MCP1642B/D

1.8A Input Current Switch, 1 MHz Low-Voltage Start-Up

Synchronous Boost Regulator

Features General Description

• Up to 96% Typical Efficiency The MCP1642B/D devices are compact,
• 1.8A Typical Peak Input Current Limit: high-efficiency, fixed-frequency, synchronous step-up
- IOUT > 175 mA @ 1.2V VIN, 3.3V VOUT DC-DC converters. This family of devices provides an
easy-to-use power supply solution for applications
- IOUT > 600 mA @ 2.4V VIN, 3.3V VOUT
powered by either one-cell, two-cell, or three-cell
- IOUT > 800 mA @ 3.3V VIN, 5.0V VOUT alkaline, Ultimate Lithium, NiCd, NiMH, one-cell Li-Ion
- IOUT > 1A @ VIN > 3.6V, 5.0V VOUT or Li-Polymer batteries.
• Low Start-Up Voltage: 0.65V, typical 3.3V VOUT Low-voltage technology allows the regulator to start-up
@ 1 mA without high inrush current or output voltage overshoot
• Low Operating Input Voltage: 0.35V, typical 3.3V from a low voltage input. High efficiency is
VOUT @ 1 mA accomplished by integrating the low-resistance
• Output Voltage Range: N-Channel Boost switch and synchronous P-Channel
switch. All compensation and protection circuitry are
- Reference Voltage, VFB = 1.21V
integrated to minimize the number of external
- 1.8V to 5.5V for the adjustable device option components. An open-drain Power Good output is
- 1.8V, 3.0V, 3.3V and 5.0V for fixed VOUT provided to indicate when the output voltage is within
options 10% of regulation and facilitates the interface with an
• Maximum Input Voltage  VOUT < 5.5V MCU. For standby applications, MCP1642B provides a
• PWM Operation: 1 MHz “true output disconnect” from input to output while in
- Low Noise, Anti-Ringing Control shutdown (EN = GND). An additional device option
(MCP1642D) is available and connects “input to output
• Power Good Open-Drain Output
bypass” while in shutdown. Both options consume less
• Internal Synchronous Rectifier than 1 µA of input current.
• Internal Compensation For the adjustable (ADJ) device options, the output
• Inrush Current Limiting and Internal Soft-Start voltage is set by a small external resistor divider. Fixed
• Selectable, Logic-Controlled Shutdown States: VOUT device options do not require external divider
- True Load Disconnect Option (MCP1642B) resistors. Two package options, 8-lead MSOP and 8-
lead 2x3 DFN, are available.
- Input-to-Output Bypass Option (MCP1642D)
• Shutdown Current (All States): 1 µA Package Types
• Overtemperature Protection MCP1642B/D-xx MCP1642B/D-xx
• Available Packages: MSOP 2x3 DFN*
- 8-Lead MSOP EN 1 8 VIN
EN 1 8 VIN
- 8-Lead 2x3 DFN
NC 2 7 SGND NC 2 EP 7 SGND
Applications PG 3 PG 3 9 6 PGND
6 PGND
• One, Two and Three-Cell Alkaline, Lithium VOUT 4 5 SW
Ultimate and NiMH/NiCd Portable Products VOUT 4 5 SW
• Single-Cell Li-Ion to 5V Converters MCP1642B/D-ADJ MCP1642B/D-ADJ
• PIC® MCU Power MSOP 2x3 DFN*
• USB Emergency Backup Charger from Batteries EN 1 8 VIN
EN 1 8 VIN
• Personal Medical Products
VFB 2 7 SGND VFB 2 EP 7 SGND
• Wireless Sensors
PG 3 6 PGND PG 3 9 6 PGND
• Hand-Held Instruments
• GPS Receivers VOUT 4 5 SW
VOUT 4 5 SW
• +3.3V to +5.0V Distributed Power Supply
* Includes Exposed Thermal Pad (EP); see Table 3-1.

 2014 Microchip Technology Inc. DS20005253A-page 1

MCP1642B/D
Typical Application
L1
4.7 µH

CIN VOUT
4.7...10 µF SW 3.3V
VIN= 0.9 to 1.6V VOUT
VIN
+ COUT
MCP1642B-33
ALKALINE

NC 4.7...10 µF
PG

EN
- GND
ON
OFF
L
4.7 µH

VOUT
CIN SW 5.0V
4.7...10 µF VOUT
VIN= 1.8 to 3.2V VIN RTOP
MCP1642D-ADJ 976 k COUT
+
ALKALINE

VFB 4.7...10 µF
RBOT RPG
309 k 1 M
EN
-
ON
+ OFF PG
ALKALINE

®
GND
From PIC MCU I/O To PIC MCU I/O

100
90
VIN = 1.2V, VOUT = 3.3V
80
Efficiency (%)

70
VIN = 2.5V, VOUT = 5.0V
60
50
40
30
20
10
0
1 10 100 1000
IOUT (mA)

DS20005253A-page 2  2014 Microchip Technology Inc.

 MCP1642B/D
1.0 ELECTRICAL † Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
CHARACTERISTICS This is a stress rating only and functional operation of
Absolute Maximum Ratings † the device at those or any other conditions above those
indicated in the operational sections of this
EN, FB, VIN, VSW, VOUT – GND .......................... +6.5V specification is not intended. Exposure to maximum
EN, FB ......<maximum of VOUT or VIN > (GND – 0.3V) rating conditions for extended periods may affect
Output Short-Circuit Current ...................... Continuous device reliability.
Output Current Bypass Mode........................... 800 mA
Power Dissipation ............................ Internally Limited
Storage Temperature ..........................-65°C to +150°C
Ambient Temp. with Power Applied.......-40°C to +85°C
Operating Junction Temperature.........-40°C to +125°C
ESD Protection On All Pins:
HBM........................................................ 4 kV
MM......................................................... 300V

DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Input Characteristics
Minimum Start-Up Voltage VIN — 0.65 0.8 V Note 1
— 0.9 1.8 V MCP1642B/D-50, Note 1
Minimum Input Voltage VIN — 0.35 — V Note 1, Note 5
After Start-Up — 0.5 — V Note 1, Note 5, MCP1642B/D-50
Output Voltage Adjust. VOUT 1.8 — 5.5 V VOUT  VIN (MCP1642B/D-ADJ);
Range Note 2
(MCP1642B/D-ADJ)
Output Voltage VOUT — 1.8 — V VIN < 1.8V, MCP1642B/D-18,
(MCP1642B/D-XX) Note 2
— 3.0 — V VIN < 3.0V, MCP1642B/D-30,
Note 2
— 3.3 — V VIN < 3.3V, MCP1642B/D-33,
Note 2
— 5.0 — V VIN < 5.0V, MCP1642B/D-50,
Note 2
Maximum Output Current IOUT — 175 — mA 1.2V VIN, 1.8V VOUT, Note 5
— 300 — mA 1.5V VIN, 3.3V VOUT, Note 5
— 800 — mA 3.3V VIN, 5.0V VOUT, Note 5
Feedback Voltage VFB 1.173 1.21 1.247 V
Feedback Input IVFB — 1.0 — nA Note 5
Bias Current
Note 1: Resistive load, 1 mA.
2: For VIN > VOUT, VOUT will not remain in regulation.
3: IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V
output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent
current can be estimated by: (IQPWM * (VOUT/VIN)).
4: 220 resistive load, 3.3V VOUT (15 mA).
5: Determined by characterization, not production tested.

 2014 Microchip Technology Inc. DS20005253A-page 3

MCP1642B/D
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Quiescent Current – IQPWM — 400 500 µA Measured at VOUT, EN = VIN,
PWM Mode IOUT = 0 mA, Note 3
Quiescent Current – IQSHDN — 1 — µA VOUT = EN = GND, IOUT = 0 mA
Shutdown includes N-Channel and
P-Channel Switch Leakage
NMOS Switch Leakage INLK — 0.5 — µA VIN = VSW = 5V,
VOUT = 5.5V,
VEN = VFB = GND
PMOS Switch Leakage IPLK — 0.2 — µA VIN = VSW = GND,
VOUT = 5.5V
NMOS Switch RDS(ON)N — 0.15 —  VIN = 3.3V, ISW = 250 mA, Note 5
ON Resistance
PMOS Switch RDS(ON)P — 0.3 —  VIN = 3.3V, ISW = 250 mA, Note 5
ON Resistance
NMOS Peak IN(MAX) — 1.8 — A Note 5
Switch Current Limit
Accuracy VFB% -3 — 3 % MCP1642B/D-ADJ, VIN = 1.2V
VOUT% -3 — 3 % MCP1642B/D-18, VIN = 1.2V
-3 — 3 % MCP1642B/D-30, VIN = 1.2V
-3 — 3 % MCP1642B/D-33, VIN = 1.2V
-3 — 3 % MCP1642B/D-50, VIN = 2.5V
Line Regulation VFB/VFB) -0.5 0.01 0.5 %/V MCP1642B/D-ADJ,
/VIN| VIN = 1.5V to 3.0V, IOUT = 25 mA
VOUT/VOUT) -0.5 0.05 0.5 %/V MCP1642B/D-18,
/VIN| VIN = 1.0V to 1.5V, IOUT = 25 mA
-0.5 0.01 0.5 %/V MCP1642B/D-30,
VIN = 1.5V to 2.5V, IOUT = 25 mA
-0.5 0.01 0.5 %/V MCP1642B/D-33,
VIN = 1.5V to 3.0V, IOUT = 25 mA
-0.5 0.01 0.5 %/V MCP1642B/D-50,
VIN = 2.5V to 4.2V, IOUT = 25 mA
Load Regulation VFB/VFB| -1.5 0.05 1.5 % IOUT = 25 mA to 150 mA,
VIN = 1.5V
VOUT/VOUT| -1.5 0.1 1.5 % MCP1642B/D-18, VIN = 1.5V,
IOUT = 25 mA to 75 mA
-1.5 0.1 1.5 % MCP1642B/D-30, VIN = 1.5V,
IOUT = 25 mA to 125 mA
-1.5 0.1 1.5 % MCP1642B/D-33, VIN = 1.5V,
IOUT = 25 mA to 150 mA
— 0.5 — % MCP1642B/D-50, VIN = 3.0V,
IOUT = 25 mA to 500 mA, Note 5
Note 1: Resistive load, 1 mA.
2: For VIN > VOUT, VOUT will not remain in regulation.
3: IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V
output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent
current can be estimated by: (IQPWM * (VOUT/VIN)).
4: 220 resistive load, 3.3V VOUT (15 mA).
5: Determined by characterization, not production tested.

DS20005253A-page 4  2014 Microchip Technology Inc.

 MCP1642B/D
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Maximum Duty Cycle DCMAX — 90 — % Note 5
Switching Frequency fSW 0.85 1.0 1.15 MHz Note 5, IOUT = 65 mA,
for MCP1642B/D-50 VIN = 2.5V
EN Input Logic High VIH 75 — — % of VIN IOUT = 1 mA,
for MCP1642B/D-50 VIN = 2.5V
EN Input Logic Low VIL — — 20 % of VIN IOUT = 1 mA,
for MCP1642B/D-50 VIN = 2.5V
EN Input Leakage Current IENLK — 0.1 — µA VEN = 1.2V
Power Good Threshold PGTHF — 90 — % VFB Falling, Note 5
Power Good Hysteresis PGHYS — 3 — % Note 5
Power Good Output Low PGLOW — 0.4 — V ISINK = 5 mA, VFB = 0V, Note 5
Power Good Output Delay PGDELAY — 600 — µs Note 5
Power Good Output PGRES — 250 — µs Note 5
Response
Power Good Input Voltage VPG_VIN 0.9 — 5.5 V ISINK = 5 mA, VFB = 0V, Note 5
Operating Range
Power Good PGLEAK — 0.01 — µA VPG = 5.5V,
Leakage Current VOUT in Regulation, Note 5
Soft Start Time tSS — 550 — µs EN Low to High,
90% of VOUT, Note 4, Note 5
Thermal Shutdown TSD — 150 — C Note 5
Die Temperature
Die Temperature TSDHYS — 35 — C Note 5
Hysteresis
Note 1: Resistive load, 1 mA.
2: For VIN > VOUT, VOUT will not remain in regulation.
3: IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V
output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent
current can be estimated by: (IQPWM * (VOUT/VIN)).
4: 220 resistive load, 3.3V VOUT (15 mA).
5: Determined by characterization, not production tested.

TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Ambient Temperature TA -40 — +85 °C Steady State
Range
Storage Temperature Range TA -65 — +150 °C
Maximum Junction Temperature TJ — — +150 °C Transient
Package Thermal Resistances
Thermal Resistance, 8L-MSOP JA — 211 — °C/W
Thermal Resistance, 8L-2x3 DFN JA — 68 — °C/W

 2014 Microchip Technology Inc. DS20005253A-page 5

MCP1642B/D
NOTES:

DS20005253A-page 6  2014 Microchip Technology Inc.

 MCP1642B/D
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA,
TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package).

100
500 VOUT = 2.0V
VIN = 1.2V 90
475
80
IQ PWM Mode (µA)

450 VIN = 1.6V

Efficiency (%)
70
VIN = 1.2V
425 60
VOUT = 5.0V
400 50
40
375 VOUT = 3.3V
30
350 VOUT = 2.0V
20
325 10
300 0
-40 -25 -10 5 20 35 50 65 80 0.1 1 10 100 1000
Ambient Temperature (°C) IOUT (mA)

FIGURE 2-1: VOUT IQPWM vs. Ambient FIGURE 2-4: 2.0V VOUT Mode Efficiency
Temperature. vs. IOUT.

3.314 100
IOUT = 50 mA VIN = 1.8V VOUT = 3.3V
90
VIN = 2.5V
3.312 80
VIN = 1.2V
Efficiency (%)

70
VIN = 1.2V
VOUT (V)

3.310 60
50
3.308 40
30
3.306 20
10
3.304 0
-40 -25 -10 5 20 35 50 65 80 0.1 1 10 100 1000
Ambient Temperature (°C) IOUT (mA)

FIGURE 2-2: 3.3V VOUT vs. Ambient FIGURE 2-5: 3.3V VOUT Mode Efficiency
Temperature. vs. IOUT.

5.010 100
VOUT = 5.0V
IOUT = 50 mA 90
5.005 80
VIN = 3.6V
Efficiency (%)

70
5.000 VIN = 2.5V VIN = 2.5V
VOUT (V)

60
4.995 50
40
4.990
30
4.985 VIN = 1.8V 20
10
4.980 0
-40 -25 -10 5 20 35 50 65 80 0.1 1 10 100 1000
Ambient Temperature (°C) IOUT (mA)

FIGURE 2-3: 5.0V VOUT vs. Ambient FIGURE 2-6: 5.0V VOUT Mode Efficiency
Temperature. vs. IOUT.

 2014 Microchip Technology Inc. DS20005253A-page 7

MCP1642B/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA,
TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package).

1400 1.50
VOUT = 5.0V
1200 VOUT = 3.3V 1.30
1000
1.10
IOUT (mA)

VIN (V)
800 VOUT = 5.0V
0.90
600 Start-up
VOUT = 2.0V
0.70 Shutdown
400

200
TA = +25°C 0.50
TA = +85°C

0 0.30
0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 0 20 40 60 80 100
VIN (V) IOUT (mA)

FIGURE 2-7: Maximum IOUT vs. VIN. FIGURE 2-10: 5.0V VOUT Minimum
Start-Up and Shutdown VIN into Resistive Load
vs. IOUT.

3.304 1004

Switching Frequency (kHz)

IOUT = 15 mA VOUT = 3.3V
3.302
TA = 25°C
1000
3.300
VOUT (V)

3.298
996
3.296
TA = 85°C
3.294 992
TA = -40°C
3.292

3.290 988
0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 -40 -25 -10 5 20 35 50 65 80
VIN (V) Ambient Temperature (°C)

FIGURE 2-8: 3.3V VOUT vs. VIN. FIGURE 2-11: fSW vs. Ambient
Temperature.

0.70 4.5
VOUT = 3.3V VOUT = 5.0V
0.65 4
Start-up
0.60 3.5
0.55 3 VOUT = 3.3V
VIN (V)

VIN (V)

2.5
0.50
Shutdown 2 VOUT = 2.0V
0.45
1.5
0.40
1
0.35 0.5
0.30 0
0 20 40 60 80 100 0 5 10 15 20 25
IOUT (mA) IOUT (mA)

FIGURE 2-9: 3.3V VOUT Minimum FIGURE 2-12: PWM Pulse-Skipping Mode
Start-Up and Shutdown VIN into Resistive Load Threshold vs. IOUT.
vs. IOUT.

DS20005253A-page 8  2014 Microchip Technology Inc.

 MCP1642B/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA,
TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package).

100 VOUT IOUT = 100 mA

20 mV/div
AC coupled
10
IIN (mA)

VOUT = 5.0V
VOUT = 3.3V
1 VSW
2V/div
VOUT = 2.0V

0.1 IL
0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 200 mA/div
VIN (V) 1 µs/div

FIGURE 2-13: Average of No Load Input FIGURE 2-16: MCP1642B/D High Load
Current vs. VIN. PWM Mode Waveforms.

2.5 0.25
IOUT = 15 mA
Switch Resistance (:)

2 0.2

N - Channel
1.5 0.15
VOUT
1V/div VIN
1 0.1
1V/div
P - Channel
0.5 0.05
VEN
1V/div
0 0
1 1.4 1.8 2.2 2.6 3 3.4 3.8 4.2 200 µs/div
> VIN or VOUT

FIGURE 2-14: N-Channel and P-Channel FIGURE 2-17: 3.3V Start-Up After Enable.
RDSON vs. > of VIN or VOUT.

VOUT IOUT = 1 mA I OUT = 15 mA

20 mV/div
AC coupled
VOUT
2V/div
VIN
1V/div

VSW
1V/div IL
200 mA/div
IL
100 mA/div 1 µs/div 200 µs/div

FIGURE 2-15: MCP1642B/D 3.3V VOUT FIGURE 2-18: 3.3V Start-Up When
Light Load PWM Mode Waveforms. VIN = VENABLE.

 2014 Microchip Technology Inc. DS20005253A-page 9

MCP1642B/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA,
TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package).

VOUT
100 mV/div
AC coupled

IOUT
100 mA/div Step from 20 mA to 150 mA

400 µs/div

FIGURE 2-19: MCP1642B 3.3V VOUT Load

Transient Waveforms.

VOUT
100 mV/div
AC coupled

VIN
1V/div

Step from 1.2V to 2.4V

400 µs/div

FIGURE 2-20: 3.3V VOUT Line Transient

Waveforms.

DS20005253A-page 10  2014 Microchip Technology Inc.

 MCP1642B/D
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

MCP1642B/D-XX MCP1642B/D-ADJ
MSOP, 2x3 DFN MSOP, 2x3 DFN Symbol Description

1 1 EN Enable pin. Logic high enables operation. Do not allow this pin
to float.
2 — NC Not Connected.
— 2 VFB Reference Voltage pin. Connect VFB to an external resistor
divider to set the output voltage (for fixed VOUT options, this pin
is not connected).
3 3 PG Open-Drain Power Good pin. Indicates when the output voltage
is within regulation.
4 4 VOUT Boost Converter Output.
5 5 SW Boost and Rectifier Switch input. Connect boost inductor
between SW and VIN.
6 6 PGND Power Ground reference.
7 7 SGND Signal Ground reference.
8 8 VIN Input supply voltage. Local bypass capacitor required.
9 9 EP Exposed Thermal Pad (2x3 DFN only).

3.1 Enable Pin (EN) 3.6 Power Ground Pin (PGND)

The EN pin is a logic-level input used to enable or The power ground pin is used as a return for the
disable device switching and lower quiescent current high-current N-Channel switch. The PGND and SGND
while disabled. A logic high (>75% of VIN) will enable pins are connected externally.
the regulator output. A logic low (<20% of VIN) will
3.7 Signal Ground Pin (SGND)
ensure that the regulator is disabled.
The signal ground pin is used as a return for the
3.2 Feedback Voltage Pin (VFB) integrated VREF and error amplifier. The SGND and
power ground (PGND) pins are connected externally.
The VFB pin is used to provide output voltage regulation
by using a resistor divider for the ADJ device option. 3.8 Power Supply Input Voltage Pin
The typical feedback voltage will be 1.21V, with the (VIN)
output voltage in regulation. Connect the input voltage source to VIN. The input
3.3 Power Good Pin (PG) source should be decoupled to GND with a 4.7 µF
minimum capacitor.
The Power Good pin is an open-drain output which can
be tied to VOUT using a pull-up resistor. It turns low 3.9 Exposed Thermal Pad (EP)
when VOUT drops below 10% of its nominal value. There is no internal electrical connection between the
Exposed Thermal Pad (EP) and the SGND and PGND
3.4 Output Voltage Pin (VOUT) pins. They must be connected to the same electric
potential on the Printed Circuit Board (PCB).
The output voltage pin connects the integrated
P-Channel MOSFET to the output capacitor. The FB
voltage divider is also connected to the VOUT pin for
voltage regulation for the “ADJ” option.

3.5 Switch Node Pin (SW)

Connect the inductor from the input voltage to the SW
pin. The SW pin carries inductor current and can be as
high as 1.8A peak. The integrated N-Channel switch
drain and integrated P-Channel switch source are
internally connected at the SW node.

 2014 Microchip Technology Inc. DS20005253A-page 11

MCP1642B/D
NOTES:

DS20005253A-page 12  2014 Microchip Technology Inc.

 MCP1642B/D
4.0 DETAILED DESCRIPTION 4.1.3 ADJUSTABLE OUTPUT VOLTAGE
OPTION
4.1 Device Option Overview For the MCP1642B/D ADJ option, the output voltage is
adjustable with a resistor divider over a 1.8V minimum
The MCP1642B/D family of devices is capable of low
to 5.5V maximum range. The middle point of the
start-up voltage and delivers high efficiency over a wide
resistor divider connects to the VFB pin. High-value
load range for single-cell, two-cell, three-cell alkaline,
resistors are recommended to minimize quiescent
Ultimate Lithium, NiMH, NiCd and single-cell Li-Ion
current to keep efficiency high at light loads. The
battery inputs. A high level of integration lowers total
reference voltage is VFB = 1.21V.
system cost, eases implementation and reduces board
area. 4.1.4 FIXED OUTPUT VOLTAGE OPTION
The devices feature low start-up voltage, fixed and For the fixed output voltage option of the MCP1642B/D
adjustable output voltage, PWM mode operation, devices, the VFB pin is not connected. There is an
integrated synchronous switch, internal compensation, internal feedback divider which minimizes quiescent
low noise anti-ringing control, inrush current limit and current to keep efficiency high at light loads.
soft start.
The value of the internal divider is 815 k typical.
There are two shutdown options for the MCP1642B/D
family: The fixed set values are: 1.8V, 3.0V, 3.3V and 5.0V.

• True Output Disconnect mode (MCP1642B) TABLE 4-1: PART NUMBER SELECTION
• Input-to-Output Bypass mode (MCP1642D) BY SHUTDOWN OPTION

4.1.1 TRUE OUTPUT DISCONNECT True Output Input-to-Output

Part Number
Disconnect Bypass
MODE OPTION
The MCP1642B device incorporates a true output MCP1642B-ADJ X —
disconnect feature. With the EN pin pulled low, the (or -18; 30; 33; 50)
output of the MCP1642B is isolated or disconnected MCP1642D-ADJ — X
from the input by turning off the integrated P-Channel (or -18; 30; 33; 50)
switch and removing the switch bulk diode connection.
This removes the DC path that is typical in boost
converters, which allows the output to be disconnected
from the input. During this mode, less than 1 µA of
current is consumed from the input (battery). True
output disconnect does not discharge the output.

4.1.2 INPUT-TO-OUTPUT BYPASS MODE

OPTION
The MCP1642D device incorporates the
Input-to-Output Bypass shutdown option. With the EN
input pulled low, the output is connected to the input
using the internal P-Channel MOSFET. In this mode,
the current drawn from the input (battery) is less than
1 µA with no load. The Input-to-Output Bypass mode is
used when the input voltage is high enough for the load
to operate (e.g. PIC MCU operating in sleep mode).
When a higher regulated output voltage and load
current are necessary, the EN pin must be pulled high,
enabling the boost converter.

 2014 Microchip Technology Inc. DS20005253A-page 13

MCP1642B/D
4.2 Functional Description
The MCP1642B/D devices are compact,
high-efficiency, fixed-frequency, step-up DC-DC
converters that provide an easy-to-use power supply
solution for applications powered by either one-cell,
two-cell, or three-cell alkaline, Ultimate Lithium, NiCd,
or NiMH, or one-cell Li-Ion or Li-Polymer batteries.
Figure 4-1 depicts the functional block diagram of the
MCP1642B/D devices.

VOUT

Internal
VIN
Bias IZERO
Direction
Control

SW Soft-Start

Gate Drive 0V
OCREF ILIMIT
and
EN Shutdown
Control
Logic ISENSE

PGND

Slope
Oscillator S
Compensation

SGND

*
VOUT
PWM
Logic
EA
1.21V
VFB (NC)

0.9 x VREF
VFB

PG

* Available in Fixed Output option only. See

Section 4.2.4 “Fixed Output Voltage”.

FIGURE 4-1: MCP1642B/D Block Diagram.

DS20005253A-page 14  2014 Microchip Technology Inc.

 MCP1642B/D
4.2.1 LOW-VOLTAGE START-UP 4.2.3 ADJUSTABLE OUTPUT VOLTAGE
The MCP1642B/D devices are capable of starting from The MCP1642B/D-ADJ output voltage is adjustable
a low input voltage. Start-up voltage is typically 0.65V with a resistor divider over a 1.8V minimum to 5.5V
for a 3.3V output and 1 mA resistive load. maximum range. High-value resistors are
When enabled, the internal start-up logic turns the recommended to minimize quiescent current to keep
rectifying P-Channel switch on until the output efficiency high at light loads.
capacitor is charged to a value close to the input
4.2.4 FIXED OUTPUT VOLTAGE
voltage. During this period, the rectifying switch is
current-limited at approximately 125 mA, which limits MCP1642B/D-XX has the feedback divider included.
the start-up under heavy resistive load condition. After Four output values are available: 1.8V, 3.0V, 3.3V and
charging the output capacitor to the input voltage, the 5.0V. For this option, pin 2 remains unconnected.
device starts switching. A ring oscillator is only used The value of the internal divider is 815 k typical.
until the main RC oscillator has enough bias and is
ready. The device runs open-loop until the output rises 4.2.5 MAXIMUM OUTPUT VOLTAGE
enough to start the RC oscillator. During this time, the
The maximum output current of the devices is
boost switch current is limited to 50% of its nominal
dependent upon the input and output voltage. For
value. Once the output voltage reaches a high value,
example, to ensure a 200 mA load current for
normal closed-loop PWM operation is initiated.
VOUT = 3.3V, a typical value of 1.3V input voltage is
Then, during the end sequence of the start-up, the necessary. If an application is powered by one Li-Ion
MCP1642B/D devices charge an internal capacitor with battery (VIN from 3.0V to 4.2V), the typical load current
a very weak current source. The voltage on this the MCP1642B/D devices can deliver is close to
capacitor, in turn, slowly ramps the current limit of the 800 mA at 5.0V output (see Figure 2-7).
boost switch to its nominal value (1.8A typical). The
soft-start capacitor is completely discharged in the 4.2.6 ENABLE PIN
event of a commanded shutdown or a thermal
The enable pin is used to turn the boost converter on
shutdown.
and off. The enable threshold voltage varies with input
There is no undervoltage lockout feature for the voltage. To enable the boost converter, the EN voltage
MCP1642B/D devices. The devices will start up at the level must be greater than 75% of the VIN voltage. To
lowest possible voltage and run down to the lowest disable the boost converter, the EN voltage must be
possible voltage. For typical battery applications, less than 20% of the VIN voltage.
deeply discharged batteries may result in
"motor-boating" (emission of a low-frequency tone). 4.2.7 POWER GOOD OUTPUT PIN
The MCP1642B/D devices have an internal
4.2.2 PWM MODE OPERATION
comparator which is triggered when VOUT reaches 90%
In normal PWM operation, the MCP1642B/D devices of regulation. An open-drain transistor allows
operate as fixed-frequency, synchronous boost interfacing with an MCU. It can sink up to a few mA
converters. The switching frequency is internally from the power line at which the pull-up resistor is
maintained with a precision oscillator typically set to connected. See the DC Characteristics table for
1 MHz. At light loads, the MCP1642B/D devices begin details.
to skip pulses. Figure 2-12 represents the input voltage
versus load current for the pulse-skipping threshold in 4.2.8 INTERNAL BIAS
PWM mode. By operating in PWM-only mode, the out- The MCP1642B/D devices get their start-up bias from
put ripple remains low and the frequency is constant. VIN. Once the output exceeds the input, bias comes
Operating in fixed PWM mode results in low efficiency from the output. Therefore, once started, operation is
during light load operation but has low output ripple and completely independent of VIN. Operation is only
noise for the supplied load. limited by the output power level and the input source
Lossless current sensing converts the peak current series resistance. When started, the output will remain
signal to a voltage to sum with the internal slope in regulation down to 0.35V typical with 1 mA output
compensation. This summed signal is compared to the current for low source impedance inputs.
voltage error amplifier output to provide a peak current
control command for the PWM signal. The slope
compensation is adaptive to the input and output
voltage. Therefore, the converter provides the proper
amount of slope compensation to ensure stability, but is
not excessive, which causes a loss of phase margin.
The peak current limit is set to 1.8A typical.

 2014 Microchip Technology Inc. DS20005253A-page 15

MCP1642B/D
4.2.9 INTERNAL COMPENSATION
The error amplifier, with its associated compensation
network, completes the closed-loop system by
comparing the output voltage to a reference at the
input of the error amplifier, and feeding the amplified
and inverted signal to the control input of the inner
current loop. The compensation network provides
phase leads and lags at appropriate frequencies to
cancel excessive phase lags and leads of the power
circuit. All necessary compensation components and
slope compensation are integrated.

4.2.10 SHORT-CIRCUIT PROTECTION

Unlike most boost converters, the MCP1642B/D
devices allow their output to be shorted during normal
operation. The internal current limit and
overtemperature protection limit excessive stress and
protect the device during periods of short circuit,
overcurrent and overtemperature. While operating in
the Input-to-Output Bypass mode, the P-Channel
current limit is inhibited to minimize quiescent current.

4.2.11 LOW NOISE OPERATION

The MCP1642B/D devices integrate a low-noise
anti-ring switch that damps the oscillations typically
observed at the switch node of a boost converter when
operating in the Discontinuous Inductor Current mode.
This removes the high-frequency radiated noise.

4.2.12 OVERTEMPERATURE
PROTECTION
Overtemperature protection circuitry is integrated into
the MCP1642B/D devices. This circuitry monitors the
device junction temperature and shuts the device off if
the junction temperature exceeds the typical +150°C
threshold. If this threshold is exceeded, the device will
automatically restart when the junction temperature
drops by 35°C. The soft start is reset during an
overtemperature condition.

DS20005253A-page 16  2014 Microchip Technology Inc.

 MCP1642B/D
5.0 APPLICATION INFORMATION Overshoots and undershoots on pulsed load
applications are reduced by adding a zero in the
compensation loop. A small capacitance (for example,
5.1 Typical Applications
27 or 33 pF) in parallel with an upper feedback resistor
The MCP1642B/D synchronous boost regulators oper- will reduce output spikes. This small capacitance also
ate over a wide input and output voltage range. The attenuates the low-frequency component on the output
power efficiency is high for several decades of load ripple that might appear when the device supplies light
range. Output current capability increases with the loads (ranging from 75 to 150 mA) and on condition
input voltage and decreases with the increasing output that (VOUT – VIN) < 0.6V (see the application example
voltage. The maximum output current is based on the in Figure 6-1).
N-Channel peak current limit. Typical characterization
curves in this data sheet are presented to display the 5.2.1 VIN > VOUT SITUATION
typical output current capability. For VIN > VOUT, the output voltage will not remain in
regulation. VIN > VOUT is an unusual situation for a
5.2 Adjustable Output Voltage boost converter, and there is a common issue when
Calculations two alkaline cells (2 x 1.6V typical) are used to boost to
3.0V output. A minimum headroom of approximately
To calculate the resistor divider values for the 200 to 300 mV between VOUT and VIN must be
MCP1642B/D, the following equation can be used. ensured, unless a low frequency higher than the PWM
Where RTOP is connected to VOUT, RBOT is connected output ripple on VOUT is expected. This ripple and its
to GND and both are connected to the VFB input pin: frequency are VIN dependent.

EQUATION 5-1: 5.3 Power Good Output

V OUT
R TOP = R BOT   ------------- – 1 The Power Good output is meant to provide a method
 V FB  that gives information about the output state of the
device. The Power Good comparator is triggered when
VOUT reaches approximately 90% of regulation (on the
EXAMPLE 1: falling edge).
VOUT = 3.3V The PG pin is an open-drain output, which should be
connected to VOUT through an external pull-up resistor.
VFB = 1.21V
It is recommended to use a high-value resistor (to sink
RBOT = 309 k µA from output) in order to use less power while
RTOP = 533.7 k (standard value = 536 k) interfacing with an I/O PIC MCU port.
The Power Good block is internally supplied by the
EXAMPLE 2: maximum between the input and output voltage, and
VOUT = 5.0V the minimum voltage necessary is 0.9V. This is
important for applications in which the Power Good pin
VFB = 1.21V
is pulled-up to an external supply. If the output voltage
RBOT = 309 k is less than 0.9V (e.g., due to an overcurrent situation
RTOP = 967.9 k (standard value = 976 k) or an output short circuit, and also if the device is in
Shutdown - EN = GND), the input voltage has to be
There are some potential issues with higher-value
high enough to drive the Power Good circuitry.
resistors. For small surface-mount resistors,
environment contamination can create leakage paths Power Good delay time is measured between the time
that significantly change the resistive divider ratio, when VOUT starts to regulate and the time when there
which in turn affects the output voltage. The FB input is a response from Power Good output. Power Good
leakage current can also impact the divider and change response time is measured between the time when
the output voltage tolerance. VOUT goes out of regulation with a 10% drop, and the
time when Power Good output gets to a low level. Both
For boost converters, the removal of the feedback
Power Good delay time and Power Good response
resistors during operation must be avoided. In this
time are specified in the DC Characteristics table.
case, the output voltage will increase above the abso-
Additionally, there are no blanking time or delays; there
lute maximum output limits of the MCP1642B/D and
is only a 3% hysteresis of the Power Good comparator.
damage the device (for additional information, see
Due to the dynamic response, MCU must interpret
Application Note AN1337).
longer transients.

 2014 Microchip Technology Inc. DS20005253A-page 17

MCP1642B/D
When VOUT resumes to a value higher than 93%, the EQUATION 5-2:
PG pin switches to high level.
IOUT = C OUT   -------
dV
 dt 
600 µs (typ.) 250 µs (typ.) Where:
dV = Ripple voltage
VOUT dt = ON time of the N-Channel switch
(DC x 1/FSW)
PG DELAY PG RESPONSE Table 5-1 contains the recommended range for the
input and output capacitor value.
PG
TABLE 5-1: CAPACITOR VALUE RANGE
CIN COUT
FIGURE 5-1: Power Good Timing Diagram.
Minimum 4.7 µF 10 µF
Maximum — 100 µF
5.4 Input Capacitor Selection
The boost input current is smoothed by the boost 5.6 Inductor Selection
inductor, reducing the amount of filtering necessary at The MCP1642B/D devices are designed to be used
the input. Some capacitance is recommended to with small surface-mount inductors; the inductance
provide decoupling from the source. Low ESR X5R or value can range from 2.2 µH to 6.8 µH. An inductance
X7R are well suited, since they have a low temperature value of 4.7 µH is recommended to achieve a good
coefficient and small size. For light-load applications, balance between the inductor size, the converter load
4.7 µF of capacitance is sufficient at the input. For transient response and the minimized noise.
high-power applications that have high source
impedance or long leads which connect the battery to
TABLE 5-2: MCP1642B/D
the input, 10 µF of capacitance is recommended. RECOMMENDED INDUCTORS
Additional input capacitance can be added to provide a Value DCR ISAT Size
Part Number
stable input voltage. (µH)  (typ.) (A) WxLxH (mm)

Coilcraft
Table 5-1 contains the recommended range for the
input capacitor value. LPS4018-472 4.7 0.125 1.9 4.1x4.1x1.8
XFL4020-472 4.7 0.057 2.7 4.2x4.2x2.1

5.5 Output Capacitor Selection LPS5030-472 4.7 0.083 2 5x5x3

LPS6225-472 4.7 0.065 3.2 6.2x6.2x2.5
The output capacitor helps provide a stable output MSS6132-472 4.7 0.043 2.84 6.1x6.1x3.2
voltage during sudden load transients and reduces the Würth Elektronik
output voltage ripple. As with the input capacitor, X5R
744025004 Type WE-TPC 4.7 0.1 1.7 2.8x2.8x2.8
and X7R ceramic capacitors are well suited for this
744042004 WE-TPC 4.7 0.07 1.65 4.8x4.8x1.8
application. Using other capacitor types (aluminum or
744052005 WE-TPC 5 0.047 1.8 5.8x5.8x1.8
tantalum) with large ESR has impact on the converter's
efficiency (see AN1337) and maximum output power. 7447785004 WE-PD 4.7 0.06 2.5 6.2x5.9x3.3
TDK/EPCOS
The MCP1642B/D devices are internally compensated,
B82462A2472M000 4.7 0.084 2.00 6.0x6.0x2.5
so output capacitance range is limited. See Table 5-1
B82462G4472M 4.7 0.04 1.8 6.3x6.3x3.0
for the recommended output capacitor range.
Several parameters are used to select the correct
An output capacitance higher than 10 µF adds a better inductor: maximum rated current, saturation current
load step response and high-frequency noise and copper resistance (ESR). For boost converters, the
attenuation, especially while stepping from light current inductor current can be much higher than the output
loads to heavy current loads. In addition, 2 x 10 µF current. The lower the inductor ESR, the higher the
output capacitors ensure a better recovery of the output efficiency of the converter: a common trade-off in size
after a short period of overloading. versus efficiency.
While the N-Channel switch is on, the output current is The saturation current typically specifies a point at
supplied by the output capacitor COUT. The amount of which the inductance has rolled off a percentage of the
output capacitance and equivalent series resistance rated value. This can range from a 20% to 40%
will have a significant effect on the output ripple reduction in inductance. As inductance rolls off, the
voltage. While COUT provides load current, a voltage inductor ripple current increases, as does the peak
drop also appears across its internal ESR that results switch current. It is important to keep the inductance
in ripple voltage. from rolling off too much, causing switch current to
reach the peak limit.

DS20005253A-page 18  2014 Microchip Technology Inc.

 MCP1642B/D
5.7 Thermal Calculations The difference between the first term, input power, and
the second term, power delivered, is the power dissipa-
The MCP1642B/D devices are available in two different tion of the MCP1642B/D devices. This is an estimate
packages (MSOP-8 and 2 x 3 DFN-8). By calculating assuming that most of the power lost is internal to the
the power dissipation and applying the package MCP1642B/D and not CIN, COUT and the inductor.
thermal resistance (JA), the junction temperature is There is some percentage of power lost in the boost
estimated. The maximum continuous junction inductor, with very little loss in the input and output
temperature rating for the MCP1642B/D family of capacitors. For a more accurate estimation of internal
devices is +125°C. power dissipation, subtract the IINRMS2 x LESR power
To quickly estimate the internal power dissipation for dissipation.
the switching boost regulator, an empirical calculation
using measured efficiency can be used. Given the 5.8 PCB Layout Information
measured efficiency, the internal power dissipation is
estimated by Equation 5-3. Good printed circuit board layout techniques are
important to any switching circuitry, and switching
power supplies are no different. When wiring the
EQUATION 5-3:
switching high-current paths, short and wide traces
should be used. Therefore, it is important that the input
V OUT  I OUT
 -------------------------------
and output capacitors be placed as close as possible to
- –  VOUT  I OUT  = P Dis
 Efficiency  the MCP1642B/D to minimize the loop area.
The feedback resistors and feedback signal should be
routed away from the switching node and the switching
current loop. When possible, ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interference.

+VIN
L

CIN
GND
MCP1642
COUT

1
RTOP
RBOT
+VOUT
Via To Bottom
Plane

Enable Power Good

FIGURE 5-2: MCP1642B/D Recommended Layout, Applicable to Both Packages.

 2014 Microchip Technology Inc. DS20005253A-page 19

MCP1642B/D
6.0 TYPICAL APPLICATION CIRCUITS

L
4.7 µH

VOUT
VIN 5.0V @ min. 500 mA
SW
3.3V to 4.2V VOUT
VIN RTOP CC
976 k 27 pF
CIN MCP1642B-ADJ COUT
+ 10 µF
10 µF EN VFB
LI-ION

RBOT
PG 309 k
- PGND SGND

FIGURE 6-1: Portable USB Powered by Li-Ion.

L
4.7 µH

VOUT
VIN 5.0V @ min. 500 mA
SW
1.8V to 3.6V VOUT
VIN
CIN MCP1642B-50 COUT
+ 10 µF EN 10 µF
PG
NC
- PGND SGND

+ 28.7
30.0
Energizer® MAX®
Energizer® MAX AA
® AA
Service Estimate (hours)

Energizer® UltimateLithium
Energizer® Ultimate LithiumAA
AA
25.0
- 20.0

15.0 12.7

10.0
5.8
5.0
1.8 2.3
0.3
0.0
50 mA 250 mA 500 mA
Constant Output Current with 5V DC VOUT

Note: Service estimates apply to using two Energizer® MAX® AA or Energizer® Ultimate Lithium AA
batteries as the power source. Note that, if PG or feedback divider network is used, some
additional input drain current should be included, but there will be negligible effects on the service
estimates at these three load currents.

FIGURE 6-2: Portable USB Powered by Two Energizer® MAX® AA or Energizer® Ultimate Lithium
AA Batteries with the 5.0V Fixed Option of the MCP1642B.

DS20005253A-page 20  2014 Microchip Technology Inc.

 MCP1642B/D
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
8-Lead DFN (2x3x0.9 mm) Example

Part Number Code

MCP1642B-18I/MC AJY AJY
MCP1642BT-18I/MC AJY 348
MCP1642B-30I/MC AJU 25
MCP1642BT-30I/MC AJU
MCP1642B-33I/MC AJQ
MCP1642BT-33I/MC AJQ
MCP1642B-50I/MC AJL
MCP1642BT-50I/MC AJL
MCP1642B-ADJI/MC AKC
MCP1642BT-ADJI/MC AKC
MCP1642D-18I/MC AKA
MCP1642DT-18I/MC AKA
MCP1642D-30I/MC AJW
MCP1642DT-30I/MC AJW
MCP1642D-33I/MC AJS
MCP1642DT-33I/MC AJS
MCP1642D-50I/MC AJN
MCP1642DT-50I/MC AJN
MCP1642D-ADJI/MC AKE
MCP1642DT-ADJI/MC AKE

8-Lead MSOP (3x3 mm) Example

42B50I
348256

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 Pb-free JEDEC® designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

 2014 Microchip Technology Inc. DS20005253A-page 21

MCP1642B/D

 

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DS20005253A-page 22  2014 Microchip Technology Inc.

 MCP1642B/D

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

 2014 Microchip Technology Inc. DS20005253A-page 23

MCP1642B/D

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

DS20005253A-page 24  2014 Microchip Technology Inc.

 MCP1642B/D

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

 2014 Microchip Technology Inc. DS20005253A-page 25

MCP1642B/D

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

DS20005253A-page 26  2014 Microchip Technology Inc.

 MCP1642B/D
APPENDIX A: REVISION HISTORY

Revision A (December 2014)

• Original Release of this Document.

 2014 Microchip Technology Inc. DS20005253A-page 27

MCP1642B/D
NOTES:

DS20005253A-page 28  2014 Microchip Technology Inc.

 MCP1642B/D
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO. [X](1) X X /XX
Examples:
Device Tape Output Temperature Package a) MCP1642B-18I/MC: Industrial temperature,
and Reel Voltage Range 8LD 2x3 DFN package
b) MCP1642BT-18I/MC: Tape and Reel,
Industrial temperature,
Device: MCP1642B: 1A, 1 MHz Low Voltage Start-up Synchronous
8LD 2x3 DFN package
Boost Regulator With True Disconnect Output
MCP1642D: 1A, 1 MHz Low Voltage Start-up Synchronous c) MCP1642B-ADJI/MC: Industrial temperature,
Boost Regulator With Input to Output Bypass 8LD 2x3 DFN package
d) MCP1642BT-ADJI/MC: Tape and Reel,
Industrial temperature,
Output Voltage: 18 = 1.8V
30 = 3.0V 8LD 2x3 DFN package
33 = 3.3V e) MCP1642B-18I/MS: Industrial temperature,
50 = 5.0V
ADJ = Adjustable Output Voltage
8LD MSOP package
f) MCP1642BT-18I/MS: Tape and Reel,
Industrial temperature,
Temperature I = -40C to +85C (Industrial) 8LD MSOP package
Range:
g) MCP1642B-ADJI/MS: Industrial temperature,
8LD MSOP package
Package: MC = Plastic Dual Flat, No Lead – 2x3x0.9 mm Body h) MCP1642BT-ADJI/MS: Tape and Reel,
(DFN) Industrial temperature,
MS = Plastic Micro Small Outline (MSOP) 8LD MSOP package

a) MCP1642D-18I/MC: Industrial temperature,

8LD 2x3 DFN package
b) MCP1642DT-18I/MC: Tape and Reel,
Industrial temperature,
8LD 2x3 DFN package
c) MCP1642D-ADJI/MC: Industrial temperature,
8LD 2x3 DFN package
d) MCP1642DT-ADJI/MC: Tape and Reel,
Industrial temperature,
8LD 2x3 DFN package
e) MCP1642D-18I/MS: Industrial temperature,
8LD MSOP package
f) MCP1642DT-18I/MS: Tape and Reel,
Industrial temperature,
8LD MSOP package
g) MCP1642D-ADJI/MS: Industrial temperature,
8LD MSOP package
h) MCP1642DT-ADJI/MS: Tape and Reel,
Industrial temperature,
8LD 2x3 MSOP package

Note 1: Tape and Reel identifier only appears in the

catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.

 2014 Microchip Technology Inc. DS20005253A-page 29

MCP1642B/D
NOTES:

DS20005253A-page 30  2014 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks

applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC,
and may be superseded by updates. It is your responsibility to
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
ensure that your application meets with your specifications.
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
MICROCHIP MAKES NO REPRESENTATIONS OR
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
SST, SST Logo, SuperFlash and UNI/O are registered
IMPLIED, WRITTEN OR ORAL, STATUTORY OR trademarks of Microchip Technology Incorporated in the
OTHERWISE, RELATED TO THE INFORMATION, U.S.A. and other countries.
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR The Embedded Control Solutions Company and mTouch are
FITNESS FOR PURPOSE. Microchip disclaims all liability registered trademarks of Microchip Technology Incorporated
arising from this information and its use. Use of Microchip in the U.S.A.
devices in life support and/or safety applications is entirely at Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
the buyer’s risk, and the buyer agrees to defend, indemnify and CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
hold harmless Microchip from any and all damages, claims, Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
suits, or expenses resulting from such use. No licenses are KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
conveyed, implicitly or otherwise, under any Microchip MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
intellectual property rights. Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2014, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63276-905-3

QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures

== ISO/TS 16949 ==
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

 2014 Microchip Technology Inc. DS20005253A-page 31

 Worldwide Sales and Service
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office Asia Pacific Office India - Bangalore Austria - Wels
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Tel: 480-792-7200 Harbour City, Kowloon Denmark - Copenhagen
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Fax: 480-792-7277 Hong Kong Tel: 45-4450-2828
Tel: 91-11-4160-8631
Technical Support: Tel: 852-2943-5100 Fax: 45-4485-2829
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Tel: 631-435-6000 Tel: 86-29-8833-7252
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Tel: 408-735-9110 China - Xiamen
Tel: 86-592-2388138
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Fax: 86-592-2388130
Tel: 905-673-0699
Fax: 905-673-6509 China - Zhuhai
Tel: 86-756-3210040
03/25/14
Fax: 86-756-3210049

DS20005253A-page 32  2014 Microchip Technology Inc.