ALM-11036

776 MHz – 870 MHz

Low Noise, High Linearity Amplifier Module
with Fail-Safe Bypass Feature

Data Sheet

Description Features
Avago Technologies’ ALM-11036 is an easy-to-use GaAs  Very Low Noise Figure
MMIC Tower Mount Amplifier (TMA) LNA Module with low  Good Return Loss
IL bypass path. The module has low noise and high linearity
achieved through the use of Avago Technologies’ propri-  Low Bypass IL
etary 0.25 m GaAs Enhancement-mode pHEMT process.  Fail-safe Bypass mode
All matching components are fully integrated within the  High linearity performance
module and the 50 ohm RF input and output pins are
already internally AC-coupled. This makes the ALM-11036  High isolation @LNA mode
extremely easy to use as the only external parts are DC  Flat gain
supply bypass capacitors. For optimum performance  GaAs E-pHEMT Technology
at other bands, ALM-11136 (870-915 MHz), ALM-11236
(1710-1850 MHz) and ALM-11336 (1850-1980) are recom-  Single 5 V power supply
mended. All ALM-11x36 share the same package and pin  Compact MCOB package 7.0 x 10.0 x 1.5 mm3
out configuration.
 MSL2a
Pin Configuration and Package Marking Specifications
7.0 x 10.0 x 1.5 mm3 36-lead MCOB 849 MHz; 5 V, 92 mA (typical)
 15.6 dB Gain
 ≥ 18 dB RL
 0.78 dB Noise Figure
AVAGO

WWYY
11036

XXXX

 21.3 dBm IIP3

 4 dBm Input Power at 1 dB gain compression
Pin Connection  0.82 dB Bypass IL
 ≥ 18 dB Bypass RL
27
28
29
30
31
32
33
34
35
36

4 RF_IN
26 1
25 2 23 RF_OUT  ≥ 50 dB isolation @LNA mode
24 3 28 EXT_P2
23 4 Applications
22 5 30 EXT_P1
21 6 33 Vdd  Tower Mount Amplifier (TMA)
20 7
Others GND  Cellular Infrastructure
19 8
18
17
16
15
14
13
12
11
10
9

Attention: Observe precautions for

Note: handling electrostatic sensitive devices.
Package marking provides orientation and identification
“11036” = Device Part Number ESD Machine Model = 350 V
“WWYY” = Work week and Year of manufacture ESD Human Body Model = 1500 V
“XXXX” = Last 4 digit of Lot number Refer to Avago Application Note A004R:
Electrostatic Discharge, Damage and Control.
Absolute Maximum Rating [1] TA = 25° C
Symbol Parameter Units Absolute Max. Thermal Resistance [2]
(Vdd = 5.0 V, Idd = 100 mA) jc = 83.1 °C/W
Vdd Device Voltage, V 5.5
Notes:
RF output to ground
1. Operation of this device in excess of any of
Pin,max CW RF Input Power dBm +15 these limits may cause permanent damage.
(Vdd = 5.0 V, Idd = 100 mA) 2. Thermal resistance measured using Infra-Red
measurement technique.
Pdiss Total Power Dissipation [3] W 0.715 3. Power dissipation with unit turned on. Board
Tj Junction Temperature °C 150 temperature Tc is 25° C. Derate at 12.3 mW/°C
for TC > 92° C.
TSTG Storage Temperature °C -65 to 150
Tamb Ambient Temperature °C -40 to 85

Electrical Specifications [1, 4]

RF performance at TA = 25° C, Vdd = 5 V, 849 MHz, measured on demo board in Figure 1 with component listed in Table 1
for DC bypass.
Symbol Parameter and Test Condition Frequency (MHz) Units Min. Typ. Max.
Idd Drain Current mA 75 92 107
Gain Gain 776 dB – 15.4 –
849 14.2 15.6 17.2
IRL Input Return Loss, 50  source dB – 30 –
ORL Output Return Loss, 50  load dB – 26 –
NF [2] Noise Figure 776 dB – 0.84 –
849 – 0.78 0.95
IIP3 [3] Input Third Order Intercept Point dBm 18.7 21.3 –
IP1dB Input Power at 1 dB Gain Compression dBm 2.85 4 –
Bypass IL Bypass Insertion Loss, 50  load Vdd = 0 V 776 dB – 0.7 –
849 – 0.82 1.1
Bypass IRL Input Return Loss, 50  source Vdd = 0 V dB – 35 –
Bypass ORL Output Return Loss, 50  load Vdd = 0 V dB – 35 –
ISOL Bypass Isolation @LNA ON Vdd = 5 V dB – 54 –
Notes:
1. Measurements at 849 MHz obtained using demo board described in Figure 1.
2. For NF data, board losses of the input have not been de-embedded.
3. IIP3 test condition: FRF1 = 849 MHz, FRF2 = 850 MHz with input power of -15 dBm per tone.
4. Use proper bias, heatsink and derating to ensure maximum channel temperature is not exceeded. See absolute maximum ratings and application
note for more details.

2
Product Consistency Distribution Charts[1, 2]

LSL USL LSL USL

80 90 100 14 15 16 17
Figure 1. Idd, LSL = 75 mA , nominal = 92 mA, USL = 107 mA Figure 2. Gain, LSL = 14.2 dB, nominal = 15.6 dB, USL = 17.2 dB

USL LSL

0.7 0.8 0.9 19 20 21 22 23

Figure 3. NF, nominal = 0.7 8dB, USL = 0.95 dB Figure 4. IIP3, LSL = 18.7 dBm, nominal = 21.3 dBm

LSL LSL

3 4 5 -1.1 -1 -0.9 -0.8 -0.7 -0.6

Figure 5. IP1dB, LSL = 2.85 dBm, nominal = 4 dBm Figure 6. Bypass IL, LSL = 1.1 dB, nominal = 0.82 dB

Notes:
1. Distribution data sample size is 1500 samples taken from 3 different wafer lots. Future wafers allocated to this product may have nominal values
anywhere between the upper and lower limits.
2. Circuit trace losses have not been de-embedded from measurements above.

3
Demo Board Layout

GND

Vsupply
Avago
Technologies
Z1

C1
C2

C3 Z2
28 EXT_P2
30 EXT_P1
36 Gnd

34 Gnd

27 Gnd
35 Gnd

32 Gnd

31 Gnd

29 Gnd
33 Vdd

Gnd 1 26 Gnd

Gnd 2 25 Gnd

Gnd 3 24 Gnd

RF_IN 4 23 RF_OUT

Gnd 5 22 Gnd

Gnd 6 21 Gnd

Gnd 7 20 Gnd

Gnd 8 19 Gnd
10

11

12

13

14

15

16

17

18
9
Gnd

Gnd

Gnd

Gnd

Gnd

Gnd

Gnd

Gnd

Gnd

Gnd

ALM- rev1gi MILS

W 21.89
G 14.57
March'10 H 10
S 60
Low T.M.

Figure 7. Demo Board Layout Diagram

– Recommended PCB material is 10 mils Rogers RO4350.

– Suggested component values may vary according to layout and PCB material.
– Copper trace between the 2 pads is removed before Z2 0(ohm) is placed.

4
Demo Board Schematic
Vdd (5 V)

Z1

Z2
C1 C2
27,29,31,32,34,35,36
EXT_P1 EXT_P2
33 30 28
1,2,3 24,25,26

BIAS

5V
4 5V 23
RFin 50-Ohms TL RFout
0V

5,6,7,8 19,20,21,22

9,10,11,12,13,14,15,16,17,18
Module Outline,
7 mm x 10 mm

Truth Table
Vdd (V)
LNA Mode 5
Bypass Mode 0
Fail-safe Mode NC
Bypass and Fail-safe mode have similar performance

Figure 8. Demo Board Schematic Diagram

Table 1. DC component list for 776-870 MHz

Part Size Value Detail Part Number
C1 0805 2.2 F (Murata) GRM21BR61E225KA12L
C2 0402 NU NU
Z1 0805 0 ohm (Kamaya) RMC1/8-JPTP
Z2 0603 0 ohm (Kamaya) RMC1/16-JPTP
Notes:
C1 is DC bypass capacitor
Z1 is 0 ohm resistor or fuse

5
Typical Performance
RF performance at TA = 25° C, Vdd = 5 V for LNA mode, Vdd = 0 V for Bypass mode, measured on demo board in Figure 7.
Signal = CW unless stated otherwise. Application Test Circuit is shown in Figure 8 and Table 1. IIP3 test condition: FRF1-FRF2
= 1 MHz with input power of -15 dBm per tone.

100 17.0
16.5
95 16.0
15.5

Gain (dB)
Idd (mA)

90 15.0
14.5
85 14.0 85° C
13.5 25° C
-40° C
80 13.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 770 780 790 800 810 820 830 840 850 860 870
Temperature (°C) Frequency (MHz)
Figure 9. Idd vs Temperature Figure 10. Gain vs Frequency

0 0
85° C -5 85° C
-5
25° C 25° C
-10 -40° C -10 -40° C
-15 -15
S22 (dB)
S11 (dB)

-20 -20
-25 -25
-30 -30
-35 -35
-40 -40
770 780 790 800 810 820 830 840 850 860 870 770 780 790 800 810 820 830 840 850 860 870
Frequency (MHz) Frequency (MHz)
Figure 11. S11 vs Frequency Figure 12. S22 vs Frequency

1.1 30
1.0 28
26
0.9
24
0.8
IIP3 (dBm)

22
NF(dB)

0.7 20
0.6 18
16
0.5 85° C 85° C
14
25° C 25° C
0.4 12
-40° C -40° C
0.3 10
770 780 790 800 810 820 830 840 850 860 870 770 780 790 800 810 820 830 840 850 860 870
Frequency (MHz) Frequency (MHz)
Figure 13. NF vs Frequency Figure 14. IIP3 vs Frequency

6
 8.0 -0.5
85° C
7.0 25° C -0.6
6.0 -40° C
-0.7

Bypass IL (dB)
5.0
IP1dB(dBm)

-0.8
4.0
-0.9
3.0
-1.0
2.0 85° C
-1.1 25° C
1.0
-40° C
0.0 -1.2
770 780 790 800 810 820 830 840 850 860 870 770 780 790 800 810 820 830 840 850 860 870
Frequency (MHz) Frequency (MHz)
Figure 15. IP1dB vs Frequency Figure 16. Bypass IL vs Frequency

0 0
-5 85° C -5 85° C
25° C 25° C
-10 -40° C -10 -40° C
-15 -15
Bypass S22 (dB)
Bypass S11 (dB)

-20 -20
-25 -25
-30 -30
-35 -35
-40 -40
-45 -45
-50 -50
770 780 790 800 810 820 830 840 850 860 870 770 780 790 800 810 820 830 840 850 860 870
Frequency (MHz) Frequency (MHz)
Figure 17. Bypass S11 vs Frequency Figure 18. Bypass S22 vs Frequency

-30
-35 85° C
25° C
-40 -40° C
Isolation (dB)

-45
-50
-55
-60
-65
-70
770 780 790 800 810 820 830 840 850 860 870
Frequency (MHz)
Figure 19. Bypass isolation vs Frequency (LNA mode)

7
Typical Scattering Parameters, Vdd = 5 V, Idd = 92 mA
LNA SPAR (100 MHz – 20 GHz)
Freq (GHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
0.1 -0.96 -144.48 -12.98 -32.61 -13.07 -32.53 -0.87 -123.04
0.5 -2.21 142.14 -27.02 -94.66 -38.63 63.66 -1.07 106.09
0.7 -6.53 47.06 11.56 -4.83 -29.78 -37.54 -8.99 160.33
0.75 -14.56 22.36 14.99 -69.88 -25.15 -100.88 -19.56 96.86
0.77 -18.24 21.15 15.40 -91.79 -24.43 -121.56 -29.62 115.18
0.79 -21.72 21.48 15.61 -111.16 -23.84 -140.43 -28.92 -168.17
0.81 -25.22 13.45 15.68 -128.62 -23.40 -156.46 -25.68 -160.33
0.83 -29.79 -18.04 15.67 -144.42 -23.02 -171.42 -25.35 -157.21
0.85 -29.36 -84.38 15.62 -159.03 -22.65 174.56 -26.30 -140.35
0.87 -24.30 -124.20 15.56 -172.74 -22.38 161.58 -25.00 -112.85
0.89 -20.26 -141.54 15.45 174.50 -22.21 149.80 -21.42 -95.86
0.91 -17.80 -155.35 15.30 162.05 -22.02 137.76 -18.03 -92.18
0.92 -16.84 -162.04 15.22 156.26 -22.03 132.58 -16.69 -91.89
0.93 -16.07 -167.32 15.10 150.59 -21.87 127.13 -15.45 -93.88
0.95 -14.87 -178.09 14.87 139.60 -21.77 116.63 -13.42 -97.98
1 -14.04 155.35 14.34 114.38 -21.61 93.24 -10.38 -108.84
1.5 -8.03 -107.48 10.10 -55.73 -19.43 -68.19 -7.09 149.36
2 -2.96 -123.02 -1.92 140.66 -27.02 134.78 -1.50 -176.24
2.5 -1.42 -160.14 -13.17 79.99 -35.19 81.93 -1.12 124.52
3 -0.98 178.28 -17.99 15.79 -41.36 49.18 -3.43 30.64
3.5 -1.00 164.55 -26.05 -66.05 -36.47 -40.63 -4.70 -148.81
4 -0.89 154.97 -37.39 -127.94 -69.35 15.05 -2.20 140.32
4.5 -1.37 144.20 -56.59 179.37 -50.93 -33.28 -8.59 -10.69
5 -4.74 133.59 -60.21 -37.96 -59.46 -72.44 -1.68 -159.63
5.5 -1.67 152.92 -62.99 -147.73 -67.86 73.07 -0.91 160.23
6 -1.86 126.12 -54.39 33.97 -56.51 57.13 -0.96 130.17
7 -1.48 112.34 -37.36 -164.63 -38.00 -161.07 -1.15 79.40
8 -0.85 86.81 -46.38 95.84 -46.38 101.79 -1.11 32.34
9 -1.77 78.40 -28.25 -45.00 -28.67 -42.61 -2.28 -26.39
10 -3.36 58.78 -25.97 150.57 -24.74 160.81 -7.18 -92.13
11 -6.31 26.98 -23.28 -173.77 -23.41 -166.84 -4.70 -121.47
12 -3.68 -25.16 -22.76 -158.65 -22.78 -157.77 -3.95 -94.58
13 -5.10 -68.82 -29.35 166.53 -29.53 166.64 -10.27 172.28
14 -11.62 147.68 -25.22 -20.01 -25.12 -21.30 -12.64 131.06
15 -5.04 46.97 -27.14 118.03 -27.07 118.94 -8.31 -60.24
16 -6.53 -49.32 -26.80 -15.28 -26.68 -14.29 -4.89 -144.80
17 -13.93 170.79 -31.39 139.93 -31.28 140.16 -2.80 -153.41
18 -7.60 -17.67 -29.19 117.19 -28.95 115.28 -5.70 173.60
19 -3.86 -80.47 -27.82 7.47 -27.74 7.75 -4.89 -171.62
20 -5.46 -136.04 -28.58 53.03 -28.54 53.25 -2.77 150.14

8
PCB Layout and Stencil Design
9.795
9.765
0.845 (pitch) 0.845 (pitch)
Pin 1 Pin 1

(pitch)

(pitch)
0.845

0.845
0.20

0.47
0.50

6.770
5.20

6.80

4.50

1.0375
1.0375
8.10 3.65

0.50 0.47

Land Pattern Stencil Opening

0.845

Pin 1
(pitch)
0.845

Metal
1.0375

Soldermask Open

Note :
1. Recommended Land Pattern & Stencil Opening.
2. Stencil thickness is 0.1 mm (4 mils)
3. All dimension are in MM unless otherwise specified
Combination of Land Pattern and Stencil Opening

Part Number Ordering Information

Part Number No. of Devices Container
ALM-11036-TR1G 1000 13” Reel
ALM-11036-BLKG 100 antistatic bag

9
MCOB 7 x 10 Package Dimensions
Pin1 Identification

10.00±0.10 1.50±0.10

AVAGO

WWYY
11036

XXXX
7.00±0.10

1.12
Top View
Side View

0.845 (pitch)
0.50
0.50 Pin 1
0.10
5.20 R0.15 0.845 (pitch)

0.05 8.10
(SM to metal gap) Bottom SM

Bottom Metal

1.0375
Notes:
1. All dimensions are in milimeters
2. Dimensions are inclusive of plating
Bottom View 3. Dimensions are exclusive of mold flash and metal burr

Device Orientation
REEL

USER FEED DIRECTION

AVAGO AVAGO AVAGO

11036 11036 11036
CARRIER WWYY WWYY WWYY
TAPE XXXX XXXX XXXX

USER TOP VIEW END VIEW

FEED
DIRECTION
COVER TAPE

10
Tape Dimensions
12.00 ± 0.10
2.00 ± 0.10

4.00 ± 0.10
Ø 1.50 + 0.10 1.75 ± 0.10

11.50 ± 0.10
24.00 + 0.30
− 0.10

Ø 1.50 + 0.25

0.318 ± 0.02

5° MAX
8° MAX
10.49 ± 0.10
7.32 ± 0.10
2.06 ± 0.10

A. K. B.

11
Reel Dimensions - 13” Reel
ESD Label
(See Below)
Recycle Symbol

Detail ‘X’

Embossed Line X2
90.0mm Length
Lines 147.0mm away from center point
Embossed ‘M’ 5.0mm Height

FRONT VIEW
25.65±1.75** Ø20.2 (Min)
25.4±1.0*
Recycle Symbol +0.5
Ø13.1 -0.2

See Detail ‘X’ 2.2±0.5

FRONT BACK
Detail ‘X’
Ø100.0±0.5
Ø331.5 Max

1.0

Detail ‘Y’ 4.0

Slot 10.0±0.5(2x) 30.4*
Slot 5.0±0.5***(1x) Max Detail ‘Y’
BACK VIEW (Slot Hole)

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-2846EN - October 10, 2011