EC Classification ENGLISH 9 2018 V2

The document provides a classification overview for PCB design patterns and drill sizes at Eurocircuits. It defines 10 pattern classes based on minimum track widths, spacings and hole sizes, with class 1 being the smallest dimensions. It also defines 7 drill classes based on minimum tool size, with class A allowing the smallest holes. The smallest dimension value determines the class. Thicker copper layers and boards allow for larger minimum sizes. Services include standard, flexible, and high frequency PCB prototypes.

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EC Classification ENGLISH 9 2018 V2

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Eurocircuits - PCB Design Classification Overview

Pattern Class class 3 class 4 class 5 class 6 class 7 class 8 class 9 class 10
Service N+P+S+B+RF+SF+I N+P+S+B+RF+SF+I N+P+S+B+RF+SF+I N+P+S+B+RF+SF+I S+RF S+RF S+RF -
OTW 0.250 10 0.200 8 0.175 7 0.150 6 0.125 5 0.100 4 0.090 3.5 <0.090 <3.5 mm-mil
OTT-OTP-OPP 0.250 10 0.200 8 0.175 7 0.150 6 0.125 5 0.100 4 0.090 3.5 <0.090 <3.5 mm-mil
OAR 0.200 8 0.150 6 0.150 6 0.125 5 0.125 5 0.100 4 0.100 4 <0.100 <4 mm-mil
ITW 0.250 10 0.200 8 0.175 7 0.150 6 0.125 5 0.100 4 0.090 3.5 <0.090 <3.5 mm-mil
ITT-ITP-IPP 0.250 10 0.200 8 0.175 7 0.150 6 0.125 5 0.100 4 0.090 3.5 <0.090 <3.5 mm-mil
IAR 0.200 8 0.150 6 0.150 6 0.125 5 0.125 5 0.125 5 0.125 5 <0.125 <5 mm-mil
IPI 0.275 11 0.225 9 0.225 9 0.200 8 0.200 8 0.200 8 0.200 8 <0.200 <8 mm-mil

The smallest value (OTW, OTT-OTP-OPP, OAR, ITW, ITT-ITP-IPP, IAR, IPI) determines the Pattern Class of the board

Base Cu min Pattern Values

Base Cu OL OTT-OTP-OPP OTW
12µm ⅓oz 0.090 3.5 0.090 3.5 mm-mil
18µm ½oz 0.100 4 0.090 3.5 mm-mil
35µm 1oz 0.125 5 0.125 5 mm-mil
70µm 2oz 0.200 8 0.200 8 mm-mil
105µm 3oz 0.250 10 0.250 10 mm-mil
Base Cu IL ITT-ITP-IPP ITW
12µm ⅓oz 0.090 3.5 0.090 3.5 mm-mil Preceding letters O and I stand for Outer- and Inner layer
18µm ½oz 0.100 4 0.090 3.5 mm-mil Example: OTW = Outer layer Track Width
35µm 1oz 0.125 5 0.125 5 mm-mil
70µm 2oz 0.200 8 0.200 8 mm-mil OAR : smallest OAR (Outer layer Annular Ring = 1/2 (Outer layer pad diameter - TOOLSIZE))
105µm 3oz 0.250 10 0.250 10 mm-mil IAR : smallest IAR (Inner layer Annular Ring = 1/2 (Inner layer pad diameter - TOOLSIZE))
IPI (Inner layer Pad Insulation) : Clearance between edge TOOLSIZE of any unconnected hole(PTH/NPTH) and any nearest copper
Smallest TOOLSIZE = Finished Hole Size + 0.10mm/4mil for Plated Through Holes
+ 0.00mm/0mil for Non Plated Through Holes

Drill Class class A class B class C class D class E class F

Service N+P+S+B+RF+SF+I N+P+S+B+RF+SF N+P+S+B+RF+SF S+RF S+RF -
min TOOLSIZE 0.60 0.026 0.45 0.018 0.35 0.014 0.25 0.010 0.20 0.008 <0.20 <0.008 mm-inch
Corresponding finished holes sizes
PTH 0.50 0.022 0.35 0.014 0.25 0.010 0.15 0.006 0.10 0.004 <0.10 <0.004 mm-inch
NPTH 0.60 0.026 0.45 0.018 0.35 0.014 0.25 0.010 0.20 0.008 <0.20 <0.008 mm-inch
The smallest value (TOOLSIZE) determines the Drill Class of the PCB

Max. PCB Thickness to Drill Class 3.20 0.125 3.20 0.125 2.40 0.093 2.00 0.079 1.60 0.062 mm-inch Aspect ratio is 1 / 8
Note A: VIA holes are Plated Through Holes, default defined as <=0.45mm (18mil) for all services or <= as defined by the customer in the order details.
VIA holes have a maximum negative tolerance of 0.30mm (12mil)
Note B: This classification table can only be put into praxis on PCB designs that have a Plating Index of 0.40 or higher. This is calculated in the PCB Visualizer analysis and displayed in the PCB Visualizer order details.

Services Index : N = NAKED proto P = PCB proto S = STANDARD pool B = BINDI pool RF = RF pool SF = SEMI-FLEX pool I = IMS pool