running, current sharing circuitry balances
the load to reduce heat and improve the reliability of the power supplies. In the
event that on supply needs to be replaced, the recommended method for
changing Power Modules is with the power off (to the module being removed and
the module being inserted). The system will tolerate this “cold swap” method
without failure.

Each main power supply has four LEDs to indicate power supply health (OK,
Input Fault, Overtemperature, and Power Supply Fault). See MicroNet Plus
Power Supply Troubleshooting (Section 5.5) for a description of the LED
indications.

Input power connections are made to the power supply through a plug/header
assembly on the front of the power supply.

For redundant operation, the control can use any combination of power supplies.

The power supplies can only be installed into slots PS1 (power supply #1) and
PS2 (power supply #2). If redundant power supplies are not needed, blanking
plates must be installed in the slots not being used.

For MicroNet Plus installation instructions, see Chapter 14.

Woodward 47
MicroNet TMR Manual 26167V1

The MicroNet Plus main power supplies must have the input power
removed before installing or removing.
This equipment is suitable for use in Class I, Division 2, Groups A, B,
C, and D or non-hazardous locations only.
Wiring must be in accordance with Class I, Division 2 wiring methods
and in accordance with the authority having jurisdiction.

Figure 4-9—Power Supply Module

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Manual 26167V1 MicroNet TMR

4.9.2—Power Supply Module Specifications

 All Temperature ratings specify the System Ambient

Temperature as measured at the front of the MicroNet chassis.
 The Power Supply operating temperature range is –10 to +65 °C
with de-rated 5 Vdc output current above 55 °C. See Power
Supply specifications.
 For a particular system configuration, use the MicroNet Power
Program to calculate the output current requirements (24 V, 5 V)
as a function of the Chassis, CPUs, and I/O modules used in the
system.

Main PS (24 Vdc Input)

Operating range: 18 to 36 Vdc
Nominal input voltage rating: 24 Vdc
Maximum input current: 33 A
Maximum input power: 600 W
Input power fuse/breaker rating: 50 A time delay

Maximum output current (24 Vdc): 12.0 A @ 65 °C System Ambient Temp.

Maximum output current (5 Vdc): 22.0 A @ 65 °C, 28 A @ 60 °C, 32 A
@ 55 °C
Holdup time: 5 ms @ 24 Vdc

Main PS (110 Vac/dc Input)

AC input
Operating range: 88 to 132 Vac (47 to 63 Hz)
Nominal input voltage rating: 98 to 120 Vac, as on power supply label
Maximum input current: 13.6 A
Maximum input power: 1250 VA
Input power fuse/breaker rating: 20 A time delay
Maximum output current (24 Vdc): 12.0 A @ 65 °C System Ambient Temp.
Maximum output current (5 Vdc): 28.0 A @ 65 °C, 32 A @ 60 °C
Holdup time: 1 cycle @ 120 Vac

DC input
Operating range: 100 to 150 Vdc
Nominal input voltage rating: 111 to 136 Vdc, as on power supply label
Maximum input current: 6A
Maximum input power: 600 W
Input power fuse/breaker rating: 10 A time delay

Maximum output current (24 Vdc): 12.0 A @ 65 °C System Ambient Temp.

Maximum output current (5 Vdc): 28.0 A @ 65 °C, 32 A @ 60 °C
Holdup time: 7 ms @ 120 Vdc

Main PS (220 Vac Input)

High Voltage AC
Operating range: 180 to 264 Vac (47 to 63 Hz)
Nominal input voltage rating: 200 to 240 Vac, as on power supply label
Maximum input current: 6.7 A
Maximum input power: 1250 VA
Input power fuse/breaker rating: 10 A time delay

Maximum output current (24 Vdc): 12.0 A @ 65 °C System Ambient Temp.

Maximum output current (5 Vdc): 22.0 A @ 65 °C, 28 A @ 60 °C, 32 A
@ 55 °C
Holdup time: 1 cycle @ 220 Vac
Woodward 49
MicroNet TMR Manual 26167V1
Input Power Wiring
A ground conductor connected to the chassis is required for safety. The power
supply grounding terminal(s) should also be connected to earth to ensure
grounding of the power supply printed circuit boards. The grounding conductor
must be the same size as the main supply conductors.

Note that the control’s power supplies are not equipped with input
power switches. For this reason, some means of disconnecting input
power to each main power supply must be provided for installation
and servicing.

A circuit breaker meeting the above requirements or a separate

switch with appropriate ratings may be used for this purpose. Label
the circuit breaker and locate it in close proximity to the equipment
and within easy reach of the operator. To avoid nuisance trips, use
only time-delay fuses or circuit breakers.

Branch circuit fuses, circuit breakers, and wiring must meet appropriate codes
and authorities having jurisdiction for the specific country (CE, UL, etc). See
Table 4-3 for maximum recommended fuse or breaker ratings. Do not connect
more than one main power supply to any one fuse or circuit breaker. Use only
the wire sizes specified in Table 4-3 which meet local code requirements. Time
delay fuses or circuit breakers must be used to prevent nuisance trips.

Power requirements depend on the number and type of modules supplied for
each system. For a system with a single I/O chassis, size the input power source
according to the rating of the MicroNet Plus power supply to which the source is
connected. Do not size the supply mains for the sum of the MicroNet Plus power
supply ratings when redundant supplies are used. MicroNet Plus supplies are
redundant when installed in the same chassis. Redundant supplies share the
load between them equally, but each must provide for full load in the event that
one of the units is disabled. Table 4-3 gives the maximum overload protection for
supply mains connected to any single or redundant pair of MicroNet Plus main
power supplies. It is not recommended that both MicroNet Plus main power
supplies of a redundant pair be connected to a single source, since failure of that
source would disable the system.

Multiple chassis systems using MicroNet Plus power supplies may have power
supplies of the same model, but in different chassis, connected to the same
source. In this case, each branch to a chassis must have its own overcurrent
protection sized according to Table 4-3, and the power source must be sized for
the sum of the branches.

Not all systems will require the full load capability of the MicroNet Plus power
supply. If not otherwise indicated on a cabinet system nameplate, either use the
MicroNet power supply input ratings for sizing the system’s source or consult
Woodward for determining the minimum source requirements.

Table 4-3 provides fuse and wire size specifications for each power supply.

50 Woodward
Manual 26167V1 MicroNet TMR

MAXIMUM MAXIMUM FUSE/

INPUT VOLTAGE C.B. RATING WIRE SIZE **
RANGE (Time Delay) (AWG/mm²)
18–36 Vdc 50 A 8 / 10 *
100–150 Vdc 10 A 14 / 2.5
88–132 Vac 47–63 Hz 20 A 12 / 4

180–264 Vac 47–63 Hz 10 A 14 / 2.5

* must use wire rated for at least 75 °C for use at 30 °C ambient
** except as noted, wire sizes are rated 60 °C for 30 °C ambient

Table 4-3—MicroNet Plus Power Supply Requirements

When a cabinet is not supplied with the system, input power connections are
made through a plug/header assembly on the front of each main power supply.
The plug accept wires from 0.5 to 16 mm² (20–6 AWG). For a good connection,
the inserted wires should have the insulation stripped back 11-12 mm (0.45 in).
Torque to 0.5 to 0.6 Nm (0.37 to 0.44 lb-ft).

A green/yellow wire connection of at least the same size as the supply wire must
be used for the PE ground.

System Power-Up
If at any time during this procedure the defined or expected result is not
achieved, begin system troubleshooting.

1. Verify that the entire MicroNet Plus control system has been installed.

2. Turn on the power to one power supply and verify that the power supply’s
green LED is the only power supply LED on.

3. Turn off the power to the first power supply and turn on the power to the
second power supply (if a second power supply is present) and verify that the
power supply’s green LED is the only power supply LED on.

4. The RTN_CPUs in the chassis will not start automatically, the CPUs in the
TMR chassis must command them to start. See GAP application program
for details.

Woodward 51
MicroNet TMR Manual 26167V1

4.9.3—Power Supply Troubleshooting

System diagnostic routines continuously monitor each main power supply for
proper operation. If a fault condition is detected, the fault is annunciated. If
necessary, use the power supply’s front panel LEDs to assist in diagnosing any
related problems. If all supply LEDs are off (not illuminated), it is probable that
input power is not present, and verification should be made.

Power Supply LED Descriptions

OK LED—This green LED turns on to indicate that the power supply is operating
and that no faults are present.

INPUT FAULT LED—This red LED turns on to indicate that the input voltage is
either above or below the specified input range. If this LED is on, check the input
voltage, and correct the problem. Long-term operation with incorrect input
voltages may permanently damage the power supply. Once the input voltage is
within the supply’s input specifications, this LED will turn off. Refer to the power
supply input specifications.

OVERTEMPERATURE LED—This red LED gives an early warning of a thermal

shutdown. The LED turns on to indicate that the internal power supply
temperature has exceeded approximately 95 °C. If the internal supply
temperature rises to approximately 100 °C, the supply may shut down. Because
of the many variables involved (ambient temperature, load, thermal conductivity
variations), there is no accurate way of predicting the time between the indication
of overtemperature (LED illuminated) and power supply shutdown.

If this LED is turned on, verify that the fans in the power supply chassis are
turning and free of dust and other obstructions, and that the temperature around
the power supply is less than 55 °C. If the power supply is cooled down without
delay, it can recover from this situation without shutting down. This LED will turn
off once the internal power supply heat sink temperature falls below
approximately 90 °C.

POWER SUPPLY FAULT LED—This red LED turns on when one of the supply’s
three power converters has shut down or one or more of the supply levels is
below internally specified levels. If this LED is on, check for a short circuit on
external devices connected to the control’s power supply. When the short circuit
has been removed, the supply will resume normal operation (Note that if the 24 V
or 5 V outputs are shorted, these power converters will be latched OFF and can
only be cleared by removing the shorted condition and removing the input power
for 1 minute (or until the front panel LEDs extinguish). If no short circuit is found,
reset the supply by removing input power for one minute. If the power supply is
still not functioning after input power has been restored, verify that the supply is
properly seated to the motherboard connector. If the supply is properly seated
but is not working, then replace the supply.

Simplex Power Supply Checks

The following is a troubleshooting guide for checking areas which may present
difficulties. If these checks are made prior to contacting Woodward for technical
assistance, system problems can be more quickly and accurately assessed.

 Is the input power within the range of the control’s power supply input?
 Is the input power free of switching noise or transient spikes?
 Is the power circuit dedicated to the governor only?
 Are the control’s supplies indicating that they are OK?
 Are the control’s supplies outputting the correct voltage?
 Is the RTN / CPU Low Vcc LED ON?

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Manual 26167V1 MicroNet TMR

4.10—MicroNet Simplex 6/12 Chassis Power Supplies

4.10.1—Module Description
The MicroNet expansion chassis may use either single or redundant power
supplies. A motherboard located on the back of the chassis allows the two power
supplies to form a redundant power system providing two separately regulated,
24 Vdc, 12 A outputs; two separately regulated, 5 Vdc, 20 A outputs; and two
separately regulated, 5 Vdc precharge outputs to the control. Power output
regulation, including line, load, and temperature effects, is less than ±5%.

When redundant power supplies are running, current sharing circuitry balances
the load to reduce heat and improve the reliability of the power supplies. In the
event that one supply needs replacement, this feature also ensures hot
replacement of the power supplies without disrupting the operation of the control.

Each main power supply has four LEDs to indicate power supply health (OK,
Input Fault, Overtemperature, and Power Supply Fault). See MicroNet Expansion
Power Supply Troubleshooting (Section 4.13.1) for a description of the LED
indications.

Input power connections are made to the power supply through terminals on the
front of the power supply.

For redundant operation, the control can use any combination of power supplies.

The power supplies can only be installed into slots PA1 (power supply #1) and
PA2 (power supply #2). If redundant power supplies are not needed, blanking
plates (3799-301) must be installed in the slots not being used.

For MicroNet TMR installation instructions, see Chapter 14 and Section 3.3 of
this chapter.

The 6/12 slot expansion chassis should not be used for new
applications. The 6/12 slot expansion chassis should only be used in
retrofit situations where the chassis is already installed.

The MicroNet TMR main power supplies must have the input power
removed before installing or removing.
This equipment is suitable for use in Class I, Division 2, Groups A, B,
C, and D or non-hazardous locations only.
Wiring must be in accordance with Class I, Division 2 wiring methods
and in accordance with the authority having jurisdiction.

Woodward 53
MicroNet TMR Manual 26167V1

Expansion Chassis PS Expansion Chassis PS

(24 Vdc Input) (120 Vac/dc Input)

Figure 4-10—Power Supply Modules

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Manual 26167V1 MicroNet TMR

4.11—MicroNet Simplex Power Supply Specifications

Main PS Expansion (24 Vdc Input)

Operating range: 18 to 36 Vdc
Nominal voltage rating: 20 to 32 Vdc, as on power supply label
Maximum current: 29.5 A
Maximum power: 531 W
Input power fuse/breaker rating: 50 A time delay
Holdup time: 5 ms @ 24 Vdc

Main PS Expansion (120 Vac/dc Input)

AC
Operating range: 88 to 132 Vac (47 to 63 Hz)
Nominal voltage rating: 98 to 120 Vac, as on power supply label
Maximum current: 12.1 A
Maximum power: 1062 VA
Input power fuse/breaker rating: 20 A time delay
Holdup time: 1 cycle @ 120 Vac

DC
Operating range: 100 to 150 Vdc
Nominal voltage rating: 111 to 136 Vdc, as on power supply
label
Maximum current: 5.3 A
Maximum power: 531 W
Input power fuse/breaker rating: 10 A time delay
Holdup time: 7 ms @ 120 Vdc

Main PS Expansion (220 Vac Input)

High Voltage AC
Operating range: 180 to 264 Vac (47 to 63 Hz)
Nominal voltage rating: 200 to 240 Vac, as on power supply
label
Maximum current: 5.9 A
Maximum power: 1062 VA
Input power fuse/breaker rating: 10 A time delay
Holdup time: 1 cycle @ 220 Vac

High Voltage DC
Operating range: 200 to 300 Vdc
Nominal voltage rating: 223 to 272 Vdc, as on power supply
label
Maximum current: 2.7 A
Maximum power: 531 W
Input power fuse/breaker rating: 5 A time delay
Holdup time: 7 ms @ 225 Vdc

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MicroNet TMR Manual 26167V1

4.12—MicroNet Simplex Power Supply Installation

Figure 4-11—MicroNet Simplex Power Supply

4.12.1—Input Power Wiring

MicroNet controls require a fixed wiring installation for ac applications. Ground
leakage exceeds 3.5 mA AC. Maximum ground leakage for ac installations is 7.2
mA at 60 Hz. A ground conductor connected to the chassis is required for safety.
The power supply grounding terminal(s) should also be connected to earth to
ensure grounding of the power supply printed circuit boards. The grounding
conductor must be the same size as the main supply conductors.

Note that the control’s power supplies are not equipped with input
power switches. For this reason, some means of disconnecting input
power to each main power supply must be provided for installation
and servicing. A circuit breaker meeting the above requirements or a
separate switch with appropriate ratings may be used for this
purpose. To avoid nuisance trips, use only time-delay fuses or circuit
breakers.

56 Woodward
Manual 26167V1 MicroNet TMR
Branch circuit fuses, circuit breakers, and wiring must meet appropriate codes
and authorities having jurisdiction for the specific country (CE, UL, etc). See
Table 4-4 for maximum recommended fuse or breaker ratings. Do not connect
more than one main power supply to any one fuse or circuit breaker. Use only
the wire sizes specified in Table 4-4 which meet local code requirements. Time
delay fuses or circuit breakers must be used to prevent nuisance trips.

Power requirements depend on the number and type of modules supplied for
each system. For a system with a single I/O chassis, size the input power source
according to the rating of the MicroNet power supply to which the source is
connected. Do not size the supply mains for the sum of the MicroNet power
supply ratings when redundant supplies are used. MicroNet supplies are
redundant when installed in the same chassis. Redundant supplies share the
load between them equally, but each must provide for full load in the event that
one of the units is disabled. Table 4-4 gives the maximum overload protection for
supply mains connected to any single or redundant pair of MicroNet main power
supplies. It is not recommended that both MicroNet main power supplies of a
redundant pair be connected to a single source, since failure of that source would
disable the system.

Multiple chassis systems using MicroNet power supplies may have power
supplies of the same model, but in different chassis, connected to the same
source. In this case, each branch to a chassis must have its own overcurrent
protection sized according to Table 4-4, and the power source must be sized for
the sum of the branches.

Not all systems will require the full load capability of the MicroNet power supply.
If not otherwise indicated on a cabinet system nameplate, either use the
MicroNet power supply input ratings for sizing the system’s source or consult
Woodward for determining the minimum source requirements.

Table 4-4 provides fuse and wire size specifications for each power supply.

MAXIMUM MAXIMUM FUSE/

INPUT VOLTAGE C.B. RATING WIRE SIZE **
RANGE (Time Delay) (AWG/mm²)
18–36 Vdc 50 A 8 / 10 *
100–150 Vdc 10 A 14 / 2.5
88–132 Vac 47–63 Hz 20 A 12 / 4
200–300 Vdc 5 A 16 / 1.5
180–264 Vac 47–63 Hz 10 A 14 / 2.5
* must use wire rated for at least 75 °C for use at 30 °C ambient
** except as noted, wire sizes are rated 60 °C for 30 °C ambient

Table 4-4—MicroNet Simplex Power Supply Requirements

Woodward 57
MicroNet TMR Manual 26167V1
When a cabinet is not supplied with the system, input power connections are
made through terminals on the front of each main power supply. These terminals
accept wires from 0.5 to 10 mm² (20–8 AWG). For a good connection, the
inserted wires should have the insulation stripped back 8–9 mm (0.33 in). Torque
to 0.5 to 0.6 Nm (0.37 to 0.44 lb-ft).

The 24 Vdc power supply model uses larger copper input terminals to
accommodate the required 10 mm² (8 AWG) wire.

A green/yellow wire connection of at least the same size as the supply wire must
be used for the PE ground.

4.12.2—System Power-Up
If at any time during this procedure the defined or expected result is not
achieved, begin system troubleshooting.

1. Verify that the entire MicroNet control system has been installed.

2. Turn on the power to one power supply and verify that the power supply’s
green LED is the only power supply LED on.

3. Turn off the power to the first power supply and turn on the power to the
second power supply (if a second power supply is present) and verify that the
power supply’s green LED is the only power supply LED on.

4. If the RTN_CPUs are being used, they will not start automatically, the CPUs
in the TMR chassis must command them to start. See GAP application
program for details.

4.13—MicroNet Simplex Power Supply

Troubleshooting
System diagnostic routines continuously monitor each main power supply for
proper operation. If a fault condition is detected, the fault is annunciated and the
supply’s output disabled. If necessary, use the power supply’s front panel LEDs
to assist in diagnosing any related problems. If all supply LEDs are off (not
illuminated), it is probable that input power is not present, and verification should
be made.

4.13.1—Power Supply LED Descriptions

OK LED—This green LED turns on to indicate that the power supply is operating
and that no faults are present.

INPUT FAULT LED—This red LED turns on to indicate that the input voltage is
either above or below the specified input range. If this LED is on, check the input
voltage, and correct the problem. Long-term operation with incorrect input
voltages may permanently damage the power supply. Once the input voltage is
within the supply’s input specifications, this LED will turn off. Refer to the power
supply input specifications.

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OVERTEMPERATURE LED—This red LED gives an early warning of a thermal
shutdown. The LED turns on to indicate that the internal power supply
temperature has exceeded approximately 80 °C. If the internal supply
temperature rises to approximately 90 °C, the supply will shut down. Because of
the many variables involved (ambient temperature, load, thermal conductivity
variations), there is no accurate way of predicting the time between the indication
of overtemperature (LED illuminated) and power supply shutdown.

If this LED is turned on, verify that the fan in the power supply chassis is turning
and is free of dust and other obstructions, and that the temperature around the
power supply is less than 55 °C. If the power supply is cooled down without
delay, it can recover from this situation without shutting down. This LED will turn
off once the internal power supply heat sink temperature falls below
approximately 75 °C.

POWER SUPPLY FAULT LED—This red LED turns on when one of the supply’s
four power converters has shut down. If this LED is on, check for a short circuit
on external devices connected to the control’s power supply. When the short
circuit has been removed, the supply will resume normal operation. If no short
circuit is found, reset the supply by removing input power for one minute. If the
power supply is still not functioning after input power has been restored, verify
that the supply is properly seated to the motherboard connector. If the supply is
properly seated but is not working, then replace the supply.

4.13.2—Expansion Power Supply Checks

The following is a troubleshooting guide for checking areas which may present
difficulties. If these checks are made prior to contacting Woodward for technical
assistance, system problems can be more quickly and accurately assessed.

 Is the input power within the range of the control’s power supply input?
 Is the input power free of switching noise or transient spikes?
 Is the power circuit dedicated to the governor only?
 Are the control’s supplies indicating that they are OK?
 Are the control’s supplies outputting the correct voltage?

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Chapter 5.
CPUs

5.1—TMR5200 CPU Module

5.1.1—Module Description

Figure 5-1—TMR5200 CPU Module

The MicroNet TMR5200 CPU module contains a MPC5200 processor, 128

Mbyte DDR RAM, 64 MB of flash memory, a Real Time clock, and various
communication peripherals. These peripherals include (2) general use Ethernet
ports, (1) Real Time Network port, (1) serial port, (1) one service port, and (2)
CAN ports. This module includes an FPGA to provide VMEbus master/slave
capability as well as other functions necessary for redundant systems.

The TMR5200 Module is designed for 3-2-0 operation. A TMR system cannot
operate with a single CPU.

This module was designed and rated for –40 to +85 °C operation in the industrial
marketplace.
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For CPU module installation and replacement instructions, see the instructions
for installing the VME module in Chapter 14, and the instructions for replacement
in Chapter 15.

Live insertion and removal of this module is allowed in a MicroNet

TMR or Plus chassis. This module should be reset immediately
before removing it from the chassis. This notifies the module that it
RESET will be removed and provides a graceful failover to another healthy
! MODULE CPU module if available.
BEFORE REMOVAL

The CPU module runs the GAP application program. Figure 5-2 is a block
diagram of a CPU module. When the power is applied, the CPU module will
perform diagnostic tests, before running the application program.

The CPU module contains a battery to power the real time clock when power to
the control is off. This battery is not user-replaceable. During normal operation,
on-board circuitry keeps the battery charged. Once the battery is fully charged
(taking a maximum of three days), the battery will continue to run the clock for a
minimum of three months without power to the control. If power is removed from
the CPU module for longer than three months, the real time clock may need to be
reset. The resolution of the real time clock is 10 milliseconds.

Figure 5-2—CPU Module Block Diagram

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5.1.2—Module Configuration
Hardware Configuration. The Module Configuration Switch (S2) must be
configured properly for CPU mode (main rack, address 0x000) operation. This
module will be factory configured appropriately.

It is recommended to verify proper switch settings before installing

the module in the system and when troubleshooting CPU-related
issues.

If the CPU module is incorrectly configured for RTN mode, Ethernet

ports #1 and #2 are NOT active and AppManager will not be available.

 Network Type. The Network Type setting is factory set OFF to

automatically configure the RTN communication port IP addresses to the
172.20.x.x series.

It is recommended to verify proper switch settings before installing

the module in the system and when troubleshooting CPU or RTN
related issues.

The Network Type setting on all CPU and Remote RTN modules in
the system must match for proper system operation.

The customer network attached to Ethernet #1 or #2 may already use

the RTN port addresses of 172.20.x.x. In this case, the Network Type
switch should be configured ON to use the 10.250.x.x RTN port
addresses.

Network Configuration. Ethernet ports (ENET1, ENET2) can be configured for

the customer network as desired. The RTN ports (RTN1, RTN2) are reserved for
communicating with Woodward Real Time Network devices such as expansion
racks. See the on-site Network Administrator to define an appropriate I/P address
configuration for ENET1 and ENET2.

This module has been factory configured with fixed Ethernet IP addresses of
 Ethernet #1 (ENET1) = 172.16.100.1, Subnet Mask = 255.255.0.0
 Ethernet #2 (ENET2) = 192.168.128.20, Subnet Mask = 255.255.255.0

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Network Configuration Utility (AppManager)
Woodward's AppManager software can be used to load Control software (GAP),
monitor diagnostic faults, and configure Network settings. The AppManager utility
can be downloaded from www.woodward.com/software. A PC connection must
be made to Ethernet #1 (ENET1) using a RJ45 Ethernet cable.

AppManager can always be used to “discover/view” the current CPU

IP Address. However, to modify settings or load applications, the PC
running AppManager must be reconfigured to be on the same
“network” as the CPU.

 Locate the ControlName on the module faceplate and highlight it in

AppManager.
 To VIEW the IP address configuration, select menu option CONTROL -
CONTROL INFORMATION. Look for the Ethernet adapter addresses under
the Footprint Description.
 To CHANGE the IP address configuration, select menu option CONTROL -
CHANGE NETWORK SETTINGS.

5.1.3—Front Panel Indicators (LEDs)

The MicroNet PowerPC TMR5200 module has the following front-panel LEDs.

LED Name Description

RUN / RESET (GREEN/RED)—Active RED when the user pushes the
GR RUN reset switch. Active GREEN upon release and after the CPU Operating
RD RUN
system is loaded and running.
LINK ACTIVE (GREEN)—A valid Ethernet connection to another
G LINK LINK device exists
ETH TX/RX (YELLOW)—Active YELLOW when data is transmitted or
Y TX/RX TX/RX
received.
System Controller (GREEN)—Active when this CPU module is the
SYSCON
VMEbus System Controller.
Standby Ready (YELLOW) - NOT used for TMR systems. Active
STANDBY when this CPU module is ready to release or take over the System
Controller functions in a failover event.
Low VCC Power Fault (RED)—A CPU or VME power supply high or
low tolerance fault has been detected.
LVCC
- Local CPU power faults could be 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V.
- VME power faults could be VME_5V, VME_5VPC, or VME_24V.
SYSCON GR YL STANDBY IOLOCK (RED)—This LED indicates that an I/O LOCK condition exists
either locally on the CPU itself and/or on the VMEbus.
LVCC RD RD IOLOCK
Note: IOLOCK is a condition driven by the SYSCON where all I/O
IOLOCK
FAULT RD RD WDOG modules are placed into a failsafe condition and outputs are driven to a
known state. For a main CPU rack, IOLOCK is activated within 18ms of
a detected fault condition. For an RTN expansion rack, IOLOCK may
take up to 55ms to be asserted.
FAULT CPU FAULT (RED)—Actively flashes CPU fault codes as necessary.
CPU Watchdog / Health Faults (RED)—The processor watchdog or
Health monitor has tripped and the CPU or Remote RTN module is
WATCHDOG prevented from running. The CPU Watchdog includes a 1 ms failover
event and an 18 ms timeout event. Health faults include GAP fault,
Watchdog events, and local SYSCLK and MFT hardware faults.
CAN LED’s
GR GR CAN #1, #2 CAN #1, #2 (GREEN/RED)—Active GREEN or RED when data is
#1 RD RD #2 transmitted or received through CAN port #1 or #2.

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5.1.4—Module Reset
Front Panel Reset Switch. The CPU module has a pushbutton reset switch on
the front panel to reset the module. If a GAP application was successfully running
at the time of reset, the same application will be auto-started and re-initialized.

CPU Remote Reset. Each CPU module will respond to a +24 V remote reset
signal. The chassis provides a terminal-block with inputs RST1+, RST1–, RST2+,
RST2–, RST3+, and RST3– for wiring the remote reset signals to each CPU.
Each reset signal is routed to an opto-isolated input on the appropriate CPU that
requires a +24 V signal to cause a reset.

Reset Notes:
 Resetting a CPU or Remote RTN module creates a HealthFault that
immediately sets the WDOG light RED.
 The front-panel RUN/RESET led will be RED while reset is held and will turn
GREEN for a few seconds after releasing reset. After turning OFF, it will again
turn GREEN when the operating system starts to boot.
NOTE: When a TMR System is running with only 2 healthy CPUs, Pressing the
reset on either of the running CPUs will drive IOLOCK and IORESET on the
entire TMR system. This will place the Control System and all expansion racks to
a safe condition where all output signals are driven to a known failsafe condition.

This module should be reset immediately before removing it from the

chassis. This notifies the module and system software that it will be
removed.
RESET
! MODULE
BEFORE REMOVAL

5.1.5—10/100 BaseT Ethernet Ports

There are two 10/100 BaseT Ethernet Ports (RJ45) available to the application
software. These ports are full duplex, auto switching, and do not require the use
of an Ethernet shield box.

ETHERNET CABLES—Max cable length is 30 meters. Double

shielded, Cat 5 Ethernet cables (SSTP) are required for customer
installations.

5.1.6—RTN Port
In a TMR5200 based system, each Kernel CPU provides Real Time Network
(RTN) capability for expanding to other racks using Ethernet port 4 (RJ45). This
RTN port communicates between the main chassis CPU's and any Remote RTN
modules located in an expansion chassis. The GAP software application defines
the expansion racks, their I/O modules, and the use of the RTN port (GAP block
is RTN).

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Up to two Remote RTN modules may be installed into each MicroNet Plus 8/14
expansion chassis (only one RTN for 6/12 slot expansion chassis). When
initialized by the main chassis CPU, the Remote RTN modules will acquire either
a SYSCON or STANDBY status. The Remote RTN module that becomes
SYSCON will control the expansion chassis it is located in. It will synchronize
with the STANDBY Remote RTN module and perform any redundancy functions
as necessary. Input and output data from all I/O modules will be managed
appropriately and made available to the GAP Application running in the main-
chassis CPUs.

**Refer to the Communications section and the RTN Remote Transceiver module
for additional information to configure expansion racks using either copper or
fiber Ethernet cables.

REMOTE RTN CABLES (COPPER)

 Double shielded, Cat 5 Ethernet cables (SSTP) are required for
customer installations.
 Cable length between the Main rack and RTN switch is 3 m (10 ft)
max.
 Cable length between the RTN switch and Expansion rack is 30 m
(100 ft) max.

5.1.7—RS-232/422/485 Serial Port

An isolated, configurable RS-232 / 422 / 485 serial port is located on the front of
the CPU module and is configured by the GAP software application. The baud
rate is selectable from 300 baud to 115.2 Kbaud. Shielded cable is required
when connecting to the CPU module’s serial port. Using shielded cable will help
ensure the robustness of the serial communications.
Pin 1 – RS-422 Transmit (+)
Pin 2 – RS-232 Receive
Pin 3 – RS-232 Transmit
Pin 4 – RS-422 Transmit (-)
Pin 5 – Signal Ground
Pin 6 – Termination Resistor (+)
Pin 7 – RS-485/422 Receive (+)
Pin 8 – RS-485/422 Receive (-)
Pin 9 – Termination Resistor (-)

Figure 5-3—CPU Communications Port (DB9F)

5.1.8—RS-232 Service Port

An isolated RS-232 service port is located on the front of the CPU module. This
port is for VxWorks® * operating system use only and cannot be configured for
application software use. The communication settings are fixed at 38.4 Kbaud, 8
data bits, no parity, 1 stop-bit, and no flow control.
*—VxWorks is a trademark of Wind River Systems, Inc.

For debug use, a null-modem cable and 5450–1065 Serial Adapter cable (PS2M
to DB9F) is required to attach this port to a PC. This port is to be used by
trained Field Service personnel only!

Shielded cable is required when connecting to the Service Port. Using shielded
cable will help ensure the robustness of the serial communications.

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Pin 1 – RS-232 Receive

Pin 2 – RS-232 Transmit
Pin 3 – Signal Ground
Pin 4 – Not Used
Pin 5 – Signal Ground
Pin 6 – Not Used

Figure 5-4—CPU Service Port (mini-DIN6F)

5.1.9—CAN Communication Ports

CAN is not supported on the TMR5200 CPU at this time.

5.1.10—Troubleshooting and Tuning

The MicroNet CPU module runs off-line and on-line diagnostics that display
troubleshooting messages through the debug Service Port and AppManager. Off-
line diagnostics run automatically on power-up and when the Reset switch is
asserted. On-line diagnostics run during normal Control System operation when
the GAP application is active. More information on diagnostics tests, subsequent
LED flash codes, and serial port messages is contained in the VxWorks manual.

A table of the CPU fault LED flash codes is shown below:

Failure Flash Code

RAM Test Failure 1, 4
Real Time Clock Test Failure 2, 2
Floating Point Unit Test Failure 2, 3
Flash Test Failure 2, 4
HD1 Flash Test Failure 2, 5
I2C Bus Test Failure 2, 6
Module Installed in wrong slot 2, 7
Main Chassis CPU switch must be set to 0 3,5
Remote RTN Rate Group 5 Slip 3, 7
Remote RTN Rate Group 10 Slip 3, 8
Remote RTN Rate Group 20 Slip 3, 9
Remote RTN Rate Group 40 Slip 3, 10
Remote RTN Rate Group 80 Slip 3, 11
Remote RTN Rate Group 160 Slip 3, 12
Remote RTN Chassis Switch Invalid 4, 5
Backup Remote RTN Chassis Switch different from 4, 6
Primary Remote RTN
This module does not support the CAN port(s) 4, 7
This module needs a “footprint” update 4, 9

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*A table of Message ID values as displayed in AppManger:

Description of ID ID Number
Created by the Coder (Evaluate specific Application) 1-99
“sysinit” – Problem in system initialization 184,185,186
VerifyCpuMem -- Problem in verify CPU memory 103
VerifyNVLog -- Problem in verify NV_LOG functions 104,143,145
ExecuteTMRMessageTask -- Freerun task error 101,102
TMRDportDiagnostics -- Problem running DualPort test 105,106,112,113,114
WaitRTNBuffer -- Problem waiting for the RTN messages 146,147
ioRead -- Problem in the ioRead function 142,183
Run_ll_int -- Problem in the Ladder Logic executive 180
SynCmdBuffer – Problem sending messages to RTN chassis 181
CheckSyncCmdBuffer - Problem sending message to RTN 182
Clk_xvstat -- TMR CPU missing in interrupt service routine 604,605
PresInt -- TMR CPU unable to reach previous target 660
CopyToPickup – Problem syncing lost CPU 130,131,132
Re-sync -- Problem syncing lost CPU 133,134,135,136,137,138
Re-sync -- Lost CPU failed to sync properly 139

5.2—CPU_040 Module
5.2.1—Module Description

Figure 5-5—040 CPU Module

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Figure 5-6—CPU Module

The information in this chapter on the CPU_040s is for legacy

systems that use the old CPU_040 CPUs. Use the CPU_5200 CPUs
for all new designs.

Every MicroNet TMR® control contains three CPU modules, one located in the
second slot of each kernel, just to the right of the kernel power supply.

For CPU module installation and replacement instructions, see the instructions
for installing the VME module in Chapter 14, and for replacement in Chapter 15.

The CPU modules run the application program. Figure 5-7 is a block diagram of
a CPU module. When the reset switch is toggled to the Run position, the CPU
modules will perform diagnostic tests, sync together, and then run the application
program.

The CPU has a PCMCIA (Personal Computer Memory Card International

Association) slot on its front panel. The PCMCIA slot is used to download
application files to the CPU module.

The CPU module contains a battery to power the real time clock when power to
the control is off. This battery is not user-replaceable. During normal operation,
on-board circuitry keeps the battery charged. Once the battery is fully charged
(taking a maximum of three days), the battery will continue to run the clock for a
minimum of three months without power to the control. If power is removed from
the CPU module for longer than three months, the real time clock may need to be
reset. The resolution of the real time clock is 10 milliseconds.

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Figure 5-7—CPU Module Block Diagram

5.2.2—RS-232 Serial Port COM1

An RS-232 serial port is located on the front of the CPU module. This port should
only be connected to a device with an isolated serial port. Baud rate is selectable
from 300 baud to 38.4 Kbaud. Before this port can be used, Woodward kit P/N
8298-096 must be installed. To install this kit, the CPU must have screw posts.
Some of Woodward’s earlier CPU modules have slide lock posts. These must be
sent to Woodward for upgrade before the port may be used. See Chapter 12 for
details on how to install this port filter kit. Shielded cable is required when
connecting to the CPU module’s serial port. Using shielded cable will help ensure
the robustness of the serial communications.

This communication port is non-isolated. Shielded cable and a Serial Port

Isolator/ Converter is required when using this port to avoid susceptibility to EMI
noise and ground loops related to PC connections and typical industrial
environments. The following standard options are available:
 RS-232–RS-232 Isolator and Filter
 RS-232–RS-485 Isolator/Converter and Filter
 RS-232–RS-422 Isolator/Converter and Filter

A Serial Port Isolator/Converter must be properly installed,

grounded, and powered prior to connection with the CPU. Once
properly installed, it may be connected to a field device at any time.
Alternatively, the isolator may be connected to the field device.
However, it must be properly installed, grounded, and powered prior
to connection to the CPU.

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Figure 5-8—68040 CPU Communications Port

5.2.3—FTM Reference
No FTM is used with this CPU. However, additional installation and application
information can be found in Chapter 12.

5.2.4—Troubleshooting and Tuning

The MicroNet™ Operating System runs both off-line and on-line diagnostics.
Diagnostics are run at power-up or when the Reset switch is toggled (off-line),
and automatically when operating under application-program control (on-line).

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68040 CPU Off-Line Diagnostics
The following table shows the tests run by off-line diagnostics, and the order in
which they are run. Off-line diagnostics are started immediately after the Reset
has toggled.

TEST EXPLANATION OF TEST

1. CSR (Control Status The CSR register of the CPU is tested by writing to it, reading from it, and then
Register) Test testing the value read back.
2. Simple DUART (dual This test checks the DUART counter/timer, and on Channel A of the CPU
universal asynchronous module, it does an receiver/internal wrap-around test. If the Channel passes the
transmitter) test, the display is initialized, and communication with the VFD (vacuum-
fluorescent display) is set up. If the VFD does not respond, the system sets up
for a dumb terminal.
3. Local RAM Test This test checks all of the local RAM installed by performing the following tests:
A. Marching One test (writes to a bit location in memory, then reads that
location back to verify it his is repeated for every bit-location in memory.
B. Write Byte, read word; write word, read byte, etc.
C. If memory is less than 512 KB, perform wraparound test (writes past word
boundaries).
D. Misalign test (accesses memory on a misaligned word boundary).
4. Application RAM Test This test determines whether the memory for the application is RAM or PROM.
If application memory is PROM, no tests are done. If application memory is
RAM, the following tests are performed.
A. Marching One test.
B. Write Byte, read word; write word, read byte, etc.
C. If me
D. Misalign test.
5. Extensive DUART Test This test checks both channels of the DUART with:
A. Internal wrap-around test
B. Different BAUD rates, data bits, etc.
6. Clock interrupt Test This test enables the interrupt timer and checks that the interrupts are being
generated.
7. Local Bus Timeout Test This test writes to a location on the Woodward I/O bus with no memory
(module) installed, and checks that a bus error occurs.
8. VME Bus Timeout Test This test writes to a location on the VME bus with no module installed, and
verifies that a bus error occurs.
9. PROM Write Test This test makes the CPU think that PROM is installed. It then writes to a
location and verifies that the CPU generates a bus error.
10. EEPROM Test This test uses the last few locations in the EEPROM. It writes to a location,
reads the data back, and checks to see if the write was successful. It then
repeats the procedure for different locations.
11. FPU (Floating Point) This test checks the register locations on the Unit) Test co-processor, does
some math calculations with known answers, and checks to be sure the
answers returned are correct.
12. BOOT If the self test has been successful so far, the system checks to see if PROM is
installed. If PROM is installed, and if it has a valid application program in it, that
program will be executed.
If RAM is installed, the system checks the VME bus to see if there is a memory
module with a valid application program. If it finds one, it will download it to the
CPU RAM and execute it.
If there is no application program, the system sets up for a download and
requests the operator to download an application program.
If PCMCIA module is installed, the CPU will download the application from the
PCMCIA module and execute it.

Table 5-1—Off-line Tests

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If during diagnostics, a particular test fails, testing stops and a message
identifying the cause of the failure will be displayed. Also, the FAILED LED on the
CPU module will periodically repeat bursts of flashes; the number of flashes in
each burst indicates the test that failed as shown in Table 5-2.

FLASHES IN BURST ERROR DETECTED

1 Start Up test failed
2 Control Status Register test failed
3 DUART test Failed
4 Local RAM test failed
5 Local RAM Misaligned test failed
6 Application RAM test Failed
7 Application RAM Misaligned test failed
8 Clock Interrupt test failed
9 Local Bus Timeout test failed
10 VME Bus Timeout test failed
11 PROM Write test failed
12 EEPROM test failed
13 Floating Point Math Co-processor test failed

Table 5-2—Flash Codes

68040 CPU On-Line Diagnostics

As soon as the application program starts running, the system will use a small
portion of run time to continuously run the following on-line diagnostic tests.

TEST EXPLANATION OF TEST

1. Local Memory Test This test gets a location from memory, saves the data from that
location, then writes several different values to that location. It reads
each value back, and checks it to be sure it is correct. It then restores
the saved original data back to the RAM and repeats the process at
another location.
2. Application Memory RAM only: If the memory is RAM, this test gets a location from memory,
Test saves the data from that location, then writes several different values to
that location. It reads each value back, and checks it to be sure it is
correct. It then restores the saved original data back to the RAM and
repeats the process at another location.
UVPROM, RAM and Flash: The test then calculates the sumcheck
value and compares it to the sumcheck value previously calculated
offline and stored in memory.
3. FPU (Floating Point This test checks the register locations on the co-processor, does some
Unit) Test math calculations with known answers, and checks to be sure the
answers are returned correct.
4. Task Overview This test checks the last eight locations in the task that has just
completed to make sure that the values that were set up when the task
was created have not changed. If they have, it indicates that the task
has overflowed its memory, and destroyed memory in another task.

Table 5-3—On-Line Tests

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A failure of any one of the on-line tests results in the I/O lock being asserted and
display of a message as shown in Table 5-4. The message will be displayed on
the Service Panel at the time the error occurs, and it also will go into the Fault
Mode Buffer so that it can be displayed in the Fault Mode.

TEST MESSAGE ON FAILURE

Local RAM Local RAM Failed
Application RAM Application RAM Failed
FPU (Co-processor) FPU C0-processor Failed
During execution, an operating system Task overrun
task ran out of memory, or its memory was
corrupted by a different task

Table 5-4—Test Failure Messages

68040 CPU Operation Errors

Certain other errors can occur during system operation. These errors and their
associated messages are listed in Tables 5-5 and 5-6.

MESSAGE MEANING
Checksum Error Local RAM Failed
System Error (#) Application RAM Failed (ref. Table 5-6)
EEPROM Fault FPU C0-processor Failed
Math Exception The FPU (Co-processor) has received an illegal instruction
Rate Group Slip (#) Rate group # (number) is scheduled to run and it did not complete
its previous scheduled run.
EEPROM Initialization Fault The CPU attempted to program the EEPROMs during system
initialization and failed, or the EEPROM was detected bad
(EEPROM FAULT). The system is not permitted to run because
the EEPROM data is not current.
Exception Error Vector # An error was detected by the processor. The vector number
indicates which exception the 68040 processor took. For an
explanation of exceptions, refer to page 8-5 of Motorola Manual
M 68040 UM/AD, MC68040 Enhanced 32-bit Microprocessor
Users Manual.

Table 5-5—Operation Errors

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NUMBER SYS. FILE MEANING

OPER.
1 CREATE Cannot create task with priority less than one.
2 CREATE Stack size requested is smaller than the minimum size.
3 NEWPID The priority is greater than the maximum allowed.
4 NEWPID The rate group Proctab entry is not free.
5 NEWPID All the Proctab entries are full.
6 GETMEM Tried to get a (zero-byte) block of memory.
7 GETMEM No memory available.
8 GETMEM Not enough memory available for block size requested.
9 FREEMEM Returned a (zero-byte) block of memory.
10 FREEMEM Returned a block of memory outside of heap boundaries.
11 FREEMEM Unable to return the block of memory
12 NEWSEM No semaphores available.
13 SUSPEND Cannot suspend a task that is not current or ready.
14 SCOUNT The semaphore number is invalid.
15 SCOUNT The semaphore number passed in is undefined.
16 SCREATE The initial count is smaller than zero.
17 SIGNAL The semaphore number is invalid.
18 SIGNAL The semaphore number passed in is undefined.
19 SIGNALN The semaphore number is invalid.
20 SIGNALN The semaphore number passed in is undefined.
21 SIGNALN Must signal semaphore one or more times.
22 SRESET The semaphore number is invalid.
23 SRESET The semaphore number passed in is undefined.
24 RESET Must set semaphore to zero or larger.
25 WAIT The semaphore number is invalid.
26 WAIT The semaphore number passed in is undefined.

Table 5-6—Numbered System Errors

When the system detects an error when starting or running an application, the
CPU will flash the FAILED LED on the CPU module with two bursts of flashes
separated by a medium longer pause. The CPU will re-start flashing the fault
codes after a long pause. The number of flashes will match the display message
or it can be determined by counting the two groups of short flashes between the
medium pause. The number of flashes in each burst indicates the detected
failure as shown in Table 5-7.

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FLASHES IN BURST ERROR DETECTED

5,4 The Applications do not match, CPU_C different.
5,1 The Applications do not match, CPU_B different.
5,2 The Applications do not match, CPU_A different.
5,3 The Applications do not match, ALL different.
5,7 The Ladder Logic Applications do not match.
5,8 The EE (tunable) values do not match, CPU_A different.
5,9 The EE (tunable) values do not match, CPU_B different.
5,10 The EE (tunable) values do not match, CPU_C different..
5,11 The EE (tunable) values do not match, all CPUs different.
5,14 Pickup CPU failed, re‐sync process
5,15 Pickup CPU failed, Application does not match running CPUs
5,16 Pickup CPU failed, EE (tunable) values do not match
5,17 Pickup CPU failed, EE (tunable) values do not match
5,19 Pickup CPU failed ,Ladder Logic Applications do not match
5,20 Pickup CPU failed attempt to re‐sync with running CPUs
5,21 Pickup CPU failed attempt to re‐sync with running CPUs
5,22 Pickup CPU failed attempt to re‐sync with running CPUs
5,23 Pickup CPU failed attempt to re‐sync with running CPUs
5,24 Pickup CPU failed attempt to re‐sync with running CPUs
5,25 Pickup CPU failed attempt to re‐sync with running CPUs
6,4 Dual‐port RAM error detected (Local Right)
6,5 Dual‐port RAM error detected (Local Left)
6,7 Dual‐port RAM error detected (Remote Right)
6,8 Dual‐port RAM error detected (Remote Left)
6,9 Dual‐port RAM error detected (Unknown)
6,14 Vote busted
6,10 Kill CPU called on CPU_A
6,11 Kill CPU called on CPU_B
6,12 Kill CPU called on CPU_C
6,13 Kill CPU called on all CPUs
7,1 Ladder Logic error, flash program failed
7,2 Ladder Logic error, flash program failed
7,4 Ladder Logic error, flash program failed
7,5 Ladder Logic error, flash initialization failed
7,6 Ladder Logic error, flash erase failed
7,8 Ladder Logic error, flash erase failed
7,9 Ladder Logic error, bad flash
7,10 Ladder Logic error, bad flash
7,11 Ladder Logic error, bad flash
7,12 Ladder Logic error,
9,1 Bus error
9,2 Fault detected – Checksum,RG Slip, TaskOver, SystemError, Exception, MathException,
9,3 bus error from Dualport broadcast address
9,4 LL CPU required (needs to have the 2nd bank of FLASH installed
9,6 memory fault stack overflow
10,1 insert failed, requested key is greater than NPROC
10,2 insert failed, task is already on a queue
10,3 insertd failed, task is already on a queue
10,4 ready failed, task is already READY or CURRENT
10,5 reinsert failed, requested key is greater than NPROC
10,6 reinsert failed, task is already on a queue
88,12 PCMCIA transfer failed

Table 5-7—System Alarms

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 MicroNet TMR Manual 26167V1
CPU_040 Alarms
The possible system alarms are listed in Table 5-8. The numbered system
alarms are listed in Table 5-9.

The ALARMS in Tables 5-8 and 5-9 do not automatically display; they are stored
by the system and to see them, you must use the OPSYS_FAULTS Mode of the
Service Panel.

MESSAGE MEANING
SIO n Configuration Fails A configuration error occurred on Port n of SIO x module.
port x n (1-…) = SIO number
x (1-4) = port number
SIO n Missing SIO n module is not installed.
n (1-…) = SIO number
SIO n Self Test Failed SIO n module failed its self test.
n (1-…) = SIO number
SIO n Initialization Failed SIO n module failed to initialize.
n (1-…) = SIO number
System Alarm # n A numbered system alarm has occurred. The number of the alarm is n
(see Table 20-8, Numbered System Alarms).
Divide by Zero A divide by zero operation was performed.
Real to Int Conversion An Overflow has occurred during a Real-to-integer conversion
Overflow operation.

Table 5-8—System Alarms

NUMBER OPER SYS. MEANING

FILE
1 CLOSE The device number is invalid.
2 CONTROL The device number is invalid.
3 GETC The device number is invalid.
4 INIT The device number is invalid.
5 OPEN The device number is invalid.
6 PUTC The device number is invalid.
7 READ The device number is invalid.
8 RECVTIM The time passed inn was less than zero.
9 SEND The PID number is invalid.
10 SEND Cannot send message to undefined task.
11 SEND Process has message pending.
12 SENDF The PID number is invalid.
13 SENDF Cannot send message to undefined task.
14 WRITE The device number is invalid.
15 IOERR The function is not implemented for this device.
16 TTYCNTL Baud rate invalid.
17 TTYCNTL Mode (line/char) invalid.
18 TTYCNTL Function invalid.
19 TTYREAD Attempt to read fewer than zero characters.
20 TTYWRITE Attempt to write fewer than zero characters.
21 ICCCNTL Function invalid.
22 ICCINIT Too many SIO modules are defined.

Table 5-9—Numbered System Alarms

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Manual 26167V1 MicroNet TMR

Chapter 6.
Communication

6.1—Remote RTN Module

6.1.1—Module Description

Figure 6-1—Remote RTN Module

The MicroNet Remote Real Time Network (RTN) module is designed to be

located in an expansion rack. The module’s primary function is to gather data
from local I/O modules and communicate this data to the main rack CPUs while
providing redundant failover control of the rack in which it is located.

The Remote RTN module contains a MPC5200 processor, 128 Mbyte DDR
RAM, 64 MB of flash memory, a Real Time clock, and various communication
peripherals. These peripherals include (3) Real Time Network ports and (1)
service port. This module includes an FPGA to provide VMEbus master/slave
capability, health monitoring, and failover functions necessary for redundant
systems.

This module was designed and rated for –40 to +85 °C operation in the industrial
marketplace. Figure 6-2 is a block diagram of a Remote RTN module.

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 MicroNet TMR Manual 26167V1

MicroNet Real-Time Network Module (RTN)

RESET SWITCH MANUAL RESET 64MB FLASH VMEbus VME
ADDRESS
File System, On-Board CAB(15:0) MASTER VAB(31:1) ADDRESS VA(31:1)
RUN / RESET GR
RD
RUN / RESET LED BUFFERS
XCVR
Reserved Boot Sectors

64MByte 64MByte VMEBUS

MicroNet VMEbus
DDR SDRAM DDR SDRAM CONTROLLER
(high) (low) VME
DATA (Master/Slave) VDB(31:0) DATA VD(31:0)
BUFFERS CDB(15:0)
DPRAM XCVR
(3) RJ45 5k x 32
RTN-/A REAL-TIME
RTN1/B NETWORK PORTS
1.8V 2.5V 3.3V CTRL
RTN2/C VCB(11:0) VC(11:0)
XCVR

VMEbus
RS-232 Debug RS-232 Port SLAVE
(MINI-DIN6F) (ISOLATED) Bus Isolation
& XCVR Control
ARBITER
LED DRIVER BTO
SYSCON + STANDBY SYSCON CTRL
SYSCON GR YL STANDBY Low Voltage (LVCC) MOTOROLA XCVR
WGC
P1
IOLOCK Fault FPGA
LVCC RD RD IOLOCK
Module Fault / Code
MPC5200 REDUNDANCY
FAULT RD RD WDOG Watchdog / HealthFault CONTROLLER

WGC
WGC
HEALTH MONITOR MONITOR
MFT, IOLOCK,
FAN MONITOR
Control & Status

MicroNet VMEbus
RTC with 3.3V
Battery
2.5V

RESET*
2.5V 3.3V 3.3V
2.5v
1.5V
LOCAL PWR
MONITOR 1.2V
VME HotSwap
5.0V_FAIL
Front Panel

(4) Isolated 5V 3.3V_FAIL

Power Supplies 2.5V_FAIL
(Serial and CAN) 1.8V_FAIL 1.8V
LOCAL POWER HotSwap Ctrl
DIP-SWITCH (S2) 1.5V_FAIL 3.3V VME_5V
SUPPLY (+5V to 3.3V)
ON 1.2V_FAIL P2
OFF
1 2 3 4 LSB VME_24

Isol 5V
1.2V 1.5V 1.8V 2.5V 3.3V
coms, CAN

Figure 6-2—Remote RTN Module Block Diagram

Remote RTN modules can support simplex, redundant, and TMR systems. Every
RTN expansion chassis contains one Remote RTN module located in the first
slot (CPU1) of the chassis. A redundant configuration using a Plus chassis may
also have a Remote RTN module located in the CPU2 location (slot 8 or slot 14
depending on the chassis used).

For Remote RTN module installation and replacement instructions, see the
instructions for installing the VME module in Chapter 14, and for replacement in
Chapter 15. This module will NOT automatically re-initialize to a running
state after reset. This module is can only be initialized by the main-chassis CPU
when the application starts and upon any application request.

Live insertion and removal of this module is allowed in a MicroNet

Plus chassis. This module should be reset immediately before
removing it from the chassis. This notifies the module that it will be
RESET removed and provides a graceful failover to another healthy Remote
! MODULE RTN module if available.
BEFORE REMOVAL

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Manual 26167V1 MicroNet TMR
Operation
For redundant systems, up to two Remote RTN modules may be installed into
each MicroNet Plus 8/14 slot expansion chassis (only one RTN can be installed
in the MicroNet 6/12 slot chassis). When initialized by the main chassis CPU, the
Remote RTN modules will acquire either a SYSCON or STANDBY status. The
Remote RTN module that becomes SYSCON will control the expansion chassis
it is located in. It will synchronize with the STANDBY Remote RTN module and
perform any redundancy functions as necessary. Input and output data from all
I/O modules will be managed appropriately and made available to the GAP
Application running in the main-chassis CPUs.

The Remote RTN module communicates with the I/O modules in the expansion
chassis and also the CPU modules in the main chassis. When the power is
applied, the Remote RTN module will perform diagnostic tests before beginning
communications.

6.1.2—RTN Expansion Chassis Configurations

The MicroNet TMR5200 can expand from a single main rack to a maximum 4-rack
system by using Remote RTN modules and copper or fiber optic Ethernet switches.
A maximum of 3 MicroNet Plus expansion racks (14 slot or 8 slot versions) or
MicroNet Simplex racks (6 or 12 slot versions) are supported. If desired, fiber optic
Ethernet switches can be used to locate each chassis in a different location. It is
required to use Woodward approved Ethernet hardware for robust operation.

Example 4-rack systems using copper and fiber Ethernet cables.

Figure 6-3—MicroNet TMR5200 System (copper, 3-rack)

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 MicroNet TMR Manual 26167V1

MicroNet TMR, Fiber Optic Expansion

- MicroNet Plus Expansion racks with redundant RTN modules
x
RS2-4TX/1FX-SM
i
RS2
TX
P
1

2
2

3
0 1
4

LA1
1

5
DA/STAT
FAULT
DA/STAT

Real Time Network (100' max)

LA2

FAULT
LA3
LA4

Switch 4TX/1FX
LA5

+24V*
+24V
1

RTN-A 4 5
Fiber-A
(10' max) (2 Km)

RTN-B
RS2
Fiber-B TX

(2 Km)

RS2-4TX/1FX-SM RS2

Exp #1 Exp #2 Exp #3

x i
TX
1 2 1
P DA/STAT
2 3 4 5 FAULT
DA/STAT
0 1
LA1
LA2
FAULT

LA3
LA4
LA5
+24V*
+24V

RTN-C Fiber-C
MicroNet TMR 4 5

(2 Km)
Main Rack

Figure 6-4—MicroNet TMR5200 System (fiber, 2 locations)

6.1.3—Module Configuration
Network Configuration. No network configuration is required. Only the RTN
ports are active on this module. Ethernet port (ENET1) is disabled on the Remote
RTN module by the Module Config switch (S2) and no IP address configuration is
necessary.

Hardware Configuration. The Module Configuration Dip-Switch (S2) must be

configured properly for RTN mode with the expansion chassis address set
appropriately as X1-X7 for Plus systems or X1-X3 for TMR systems.

 RTN Mode. The Module Config Switch (S2) is factory configured for RTN
mode, expansion rack X1 operation (address 0x001). It may need to be
re-configured for expansion rack X1-X3 in TMR systems. Note: RTN mode
will disable Ethernet port #1.

 Network Type. The Network Type setting is factory set OFF to

automatically configure the RTN communication port IP addresses to the
172.20.x.x series.

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 Manual 26167V1 MicroNet TMR

It is recommended to verify proper switch settings before installing

the module in the system and when troubleshooting RTN related
issues.

The Network Type setting on all CPU and Remote RTN modules in
the system must match for proper system operation.

The customer network attached to Ethernet #1 or #2 at the main

chassis CPUs may already use the RTN port addresses of 172.20.x.x.
In this case, the Network Type switch should be configured ON to
use the alternate 10.250.x.x RTN port addresses.

If the Remote RTN module is incorrectly configured for CPU mode,

Ethernet ports #1 and #2 are active and have been factory-set to fixed
Ethernet IP addresses of:
 Ethernet #1 (ENET1) = 172.16.100.1, Subnet Mask =
255.255.0.0
 Ethernet #2 (ENET2) = 192.168.128.20, Subnet Mask =
255.255.255.0

6.1.4—Front Panel Indicators (LEDs)

The Real Time Network (RTN) module has the following front-panel LED's.

LED Name Description

RUN / RESET (GREEN/RED)—Active RED when the user pushes
GR RUN the reset switch. Active GREEN upon release and after the CPU
RD RUN
Operating system is loaded and running.
LINK ACTIVE (GREEN)—A valid Ethernet connection to another
G LINK LINK device exists
RTN TX/RX (YELLOW)—Active YELLOW when data is transmitted or
Y TX/RX TX/RX
received.
System Controller (GREEN)—Active when the Remote RTN module
SYSCON
is the VMEbus System Controller.
Standby Ready (YELLOW)—Active when the STANDBY mode of this
STANDBY CPU or Remote RTN module is ready to release or take over the
System Controller functions in a failover event.
Low VCC Power Fault (RED)—An RTN or VME power supply high or
low tolerance fault has been detected.
LVCC
- Local CPU power faults could be 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V.
- VME power faults could be VME_5V, VME_5VPC, or VME_24V.
SYSCON GR YL STANDBY IOLOCK (RED)—This LED indicates that an I/O LOCK condition
exists either locally on the CPU itself and/or on the VMEbus.
LVCC RD RD IOLOCK
IOLOCK Note: IOLOCK is a condition driven by the SYSCON where all I/O
FAULT RD RD WDOG
modules are placed into a failsafe condition and outputs are driven to
a known state. For an RTN expansion rack, IOLOCK is activated
within 55ms of a detected fault condition.
FAULT CPU FAULT (RED)—Actively flashes CPU fault codes as necessary.
CPU Watchdog / Health Faults (RED)—The processor watchdog or
Health monitor has tripped and the CPU or Remote RTN module is
WATCHDOG prevented from running. The CPU Watchdog includes a 1 ms failover
event and an 18 ms timeout event. Health faults include GAP fault,
Watchdog events, and local SYSCLK and MFT hardware faults.

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6.1.5—Module Reset
Front Panel Reset Switch. The Remote RTN module incorporates a pushbutton
reset switch on the front panel to reset the module. This module will NOT
automatically re-initialize to a running state after reset. The main-chassis CPU
application can re-init this module upon request.

RTN1 and RTN2 Remote Reset. Each Remote RTN module will respond to a
+24 V remote reset signal. The chassis provides a terminal-block with inputs
RST1+, RST1-, RST2+, and RST2- for wiring the remote reset signals to each
RTN. Each reset signal is routed to an opto-isolated input on the appropriate
RTN that requires a +24 V signal to cause a reset.

Reset Notes:
 Resetting a Remote RTN module creates a HealthFault that immediately
sets the WDOG light RED.
 Any Expansion chassis running with one healthy RTN. Reset detection will
also drive IOLOCK and IORESET to place the expansion rack and all output
signals into a known failsafe condition.
 Any Expansion chassis running with two healthy RTNs. Reset detection on
the SYSCON (System Controller) causes an immediate "Failover" to the
other STANDBY RTN who then becomes the new System Controller for this
chassis. Reset detection on the STANDBY unit causes a HealthFault that
removes it from STANDBY mode.
 The front-panel RUN/RESET led will be RED while reset is held and will turn
GREEN for a few seconds after releasing reset. After turning OFF, it will
again turn GREEN when the operating system starts to boot.

This module should be reset immediately before removing it from the

chassis. This notifies the module that it will be removed and provides
a graceful failover to another healthy Remote RTN module if
RESET available.
! MODULE
BEFORE REMOVAL

6.1.6—RTN Ports
Three Real Time Network ports (RJ45) provide communications between the
expansion chassis Remote RTN module and the main-chassis CPU A, B, and C
modules. Through these ports, expansion chassis I/O data is made available to
the GAP Application running in the main-chassis CPUs.

REMOTE RTN CABLES (COPPER)

 Double shielded, Cat 5 Ethernet cables (SSTP) are required for
customer installations.
 Cable length between the Main rack and RTN switch is 3 m (10 ft)
max.
 Cable length between the RTN switch and Expansion rack is 30 m
(100 ft) max.

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6.1.7—Ethernet Switch Hardware

For systems with more than a single RTN module, copper or fiber optic Ethernet
switches are required to achieve communication and hardware redundancy.
Specific Ethernet switches have been tested and approved to obtain expansion
chassis real time performance and redundancy.

Due to the critical nature of communications with an RTN expansion rack, it is

required to use Woodward approved copper and fiber Ethernet switches for
robust system operation. At the time of this writing, the following hardware part
numbers are approved.

 1752-423, Hirschmann copper Ethernet switch (RS2-TX, 8 port)

 1711-1069, Hirschmann Fiber Optic Switch (RS2-4TX/1FX)
 1751-6077, Hirschmann Fiber Optic Switch (RS2-3TX/2FX)

6.1.8—Expansion Racks using Copper or Fiber cables

MicroNet TMR5200 multiple-rack systems are supported by locating expansion
racks locally with the main chassis or in different remote locations using fiber
optic cables and Ethernet switches. A maximum of 3 MicroNet Plus expansion
racks (14 slot or 8 slot versions) or MicroNet Simplex expansion racks (6 or 12 slot
versions) are supported in up to 3 different remote locations using fiber optic Ethernet
switches. It is required to use Woodward approved hardware for robust operation.

Configuration Notes:
- A combination of approved copper and fiber optic Ethernet switches are
allowed.
- A maximum of 4 switches and 2 km of fiber cable shall be allowed in any
communication path.
- RTN cables from the main CPU rack to the local RTN switch hardware shall be
3 m (10') max.

 Copper Expansion: Using copper Ethernet cables and switches, each

expansion rack may be located up to 30 meters away from the main CPU
chassis.

 Fiber Optic Expansion: Using fiber optic cables and switches, each
expansion rack may be located up to 2 km away from the main CPU
chassis.

Fiber Optic Cable Specification

 62.5 / 125 μm multi-mode, duplex fiber
 Standard SC Type connectors
 Wavelength : 850 nm, 1300 nm
 Attenuation @ 1300 nm : < 1.5 db/km
 Bandwidth @ 1300 nm : > 500 MHz – km
 Flammability type OFNR (riser, UL-1666)
 Minimum bend radius of 7 cm
 Refer to Woodward reference dwg 9097-2077

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MicroNet TMR Manual 26167V1

6.1.9—RS-232 Service Port

An isolated RS-232 service port is located on the front of the Remote RTN
module. This port is for VxWorks operating system use only and cannot be
configured for application software use. The communication settings are fixed at
38.4 Kbaud, 8 data bits, no parity, 1 stop-bit, and no flow control.

For debug use, a null-modem cable and 5450–1065 Serial Adapter cable (PS2M
to DB9F) is required to attach this port to a PC. This port is to be used by
trained Field Service personnel only!

Shielded cable is required when connecting to the Remote RTN module’s serial
port. Using shielded cable will help ensure the robustness of the serial
communications.

Pin 1 – RS-232 Receive

Pin 2 – RS-232 Transmit
Pin 3 – Signal Ground
Pin 4 – Not Used
Pin 5 – Signal Ground
Pin 6 – Not Used

Figure 6-5—RTN Service Port (mini-DIN6F)

6.1.10—Troubleshooting / Flash Codes

The MicroNet Remote RTN module runs off-line and on-line diagnostics that
display troubleshooting messages through the debug Service Port and
AppManager. Off-line diagnostics run automatically on power-up and when the
Reset switch is asserted. On-line diagnostics run during normal Control System
operation when the GAP application is active. More information on diagnostics
tests, subsequent LED flash codes, and serial port messages is contained in the
VxWorks manual.

A table of the RTN fault LED flash codes is shown below:

Failure Flash Code

RAM Test Failure 1, 4
Real Time Clock Test Failure 2, 2
Floating Point Unit Test Failure 2, 3
Flash Test Failure 2, 4
HD1 Flash Test Failure 2, 5
I2C Bus Test Failure 2, 6
Module Installed in wrong slot 2, 7
Main Chassis CPU switch must be set to 0 3,5
Remote RTN Rate Group 5 Slip 3, 7
Remote RTN Rate Group 10 Slip 3, 8
Remote RTN Rate Group 20 Slip 3, 9
Remote RTN Rate Group 40 Slip 3, 10
Remote RTN Rate Group 80 Slip 3, 11
Remote RTN Rate Group 160 Slip 3, 12
Remote RTN Chassis Switch Invalid 4, 5
Backup Remote RTN Chassis Switch different from 4, 6
Primary Remote RTN
This module does not support the CAN port(s) 4, 7
This module needs a “footprint” update 4, 9

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Manual 26167V1 MicroNet TMR

6.2—Main Transceiver (XCVR) Module

6.2.1—Module Description
The Main XCVR module is only used with CPU 68040 systems. It allows
extension of the VME back plane to the expansion I/O Chassis. The Main XCVR
module sends and receives control, data, and address information to and from its
associated Remote Transceiver module (see next section of this chapter) in an
I/O chassis through a copper transceiver cable. The Main XCVR module is used
in the Main Chassis. See Figure 6-6 for a block diagram of the module.

Figure 6-6—Main XCVR Module Block Diagram

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MicroNet TMR Manual 26167V1

6.2.2—Module Specification
Parallel Interface: High-speed, differential line drivers
operating at VME transmission rate
Cable Interface: 100 pin metal shell Micro-D connector (2
per module)

Figure 6-7—Main XCVR Module

6.2.3—Installation
 The Main XCVR module can be installed in any slot in the Main Chassis.
 No jumpers are used to configure this module.
 This Transceiver module has no switches or LEDs.

6.2.4—Troubleshooting
1. If the Main XCVR module is not functioning or not functioning properly, verify
cable connections.
2. If the module is still not functioning properly after verifying the cable
connections, replace the cables connecting to module.
3. If the module is still not functioning properly after replacing cables, replace
the module.

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6.3—Remote Transceiver (XCVR) Module

6.3.1—Module Description
The Remote XCVR module is only used with CPU 68040 systems. The Remote
XCVR module receives and sends control, data, and address information via
cable to and from its associated Main XCVR module. This module must be used
in each Remote I/O Chassis that is connected to the Main Chassis via copper
cables.

The Remote XCVR module connects to the VME bus of the chassis. The bus
receiver/driver of the Remote Transceiver module interfaces with the VME bus,
exchanging control, data, and address information. The chassis decoder
determines if this chassis is to be accessed, and if so, it activates the
receiver/driver of this chassis' Remote Transceiver module to receive or send
information. Figure 6-8 is a block diagram of the Remote Transceiver module.

Figure 6-8—Remote XCVR Module Block Diagram

The bus-arbitration logic determines priority of bus-access operations and

controls the receiver/driver accordingly.

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MicroNet TMR Manual 26167V1
Table 6-1 shows the jumpers on the Remote XCVR module used to configure the
chassis ID.

Figure 6-9—Remote XCVR Module Jumpers

JPR1 JPR2 JPR3 JPR4

CHASSIS 1 0 0 0 1
CHASSIS 2 0 0 1 0
CHASSIS 3 0 0 1 1
CHASSIS 4 0 1 0 0
CHASSIS 5 0 1 0 1
CHASSIS 6 0 1 1 0
CHASSIS 7 0 1 1 1
CHASSIS 8 1 0 0 0
CHASSIS 9 1 0 0 1
CHASSIS 10 1 0 1 0
CHASSIS 11 1 0 1 1
CHASSIS 12 1 1 0 0
CHASSIS 13 1 1 0 1
CHASSIS 14 1 1 1 0
CHASSIS 15 1 1 1 1

Table 6-1—Remote XCVR Module Jumpers (JPR1–4)

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Manual 26167V1 MicroNet TMR

Figure 6-10—Remote XCVR Module

6.3.2—Module Specification
Parallel Interface: High-speed, differential line drivers
operating at VME transmission rate
Cable Interface: 100 pin metal shell Micro-D connector (2
per module)

6.3.3—Installation
 The Remote XCVR module has no switches or LEDs.
 All expansion chassis except for the last one in the chain should use the
Remote XCVR module without termination resistors. This module must be
installed in Slot 1.
 The last expansion chassis in the chain should use the Remote XCVR
module with termination resistors. This module must be installed in Slot 1.

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6.3.4—Troubleshooting
1. If the Remote XCVR module is not functioning or not functioning properly,
verify the cable connections.
2. If the module is still not functioning properly after verifying the cable
connections, replace the cables connecting to module.
3. If the module is still not functioning properly after replacing cables, replace
the module.

6.4—Transceiver Accessories
6.4.1—Description
These accessories are only used with CPU 68040 systems. Each expansion
chassis except the last one should have the T-Module mounted next to it. The
3-foot (0.9 m) cables should connect these expansion chassis to the T-Modules.
Connections from the Main Chassis, the last Expansion Chassis, and
connections between the T-Modules should be made with 10-foot (3 m) cables.

Figure 6-11—T-Module (I/O XCVR-Module)

Figure 6-12—Cables
[available in 3 ft (0.9 m) and 10 ft (3 m) lengths]
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Manual 26167V1 MicroNet TMR

6.4.2—Module Specification
Parallel Interface: High-speed, differential line drivers
operating at VME transmission rate
Cable Interface: 100 pin metal shell Micro-D
connector (2 per module)

6.4.3—Transceiver Accessories Installation (Outline)

The Main and Remote Transceiver modules must be connected

exactly as shown in the following diagrams (Figures 6-16 and 6-17).
The following notes apply on these figures.
Note 1: The Main Transceiver module can be installed in any slot in
the Main Chassis.
Note 2: All expansion chassis except for the last one in the chain
should use the module without termination resistors. This module
must be installed in Slot 1.
Note 3: The last expansion chassis in the chain should use the
module with termination resistors. This module must be installed in
Slot 1.
Note 4: All expansion chassis except the last one should have the
T-Module mounted next to it. The three-foot (0.9 m) cables should
connect these expansion chassis to the T-Modules. Connections
from the Main Chassis, the last Expansion Chassis, and connections
between the T-Modules should be made with ten-foot (3 m) cables.

Figure 6-13—Expansion I/O Chassis

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MicroNet TMR Manual 26167V1

Figure 6-14—Termination

6.5—Ethernet Module
6.5.1—Module Description
This Ethernet module is only used with CPU 68040 systems. The MicroNet™
Ethernet module is a 32 bit VME bus module which has been integrated into the
MicroNet product family. The module is designed to fully support auto-switching
10/100 Base-TX Ethernet connections, but has been configured to operate at
only 10 Mbps for use with legacy products.

The Ethernet module has a VME adapter board attached to allow its use in a
MicroNet chassis. However, this module is not “hot swappable” due to signal
integrity issues on the VME backplane. When inserted into a powered chassis,
the module will interrupt VME bus backplane communications and cause other
Woodward modules and expansion racks to shut down.

On power-up, the Ethernet board runs a series of self-tests that check the board
hardware. After successful completion of the tests, the red FAIL LED will turn
OFF. The self-tests may last 10–20 seconds.

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Due to addressing conflicts with the Pentium CPU and TMR5200, this
module can be used only with the Motorola 68040 CPU family.

Figure 6-15—Ethernet Module

LED Annunciations
The following LEDs annunciate board failure as well as different functions related
to Ethernet communications. When continuous communications are present, the
RX and TX LEDs will be ON continuously.

LEDs Name LED Color Description

LINK GREEN Indicates the Ethernet connection is good.
COL RED Indicates a collision on the Ethernet.
100 GREEN Indicates the Ethernet connection is functioning at
100 Mbps.
RX GREEN Indicates data is being received.
TX GREEN Indicates data is being received.
FAIL RED Indicates a module reset or self test failure.

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MicroNet TMR Manual 26167V1
10BaseT Ethernet
A 10BaseT RJ45 Ethernet connector is available for system use. This connection
is used for control configuration, data gathering, and networking of multiple
controls. In addition, this port may be relied upon for interfacing TCP/IP
Distributed I/O devices into the control system.

To ensure signal integrity and robust operation of Ethernet devices, an Ethernet

Interface FTM (Field Termination Module) is required when using this port. The
FTM’s primary function is to implement EMI shielding and cable shield
termination of the Ethernet cable. Along with the Ethernet Interface FTM, double-
shielded Ethernet cables (SSTP) are required. See the Ethernet Interface FTM
section below for more details.

6.5.2—Module Specifications
Ethernet Features
 Industry Standard 6U, VME-32 format
 Network interface conforming to the IEEE 802.3 standard
 Configured for 10BaseT communication support
 Module failure/reset, Link LED, Transmit, Receive, Collision, and 10/100
Mbps LEDs
 Supports Woodward communications such as Modbus, GAP Download, and
Tunable Capture/Download.

Electrical Specifications
Voltage: 5.0 Vdc, 5% tolerance
Power: 15.0 W max (13.5 W typical)
Processor: PowerPC 750, 400 MHz
Memory: 64 MB DRAM, 2 MB boot flash, 32 MB
user flash
Bus Interface: 32 bit VME bus
On board I/O: RJ45 10 Mbps Ethernet port
Hardware Configuration: VME address #1 or #2 configuration for
using 2 modules in a system

6.5.3—Installation
VME Address Configuration
The Ethernet module can be configured for an alternate VME address to support
the use of two modules in a MicroNet system. For dual module operation, both
the Woodward GAP and the module DIP switch must be configured properly.

The DIP switch (S2) is located directly behind the RJ45 Ethernet
connector.
NOT USED

NOT USED

VME1

FACTORY DEFAULTS VME Address

S2 DO NOT MODIFY CONFIG (S2-3)
VME1 Addr
ON OFF 1
ON 2

OFF 1 2 3 4 5 6 7 8
VIS-151
*SWITCH POSITIONS SHOWN AT DEFAULTS 02-27-2001
KDW

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6167V1 M
MicroNet TMR
RJ
J45 Ethernett Pinout

Coonnector Signal Mnemonic

S
RJ4
45 female Shielded RJ45
f
female receptacle

1 TX+
2 TX-
3 RX+
4 ---
5 ---
6 RX-
7 ---
8 ---
S
Shield Chassis GND
D

6..5.4—FTM
M Referen
nce
Etthernet Interfface FTM
Too ensure signaal integrity an
nd robust operation of Ethe
ernet devices, an Ethernet
Intterface FTM (Field
( Termination Module) is required when
w interfaccing Ethernet
de
evices to the CPU.
C The FTM’s primary function is to implement
i EMMI shielding
nd cable shield termination of the Ethern
an net cable. Alo
ong with this FTM,
F double
sh
hielded Ethernnet cables (SS STP) are requuired.

Pleease see Cha

apter 12 for th
he Ethernet In
nterface FTM specification
ns and wiring
infformation.

Etthernet Systeem Requirem ments

 This modu ule is for use with
w Motorolaa x040/060 CP PUs and cann not be used
with the Pe
entium CPU.
 System wiring requires using the Eth
hernet Interfacce FTM.
 System wiring requires using shielde
ed RJ45 Ethe ernet cables (ffor part
numbers, see
s Appendixx A):
double shie
elded Cat-5 Eth
hernet cable (SSTP), 1.5 ft (45
57 mm)
double shie
elded Cat-5 Eth
hernet cable (SSTP), 3 ft (914
4 mm)
double shie hernet cable (SSTP), 7 ft (2.1 m)
elded Cat-5 Eth
double shie
elded Cat-5 Eth
hernet cable (SSTP), 10 ft (3.00 m)
double shie
elded Cat-5 Eth
hernet cable (SSTP), 14 ft (4.33 m)
double shie
elded Cat-5 Eth
hernet cable (SSTP), 25 ft (7.66 m)
double shie
elded Cat-5 Eth
hernet cable (SSTP), 50 ft (155 m)
double shie
elded Cat-5 Eth
hernet cable (SSTP), 100 ft (330 m)

6..5.5—Tro
oubleshoo
oting
1. If the Etherrnet module iss not functioning or not fun nctioning prop perly, verify the
cable connections.
2. If the moduule is still not functioning
f prroperly after verifying
v the cable
c
connectionss, replace the e cables conn necting to mod dule.
3. If the moduule is still not functioning
f prroperly after replacing
r cables, replace
the module e.

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d 9
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MicroNet TMR Manual 26167V1

6.6—SIO Module
6.6.1—Module Description

Figure 6-16—SIO Module

The SIO (Serial In/Out) Module interfaces four serial communication ports to the
VME bus.

Figure 6-17 is a block diagram of the SIO module. The module manages four
serial ports. Port A(J1) and port B(J2) are RS-232 ports. Port C(J3) and Port
D(J4) are for RS-232, RS-422, or RS-485 communication protocols. Ports C and
D must be at the same baud rate when using 38.4 Kbaud or 57.6 Kbaud.

The processor on this module is a 68030. It controls the transfer of data between
the ports and the VME bus.

This module can have as much as 4 KB of Dual-Port RAM and 64 KB of PROM.

The local memory supports the 68030 processor on this module.

The SIO module has one LED (FAULT) and no switches.

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Figure 6-17—SIO Module Block Diagram

6.6.2—Module Specification
Ports 1 and 2: RS-232 @ 110–38.4 Kbaud
Ports 3 and 4: RS-232, RS-422, and RS-485 (software
selectable) @ 110–57.6 Kbaud
Software Support: Modbus RTU
Modbus ASCII
Woodward-specific service interface

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6.6.3—Installation
Termination
For RS-422, termination should be located at the receiver when one or more
transmitters are connected to a single receiver. When a single transmitter is
connected to one or more receivers, termination should be at the receiver
farthest from the transmitter. Figure 6-18 is an example.

Figure 6-18—RS-422 Terminator Locations

For RS-485, termination should be at each end of the cable. If termination can't
be located at the end of a cable, put it as close as possible to the ends. Figure
6-22 is an example.

Figure 6-19—RS-485 Terminator Locations

Termination is accomplished using a three-resistor voltage divider between a

positive voltage and ground. The impedance of the resistor network should be
equal to the characteristic impedance of the cable. This is usually about 100 to
120 Ω. The purpose is to maintain a voltage level between the two differential
lines so that the receiver will be in a stable condition. The differential voltage can
range between 0.2 and 6 V; the maximum voltage between either receiver input
and circuit ground must be less than 10 V. There is one termination resistor
network for each port located on the SIO board. Connection to this resistor
network is made through the 9-pin connectors on pins 6 and 9. See Figure 6-20
for termination and cable connection examples.

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Figure 6-20—Termination and Cable Connection Examples

Grounding and Shielding

The RS-422 and RS-485 specifications state that a ground wire is needed if there
is no other ground path between units. The preferred method to do this is to
include a separate wire in the cable that connects the circuit grounds together.
Connect the shield to earth ground at one point only. The alternate way is to
connect all circuit grounds to the shield, and then connect the shield to earth
ground at one point only. If the latter method is used, and there are non-isolated
nodes on the party line, connect the shield to ground at a non-isolated node, not
an isolated node. Figures 6-24 and 6-25 illustrate these cabling approaches.

Non-isolated nodes may not have a signal ground available. If a

signal ground is not available, use the alternate wiring scheme in
Figure 6-21 with the signal ground connection removed on those
nodes only.

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Figure 6-21—Preferred Multipoint Wiring Using Shielded Twisted-Pair Cable with

a Separate Signal Ground Wire

The SG (signal ground) connection is not required if signal ground is

unavailable.

Figure 6-22—Alternate Multipoint Wiring Using Shielded Twisted-Pair Cable

without a Separate Signal Ground Wire

6.6.4—Troubleshooting
1. If the SIO module is not functioning or not functioning properly, verify the
cable connections.
2. If the module is still not functioning properly after verifying the cable
connections, replace the cables connecting to module.
3. If the module is still not functioning properly after replacing cables, replace
the module.

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Chapter 7.
Discrete I/O Modules

7.1—Introduction
There are five types of discrete I/O modules currently available with the
MicroNet™ system. These include the 24/12 TMR Discrete Combo module (24
discrete inputs, 12 discrete outputs), 48/24 Discrete Combo module (48 discrete
inputs, 24 discrete outputs), 48 Ch DI module, 32 Ch DO module, and the 64 Ch
DO module.

7.2—24/12 TMR Discrete I/O Module

Each 24/12 TMR Discrete I/O module (TMR High Density Discrete module)
contains circuitry for twenty-four (24) discrete inputs and twelve (12) TMR
discrete outputs, and provides latent fault detection for each relay output. Each
discrete input may be 24 V, or 125 Vdc. Each relay output provides the option of
using a normally open contact, or a normally closed contact.

7.2.1—Physical Description
The modules slide into card guides in the control’s chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

Figure 7-1—24/12 TMR Discrete I/O Module

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Figure 7-2—24/12 TMR Discrete I/O Module Block Diagram

7.2.2—Specifications
Discrete Inputs
Number of channels: 24
Update time: 5 ms
Input type: Optically isolated discrete input
24 V Input thresholds: <8 Vdc = “OFF”, at .7 mA
>16 Vdc = “ON”, at 1.2 mA
125 V Input thresholds: < 24 Vdc = “OFF”, at .7 mA
>55 Vdc = « ON », at 4 mA
Input current : 3.5 mA @ 24 Vdc ; 8 mA @ 125 Vdc
External input voltage: 18-32 Vdc (LVD and UL) or
100–150 Vdc (UL)
Isolation voltage: 500 Vdc to earth ground,
1000 Vdc to control common
Time stamping: 1 ms resolution
Isolated 24 Vdc contact supply: 400 mA maximum

Discrete Outputs
Number of channels: 12
Update time: 5 ms
Relay type: Dust-tight, magnetic blow-out
Coil rating: 80 mA @ 24 Vdc, suppressor located on
circuit board
Minimum load: 50 mA @ 125 Vdc
Relay response time: 15 ms (operate and release)
Relay life expectancy: 50,000 operations @ rated load
Replaceability: Relays are socket mounted and retained by
a hold down spring

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Contact ratings:
5.0 A @ 240 Vac, 50/60 Hz (resistive) (meets UL ratings only)
3.0 A @ 240 Vac, 50/60 Hz (inductive)·(meets UL ratings only)
10.0 A @ 120 Vac, 50/60 Hz (resistive) (meets UL ratings only)
6.0 A @ 120 Vac, 50/60 Hz (inductive) (meets UL ratings only)
600 watt @ 120 Vac, 50/60 Hz (lamp) (meets UL ratings only)
3.0 A @ 150 Vdc (resistive) (meets UL ratings only)
1.2 A @ 150 Vdc (inductive) (meets UL ratings only)
10.0 A @ 28 Vdc (resistive) (meets LVD and UL ratings)
3.0 A @ 28 Vdc (inductive) (meets LVD and UL ratings)

7.2.3—24/12 TMR Discrete I/O Module and Associated

Components

Figure 7-3—Example TMR System Configuration

In a TMR system, each 24/12 TMR Discrete I/O module is connected through
two high density 62 conductor discrete cables to four FT Relay/Discrete Input
modules. All of the I/O on 24/12 TMR Discrete I/O module is accessible on the
relay modules. See Figure 7-3 for an example.

7.2.4—24/12 TMR Discrete I/O Module Operation

This module includes no potentiometers and requires no calibration. A 24/12
TMR Discrete I/O module may be replaced with another module of the same part
number without any adjustment.

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7.2.4.1—Field Wiring

Figure 7-4—Wiring Diagram for a FT Relay/Discrete Input Module

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7.2.4.2—Discrete Inputs
The 24/12 TMR Discrete I/O Discrete module accepts 24 discrete inputs. Each of
the control’s four FT Relay/Discrete Input modules accepts six contact inputs.
Contact wetting voltage can be supplied by the control or from an external
source. 24 Vdc contact wetting voltage is available on each relay module.
Optionally, an external 18-32 Vdc power source or an external 100–150 Vdc
power source can be used to source the voltage. Because all discrete inputs are
fully isolated, a common reference point must be established between the inputs
and the contact power source. If the 24 Vdc internal power source is used for
contact wetting, jumpers are required between relay module terminals 33, 34,
and 35. If an external power source is used for contact wetting, the external
source’s common must be connected to the relay module’s discrete input
commons (terminals 34 and 35).

The inputs have components which establish a voltage threshold and a current
threshold, to prevent a closed indication due to the leakage current of most solid
state relays. The discrete inputs also have time stamping on a change of state,
with 1 millisecond resolution.

Figures 7-5 and 7-6 illustrate the different discrete input wiring configurations
based on the input voltage.

Figure 7-5—Optional Internal 24 Vdc Contact Wetting Configuration

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Figure 7-6—Optional External 24/125 Vdc Contact Wetting Configuration

7.2.4.3—Configuration Notes

If there is 125 Vdc on the FT Relay/Discrete Input module terminal

blocks, there will be 125 Vdc on the relay module sub D connectors
and on the cable when it is connected to the relay module. For this
reason, any power should be removed from the relay module
terminal blocks, if possible, before installing the 24/12 TMR Discrete
I/O module or the relay module.

Refer to Figures 7-5 and 7-6 for contact input wiring.

 All contact inputs accept dry contacts.
 The internal 24 Vdc power source, an external 18-36 Vdc (UL and LVD)
power source, or an external 100–150 Vdc (UL only) power source can be
used for circuit wetting.
 If the 24 Vdc internal power source is used, jumpers are required between
FT Relay/Discrete Input module terminals 33 and 34, and terminals 33 and
35.
 If an external power source is used for contact wetting, the external source’s
common must be connected to the relay module’s discrete input commons
(terminals 34 and 35). Power for sensors and contacts must be supplied by
the control’s power supplies, or the external power supply must be Class II
at 30 Vdc or less and outputs must be fused with appropriately sized fuses
(a maximum current rating of 100V, where V is the supply's rated voltage
or 5 A, whichever is less).
 Verify that the correct discrete input terminals are used, for low or high
voltage inputs.

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Figure 7-7—TMR Discrete Output

7.2.4.4—Latent Fault Detection

It is important to detect latent faults in a fault tolerant system, because although a
single fault may go undetected, if another fault occurs it could cause a shutdown.

Discrete outputs can be configured to use latent fault detection to identify relay
failures without affecting a relay output’s state. Six individual relays make up one
relay output. When a relay output is closed, the contacts of all six relays are
closed. Because of the series-parallel configuration of the relays, the failure of
any two individual relays will not cause the output to open. The individual relays
are periodically opened and reclosed in pairs to ensure that they are in the
correct state and that they change state.

When a relay output is open, the contacts of all six relays are open. Because of
the series-parallel configuration of the relays, the failure of any one relay will not
cause the output to close. The individual relays are periodically closed and
reopened one by one to ensure that they change state.

Readback circuitry allows the state of each relay contact to be detected. Any
failures are annunciated, and further testing is disabled without affecting the state
of the relay output contact or control operation.

Latent fault detection is not appropriate for all applications or circuits. The
control’s latent fault detection logic can only work with circuits using voltages
between 18-32 Vdc, 100–150 Vdc, or 88-132 Vac. For latent fault detection to
work, a small leakage current is passed through the circuit’s load. Depending on
the size of the load, the leakage current may be enough to cause a load to be on
or active when a relay contact is open. In this case, the individual relay’s latent
fault detection logic may be disabled, eliminating the leakage current.

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With latent fault detection, when a relay contact is closed no difference in
operation is experienced; the relay output appears as a closed contact. However,
when a relay contact is open, it appears to the interfaced circuit as a large
resistor instead of an open contact. A small amount of current is leaked to the
load, resulting in a developed voltage across the load. In most cases this has no
bearing on the circuitry, because only a small amount of voltage is developed
across its load. However, when a relay output is used with a very high resistance
load (low current load), enough voltage may be developed across the load to
prevent it from de-energizing.

Verifying That Latent Fault Detection Can Be Used With a Relay Output
1. Verify that the circuit the relay output is used with has a voltage level of 18-
32 Vdc, 100–150 Vdc, or 88-132 Vac.
2. Use graph which corresponds to the circuit’s voltage level to determine if the
voltage developed across the load (due to the leakage current) is lower than
the load’s drop-out voltage level.
 Acquire the resistance of the load (relay, motor, solenoid, etc.) to be driven
by the relay.
 Acquire the load’s minimum drop-out voltage.
 From the bottom of the graph, follow the line corresponding to the load’s
resistance up to the point at which it intersects the circuit power line. At this
point the corresponding voltage level (on the left of the graph) is the level of
voltage that will be developed across the load due to leakage current.

If circuit voltage is acceptable, and the developed load voltage (from the graph) is
less than the load’s drop-out voltage, latent fault detection can be used with the
circuit.

If the developed load voltage is greater than the load’s drop-out voltage, it is
recommended that latent fault detection be disabled or that a resistor be
connected in parallel (shunt) with the load. A correctly sized resistor connected in
parallel with the circuit load will decrease the developed load voltage below the
load’s drop-out voltage level. Using the corresponding latent fault detection graph
and the load’s minimum drop-out voltage, perform the above procedure in
reverse (see Step #2) to determine an acceptable shunt resistance. When
selecting a shunt resistor, also verify that its voltage and wattage ratings meet
that of the circuit.

Latent Fault Detection Verification Example

(Figure 7-9)
Circuit power = 110 Vac; load resistance = 200 ohms; load drop-out voltage = 25
Vac

Using the graph below, the intersection point between the 200 ohm load
resistance line and the 110 Vac line was found. From this intersection point it
was determined that the voltage developed across the load due to leakage
current when the relay is open, is approximately 7.5 Vac. This voltage level is
lower than the load’s 25 Vac drop-out voltage, so latent fault detection can be
used.

If, however, the load resistance were 1200 ohms, the intersection would be
approximately 29.5 Vac, too high for latent fault detection. By following the graph
along the allowable drop-out voltage, 25 Vac, it can be determined that a total
load resistance of 900 Ohms or less is needed. By placing a properly rated 3600
ohm resistor in shunt with the load, (1200 ohms//3600 ohms=>900 ohms) latent
fault detection can be used.

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Figure 7-8—Latent Fault Detection Verification Graph–18-32 Vdc Circuitry

Figure 7-9—Latent Fault Detection Verification Graph–18-132 Vac Circuitry

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Figure 7-10—Latent Fault Detection Verification Graph–100–150 Vdc Circuitry

7.2.4.5—Relay Jumper Configurations

Relay coil power should be supplied by the control, because this supply is fault
tolerant. Jumper banks (four jumpers in one package) are provided on each relay
module to allow field selection of internal or external relay coil power. See Figure
14-11. If it is necessary to supply external relay coil power, the relay coil power
jumper bank must be moved from its defaulted INT. position to the EXT. position.

To retain circuit integrity if an external power supply is used for relay coil power,
the external power supply must be an isolated 24 Vdc source with +5%
regulation. It is recommended that a start-up routine be utilized to remove the
source during system power-up and power-down. This routine will guarantee that
no relay is inadvertently energized due to system power-up surges. (By using the
relay module’s internal relay coil power this start-up routine is automatically
performed.)

Each relay output has two banks of jumpers. One jumper-bank (a set of nine
jumpers) is used to match the latent fault detection circuit with the circuit voltage
to which it is being interfaced. The second jumper bank (a set of four jumpers) is
used to select which set of relay contacts (N.O. or N.C.) is tested by the latent
fault detection logic. During operation, only one set of relay contacts (normally
open or normally closed) can be tested. The set of relay contacts tested should
be same set of relay contacts used by the load. Refer to [Figure 14-11 and 14-
12]. Latent fault detection circuitry can be jumper configured to be compatible
with the following circuit voltages:
 18-32 Vdc circuit power
 88-132 Vac circuit power
 100–150 Vdc circuit power

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Figure 7-11—Jumper and Relay Location Diagram

After all jumper-banks have been correctly positioned, mark the placement of
each jumper-bank on the FT Relay/Discrete Input module cover labels. See the
figure below.

Figure 7-12—FT Relay/Discrete Input Module Labels

Configuration Notes

HIGH VOLTAGE—If there is 125 Vdc on the FT Relay/Discrete Input

module terminal blocks, there will be 125 Vdc on the relay module
sub D connectors and on the cable when it is connected to the relay
module. For this reason, any power should be removed from the
relay module terminal blocks, if possible, before installing the 24/12
TMR Discrete I/O module or the relay module.

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 Refer to Figure 7-13 for relay output wiring.
 Verify that each set of relay contacts meets the power requirements of the
circuit with which it is being used. Interposing relays are required in cases
where the interfaced circuit demands relay contacts with a higher power
rating. If interposing relays or other inductive loads are required, it is
recommended that interposing relays with surge (inductive kickback)
protection be used. Improper connection could cause equipment damage.
 Verify that system power is off before removing or installing any relay
module jumper. Use ESD precautions when removing and installing relay
module jumper-banks.
 Select internal or external relay coil power. If the control’s internal power is
used, verify that the relay module’s “Relay Coil Power Jumper” bank is in
the INT. position. If external relay coil power is supplied, move the relay
module’s “Relay Coil Power Jumper” bank to the EXT. position and verify
that the external source is fully isolated. (Mark the module’s label to indicate
jumper position.)
 Verify that latent fault detection can be used with each relay output.
 If latent fault detection cannot be used with the relay output, verify that the
relay’s latent fault detection jumper-banks are in their disabled positions.
(Mark the module’s label to indicate jumper position.) Alternatively, an
external resistor can be wired in parallel with the load to allow latent fault
detection to be used with the relay output. In this case it is the customer’s
responsibility to calculate the required resistor ratings and install the
resistor.
 If latent fault detection can be used with the relay output, move the relay’s
latent fault detection jumper-bank to the correct position for the circuit
power. Also select which set of relay contacts (N.O. or N.C.) are to be tested
by the latent fault detection logic. (Mark the module’s labels to indicate
jumper positions.)

Figure 7-13—Example Relay Output Wiring Diagram

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7.2.4.6—Fault Detection (Module Hardware)
Each 24/12 TMR Discrete I/O module has a red Fault LED that is turned on when
the system is reset. During initialization of a 24/12 TMR Discrete I/O module,
which occurs after every CPU reset, the CPU turns the Fault LED on. The CPU
then tests each 24/12 TMR Discrete I/O module using diagnostic routines built
into the software. If the diagnostic test is not passed, the LED remains on or
blinks. If the test is successful, the LED goes off. If the Fault LED on a 24/12
TMR Discrete I/O module is illuminated after the diagnostics and initialization
have been run, the module may be faulty or may be located in the wrong slot.

Number of LED Flashes Failure

2 Micro-controller internal RAM test failure
3 External RAM high and low byte test failure
4 External RAM low byte failure
5 External RAM high byte failure
6 EEPROM failure
7 Software not running
8 System monitor fault
9 MFT pulses missing

Table 7-1—LED Indications of Failure

Fault Detection (I/O)

In addition to detecting 24/12 TMR Discrete I/O module hardware faults, the
application software may detect I/O faults.

Discrete Input Faults. The application software can detect faults by comparing
the inputs from the three kernels.

Discrete Output Faults. The module monitors relay coil voltage and contact
states. The contacts change state periodically to allow latent fault detection. The
application determines the course of action in the event of a fault.

Microcontroller Faults. The system monitors a software watchdog, a hardware

watchdog, and a software watchdog on the VME bus communications. All
outputs are shut down in the event of a microcontroller fault.

7.2.4.7—24/12 TMR Discrete I/O Module Troubleshooting Guide

If during normal control operation all of a chassis’ 24/12 TMR Discrete I/O
modules have Fault LEDs on, check the chassis’ CPU module for a failure. If
during normal control operation only the 24/12 TMR Discrete I/O module’s Fault
LED is on or flashing, insure that it is installed in the correct slot. If it is, then
replace that 24/12 TMR Discrete I/O module. See instructions for module
replacement in Chapter 21, Installation and Service. When a 24/12 TMR Discrete
I/O module fault is detected, its outputs should be disabled or de-energized.

Discrete Inputs
If a discrete input is not functioning properly, verify the following:
 Measure the input voltage on the terminal block. It should be in the range of
18-32 Vdc for the low voltage input terminal blocks, or 100–150 Vdc for the
high voltage terminal blocks.
 Check the wiring. If the inputs are reading open, look for a loose connection
on the terminal blocks, disconnected or misconnected cables, or a missing
jumper on the terminal block.
 Check the software configuration to ensure that the input is configured
properly.

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 If the other channels on the 24/12 TMR Discrete I/O module are also not
working, check the fuse on the 24/12 TMR Discrete I/O module. See
instructions for module replacement in Chapter 21, Installation and Service.
This fuse is visible and can be changed through the bottom of the module. If
this fuse is blown, fix the wiring problem and replace the fuse with another
fuse of the same type and rating.

After verifying all of the above, remove the 24/12 TMR Discrete I/O module and
exchange the J1 and J2 cables. See instructions for replacing the module in
Chapter 21, Installation and Service. If the problem moves to a different channel,
replace the cable. If not, exchange the cables at the FT Relay/Discrete Input
modules so J1 is driving J2 and vice versa. If the problem moves to a different
input, replace the 24/12 TMR Discrete I/O module. If the fault remains with the
same input, replace the FT Relay/Discrete Input module. See instructions for
replacing the FT Relay/Discrete Input modules in Chapter 21, Installation and
Service.

Discrete Outputs
If a discrete output is not functioning properly, verify the following:
 Check the wiring for a loose connection on the terminal blocks and
disconnected or misconnected cables.
 Verify that the current through the relay contact does not exceed the contact
rating.
 Make sure that if latent fault detection is being used, the trickle current
through the relay is insufficient to energize the relay load. See Figures 15-8
through 15-10.
 If the other output channels on the 24/12 TMR Discrete I/O module are also
not working, check the fuse on the 24/12 TMR Discrete I/O module. See
instructions for module replacement in Chapter 21, Installation and Service.
This fuse is visible and can be changed through the bottom of the module. If
this fuse is blown, fix the wiring problem and replace the fuse with another
fuse of the same type and rating.
 Check the software configuration to ensure that the output is configured
properly.

After verifying all of the above, remove the 24/12 TMR Discrete I/O module and
exchange the J1 and J2 cables. See instructions for replacing the module in
Chapter 21, Installation and Service. If the problem moves to a different channel,
replace the cable. If not, exchange the cables at the FT Relay/Discrete Input
modules so J1 is driving J2 and vice versa. See instructions for replacing the
module in Chapter 21, Installation and Service. If the problem moves to a
different relay, replace the 24/12 TMR Discrete I/O module or the relay. See
instructions for replacing the FT Relay/Discrete Input modules and relays in
Chapter 21, Installation and Service. If the fault remains with the same relay,
replace the relay or the FT Relay/Discrete Input module.

7.3—48/24 Discrete Combo Module

7.3.1—Module Description
A 48/24 Discrete Combo module contains circuitry for forty-eight discrete inputs
and twenty-four discrete outputs. These modules have no potentiometers and
require no calibration. A module may be replaced with another module of the
same part number without any adjustment. There are two different FTM I/O
configurations for the 48/24 Discrete Combo Module.

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Configuration 1 consists of one 48/24 Discrete FTM connected to the 48/24
Discrete Combo module via two High Density Analog/Discrete cables. The 48/24
Discrete FTM is then connected to either two 16 Ch Relay Modules or one 32 Ch
Relay Module via a Low Density Discrete Cable(s).

Configuration 2 consists of two 24/12 Discrete FTMs (DIN rail mounted)

connected to the 48/24 Discrete Combo module via two High Density
Analog/Discrete cables.

The discrete inputs are optically isolated and accessible through either the 48/12
Discrete FTM or the 24/12 Discrete FTM depending on the configuration. The
discrete outputs are accessible through either the 24/12 Discrete FTM or the two
16 Ch Relay Modules or the one 32 Ch Relay Module when so configured. See
Figures 7-15 and 7-20 for examples of configurations.

Figure 7-14—Discrete Combo Module

7.3.2—Module Specification
Discrete Inputs
Number of channels: 48
Update time: 5 ms
Input type: Optically isolated discrete input
(galvanically isolated)

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48/24 Discrete FTM
Input thresholds:
Low voltage: 8 Vdc at 1.5 mA = “OFF”
> 16 Vdc at 3 mA = “ON”
High voltage: <29 Vdc at 1.8 mA = “OFF”
>67 Vdc at 4 mA = “ON”
Input current: 4 mA @ 24 Vdc; 2.6–5 mA @ 125 Vdc
External input voltage: 18–32 Vdc (UL and LVD), or 100–150
Vdc (UL) w/ high Voltage FTM
Isolation voltage: 500 Vdc to earth ground, 1000 Vdc to
control common
Time stamping: 1 ms resolution
Isolated 24 Vdc contact supply: 400 mA maximum

For the 24/12 Discrete FTM input specifications, see Chapter 12.

Discrete Outputs
Number of channels: 24
Update time: 5 ms

For the 24/12 Discrete FTM, 16 Ch Relay Module, and the 32 Ch Relay Module
output specifications, see Chapter 12.

7.3.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

There are two different FTM I/O configurations for the 48/12 Discrete Combo
Module.

Configuration 1
Configuration 1 consists of one 24 Vdc or 125 Vdc 48/24 Discrete FTM
connected to the 48/24 Discrete Combo module via two High Density
Analog/Discrete cables. The top connector on the 48/24 Discrete Combo module,
which is labeled J1, connects to J1 on the 48/24 Discrete FTM, and J2 connects
to J2. There are two versions of the FTM, one for 24 Vdc inputs, and one for 125
Vdc inputs. The LVD applies only to the 24 Vdc version. The 24 Vdc 48/24
Discrete FTM handles 24 Vdc input signals and the 125 Vdc 48/24 Discrete FTM
handles 125 Vdc input signals. Either 48/24 Discrete FTM is then connected to
either two 16 Ch Relay Modules or one 32 Ch Relay Module via a Low Density
Discrete Cable(s) via the third connector. See Figure 7-15 for an example of
configuration.

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Power Supply Power Supply CPU 48/24

#1 #2 DIO

J1
P1

J2
P1

High Density Analog/Discrete Cable

High Density Analog/Discrete Cable

Low Density
Discrete Cable

P1
J1
32Ch Relay Module

P2 P2 P2 OR Low Density
J1 J2 J3 Discrete Cable
24VDC 48/24 Discrete FTM or

P1
J1

P1

P2
J1
J2
125VDC 48/24 Discrete FTM
16Ch Relay Module 16Ch Relay Module

Figure 7-15—Configuration 1, One 48/24 Discrete FTM with Relay Module(s)

All of the discrete inputs on the module are accessible on the FTM, and the
channels are labeled to correspond to their designation in the application
software (discrete input 1 on the FTM will be discrete input 1 in the application
software).

Discrete Inputs
Each 48/24 Discrete Combo module accepts 48 contact inputs. The 48/24
Discrete FTM may supply contact wetting voltage. Optionally, an external 18–32
Vdc power source or an external 100–150 Vdc power source can be used to
source the circuit wetting voltage. If the 24 Vdc internal power source is used for
contact wetting, a jumper is required between FTM terminals 98 and 99. If an
external power source is used for contact wetting, the external source’s common
must be connected to the FTM’s discrete input common, terminal 49. If 125 Vdc
contact inputs are needed, the High Voltage (125 Vdc) FTM must be used. The
FTM provides a common cage-clamp terminal connection for customer field
wiring. Figures 7-16 and 7-17 illustrate different discrete input wiring
configurations based on the input voltage.

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Figure 7-16—Discrete Input Interface Wiring to a 24 Vdc 48/24 Discrete FTM

Figure 7-17—Discrete Input Interface Wiring to a 125 Vdc 48/24 Discrete FTM

HIGH VOLTAGE—If the high voltage FTM is being used, and there is
125 Vdc on the FTM terminal blocks, there will be 125 Vdc on the FTM
sub D connectors and on the cable when it is connected to the FTM.
For this reason, any power should be removed from the FTM terminal
blocks before installing the 48/24 Discrete Combo module or the
FTM.

Configuration Notes:
 Refer to Chapter 12 for Discrete Input wiring.
 Each 48/24 Discrete I/O module can only accept one input voltage range, 24
Vdc (LVD and UL) or 125 Vdc (UL only).
 All contact inputs accept dry contacts.
 24 Vdc FTM only—If the internal 24 Vdc is used, a jumper must be added to
tie the internal 24 Vdc to the bussed power terminal blocks (see Figure
6-16).
 24 Vdc FTM only—If an external 24 Vdc is used, the common for the
external 24 Vdc must be tied to the discrete input common (see Figure
6-16). Power for contacts must be supplied by the control’s power supplies,
or the external power supply outputs must be rated to Class II at 30 Vdc or
less and outputs must be fused with appropriately sized fuses (a maximum
current rating of 100  V, where V is the supply’s rated voltage or 5 A,
whichever is less).
 High Voltage FTM only—The common for the 125 Vdc must be tied to the
discrete input common (see Figure 7-17).

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Discrete Outputs
For the 48/24 Discrete Combo FTM configuration, there are three types of relay
output boxes that can be used. These consist of the 16 Ch Relay (Phoenix)
Module, 16 Ch Relay Module, and the 32 Ch Relay Module (see Chapter 12 for a
description of the available modules). The relay modules connect to the 48/24
Discrete FTM through individual cables and provide a common cage-clamp
terminal connection for customer field wiring. The discrete outputs on the 48/24
Discrete I/O module are non-isolated; the isolation takes place in the relay boxes.

Discrete outputs 9, 10, 11, 12, 21, 22, 23, and 24, drive two relays per output
(see Table 7-2). Internal wiring on the 48/24 Discrete I/O FTM provides this dual
relay functionality. The application software may use these relays for outputs
where extra relay contacts are needed, such as alarm or shutdown outputs.

Discrete Outputs 16 Channel Relay Mod.(s) 32 Channel Relay Mod.

1-8 Mod. 1 Ch. 1-8 Ch. 1-8
9 Mod. 1 Ch. 9, 10 Ch. 9,10
10 Mod. 1 Ch. 11, 12 Ch. 11, 12
11 Mod. 1 Ch. 13, 14 Ch. 13, 14
12 Mod. 1 Ch. 15, 16 Ch. 15, 16
13-20 Mod. 2 Ch. 1-8 Ch. 17-24
21 Mod. 2 Ch. 9, 10 Ch. 25, 26
22 Mod. 2 Ch. 11, 12 Ch. 27, 28
23 Mod. 2 Ch. 13, 14 Ch. 29, 30
24 Mod. 2 Ch. 15, 16 Ch. 31, 32

Table 7-2—Discrete Outputs/Relay Module Configuration

See Chapter 12 for field wiring of discrete output relays.

Figures 7-18 and 7-19 illustrate examples of different discrete output wiring
configurations.

Figure 7-18—Relay Output Interface Wiring to a 16 Ch Relay Module

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Figure 7-19—Relay Output Interface Wiring to a 32 Ch Relay Module

Configuration Notes
 Verify that each set of relay contacts meets the power requirements of the
circuit with which it is being used. Interposing relays are required when the
interfaced circuit demands relay contacts with a higher power rating. If
interposing relays or other inductive loads are required, it is recommended
that interposing relays with surge (inductive kickback) protection be used.
Improper connection could cause serious equipment damage.

Configuration 2
Configuration 2 consist of two 24/12 Discrete FTMs (DIN rail mounted)
connected to the 48/24 Discrete Combo module via two High Density
Analog/Discrete cables. See Figure 7-20 for an example of configuration.

Power Supply Power Supply CPU 48/24

#1 #2 DIO

J1
P1

J2
P1

High Density Cable

High Density Cable

P2
J1

24/12 Discrete FTM

P2
J1

24/12 Discrete FTM

Figure 7-20—Configuration 2, Two 24/12 Discrete FTMs

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Both the 48 discrete inputs and 24 discrete outputs are wired to the 24/12
Discrete FTM. An external 24 Vdc source connection to the FTM is required for
discrete input contact sensing and relay coil energizing. For wiring information on
the 24/12 Discrete FTM, see Chapter 12.

Discrete Inputs
Each 24/12 Discrete FTM accepts 24 contact inputs. The 24/12 Discrete FTM
may supply contact wetting voltage. Optionally, an external 18–32 Vdc power
source can be used to source the circuit wetting voltage. If the 24 Vdc internal
power source is used for contact wetting, a jumper is required between FTM
terminals on TB9. If an external power source is used for contact wetting, the
external source’s common must be connected to the FTM’s discrete input
common, terminal 49 (see Figure 7-21).

Internal External

TB6
Channel 1 1

25
Field Contacts
Channel 2 2

26

48/24
Discrete
Combo TB9
Module

Jumper

Optional
TB8 External
Excitation
+24VDC 50 NC

24Ret 49

TB10
Cable
91 Ground to
Sheild
DIN rail
92

Figure 7-21—Discrete Input Interface Wiring to a 24/12 Discrete FTM

Configuration Notes:
 Refer to Chapter 12 for Discrete Input wiring.
 All contact inputs accept dry contacts.
 If the internal 24 Vdc is used, a jumper must be added to tie the internal 24
Vdc to the bussed power terminal blocks (see Figure 7-21).
 If an external 24 Vdc is used, the common for the external 24 Vdc must be
tied to the discrete input common (see Figure 7-21). Power for contacts
must be supplied by the control’s power supplies, or the external power
supply outputs must be rated to Class II at 30 Vdc or less and outputs must
be fused with appropriately sized fuses (a maximum current rating of 100/V,
where V is the supply’s rated voltage, or 5 A, whichever is less).

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Discrete Outputs
The discrete outputs on the 48/24 Discrete I/O module are non-isolated; the
isolation takes place in the 24/12 Discrete FTM. See Chapter 12 for field wiring of
discrete output relays. Figure 7-22 illustrates an example of a discrete output
wiring configuration.

Internal External

TB1
K1 +V
53
U1
K1 52 Relay 1

Channel 1 51
48/24
Discrete
Load
Combo
Module

K13 K13
IO Lock TB3
47 +24VDC (A)

48 24Ret (A)

49 +24VDC (B)
Optional
50 24Ret (B)

Figure 7-22—Relay Output Interface Wiring to a 24/12 Discrete FTM

Configuration Notes
 Verify that each set of relay contacts meets the power requirements of the
circuit with which it is being used. Interposing relays are required when the
interfaced circuit demands relay contacts with a higher power rating. If
interposing relays or other inductive loads are required, it is recommended
that interposing relays with surge (inductive kickback) protection be used.
Improper connection could cause serious equipment damage.

7.3.4—FTM Reference
See Chapter 12 for detailed wiring of FTMs. See Appendix A for part number
Cross Reference for modules, FTMs, and cables.

7.3.5—Troubleshooting
Fault Detection (Module Hardware)
Each 48/24 Discrete Combo module has a red Fault LED that is turned on when
the system is reset. During initialization of a 48/24 Discrete Combo module,
which occurs after every CPU reset, the CPU turns the Fault LED on. The CPU
then tests each 48/24 Discrete Combo module using diagnostic routines built into
the software. If the diagnostic test is not passed, the LED remains on or blinks. If
the test is successful, the LED goes off. If the Fault LED on a 48/24 Discrete
Combo module is illuminated after the diagnostics and initialization have been
run, the module may be faulty or may be located in the wrong slot.

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Number of LED Flashes Failure

2 Micro-controller internal RAM test failure
3 External RAM high and low byte test failure
4 External RAM low byte failure
5 External RAM high byte failure
6 EEPROM failure
7 Software not running
8 System monitor fault
9 MFT pulses missing

Table 7-3—LED Indications of Failure

Fault Detection (I/O)

In addition to detecting 48/24 Discrete I/O module hardware faults, the
application software may detect I/O faults.
Discrete Output Faults: The module monitors the FTM control voltage and
annunciates faults. The application software determines the course of action in
the event of a fault.
Microcontroller Faults: The system monitors a software watchdog, a hardware
watchdog, and a software watchdog on the VME bus communications. All
outputs are shut down in the event of a microcontroller fault.

Figure 7-23—48/24 Discrete Combo Module Block Diagram

If during normal control operation all of a chassis’ 48/24 Discrete Combo

modules have Fault LEDs on, check the chassis’ CPU module for a failure. If
during normal control operation only the 48/24 Discrete Combo module’s Fault
LED is on or flashing, insure that it is installed in the correct slot. If it is, then
replace that 48/24 Discrete Combo module. When a module fault is detected, its
outputs should be disabled or de-energized.

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Discrete Inputs
If a discrete input is not functioning properly, verify the following:
1. Measure the input voltage on the terminal block. It should be in the range of
16–32 Vdc for the low voltage FTM or 100–150 Vdc for the high voltage
FTM.
2. Check the wiring. If the inputs are reading open, look for a loose connection
on the terminal blocks, disconnected or misconnected cables, or a missing
jumper on the terminal block.
3. Check the application software configuration to ensure that the input is
configured properly.
4. If the other channels on the 48/24 Discrete Combo module are not working
either, check the fuse on the 48/24 Discrete Combo module. See the
instructions in Chapter 15 for replacing the module. This fuse is visible and
can be changed through the bottom of the module. If this fuse is blown, fix
the wiring problem and replace the fuse with another fuse of the same type
and rating.
5. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace the
48/24 Discrete Combo module.
6. If the readings are incorrect on several channels of the 48/24 Discrete
Combo module, corresponding to both cables, replace the 48/24 Discrete
Combo module.
7. If replacing the module does not fix the problem, replace the FTM. See the
instructions in Chapter 15 for replacing the FTM.

Discrete Outputs
If a discrete output is not functioning properly, verify the following:
1. Check the wiring for a loose connection on the terminal blocks, or
disconnected or misconnected cables.
2. Verify that the current through the relay contacts is not greater than the relay
contact rating.
3. If the other output channels on the 48/24 Discrete Combo module are not
working either, check the fuse on the 48/24 Discrete Combo module. See
the instructions in Chapter 15 for replacing the module. This fuse is visible
and can be changed through the bottom of the module. If this fuse is blown,
fix the wiring problem and replace the fuse with another fuse of the same
type and rating.
4. Check the software configuration to ensure that the output is configured
properly.
5. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, exchange
the cables at the FTM, so J1 is driving J2 and vice versa. If the problem
moves to a different relay, replace the 48/24 Discrete Combo module. If the
fault stays with the same relay, replace the relay or the relay module. See
instructions for replacing the relay modules in Chapter 15. If replacing the
relay module does not fix the problem, replace the cable between the relay
module and the FTM, or replace the FTM itself. See the instructions in
Chapter 15 for replacing the FTM.

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7.4—48 Channel Discrete Input Module

7.4.1—Module Description
Each 48 Channel Discrete Input (48 Ch DI) Module is connected through two low
density discrete cables to two separate FTMs. There are two types of FTMs
available for use with the 48 Ch DI Module; the 24 Vdc Discrete Input/Output
FTM and the Discrete Input (With LEDs) FTM (see Chapter 12 for additional
information on this FTM module). The 24 Vdc Discrete Input/Output FTM doesn’t
have LEDs and the Discrete Input (with LEDs) FTM has LEDs. All I/Os on the
module are accessible on the FTMs, and the channels are labeled sequentially to
correspond to their software locations (for example, discrete input 1 on the FTM
will be discrete input 1 in the application software).

Figure 7-24—Discrete Input Module

This module receives discrete signals from 48 separate switches or relay

contacts, and sends this data to the CPU. The inputs are optically isolated from
the balance of the MicroNet control circuitry. The module system provides
isolated +24 Vdc power for these external contacts on the 24 Vdc Discrete
Input/Output FTM. The Discrete Input (With LEDs) FTM requires an external
contact wetting power supply.

There are no potentiometers for tuning and requires no calibration. A module

may be replaced with another 48 Ch DI Module of the same part number without
any adjustment.

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7.4.2—Module Specification
Number of Channels: 48
Input Type: Optically isolated discrete input
Input Thresholds: < 8 Vdc = "OFF"
> 16 Vdc = "ON"
Input Current: 3 mA @ 24 Vdc
Contact Power: Module provides isolated 24 Vdc, 0.3 A

7.4.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

Each 48 Ch DI Module is connected through two low density discrete cables to

two 24 Vdc Discrete Input/Output FTMs or Discrete Input (With LEDs) FTMs. All
I/Os on the module are accessible on the FTMs, and the channels are labeled
sequentially to correspond to their software locations (for example., discrete input
1 on the FTM will be discrete input 1 in the application software). The FTM
plugged into J1 handles channels 1–24, and the FTM plugged into J2 handles
channels 25–48. See Figure 7-25 for system installation configuration.

Power Supply Power Supply CPU 48

#1 #2 DI

J1
P1

J2
P1

Low Density Cable

Low Density Cable

P2
J1
24VDC Discrete Input/Output FTM
or
Discrete Input (With LEDS) FTM

P2
J1
24VDC Discrete Input/Output FTM
or
Discrete Input (With LEDS) FTM

Figure 7-25—48 Ch DI Module with two FTMs

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Each 48 Ch DI Module accepts 48 contact inputs. Contact wetting voltage may
be supplied by the 48 Ch DI Module internal power supply. The supply can only
supply 300 mA and therefore should not be used with the Discrete Input (with
LEDs) FTM. If an external power source (18–32 Vdc) is supplied, the Discrete
Input (with LEDs) FTM may be used. Figures 7-26 and 7-27 illustrate different
discrete input wiring configurations based on internal or external power source.

Internal External

TB1
Channel 1 1

Channel 2 2
Field Contacts
Channel 3 3

Channel 4 4

48Ch DI
Module

24Ret 25 NC

26

+24VDC 54

Figure 7-26—Discrete Input Interface Wiring with Internal Power Source to a 24

Vdc Discrete Input/Output FTM

Internal External

TB1
Channel 1 1

Channel 2 2
Field Contacts
Channel 3 3

Channel 4 4
+
48Ch DI
Power
Module
1.21K Source
Ohms
-

24Ret 25

26

+24VDC 54

Figure 7-27—Discrete Input Interface Wiring with External Power Source to a

Discrete Input (with LEDs) FTM

Configuration Notes:
 Refer to Chapter 12 for Discrete Input wiring.
 All contact inputs accept dry contacts.

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7.4.4—FTM Reference
See Chapter 12 for detailed wiring of FTMs. See Appendix A for part number
Cross Reference for modules, FTMs, and cables.

7.4.5—Troubleshooting
Fault Detection (Module Hardware)
Each 48 Ch DI module has a red Fault LED that is turned on when the system is
reset. During initialization of a 48 Ch DI module, which occurs after every CPU
module reset, the CPU turns the Fault LED on. The CPU module via the VME
bus turns off the Fault LED when the CPU has started execution of the
application program and verified that the board is present.

Figure 7-28—Discrete Input Module Block Diagram

Figure 7-28 is a block diagram of the Discrete Input module. The module
receives information from as many as 48 field switches and relays. Field wiring is
isolated from the MicroNet circuitry by optical isolators in each channel; the state
of each discrete input is passed through an optoisolator to the buffers. The CPU
then obtains the data for each channel through the VME interface.

If during normal control operation all of a chassis’ 48 DI modules have Fault

LEDs on, check the chassis’ CPU module for a failure.

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If a discrete input is not functioning properly, verify the following:
1. Measure the input voltage on the terminal block of the FTM. It should be in
the range of 16–32 Vdc.
2. Check the wiring. If the inputs are reading open, look for a loose connection
on the terminal blocks, disconnected or misconnected cables, or a missing
jumper on the terminal block.
3. Check the application software configuration to ensure that the input is
configured properly.
4. If the other channels on the 48 DI module are not working either, check the
fuse on the 48 DI module. See the instructions in Chapter 15 for replacing
the module. This fuse is visible and can be changed through the bottom of
the module. If this fuse is blown, fix the wiring problem and replace the fuse
with another fuse of the same type and rating.
5. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace the
48 DI module.
6. If replacing the module does not fix the problem, replace the FTM. See the
instructions in Chapter 15 for replacing the FTM.

7.5—32 Channel Discrete Output Module

7.5.1—Module Description
The MicroNet control can provide discrete outputs to the prime mover from field
wiring. Each Discrete Output (DO) module can individually control 32 outputs
according to commands from the CPU module. These modules have no
potentiometers and require no calibration. A module may be replaced with
another module of the same part number without any adjustment. There are two
different FTM I/O configurations for the 32 Ch DO Module. The module can be
connected to one 32 Ch Relay Module or two 16 Ch Relay Modules (see Chapter
12 for additional information on the relay modules).

7.5.2—Module Specification
Number of channels: 32
Update time: 5 ms
Output Type: Open drain drivers, intended for use
with Woodward relay interface modules.
Fault Detection Readback: Output channel status, relay status is
not available
System Faults: Outputs are turned off if
communications with the CPU is lost.

For the 16 Ch Relay Module and the 32 Ch Relay Module output specifications,
see Chapter 12.

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Figure 7-29—Discrete Output Module

7.5.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

This module receives digital data from the CPU and generates 32 non-isolated
relay driver signals. All discrete output modules in the system interface to one or
more Woodward Relay Modules, each with 16 or 32 relays. The contacts of
these relays then connect to the field wiring.

A separate 24 Vdc power source must be provided for the relays; this module
does not furnish this power. A section of a multi-output Main Power Supply can
be used, or power from a single-output Main Power Supply can be used, as long
as sufficient current is available.

Each 32 Ch DO Module is connected through one low density discrete cable to a

32 Ch Relay module or a 16 Ch Relay module daisy chained to a second 16 Ch
Relay module with another low density cable. See Figure 7-30 for system
installation configuration.

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Power Supply Power Supply CPU 32

#1 #2 DO

J1
P1

Low Density Cable

Or

Low Density Cable

P2 P2

P1

P2
J2

J1
J1 J1

32Ch Relay Module 16Ch Relay Module 16Ch Relay Module

Figure 7-30—32 Ch DO Module with Relay Modules

See Chapter 12 for field wiring of discrete output relays.

Figures 7-31 and 7-32 illustrate examples different discrete output wiring
configurations.

Figure 7-31—Relay Output Interface Wiring to a 16 Ch Relay Module

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Figure 7-32—Relay Output Interface Wiring to a 32 Ch Relay Module

Configuration Notes
 Verify that each set of relay contacts meets the power requirements of the
circuit with which it is being used. Interposing relays are required when the
interfaced circuit demands relay contacts with a higher power rating. If
interposing relays or other inductive loads are required, it is recommended
that interposing relays with surge (inductive kickback) protection be used.
Improper connection could cause serious equipment damage.

7.5.4—FTM Reference
See Chapter 12 for detailed wiring of relay modules. See Appendix A for part
number Cross Reference for modules, FTMs, and cables.

7.5.5—Troubleshooting
Figure 7-33 is a block diagram of the 32-Channel Discrete Output module. The
CPU sends the address of this module and the address and state of the channel
to be output to this module. This information is received by the VME interface
and passed to the latches. The latch associated with the channel to be output
stores the information and passes it to the drivers. The driver for that channel
then energizes or de-energizes the relay for that channel.

Each channel has a readback buffer that indicates the status of the output driver
(not the relay). The CPU compares this status to the value written to the channel
and generates a fault signal if these two values are different. The relay module
power is turned off if communications with the CPU are lost or a fault is detected.

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RELAY
POWER TO
ENABLE WOODWARD
RELAY
CHANNELS MODULE
1-32
LATCHES DRIVERS

VME
VME
INTER-
BUS
FACE

BUFFERS

FAULT
LED

Figure 7-33—Discrete Output Module (32 Channel) Block Diagram

If a discrete output is not functioning properly, verify the following:

1. Check the wiring for a loose connection on the terminal blocks, or
disconnected or misconnected cables.
2. Verify that the current through the relay contacts is not greater than the relay
contact rating.
3. If the other output channels on the 32 Ch DO module are not working either,
check the fuse on the 32 Ch DO module. See the instructions in Chapter 15
for replacing the module. This fuse is visible and can be changed through
the bottom of the module. If this fuse is blown, fix the wiring problem and
replace the fuse with another fuse of the same type and rating.
4. Check the software configuration to ensure that the output is configured
properly.
5. If replacing the relay module does not fix the problem, replace the cable
between the relay module and the FTM, or replace the FTM itself. See the
instructions in Chapters 15 for replacing the FTM.

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7.6—64 Channel Discrete Output Module

7.6.1—Module Description

Figure 7-34—Discrete Output Module

The MicroNet control can provide discrete outputs to the prime mover from field
wiring. Each of this type Discrete Output (DO) module can individually control 64
outputs according to commands from the CPU module. These modules have no
potentiometers and require no calibration. A module may be replaced with
another module of the same part number without any adjustment. There are
several different FTM I/O configurations for the 64 Ch DO Module. The module
can be connected to two 32 Ch Relay Module, four 16 Ch Relay Modules, or a
combination of the two types (see Chapter 12 for additional information on the
relay modules).

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7.6.2—Module Specification
Number of channels: 64
Update time: 5 ms
Output Type: Open drain drivers, intended for use
with Woodward relay interface modules.
Fault Detection Readback: Output channel status, relay status is
not available
System Faults: Outputs are turned off if
communications with the CPU is lost.

For the 16 Ch Relay Module, and the 32 Ch Relay Module output specifications,
see Chapter 12.

7.6.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

This module receives digital data from the CPU and generates 64 non-isolated
relay driver signals. All discrete output modules in the system interface to one or
more Woodward Relay Modules, each with 16 or 32 relays. The contacts of
these relays then connect to the field wiring.

A separate 24 Vdc power source must be provided for the relays; this module
does not furnish this power. A section of a multi-output Main Power Supply can
be used, or power from a single-output Main Power Supply can be used, as long
as sufficient current is available.

Each 64 Ch DO Module is connected through two low density discrete cables to

two 32 Ch Relay modules or two 16 Ch Relay modules daisy chained to two
additional 16 Ch Relay modules with two additional low density cables. See
Figure 7-35 for system installation configuration.

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Power Supply Power Supply CPU 64

#1 #2 DO

J1
P1

J2
P1

Low Density Cable

Low Density Cable

Or
Low Density Cable

P2 P2

P1

P2
J2

J1
J1 J1
32Ch Relay Module 16Ch Relay Module 16Ch Relay Module
(Channels 33-64) (Channels 33-48) (Channels 49-64)

Low Density Cable

Or
P2 P2
P1

P2
J2

J1
J1 J1
32Ch Relay Module 16Ch Relay Module 16Ch Relay Module
(Channels 1-32) (Channels 1-16) (Channels 17-32)

Figure 7-35—64 Ch DO Module with Relay Modules

See Chapter 12 for field wiring of discrete output relays.

Figures 7-36 and 7-37 illustrate examples different discrete output wiring
configurations.

Figure 7-36—Relay Output Interface Wiring to a 16 Ch Relay Module

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Figure 7-37—Relay Output Interface Wiring to a 32 Ch Relay Module

Configuration Notes
 Verify that each set of relay contacts meets the power requirements of the
circuit with which it is being used. Interposing relays are required when the
interfaced circuit demands relay contacts with a higher power rating. If
interposing relays or other inductive loads are required, it is recommended
that interposing relays with surge (inductive kickback) protection be used.
Improper connection could cause serious equipment damage.

7.6.4—FTM Reference
The 64 Ch DO Module uses the same relay modules as the 32 Ch DO Module.
See the previous section.

7.6.5—Troubleshooting
The 64 Ch DO Module uses the same relay modules as the 32 Ch DO Module
and therefore has the same troubleshooting approach as the 32 Ch DO Module.
See the previous section.

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Chapter 8.
Analog I/O Modules

8.1—Introduction
This chapter contains information on those modules that are classified as analog
I/O modules. There are two types analog I/O modules. There are the single
function type modules and the combination modules. The combination modules
consist of more than one type of input or output. The single type modules consist
of a single type of I/O, such as all 4–20 mA inputs.

8.2—Combination I/O Modules

There are five Analog Combination I/O modules available from Woodward.
These are described in sections 7.3 through 7.8.

8.3—TMR 24/8 Analog Module

8.3.1—Module Description
A 24/8 Analog module contains circuitry for twenty-four analog inputs and eight
4–20 mA outputs. These modules have no potentiometers and require no
calibration. A module may be replaced with another module of the same part
number without any adjustment.

The TMR 24/8 Analog module comes in the following configuration: 24 channels
of 4–20 mA inputs with 8 channels of 4–20 mA outputs (2-pole 10 ms filter on all
input channels, except channels 23 and 24, which have 2-pole 5 ms filter).

All 4–20 mA analog inputs may be used with two-wire ungrounded (loop
powered) transducers or isolated (self-powered) transducers. All analog inputs
have 200 Vdc of common mode rejection. If interfacing to a non-isolated device,
which may have the potential of reaching over 200 Vdc with respect to the
control’s common, the use of a loop isolator is recommended to break any return
current paths producing erroneous readings.

Each board has an on-board processor for automatic calibration of the I/O
channels. Each analog input incorporates a time-stamping feature with 5 ms
resolution for two low setpoints and two high setpoints.

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Figure 8-1—24/8 Analog Module

8.3.2—Module Specification
Analog Input Ratings
Number of channels: 24
Update time: 5 ms
Input range: 0–25 mA; software and hardware selectable

The maximum voltage input range may vary between 4.975 and 5.025
Volts from module to module.

Isolation: 0 Vrms, 60 dB CMRR, 200 Vdc common mode

rejection voltage; no galvanic isolation
Input imp. (4–20 mA): 200 ohms
Anti-aliasing filter: 2 poles at 10 ms
Resolution: 16 bits
Accuracy: Software calibrated to 0.1%, over 0–25 mA full
scale
Temp drift: 275 ppm/C, maximum
Fuse: 100 mA fuse per channel.
Time stamping:5 ms resolution on low event and latch, and high event and latch

The 24 channel analog inputs are divided into two banks, with
channel 1 through channel 12 data gathering at 1.8 ms after the MFT
tick and channel 13 through channel 24 data gathering at 3.7 ms after
the MFT tick.

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4–20 mA Output Ratings
Number of channels: 8
Update time: 5 ms
Output Driver: Pulse Width Modulated (PWM)
PWM frequency: 6.14 kHz
Filter: 3 poles at 500 ms
Current output: 4–20 mA
Current output range: 0–25 mA
Isolation: 0 Vrms
Max load resistance: 600 ohms (load + wire resistance)
Current readback: 8 bits
Readback isolation: 60 dB CMRR, 200 Vdc common mode rejection
voltage
Resolution: 11 bits
Accuracy: Software calibrated to 0.2% of 0–25 mA full
scale
Temperature drift: 125 ppm/C, maximum
Readback accuracy: 0.5% of 0–25 mA full scale
Readback temp drift: 400 ppm/C, maximum

8.3.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

Three 24/8 Analog I/O modules are connected through six high density 62
conductor analog cables (two from each module) to two 24/8 Analog I/O FTMs.
Each 24/8 Analog I/O module has two sub D connectors on the front panel. The
top sub D connector contains the first half of the channels (analog input channels
1-12 and analog output channels 1-4) and the bottom sub D connector contains
the second half of the I/O channels. See Figure 8-2 for an example.

Figure 8-2—Example TMR System Configuration

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Analog Inputs
For a 4–20 mA input signal, the 24/8 Analog Module uses a 200 ohm resistor
across the input located on the 24/8 Analog Module. Each analog input channel
may power its own 4–20 mA transducer. See Figure 8-3 for analog input
connection. This power is protected with a 100 mA fuse on each channel to
prevent an inadvertent short from damaging the module. The 24 Vdc outputs are
capable of providing 24 Vdc with ±10% regulation. The maximum current is 0.8
A. Power connections can be made through terminals located on the 24/8 Analog
FTMs. See Chapter 12 for complete field wiring information for the 24/8 Analog
FTM.

When configuring the AI Combo block in GAP, set Conf. input field to
1 for all inputs when used with the 24/8 Analog FTM. This will allow
the block to use the module factory calibration values for the 4–20
mA inputs that were calibrated with 200 ohm internal resistors on the
24/8 Analog Module.

Figure 8-3—Analog Input Wiring for a 24/8 Analog FTM

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Analog Outputs
There are 8 analog output channels of 4–20 mA with a full scale range of 0–25
mA. All Analog Outputs can drive a maximum load of 600 ohms (load + wire
resistance). See Figure 8-4 for analog output connection. Each output monitors
the output source current for fault detection. All of the analog outputs may be
individually disabled. When a channel fault or a module fault is detected, the
application program may annunciate the fault, disable the channel and stop using
data in system calculations or control. Care should be taken to prevent ground
loops and other faults when interfacing to non-isolated devices. See Chapter 12
for complete field wiring information for the Analog High Density FTM.

Figure 8-4—Analog Output Wiring for a 24/8 Analog FTM

8.3.4—FTM Reference
See Chapter 12 for complete field wiring information for the Analog High Density
FTM. See Appendix A for part number Cross Reference for modules, FTMs, and
cables.

8.3.5—Troubleshooting
Each 24/8 Analog module has a red Fault LED that is turned on when the system
is reset. During initialization of a module, which occurs after every CPU reset, the
CPU turns the Fault LED on. The CPU then tests each module using diagnostic
routines built into the software. If the diagnostic test is not passed, the LED
remains on or blinks. If the test is successful, the LED goes off. If the Fault LED
on a module is illuminated after the diagnostics and initialization have been run,
the module may be faulty or may be located in the wrong slot.

Number of LED Flashes Failure

1 Hardware watchdog, CPU clock failure, reset fail
2 Micro-controller internal RAM test failure
3 External RAM test failure
4 Unexpected exception error
5 Dual Port RAM test failure
6 EEPROM failure
7 Communications watchdog time out
8 EEPROM error is corrected (reset the module to continue)
9 Missing an A/D Converter interrupt

Table 8-1—LED Indications of Failure

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Fault Detection (I/O)
In addition to detecting the High Density Analog I/O module hardware faults, the
application software may detect I/O faults.

Analog Input Faults: The application software may be set with a high and low
latch setpoint to detect input faults.

Analog Output Driver Faults: The module monitors the source currents and
annunciates faults. The application software determines the course of action in
the event of a fault.

Microcontroller Faults: The system monitors a software watchdog, a hardware

watchdog, and a software watchdog on the VME bus communications. All
outputs are shut down in the event of a microcontroller fault.

Troubleshooting Guide

If during normal control operation all of a chassis’ 24/8 Analog I/O modules have
Fault LEDs on, check the kernel’s CPU module for a failure. If during normal
control operation only the 24/8 Analog I/O module’s Fault LED is on or flashing,
ensure that it is installed in the correct slot. If it is, then replace that 24/8 Analog
I/O module. See instructions for replacing the module in Chapter 21, Installation
and Service. When a module fault is detected, its outputs should be disabled or
de-energized.

Analog Inputs
If an analog input is not functioning properly, verify the following:
 Check that the cable is shielded and the shield is properly grounded per the
section on Shields and Grounding in Chapter 21, Installation and Service.
 Measure the input voltage on the terminal block. It should be in the range of
0–5 V.
 Look at the individual inputs into each kernel. Each 24/8 Analog I/O module
reads the same input from the FTM, so the application software should
contain three separate numbers, one from each 24/8 Analog I/O module.
The numbers should be within 0.1% of each other unless a high common
mode voltage is present.

The following actions may shut down the prime mover.

 If all of the 24/8 Analog I/O modules are reading approximately the same
number, but the reading is incorrect, go to step 1. If two of the 24/8 Analog
I/O modules are reading correctly, but one is reading incorrectly, go to step
2.

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1. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables, a missing jumper on the terminal
block if the input is a loop powered current input, or a blown fuse on the 24
Vdc on the FTM. See instructions for replacing the fuse on the FTM below. If
all of the inputs are reading high, check to ensure that the 24 Vdc is not
connected across the input directly. Check the fuse on the 24/8 Analog I/O
module. See instructions for replacing the module in Chapter 21, Installation
and Service. This fuse is visible and can be changed through the bottom of
the module. If this fuse is blown, fix the wiring problem and replace the fuse
with a fuse of the same type and rating. Check the application software
configuration to ensure that the input is configured properly. If the
connections and application software are verified and the correct voltage is
present on the terminal block, but all of the 24/8 Analog I/O modules are
reading 0 V, exchange FTM #1 with FTM #2. See instructions for replacing
the FTM in Chapter 15. If the problem follows the FTM, replace the FTM.
The FTM contains only a wire wound 3 W resistor and traces, so failure is
extremely unlikely.

2. If one or two of the 24/8 Analog I/O modules are reading the correct
number, but the other 24/8 Analog I/O module(s) is (are) incorrect, check
the application software configuration of the modules with the non-working
channels, and check to ensure that the cables are connected properly. If the
other channels on the same 24/8 Analog I/O module are not working either,
check the fuse on the 24/8 Analog I/O module. See instructions for replacing
the module in Chapter 21, Installation and Service. This fuse is visible and
can be changed through the bottom of the module. If this fuse is blown, fix
the wiring problem and replace the fuse with a fuse of the same type and
rating. If the reading is still incorrect, but the other readings from the 24/8
Analog I/O module are correct, remove the 24/8 Analog I/O module and
exchange the J1 and J2 cables. If the problem moves to a different channel,
replace the cable. If not, replace the 24/8 Analog I/O module. If the readings
are incorrect on several channels of the 24/8 Analog I/O module,
corresponding to both cables, replace the 24/8 Analog I/O module.

Analog Outputs
If an analog output is not functioning properly, verify the following:
 Check that the cable is shielded and the shield is properly grounded Shields
and Grounding section in Chapter 21, Installation and Service.
 Check the load resistance to ensure that it is below 600 ohms.
 Check to ensure that the load wiring is isolated.

The following actions may shut down the prime mover.

 Disconnect the field wiring and connect a resistor across the output. If the
output current is 0 mA, go to step 1. If the output current is correct, but some
of the outputs have a fault, go to step 2.

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1. Check the wiring for a loose connection on the terminal blocks or
disconnected or misconnected cables. If none of the outputs on a given 24/8
Analog I/O module are functioning, check the 24/8 Analog I/O module fuse.
See instructions for replacing the module in Chapter 21, Installation and
Service. This fuse is visible and can be changed through the bottom of the
module. If the fuse is blown, fix the wiring problem and replace the fuse with
a fuse of the same type and rating. Check the application software
configuration to ensure that the output is configured properly. If the
connections and application software are verified, exchange FTM #1 with
FTM #2. See instructions for replacing the FTM in Chapter 15. If the
problem follows the FTM, replace the FTM. The FTM contains only traces
and a few discrete components, so failure is extremely unlikely.

2. If one or two of the 24/8 Analog I/O modules have an output fault, but the
other module(s) does (do) not, check the application software, and check to
ensure that the cables are connected properly. If the other output channels
on the same 24/8 Analog I/O module are also not working, check the fuse
on the 24/8 Analog I/O module. See instructions for replacing the module in
Chapter 21, Installation and Service. This fuse is visible and can be
changed through the bottom of the module. If the fuse is blown, fix the wiring
problem and replace the fuse with a fuse of the same type and rating. If the
output still has a fault, but the other output channels on the 24/8 Analog I/O
module are functioning properly, remove the 24/8 Analog I/O module and
exchange the J1 and J2 cables. If the problem moves to a different channel,
replace the cable. If not, replace the 24/8 Analog I/O module. If the readings
are incorrect on several channels of the 24/8 Analog I/O module,
corresponding to both cables, replace the same 24/8 Analog I/O module.

Replacing a Fuse on the Field Terminal Module (FTM)

1. Verify that the condition that caused the fuse to blow has been corrected.

If power has not been removed from the control system, power will
be active at the module and also at the FTM. Shorting of protected
circuitry could cause a control system shutdown.

2. Remove FTM cover carefully, to prevent contact with any FTM circuitry
under the cover. To remove the FTM cover, pinch the retaining barb and lift
the cover.

3. Locate and replace the fuse with another fuse of the same size, type, and
rating. See Figure 12-12 or Figure 12-13 for channel fuse location.

4. Replace the FTM Cover.

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8.4—TMR Analog Combo Module

8.4.1—Module Description
Each High Density Analog Combo module contains circuitry for four speed
sensor inputs, eight analog inputs, four analog outputs, and two proportional
actuator driver outputs. Each speed sensor input may be from a magnetic pick-
up or from a proximity probe, each analog input must be 4–20 mA, and each
actuator driver may be configured as 4–20 mA or 20–160 mA.

There are two configurations of the Analog Combo Modules. One has the analog
inputs configured for 4–20 mA and the other is configured for 0–5 V. See
Appendix A for specific part numbers. In a simplex system, either Analog Combo
module is connected through two analog cables to one Analog Combo FTM. All
of the I/O are accessible on the FTM, and the channels are labeled to correspond
to their software locations, e.g. analog input 1 on the FTM will be analog input 1
in the application software.

This module includes no potentiometers and requires no calibration. An Analog

Combo module may be replaced with another module of the same part number
without any adjustment.

Figure 8-5—Analog Combo Module

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8.4.2—Module Specifications
Digital Speed Sensor Inputs
Number of channels: 4
Update time: 5 ms
MPU Input Ratings
Input frequency: 100 - 25000 Hz
Input amplitude: 1-25 Vrms
Input impedance: 2000 Ohms
Isolation voltage: 500 Vrms
Resolution: 12 bits minimum over chosen frequency range
Accuracy: 0.03% full scale, minimum
Proximity Probe Input Ratings
Input frequency: 0.5 - 25000 Hz
Input amplitude: 3.5 - 32 Vdc input to the module
Available power: 12 Vdc or 24 Vdc, 50 mA maximum
Isolation voltage: 0 Vrms
Resolution: 12 bits minimum over chosen frequency range
Accuracy: Software calibrated to 0.03% full scale
Fuse: 24 Vdc 100 mA fuse/channel, 12 Vdc short
circuit protected
Time Stamping: 5 millisecond resolution on low event and low
latch
Analog Input Ratings
Number of channels: 8
Update time: 5 millisecond
Input range: 0–25 mA

The maximum input voltage range may vary between 4.975 and 5.025
Volts from module to module.

Isolation: 0 VRMS, -60 dB CMRR, 200 Vdc common

mode rejection voltage; no galvanic isolation
Input impedance: 200 ohms
Anti-aliasing filter: 2 poles at 10 ms
Resolution: 16 bits
Accuracy: Software calibrated to 0.1%, over 25 mA full
scale
Temp drift: 275 ppm/C, maximum
Fuse: 100 mA fuse per channel
Time stamping: 5 ms resolution on low event and latch, and high
event and latch
4–20 mA Analog Output Ratings
Number of channels: 4
Update time: 5 ms
Driver: Pulse Width Modulated (PWM)
PWM frequency: 6.14 kHz
Filter: 3 poles at 500 ms
Current output: 4–20 mA current output range: 0 - 25 mA
Isolation: 0 Vrms
Max load resistance: 600 ohms (load + wire resistance)
Current readback: 11 bits
Readback isolation: -60 dB CMRR, 200 Vdc common mode
Resolution: 11 bits
Accuracy: Software calibrated to 0.2%, over 25 mA full
scale
Temperature drift: 125 ppm/C, maximum
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Readback accuracy: 0.2%, over 25 mA full scale
Readback temp drift: 400 ppm/C, maximum
Actuator Driver Output Ratings
Number of channels: 2
Update time: 5 millisecond
Driver: PWM (proportional only), single or dual coil
PWM frequency: 6.14 kHz
Filter: 3 poles at 500 microseconds
Current output: 4–20 mA or 20–160 mA, software selectable
Current output range: 0-24 mA or 0–196 mA, depending on the
selected range
Isolation: 0 Vrms
Max. act resistance 45 ohms on the 20–160 mA output, 360 ohms
on the 4–20 mA output
Readback Actuator source and return currents
Readback isolation -60 dB CMRR, 200 Vdc common mode
Dither current 25 Hz, fixed duty cycle, software variable
amplitude
Resolution 11 bits over 25 or 200 mA range
Accuracy Software calibrated to 0.2% of 25 or 200 mA
range
Temperature drift 125 ppm/C, maximum
Readback accuracy 0.1% of 25 or 200 mA range
Readback temp drift 150 ppm/C, maximum

88.4.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

Three MPU and Analog I/O modules are connected through six analog cables (two
from each module) to two FTMs. Each MPU and Analog I/O module has two sub D
connectors on the front panel. The top sub D connector contains the first half of the
channels (speed sensor channels 1 and 2, actuator channel 1, analog output
channels 1 and 2, and analog input channels 1-4), and the bottom sub D connector
contains the second half of the I/O channels. See Figure 8-6 for an example.

Figure 8-6—Example Fault Tolerant System Configuration

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Field Wiring
See Chapter 12 for complete wiring connections for the TMR Analog Combo
FTM. Wire each channel per the following examples for each type of signal.

Speed Sensor Inputs

The MPU and proximity probe inputs are read and the speed is provided to the
application program. A derivative output is provided via the application software if
desired. The speed sensor inputs are filtered by the Analog Combo module and
the filter time constant is selectable through the application software program at 8
milliseconds or 16 milliseconds. Eight milliseconds should be acceptable for most
applications. 16 milliseconds may be necessary for very slow speed applications.
The speed range determines the maximum speed that the module will detect.
The control output of the software will detect a minimum speed of one fiftieth of
the speed range. This allows detection of failed speed sensors to help prevent
overspeed due to slow update times at very low speeds. The monitor output of
the GAP block will read down to 0.5 Hz, irrespective of the speed range. An
application may use any combination of accepted MPU and proximity probes,
and any combination of speed ranges.

Any of the module’s four speed channels accepts passive magnetic pickup units
(MPUs) or proximity probes. Each speed input channel can only accept one MPU
or one proximity probe.

A proximity probe may be used to sense very low speeds. With a proximity
probe, speed can be sensed down to 0.5 Hz. When interfacing to open collector
type proximity probes, a pull-up resistor is required between the supplied
proximity probe voltage and the proximity probe input to the FTM. Individually
fused 12 Vdc and 24 Vdc sources are provided with each speed input to power
system proximity probes (100 mA fuses, located on the FTMs, are used).
External pull-up resistors are required when interfacing with an open collector
type proximity probe. See Figure 8-7 for MPU/proximity probe wiring example.
Channel 1 shows an MPU connection, channel 2 shows a 24 V proximity
connection, and channel 3 is an example of a 12 V proximity connection. Always
jumper the unused MPU connection to eliminate possible noise interference
when connecting a proximity probe.

It is not recommended that gears mounted on an auxiliary shaft

coupled to the rotor be used to sense speed. Auxiliary shafts tend to
turn more slowly than the rotor (reducing speed sensing resolution)
and have coupling gear backlash, resulting in less than optimum
speed control. For safety purposes, it is also not recommended that
the speed sensing device sense speed from a gear coupled to a
mechanical drive side of a system’s rotor coupling.

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When a speed sensor input channel has been wired as either MPU or
proximity probe input, the unused MPU/Prox must be jumpered at the
FTM. When an input channel is not used, both the MPU and Prox
inputs must be jumpered. See example in Figure 8-7.

Figure 8-7—MPU/Proximity Interface Wiring to the TMR Analog Combo FTM

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Analog Inputs
The analog inputs must be current type. See Appendix A for specific part
numbers. All modules use the same cable and FTMs.

All current inputs may be used with two-wire ungrounded (loop powered)
transducers or isolated (self-powered) transducers. All analog inputs have 200
Vdc of common mode rejection. If interfacing to a non-isolated device, which may
have the potential of reaching over 200 Vdc with respect to the control’s
common, the use of a loop isolator is recommended to break any return current
paths that may produce erroneous readings. All current inputs use 200 ohm
resistors across their inputs.

Each current input channel may power its own 4–20 mA transducer. This power
is protected with a 100 mA fuse on each channel to prevent an inadvertent short
from damaging the module. The 24 Vdc outputs are capable of providing 24 Vdc
with ±10% regulation. Power connections can be made through terminals located
on the FTMs. Refer to Figure 8-8 for 4–20 mA Current Input wiring.

Figure 8-8—Current Input Wiring for an Analog Combo Module FTM

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Only self-powered voltage transducers should be used on voltage input
channels. The full scale range must not exceed 5 volts. Refer to Figure 8-9 for 0–
5 Vdc voltage transducer input wiring.

MicroNet Module CABLE FTM

TB1
F8
24 NC

68 NC
.01uF
25 Ch. 1
J1 J1
-
9 9 69 -
Anti- Self Powered
AI_01 aliasing Voltage
+ Filter 27 27 26 + Transducer
F7
70 NC

27 NC
.01uF
71 SHLD Ch. 2
-
Anti- 7 7 28 -Input
AI_02 aliasing
+ Filter 25 25 72 +Input
F6
29 NC

73 NC
.01uF
30 SHLD Ch. 3
-
Anti- 5 5 74 -Input
AI_03 aliasing
+ Filter 23 23 31 +Input
F5
75 NC

32 NC
.01uF
76 SHLD Ch. 4
-
Anti- 2 2 33 -Input
AI_04 aliasing
+ Filter 21 21 77 +Input
F4
34 NC

78 NC
.01uF
35 SHLD Ch. 5
J2 J2
-
Anti- 9 9 79 -Input
AI_05 aliasing
+ Filter 27 27 36 +Input
F3
80 NC

37 NC
.01uF
81 SHLD Ch. 6
-
Anti- 7 7 38 -Input
AI_06 aliasing
+ Filter 25 25 82 +Input
F2
13 13 39 NC
J1 J1
13 13 83 NC
.01uF
40 SHLD Ch. 7
J2 J2
-
Anti- 5 5 84 -Input
AI_07 aliasing
+ Filter 23 23 41 +Input
F1
- 15 15 85 NC
11 11
+24VDC J1 J1 42 NC
+ 15 15 .01uF
11 11 86 SHLD Ch. 8
J2 J2
-
Anti- 2 2 43 -Input
AI_08 aliasing
+ Filter 21 21 87 +Input
J1&2 J1&2
20 20 88

Grounded to Chassis J1 Outer Shell Ground to DIN Rail

Figure 8-9—Voltage Input Wiring for an Analog Combo Module FTM

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Analog Outputs
The analog outputs are 4–20 mA with a full-scale range of 0–25 mA. Each output
monitors the output source current for fault detection. All of the analog outputs
may be individually disabled. When a channel fault or a module fault is detected,
the application program may annunciate the fault, disable the channel or module,
and stop using the data in system calculations or control.

The Analog Combo module has four 4–20 mA current output drivers. All analog
outputs can drive a maximum load of 600 ohms (load + wire resistance). Care
should be taken to prevent ground loops and other faults when interfacing to non-
isolated devices. See Figure 8-10 for an example of 4–20 mA output wiring.

Actuator Outputs
The actuator outputs may be configured for 4–20 mA or 20–160 mA.
Configuration is done through the application software; no hardware
modifications in the forms of jumpers or switches are necessary. For fault
detection, each output monitors the output source current and the output return
current. All of the actuator outputs may be individually disabled. When a channel
fault or a module fault is detected, the application program may annunciate the
fault, disable the channel or module, and stop using the data in system
calculations or control.

Dither may be provided in the application software for each output. Dither is a low
frequency (25 Hz) signal consisting of a 5 millisecond pulse modulated onto the
DC actuator-drive current to reduce sticking due to friction in linear type
actuators. Woodward TM-type actuators typically require dither. Dither amplitude
is variable through the application software. See Figure 8-10 for an example of
actuator wiring.

For a dual coil actuator in a simplex system, two actuator driver

outputs must be used.

Configuration Notes
 Maximum impedance for a 4 to 20 mA actuator output driver is 360 ohms
(actuator impedance + wire resistance).
 Maximum impedance for a 20 to 160 mA actuator output is 45 ohms
(actuator impedance + wire resistance).
 Each actuator driver senses its source and return current to allow
overcurrent and undercurrent alarms and shutdowns.

8.4.4—FTM Reference
See Chapter 12 for complete Analog Combo FTM field wiring information. See
Appendix A for proper Module, FTM, and cable part numbers.

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Figure 8-10—Analog Output and Actuator Wiring for an Analog Combo FTM

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8.4.5—Troubleshooting
Fault Detection (Module Hardware)
Each Analog Combo module has a red Fault LED that is turned on when the
system is reset. During initialization of a module, which occurs after every CPU
reset, the CPU turns the Fault LED on. The CPU then tests the module using
diagnostic routines built into the software. If the diagnostic test is not passed, the
LED remains on or blinks. If the test is successful, the LED goes off. If the Fault
LED on a module is illuminated after the diagnostics and initialization have been
completed, the Analog Combo module may be faulty or may be located in the
wrong slot.

Number of LED Flashes Failure

1 Hardware watchdog, CPU clock failure, reset fail
2 Micro-controller internal RAM test failure
3 External RAM test failure
4 Unexpected exception error
5 Dual Port RAM test failure
6 EEPROM failure
7 Communications watchdog time out
Table 8-2—LED Indications of Failure

Fault Detection (I/O)

In addition to detecting module hardware faults, the application program may
detect I/O faults.

Analog Input Faults. The application software may set a high and low latch
setpoint to detect input faults.

Speed Sensor Input Faults. The application software may set a high and low
latch setpoint to detect input faults. The low latch setpoint must be greater than
one fiftieth of the frequency range.

Analog Output Driver Faults. The module monitors the source currents and
annunciates faults. The application determines the course of action in the event
of a fault.

Actuator Driver Or Load Faults. The module monitors the source and return
currents and annunciates faults. The application determines the course of action
in the event of a fault.

Micro-controller Faults. The system monitors a software watchdog, a hardware

watchdog, and a software watchdog on the VME bus communications. All
outputs are shutdown in the event of a microcontroller fault.

Troubleshooting Guide
If during normal control operation all of a chassis’ I/O modules have Fault LEDs
on, check the kernel’s CPU module for a failure. If during normal control
operation only the MPU and Analog I/O module’s Fault LED is on or flashing,
insure that it is installed in the correct slot. If it is, then replace that MPU and
Analog I/O module. See instructions for replacing the module in Chapter 21,
Installation and Service. When a module fault is detected, its outputs should be
disabled or de-energized.

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Speed Sensor Inputs
MPUs. If a speed sensor input is not functioning properly, verify the following:
 Check that the cable is shielded and the shield is properly grounded per the
Shields and Grounding section in Chapter 21, Installation and Service.
 Measure the input voltage on the terminal block. It should be in the range of
1-25 VRMS.
 Verify that the signal waveform is clean and void of double zero crossings.
 Verify that no ground connection exists and that the resulting 60 Hz signal is
absent.
 Measure the frequency. It should be in the range of 100 Hz - 25 kHz.
 Look at the individual inputs into each kernel. A and B should read an input,
and C should also read this input if the terminal block jumpers are installed.
The application software should contain three separate numbers, one from
each module. The numbers should be within 0.1% of each other, except
kernel C if the jumpers are not installed.
 Verify that any unused MPU/Prox inputs are jumpered per Figure 8-7.

The following actions may shut down the prime mover. If all of the
MPU and Analog I/O modules are reading approximately the same
number, but it is not the right reading, go to step 1. If two of the MPU
and Analog I/O modules are reading correctly, but one is reading
incorrectly, go to step 2.

1. Check the wiring. If the inputs are reading 0, look for a loose connection on
the terminal blocks or disconnected or misconnected cables. Check the
application software configuration to ensure that the input is configured
properly. If the connections and application software are verified and the
correct voltage is present on the terminal block, but all of the MPU and
Analog I/O modules are reading 0 V, exchange FTM #1 with FTM #2. See
instructions for replacing the FTM in Chapter 15. If the problem follows the
FTM, replace the FTM. The FTM contains only traces and a few discrete
components, so failure is extremely unlikely.

2. If one or two of the MPU and Analog I/O modules are reading the correct
number, but the other module(s) is (are) incorrect, check the application
software configuration of the modules with the non-working channels, and
check to ensure that the cables are connected properly. If C kernel is not
working, but A and B are, check to insure that the terminal block jumpers
are installed if the MPU can drive three inputs. If the reading is still incorrect,
but the other readings from the MPU and Analog I/O module are correct,
remove the MPU and Analog I/O module and exchange the J1 and J2
cables. See instructions for replacing the module in Chapter 21, Installation
and Service. If the problem moves to a different channel, replace the cable.
If not, replace the MPU and Analog I/O module. If the readings are incorrect
on several channels of the same MPU and Analog I/O module,
corresponding to both cables, replace the MPU and Analog I/O module.

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Proximity Probes. If a speed sensor input is not functioning properly, verify the
following:
 Check that the cable is shielded and the shield is properly grounded per the
Shields and Grounding section in Chapter 21, Installation and Service.
 Measure the input voltage on the terminal block. It should be in the range of
3.5 - 32 Vpeak.
 Verify that the signal waveform is clean and void of double zero crossings.
 Verify that no ground connection exists and that the resulting 60 Hz signal is
absent.
 Measure the frequency. It should be in the range of 0.5 Hz, to 25 kHz.
 Check the wiring. Look for a loose connection at the terminal blocks,
disconnected or misconnected cables, a missing jumper on the terminal
block, or a blown fuse on the 24 Vdc on the FTM. See Figure 11-21 for FTM
fuse locations.
 Check the software configuration to ensure that the input is configured
properly.
 Check the fuse on the FTM. See the instructions and fuse locations below.
 If the other channels on the MPU and Analog I/O module are also not
working, check the fuse on the MPU and Analog I/O module. This fuse is
visible and can be changed through the bottom of the module. If the fuse is
blown, fix the wiring problem and replace the fuse with another fuse of the
same type and rating.
 Look at the individual inputs into each kernel. Each module reads the same
input from the FTM, so the software should contain three separate numbers,
one from each MPU and Analog I/O module. The numbers should be within
0.1% of each other unless a high common mode voltage is present.
 Verify that any unused MPU/Prox inputs are jumpered per Figure 8-7.

The following actions may shut down the prime mover. If all of the
MPU and Analog I/O modules are reading approximately the same
number, but it is not the right reading, go to step 1. If two of the
modules are reading correctly, but one is reading incorrectly, go to
step 2.

1. Check the wiring. If the inputs are reading 0, look for a loose connection on
the terminal blocks, disconnected or misconnected cables, a missing jumper
on the terminal block, or a blown fuse on the 24 Vdc on the FTM. See
instructions for replacing the fuse, below. Check the MPU and Analog I/O
module fuse. See instructions for replacing the module in Chapter 21,
Installation and Service. This fuse is visible and can be changed through the
bottom of the module. If the fuse is blown, fix the wiring problem, then
replace the fuse with another fuse of the same type and rating. Check the
application software configuration to ensure that the input is configured
properly. If the connections and application software are verified and the
correct voltage is present on the terminal block, but all of the MPU and
Analog I/O modules are reading 0 V, exchange FTM #1 with FTM #2. See
instructions for replacing the FTM in Chapter 15. If the problem follows the
FTM, replace the FTM. The FTM contains only a wire wound 3 W resistor
and traces, so failure is extremely unlikely.

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2. If one or two of the MPU and Analog I/O modules are reading the correct
number, but the other module(s) is (are) incorrect, check the application
software configuration of the modules with the non-working channels, and
check to ensure that the cables are connected properly. If the other
channels on the same MPU and Analog I/O module are also not working,
check the fuse on the MPU and Analog I/O module. See the instructions for
replacing the module in Chapter 21, Installation and Service. This fuse is
visible and can be changed through the bottom of the module. If this fuse is
blown, fix the wiring problem and replace the fuse with a fuse of the same
type and rating. If the reading is still incorrect, but the other readings from
the MPU and Analog I/O module are correct, remove the MPU and Analog
I/O module and exchange the J1 and J2 cables. If the problem moves to a
different channel, replace the cable. If not, replace the MPU and Analog I/O
module. If the readings are incorrect on several channels of the MPU and
Analog I/O module, corresponding to both cables, replace the MPU and
Analog I/O module.

Analog Inputs
If an analog input is not functioning properly, verify the following:
 Check that the cable is shielded and the shield is properly grounded per the
Shields and Grounding section in Chapter 21, Installation and Service.
 Measure the input voltage on the terminal block. It should be in the range of
0–5 V.
 Look at the individual inputs into each kernel. Each module reads the same
input from the FTM, so the application software should contain three
separate numbers, one from each MPU and Analog I/O module. The
numbers should be within 0.1% of each other unless a high common mode
voltage is present.
 Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables, a missing jumper on the terminal
block if the input is a current input, or a blown fuse on the 24 Vdc on the
FTM. See Figure 11-21 for FTM fuse locations.
 If all of the inputs are reading high, check that the 24 Vdc is not connected
across the input directly.
 Check the software configuration to ensure that the input is configured
properly.
 Check the fuse on the FTM. See the instructions and fuse locations below.

The following actions may shut down the prime mover. If all of the
MPU and Analog I/O modules are reading approximately the same
number, but the reading is incorrect, go to step 1. If two of the MPU
and Analog I/O modules are reading correctly, but one is reading
incorrectly, go to step 2.

1. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables, a missing jumper on the terminal
block if the input is a loop powered current input, or a blown fuse on the 24
Vdc on the FTM. See instructions for replacing the fuses on the FTM, below.
If all of the inputs are reading high, check to ensure that the 24 Vdc is not
connected across the input directly. Check the MPU and Analog I/O module
fuse. See instructions for replacing the module in Chapter 21, Installation
and Service. This fuse is visible and can be changed through the bottom of
the module. If the fuse is blown, fix the wiring problem, then replace the fuse
with another fuse of the same type and rating. Check the application
software configuration to ensure that the input is configured properly. If the
connections and application software are verified and the correct voltage is
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present on the terminal block, but all of the MPU and Analog I/O modules
are reading 0 V, exchange FTM #1 with FTM #2. See instructions for
replacing the FTM in Chapter 15. If the problem follows the FTM, replace
the FTM. The FTM contains only a wire wound 3 W resistor and traces, so
failure is extremely unlikely.

2. If one or two of the MPU and Analog I/O modules are reading the correct
number, but the other module(s) is (are) incorrect, check the application
software configuration of the modules with the non-working channels, and
check to ensure that the cables are connected properly. If the other
channels on the same MPU and Analog I/O module are not working either,
check the fuse on the MPU and Analog I/O module. See instructions for
replacing the module in Chapter 21, Installation and Service. This fuse is
visible and can be changed through the bottom of the module. If this fuse is
blown, fix the wiring problem and replace the fuse with a fuse of the same
type and rating. If the reading is still incorrect, but the other readings from
the MPU and Analog I/O module are correct, remove the MPU and Analog
I/O module and exchange the J1 and J2 cables. If the problem moves to a
different channel, replace the cable. If not, replace the MPU and Analog I/O
module. If the readings are incorrect on several channels of the MPU and
Analog I/O module, corresponding to both cables, replace the MPU and
Analog I/O module.

Analog Outputs
If an analog output is not functioning properly, verify the following:
 Check that the cable is shielded and the shield is properly grounded per the
Shields and Grounding section in Chapter 21, Installation and Service.
 Check the load resistance to ensure that it is below 600 ohms.
 Check to ensure that the load wiring is isolated.
 Check the wiring for a loose connection on the terminal blocks and
disconnected or misconnected cables.
 Disconnect the field wiring and connect a resistor across the output. If the
output is correct across the resistor, there is a problem with the field wiring.
 If the other output channels on the MPU and Analog I/O module are also not
working, check the fuse on the MPU and Analog I/O module. See
instructions for module replacement in Chapter 21, Installation and Service.
This fuse is visible and can be changed through the bottom of the module. If
the fuse is blown, fix the wiring problem and replace the fuse with a fuse of
the same type and rating.

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 Check the software configuration to ensure that the output is configured
properly.

The following actions may shut down the prime mover. Disconnect
the field wiring and connect a resistor across the output. If the output
current is 0 mA, go to step 1. If the output current is correct, but
some of the outputs have a fault, go to step 2.

1. Check the wiring for a loose connection on the terminal blocks or

disconnected or misconnected cables. If none of the outputs on a given
MPU and Analog I/O module are functioning, check the MPU and Analog
I/O module fuse. See instructions for replacing the module in Chapter 21,
Installation and Service. This fuse is visible and can be changed through the
bottom of the module. If the fuse is blown, fix the wiring problem, then
replace the fuse with another fuse of the same type and rating. Check the
application software configuration to ensure that the output is configured
properly. If the connections and application software are verified, exchange
FTM #1 with FTM #2. See instructions for replacing the FTM in Chapter 15.
If the problem follows the FTM, replace the FTM. The FTM contains only
traces and a few discrete components, so failure is extremely unlikely.

2. If one or two of the MPU and Analog I/O modules have an output fault, but
the other module(s) does (do) not, check the application software, and
check to ensure that the cables are connected properly. If the other output
channels on the same MPU and Analog I/O module are also not working,
check the fuse on the MPU and Analog I/O module. See instructions for
replacing the module in Chapter 21, Installation and Service. This fuse is
visible and can be changed through the bottom of the module. If the fuse is
blown, fix the wiring problem and replace the fuse with a fuse of the same
type and rating. If the output still has a fault, but the other output channels
on the MPU and Analog I/O module are functioning properly, remove the
MPU and Analog I/O module and exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace the
MPU and Analog I/O module. If the readings are incorrect on several
channels of the MPU and Analog I/O module, corresponding to both cables,
replace the same MPU and Analog I/O module.

Actuator Outputs
If an actuator output is not functioning properly, verify the following:
 Check that the cable is shielded and the shield is properly grounded per the
Shields and Grounding section in Chapter 21, Installation and Service.
 Check the load resistance to ensure that it is below the specified limit.
 Check to ensure that the load wiring is isolated.
 Check the wiring for a loose connection on the terminal blocks or
disconnected or misconnected cables.
 Disconnect the field wiring and connect a resistor across the output.
 If the other output channels on the MPU and Analog I/O module are also not
working, check the fuse on the MPU and Analog I/O module. See
instructions for module replacement in Chapter 21, Installation and Service.
This fuse is visible and can be changed through the bottom of the module. If
the fuse is blown, fix the wiring problem, and replace the fuse with a fuse of
the same type and rating.
 Check the software configuration to ensure that the output is configured
properly

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The following actions may shut down the prime mover. Disconnect
the field wiring and connect a resistor across the output; if the
output current is 0 mA, go to step 1. If the output current is correct,
but some of the outputs have a fault, go to step 2.

1. Check the wiring for a loose connection on the terminal blocks, or

disconnected or misconnected cables. If none of the outputs on a given
MPU and Analog I/O module are functioning, check the MPU and Analog
I/O module fuse. See instructions for replacing the module in Chapter 21,
Installation and Service. This fuse is visible and can be changed through the
bottom of the module. If the fuse is blown, fix the wiring problem, then
replace the fuse with another fuse of the same type and rating. Check the
application software configuration to ensure that the output is configured
properly. If the connections and application software are verified, exchange
FTM #1 with FTM #2. See instructions for replacing the FTM in Chapter 15.
If the problem follows the FTM, replace the FTM. The FTM contains only
traces and a few discrete components, so failure is extremely unlikely.

2. If one or two of the MPU and Analog I/O modules have an output fault, but
the other module(s) does (do) not, check the application software
configuration, and check to ensure that the cables are connected properly.
Check the wiring for dual coil and single coil actuators, and ensure that the
wiring configuration matches the application software configuration. If the
other output channels on the same MPU and Analog I/O module are also
not working, check the fuse on the MPU and Analog I/O module. See
instructions for replacing the module in Chapter 21, Installation and Service.
This fuse is visible and can be changed through the bottom of the module. If
this fuse is blown, fix the wiring problem and replace the fuse with a fuse of
the same type and rating. If the output still has a fault, but the other output
channels on the MPU and Analog I/O module are functioning properly,
remove the MPU and Analog I/O module and exchange the J1 and J2
cables. If the problem moves to the other channel, replace the cable. If not,
replace the MPU and Analog I/O module. If the readings are incorrect on
several channels of the same MPU and Analog I/O module, corresponding
to both cables, replace the MPU and Analog I/O module.

Replacing a Fuse on the Field Terminal Module (FTM)

1. Verify that the condition that caused the fuse to blow has been corrected.

If power has not been removed from the control system, power will
be active at the module and also at the FTM. Shorting of protected
circuitry could cause a control system shutdown.

2. Remove FTM cover carefully, to prevent contact with any FTM circuitry
under the cover. To remove the FTM cover, pinch the retaining barb and lift
the cover.

3. Locate and replace the fuse with another fuse of the same size and rating.
See Figure 11-20 or Figure 11-21 for channel fuse locations.

4. Replace the FTM cover.

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Figure 8-11—MPU and Analog I/O Module FTM Fuse Locations

8.5—24/8 Analog Module

8.5.1—Module Description
A 24/8 Analog module contains circuitry for twenty-four analog inputs and eight
4–20 mA outputs. These modules have no potentiometers and require no
calibration. A module may be replaced with another module of the same part
number without any adjustment.

The 24/8 Analog Modules come in four different configurations.

1. 24 channels of 4–20 mA inputs with 8 channels of 4–20 mA outputs

(2-pole 10 ms filter on all input channels).
2. 24 channels of 4–20 mA inputs with 8 channels of 4–20 mA outputs
(2-pole 10 ms filter on all input channels, except channels 23 and 24,
which have 2-pole 5 ms filter).
3. 12 channels of 4–20 mA inputs, 12 channels 0–5 Vdc inputs with 8
channels of 4–20 mA outputs (2-pole 10 ms filter on all input channels).

All 4–20 mA analog inputs may be used with two-wire ungrounded (loop
powered) transducers or isolated (self-powered) transducers. All analog inputs
have 200 Vdc of common mode rejection. If interfacing to a non-isolated device,
which may have the potential of reaching over 200 Vdc with respect to the
control’s common, the use of a loop isolator is recommended to break any return
current paths producing erroneous readings.

Each board has an on-board processor for automatic calibration of the I/O
channels. Each analog input incorporates a time-stamping feature with 5 ms
resolution for two low setpoints and two high setpoints.

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Figure 8-12—24/8 Analog Module

8.5.2—Module Specification
Analog Input Ratings
Number of channels: 24
Update time: 5 ms
Input range: 0–25 mA or 0–5 V; software and hardware
selectable

The maximum voltage input range may vary between 4.975 and 5.025
Volts from module to module.

Isolation: 0 Vrms, 60 dB CMRR, 200 Vdc common mode

rejection voltage; no galvanic isolation
Input imp. (4–20 mA): 200 ohms
Anti-aliasing filter: 2 poles at 10 ms
Resolution: 16 bits
Accuracy: Software calibrated to 0.1%, over 0–25 mA full
scale
Temp drift: 275 ppm/C, maximum
Fuse: 100 mA fuse per channel.
Time stamping:5 ms resolution on low event and latch, and high event and latch

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The 24 channel analog inputs are divided into two banks, with
channel 1 through channel 12 data gathering at 1.8 ms after the MFT
tick and channel 13 through channel 24 data gathering at 3.7 ms after
the MFT tick.

4–20 mA Output Ratings

Number of channels: 8
Update time: 5 ms
Output Driver: Pulse Width Modulated (PWM)
PWM frequency: 6.14 kHz
Filter: 3 poles at 500 ms
Current output: 4–20 mA
Current output range: 0–25 mA
Isolation: 0 Vrms
Max load resistance: 600 ohms (load + wire resistance)
Current readback: 8 bits
Readback isolation: 60 dB CMRR, 200 Vdc common mode rejection
voltage
Resolution: 11 bits
Accuracy: Software calibrated to 0.2% of 0–25 mA full
scale
Temperature drift: 125 ppm/C, maximum
Readback accuracy: 0.5% of 0–25 mA full scale
Readback temp drift: 400 ppm/C, maximum

8.5.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

Each 24/8 Analog Module is connected through two High Density

Analog/Discrete cables to two 24/8 Analog FTMs. All I/Os on the module are
accessible on the FTM, and the channels are labeled to correspond to their
software locations (e.g., analog input 1 on the FTM will be analog input 1 in the
application software). See Figure 8-13 for an example.

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Power Supply Power Supply CPU 24/8

#1 #2 Analog

J1
P1

J2
P1

High Density Analog/Discrete Cable

High Density Analog/Discrete Cable

P2
J1 24/8 Analog FTM
(Inputs Ch. 12-24)
(Outputs Ch. 5-8)

P2
J1 24/8 Analog FTM
(Inputs Ch. 1-12)
(Outputs Ch. 1-4)

Figure 8-13—Simplex System Configuration Example

Analog Inputs
For a 4–20 mA input signal, the 24/8 Analog Module uses a 200 ohm resistor
across the input located on the 24/8 Analog Module. Each analog input channel
may power its own 4–20 mA transducer. See Figure 8-14 for analog input
connection. This power is protected with a 100 mA fuse on each channel to
prevent an inadvertent short from damaging the module. The 24 Vdc outputs are
capable of providing 24 Vdc with ±10% regulation. The maximum current is 0.8
A. Power connections can be made through terminals located on the 24/8 Analog
FTMs. See Chapter 12 for complete field wiring information for the 24/8 Analog
FTM.

When configuring the AI Combo block in GAP, set Conf. input field to
1 for all inputs when used with the 24/8 Analog FTM. This will allow
the block to use the module factory calibration values for the 4–20
mA inputs that were calibrated with 200 ohm internal resistors on the
24/8 Analog Module.

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Figure 8-14—Analog Input Wiring for a 24/8 Analog FTM

Analog Outputs
There are 8 analog output channels of 4–20 mA with a full scale range of 0–25
mA. All Analog Outputs can drive a maximum load of 600 ohms (load + wire
resistance). See Figure 8-15 for analog output connection. Each output monitors
the output source current for fault detection. All of the analog outputs may be
individually disabled. When a channel fault or a module fault is detected, the
application program may annunciate the fault, disable the channel and stop using
data in system calculations or control. Care should be taken to prevent ground
loops and other faults when interfacing to non-isolated devices. See Chapter 12
for complete field wiring information for the Analog High Density FTM.

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Figure 8-15—Analog Output Wiring for a 24/8 Analog FTM

8.5.4—FTM Reference
See Chapter 12 for complete field wiring information for the Analog High Density
FTM. See Appendix A for part number Cross Reference for modules, FTMs, and
cables.

8.5.5—Troubleshooting
Each 24/8 Analog module has a red Fault LED that is turned on when the system
is reset. During initialization of a module, which occurs after every CPU reset, the
CPU turns the Fault LED on. The CPU then tests each module using diagnostic
routines built into the software. If the diagnostic test is not passed, the LED
remains on or blinks. If the test is successful, the LED goes off. If the Fault LED
on a module is illuminated after the diagnostics and initialization have been run,
the module may be faulty or may be located in the wrong slot.

Number of LED Flashes Failure

1 Hardware watchdog, CPU clock failure, reset fail
2 Micro-controller internal RAM test failure
3 External RAM test failure
4 Unexpected exception error
5 Dual Port RAM test failure
6 EEPROM failure
7 Communications watchdog time out
8 EEPROM error is corrected (reset the module to continue)
9 Missing an A/D Converter interrupt
Table 8-3—LED Indications of Failure

Fault Detection (I/O)

In addition to detecting the High Density Analog I/O module hardware faults, the
application software may detect I/O faults.

Analog Input Faults: The application software may be set with a high and low
latch setpoint to detect input faults.

Analog Output Driver Faults: The module monitors the source currents and
annunciates faults. The application software determines the course of action in
the event of a fault.

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Microcontroller Faults: The system monitors a software watchdog, a hardware
watchdog, and a software watchdog on the VME bus communications. All
outputs are shut down in the event of a microcontroller fault.

Troubleshooting Guide
If during normal control operation, all of the 24/8 Analog modules have Fault
LEDs on, check the chassis’ CPU module for a failure. If during normal control
operation only the 24/8 Analog module’s Fault LED is on or flashing, insure that it
is installed in the correct slot. If it is, then replace that module. See instructions
for replacement in Chapter 15. When a module fault is detected, its outputs will
be disabled or de-energized.

Analog Inputs
If an analog input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage on the FTM terminal block. It should be in the
range of 0–5 V.
3. Verify that there are no or minimal AC components to the Analog Input
signal. Improper shielding may introduce AC noise on the input
terminals.
4. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables, a missing jumper on the terminal
block if the input is a current input, or a blown fuse on the 24 Vdc on the
FTM.
5. If all of the inputs are reading high, check that the 24 Vdc is not
connected across the input directly.
6. Check the software configuration to ensure that the input is configured
properly.
7. If all of the channels on the 24/8 Analog module are not working, check
the fuse on the 24/8 Analog module. See instructions for module
replacement in Chapter 15. This fuse is visible and can be changed
through the bottom of the module. If the fuse is blown, fix the wiring
problem, then replace the fuse with another fuse of the same type and
rating.
8. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the module.
9. If the readings are incorrect on several channels of the 24/8 Analog
module, corresponding to both cables, replace the module.
10. If replacing the module does not fix the problem, replace the FTM. The
FTM contains only traces and a few discrete components, so failure is
extremely unlikely. See instructions for replacing the FTM in Chapter 15.

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Analog Outputs
If an analog output is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Check the load resistance to ensure that it is not greater than 600 ohms.
3. Check to ensure that the load wiring is isolated.
4. Check the wiring for a loose connection on the FTM terminal blocks and
disconnected or misconnected cables.
5. Disconnect the field wiring and connect a resistor across the output. If
the output is correct across the resistor, there is a problem with the field
wiring.
6. If all of the channels on the 24/8 Analog module are not working, check
the fuse on the 24/8 Analog module. See instructions for module
replacement in Chapter 15. This fuse is visible and can be changed
through the bottom of the module. If the fuse is blown, fix the wiring
problem, then replace the fuse with another fuse of the same type and
rating.
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the module.
9. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the module.
10. If replacing the module does not fix the problem, replace the FTM. The
FTM contains only traces and a few discrete components, so failure is
extremely unlikely. See instructions for replacing the FTM in Chapter 15.

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8.6—Dataforth® 24/8 Analog Module

8.6.1—Module Description
The Dataforth® Analog Module uses the same board as utilized in the 24/8
Analog Module in section 7.3. The module is configured for 24 channels of 0–5
Vdc inputs and 8 channels of 4–20 mA outputs. In place of the two standard 24/8
Analog FTMs, two special Simplex Dataforth FTMs are connected through two
high density analog/digital cables. The Simplex Dataforth FTM is designed to
convert sensor input signals to a 0 to 5 V input compatible with the 24/8 Analog
module. Each channel is individually configurable via a plug-in standard isolated
Dataforth SCM7B converter that has been modified to meet Woodward’s
bandwidth and input temperature range requirements. Each module can plug into
any of the 12 channels on the FTM. Each plug-in module converts the incoming
signal to a 1 to 4 volt signal. No Calibration is required on the FTM or its plug-in
modules. The plug-in modules are powered directly through the cable connector;
resulting in no need for external power connections to the FTM. These plug-in
modules currently include 4–20 mA input (internal shunt resistor), 0–5 Vdc input
(pass through), 100 Ω RTDs, 200 Ω RTDs, and Type K Thermocouples. For
Analog Outputs no plug-in modules are required. Isolation is provided on each
channel. Channels are labeled to correspond to their software locations (e.g.,
analog input 1 on the FTM corresponds to analog input 1 in the application
software.)

Figure 8-16—Dataforth 24/8 Analog Module

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8.6.2—Specifications
To obtain overall signal input accuracy and bandwidth, the Dataforth FTM (0–5
V) module input accuracy and the Dataforth 24/8 Analog Module must be taken
into account.

Module K Type RTD 100  Pt Pass Through Pass Through

Thermocouple European Curve with 200 
Resistor (0.1%,
3 Watt)
Dataforth P/N SCM7B47K- SCM7B34-1459 SCM7BPT- SCM7BPT
1458 1460
Woodward P/N 1784-653 1784-655 1784-659 1784-657
Input Range -70F (-56.67C) -70F (-56.67C) 0 to 25 mA 0 to 5 V (limited
to +2200F to +500F (Limited by by MicroNet card
(+1204.44C) (+260C) MicroNet card input range.)
input range.)
Input Protection 120 Vrms max 120 Vrms max None None
Continuous
Input Protection ANSI/IEEE ANSI/IEEE None None
Transient C37.90.1-1989 C37.90.1-1989
Output Range 1 to +5 V 1 to +5 V 0 to 5 V** 0 to 5 V
Linearized Linearized
Isolation (Input to 1500 Vrms 1500 Vrms None None
Output)
CMRR 100 dB 100 dB N/A N/A
(50 or 60 Hz)
Accuracy Maximum 0.32% of Span* 0.075% of N/A N/A
Span*
Gain Stability (-40 40 ppm/C 60 ppm/C 20 ppm/C N/A
to +85C)
Input Offset 0.5 V/C 1.0 V/C N/A N/A
Stability
Output Offset 0.002%Span/C 0.002%Span/C N/A N/A
Stability
Open Input Upscale N/A N/A N/A
Response
Open Input 10 s. max N/A N/A N/A
Detection Time
Bandwidth (-3 dB) 150 Hz 150 Hz N/A N/A
Step Response (0 3 ms 3 ms N/A N/A
to 90%)
Supply Voltage 14-35 Vdc 14-35 Vdc None None
Supply Current 30 mA max 30 mA max N/A N/A
Supply Sensitivity 0.0001%/% Vs 0.0001%/% Vs N/A N/A
Operating Temp. +5 to +45C -40 to +85C -40 to +85C -40 to +85C
Range
Storage Temp. -40 to +85C -40 to +85C -40 to +85C -40 to +85C
Range
Relative Humidity 0 to 90% Non- 0 to 90% Non- 0 to 90% Non- 0 to 90% Non-
condensing condensing condensing condensing
Sensor Excitation N/A 250A N/A N/A
Current
Lead Resistance N/A 0.02C/ max N/A N/A
Effect
Table 8-4—Module Accuracy

* Accuracy includes the effects of repeatability, hysteresis, and conformity. CJC

sensor, thermocouple, or RTD sensor accuracy should be added to the module
accuracy to compute the overall measurement accuracy.

** The maximum input voltage range may vary between 4.975 and 5.025 Volts
from Dataforth module to Dataforth module.

Outputs can drive a maximum load of 600 ohms (load + wire resistance).

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MicroNet TMR Manual 26167V1

8.6.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

Each Dataforth module is connected through two high density analog/discrete

cables to two Simplex Dataforth FTMs. All I/Os on the module are accessible on
the FTM. See Figure 8-17 for an example.

Power Supply Power Supply CPU 24/8

#1 #2 Analog

J1
P1

J2
P1

High Density Analog/Discrete Cable

High Density Analog/Discrete Cable

P2
J1
Simplex Dataforth FTM
(Inputs Ch. 12-24)
(Outputs Ch. 5-8)

P2
J1
Simplex Dataforth FTM
(Inputs Ch. 1-12)
(Outputs Ch. 1-4)

Figure 8-17—Simplex Dataforth Configuration Example

Field Wiring
See Chapter 12 for complete wiring connections for the Simplex Dataforth FTM.
Each input channel requires a Dataforth plug-in module per input. Install one of
the five different Dataforth modules into each of the 12 plug-in slots on the FTM.
It is not necessary to have a plug-in module in a slot if not used. With the Simplex
Dataforth FTM connected to J1 of the Dataforth Module, channels 1-12 will be
active. With the Simplex Dataforth FTM connected to J2 of the Dataforth Module,
channels 13-24 will be active. Wire each channel per the following examples for
each type of plug-in module. Install jumpers on FTM module as shown for
specific type of input.

Thermocouple Plug-in Module

The Thermocouple Plug-in module accepts a single input from a type K
thermocouple. The signal is filtered, isolated, amplified, linearized, and converted
to a 1 to +5 V analog voltage for output to the Dataforth Module.

Linearization is achieved by creating a non-linear transfer function through the

module itself. This non-linear transfer function is configured at the factory, and is
designed to be equal and opposite to the thermocouple non-linearity.

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The cold junction compensation (CJC) is performed by using an NTC thermistor,
externally mounted on the FTM module, as shown in Figure 8-18. The
thermocouple signal will fail high if an open wire is detected.

These modules incorporate both Thompson (Bessel) and Butterworth five-pole

filter to maximize both time and frequency response. After the initial field side
filtering, the input signal is chopped by a proprietary chopper circuit and
transferred across the transformer isolation barrier. The signal is then
reconstructed and filtered and scaled for 1 to 5 V for the Dataforth Module.

MicroNet™ Module Dataforth® FTM

Plug-in
FTM
Module Term Blk
1
0 13
NTC
Thermistor * 2
3 2 14
- In
+24 V
3
+ V out 4 1 15
+ In Thermocouple
0.01uf, 500V
- Com 4
5 16
3 5
IN
Px 2
OUT
17
1

6
24 RTN 18
Jumper
TB15

1
Fuse
100 mA 250 V
2

Figure 8-18—Thermocouple Wiring to Simplex Dataforth FTM

RTD Plug-in Module

The RTD Plug-in module accepts a single connection from a 100 or 200 Ohm
Platinum RTD, depending on the selected RTD Plug-in module as shown in
Figure 8-19. The input signal is filtered, isolated, amplified, linearized, and
converted to a 1 to +5 V analog voltage for output to High Density Analog I/O
Module.

These modules incorporate both Thompson (Bessel) and Butterworth five-pole

filter to maximize both time and frequency response. After the initial field side
filtering, the input signal is chopped by a proprietary chopper circuit and
transferred across the transformer isolation barrier. The signal is then
reconstructed and filtered and scaled for 1 to 5 V for the Dataforth Module.

Linearization is achieved by creating a non-linear transfer function through the

module itself. This non-linear transfer function is configured at the factory, and is
designed to be equal and opposite to the specific RTD non-linearity. Lead
compensation is achieved by matching two current paths thus canceling the
effects of lead resistance.

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 MicroNet TMR Manual 26167V1
MicroNet™ Module Dataforth® FTM
Plug-in
FTM
Module Term Blk
1
0 13
Sense

NTC
Thermistor * 2
3 2 14
- In
+24 V RTD
3
+ V out 4 1 15
+ In

0.01uf, 500V
Com 4
- 5 16
3 5
IN * Note: The thermistor remains present on
Px 2
1 OUT
17 the FTM on all circuits, but has no effect
6 on the accuracy of the measurement.
24 RTN 18
Jumper
TB15

1
Fuse
100 mA 250 V
2

Figure 8-19—RTD Wiring to Simplex Dataforth FTM

Current Input Plug-in Module

The Current Input Plug-in Module is a pass-through module with a 200 ohm
precision shunt resistor to convert the 4–20 mA input to 0.8 to 4 Vdc signal. No
filtering is done on this module. See Figure 8-20 for and example of wiring a loop
powered transducer and Figure 8-21 for a self powered transducer.

When configuring the AI Combo block in GAP, set Conf. input field to
2 for all 4–20 mA inputs when used with the current input plug-in
module. This will allow the block to use the module factory voltage
calibration values with a gain factor for a 200 ohm external resistor
on the Dataforth FTM.

MicroNet™ Module Dataforth® FTM

Plug-in FTM
Module Term Blk
1
0 13
2
3 2 14 4/20 mA (Loop Powered)
+24 V
+ V out 4 1 3
15
+ In -
Sig

0.01uf, 500V
4
4-20mA Transmitter
- Com 5 16
Shield +
+24 V

3 5
IN
Px 2
1 OUT
17
6
18
+24 V
24 RTN
Jumper
TB15

1
Fuse
100 mA 250 V
2

Figure 8-20—Loop powered 4–20 mA Signal Wiring to Simplex Dataforth FTM

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MicroNet™ Module Dataforth® FTM

Plug-in FTM 4/20 mA (Self Powered)

Module Term Blk
1
0 13
2
3 2 14
- In -
+24 V - - 24 V + 24 V

3
4-20mA Transmitter
+ V out 4 1
15
+ In +
Sig

0.01uf, 500V
Com 4
- 5 16
Shield

3 5
IN
Px 2
1 OUT
17
6
24 RTN 18
Jumper
TB15

1
Fuse
100 mA 250 V
2

Figure 8-21—Self-powered 4–20 mA Signal Wiring to Simplex Dataforth FTM

Voltage Input Plug-in Module

The Voltage Input Module is a pass-through module and is capable of reading
voltage signals between 0.8 and 4.8 Vdc. No filtering is provided by the Dataforth
module. See section 24/8 Analog Module for filtering provided by the Dataforth
Module. See Figure 8-22 for an example of wiring a voltage transducer.

When configuring the AI Combo block in GAP, set Conf. input field to
0 for all voltage inputs when used with the voltage input plug-in
module. This will allow the block to use the module factory voltage
calibration values with the Dataforth FTM.

MicroNet™ Module Dataforth® FTM

Plug-in FTM Voltage

Term Blk
Module
1
0 13
2
3 2 14
- In -
+24 V -

3
0-5VDC Transmitter
+ V out 4 1
15
+ In +
Sig

0.01uf, 500V
- Com 5 4
16
Shield

3 5
IN
Px 2
1 OUT
17
6
24 RTN 18
Jumper
TB15

1
Fuse
100 mA 250 V
2

Figure 8-22—0–5 Vdc Signal Wiring to Simplex Dataforth FTM

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 MicroNet TMR Manual 26167V1
Analog Output Connection
The Analog Output circuit doesn’t use a plug-in module. No jumper connections
are required. See Figure 8-23 for an example of wiring a 4–20 mA output device.

+24 V
MicroNet™ Module

I/O Lockout

Analog Output +
Dataforth® FTM
Feedback - FTM
TB1
Analog Output
- Out -
1
Output
Analog Output B + Out + Device
2
0.01uf, 500V
Shield
3

24 COM
TB15

Figure 8-23—Analog Output Signal Wiring to Simplex Dataforth FTM

8.6.4—FTM Reference
See Chapter 12 for complete field wiring of the Simplex Dataforth FTM. See
Appendix A for part number Cross Reference for modules, FTMs, and cables.

Figure 8-24—Dataforth Plug-in Modules

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8.6.5—Troubleshooting
Each Dataforth 24/8 Analog Module has a red Fault LED that is turned on when
the system is reset. During initialization of a module, which occurs after every
CPU reset, the CPU turns the Fault LED on. The CPU then tests each module
using diagnostic routines built into the software. If the diagnostic test is not
passed, the LED remains on or blinks. If the test is successful, the LED goes off.
If the Fault LED on a module is illuminated after the diagnostics and initialization
have been run, the module may be faulty or may be located in the wrong slot.

Number of LED Flashes Failure

1 Hardware watchdog, CPU clock failure, reset fail
2 Micro-controller internal RAM test failure
3 External RAM test failure
4 Unexpected exception error
5 Dual Port RAM test failure
6 EEPROM failure
7 Communications watchdog time out
8 EEPROM error is corrected (reset the module to continue)
9 Missing an A/D Converter interrupt
Table 8-5—LED Indications of Failure

Fault Detection (I/O)

In addition to detecting the High Density Analog I/O module hardware faults, the
application software may detect I/O faults.

Analog Input Faults: The application software may be set with a high and low
latch setpoint to detect input faults.

Analog Output Driver Faults: The module monitors the source currents and
annunciates faults. The application software determines the course of action in
the event of a fault.

Microcontroller Faults: The system monitors a software watchdog, a hardware

watchdog, and a software watchdog on the VME bus communications. All
outputs are shut down in the event of a microcontroller fault.

Troubleshooting Guide
If during normal control operation all of a chassis’ Dataforth 24/8 Analog Module
have Fault LEDs on, check the chassis’ CPU module for a failure. If during
normal control operation only the Dataforth Module’s Fault LED is on or flashing,
insure that it is installed in the correct slot. If it is, then replace that module. See
instructions for replacement in Chapter 15. When a module fault is detected, its
outputs should be disabled or de-energized.

Thermocouple Inputs
If an Thermocouple input is not functioning properly, verify the following:
1. Verify that the correct Dataforth plug-in module is installed. Swap plug-in
modules on FTM. Replace module if problem follows module.
2. Check that the cable is shielded and the shield is properly grounded per
section Shields and Grounding section in Chapter 14.

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MicroNet TMR Manual 26167V1
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are reading full scale, look for a loose
connection on the terminal blocks, disconnected or misconnected cables,
a missing jumper on the terminal block, or a blown fuse on the 24 Vdc on
the FTM.
5. Check the software configuration to ensure that the input is configured
properly.
6. Verify that FTM module is within operating limits of +5 to 45 degrees C.
7. If all of the thermocouple channels on the Dataforth Module are not
working, check the fuse on the Dataforth Module. See instructions for
module replacement in Chapter 15. This fuse is visible and can be
changed through the bottom of the module. If the fuse is blown, fix the
wiring problem, then replace the fuse with another fuse of the same type
and rating.
8. If the readings are incorrect on several channels of the Dataforth Module,
after replacing both cables, replace the module. If replacing the module
does not fix the problem, replace the FTM. See instructions for replacing
the FTM in Chapter 15.

RTD Inputs
If an RTD input is not functioning properly, verify the following:
1. Verify that the correct Dataforth plug-in module is installed. Swap plug-in
modules on FTM. Replace module if problem follows module.
2. Check that the cable is shielded and the shield is properly grounded per
section Shields and Grounding section in Chapter 14.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are minimum scale or full scale, look for a
loose connection on the terminal blocks, disconnected or misconnected
cables, a missing jumper on the terminal block, or a blown fuse on the 24
Vdc on the FTM.
5. Check the software configuration to ensure that the input is configured
properly.
6. If all of the RTD channels on the Dataforth Module are not working,
check the fuse on the Dataforth Module. See instructions for module
replacement in Chapter 15. This fuse is visible and can be changed
through the bottom of the module. If the fuse is blown, fix the wiring
problem, then replace the fuse with another fuse of the same type and
rating.
7. If the readings are incorrect on several channels of the Dataforth Module,
after replacing both cables, replace the module. If replacing the module
does not fix the problem, replace the FTM. See instructions for replacing
the FTM in Chapter 15.

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4–20 mA Analog Inputs
If a 4–20 mA analog input is not functioning properly, verify the following:
1. Verify that the correct Dataforth plug-in module is installed.
2. Check that the cable is shielded and the shield is properly grounded.
3. Measure the input voltage on the FTM terminal block. It should be in the
range of 0.8-4.0 V.
4. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
5. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables, a missing jumper on the terminal
block if the input is a current input, or a blown fuse on the 24 Vdc on the
FTM.
6. Check the software configuration to ensure that the input is configured
properly.
7. If all of the 4–20 mA channels on the Dataforth Module are not working,
check the fuse on the Dataforth Module. See instructions for module
replacement in Chapter 15. This fuse is visible and can be changed
through the bottom of the module. If the fuse is blown, fix the wiring
problem, then replace the fuse with another fuse of the same type and
rating.
8. If the readings are incorrect on several channels of the Dataforth Module,
after replacing both cables, replace the module. If replacing the module
does not fix the problem, replace the FTM. The 4–20 mA configured FTM
contains only traces and a few discrete components, so failure is
extremely unlikely. See instructions for replacing the FTM in Chapter 15.

0–5 Vdc Analog Inputs

If an 0–5 Vdc analog input is not functioning properly, verify the following:
1. Verify that the correct Dataforth plug-in module is installed.
2. Check that the cable is shielded and the shield is properly grounded.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are minimum scale or full scale, measure
the input voltage on the FTM terminal block. It should be in the range of
0.8-4.8 V. Look for a loose connection on the terminal blocks,
disconnected or misconnected cables on the terminal block.
5. Check the software configuration to ensure that the input is configured
properly.
6. If all of the voltage channels on the Dataforth Module are not working,
check the fuse on the Dataforth Module. See instructions for module
replacement in Chapter 15. This fuse is visible and can be changed
through the bottom of the module. If the fuse is blown, fix the wiring
problem, then replace the fuse with another fuse of the same type and
rating.
7. If the readings are incorrect on several channels of the Dataforth Module,
after replacing both cables, replace the module. If replacing the module
does not fix the problem, replace the FTM.

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MicroNet TMR Manual 26167V1
Analog Outputs
If an analog output is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded.
2. Check the load resistance to ensure that it is not greater than 600 ohms.
3. Check to ensure that the load wiring is isolated.
4. Check the wiring for a loose connection on the FTM terminal blocks and
disconnected or misconnected cables.
5. Disconnect the field wiring and connect a resistor across the output. If
the output is correct across the resistor, there is a problem with the field
wiring.
6. If all of the channels on the Dataforth Module are not working, check the
fuse on the Dataforth Module. See instructions for module replacement
in Chapter 15. This fuse is visible and can be changed through the
bottom of the module. If the fuse is blown, fix the wiring problem, then
replace the fuse with another fuse of the same type and rating.
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the module.
9. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the module.
10. 1 If replacing the module does not fix the problem, replace the FTM. The
FTM contains only traces and a few discrete components, so failure is
extremely unlikely. See instructions for replacing the FTM in Chapter 15.

180 Woodward
Manual 26167V1 MicroNet TMR

8.7—Analog Combo Module

8.7.1—Module Description
Each High Density Analog Combo module contains circuitry for four speed
sensor inputs, eight analog inputs, four analog outputs, and two proportional
actuator driver outputs. Each speed sensor input may be from a magnetic pick-
up or from a proximity probe, each analog input may be 4–20 mA or 0–5 V, and
each actuator driver may be configured as 4–20 mA or 20–160 mA.

There are two configurations of the Analog Combo Modules. One has the analog
inputs configured for 4–20 mA and the other is configured for 0–5 V. See
Appendix A for specific part numbers. In a simplex system, either Analog Combo
module is connected through two analog cables to one Analog Combo FTM. All
of the I/O are accessible on the FTM, and the channels are labeled to correspond
to their software locations, e.g. analog input 1 on the FTM will be analog input 1
in the application software.

This module includes no potentiometers and requires no calibration. An Analog

Combo module may be replaced with another module of the same part number
without any adjustment.

Figure 8-25—Analog Combo Module

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MicroNet TMR Manual 26167V1

8.7.2—Module Specifications
Digital Speed Sensor Inputs
Number of channels: 4
Update time: 5 ms

MPU Input Ratings

Input frequency: 100 - 25000 Hz
Input amplitude: 1-25 Vrms
Input impedance: 2000 Ohms
Isolation voltage: 500 Vrms
Resolution: 12 bits minimum over chosen frequency range
Accuracy: 0.03% full scale, minimum

Proximity Probe Input Ratings

Input frequency: 0.5 - 25000 Hz
Input amplitude: 3.5 - 32 Vdc input to the module
Available power: 12 Vdc or 24 Vdc, 50 mA maximum
Isolation voltage: 0 Vrms
Resolution: 12 bits minimum over chosen frequency range
Accuracy: Software calibrated to 0.03% full scale
Fuse: 24 Vdc 100 mA fuse/channel, 12 Vdc short
circuit protected
Time Stamping: 5 millisecond resolution on low event and low
latch

Analog Input Ratings

Number of channels: 8
Update time: 5 millisecond
Input range: 0–25 mA, or 0–5 V; Dependent on module part
number.

The maximum input voltage range may vary between 4.975 and 5.025
Volts from module to module.

Isolation: 0 VRMS, -60 dB CMRR, 200 Vdc common

mode rejection voltage; no galvanic isolation
Input impedance: 200 ohms
Anti-aliasing filter: 2 poles at 10 ms
Resolution: 16 bits
Accuracy: Software calibrated to 0.1%, over 25 mA full
scale
Temp drift: 275 ppm/C, maximum
Fuse: 100 mA fuse per channel
Time stamping: 5 ms resolution on low event and latch, and high
event and latch

182 Woodward
Manual 26167V1 MicroNet TMR
4–20 mA Analog Output Ratings
Number of channels: 4
Update time: 5 ms
Driver: Pulse Width Modulated (PWM)
PWM frequency: 6.14 kHz
Filter: 3 poles at 500 ms
Current output: 4–20 mA current output range: 0 - 25 mA
Isolation: 0 Vrms
Max load resistance: 600 ohms (load + wire resistance)
Current readback: 11 bits
Readback isolation: -60 dB CMRR, 200 Vdc common mode
Resolution: 11 bits
Accuracy: Software calibrated to 0.2%, over 25 mA full
scale
Temperature drift: 125 ppm/C, maximum
Readback accuracy: 0.2%, over 25 mA full scale
Readback temp drift: 400 ppm/C, maximum

Actuator Driver Output Ratings

Number of channels: 2
Update time: 5 millisecond
Driver: PWM (proportional only), single or dual coil
PWM frequency: 6.14 kHz
Filter: 3 poles at 500 microseconds
Current output: 4–20 mA or 20–160 mA, software selectable
Current output range: 0-24 mA or 0–196 mA, depending on the
selected range
Isolation: 0 Vrms
Max. act resistance 45 ohms on the 20–160 mA output, 360 ohms
on the 4–20 mA output
Readback Actuator source and return currents
Readback isolation -60 dB CMRR, 200 Vdc common mode
Dither current 25 Hz, fixed duty cycle, software variable
amplitude
Resolution 11 bits over 25 or 200 mA range
Accuracy Software calibrated to 0.2% of 25 or 200 mA
range
Temperature drift 125 ppm/C, maximum
Readback accuracy 0.1% of 25 or 200 mA range
Readback temp drift 150 ppm/C, maximum

8.7.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

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MicroNet TMR Manual 26167V1
There are two configurations of the Analog Combo Modules. One has the analog
inputs configured for 4–20 mA and the other is configured for 0–5 V. See
Appendix A for specific part numbers. In a simplex system, each Analog Combo
module is connected through two Low Density analog cables to one Analog
Combo FTM. All of the I/O are accessible on the FTM, and the channels are
labeled to correspond to their software locations. See Figure 8-26 for
configuration.

Power Supply Power Supply CPU Analog

#1 #2 Combo

J1
P1

J2
P1

Low Density Analog Cable

Low Density Analog Cable

P2 P2
J1 J2

Analog Combo FTM

Figure 8-26—Simplex System Configuration Example

Field Wiring
See Chapter 12 for complete wiring connections for the Analog Combo FTM.
Wire each channel per the following examples for each type of signal.

CE COMPLIANCE—MPU / proximity probe field wiring cables should

be limited to less than 30 m (100 ft) for best EMC surge performance.

Degraded surge performance may occur under the following

conditions:
 cable lengths greater than 30 m
 ground fault conditions created by poor cable shield termination
 DGND coupled/connected to protective earth

Speed Sensor Inputs

The MPU and proximity probe inputs are read and the speed is provided to the
application program. A derivative output is provided via the application software if
desired. The speed sensor inputs are filtered by the Analog Combo module and the
filter time constant is selectable through the application software program at 8
milliseconds or 16 milliseconds. Eight milliseconds should be acceptable for most
applications. 16 milliseconds may be necessary for very slow speed applications. The
speed range determines the maximum speed that the module will detect. The control
output of the software will detect a minimum speed of one fiftieth of the speed range.
This allows detection of failed speed sensors to help prevent overspeed due to slow
update times at very low speeds. The monitor output of the GAP block will read down
to 0.5 Hz, irrespective of the speed range. An application may use any combination of
accepted MPU and proximity probes, and any combination of speed ranges.
Any of the module’s four speed channels accepts passive magnetic pickup units
(MPUs) or proximity probes. Each speed input channel can only accept one MPU
or one proximity probe.
184 Woodward
 Manual 26167V1 MicroNet TMR

When a speed sensor input channel has been wired as either MPU or
proximity probe input, the unused MPU/Prox must be jumpered at the
FTM. When an input channel is not used, both the MPU and Prox
inputs must be jumpered. See example in Figure 8-27.

MicroNet Module CABLE FTM

NC
J1 J1 TB1
+
37 37 1
MPU #1
36 36 45 -
MPU/PROX_1 .01uF
18 18 2
2.1K ohm
+Prox Input Ch. 1 (MPU)
19 19 46 +Prox Input
3W
3 +24VDC
+24VDC
F12 Jumper
24/12V 47 +12VDC
Reg.

4 Com

35 35 48 +MPU Input
Jumper
34 34 5 -MPU Input
MPU/PROX_2 .01uF
15 15 49
2.1K ohm
+Prox Input + Ch. 2 (Prox.)
17 17 6
3W
PROX #2
50
F11
24/12V 7 NC
Reg.
-
51
J2 J2
37 37 8 +MPU Input
Jumper
36 36 52 -MPU Input
MPU/PROX_3 .01uF
18 18 9
2.1K ohm
+Prox Input + Ch. 3 (Prox.)
19 19 53
J1 J1 3W
PROX #3
15 15 10 NC
11 11 F10
24/12V 54
J2 J2 Reg.
15 15 -
11
11 11
35 35 55 +MPU Input
Jumper
34 34 12 -MPU Input
MPU/PROX_4 .01uF
15 15 56 Shld
2.1K ohm Ch. 4
+Prox Input
17 17 13 +Prox Input (Not Used)
+ F9 3W
57 +24VDC
+24VDC J1 J1 Jumper
13 13 24/12V 14 +12VDC
Reg.
- J2 J2
13 13 58 Com
J1 J1
20 20 88
J2 J2
Ground to DIN Rail
20 20

Grounded to Chassis Outer Shell

Figure 8-27—MPU/Proximity Interface Wiring to the Analog Combo FTM

Woodward 185
MicroNet TMR Manual 26167V1
A proximity probe may be used to sense very low speeds. With a proximity
probe, speed can be sensed down to 0.5 Hz. When interfacing to open collector
type proximity probes, a pull-up resistor is required between the supplied
proximity probe voltage and the proximity probe input to the FTM. Individually
fused 12 Vdc and 24 Vdc sources are provided with each speed input to power
system proximity probes (100 mA fuses, located on the FTMs, are used).
External pull-up resistors are required when interfacing with an open collector
type proximity probe. See Figure 8-27 for MPU/proximity probe wiring example.
Channel 1 shows an MPU connection, channel 2 shows a 24 V proximity
connection, and channel 3 is an example of a 12 V proximity connection. Always
jumper the unused MPU connection to eliminate possible noise interference
when connecting a proximity probe.

It is not recommended that gears mounted on an auxiliary shaft

coupled to the rotor be used to sense speed. Auxiliary shafts tend to
turn more slowly than the rotor (reducing speed sensing resolution)
and have coupling gear backlash, resulting in less than optimum
speed control. For safety purposes, it is also not recommended that
the speed sensing device sense speed from a gear coupled to a
mechanical drive side of a system’s rotor coupling.

Analog Inputs
The analog inputs may be current or voltage type dependent on the part number.
See Appendix A for specific part numbers. Both modules use the same cable and
FTM.

All current inputs may be used with two-wire ungrounded (loop powered)
transducers or isolated (self-powered) transducers. All analog inputs have
200 Vdc of common mode rejection. If interfacing to a non-isolated device, which
may have the potential of reaching over 200 Vdc with respect to the control’s
common, the use of a loop isolator is recommended to break any return current
paths that may produce erroneous readings. All current inputs use
200 ohm resistors across their inputs.

Each current input channel may power its own 4–20 mA transducer. This power
is protected with a 100 mA fuse on each channel to prevent an inadvertent short
from damaging the module. The 24 Vdc outputs are capable of providing 24 Vdc
with ±10% regulation. Power connections can be made through terminals located
on the FTMs. Refer to Figure 8-28 for 4–20 mA Current Input wiring.

186 Woodward
Manual 26167V1 MicroNet TMR

MicroNet Module CABLE FTM

TB1
F8
24 +
Loop Powered
Transducer
68 -
.01uF
25 Ch. 1
J1 J1
-
Anti- 9 9 69 -
200
AI_01 aliasing Ohm
+ Filter 27 27 26 +
F7
70 NC

27 NC
.01uF
71 Ch. 2
-
7 7 28 -
Anti-
200 Self Powered
AI_02 aliasing Ohm Transducer
+ Filter 25 25 72 +
F6
29 +24V

73 COM
.01uF
30 SHLD Ch. 3
-
Anti- 5 5 74 -Input
200
AI_03 aliasing Ohm
+ Filter 23 23 31 +Input
F5
75 +24V

32 COM
.01uF
76 SHLD Ch. 4
-
Anti- 2 2 33 -Input
200
AI_04 aliasing Ohm
+ Filter 21 21 77 +Input
F4
34 +24V

78 COM
.01uF
35 SHLD Ch. 5
J2 J2
-
Anti- 9 9 79 -Input
200
AI_05 aliasing Ohm
+ Filter 27 27 36 +Input
F3
80 +24V

37 COM
.01uF
81 SHLD Ch. 6
-
Anti- 7 7 38 -Input
200
AI_06 aliasing Ohm
+ Filter 25 25 82 +Input
F2
13 13 39 +24V
J1 J1
13 13 83 COM
.01uF
40 SHLD Ch. 7
J2 J2
-
Anti- 5 5 84 -Input
200
AI_07 aliasing Ohm
+ Filter 23 23 41 +Input
F1
- 15 15 85 +24V
11 11
+24VDC J1 J1 42 COM
+ 15 15 .01uF
11 11 86 SHLD Ch. 8
J2 J2
-
Anti- 2 2 43 -Input
200
AI_08 aliasing Ohm
+ Filter 87
21 21 +Input
J1&2 J1&2
20 20 88

Grounded to Chassis J1 Outer Shell Ground to DIN Rail

Figure 8-28—Current Input Wiring for an Analog Combo Module FTM

Woodward 187
MicroNet TMR Manual 26167V1
Only self-powered voltage transducers should be used on voltage input
channels. The full scale range must not exceed 5 volts. Refer to Figure 8-29 for
0–5 Vdc voltage transducer input wiring.

MicroNet Module CABLE FTM

TB1
F8
24 NC

68 NC
.01uF
25 Ch. 1
J1 J1
-
9 9 69 -
Anti- Self Powered
AI_01 aliasing Voltage
+ Filter 27 27 26 + Transducer
F7
70 NC

27 NC
.01uF
71 SHLD Ch. 2
-
Anti- 7 7 28 -Input
AI_02 aliasing
+ Filter 25 25 72 +Input
F6
29 NC

73 NC
.01uF
30 SHLD Ch. 3
-
Anti- 5 5 74 -Input
AI_03 aliasing
+ Filter 23 23 31 +Input
F5
75 NC

32 NC
.01uF
76 SHLD Ch. 4
-
Anti- 2 2 33 -Input
AI_04 aliasing
+ Filter 21 21 77 +Input
F4
34 NC

78 NC
.01uF
35 SHLD Ch. 5
J2 J2
-
Anti- 9 9 79 -Input
AI_05 aliasing
+ Filter 27 27 36 +Input
F3
80 NC

37 NC
.01uF
81 SHLD Ch. 6
-
Anti- 7 7 38 -Input
AI_06 aliasing
+ Filter 25 25 82 +Input
F2
13 13 39 NC
J1 J1
13 13 83 NC
.01uF
40 SHLD Ch. 7
J2 J2
-
Anti- 5 5 84 -Input
AI_07 aliasing
+ Filter 23 23 41 +Input
F1
- 15 15 85 NC
11 11
+24VDC J1 J1 42 NC
+ 15 15 .01uF
11 11 86 SHLD Ch. 8
J2 J2
-
Anti- 2 2 43 -Input
AI_08 aliasing
+ Filter 21 21 87 +Input
J1&2 J1&2
20 20 88

Grounded to Chassis J1 Outer Shell Ground to DIN Rail

Figure 8-29—Voltage Input Wiring for an Analog Combo Module FTM

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Manual 26167V1 MicroNet TMR
Analog Outputs
The analog outputs are 4–20 mA with a full-scale range of 0–25 mA. Each output
monitors the output source current for fault detection. All of the analog outputs
may be individually disabled. When a channel fault or a module fault is detected,
the application program may annunciate the fault, disable the channel or module,
and stop using the data in system calculations or control.

The Analog Combo module has four 4–20 mA current output drivers. All analog
outputs can drive a maximum load of 600 ohms (load + wire resistance). Care
should be taken to prevent ground loops and other faults when interfacing to non-
isolated devices. See Figure 8-30 for an example of 4–20 mA output wiring.

Actuator Outputs
The actuator outputs may be configured for 4–20 mA or 20–160 mA.
Configuration is done through the application software; no hardware
modifications in the forms of jumpers or switches are necessary. For fault
detection, each output monitors the output source current and the output return
current. All of the actuator outputs may be individually disabled. When a channel
fault or a module fault is detected, the application program may annunciate the
fault, disable the channel or module, and stop using the data in system
calculations or control.

Dither may be provided in the application software for each output. Dither is a low
frequency (25 Hz) signal consisting of a 5 millisecond pulse modulated onto the
DC actuator-drive current to reduce sticking due to friction in linear type
actuators. Woodward TM-type actuators typically require dither. Dither amplitude
is variable through the application software. See Figure 8-30 for an example of
actuator wiring.

For a dual coil actuator in a simplex system, two actuator driver

outputs must be used.

Configuration Notes
 Maximum impedance for a 4 to 20 mA actuator output driver is 360 ohms
(actuator impedance + wire resistance).
 Maximum impedance for a 20 to 160 mA actuator output is 45 ohms
(actuator impedance + wire resistance).
 Each actuator driver senses its source and return current to allow
overcurrent and undercurrent alarms and shutdowns.

8.7.4—FTM Reference
See Chapter 12 for complete Analog Combo FTM field wiring information. See
Appendix A for proper Module, FTM, and cable part numbers.

Woodward 189
MicroNet TMR Manual 26167V1

MicroNet Module CABLE FTM

+24
V TB1
.01uF

J1 J1 16 SHLD
I/O Lockout
33 33 15 +Output Ch. 1
Analog AO_01
+
Output 32 32 59 -Output
- .01uF
Feedback
61
Analog
B +
Output 31 31 17 Ch. 2
Output
AO_02 Device
30 30 60 -
.01uF
24 COM
19 SHLD
J2 J2
33 33 18 +Output Ch. 3
AO_03
32 32 62 -Output
.01uF

64 SHLD

31 31 63 +Output Ch. 4
AO_04
30 30 20 -Output

22 SHLD
J1 J1 .01uF
29 29 21 +Output Ch. 1
ACT_01
28 28 65 -Output
.01uF

67 SHLD
J2 J2
29 29 66 +Output Ch. 2
ACT_02
28 28 23 -Output
J1&2 J1&2
20 20 88

Grounded to Chassis J1 Outer Shell Ground to DIN Rail

Figure 8-30—Analog Output and Actuator Wiring for an Analog Combo FTM

8.7.5—Troubleshooting
Fault Detection (Module Hardware)
Each Analog Combo module has a red Fault LED that is turned on when the
system is reset. During initialization of a module, which occurs after every CPU
reset, the CPU turns the Fault LED on. The CPU then tests the module using
diagnostic routines built into the software. If the diagnostic test is not passed, the
LED remains on or blinks. If the test is successful, the LED goes off. If the Fault
LED on a module is illuminated after the diagnostics and initialization have been
completed, the Analog Combo module may be faulty or may be located in the
wrong slot.

Number of LED Flashes Failure

1 Hardware watchdog, CPU clock failure, reset fail
2 Micro-controller internal RAM test failure
3 External RAM test failure
4 Unexpected exception error
5 Dual Port RAM test failure
6 EEPROM failure
7 Communications watchdog time out
Table 8-6—LED Indications of Failure

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Manual 26167V1 MicroNet TMR
Fault Detection (I/O)
In addition to detecting module hardware faults, the application program may
detect I/O faults.

Analog Input Faults. The application software may set a high and low latch
setpoint to detect input faults.

Speed Sensor Input Faults. The application software may set a high and low
latch setpoint to detect input faults. The low latch setpoint must be greater than
one fiftieth of the frequency range.

Analog Output Driver Faults. The module monitors the source currents and
annunciates faults. The application determines the course of action in the event
of a fault.

Actuator Driver Or Load Faults. The module monitors the source and return
currents and annunciates faults. The application determines the course of action
in the event of a fault.

Micro-controller Faults. The system monitors a software watchdog, a hardware

watchdog, and a software watchdog on the VME bus communications. All
outputs are shutdown in the event of a microcontroller fault.

Troubleshooting Guide
If during normal control operation all of a chassis’ Analog Combo modules have
Fault LEDs on, check the chassis’ CPU module for a failure. If during normal
control operation only the Analog Combo module’s Fault LED is on or flashing,
insure that it is installed in the correct slot. If it is, then replace that Analog
Combo module. See instructions for replacement in Chapter 15. When a module
fault is detected, its outputs should be disabled or de-energized.

Speed Sensor Inputs

MPUs. If a magnetic pickup input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage on the terminal block. It should be in the range
of 1–25 VRMS.
3. Verify that the signal waveform is clean and void of double zero
crossings.
4. Verify that no ground connection exists and that the resulting 60 Hz
signal is absent.
5. Measure the frequency. It should be in the range of 100 Hz - 25 kHz.
6. Verify that any unused MPU/Prox inputs are jumpered per Figure 8-27.
7. Check the wiring. Look for a loose connection at the terminal blocks and
disconnected or misconnected cables.
8. Check the software configuration to ensure that the input is configured
properly.
9. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the Analog Combo module.
10. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the Analog Combo module.

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MicroNet TMR Manual 26167V1
11. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15. The FTM does not
contain any active components on the MPU inputs, so replacing it should
be the last option.

Proximity Probes
If a proximity probe input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage on the terminal block. It should be in the range
of 3.5 – 32 Vpeak.
3. Verify that the signal waveform is clean and void of double zero
crossings.
4. Verify that no ground connection exists and that the resulting 60 Hz
signal is absent.
5. Measure the frequency. It should be in the range of 0.5 Hz to 25 kHz.
6. Verify that any unused MPU/Prox inputs are jumpered per Figure 8-27.
7. Check the wiring. Look for a loose connection at the terminal blocks,
disconnected or misconnected cables, a missing jumper on the terminal
block, or a blown fuse on the 24 Vdc on the FTM.
8. Check the software configuration to ensure that the input is configured
properly.
9. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the Analog Combo module.
10. If the readings are incorrect on several channels of the Analog Combo
module, corresponding to both cables, replace the Analog Combo
module.
11. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15. The FTM contains only
a wire-wound 3 W resistor and traces, so failure is extremely unlikely and
replacing it should be the last option.

Analog Inputs
If an analog input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage on the terminal block. It should be in the range
of 0–5 V.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA or volts, look for a loose connection on the terminal
blocks, disconnected or misconnected cables, a missing jumper on the
terminal block if the input is a current input, or a blown fuse on the
24 Vdc on the FTM.
5. If all of the inputs are reading high, check that the 24 Vdc is not
connected across the input directly.
6. Check the software configuration to ensure that the input is configured
properly.
7. Check the fuse on the FTM. See the instructions and fuse locations
below.

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Manual 26167V1 MicroNet TMR
8. If the other channels on the Analog Combo module are not working
either, check the fuse on the Analog Combo module. See instructions for
module replacement in Chapter 15. This fuse is visible and can be
changed through the bottom of the module. If the fuse is blown, fix the
wiring problem, then replace the fuse with another fuse of the same type
and rating.
9. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the Analog Combo module.
10. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the Analog Combo module.
11. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15. The FTM does not
contain any active components on the MPU inputs, so replacing it should
be the last option.

Analog Outputs
If an analog output is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Check the load resistance to ensure that it is not greater than 600 ohms.
3. Check to ensure that the load wiring is isolated.
4. Check the wiring for a loose connection on the terminal blocks and
disconnected or misconnected cables.
5. Disconnect the field wiring and connect a resistor across the output. If
the output is correct across the resistor, there is a problem with the field
wiring.
6. If the other output channels on the Analog Combo module are also not
working, check the fuse on the Analog Combo module. See instructions
for module replacement in Chapter 15. This fuse is visible and can be
changed through the bottom of the module. If the fuse is blown, fix the
wiring problem and replace the fuse with a fuse of the same type and
rating.
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the Analog Combo module.
9. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the Analog Combo module.
10. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15. The FTM does not
contain any active components on the MPU inputs, so replacing it should
be the last option.

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Actuator Outputs
If an actuator output is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Check the load resistance to ensure that it is below the specified limit.
3. Check to ensure that the load wiring is isolated.
4. Check the wiring for a loose connection on the terminal blocks or
disconnected or misconnected cables.
5. Disconnect the field wiring and connect a resistor across the output.
6. If the other output channels on the Analog Combo module are also not
working, check the fuse on the Analog Combo module. See instructions
for module replacement in Chapter 15. This fuse is visible and can be
changed through the bottom of the module. If the fuse is blown, fix the
wiring problem, and replace the fuse with a fuse of the same type and
rating.
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the Analog Combo module.
9. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the Analog Combo module.
10. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15. The FTM does not
contain any active components on the MPU inputs, so replacing it should
be the last option.

Replacing a Fuse on the Field Terminal Module (FTM)

1. Verify that the condition that caused the fuse to blow has been corrected.

If power has not been removed from the control system, power will
be active at the module and also at the FTM. Shorting of protected
circuitry could cause a control system shutdown.

2. Remove FTM cover carefully, to prevent contact with any FTM circuitry
under the cover. To remove the FTM cover, pinch the retaining barb and
lift the cover.
3. Locate and replace the fuse with another fuse of the same size and
rating.
4. Replace the FTM cover.

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8.8—34 Ch High Density Versatile Input Module

(HDVIM)
8.8.1—Module Description
This board includes no potentiometers and requires no calibration. A
Configurable 34 Ch HDVIM module may be replaced with another board of the
same part number without any adjustment. Each Configurable 34 Ch HDVIM
Module contains circuitry for 34 Analog inputs and two cold junction inputs. 24 of
the Analog inputs may be 4–20 mA inputs or thermocouple inputs, and the
remaining ten Analog inputs may be 4–20 mA inputs or RTD inputs. The
Configurable 34 Ch HDVIM Module connects to the CPU board through the VME
bus.

The first 12 Thermocouple/4–20 mA inputs are isolated as a group, from the

other inputs, and from control common. The second 12 Thermocouple/4–20 mA
inputs are isolated as a group, from the other inputs, and from control common.
The first 4 RTD/4–20 mA inputs are isolated as a group, from the other inputs,
and from control common. The second 6 RTD/4–20 mA inputs are isolated as a
group, from the other inputs, and from control common.

Figure 8-31—34 Channel HDVIM Module

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8.8.2—Module Specifications
Thermocouple/4–20 mA Analog Inputs
Number of channels: 24
Current range: 0-24 mA (if configured for 4–20 mA)
Voltage range: ±72.8 mV (if configured for thermocouple)
Input impedance: 103 ohms (±1%) for 4–20 mA inputs

Thermocouple Type and Range

(Type E, J, K, N, R, S, and T thermocouples must conform to the common
commercial specifications published in the Annual Book of ASTM Standards with
voltage predictions in line with N.I.S.T. Monograph 175 or ITS-90.)

Type E:-9.83 mV (–267.68 C/–449.82 F) to 72.8 mV (952.60 C/1746.68 F)

Type J:-8.09 mV (–209.72 C/–345.50 F) to 69.55 mV (1199.94 C/2191.89 F)
Type K:-6.45 mV (–263.95C/–443.11 F) to 54.88 mV (1371.81 C/2501.26 F)
Type N:-4.34 mV (–263.14C/–441.65 F) to 47.51 mV (1299.92 C/2371.86 F)
Type R:-0.22 mV (–48.27C/–54.89 F) to 21.10 mV (1767.88 C/3214.18 F)
Type S:-0.23 mV (–48.60C/–55.48 F) to 18.69 mV (1767.76 C/3213.97 F)
Type T:-6.25 mV (–265.71C/–446.28 F) to 20.87 mV (399.97 C/751.95 F)

Common Mode Rejection –80 dB minimum for Analog inputs

–96 dB typical for Analog inputs
–110 dB minimum for thermocouple inputs
–120 dB typical for thermocouple inputs

Operational Input common

mode voltage range: ±11 V minimum
Maximum Non-operational
common mode voltage range: ±40 V minimum
Anti-aliasing filter: 2 poles at 10 ms (channel 11 has 2 poles at 5
ms)
Resolution: 15 bits
4–20 mA Input Accuracy: 1.1% FS (4–20 mA)

The overall accuracy of the 4–20 mA input measurement is

dependent on the ambient temperature of the board. The accuracy is
based on a board temperature between 0 and 55 °C. The accuracy is
in percent of full scale range.

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Thermocouple Accuracy
The overall accuracy of the thermocouple measurement is dependent on the
ambient temperature of the board. The following accuracies are based on a
board temperature between 0 and 55C. All accuracies are in percent of full scale
range for the type of thermocouple and the range specified.

Type E(<25C): 1.15%

Type E(>25C): 1.08%
Type J(<25C): 1.09%
Type J(>25C): 1.07%
Type K(<25C): 1.14%
Type K(>25C): 1.08%
Type N(<25C): 1.21%
Type N(>25C): 1.09%
Type R(<300C): 1.16%
Type R(>300C): 1.09%
Type S(<300C): 1.16%
Type S(>300C): 1.09%
Type T(<25C): 2.53%
Type T(>25C): 1.27%

Thermocouple accuracy may be reduced by RF interference in the

900 MHz to 1 GHz frequency range. RF interference may reduce the
accuracy another 0.45% of full scale when present.

CJ Update time: 5 ms
CJ accuracy: ±3 C
Latency
odd numbered channels: 1 ms
even numbered channels: 3 ms
Failure detection: Open wire detection provided for thermocouples
Isolation: All input channels are isolated from the rest of
the MicroNet platform to 500 Vdc, however they
are not isolated from each other. The inputs are
differential, with a high impedance between
channels.

RTD/4–20 mA Analog Inputs

Number of channels: 10
Input type: 100 or 200 ohm 3-wire
Max. input current: 24 mA, if configured for 4–20 mA
Max. input resistance: 781, if configured for RTD
RTD source current: 1 mA

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RTD Range
(Must conform to DIN (Deutsche Institut for Normung) standard for 100 or 200
ohm European curve (Alpha = .00385) or American curve 100 or 200 ohm curve
(Alpha = .00392))

100 RTD (European Curve): 18.49  (–200 C/–328 F) to 390.48  (850
C/1562 F)
200 RTD (European Curve): 37.04  (–200 C/–328 F) to 533.10  (457
C/854.6 F)
100 RTD (American Curve): 59.57  (–100 C/–148 F) to 269.35  (457
C/854.6 F)
200 RTD (American Curve): 119.14  (–100 C/–148 F) to 538.70 
(457 C/854.6 F)

Common mode rejection: –80 dB minimum for analog inputs

–96 dB typical for analog inputs
–96 dB minimum for RTD inputs
–115 dB typical for RTD inputs
Input common mode range: ±11 V minimum
Safe input common mode
volt: ±40 V minimum
Input impedance: 103 ohms (±1%) for 4–20 mA inputs
Anti-aliasing filter: 2 poles at 10 ms
Resolution: 15 bits

RTD Accuracy
The overall accuracy of the RTD measurement is dependent on the ambient
temperature of the board. The following accuracies are based on a board
temperature between 0 and 55C. All accuracy are in percent of full scale range
for the type of RTD specified.

100 RTD (European Curve): 1.28% FS

200 RTD (European Curve): 1.28% FS
100 RTD (American Curve): 1.28% FS
200 RTD (American Curve): 1.28% FS

Update time: 5 ms
I/O Latency: 1 ms

Isolation: All input channels are isolated from the rest of the MicroNet platform to
500 Vdc, however inputs are not isolated from each other.

8.8.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

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In a Simplex system, each 34 Ch HDVIM module is connected through two high
density 62 conductor analog cables to two 34 Ch HDVIM FTMs. All inputs on the
module are accessible on the FTM, and the channels are labeled to correspond
to their software locations (e.g., analog input 1 on the FTM will be analog input 1
in the application software). See Figure 8-32. for an example.

Power Supply Power Supply CPU HDVIM

#1 #2

J1
P1

J2
P1

High Density Analog/Discrete Cable

High Density Analog/Discrete Cable

34Ch HDVIM FTM

P2
J1 (AI/TC Ch. 13-24)
(RTD Ch. 5-10)

P2
34Ch HDVIM FTM
J1 (AI/TC Ch. 1-12)
(RTD Ch. 1-4)

Figure 8-32—Simplex System Configuration Example

Loop power for the Analog inputs must be supplied by an external supply, if
needed. This supply should be wired to terminals 40 and 81 on each FTM. The
FTM will fuse and distribute the power to 9 sets of terminals on the FTM. The 4–
20 mA, thermocouple, or RTD configurable inputs are selected in the GAP block
software, for each input. The GAP block configuration sets input gain via
software. The maximum wire size that the FTM can accept is one 16 AWG or two
20 AWG wires.

34 Ch HDVIM Module Operation

All 34 inputs can be configured as 4–20 mA analog inputs. The first 24 channels
can be configured as 4–20 mA inputs or thermocouples inputs and the last 10
can be configured as 4–20 mA inputs or RTD inputs. The application software
must be configured to match the input type used, i.e. 4–20 mA, 100 ohm RTD, K
type thermocouple, etc. This allows the 34 Ch HDVIM module to use the
applicable hardware calibration values, and to configure the appropriate
hardware gains. The first thermocouple inputs must be configured in pairs, i.e.
channels 1 and 2 must both be thermocouples or must both be 4–20 mA inputs.
The RTD channels may be configured individually. Any 'un-used' channel of a
pair, Channels 1 - 24, must have its input shorted to prevent measurement errors
on the 'in-use' channel of the pair.

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Figure 8-33—Wiring Diagram for 34 Ch HDVIM FTM

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4–20 mA Inputs
For a 4–20 mA input signal, the 34 Ch HDVIM module uses a 100 ohm resistor
across the input. All 4–20 mA inputs may be used with two-wire ungrounded
(loop powered) transducers or isolated (self-powered) transducers. All Analog
inputs have 11 Vdc of common mode rejection. If interfacing to a non-isolated
device, which may have the potential of reaching over 11 Vdc with respect to the
control’s common, the use of a loop isolator is recommended to break any return
current paths, which could produce erroneous readings. 0–5 V inputs are not
supported by this module. No loop power is provided by the MicroNet module. An
external supply must be connected to the FTM for powering loop powered inputs.

RTD Inputs
RTD inputs must be configured to use either the European or American curve in
software. Only 100 and 200 ohm platinum RTDs are supported. 200 ohm RTDs
are limited to the maximum temperature on the American curve, even when the
European curve is used. The RTD source current is 2 mA, and the RTD sense
input should be tied to the negative side of the RTD, at the RTD.

Thermocouple Inputs
See Module Specifications for supported thermocouple types. A cold junction
sensor is provided on the 34 Ch HDVIM FTM. If the actual cold junction in the
field wiring occurs elsewhere, the temperature of that junction must be brought
into the control as a thermocouple, RTD, or 4–20 mA input, and the application
software must be configured to use the appropriate cold junction temperature.
The thermocouple and cold junction input units (C or F) should be consistent in
the application software.

The first 12 Analog inputs on each FTM are isolated as a group from control
common, earth ground, and the rest of the Analog inputs. The next 4 or 6 Analog
inputs on the FTM are also isolated as a group from control common, earth
ground, and the rest of the Analog inputs. This results in 4 isolated groups of
inputs on each module.

If 4–20 mA inputs are configured for the first twelve channels on a

FTM, and thermocouple inputs are also used on that FTM, then the 4–
20 mA inputs should use an isolated power supply. Similarly, if 4–20
mA inputs are configured for the last 4-6 channels on a FTM, and
RTD inputs are also used on that FTM, the 4–20 mA inputs should
use an isolated power supply. This prevents 4–20 mA inputs from
introducing noise on temperature inputs, when they share the same
isolated input ground on the module.

8.8.4—FTM Reference
See Chapter 12 for complete 34 Ch HDVIM FTM field wiring information. See
Appendix A for proper Module, FTM, and cable part numbers.

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Figure 8-34—Analog Input Interface Wiring to the 34 Ch HDVIM Module for

Thermocouple Inputs

Figure 8-35—Analog Input Interface Wiring to the 34 Ch HDVIM Module for

4–20 mA Inputs

Figure 8-36—4–20 mA Input Interface Wiring to the 34 Ch HDVIM Module for 4–

20 mA on 4/20 mA/RTD Inputs

Figure 8-37—RTD Input Interface Wiring to the 34 Ch HDVIM Module for RTDs
on 4–20 mA/RTD Inputs

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8.8.5—Troubleshooting
Each 34 Ch HDVIM module has a red fault LED that is turned on when the
system is reset. During initialization of a board, which occurs after every CPU
reset, the CPU turns the Fault LED on. The CPU then tests the board using
diagnostic routines built into the software. If the diagnostic test is not passed, the
LED remains on or blinks. If the test is successful, the LED goes off. If the fault
LED on a board is illuminated after the diagnostics and initialization have been
completed, the 34 Ch HDVIM module may be faulty.

Number of LED Flashes Failure

1 Micro-Processor failure
2 Bus, Address, any unexpected exception error
3 Internal RAM failure
4 Internal Watchdog failure
5 EEPROM failure
7 Kernel software Watchdog count error
13 Dual port RAM error
Table 8-7—LED Indications of Failure

Fault Detection (I/O)

In addition to detecting board hardware faults, the application program may
detect I/O faults.

Analog Input Faults. The application software may set a high and low latch
setpoint to detect input faults. For thermocouple inputs, open wire detection is
provided.

Micro-controller Faults. The system monitors a software watchdog, a hardware

watchdog, and a software watchdog on the VME bus communications. All
outputs are shutdown in the event of a microcontroller fault.

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Troubleshooting Guide
If an Analog input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage on the terminal block. It should be in the range
of 0–5 V for 4–20 mA inputs. RTD inputs have a 2 mA current source.
Thermocouple inputs should have the appropriate millivolt signal.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
Thermocouple inputs are extremely sensitive to signal fluctuations.
4. Check the wiring. For a 4–20 mA input if the input is reading 0 or the
engineering units that correspond to 0 mA, look for a loose connection at
the terminal blocks and disconnected or misconnected cables.
5. For RTD inputs, check for proper connection of the sense line.
6. For thermocouple inputs, check for proper cold junction location.
7. If the input is reading high, check that the power is not connected across
the input directly.
8. Check the software configuration to ensure that the input is configured
properly. Ensure that the proper RTD or thermocouple type is selected, if
applicable.
9. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the 34 Ch HDVIM module.
10. If the readings are incorrect on several channels of the 34 Ch HDVIM
module, corresponding to both cables, replace the 34 Ch HDVIM
module.
11. If replacing the module does not fix the problem, replace the FTM. See
the instructions in Chapter 15 for replacing the FTM. The FTM contains
only traces and a few discrete components, so failure is extremely
unlikely.

8.9—Current Input Modules

There are three different 8 Ch Current Input modules available from Woodward.
These consist of the 8 Ch Current Input (4–20 mA) module, Non-Standard 8 Ch
Current Input (4–20 mA) module, and the 8 Ch Current/Voltage Input Module.
The 8 Ch Current/Voltage Input module was created for a special program and is
not a standard Woodward product.

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8.10—8 Ch Current Input (4–20 mA) Module

8.10.1—Module Description
Each 8 Ch Current Input (4–20 mA) Module contains circuitry for eight fully
isolated double-ended current inputs. The module is connected through one Low
Density Analog cable to one Analog Input FTM for field wiring connections. All
analog inputs may be used with two-wire ungrounded (loop powered)
transducers or isolated (self-powered) transducers. The Input signal range is
between 0 and 25 mA. The module has a built-in precision voltage source. The
readings from the precision-voltage reference are used for on-line temperature
compensation and automatic calibration for the module.

These modules have no potentiometers and require no calibration. A module

may be replaced with another module of the same part number without any
adjustment.

Figure 8-38—8 Channel Current Input (4–20 mA) Module

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8.10.2—Specification
Number of Channels: 8
Input Range: 0–25 mA
Accuracy: 0.5% of full scale
Temperature Coefficient: 12 ppm/degrees C
Anti-aliasing filter 2 poles at 12 ms (Channels 1-8)
Module interface: VMEbus
Resolution: 16 bit converter
Isolation: 1500 Vac continuous (channel input to control
common)
CMRR: -90 db
Input Impedance: 249 ohms
Status Indication: RED LED - channel fault or board fault

8.10.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

In a simplex system, each 8 Ch Current Input (4–20 mA) module is connected

through one Low Density Analog cable to one Analog Input FTM. All of the I/O
are accessible on the FTM. See Figure 8-39 for configuration.

Power Supply Power Supply CPU Current

#1 #2 Input

J1
P1

Low Density Analog Cable

P2
J1

Analog Input FTM

Figure 8-39—8 Ch Current Input (4–20 mA) Module Configuration

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Field Wiring
See Chapter 12 for complete wiring connections for the Analog Input FTM. See
Figure 8-40 for transducer wiring.

All analog inputs may be used with two-wire ungrounded (loop powered)
transducers or isolated (self-powered) transducers. Loop powered or self
powered 4–20 mA transducers may be connected to the current input modules
via the Analog Input FTM shown in Figure 8-40.

8.10.4—FTM Reference
See Chapter 12 for complete Analog Input FTM field wiring. See Appendix A for
proper Module, FTM, and cable part numbers.

8.10.5—Troubleshooting
The input MUX (multiplexer) permits the module to read either the value of the
precision-voltage reference for this channel, or the sensed input for this channel.
The MUX receives the current input and, under the control of the microcontroller,
passes the value through the Gain amplifier to the Isolation Amplifier. The output
of the Isolation Amplifier goes to one input of the channel-selecting MUX.

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MicroNet Module CABLE FTM

J2 J1 TB1
-15V +15V
19 19 1 +
15V1
.01uF Loop Powered
Gnd - Transducer
18 18 2
A1

+ 7.5V
Anti- 37 37 20
249
AI_01 aliasing Ohm
- Filter 36 36 21
-15V +15V
15V2 17 17 3
.01uF
Gnd
16 16 4
A2

+ 7.5V
35 35 22 +
Anti-
249 Self Powered
AI_02 aliasing Ohm Transducer
- Filter 34 34 23 -

-15V +15V
15V3 15 15 5 +15V
.01uF
Gnd
14 14 6 SHLD
7.5V
A3
Ch. 3
+
Anti- 33 33 24 +Input
249
AI_03 aliasing Ohm
- Filter 32 32 25 -Input
-15V +15V
15V4 13 13 7 +15V
.01uF
Gnd
12 12 8 SHLD
7.5V
A4
Ch. 4
+
Anti- 31 31 26 +Input
249
AI_04 aliasing Ohm
- Filter 30 30 27 -Input
-15V +15V
15V5 11 11 9 +15V
.01uF
Gnd
10 10 10 SHLD
7.5V
A5
Ch. 5
+
Anti- 29 29 28 +Input
249
AI_05 aliasing Ohm
- Filter 28 28 29 -Input
-15V +15V
15V6 9 9 11 +15V
.01uF
Gnd
8 8 12 SHLD
7.5V
A6
Ch. 6
+
Anti- 27 27 30 +Input
249
AI_06 aliasing Ohm
- Filter 26 26 31 -Input
-15V +15V
15V7 7 7 13 +15V
.01uF
Gnd
6 6 14 SHLD
7.5V
A7
Ch. 7
+
Anti- 25 25 32 +Input
249
AI_07 aliasing Ohm
- Filter 24 24 33 -Input
-15V +15V
15V8 5 5 15 +15V
.01uF
Gnd
4 4 16 SHLD
7.5V
A8
Ch. 8
+
Anti- 23 23 34 +Input
249
AI_08 aliasing Ohm
- Filter 22 22 35 -Input

3 3 17

2 2 18

1 1 19

21 21 36

20 20 37
Ground to DIN Rail
J1 Outer Shell 38

Figure 8-40—Analog Input Wiring for an 8 Ch Current Input (0–25 mA) Module

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This MUX, under control of the microprocessor, selects the channel to be read.
The analog output of this MUX is converted to a digital value by the A/D
converter, and passed to the microcontroller. The microcontroller makes any
necessary corrections to this value and stores the result in the Dual-Port RAM.
The CPU can then access the values stored in Dual-Port RAM through the VME
interface and bus. See Figure 8-41 for block diagram of module.

Figure 8-41—8 Ch Current Input (0–25 mA) Module Block Diagram

During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.

During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.

The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.

This module also has on-card on-line fault detection and automatic
calibration/compensation. Each input channel has its own precision voltage
reference. Once per minute, while not reading inputs, the on-board
microcontroller reads this reference. The microcontroller then uses this data read
from the voltage reference for both fault detection and automatic temperature
compensation/calibration.

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Limits have been set for the expected readings when the on-board
microcontroller reads each voltage reference. If the reading obtained is outside
these limits, the system determines that the input channel, A/D converter, or the
channel's precision-voltage reference is not functioning properly. If this happens,
the micro-controller flags that channel as having a fault condition. The CPU will
then take whatever action the application engineer has provided for in the
application program.

The readings from the precision-voltage reference are also used for on-line
temperature compensation and automatic calibration for the module. The
readings of the precision-voltage reference, obtained from the A/D converter, are
used by the microcontroller to determine software scaling- and offset-constants
for each channel. These scaling-and offset-constants are respectively multiplied
by and added to each channel reading to provide corrected channel readings.
The module therefore includes no potentiometers and needs no calibration.

Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.

Troubleshooting Guide
If a current input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage across the + and – inputs on the terminal
block. It should be in the range of 0–5 V.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables.
5. Check the software configuration to ensure that the input is configured
properly.
6. If the other channels on the module are not working either, check the
fuse on the 8 Ch Current Input (0–25 mA) module. This fuse is visible
and can be changed through the bottom of the module. If the fuse is
blown, fix the wiring problem, then replace the fuse with another fuse of
the same type and rating.
7. If the problem remains,, swap out the 8 Ch Current Input (0–25 mA)
module with another module of the same part number. If the problem
remains, replace the cable.
8. If the problem remains, replace the FTM. The FTM contains only traces
and a few discrete components, so failure is extremely unlikely. See
instructions for replacing the FTM in Chapter 15.

210 Woodward
Manual 26167V1 MicroNet TMR

8.11—Non-Standard 8 Ch Current Input (4–20 mA)

Module
8.11.1—Module Description
Each Non-Standard 8 Ch Current Input (4–20 mA) Module utilizes the same
circuitry that the 8 Ch Current Input (4–20 mA) module uses. Seven of the eight
double-ended channels of this module are fully isolated. Through the use of a
special FTM and cable, the derivative of the signal from channel 7 is generated
on the FTM and then fed to channel 8 on the analog Input module. This
derivative signal can be used for monitoring a rate of change in the channel 7
input transducer. The first seven channels may be connected to current
transducers. Channels 1 through 6 are standard 0–25 mA inputs with standard
frequency response. Channel 7 has been altered to allow for higher frequency
response. The module has a built-in precision voltage source. The readings from
the precision-voltage reference are used for on-line temperature compensation
and automatic calibration for the module.

These modules have no potentiometers and require no calibration. A module

may be replaced with another module of the same part number without any
adjustment.

Figure 8-42—Non-standard 8 Channel Current Input (4–20 mA) Module

Woodward 211
MicroNet TMR Manual 26167V1

8.11.2—Specification
Number of Channels: 8
Input Range: 0–25 mA
Accuracy: 0.5% of full scale
Temperature Coefficient: 12 ppm/degrees C
Anti-aliasing filter 2 poles at 12 ms (Channels 1-6)
Anti-aliasing filter 2 poles at 5 ms (Channels 7-8)
(Channel 8 is the derivative of channel 7.)
Module interface: VMEbus
Resolution: 16 bit converter
Isolation: 1500 Vac continuous (channel input to control
common)
CMRR: -90 db
Input Impedance: 249 Ohms
Status Indication: RED LED - channel fault or board fault

8.11.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

In a simplex system, each 8 Ch Current Input module is connected through one

analog cable to one FTM. All of the I/O are accessible on the FTM.

Power Supply Power Supply CPU Derivative

Current
#1 #2 Input

J1
P1

Low Density Analog Cable

P2
J1
Non-Standard
Analog Input FTM

Figure 8-43—Non-Standard 8 Channel Current Input (4–20 mA) Module

Configuration

212 Woodward
Manual 26167V1 MicroNet TMR
Field Wiring
See Chapter 12 for complete wiring connections for the Non-standard Analog
Input FTM. See Figure 8-44 for transducer wiring.

The first six analog inputs may be used with two-wire ungrounded (loop powered)
transducers or isolated (self-powered) transducers. The seventh channel can be
used with a self powered transducer only. Channel eight should not be
connected to any field wiring. Loop powered or self powered 4–20 mA
transducers may be connected to the current input modules via the Non-
Standard Analog Input FTM shown in Figure 8-44.

8.11.4—FTM Reference
The output from channel seven is split and fed to channel seven on the Non-
Standard Current Input (4–20 mA) Module and also fed through a derivative
circuit on the FTM to channel eight on the Non-Standard Current Input (4–20 mA)
Module. See Chapter 12 for complete field wiring information for the Non-
Standard Analog Input FTM. See Appendix A for proper Module, FTM, and cable
part numbers.

8.11.5—Troubleshooting
The input MUX (multiplexer) permits the module to read either the value of the
precision-voltage reference for this channel, or the sensed input for this channel.
The MUX receives the current input and, under the control of the microcontroller,
passes the value through the Gain amplifier to the Isolation Amplifier. The output
of the Isolation Amplifier goes to one input of the channel-selecting MUX.

Woodward 213
MicroNet TMR Manual 26167V1
MicroNet Module CABLE FTM

J2 J1 TB1
-15V +15V
19 19 1 +
15V1
.01uF Loop Powered
Gnd - Transducer
18 18 2
A1

+ 7.5V
Anti- 37 37 20
249
AI_01 aliasing Ohm
- Filter 36 36 21
-15V +15V
15V2 17 17 3
.01uF
Gnd
16 16 4
A2

+ 7.5V
35 35 22 +
Anti-
249 Self Powered
AI_02 aliasing Ohm Transducer
- Filter 34 34 23 -

-15V +15V
15V3 15 15 5 +15V
.01uF
Gnd
14 14 6 SHLD
7.5V
A3
Ch. 3
+
Anti- 33 33 24 +Input
249
AI_03 aliasing Ohm
- Filter 32 32 25 -Input
-15V +15V
15V4 13 13 7 +15V
.01uF
Gnd
12 12 8 SHLD
7.5V
A4
Ch. 4
+
Anti- 31 31 26 +Input
249
AI_04 aliasing Ohm
- Filter 30 30 27 -Input
-15V +15V
15V5 11 11 9 +15V
.01uF
Gnd
10 10 10 SHLD
7.5V
A5
Ch. 5
+
Anti- 29 29 28 +Input
249
AI_05 aliasing Ohm
- Filter 28 28 29 -Input
-15V +15V
15V6 9 9 11 +15V
.01uF
Gnd
8 8 12 SHLD
7.5V
A6
Ch. 6
+
Anti- 27 27 30 +Input
249
AI_06 aliasing Ohm
- Filter 26 26 31 -Input
-15V +15V
15V7 7 7 13 +15V
.01uF
Gnd
6 6 14 SHLD
7.5V
A7
Ch. 7
+ Special 25 25 32 +Input
Anti- 249
AI_07 aliasing Ohm
- 24 24 33 -Input
Filter
+15V In

Derivative
Circuit
-15V Out
-15V +15V
15V8 5 5 15 NC
.01uF
Gnd
4 4 16 NC
7.5V
A8
Ch. 8
+ Special 23 23 34 NC
Anti- 249
AI_08 aliasing Ohm
- 22 22 35 NC
Filter

3 3 17

2 2 18

1 1 19

21 21 36

20 20 37
Ground to DIN Rail
J1 Outer Shell 38

Figure 8-44—Analog Input Wiring for a Non-Standard 8 Ch Current Input (0–25

mA) Module

214 Woodward
Manual 26167V1 MicroNet TMR
This MUX, under control of the microprocessor, selects the channel to be read.
The analog output of this MUX is converted to a digital value by the A/D
converter, and passed to the microcontroller. The microcontroller makes any
necessary corrections to this value and stores the result in the Dual-Port RAM.
The CPU can then access the values stored in Dual-Port RAM through the VME
interface and bus. See Figure 8-41 for block diagram of module.

During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.

During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.

The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.

This module also has on-card on-line fault detection and automatic
calibration/compensation. Each input channel has its own precision voltage
reference. Once per minute, while not reading inputs, the on-board
microcontroller reads this reference. The microcontroller then uses this data read
from the voltage reference for both fault detection and automatic temperature
compensation/calibration.

Limits have been set for the expected readings when the on-board
microcontroller reads each voltage reference. If the reading obtained is outside
these limits, the system determines that the input channel, A/D converter, or the
channel's precision-voltage reference is not functioning properly. If this happens,
the micro-controller flags that channel as having a fault condition. The CPU will
then take whatever action the application engineer has provided for in the
application program.

The readings from the precision-voltage reference are also used for on-line
temperature compensation and automatic calibration for the module. The
readings of the precision-voltage reference, obtained from the A/D converter, are
used by the microcontroller to determine software scaling- and offset-constants
for each channel. These scaling-and offset-constants are respectively multiplied
by and added to each channel reading to provide corrected channel readings.
The module therefore includes no potentiometers and needs no calibration.

Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.

Woodward 215
MicroNet TMR Manual 26167V1
Troubleshooting Guide
If a current input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage across the + and – inputs on the terminal
block. It should be in the range of 0–5 V.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables.
5. Check the software configuration to ensure that the input is configured
properly.
6. If the other channels on the module are not working either, check the
fuse on the Non-Standard 8 Ch Current Input (0–25 mA) module. This
fuse is visible and can be changed through the bottom of the module. If
the fuse is blown, fix the wiring problem, then replace the fuse with
another fuse of the same type and rating.
7. If the problem remains,, swap out the Non-Standard 8 Ch Current Input
(0–25 mA) module with another module of the same part number. If the
problem remains, replace the cable.
8. If the problem remains, replace the FTM. The FTM contains only traces
and a few discrete components, so failure is extremely unlikely. See
instructions for replacing the FTM in Chapter 15.

8.12—Voltage Input Modules

There is one voltage input module available from Woodward.

8.13—8 Channel Voltage Input (0–10 Vdc) Module

8.13.1—Module Description
Each 8 Ch Voltage Input (0–10 Vdc) Module has eight channels for 0–10 Vdc
transducers. All eight channels are fully isolated double-ended voltage inputs.
The module is connected through one Low Density Analog cable to one Analog
Input FTM for field wiring connections. The module has a built-in precision
voltage source. The readings from the precision-voltage reference are used for
on-line temperature compensation and automatic calibration for the module.

These modules have no potentiometers and require no calibration. A module

may be replaced with another module of the same part number without any
adjustment.

216 Woodward
Manual 26167V1 MicroNet TMR

Figure 8-45—8 Channel Voltage Input (0–10 Vdc) Module

8.13.2—Specification
Number of Channels: 8
Input Range: 0–10 Volts
Accuracy: 0.5% of full scale
Temperature Coefficient: 12 ppm/degrees C
Anti-aliasing filter 2 poles at 12 ms (Channels 1-8)
Module interface: VMEbus
Resolution: 16 bit converter
Isolation: 1500 Vac continuous (channel input to control
common)
CMRR: -90 db
Input Impedance:  2 MΩ
Status Indication: RED LED - channel fault or board fault

8.13.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

Woodward 217
MicroNet TMR Manual 26167V1
In a simplex system, each 8 Ch Voltage Input module is connected through one
analog cable to one FTM. All of the I/O are accessible on the FTM.

Power Supply Power Supply CPU Voltage

#1 #2 Input

J1
P1

Low Density Analog Cable

P2
J1

Analog Input FTM

Figure 8-46—8 Ch Voltage Input (0–10 Vdc) Module Configuration

Field Wiring
See Chapter 12 for complete wiring connections for the Analog Input FTM. See
Figure 8-47 for transducer wiring.

8.13.4—FTM Reference
See Chapter 12 for complete field wiring information for the Voltage Input (0–10
Vdc) FTM. See Appendix A for part number Cross Reference for modules, FTMs,
and cables.

8.13.5—Troubleshooting
The input MUX (multiplexer) permits the module to read either the value of the
precision-voltage reference for this channel, or the sensed input for this channel.
The MUX receives the voltage input and, under the control of the microcontroller,
passes the value through the Gain amplifier to the Isolation Amplifier. The output
of the Isolation Amplifier goes to one input of the channel-selecting MUX.

218 Woodward
Manual 26167V1 MicroNet TMR

MicroNet Module CABLE FTM

J2 J1 TB1

19 19 1 NC
.01uF
18 18 2
+
37 37 20 +
Anti-
0-10VDC
AI_01 aliasing
Transducer
- Filter 36 36 21 -

17 17 3 NC
.01uF
16 16 4 SHLD
+
Anti- 35 35 22 +Input Ch. 2
AI_02 aliasing
- Filter 34 34 23 -Input

15 15 5 NC
.01uF
14 14 6 SHLD
+
Anti- 33 33 24 +Input Ch. 3
AI_03 aliasing
- Filter 32 32 25 -Input

13 13 7 NC
.01uF
12 12 8 SHLD
+
Anti- 31 31 26 +Input Ch. 4
AI_04 aliasing
- Filter 30 30 27 -Input

11 11 9 NC
.01uF
10 10 10 SHLD
+
Anti- 29 29 28 +Input Ch. 5
AI_05 aliasing
- Filter 28 28 29 -Input

9 9 11 NC
.01uF
8 8 12 SHLD
+
Anti- 27 27 30 +Input Ch. 6
AI_06 aliasing
- Filter 26 26 31 -Input

7 7 13 NC
.01uF
6 6 14 SHLD
+
Anti- 25 25 32 +Input Ch. 7
AI_07 aliasing
- Filter 24 24 33 -Input

5 5 15 NC
.01uF
4 4 16 SHLD
+
Anti- 23 23 34 +Input Ch. 8
AI_08 aliasing
- Filter 22 22 35 -Input

3 3 17

2 2 18

1 1 19

21 21 36

20 20 37
Ground to DIN Rail
J1 Outer Shell 38

Figure 8-47—Voltage Input Wiring for an 8 Channel Voltage Input (0–10 Vdc)
Module

Woodward 219
MicroNet TMR Manual 26167V1
This MUX, under control of the microprocessor, selects the channel to be read.
The analog output of this MUX is converted to a digital value by the A/D
converter, and passed to the microcontroller. The microcontroller makes any
necessary corrections to this value and stores the result in the Dual-Port RAM.
The CPU can then access the values stored in Dual-Port RAM through the VME
interface and bus. See Figure 8-48 for block diagram of module.

Figure 8-48—8 Ch Voltage Input (0–10 Vdc) Module Block Diagram

During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.

During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.

The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.

This module also has on-card on-line fault detection and automatic
calibration/compensation. Each input channel has its own precision voltage
reference. Once per minute, while not reading inputs, the on-board
microcontroller reads this reference. The microcontroller then uses this data read
from the voltage reference for both fault detection and automatic temperature
compensation/calibration.

220 Woodward
Manual 26167V1 MicroNet TMR
Limits have been set for the expected readings when the on-board
microcontroller reads each voltage reference. If the reading obtained is outside
these limits, the system determines that the input channel, A/D converter, or the
channel's precision-voltage reference is not functioning properly. If this happens,
the micro-controller flags that channel as having a fault condition. The CPU will
then take whatever action the application engineer has provided for in the
application program.

The readings from the precision-voltage reference are also used for on-line
temperature compensation and automatic calibration for the module. The
readings of the precision-voltage reference, obtained from the A/D converter, are
used by the microcontroller to determine software scaling- and offset-constants
for each channel. These scaling-and offset-constants are respectively multiplied
by and added to each channel reading to provide corrected channel readings.
The module therefore includes no potentiometers and needs no calibration.

Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.

Troubleshooting Guide
If a voltage input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage across the + and – inputs on the terminal
block. It should be in the range of 0–5 V.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 V, look for a loose connection on the terminal blocks,
disconnected or misconnected cables.
5. Check the software configuration to ensure that the input is configured
properly.
6. If the other channels on the module are not working either, check the
fuse on the 8 Ch Voltage Input (0–10 Vdc) module. This fuse is visible
and can be changed through the bottom of the module. If the fuse is
blown, fix the wiring problem, then replace the fuse with another fuse of
the same type and rating.
7. If the problem remains,, swap out the 8 Ch Voltage Input (0–10 Vdc)
module with another module of the same part number. If the problem
remains, replace the cable.
8. If the problem remains, replace the FTM. The FTM contains only traces
and a few discrete components, so failure is extremely unlikely. See
instructions for replacing the FTM in Chapter 15.

8.14—Current Output Modules

There are two Current Output modules.

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MicroNet TMR Manual 26167V1

8.15—8 Ch Current Output (4–20 mA) Module

8.15.1—Module Description
Each 8 Ch Current Output (4–20 mA) Module has eight channels for outputting
0–25 mA. The module is connected through one Low Density Analog cable to
one Analog Input FTM for field wiring connections.

These modules have no potentiometers and require no calibration. A module

may be replaced with another module of the same part number without any
adjustment.

Figure 8-49—8 Channel Current Output (4–20 mA) Module

222 Woodward
Manual 26167V1 MicroNet TMR

8.15.2—Specification
Number of Channels: 8
Current range: 0–25 mA
Maximum load resistance: 600 ohms max.
Analog Channel bandwidth: 500 Hz min.
Module interface: VMEbus
Output update time: 1 ms
Resolution: 12 bit
Accuracy: 0.1% of full scale @25 degrees C
Maximum Drift: 50 ppm/degrees C
Status Indication: RED LED - channel fault or board fault
Channel faults: Output current monitored
Microcontroller faults: System monitors a software watchdog
System faults: All outputs are set to zero if MFT is lost.
Operating Temp: 0 to 70 °C
Isolation: None

8.15.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

In a simplex system, each 8 Ch Current Output module is connected through one

analog cable to one FTM. All of the I/O are accessible on the FTM.

Power Supply Power Supply CPU Current

#1 #2 Output

J1
P1

Low Density Analog Cable

P2
J1

Analog Input FTM

Figure 8-50—8 Ch Current Output (4–20 mA) Module Configuration

Woodward 223
MicroNet TMR Manual 26167V1
There are 8 analog output channels of 4–20 mA with a full scale range of 0–25
mA. All Analog Outputs can drive a maximum load of 600 ohms (load + wire
resistance). See Figure 8-51 for analog output connection. Each output monitors
the output source current for fault detection. All of the analog outputs may be
individually disabled. When a channel fault or a module fault is detected, the
application program may annunciate the fault, disable the channel and stop using
data in system calculations or control. Care should be taken to prevent ground
loops and other faults when interfacing to non-isolated devices.

8.15.4—FTM Reference
See Chapter 12 for complete field wiring information for the 8 Ch Current Output
(4–20 mA) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.

8.15.5—Troubleshooting
The system writes output values to the Dual-Port RAM through the VME bus and
interface. The microcontroller scales the data using calibration constants stored
in EEPROM, and schedules outputs to occur at the proper time.

224 Woodward
Manual 26167V1 MicroNet TMR

MicroNet Module CABLE FTM

J2 J1 TB1

19 19 1 NC
+24 .01uF
V
18 18 2 SHLD

37 37 20 +Output Ch. 1
I/O Lockout AO_01
36 36 21 -Output
Analog
+
Output 17 17 3 NC
- .01uF
Feedback
16 16 4
Analog
B +
Output 35 35 22 Ch. 2
Output
AO_02 Device
34 34 23 -
24 COM
15 15 5 NC
.01uF
14 14 6 SHLD

33 33 24 +Output Ch. 3
AO_03
32 32 25 -Output

13 13 7 NC
.01uF
12 12 8 SHLD

31 31 26 +Output Ch. 4
AO_04
30 30 27 -Output

11 11 9 NC
.01uF
10 10 10 SHLD

29 29 28 +Output Ch. 5
AO_05
28 28 29 -Output

9 9 11 NC
.01uF
8 8 12 SHLD

27 27 30 +Output Ch. 6
AO_06
26 26 31 -Output

7 7 13 NC
.01uF
6 6 14 SHLD

25 25 32 +Output Ch. 7
AO_07
24 24 33 -Output

5 5 15 NC
.01uF
4 4 16 SHLD

23 23 34 +Output Ch. 8
AO_08
22 22 35 -Output

3 3 17 NC

2 2 18 NC

1 1 19 NC

21 21 36 NC

20 20 37
Ground to DIN Rail
J1 Outer Shell 38

Figure 8-51—Analog Output Wiring for an 8 Channel Current Output (4–20 mA)
Module

Woodward 225
MicroNet TMR Manual 26167V1
The microcontroller monitors the output current of each channel and alerts the
system if a fault is detected. The current-output drivers can be disabled by the
system. If a fault, which prevents the entire card from operating is detected by
either the microcontroller or the system, the FAULT LED will illuminate. See
Figure 8-52 for module block diagram.

Figure 8-52—Current Output ( 4–20 mA) Module Block Diagram

If an analog output is not functioning properly, verify the following:

1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Check the load resistance to ensure that it is not greater than 600 ohms.
3. Check to ensure that the load wiring is isolated.
4. Check the wiring for a loose connection on the terminal blocks and
disconnected or misconnected cables.
5. Disconnect the field wiring and connect a resistor across the output. If
the output is correct across the resistor, there is a problem with the field
wiring.
6. If the other output channels on the 8 Ch Current Output ( 4–20 mA)
Module are also not working, check the fuse on the 8 Ch Current Output
( 4–20 mA) Module. See instructions for module replacement in Chapter
15. This fuse is visible and can be changed through the bottom of the
module. If the fuse is blown, fix the wiring problem and replace the fuse
with a fuse of the same type and rating.
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, replace the 8 Ch Current Output ( 4–20
mA) Module.
9. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15. The FTM does not
contain any active components on the MPU inputs, so replacing it should
be the last option.

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Manual 26167V1 MicroNet TMR

8.16—8 Ch Current Output (0–1 mA) Module

8.16.1—Module Description
Each 8 Ch Current Output (0–1 mA) Module has eight channels for outputting 0–
1 mA. The module is connected through one Low Density Analog cable to one
Analog Input FTM for field wiring connections. This module utilizes the same
circuits that the 8 Ch Current Output (0-20 mA) Module uses.

These modules have no potentiometers and require no calibration. A module

may be replaced with another module of the same part number without any
adjustment.

Figure 8-53—8 Channel Current Output (0–1 mA) Module

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MicroNet TMR Manual 26167V1

8.16.2—Specification
Number of Channels: 8
Current range: 0 – 1.25 mA
Maximum load resistance: 10 k max.
Analog Channel bandwidth: 500 Hz min.
Module interface: VMEbus
Output update time: 1 ms
Resolution: 12 bit
Accuracy: 0.1% of full scale @25 °C
Maximum Drift: 50 ppm/degrees C
Status Indication: RED LED - channel fault or board fault
Channel faults: Output current monitored
Microcontroller faults: System monitors a software watchdog
System faults: All outputs are set to zero if MFT is lost.
Operating Temp: 0 to 70 °C
Isolation: None

8.16.3—Installation
See 8 Ch Current Output (4–20 mA) Module.

8.16.4—FTM Reference
See Chapter 12 for complete field wiring information for the 8 Ch Current Output
(0–1 mA) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.

8.16.5—Troubleshooting
See 8 Ch Current Output (4–20 mA) Module.

8.17—Voltage Output Modules

There are two Current Output modules.

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Manual 26167V1 MicroNet TMR

8.18—8 Ch Voltage Output (0–5 Vdc ) Module

8.18.1—Module Description
Each 8 Ch Voltage Output (0–5 Vdc) Module has eight channels for outputting 0–
5 Vdc. The module is connected through one Low Density Analog cable to one
Analog Input FTM for field wiring connections.

These modules have no potentiometers and require no calibration. A module

may be replaced with another module of the same part number without any
adjustment.

Figure 8-54—8 Channel Voltage Output (0–5 Vdc) Module

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MicroNet TMR Manual 26167V1

8.18.2—Specification
Number of Channels: 8
Current range: 0–6.25 V
Minimum load resistance: 500 ohms
Analog Channel bandwidth: 500 Hz min.
Module interface: VMEbus
Output update time: 1 ms
Resolution: 12 bit
Accuracy: 0.1% of full scale @25 °C
Maximum Drift: 50 ppm/degrees C
Status Indication: RED LED - channel fault or board fault
Channel faults: Output current monitored
Microcontroller faults: System monitors a software watchdog
System faults: All outputs are set to zero if MFT is lost.
Operating Temp: 0 to 70 °C
Isolation: None

8.18.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

In a simplex system, each 8 Ch Voltage Output module is connected through one

analog cable to one FTM. All of the I/O are accessible on the FTM.

Power Supply Power Supply CPU Voltage

#1 #2 Output

J1
P1

Low Density Analog Cable

P2
J1

Analog Input FTM

Figure 8-55—8 Ch Voltage Output (0–5 Vdc) Module Configuration

230 Woodward
Manual 26167V1 MicroNet TMR
There are 8 analog output channels of 0–5 Vdc with a full scale range of
0-6.25 Vdc. All Analog Outputs can drive a minimum load of 500 ohms (load +
wire resistance). See Figure 8-56 for analog output connection. Each output
monitors the output source voltage for fault detection. All of the analog outputs
may be individually disabled. When a channel fault or a module fault is detected,
the application program may annunciate the fault, disable the channel and stop
using data in system calculations or control. Care should be taken to prevent
ground loops and other faults when interfacing to non-isolated devices.

8.18.4—FTM Reference
See Chapter 12 for complete field wiring information for the 8 Ch Voltage Output
(0–5 Vdc) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.

8.18.5—Troubleshooting
Figure 8-57 is a block diagram of the Voltage Output Module with eight 0–5 Vdc
outputs.

The system writes output values to the Dual-Port RAM through the VME bus and
interface. The microcontroller scales the data using calibration constants stored
in EEPROM, and schedules outputs to occur at the proper time.

The microcontroller monitors the output voltage of each channel and alerts the
system if a fault is detected. If a fault, which prevents the entire card from
operating is detected by either the microcontroller or the system, the FAULT LED
will illuminate.

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MicroNet TMR Manual 26167V1

MicroNet Module CABLE FTM

J2 J1 TB1

19 19 1 NC
+24 V .01uF
18 18 2 SHLD

37 37 20 +Output Ch. 1
I/O Lockout AO_01
36 36 21 -Output
Analog 17 17 3 NC
Output B
.01uF
16 16 4

35 35 22 + Ch. 2
Analog Output
+ AO_02
Output - - Device
34 34 23
Feedback

24 COM 15 15 5 NC
.01uF
14 14 6 SHLD

33 33 24 +Output Ch. 3
AO_03
32 32 25 -Output

13 13 7 NC
.01uF
12 12 8 SHLD

31 31 26 +Output Ch. 4
AO_04
30 30 27 -Output

11 11 9 NC
.01uF
10 10 10 SHLD

29 29 28 +Output Ch. 5
AO_05
28 28 29 -Output

9 9 11 NC
.01uF
8 8 12 SHLD

27 27 30 +Output Ch. 6
AO_06
26 26 31 -Output

7 7 13 NC
.01uF
6 6 14 SHLD

25 25 32 +Output Ch. 7
AO_07
24 24 33 -Output

5 5 15 NC
.01uF
4 4 16 SHLD

23 23 34 +Output Ch. 8
AO_08
22 22 35 -Output

3 3 17 NC

2 2 18 NC

1 1 19 NC

21 21 36 NC

20 20 37
Ground to DIN Rail
J1 Outer Shell 38

Figure 8-56—Analog Output Wiring for an 8 Channel Voltage Output (0–5 Vdc)
Module

232 Woodward
Manual 26167V1 MicroNet TMR

Figure 8-57—8 Ch Voltage Output (0–5 Vdc) Module Block Diagram

If an analog output is not functioning properly, verify the following:

1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Check the load resistance to ensure that it is not less than 500 ohms.
3. Check to ensure that the load wiring is isolated.
4. Check the wiring for a loose connection on the terminal blocks and
disconnected or misconnected cables.
5. Disconnect the field wiring and check that the output is correct across the
FTM terminals. If the output is correct, there is a problem with the field
wiring.
6. If the other output channels on the 8 Ch Voltage Output (0–5 Vdc)
Module are also not working, check the fuse on the 8 Ch Voltage Output
(0–5 Vdc) Module. See instructions for module replacement in Chapter
15. This fuse is visible and can be changed through the bottom of the
module. If the fuse is blown, fix the wiring problem and replace the fuse
with a fuse of the same type and rating.
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, replace the 8 Ch Voltage Output
(0–5 Vdc) Module.
9. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15. The FTM does not
contain any active components on the MPU inputs, so replacing it should
be the last option.

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MicroNet TMR Manual 26167V1

8.19—8 Ch Voltage Output (0–10 Vdc) Module

8.19.1—Module Description
The 8 Ch Voltage Output (0–10 Vdc) Module is the same as a 8 Ch Voltage
Output (0–5 Vdc) Module with different feedback gain to scale the output for 0–
10 Vdc on each channel.

Figure 8-58—8 Channel Voltage Output (0–10 Vdc) Module

234 Woodward
Manual 26167V1 MicroNet TMR

8.19.2—Specification
Number of Channels: 8
Current range: 0 – 12.5 V
Maximum load resistance: 500 ohms min.
Analog Channel bandwidth: 500 Hz min.
Module interface: VMEbus
Output update time: 1 ms
Resolution: 12 bit
Accuracy: 0.1% of full scale @ 25 °C
Maximum Drift: 50 ppm/degrees C
Status Indication: RED LED - channel fault or board fault
Channel faults: Output current monitored
Microcontroller faults: system monitors a software watchdog
System faults: All outputs are set to zero if MFT is lost.
Operating Temp: 0 to 70 °C
Isolation: None

8.19.3—Installation
See 8 Ch Voltage Output (0–5 Vdc) Module.

8.19.4—FTM Reference
See Chapter 12 for complete field wiring information for the 8 Ch Voltage Output
(0–10 Vdc) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.

8.19.5—Troubleshooting
See 8 Ch Voltage Output (0–5 Vdc) Module.

8.20—Thermocouple Input Modules

There are two Thermocouple Input modules.

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MicroNet TMR Manual 26167V1

8.21—8 Ch TC (Fail Low) Module

8.21.1—Module Description
There are eight fully isolated thermocouple channels on this module. Each
channel receives a signal from a thermocouple. These signals can be from an E,
J, K, R, S, or T type thermocouple. The same module can read all types of
thermocouples. The GAP application configuration determines the type of
thermocouple each channel reads. If an open thermocouple wire is detected by
the module, the output of the channel will ramp down to its minimum value. There
is a 9th Channel used to measure the reference junction temperature of the
junction between the thermocouple and the copper traces on the FTM. This
measurement is used to calculate the thermocouple measurement temperature
through the GAP application. This cold junction measurement is located on the
FTM and utilizes an AD590 temperature sensor. If the actual cold junction in the
field wiring occurs elsewhere, the temperature of that junction must be brought
into the control as a thermocouple, RTD, or 4–20 mA input, and the application
software must be configured to use the appropriate cold junction temperature.
The thermocouple and cold junction input units (C or F) should be consistent in
the application software.

The board performs on-line temperature compensation and hardware

diagnostics. These modules have no potentiometers and require no calibration. A
module may be replaced with another module of the same part number without
any adjustment.

Figure 8-59—8 Channel TC (Fail Low) Module

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Manual 26167V1 MicroNet TMR

8.21.2—Specification
Number Channels: 8 double ended, fully isolated, thermocouple
input channels
1 cold junction channel.

(Type E, J, K, R, S, and T thermocouples must conform to the common

commercial specification published in the Annual Book of ASTM Standards with
voltage predictions in line with N.I.S.T. Monograph 175 or ITS-90.)

Thermocouple Types and ranges:

T/C TYPE LOW END C (F) HIGH END C (F)

J -40C (-40F) 1050C (1922F)
K -40C (-40F) 1600C (29125F)
E -40C (-40F) 800C (1472F)
R -40C (-40F) 1750C (3182F)
S -40C (-40F) 1750C (3182F)
T -40C (-40F) 1050C (1922F)
CJ -40C (-40F) 150C (302F)

Module interface: VMEbus

Open thermocouple detection: Fail Low
Output: Linearized temperatures in °C
Resolution: 16 bit converter
Accuracy: 0.5% of full scale over the entire temperature
range
Temperature Coefficient: 12 ppm/degree C
Isolation: 1500 Vac continuous (channel input to control
common)
Input Impedance: 2 MΩ
CMRR: -90 db
Status Indication: RED LED - channel fault or board fault
Cold Junction Comp: AD590L IC sensor 1% accuracy (Located on
FTM)

8.21.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

In a simplex system, each 8 Ch TC (Fail Low) module is connected through one

low Density analog cable to one TC Input FTM. All of the I/O are accessible on
the FTM.

Woodward 237
MicroNet TMR Manual 26167V1

Power Supply Power Supply CPU TC

#1 #2 Input

J1
P1

Low Density Analog Cable

P2
J1

TC Input FTM

Figure 8-60—8 Ch TC (Fail Low) Module Configuration

See Figure 8-61 for Thermocouple field wiring connections.

8.21.4—FTM Reference
See Chapter 12 for TC Input FTM information. See Appendix A for proper
Module, FTM, and cable part numbers.

238 Woodward
Manual 26167V1 MicroNet TMR

MicroNet Module CABLE FTM

J2 J1 TB1

19 19 1 NC
.01uF
18 18 2
+
37 37 20 +
Anti-
TC_01 aliasing
- Filter 36 36 21 -

17 17 3 NC
.01uF
16 16 4 SHLD
+
Anti- 35 35 22 +Input Ch. 2
TC_02 aliasing
- Filter 34 34 23 -Input

15 15 5 NC
.01uF
14 14 6 SHLD
+
Anti- 33 33 24 +Input Ch. 3
TC_03 aliasing
- Filter 32 32 25 -Input

13 13 7 NC
.01uF
12 12 8 SHLD
+
Anti- 31 31 26 +Input Ch. 4
TC_04 aliasing
- Filter 30 30 27 -Input

11 11 9 NC
.01uF
10 10 10 SHLD
+
Anti- 29 29 28 +Input Ch. 5
TC_05 aliasing
- Filter 28 28 29 -Input

9 9 11 NC
.01uF
8 8 12 SHLD
+
Anti- 27 27 30 +Input Ch. 6
TC_06 aliasing
- Filter 26 26 31 -Input

7 7 13 NC
.01uF
6 6 14 SHLD
+
Anti- 25 25 32 +Input Ch. 7
TC_07 aliasing
- Filter 24 24 33 -Input

5 5 15 NC
.01uF
4 4 16 SHLD
+
Anti- 23 23 34 +Input Ch. 8
TC_08 aliasing
- Filter 22 22 35 -Input

+15V 3 3 17 NC
Cold
CJ_09 2 2 AD590 18 NC
Junction
GND 1 1 19 NC

21 21 36 NC

20 20 37
Ground to DIN Rail
J1 Outer Shell 38

Figure 8-61—8 Ch TC Input (Fail Low) Module Field Wiring

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MicroNet TMR Manual 26167V1

8.21.5—Troubleshooting
The board performs on-line temperature compensation and hardware
diagnostics. To do this, once per minute, it reads two known voltages for each
channel. These values are checked against certain limits to determine if a
hardware fault has occurred. These values are also used to determine software
scaling constants used for temperature compensation. The MUX receives the
thermocouple input and, under the control of the microcontroller, passes the
value through the gain amplifier to the isolation amplifier. The output of the
isolation amplifier goes to one input of the channel-selecting MUX.

This MUX, under control of the microprocessor, selects the channel to be read.
The analog output of this MUX is converted to a digital value by the A/D
converter, and passed to the microcontroller. The microcontroller uses a lookup
table to linearize the thermocouple readings and stores the result in the Dual-Port
RAM. The CPU can then access the values stored in Dual-Port RAM through the
VME interface and bus. Upon detection of an open wire on the input, the channel
will indicate a minimum scale reading. See Figure 8-62 for module block
diagram.

Figure 8-62—Thermocouple Input Block Diagram

During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.

During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.

240 Woodward
Manual 26167V1 MicroNet TMR
The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.

This module also has on-card on-line fault detection and automatic
calibration/compensation. Each input channel has its own precision voltage
reference. Once per minute, while not reading inputs, the on-board
microcontroller reads this reference. The microcontroller then uses this data read
from the voltage reference for both fault detection and automatic temperature
compensation/calibration.

Limits have been set for the expected readings when the on-board
microcontroller reads each voltage reference. If the reading obtained is outside
these limits, the system determines that the input channel, A/D converter, or the
channel's precision-voltage reference is not functioning properly. If this happens,
the micro-controller flags that channel as having a fault condition. The CPU will
then take whatever action the application engineer has provided for in the
application program.

The readings from the precision-voltage reference are also used for on-line
temperature compensation and automatic calibration for the module. The
readings of the precision-voltage reference, obtained from the A/D converter, are
used by the microcontroller to determine software scaling- and offset-constants
for each channel. These scaling-and offset-constants are respectively multiplied
by and added to each channel reading to provide corrected channel readings.
The module therefore includes no potentiometers and needs no calibration.

Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.

Troubleshooting Guide
If an Thermocouple input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage on the terminal block. It should be in the range
of appropriate millivolt signal.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
Thermocouple inputs are extremely sensitive to signal fluctuations.
4. If the input is reading minimum range, look for a loose connection at the
terminal blocks and disconnected or misconnected cables.
5. If all the temperature measurements are offset by a fixed amount , check
for proper cold junction location. Replace the FTM.
6. Check the software configuration to ensure that the input is configured
properly. Ensure that the proper thermocouple type is selected.
7. After verifying all of the above, replace the 8 Ch TC module.

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MicroNet TMR Manual 26167V1

8.22—8 Ch TC (Fail High) Module

8.22.1—Module Description
There are two types of the Thermocouple (Fail High) modules. The standard
module is the same as the 8 Ch TC (Fail Low) Module except when a failure is
detected, the signal will indicate a full scale value. The Non-standard 8 Ch TC
(Fail High) module has replaced the type “E” table with an type “N” table and also
fails high when a failure is detected.

Figure 8-63—8 Channel TC (Fail High) Module

8.22.2—Specification
Number Channels: 8 double ended, fully isolated, thermocouple
input channels
1 cold junction channel.

(Type E, J, K, N, R, S, and T thermocouples must conform to the common

commercial specification published in the Annual Book of ASTM Standards with
voltage predictions in line with N.I.S.T. Monograph 175 or ITS-90.)

242 Woodward
Manual 26167V1 MicroNet TMR
Thermocouple Types and ranges:

T/C TYPE LOW END °C (°F) HIGH END °C (°F)

J -40C (-40F) 1050C (1922F)
K -40C (-40F) 1600C (29125F)
E -40C (-40F) 800C (1472F)
R -40C (-40F) 1750C (3182F)
S -40C (-40F) 1750C (3182F)
T -40C (-40F) 1050C (1922F)
N -40C (-40F) 1051C (1925F)
CJ -40C (-40F) 150C (302F)

Module interface: VMEbus

Open thermocouple detection: Fail Low
Output: Linearized temperatures in °C
Resolution: 16 bit converter
Accuracy: 0.5% of full scale over the entire temperature
range
Temperature Coefficient: 12 ppm/degree C
Isolation: 1500 Vac continuous (channel input to control
common)
Input Impedance: 2 MΩ
CMRR: -90 db
Status Indication: RED LED - channel fault or board fault
Cold Junction Comp: AD590L IC sensor 1% accuracy

8.22.3—Installation
See 8 Ch TC (Fail Low) Module.

8.22.4—FTM Reference
See Chapter 12 for complete field wiring information for the 8 Ch TC (Fail High)
FTM. See Appendix A for part number Cross Reference for modules, FTMs, and
cables.

8.22.5—Troubleshooting
See 8 Ch TC (Fail Low) Module.

8.23—RTD Input Modules

There are four RTD (Resistance Temperature Device) Input modules.

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MicroNet TMR Manual 26167V1

8.24—8 Ch RTD Input (10 ohm)

8.24.1—Module Description
The eight channels of this module are semi-isolated. The channels are isolated
from the control common but not from each other. Each channel receives a
signal from an RTD. This signal must be from a 10 Copper RTD with the
following temperature to Resistance relationship:

T=(R*25.95)-(234.5)

Where R= resistance of copper RTD (Ohms)

T= C

The board performs on-line temperature compensation and hardware

diagnostics. These modules have no potentiometers and require no calibration. A
module may be replaced with another module of the same part number without
any adjustment.

Figure 8-64—8 Channel RTD Input Module (10 ohm)

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Manual 26167V1 MicroNet TMR

8.24.2—Specification
Number of Channels: 8 semi-isolated, RTD channels
Input Type: 3 wire
(Must conform to 10 ohm copper RTD temperature/resistance relationship (Alpha
= .00427))

Temperature range: 40 to +300 °C

Module interface: VMEbus
Output: Linearized temperatures in °C
Resolution: 14 bit converter
Accuracy: 0.5% of full scale over the entire temperature
range
Temperature Coefficient: 12 ppm/degrees C
Isolation: 1500 Vac continuous (input channels to control
common, not channel to channel)
Input Impedance: 2.2 MΩ
CMRR: -90 db
Status Indication: RED LED - channel fault or board fault
Excitation: 4 mA

8.24.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

In a simplex system, each 8 Ch RDT Input Module is connected through one low
Density analog cable to one Analog Input FTM. All of the I/O are accessible on
the FTM.

Power Supply Power Supply CPU RTD

#1 #2 Input

J1
P1

Low Density Analog Cable

P2
J1

Analog Input FTM

Figure 8-65—8 Ch RTD Module Configuration

See Figure 8-66 for RTD field wiring connections.

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MicroNet TMR Manual 26167V1

8.24.4—FTM Reference
See Chapter 12 for complete field wiring information for the 8 Ch RTD Input (10
ohm) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.

8.24.5—Troubleshooting
The board performs on-line temperature compensation and hardware
diagnostics. To do this, once per minute, it reads two known voltages for each
channel. These values are checked against certain limits to determine if a
hardware fault has occurred. These values are also used to determine software
scaling constants used for temperature compensation. The MUX receives the
RTD input and, under the control of the microcontroller, passes the value through
the gain amplifier to the isolation Amplifier. The gain amplifier introduces the
proper gain for the type of RTD used. The output of the isolation amplifier goes to
one input of the channel-selecting MUX.

246 Woodward
Manual 26167V1 MicroNet TMR

MicroNet Module CABLE FTM

J2 J1 TB1

19 19 1
.01uF
18 18 2
+ +
Current
Source
37 37 20
RTD_01 RTD
- 36 36 21 -

17 17 3 Sense
.01uF
16 16 4 Shld
Ch. 2
+ Current
Source
35 35 22 +Input
RTD_02
- 34 34 23 -Input

15 15 5 Sense
.01uF
14 14 6 Shld
Ch. 3
+ Current
Source
33 33 24 +Input
RTD_03
- 32 32 25 -Input

13 13 7 Sense
.01uF
12 12 8 Shld
Ch. 4
+ Current
Source
31 31 26 +Input
RTD_04
- 30 30 27 -Input

11 11 9 Sense
.01uF
10 10 10 Shld
Ch. 5
+ Current
Source
29 29 28 +Input
RTD_05
- 28 28 29 -Input

9 9 11 Sense
.01uF
8 8 12 Shld
Ch. 6
+ Current
Source
27 27 30 +Input
RTD_06
- 26 26 31 -Input

7 7 13 Sense
.01uF
6 6 14 Shld
Ch. 7
+ Current
Source
25 25 32 +Input
RTD_07 - 24 24 33 -Input

5 5 15 Sense
.01uF
4 4 16 Shld
Ch. 8
+ Current
Source
23 23 34 +Input
RTD_08
- 22 22 35 -Input

3 3 17 NC

2 2 18 NC

1 1 19 NC

21 21 36 NC

20 20 37
Ground to DIN Rail
J1 Outer Shell 38

Figure 8-66—8 Ch RTD Input Module Field Wiring

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MicroNet TMR Manual 26167V1
This MUX, under control of the microprocessor, selects the channel to be read.
The analog output of this MUX is converted to a digital value by the A/D
converter, and passed to the microcontroller. The microcontroller uses a lookup
table to linearize the RTD reading and stores the result in the Dual-Port RAM.
The CPU can then access the values stored in Dual-Port RAM through the VME
interface and bus. See Figure 8-67 for module block diagram.

Figure 8-67—RTD Input Block Diagram

During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.

During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.

The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.

This module also has on-card on-line fault detection and automatic
calibration/compensation. Each input channel has its own precision voltage
reference. Once per minute, while not reading inputs, the on-board
microcontroller reads this reference. The microcontroller then uses this data read
from the voltage reference for both fault detection and automatic temperature
compensation/calibration.

248 Woodward
Manual 26167V1 MicroNet TMR
Limits have been set for the expected readings when the on-board
microcontroller reads each voltage reference. If the reading obtained is outside
these limits, the system determines that the input channel, A/D converter, or the
channel's precision-voltage reference is not functioning properly. If this happens,
the micro-controller flags that channel as having a fault condition. The CPU will
then take whatever action the application engineer has provided for in the
application program.

The readings from the precision-voltage reference are also used for on-line
temperature compensation and automatic calibration for the module. The
readings of the precision-voltage reference, obtained from the A/D converter, are
used by the microcontroller to determine software scaling- and offset-constants
for each channel. These scaling-and offset-constants are respectively multiplied
by and added to each channel reading to provide corrected channel readings.
The module therefore includes no potentiometers and needs no calibration.

Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.

Troubleshooting Guide
If an RTD input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage on the terminal block (Sense to – input). It
should be in the range generated by a 4 mA current source across the
RTD.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check for proper connection of the sense line.
5. Check the software configuration to ensure that the input is configured
properly. Ensure that the proper RTD is selected.
6. If replacing the module does not fix the problem, replace the FTM. See
the instructions in Chapter 15 for replacing the FTM. The FTM contains
only traces and a few discrete components, so failure is extremely
unlikely.

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8.25—8 Ch RTD Input (100 ohm)

8.25.1—Module Description
The eight channels of this module are semi-isolated. The channels are isolated
from the control common but not from each other. Each channel receives a
signal from an RTD. This signal must be from a 100 Platinum RTD (European
or American curve). There are two types of 100 ohm modules. The standard
module has the same temperature ranges for the American and European curves
(–40 to +450 °C). The high temperature module has a temperature range of –40
to +450 °C for the American curve and –40 to +645 °C for the European curve.

Figure 8-68—8 Channel RTD Input Module (100 ohm)

8.25.2—Specification
Number of Channels: 8 semi-isolated, RTD channels
Input Type: 3 wire

(Must conform to (Deutsche Institut for Normung) DIN standard for 100 ohm
European curve (Alpha = .00385) or American curve 100 ohm curve (Alpha =
.00392))

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Temperature ranges
Standard module: –40 to +450 °C (100 ohm platinum, American,
European)
High Temp Module: –40 to +645 °C (100 ohm platinum, European)
–40 to +450 °C (100 ohm platinum, American)
Excitation: 2 mA
Module interface: VMEbus
Output: Linearized temperatures in °C
Resolution: 14 bit converter
Accuracy: 0.5% of full scale over the entire temperature
range
Temperature Coefficient: 12 ppm/degree C
Isolation: 1500 Vac continuous (input channels to
control common, not channel to channel)
Input Impedance: 2.2 MΩ
CMRR: -90 db
Status Indication: RED LED - channel fault or board fault

8.25.3—Installation
See 8 Ch RTD Input (10 ohm) Module.

8.25.4—FTM Reference
See Chapter 12 for complete field wiring information for the 8 Ch RTD Input (100
ohm) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.

8.25.5—Troubleshooting
See 8 Ch RTD Input (10 ohm) Module.

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8.26—8 Ch RTD Input (200 ohm)

8.26.1—Module Description
The eight channels of this module are semi-isolated. The channels are isolated
from the control common but not from each other. Each channel receives a
signal from an RTD. This signal must be from a 200 Platinum RTD (European
or American curve).

Figure 8-69—8 Channel RTD Input Module (200 ohm)

8.26.2—Specification
Number of Channels: 8 semi-isolated, RTD channels
Input Type: 3 wire

(Must conform to (Deutsche Institut for Normung) DIN standard for 200 ohm
European curve (Alpha = .00385) or American curve 200 ohm curve (Alpha =
.00392))

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Manual 26167V1 MicroNet TMR
Temperature ranges –40 to +450 °C (200 ohm platinum, American,
European)
Excitation: 1 mA
Module interface: VMEbus
Output: Linearized temperatures in °C
Resolution: 14 bit converter
Accuracy: 0.5% of full scale over the entire temperature
range
Temperature Coefficient: 12 ppm/degree C
Isolation: 1500 Vac continuous(input channels to control
common, not channel to channel)
Input Impedance: 2.2 MΩ
CMRR: -90 db
Status Indication: RED LED - channel fault or board fault

8.26.3—Installation
See 8 Ch RTD Input (10 ohm) Module.

8.26.4—FTM Reference
See Chapter 12 for complete field wiring information for the 8 Ch RTD Input (200
ohm) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.

8.26.5—Troubleshooting
See 8 Ch RTD Input (10 ohm) Module.

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MicroNet TMR Manual 26167V1

8.27—8 Ch RTD Input (500 ohm)

8.27.1—Module Description
The eight channels of this module are semi-isolated. The channels are isolated
from the control common but not from each other. Each channel receives a
signal from an RTD. This signal must be from a 500 Platinum RTD (European
or American curve).

Figure 8-70—8 Channel RTD Input Module (500 ohm)

8.27.2—Specification
Number of Channels: 8 semi-isolated, RTD channels
Input Type: 3 wire

(Must conform to (Deutsche Institut for Normung) DIN standard for 500 ohm
European curve (Alpha = .00385) or American curve 500 ohm curve (Alpha =
.00392))

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Temperature ranges –40 to +450 °C (500 ohm platinum, American,
European)
Excitation: 400 μA
Module interface: VMEbus
Output: Linearized temperatures in °C
Resolution: 14 bit converter
Accuracy: 0.5% of full scale over the `entire temperature
range
Temperature Coefficient: 12 ppm/degree C
Isolation: 1500 Vac continuous(input channels to control
common, not channel to channel)
Input Impedance: 2.2 MΩ
CMRR: -90 db
Status Indication: RED LED - channel fault or board fault

8.27.3—Installation
See 8 Ch RTD Input (10 ohm) Module.

8.27.4—FTM Reference
See Chapter 12 for complete field wiring information for the 8 Ch RTD Input (500
ohm) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.

8.27.5—Troubleshooting
See 8 Ch RTD Input (10 ohm) Module.

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MicroNet TMR Manual 26167V1

8.28—4 Ch MPU/Proximity Module

There are many configurations of the MPU/Proximity Module. See Appendix A for
the various part numbers.

8.28.1—Module Description
This module has four speed inputs that can be configured as either transformer
isolated MPU inputs or non-isolated proximity inputs. The configuration of MPU
and proximity inputs is dependent on the part number.

These modules have no potentiometers and require no calibration. A module

may be replaced with another module of the same part number without any
adjustment.

Figure 8-71—4 Channel MPU/Proximity Module

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8.28.2—Specification
Number Channels: 4
Input Type: MPU/Proximity Detector (factory selected by
part number)
Input Frequency Range: MPU: 50 Hz to 25 KHz
Prox: 0.04 Hz to 2 KHz
Input Amplitude: MPU: 1 Vrms min, 25 Vrms max, Freq > 20 Hz
Prox: 10 mA
Input Impedance: MPU: 2000 Ω
Prox: 2000 Ω
Isolation Voltage: MPU: 500 Vrms
Prox: None
Resolution: 16 bits
0.0015% of range per LSB
Speed Accuracy (max): 0.01% over temperature range
Temperature drift: 1 ppm/C
Derivative Accuracy (max): 0.10% of range (p-p)
Speed Filter: 5-10,000 ms (2 real poles)
Derivative Filter: 5-10,000 ms (1 pole + speed filter)
Acceleration Limit: 1-10,000 percent/second
Operating Temperature : –15 to +55 °C

8.28.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.

In a simplex system, each 4 Ch Speed Module is connected through one low

Density analog cable to one Analog Input FTM. All of the I/O are accessible on
the FTM.

Power Supply Power Supply CPU MPU/

#1 #2 Prox

J1
P1

Low Density Analog Cable

P2
J1

Analog Input FTM

Figure 8-72—4 Ch MPU/Proximity Module

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Any of the module’s four speed channels accept passive magnetic pickup units
(MPUs) or proximity probes. The number of MPU and proximity inputs per
module is determined by the position of jumpers internal to the module. These
jumpers are factor set. The part number of the module will determine the ratio of
MPU to Proximity inputs. Each speed input channel can only accept one MPU or
one proximity probe. See Appendix A for desired part number of modules.

A proximity probe may be used to sense very low speeds. With a proximity
probe, speed can be sensed down to 0.5 Hz. When interfacing to open collector
type proximity probes, a pull-up resistor is required between the supplied
proximity probe voltage and the proximity probe input to the FTM. See Figure
7-62 for MPU and proximity probe wiring examples.

It is not recommended that gears mounted on an auxiliary shaft

coupled to the rotor be used to sense speed. Auxiliary shafts tend to
turn more slowly than the rotor (reducing speed sensing resolution)
and have coupling gear backlash, resulting in less than optimum
speed control. For safety purposes, it is also not recommended that
the speed sensing device sense speed from a gear coupled to a
mechanical drive side of a system’s rotor coupling.

8.28.4—FTM Reference
See Chapter 12 for complete field wiring information for the 4 Ch MPU/Proximity
FTM. See Appendix A for part number Cross Reference for modules, FTMs, and
cables.

8.28.5—Troubleshooting
Speed ranges are selected from the GAP and the signal is pre-scaled
accordingly. The pre-scaled signal then goes to a counter where the period of the
signal is measured. The Digital Signal Processor samples the counter's values
every 100 microseconds and performs a divide to generate a digital speed signal.

Every 100 microseconds a digital-filter algorithm is executed to average the

speed values in order to improve speed-sensor resolution at input frequencies
greater than 200 Hz. This digital filter also provides a derivative output.

Once every rate time (5-200 ms typically), the latest speed and derivative
information is moved to the Dual-Port RAM for access by the CPU module.

During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.

During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.

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Manual 26167V1 MicroNet TMR
MicroNet Module CABLE FTM
+24VDC
+5VDC
J2 J1 TB1

19 19 1 NC
.01uF
MPU_01 18 18 2
JPR 3
+
37 37 20
JPR 1
MPU #1
36 36 21 -

17 17 3 +24V
.01uF
16 16 4 Shld
MPU/PROX_02 Ch. 2
35 35 22 +Input

34 34 23 -Input

15 15 5 +24V
.01uF
14 14 6 Shld
MPU/PROX_03 Ch. 3
+24VDC 33 33 24 +Input
+5VDC
32 32 25 -Input

13 13 7 +24VDC
.01uF
JPR 23
PROX_04 12 12 8
+
31 31 26
PROX #4
30 30 27 -
JPR 21

11 11 9 NC
.01uF
10 10 10 NC

29 29 28 NC

28 28 29 NC

9 9 11 NC
.01uF
8 8 12 NC

27 27 30 NC

26 26 31 NC

7 7 13 NC
.01uF
6 6 14 NC

25 25 32 NC

24 24 33 NC

5 5 15 NC
.01uF
4 4 16 NC

23 23 34 NC

22 22 35 NC

3 3 17 NC

2 2 18 NC

1 1 19 NC

21 21 36 NC

20 20 37
Ground to DIN Rail
J1 Outer Shell 38

Figure 8-73—MPU and Proximity Probe Interface Wiring

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Figure 8-74—Digital Speed Sensor Module Block Diagram

The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.

Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.

Troubleshooting Guide
MPUs. If a magnetic pickup input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage on the terminal block. It should be in the range
of 1-25 VRMS.
3. Verify that the signal waveform is clean and void of double zero
crossings.
4. Verify that no ground connection exists and that the resulting 60 Hz
signal is absent.
5. Measure the frequency. It should be in the range of 50 Hz - 25 kHz.
6. Check the wiring. Look for a loose connection at the terminal blocks and
disconnected or misconnected cables.
7. Check the software configuration to ensure that the input is configured
properly.
8. If the readings are incorrect on several channels of the module, replace
the Speed module.
9. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15. The FTM does not
contain any active components on the MPU inputs, so replacing it should
be the last option.

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Proximity Probes
If a proximity probe input is not functioning properly, verify the following:

1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 14.
2. Measure the input voltage on the terminal block. It should be in the range
of 3.5 - 24 Vpeak.
3. Verify that the signal waveform is clean and void of double zero
crossings.
4. Verify that no ground connection exists and that the resulting 60 Hz
signal is absent.
5. Measure the frequency. It should be in the range of 0.5 Hz to 25 kHz.
6. Check the wiring. Look for a loose connection at the terminal blocks,
disconnected or misconnected cables.
7. Check the software configuration to ensure that the input is configured
properly.
8. If the readings are incorrect on several channels of the Speed module,
replace the Speed module.
9. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15.

Chapters 9–15 and the appendixes are contained in volume 2.

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