HD74LS00

Quadruple 2-Input NAND Gates

REJ03D0387–0200
Rev.2.00
Feb.18.2005

Features
• Ordering Information

Package Code Package Taping Abbreviation

Part Name Package Type
(Previous Code) Abbreviation (Quantity)
PRDP0014AB-B
HD74LS00P DILP-14 pin P —
(DP-14AV)
PRSP0014DF-B
HD74LS00FPEL SOP-14 pin (JEITA) FP EL (2,000 pcs/reel)
(FP-14DAV)
PRSP0014DE-A
HD74LS00RPEL SOP-14 pin (JEDEC) RP EL (2,500 pcs/reel)
(FP-14DNV)
Note: Please consult the sales office for the above package availability.

Pin Arrangement

1A 1 14 VCC

1B 2 13 4B

1Y 3 12 4A

2A 4 11 4Y

2B 5 10 3B

2Y 6 9 3A

GND 7 8 3Y

(Top view)

Rev.2.00, Feb.18.2005, page 1 of 5

HD74LS00

Circuit Schematic (1/4)

VCC
8k 75

20k

Inputs
A 4.5k Output
B Y

1.5k 3k

GND

Absolute Maximum Ratings

Item Symbol Ratings Unit
Supply voltage VCC Note 7 V
Input voltage VIN 7 V
Power dissipation PT 400 mW
Storage temperature Tstg –65 to +150 °C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.

Recommended Operating Conditions

Item Symbol Min Typ Max Unit
Supply voltage VCC 4.75 5.00 5.25 V
IOH — — –400 µA
Output current
IOL — — 8 mA
Operating temperature Topr –20 25 75 °C

Rev.2.00, Feb.18.2005, page 2 of 5

HD74LS00

Electrical Characteristics
(Ta = –20 to +75 °C)
Item Symbol min. typ.* max. Unit Condition
VIH 2.0 — — V
Input voltage
VIL — — 0.8 V
VOH 2.7 — — V VCC = 4.75 V, VIL = 0.8 V, IOH = –400 µA
Output voltage — — 0.5 IOL = 8 mA
VOL V VCC = 4.75 V, VIH = 2 V
— — 0.4 IOL = 4 mA
IIH — — 20 µA VCC = 5.25 V, VI = 2.7 V
Input current IIL — — –0.4 mA VCC = 5.25 V, VI = 0.4 V
II — — 0.1 mA VCC = 5.25 V, VI = 7 V
Short-circuit output
IOS –20 — –100 mA VCC = 5.25 V
current
ICCH — 0.8 1.6 mA VCC = 5.25 V
Supply current
ICCL — 2.4 4.4 mA VCC = 5.25 V
Input clamp voltage VIK — — –1.5 V VCC = 4.75 V, IIN = –18 mA
Note: * VCC = 5 V, Ta = 25°C

Switching Characteristics
(VCC = 5 V, Ta = 25°C)
Item Symbol min. typ. max. Unit Condition
tPLH — 9 15 ns
Propagation delay time CL = 15 pF, RL = 2 kΩ
tPHL — 10 15 ns
Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D0005-
0100)".

Rev.2.00, Feb.18.2005, page 3 of 5

HD74LS00

Package Dimensions
JEITA Package Code RENESAS Code Previous Code MASS[Typ.]
P-DIP14-6.3x19.2-2.54 PRDP0014AB-B DP-14AV 0.97g

14 8

E
1 7
b3

Reference Dimension in Millimeters

Symbol
Min Nom Max

A
e1 7.62
A1

D 19.2 20.32
E 6.3 7.4
A 5.06
L

A1 0.51
bp 0.40 0.48 0.56
e bp θ c b3 1.30
c 0.19 0.25 0.31
e1
θ 0° 15°
e 2.29 2.54 2.79
Z 2.39
( Ni/Pd/Au plating ) L 2.54

JEITA Package Code RENESAS Code Previous Code MASS[Typ.]

P-SOP14-5.5x10.06-1.27 PRSP0014DF-B FP-14DAV 0.23g

NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
*1 DO NOT INCLUDE MOLD FLASH.
D F 2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
14 8

bp
HE
E

c
*2

Index mark Dimension in Millimeters

Reference
Symbol
Min Nom Max
Terminal cross section D 10.06 10.5

( Ni/Pd/Au plating ) E 5.50

A2
1 7
A1 0.00 0.10 0.20
e *3
bp
Z
x M A 2.20
L1 bp 0.34 0.40 0.46
b1
c 0.15 0.20 0.25
c 1
A

θ 0° 8°
HE 7.50 7.80 8.00
θ e 1.27
A1

y L x 0.12
y 0.15
Detail F Z 1.42
L 0.50 0.70 0.90
L 1 1.15

Rev.2.00, Feb.18.2005, page 4 of 5

HD74LS00

JEITA Package Code RENESAS Code Previous Code MASS[Typ.]

P-SOP14-3.95x8.65-1.27 PRSP0014DE-A FP-14DNV 0.13g

NOTE)
*1
D F 1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
14 8 INCLUDE TRIM OFFSET.

bp

HE
E
Index mark

c
*2
Reference Dimension in Millimeters
Symbol
Min Nom Max
Terminal cross section D 8.65 9.05

( Ni/Pd/Au plating ) E 3.95

A2

1 7 A1 0.10 0.14 0.25

Z e *3
bp A 1.75
x M
bp 0.34 0.40 0.46
L1
b1
c 0.15 0.20 0.25
c 1

θ 0° 8°
A

HE 5.80 6.10 6.20

θ e 1.27

A1
L x 0.25

y y 0.15
Detail F Z 0.635
L 0.40 0.60 1.27
L 1 1.08

Rev.2.00, Feb.18.2005, page 5 of 5