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DRV5057-Q1
SBAS645 – AUGUST 2019

DRV5057-Q1 Automotive Linear Hall Effect Sensor With PWM Output

1 Features 3 Description
1• AEC-Q100 qualified for automotive applications The DRV5057-Q1 is a linear Hall effect sensor that
responds proportionally to magnetic flux density. The
– Temperature grade 0: –40°C to 150°C device can be used for accurate position sensing in a
• PWM-output linear Hall effect magnetic sensor wide range of applications.
• Operates from 3.3-V and 5-V power supplies The device operates from 3.3-V or 5-V power
• 2-kHz clock output with 50% quiescent duty cycle supplies. When no magnetic field is present, the
• Magnetic sensitivity options (at VCC = 5 V): output produces a clock with a 50% duty cycle. The
output duty cycle changes linearly with the applied
– A1: 2%D/mT, ±21-mT range
magnetic flux density, and four sensitivity options
– A2: 1%D/mT, ±42-mT range maximize the output dynamic range based on the
– A3: 0.5%D/mT, ±84-mT range required sensing range. North and south magnetic
– A4: 0.25%D/mT, ±168-mT range poles produce unique outputs. The typical pulse-width
modulation (PWM) carrier frequency is 2 kHz.
• Open-drain output with 20-mA sink capability
Magnetic flux perpendicular to the top of the package
• Compensation for magnet temperature drift
is sensed, and the two package options provide
• Industry standard package: different sensing directions.
– Surface-mount SOT-23 Because the PWM signal is based on edge-to-edge
timing, signal integrity is maintained in the presence
2 Applications of voltage noise or ground potential mismatch. This
• Automotive position sensing signal is suitable for distance transmission in noisy
environments, and the always-present clock allows
• Brake, acceleration, clutch pedals
the system controller to confirm there are good
• Torque sensors, gear shifters interconnects. Additionally, the device features
• Throttle position, height leveling magnet temperature compensation to counteract how
• Powertrain and transmission components magnets drift for linear performance across a wide
–40°C to +150°C temperature range.
• Absolute angle encoding
• Current sensing Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
DRV5057-Q1 SOT-23 (3) 2.92 mm × 1.30 mm
(1) For all available packages, see the package option addendum
at the end of the data sheet.

Typical Schematic Magnetic Response

PWM
VCC VDD
Output
DRV5057-Q1 Controller
VCC Duty Cycle
8% 25% 38% 50% 69% 75% 92%
OUT GPIO
GND VOH

VOL
Time

North 0 mT South

Magnetic Field

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes........................................ 11
2 Applications ........................................................... 1 8 Application and Implementation ........................ 12
3 Description ............................................................. 1 8.1 Application Information............................................ 12
4 Revision History..................................................... 2 8.2 Typical Applications ................................................ 14
8.3 What to Do and What Not to Do ............................. 20
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 21
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 21
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 21
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 21
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 22
6.5 Electrical Characteristics........................................... 5 11.1 Documentation Support ........................................ 22
6.6 Magnetic Characteristics........................................... 5 11.2 Receiving Notification of Documentation Updates 22
6.7 Typical Characteristics .............................................. 6 11.3 Community Resources.......................................... 22
7 Detailed Description .............................................. 8 11.4 Trademarks ........................................................... 22
7.1 Overview ................................................................... 8 11.5 Electrostatic Discharge Caution ............................ 22
7.2 Functional Block Diagram ......................................... 8 11.6 Glossary ................................................................ 22
7.3 Feature Description................................................... 8 12 Mechanical, Packaging, and Orderable
Information ........................................................... 22

4 Revision History
DATE REVISION NOTES
August 2019 * Initial release.

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5 Pin Configuration and Functions

DBZ Package
3-Pin SOT-23
Top View

VCC 1

3 GND

OUT 2

Not to scale

Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
GND 3 Ground Ground reference
OUT 2 Output Analog output
VCC 1 Power Power supply. Connect this pin to a ceramic capacitor to ground with a value of at least 0.01 µF.

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC Power supply voltage VCC –0.3 7 V
Output voltage OUT –0.3 6 V
Output current OUT 30 mA
B Magnetic flux density Unlimited T
TJ Operating junction temperature –40 170 °C
Tstg Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
Human body model (HBM), per AEC Q100-002 (1)
±3000
HBM ESD classification level 2
V(ESD) Electrostatic discharge V
Charged device model (CDM), per AEC Q100-011
±750
CDM ESD classification level C5

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
3 3.63
VCC Power-supply voltage (1) V
4.5 5.5
VO Output pullup voltage 0 5.5 V
IO Output continuous current 0 20 mA
TA Operating ambient temperature (2) –40 150 °C

(1) There are two isolated operating VCC ranges. For more information see the Operating VCC Ranges section.
(2) Power dissipation and thermal limits must be observed.

6.4 Thermal Information

DRV5057-Q1
THERMAL METRIC (1) SOT-23 (DBZ) UNIT
3 PINS
RθJA Junction-to-ambient thermal resistance 170 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66 °C/W
RθJB Junction-to-board thermal resistance 49 °C/W
ΨJT Junction-to-top characterization parameter 1.7 °C/W
ΨJB Junction-to-board characterization parameter 48 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

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6.5 Electrical Characteristics

for VCC = 3 V to 3.63 V and 4.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC Operating supply current 6 10 mA
tON Power-on time (see Figure 15) (1) B (2) = 0 mT, no load on OUT 0.6 0.9 ms
fPWM PWM carrier frequency 1.8 2.0 2.2 kHz
DJ Duty cycle peak-to-peak jitter From change in B to change in OUT ±0.1 %D (3)
IOZ High-impedance output leakage current VCC = 5 V 100 nA
VOL Low-level output voltage IOUT = 20 mA 0.15 0.4 V

(1) tON is the time from when VCC goes above 3 V until the first rising edge of the first valid pulse.
(2) B is the applied magnetic flux density.
(3) This unit is a percentage of duty cycle.

6.6 Magnetic Characteristics

for VCC = 3 V to 3.63 V and 4.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DL Linear duty cycle range 8 92 %D (1)
(2)
DCL Clamped-low duty cycle B < –250 mT 5.3 6 6.7
%D
DCH Clamped-high duty cycle B > 250 mT 93.3 94 94.7
DQ Quiescent duty cycle (3) B = 0 mT, TA = 25°C, VCC = 3.3 V or 5 V 43 50 57 %D
High-temperature operating stress for
VQΔL Quiescent duty cycle lifetime drift < 0.5 %
1000 hours
DRV5057A1-Q1 1.88 2 2.12
VCC = 5 V, DRV5057A2-Q1 0.94 1 1.06
TA = 25°C DRV5057A3-Q1 0.47 0.5 0.53
DRV5057A4-Q1 0.23 0.25 0.27
S Sensitivity %D/mT
DRV5057A1-Q1 1.13 1.2 1.27
VCC = 3.3 V, DRV5057A2-Q1 0.56 0.6 0.64
TA = 25°C DRV5057A3-Q1 0.28 0.3 0.32
DRV5057A4-Q1 0.138 0.15 0.162
DRV5057A1-Q1 ±21
Linear magnetic flux density sensing VCC = 5 V, DRV5057A2-Q1 ±42
BL mT
range (3) (4) TA = 25°C DRV5057A3-Q1 ±84
DRV5057A4-Q1 ±168
Sensitivity temperature compensation
STC 0.12 %/°C
for magnets (5)
SLE Sensitivity linearity error (3) Output duty cycle is within DL ±1 %
Sensitivity error over operating VCC
RSE Output duty cycle is within DL ±1 %
range
Quiescent error over operating VCC
SΔL < 0.5 %
range

(1) This unit is a percentage of duty cycle.

(2) B is the applied magnetic flux density.
(3) See the Sensitivity Linearity section.
(4) BL describes the minimum linear sensing range at 25°C taking into account the maximum VQ and sensitivity tolerances.
(5) STC describes the rate the device increases Sensitivity with temperature. For more information, see the Sensitivity Temperature
Compensation for Magnets section and Figure 4 to Figure 11.

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6.7 Typical Characteristics

for TA = 25°C (unless otherwise noted)

2.2 1.3
2 1.2
1.8 5057A1 1.1
5057A1
5057A2 1
1.6 5057A2
5057A3
Sensitivity (%D/mT)

Sensitivity (%D/mT)
0.9 5057A3
1.4 5057A4
5057A4
0.8
1.2
0.7
1
0.6
0.8
0.5
0.6 0.4
0.4 0.3
0.2 0.2
0 0.1
4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5 3 3.1 3.2 3.3 3.4 3.5 3.6
Supply (V) D010
Supply (V) D011
VCC = 5.0 V VCC = 3.3 V

Figure 1. Sensitivity vs Supply Voltage Figure 2. Sensitivity vs Supply Voltage

10 2.5
VCC = 3.3 V
9 VCC = 5.0 V 2.25

8 2
Supply Current (mA)

Sensitivity (%D/mT)

1.75
7
1.5
6
1.25
5
1
4
0.75
3 0.5 +STD
2 0.25 AVG
-STD
1 0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Temperature (qC) D012
Temperature (qC) D014
DRV5057A1-Q1, VCC = 5.0 V

Figure 3. Supply Current vs Temperature Figure 4. Sensitivity vs Temperature

2.5 1.5
+STD 1.4
2.25 AVG 1.3
2 -STD 1.2
1.1
Sensitivity (%D/mT)

Sensitivity (%D/mT)

1.75
1
1.5 0.9
0.8
1.25
0.7
1 0.6
0.5
0.75
0.4
0.5 0.3 +STD
0.2 AVG
0.25
0.1 -STD
0 0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Temperature (qC) D013
Temperature (qC) D005
DRV5057A1-Q1, VCC = 3.3 V DRV5057A2-Q1, VCC = 5.0 V

Figure 5. Sensitivity vs Temperature Figure 6. Sensitivity vs Temperature

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Typical Characteristics (continued)

for TA = 25°C (unless otherwise noted)
1.5 1
1.4 +STD +STD
AVG 0.9 AVG
1.3
1.2 -3STD 0.8 -3STD
1.1
Sensitivity (%D/mT)

Sensitivity (%D/mT)
0.7
1
0.9 0.6
0.8
0.5
0.7
0.6 0.4
0.5
0.3
0.4
0.3 0.2
0.2
0.1
0.1
0 0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Temperature (qC) D006
Temperature (qC) D003
DRV5057A2-Q1, VCC = 3.3 V DRV5057A3-Q1, VCC = 5.0 V

Figure 7. Sensitivity vs Temperature Figure 8. Sensitivity vs Temperature

1 0.5
+STD +STD
0.9 AVG 0.45 AVG
0.8 -3STD -3STD
0.4
Sensitivity (%D/mT)

0.7
Sensitivity (%D/mT)

0.35
0.6 0.3
0.5 0.25
0.4 0.2
0.3 0.15
0.2 0.1
0.1 0.05
0 0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Temperature (qC) D004
Temperature (qC) D001
DRV5057A3-Q1, VCC = 3.3 V DRV5057A4-Q1, VCC = 5.0 V

Figure 9. Sensitivity vs Temperature Figure 10. Sensitivity vs Temperature

0.5
+STD
0.45 AVG
0.4 -3STD
Sensitivity (%D/mT)

0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
-40 -20 0 20 40 60 80 100 120 140
Temperature (qC) D002
DRV5057A4-Q1, VCC = 3.3 V

Figure 11. Sensitivity vs Temperature

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7 Detailed Description

7.1 Overview
The DRV5057-Q1 is a 3-pin pulse-width modulation (PWM) output Hall effect sensor with fully integrated signal
conditioning, temperature compensation circuits, mechanical stress cancellation, and amplifiers. The device
operates from 3.3-V and 5-V (±10%) power supplies, measures magnetic flux density, and outputs a pulse-width
modulated, 2-kHz digital signal.

7.2 Functional Block Diagram

Element Bias VCC

Bandgap
Reference 0 …F
Offset Cancellation

Trim Registers GND

Temperature
Compensation

VCC

Precision OUT
PWM Driver
Amplifier

7.3 Feature Description

7.3.1 Magnetic Flux Direction
As shown in Figure 12, the DRV5057-Q1 is sensitive to the magnetic field component that is perpendicular to the
top of the package.

SOT-23

PCB

Figure 12. Direction of Sensitivity

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Feature Description (continued)

Magnetic flux that travels from the bottom to the top of the package is considered positive in this document. This
condition exists when a south magnetic pole is near the top (marked-side) of the package. Magnetic flux that
travels from the top to the bottom of the package results in negative millitesla values. Figure 13 shows flux
direction.

PCB

Figure 13. Flux Direction for Positive B

7.3.2 Sensitivity Linearity

The device produces a pulse-width modulated digital signal output. As shown in Figure 14, the duty-cycle of the
PWM output signal is proportional to the magnetic field detected by the Hall element of the device. If there is no
magnetic field present, the duty cycle is 50%. The DRV5057-Q1 can detect both magnetic north and south poles.
The output duty cycle maintains a linear relationship with the input magnetic field from 8% to 92%.
PWM
Output

Duty Cycle
8% 25% 38% 50% 69% 75% 92%

VOH

VOL
Time

North 0 mT South

Magnetic Field

Figure 14. Magnetic Response

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Feature Description (continued)

7.3.3 Operating VCC Ranges
The DRV5057-Q1 has two recommended operating VCC ranges: 3 V to 3.63 V and 4.5 V to 5.5 V. When VCC is
in the middle region between 3.63 V to 4.5 V, the device continues to function but sensitivity is less known
because there is a crossover threshold near 4 V that adjusts device characteristics.

7.3.4 Sensitivity Temperature Compensation for Magnets

Magnets generally produce weaker fields as temperature increases. The DRV5057-Q1 has a temperature
compensation feature that is designed to directly compensate the average drift of neodymium (NdFeB) magnets
and partially compensate ferrite magnets. The residual induction (Br) of a magnet typically reduces by 0.12%/°C
for NdFeB, and 0.20%/°C for ferrite. When the operating temperature of a system is reduced, temperature drift
errors are also reduced.

7.3.5 Power-On Time

After the VCC voltage is applied, the DRV5057-Q1 requires a short initialization time before the output is set. The
parameter tON describes the time from when VCC crosses 3 V until OUT is within 5% of VQ, with 0 mT applied
and no load attached to OUT. Figure 15 shows this timing diagram.
VCC

3V
tON

time

Output

95% × V Q

Invalid

time
Figure 15. tON Definition

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Feature Description (continued)

7.3.6 Hall Element Location
Figure 16 shows the location of the sensing element inside each package option.
SOT-23
Top View

SOT-23
Side View

centered 650 µm
±50 µm ±80 µm

Figure 16. Hall Element Location

7.4 Device Functional Modes

The DRV5057-Q1 has one mode of operation that applies when the Recommended Operating Conditions are
met.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Selecting the Sensitivity Option
Select the highest DRV5057-Q1 sensitivity option that can measure the required range of magnetic flux density
so that the output voltage swing is maximized.
Larger-sized magnets and farther sensing distances can generally enable better positional accuracy than very
small magnets at close distances, because magnetic flux density increases exponentially with the proximity to a
magnet. TI created an online tool to help with simple magnet calculations on the DRV5057-Q1 product folder.

8.1.2 Decoding a PWM

A PWM output helps system designers drive signals for long distances in noisy environments, with the ability to
retrieve the signal accurately. A decoder is employed at the load to retrieve the analog magnetic signal. Two
different methods of decoding are discussed in this section.

8.1.2.1 Decoding a PWM (Digital)

8.1.2.1.1 Capture and Compare Timer Interrupt

Many microcontrollers have a capture and compare timer mode that can simplify the PWM decoding process.
Use the timer in capture and compare mode with an interrupt that triggers on both the rising and falling edges of
the signal to obtain both the relative high (on) and low (off) time of the PWM. Make sure that the timer period is
significantly faster than the period of the PWM, based on the desired resolution. Calculate the percent duty cycle
(%D) of the PWM with Equation 1 by using the relative on and off time of the signal.
OnTime
%D u 100
OnTime OffTime (1)

8.1.2.1.2 Oversampling and Counting With a Timer Interrupt

If a capture and compare timer is not available, a standard timer interrupt and a counter can be used. Configure
the timer interrupt to be significantly faster than the period of the PWM, based on the desired resolution. Count
how many times the timer interrupts while the signal is high (OnTime), then count how many times the timer
interrupts while the signal is low (OffTime). Then use Equation 1 to calculate the duty cycle.

8.1.2.1.3 Accuracy and Resolution

The accuracy and resolution for the methods described in the Capture and Compare Timer Interrupt and
Oversampling and Counting With a Timer Interrupt sections depends significantly on the timer sampling
frequency. Equation 2 calculates the least significant bit of the duty cycle (%DLSB) based on the chosen timer
sampling frequency.
PWM frequency
%D LSB u 100
TIMER frequency (2)
For example, with a 2-kHz PWM and a 400-kHz sampling frequency, the %DLSB is:
(2 kHz / 400 kHz) × 100 = 0.5%DLSB
If the sampling frequency in increased to 2-MHz, the %DLSB is improved to be:
(2 MHz / 400 kHz) × 100 = 0.1%DLSB
However, accuracy and resolution are still subject to noise and sensitivity.

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Application Information (continued)

8.1.2.2 Decoding a PWM (Analog)
If an analog signal is needed at the end of a large travel distance, first use a microcontroller to digitally decode
the PWM, then use a DAC to produce the analog signal. If an analog signal is needed after a short signal travel
distance, use an analog output device, such as the DRV5055-Q1.
If an analog signal is needed at the end of a large travel distance and a microcontroller is unavailable, use a low-
pass filter to convert the PWM signal into an analog voltage, as shown in Figure 17. When using this method,
note the following:
• A ripple appears at the analog voltage output, causing a decrease in accuracy. The ripple intensity and
frequency depend on the values chosen for R and C in the filter.
• The minimum and maximum voltages of the PWM must be known to calculate the magnetic field strength
from the analog voltage. Thus, if the signal is traveling a large distance, then the minimum and maximum
values must be either measured or buffered back to a known value.

PWM Signal Analog Signal

R
C

Figure 17. Low-Pass RC Filter

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8.2 Typical Applications

The DRV557-Q1 is a very robust linear position sensor for applications such as throttle positions, brakes, and
clutch pedals. In linear position applications, depending on the mechanical placement and design limitations, two
common types of magnet orientations are selected: full-swing and half-swing.

8.2.1 Full-Swing Orientation Example

In the full-swing orientation, a magnet travels in parallel to the DRV5057-Q1 surface. In this case, the magnetic
range extends from south polarity to north polarity, and allows the DRV5057-Q1 to use the full linear magnetic
flux density sensing range.

S N

Figure 18. Full-Swing Orientation Example

8.2.1.1 Design Requirements

Use the parameters listed in Table 1 for this design example.

Table 1. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE
Device DRV5057-Q1
VCC 5V
Cylinder: 4.7625-mm diameter, 12.7-mm thick,
Magnet
neodymium N52, Br = 1480 mT
Travel distance 10 mm
Desired accuracy < 0.1 mm

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8.2.1.2 Detailed Design Procedure

Linear Hall effect sensors provide flexibility in mechanical design because many possible magnet orientations
and movements produce a usable response from the sensor. Figure 18 illustrates one of the most common
orientations that uses the full north to south range of the sensor and causes a close-to-linear change in magnetic
flux density as the magnet moves across the sensor. Figure 19 illustrates the close-to-linear change in magnetic
field present at the sensor as the magnet moves a given distance across the sensor. The usable linear region is
close to but less than the length (thickness) of the magnet.
When designing a linear magnetic sensing system, always consider these three variables: the magnet, sensing
distance, and the range of the sensor. Select the DRV5057-Q1 with the highest sensitivity possible based on the
system distance requirements without railing the sensor PWM output. To determine the magnetic flux density the
sensor receives at the various positions of the magnet, use a magnetic field calculator or simulation software,
referring to magnet specifications, and testing.
Determine if the desired accuracy is met by comparing the maximum allowed duty cycle least significant bit
(%DLSBmax) with the noise level (PWM jitter) of the device. Equation 3 calculates the %DLSBmax by taking into
account the used length of the linear region (travel distance), the desired resolution, and the output PWM swing
(within the linear duty cycle range).
%D swing
%D LSBmax u Re solution
Travel Dis tance (3)
Thus, with this example (and a linear duty cycle range of 8%D to 92%D), using Equation 3 gives (92 – 8) / (10) ×
0.1 = 0.84%DLSBmax. This value is larger than the 0.1%D jitter, and therefore the desired accuracy can be
achieved by using Equation 2 to select a %DLSB that is equal to or less than 0.84. Then, simply calibrate the
magnet position to align the sensor output along the movement path.

8.2.1.3 Application Curve

Figure 19 shows the magnetic field present at the sensor as the magnet passes by as described in Figure 18.
The change in distance from the trough to the peak is approximately the length (thickness) of the magnet. B
changes based on the strength of the magnet and how close the magnet is to the sensor.

5
B

-9 9
Distance D015

Figure 19. Magnetic Field vs Distance

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8.2.2 Half-Swing Orientation Example

In the half-swing orientation, a magnet travels perpendicular to the DRV5057-Q1 surface. In this case, the
magnetic range extends only to either the south or north pole, using only half of the DRV5057-Q1 linear
magnetic flux density sensing range.

Mechanical Component

PCB

Figure 20. Half-Swing Orientation Example

8.2.2.1 Design Requirements

Use the parameters listed in Table 2 for this design example.

Table 2. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE
Device DRV5057-Q1
VCC 5V
Cylinder: 4.7625 mm diameter, 12.7 mm thick,
Magnet
Neodymium N52, Br = 1480 mT
Travel distance 5 mm
Desired accuracy < 0.1 mm

8.2.2.2 Detailed Design Procedure

As illustrated in Figure 20, this design example consists of a mechanical component that moves back and forth,
an embedded magnet with the south pole facing the printed-circuit board, and a DRV5057-Q1. The DRV5057-Q1
outputs a PWM that describes the precise position of the component. The component must not contain
ferromagnetic materials such as iron, nickel, and cobalt because these materials change the magnetic flux
density at the sensor.
When designing a linear magnetic sensing system, always consider these three variables: the magnet, sensing
distance, and the range of the sensor. Select the DRV5057-Q1 with the highest sensitivity possible based on the
system distance requirements without railing the sensor PWM output. To determine the magnetic flux density the
sensor receives at the various positions of the magnet, use a magnetic field calculator or simulation software,
referring to magnet specifications, and testing.

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Magnets are made from various ferromagnetic materials that have tradeoffs in cost, drift with temperature,
absolute maximum temperature ratings, remanence or residual induction (Br), and coercivity (Hc). The Br and the
dimensions of a magnet determine the magnetic flux density (B) produced in 3-dimensional space. For simple
magnet shapes, such as rectangular blocks and cylinders, there are simple equations that solve B at a given
distance centered with the magnet. Figure 21 shows diagrams for Equation 4 and Equation 5.

Thickness Thickness
Width

Distance Distance
S N
Length S N B B
Diameter

Figure 21. Rectangular Block and Cylinder Magnets

Use Equation 4 for the rectangular block shown in Figure 21:

B=
Br
Π( ( arctan
2D 4D + W + L
WL
2 2 2 ) ± arctan ( WL
2(D + T) 4(D + T)2 + W2 + L2
)) (4)
Use Equation 5 for the cylinder illustrated in Figure 21:

B=
Br
2 ( D+T
2
(0.5C) + (D + T) 2
±
D
(0.5C)2 + D2
)
where:
• W is width
• L is length
• T is thickness (the direction of magnetization)
• D is distance
• C is diameter (5)
This example uses a cylinder magnet; therefore, Equation 5 can be used to create a lookup table for the
distances from a specific magnet based on a magnetic field strength. Figure 22 shows a magnetic field from 0
mm to 16 mm with the magnet defined in Table 2 as C = 4.7625 mm, T = 12.7 mm, and Br = 1480 mT.
200
180
160
140
120
B (mT)

100
80
60
40
20
0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Distance (mm) D009

Figure 22. Magnetic Field vs Distance

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In this setup, each gain version of the sensor produces the corresponding duty cycle shown in Figure 23 for
0 mm to 16 mm.
100
DRV5057A1
95 DRV5057A2
90 DRV5057A3
DRV5057A4
85

Duty Cycle (%)

80
75
70
65
60
55
50
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Distance (mm) D008

Figure 23. %D vs South Pole Distance (All Gains)

With a desired 5-mm movement swing, select the DRV5057-Q1 with the largest possible sensitivity that fits the
system requirements for the magnet distance to the sensor. Assume that for this example, because of
mechanical restrictions, the magnet at the nearest point to the sensor must be selected to be within 5 mm to
8 mm. The largest sensitivity option (A1) does not work in this situation because the device output is railed at the
farthest allowed distance of 8 mm. The A2 version is not railed at this point, and is therefore the sensor selected
for this example. Choose the closest point of the magnet to the sensor to be a distance that allows the magnet to
get as close to the sensor as possible without railing but stays within the selectable 5-mm to 8-mm allowed
range. Because the A2 version rails at approximately 6 mm, choose a closest distance of 6.5 mm to allow for a
little bit of margin. With this choice, Figure 24 shows the %D response at the sensor across the full movement
range.
100
DRV5057A2
95
90
85
Duty Cycle (%)

80
75
70
65
60
55
50
6.5 7 7.5 8 8.5 9 9.5 10 10.5 11 11.5
Distance (mm) D007

Figure 24. %D vs South Pole Distance (Gain A2)

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The magnetic field strength is calculated using Equation 6, where a negative number represents the opposite
pole (in this example a south pole is over the sensor, causing the results to be a positive number).
%D 50
B
Gain (6)
For example, if the A2 version of the DRV5057-Q1 measured a duty cycle of %D = 74.6% using Equation 1 ,
then the magnetic field strength present at the sensor is (74.6 – 50) / 1 = 24.6 mT.
Using the lookup table that was used to create the plot in Figure 22, the distance from the magnet at 24.6 mT is
D ≈ 8.2 mm.
For more accurate results, the lookup table can be calibrated along the movement path of the magnet.
Additionally, instead of using the calibrated lookup table for each measurement, consider using a best-fit
polynomial equation from the curve for the desired movement range to calculate D in terms of B.
The curve in Figure 24 is not linear; therefore, the achievable accuracy varies for each position along the
movement path. The location with the worst accuracy is where there is the smallest change in output for a given
amount of movement, which in this example is where the magnet is farthest from the sensor (at 11.5 mm).
Determine if the desired accuracy is met by checking if the needed %DLSB at this location for the specified
accuracy is greater than the noise level (PWM jitter) of 0.1%D. Thus, with a desired accuracy of 0.1 mm, the
needed %DLSB is the change in %D between 11.4 mm and 11.5 mm. Using the lookup table to find B and then
solving for %D in Equation 6, at 11.5 mm, B = 11.815 mT (which equates to 61.815%D), and at 11.4 mm B =
12.048 mT (which equates to 62.048%D). The difference in %D between these two points is 62.048 – 61.815 =
0.223%DLSB. This value is larger than the 0.1%D jitter, so the desired accuracy can be met as long as a %DLSB
is selected that is equal to or less than 0.223 using Equation 2.

Copyright © 2019, Texas Instruments Incorporated Submit Documentation Feedback 19

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DRV5057-Q1
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8.3 What to Do and What Not to Do

The Hall element is sensitive to magnetic fields that are perpendicular to the top of the package. Therefore, to
correctly detect the magnetic field, make sure to use the correct magnet orientation for the sensor. Figure 25
shows correct and incorrect orientation.

CORRECT

N S

S N

N S

INCORRECT

N S

Figure 25. Correct and Incorrect Magnet Orientation

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9 Power Supply Recommendations

Use a decoupling capacitor placed close to the device to provide local energy with minimal inductance. Use a
ceramic capacitor with a value of at least 0.01 µF.

10 Layout

10.1 Layout Guidelines

Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed-circuit boards, which makes placing the magnet on the
opposite side possible.

10.2 Layout Example

VCC

GND

OUT

Figure 26. Layout Example

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DRV5057-Q1
SBAS645 – AUGUST 2019 www.ti.com

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation
For related documentation see the following:
• Texas Instruments, Using Linear Hall Effect Sensors to Measure Angle tech note
• Texas Instruments, Incremental Rotary Encoder Design Considerations tech note
• Texas Instruments, DRV5055 Ratiometric Linear Hall Effect Sensor data sheet

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

22 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated

Product Folder Links: DRV5057-Q1

 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

DRV5057A1EDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-3-260C-168 HR -40 to 150 57A1Z

DRV5057A2EDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-3-260C-168 HR -40 to 150 57A2Z

DRV5057A3EDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-3-260C-168 HR -40 to 150 57A3Z

DRV5057A4EDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-3-260C-168 HR -40 to 150 57A4Z

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF DRV5057-Q1 :

• Catalog: DRV5057

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 4-Aug-2020

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV5057A1EDBZRQ1 SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5057A2EDBZRQ1 SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5057A3EDBZRQ1 SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5057A4EDBZRQ1 SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 4-Aug-2020

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DRV5057A1EDBZRQ1 SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5057A2EDBZRQ1 SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5057A3EDBZRQ1 SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5057A4EDBZRQ1 SOT-23 DBZ 3 3000 213.0 191.0 35.0

Pack Materials-Page 2
4203227/C
 PACKAGE OUTLINE
DBZ0003A SCALE 4.000
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

2.64 C
2.10
1.12 MAX
1.4
B A
1.2 0.1 C
PIN 1
INDEX AREA

0.95
3.04
1.9 2.80
3

2
0.5
3X
0.3
0.10
0.2 C A B (0.95) TYP
0.01

0.25
GAGE PLANE 0.20
TYP
0.08

0.6
TYP SEATING PLANE
0 -8 TYP 0.2

4214838/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.

www.ti.com
 EXAMPLE BOARD LAYOUT
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

PKG
3X (1.3)
1

3X (0.6)

SYMM

3
2X (0.95)

(R0.05) TYP
(2.1)

LAND PATTERN EXAMPLE

SCALE:15X

SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4214838/C 04/2017

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

PKG

3X (1.3)
1

3X (0.6)

SYMM
3
2X(0.95)

(R0.05) TYP
(2.1)

SOLDER PASTE EXAMPLE

BASED ON 0.125 THICK STENCIL
SCALE:15X

4214838/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.

www.ti.com
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