TWN4

MultiTech Nano

DocRev10, March 5, 2021

ELATEC GmbH
Contents

Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Versions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Color Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Connector and Pin-Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Assembly Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1.1 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1.2 Through-Hole Technology (THT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.3 Surface Mount Technology (SMT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.3.1 Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.3.2 Stencil for Soldering Paste . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1.3.3 Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1.3.4 Temperature Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1.3.5 Baking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4 Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 LF-Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.2 HF-Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Power states and current consumption breakdown . . . . . . . . . . . . . . . . . . . . . . . . . 16
7 Label on TWN4 Nano Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8 Additional Hardware Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.1 Programming Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.2 Using PI Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.2.1 SIO Chip soldered on PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.2.2 SAM Card Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.3 Bluetooth BLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.3.1 Connecting BLE Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.3.2 Initial Programming of BLE Module . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.3.3 Connection to the BGM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.3.3.1 Debug Connector of Development Kit . . . . . . . . . . . . . . . . . . . . 22
8.3.3.2 Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
9.1 Carrier Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
9.1.1 Dimensions of Tape Leader & Trailer . . . . . . . . . . . . . . . . . . . . . . . . . . 27
9.2 Tray . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
9.3 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
9.4 Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
9.5 Position of Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
10 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

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1 Introduction

1 Introduction

Here is a picture of the TWN4 MultiTech Nano:

Currently, there are two models of TWN4 Nano Module available:

• TWN4 MultiTech Nano
• TWN4 MultiTech Nano LEGIC 42
The TWN4 Nano Module contains voltage regulator, control unit, RFID front ends and communication
interfaces.

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2 Versions

2 Versions

As mentioned above, there are two models with different HF frontends (MIFARE and LEGIC) of the TWN4
Nano Module. In case of MIFARE it is available in three different versions, which support either both LF
(125kHz / 134.2kHz) and HF (13.56MHz), LF only or HF only. In case of LEGIC there is only the full version
with both LF (125kHz / 134.2kHz) and HF (13.56MHz). The following table lists all possible options.

Feature TWN4 MultiTech TWN4 MultiTech TWN4 MultiTech TWN4 MultiTech

Nano Module Nano Module HF Nano Module LF Nano Legic 42
√ √ √
LF -
√ √ √
HF -

Table 2.1: Different features of TWN4 MultiTech Nano Module Versions

2.1 Color Marking

The different versions of the TWN4 Nano Module are marked with a color dot on the label.

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3 Connector and Pin-Out

3 Connector and Pin-Out

The TWN4 Nano Module has two rows of pins (24 pins each), which can be used either for THT or SMT
mounting on the carrier board. The contact pitch is 1.27mm (50mil).

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3 Connector and Pin-Out

Pin Pin Name Function

1 HF_ANT1 TWN4 MultiTech Nano:
Together with pin HF_ANT2, this pin is doing load modulation on antenna
13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Not connected
2 HF_RXP TWN4 MultiTech Nano:
Together with pin HF_RXN, this pin builds the input from the direct
matched antenna 13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Not connected
3 HF_TX1 TWN4 MultiTech Nano:
Together with pin HF_TX2, this pin builds the output to the direct matched
antenna 13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Output for antenna (50 Ohm)
4 HF_GND Antenna Ground (connected to GND)
5 HF_TX2 TWN4 MultiTech Nano:
Together with pin HF_TX1, this pin builds the output to the direct matched
antenna 13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Not connected
6 HF_RXN TWN4 MultiTech Nano:
Together with pin HF_RXP, this pin builds the input from the direct matched
antenna 13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Not connected
7 HF_ANT2 TWN4 MultiTech Nano:
Together with pin HF_ANT1, this pin is doing load modulation on antenna
13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Not connected
8 LF_ANT1 Output 1 for connecting external 125 kHz / 134.2 kHz antennas
9 LF_ANT2 Output 2 for connecting external 125 kHz / 134.2 kHz antennas
continued on next page. . .

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3 Connector and Pin-Out

10 GPIO0 GPIO0, I/O pin for general purposes.

11 GPIO1 GPIO1, I/O pin for general purposes.
12 GPIO2 GPIO2, I/O pin for general purposes.
13 GPIO3 GPIO3, I/O pin for general purposes.
14 GPIO4 GPIO4, I/O pin for general purposes.
15 GPIO5 GPIO5, I/O pin for general purposes.
16 GPIO6 GPIO6, I/O pin for general purposes.
17 GPIO7 GPIO7, I/O pin for general purposes.
18 SAM1_CLK Clock output for SAM1
19 SAM1_IO I/O line for SAM1
20 SAM1_RST Reset output for SAM1
21 GND Ground
22 SAM2_CLK Clock output for SAM2
23 SAM2_IO I/O line for SAM2
24 SAM2_RST Reset output for SAM2
25 BOOT Shortcut against ground during reset will guide firmware di-
rectly into boot loader
26 SPK+ Digitally modulated output for a speaker. Second connection
for the speaker is ground. The impedance of the speaker
should be greater than 24 ohm.
27 COM2_TX- Low active output (logic level, push/pull) of asynchronous TXD
from COM2.
28 COM2_RX- Low active input (logic level) with internal pull-up resistor of
asynchronous RXD to COM2.
29 SPI_SS- Pin SS- of SPI interface
30 SPI_MISO Pin MISO of SPI interface
31 SPI_MOSI Pin MOSI of SPI interface
32 SPI_SCK Pin SCK of SPI interface
33 GND Ground
34 CAN_TX TTL TX pin of CAN interface. A external interface circuit is
required.
35 CAN_RX TTL RX pin of CAN interface. A external interface circuit is
required.
continued on next page. . .

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3 Connector and Pin-Out

36 I2C_SCL Clock pin of I2C interface. No internal pull up.

37 I2C_SDA Data pin of I2C interface. No internal pull up.
38 PWRDWN- Low active TTL input with internal pull-up resistor for turning off
the voltage regulator.
39 RESET- Low active TTL input with internal pull-up resistor for hard re-
set.
40 VCC 3.3V power supply input.
41 VREG 3.3V output from on-board voltage regulator
42 HOSTSEL Host channel selector: Low = COM1, high = USB. This pin is
internally pulled high.
43 USB_DM USB Data -
44 USB_DP USB Data +
45 COM1_TX- Low active output (logic level, push/pull) of asynchronous TXD
from COM1.
46 COM1_RX- Low active input (logic level) with internal pull-up resistor of
asynchronous RXD to COM1.
47 VIN Unregulated input to on-board voltage regulator.
48 GND Ground

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3 Connector and Pin-Out

3.1 Assembly Information

3.1.1 Dimensions

The dimensions of TWN4 Nano Module are as follows (All dimensions in mm unless otherwise stated.)

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3 Connector and Pin-Out

3.1.2 Through-Hole Technology (THT)

Suggested connector for THT assembly is Samtec TMS-124-02-G-S.

In case a detachable connection is required, mating part (to be mounted on carrier board) is Samtec
SLM-124-01-G-S.

3.1.3 Surface Mount Technology (SMT)

3.1.3.1 Footprint

1.60
1.05

PIN 1 MARKING
1.27

17.78
19.55

Dimensions in mm

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3 Connector and Pin-Out

3.1.3.2 Stencil for Soldering Paste

To ensure good soldering quality, the following stencil opening is recommended. The stencil in the area of
the Nano Module should have a thickness of 0.15 mm.

Please note: As the stencil opening is wider than the SMT pads, do not place other SMT parts in that
area to prevent short circuits.

2.56
1.05

PIN 1 MARKING

17.78
21.16

Dimensions in mm

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3 Connector and Pin-Out

3.1.3.3 Placement

Please take special care about correct placement of TWN4 MultiTech Nano on the soldering pads. Wrong
placement might cause holes for THT assembly to absorb tin from the SMT pads. Please follow these
rules:

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3 Connector and Pin-Out

3.1.3.4 Temperature Profile

For reflow soldering, following temperature profile is recommended:

240°C TP 245°C
217°C tP
200°C
tL

150°C
tS

25°C

Ramp-up rate 1-3 K/s

Preheat time (ts ) 60-180 seconds
Time within liquidus temperature (tL ) 60-150 seconds
Peak temperature (TP ) 245 +0/-5 °C
Time within peak (tP ) 10-30 seconds

3.1.3.5 Baking

The TWN4 MultiTech Nano has a moisture sensitivity level (MSL) of 3. This means, that the modules must
be baked prior to reflow soldering, if the modules are removed from their sealed dry-bags and not soldered
within their out-of-bag time, which is 168 hours.

In this case it is recommended to bake the TWN4 MultiTech Nano for 10 days at 85°C

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4 Antenna

4 Antenna

4.1 LF-Antenna

The nominal inductance for an external 125 kHz/134.2 kHz antenna is 490 µH. The series resistance of the
antenna should be lower than 10 ohms.

4.2 HF-Antenna

Please see separate document TWN4 Nano Antenna Match Calc Guide DocRev1.pdf and AntennaTuner.exe.
AntennaTuner allows to do an antenna design interactively.

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5 Power Supply

5 Power Supply

The picture below is showing how power is routed through TWN4 Nano Module:

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6 Power states and current consumption breakdown

6 Power states and current consumption

breakdown

The TWN4 Nano Module supports 3 power states that can be used to reduce the current consumption of
the reader when the application calls for it.
In Normal state the reader can accommodate a request to search for a high-/low-frequency tag, perform
a BLE action or interact with peripherals on short notice; the current consumption in this state is the
highest.
In Sleep state the reader is not capable of any of the above, but consumes considerably less current. The
reader can be woken by communication on USB/COM ports, predefined timeout, or a Low-Power-Card-
Detection (LPCD) event and taken to Normal state.
In Stop state the reader consumes the least current and can be woken up via external/internal interrupt, or
a Low-Power-Card-Detection (LPCD) event and taken to Normal state.
Changing the LPCD poll time will change the current consumption, which can be estimated with the fol-
lowing formula:

0.1mAs
ILP CD = 0.5mA +
tP oll [s]

.
Table 6.1 shows the expected typical current draw in the 3 states described above, depending on the
reader interface connected. It is assumed that a +5V DC Power Source is used. Results vary marginally
when +3.3V source is used in the UART-TTL option. The UART-RS232 option was exercised using
MAX3221A chip.

Host Connection USB UART-TTL

Normal Idle 65 59,4
Sleep 15,0 7,1
Sleep LPCD Option 15,4 7,5
Stop N/A 0,45
Stop LPCD Option N/A 0,8

Table 6.1: Typical Current Consumption in Base System States (mA)

Table 6.2 shows the extra current observed when the TWN4 Nano Module is integrated into a reader
(these results are to be taken as example only and are expected to change); these values are to be added
to those in the "Normal Idle" base state.

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6 Power states and current consumption breakdown

Function Current Consumption

SearchTag-HF +130
SearchTag-LF +25
RS232 +4
BLE Active Packet Reception +9
BLE Active Transmission (0 dBm output power) +9
BLE Active Transmission (8 dBm output power) +24
Speaker Constant Tone +80

Table 6.2: Extra Current Consumption per Function added to "Normal Idle" base state (mA)

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7 Label on TWN4 Nano Module

7 Label on TWN4 Nano Module

The content of the label is as follows:

R YYWW

ZZZ

Code Meaning Example

YY Year 17
WW Calendar week 05
ZZZ Part number code FDC
6th to 8th digit of part number, e.g.
part number: T4NM-FDC0
part number code: FDC

Table 7.1: Label content description

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8 Additional Hardware Requirements

8 Additional Hardware Requirements

8.1 Programming Firmware

To program firmware to the TWN4 Nano Module, it is mandatory to have at least one of the following
connections:
• USB
• COM1
• COM2
This should be kept in mind while designing a mainboard for the TWN4 Nano Module.
For a description how to program firmware to the TWN4 Nano Module please refer to documents TWN4
AppBlaster Config Cards User Guide DocRev6.pdf for Windows and TWN4 Programming with Command
Line under Linux DocRev1.pdf for Linux.

8.2 Using PI Option

To use the PI Option, e.g. to read the PAC bits from an iCLASS transponder, a SIO processor is needed.
This can be either a SIO chip which is soldered directly on a PCB or a SAM card incorporating the SIO
processor.

8.2.1 SIO Chip soldered on PCB

The SIO processor has to be added to the design of the mainboard. The chip can be connected either to
SAM1 or SAM2 of the TWN4 Nano Module.

Recommended schematic:

8.2.2 SAM Card Connection

A SAM socket has to be added to the design of the mainboard. The SAM socket can be connected either
to SAM1 or SAM2 of the TWN4 Nano Module.

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8 Additional Hardware Requirements

Following SAM sockets are recommended:

• Molex 47388-2001
• Molex 47308-0001
Recommended schematic:

8.3 Bluetooth BLE

8.3.1 Connecting BLE Module

The firmware of the TWN4 Nano Module has direct support for the Silicon Labs BGM111, BGM121 and
BGM11S BLE module.
To use this feature, it is needed to connect following signals to the TWN4 Nano Module:
• COM2_TX-
• COM2_RX-
• GPIO7
The signals TDI, TDO, TMS and TCK are needed to do an initial programming of the BLE Module.

Please note:
In order to have BLE module with support by TWN4 Nano Module firmware, TWN4 must be purchased
with activated B Option. Otherwise, BLE functionality must be programmed from within the App. Please
contact your distributor for TWN4 Nano Module with B option.

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8 Additional Hardware Requirements

Following schematics are recommended:

BGM111

BGM121 / BGM11S

8.3.2 Initial Programming of BLE Module

All the BGM Bluetooth Modules from Silicon Labs must first be programmed.
With Silicon Labs Development Kit SLWSTK6101C all BGM modules can be programmed via the SWD
pins TMS and TCK. The Silicon Labs software Simplicity Studio is a universal development package which
can be used for the initial programming of the BGM modules. This software contains the tool "Flash Pro-
grammer" for programming the BGM Modules. The following part describes a possible way to programm
the BGM Modules.

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8 Additional Hardware Requirements

8.3.3 Connection to the BGM Module

8.3.3.1 Debug Connector of Development Kit

The BGM Module must be connected to the Starter Kit SLWSTK6101C: Connect GND, TMS and TCK to
the BGM Module. Note: Pin 9 of the connector is used for cable detection. In case of a high level (3.3V),
the plugged in module is signaled to the programming adapter. In case of low level no module is detected.

Figure 8.1: Silicon Labs Development Kit

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8 Additional Hardware Requirements

8.3.3.2 Software

Figure 8.2: Silicon Labs Simplicity Studio

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8 Additional Hardware Requirements

Figure 8.3: Silicon Labs Simplicity Studio Tools Dialog

Procedure for initial programming of BGM module

• Insert BGM module (e.g. BGM111) to Development Kit
• Connect the Development Kit SLWSTK6101C via USB to PC
• Connect target BGM module to the debug connector of the Development Kit
• Power on the target BGM module with 3.3V
• Start the software "Simplicity Studio" and the tool "Flash Programmer" (see screenshots above)
• Select file type bin and load binary file. The current version of this file can be requested from ELATEC
Support [email protected]
• Press button "Program" to program the BGM Module.

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8 Additional Hardware Requirements

Figure 8.4: Silicon Labs Flash Programmer

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9 Packaging

9 Packaging

TWN4 Nano Modules on reel always have ELATEC standard firmware "CDC Simple Protocol".

9.1 Carrier Tape

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9 Packaging

9.1.1 Dimensions of Tape Leader & Trailer

• Start: Top Cover Tape 1x circumference plus 100mm (minimum 300mm)

• Leader: 10 pitch (minimum 100mm)
• Components: area with packed modules
• Trailer: 1 x circumference (minimum 160mm)

9.2 Tray

9.3 Package

A moisture barrier bag (MBB) is used to pack the reel or tray (size of MBB according to reel / tray dimen-
sion)

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9 Packaging

The MBB contains:

• The reel with TWN4 MultiTech Nano
• Desiccant packs
• Humidity indicator card
The packed MBB is de-aerated and sealed.

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9 Packaging

9.4 Label

• Part number: Part number (P/N) of contained product as text and barcode (Code 128)
• Version: Hardware version/firmware version
• Date code: Date code and charge number as [YYWWNNPP], where:
YY = Year, e.g. 17
WW = Calendar week, e.g. 05
NN = Production lot in decimal (incremented for each lot), e.g. 01
PP = Production site, e.g. 01 (internal use only)
• Quantity: Number of modules on reel

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9 Packaging

9.5 Position of Label

There are two identical labels, one on MBB, one on contained reel. In case of tray, there is only a label on
the MBB and no label on the tray.
Following positions:
Label on MBB:

Label on reel:

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10 Disclaimer

10 Disclaimer

ELATEC reserves the right to change any information or data in this document without prior notice. The
distribution and the update of this document is not controlled. ELATEC declines all responsibility for the
use of product with any other specifications but the ones mentioned above. Any additional requirement for
a specific custom application has to be validated by the customer himself at his own responsibility. Where
application information is given, it is only advisory and does not form part of the specification.
All referenced brands, product names, service names and trademarks mentioned in this document are the
property of their respective owners.

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