The document summarizes the specifications and characteristics of a P-channel logic level enhancement mode MOSFET. Key specifications include a drain-source breakdown voltage of -30V, an RDS(ON) of 7mΩ at -10V gate-source voltage, and a continuous drain current rating of -70A. The MOSFET has maximum ratings for drain-source voltage, gate-source voltage, continuous and pulsed drain current, avalanche current and energy, and power dissipation.
The document summarizes the specifications and characteristics of a P-channel logic level enhancement mode MOSFET. Key specifications include a drain-source breakdown voltage of -30V, an RDS(ON) of 7mΩ at -10V gate-source voltage, and a continuous drain current rating of -70A. The MOSFET has maximum ratings for drain-source voltage, gate-source voltage, continuous and pulsed drain current, avalanche current and energy, and power dissipation.
The document summarizes the specifications and characteristics of a P-channel logic level enhancement mode MOSFET. Key specifications include a drain-source breakdown voltage of -30V, an RDS(ON) of 7mΩ at -10V gate-source voltage, and a continuous drain current rating of -70A. The MOSFET has maximum ratings for drain-source voltage, gate-source voltage, continuous and pulsed drain current, avalanche current and energy, and power dissipation.
The document summarizes the specifications and characteristics of a P-channel logic level enhancement mode MOSFET. Key specifications include a drain-source breakdown voltage of -30V, an RDS(ON) of 7mΩ at -10V gate-source voltage, and a continuous drain current rating of -70A. The MOSFET has maximum ratings for drain-source voltage, gate-source voltage, continuous and pulsed drain current, avalanche current and energy, and power dissipation.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage VDS -30 V Gate-Source Voltage VGS ±20 TC = 25 °C -70 Continuous Drain Current3 ID TC = 100 °C -56 1 IDM Pulsed Drain Current -150 A TA = 25 °C -13 Continuous Drain Current ID TA = 70 °C -10 Avalanche Current IAS -71 Avalanche Energy L = 0.1mH EAS 252 mJ TC = 25 °C 50 TC = 100 °C 32 Power Dissipation PD W TA = 25 °C 2.5 TA = 70 °C 1.6 Operating Junction & Storage Temperature Range TJ, TSTG -55 to 150 °C
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Case RqJC 2.5 °C / W Junction-to-Ambient RqJA 50 1 Pulse width limited by maximum junction temperature. 2 The value of RqJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The value in any given application depends on the user's specific board design. 3 Package limitation current is -51A.
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNITS MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = -250mA -30 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = -250mA -1 -1.4 -3 Gate-Body Leakage IGSS VDS = 0V, VGS = ±16V ±30 mA VDS = -24V, VGS = 0V -1 Zero Gate Voltage Drain Current IDSS mA VDS = -20V, VGS = 0V , TJ = 125 °C -10 Drain-Source On-State VGS = -4.5V, ID = -20A 5.7 10 RDS(ON) mΩ Resistance1 VGS = -10V, ID = -20A 3.8 7 Forward Transconductance1 gfs VDS = -5V, ID = -12A 65 S DYNAMIC Input Capacitance Ciss 5210 Output Capacitance Coss VGS = 0V, VDS = -15V, f = 1MHz 960 pF Reverse Transfer Capacitance Crss 890 Qg(VGS =10V) 121 Total Gate Charge2 Qg(VGS =4.5V) VDS = -15V,VGS = -10V, 64 nC Gate-Source Charge 2 Qgs ID = -20A 12 Gate-Drain Charge2 Qgd 27 2 td(on) Turn-On Delay Time 33 2 tr Rise Time VDS = -15V, 25 nS Turn-Off Delay Time 2 td(off) ID @ -20A, VGS = -10V, RGS = 6Ω 100 Fall Time2 tf 45
Hans-Leo Ross (Auth.) - Functional Safety For Road Vehicles - New Challenges and Solutions For E-Mobility and Automated Driving-Springer International Publishing (2016)