19-1912; Rev 3; 11/03

KIT
ATION
EVALU BLE
AVA ILA

2.4GHz to 2.5GHz Linear Power Amplifier

General Description Features

MAX2242
The MAX2242 low-voltage linear power amplifier (PA) is ♦ 2.4GHz to 2.5GHz Operating Range
designed for 2.4GHz ISM-band wireless LAN applica-
tions. It delivers +22.5dBm of linear output power with ♦ +22.5dBm Linear Output Power (ACPR of <-33dBc
an adjacent-channel power ratio (ACPR) of <-33dBc 1st-Side Lobe and <-55dbc 2nd-Side Lobe)
1st-side lobe and <-55dBc 2nd-side lobe, compliant ♦ 28.5dB Power Gain
with the IEEE 802.11b 11MB/s WLAN standard with at
least 3dB margin. The PA is packaged in the tiny 3x4 ♦ On-Chip Power Detector
chip-scale package (UCSP™), measuring only 1.5mm x ♦ External Bias Control for Current Throttleback
2.0mm, ideal for radios built in small PC card and com-
pact flash card form factors. ♦ +2.7V to +3.6V Single-Supply Operation
The MAX2242 PA consists of a three-stage PA, power ♦ 0.5µA Shutdown Mode
detector, and power management circuitry. The power
detector provides over 20dB of dynamic range with ♦ Tiny Chip-Scale Package (1.5mm ✕ 2.0mm)
±0.8dB accuracy at the highest output power level. An
accurate automatic level control (ALC) function can be
easily implemented using this detector circuit.
The PA also features an external bias control pin. Ordering Information
Through the use of an external DAC, the current can be
throttled back at lower output power levels while main- PIN- TOP
taining sufficient ACPR performance. As a result, the PART TEMP RANGE PACKAGE MARK
highest possible efficiency is maintained at all power MAX2242EBC-T -40°C to +85°C 3 ✕ 4 UCSP AAE
levels. The device operates over a single +2.7V to
+3.6V power-supply range. An on-chip shutdown fea-
ture reduces operating current to 0.5µA, eliminating the
need for an external supply switch.
Pin Configuration
________________________Applications
RF_IN GND VCC1
IEEE 802.11b DSSS Radios
C4 B4 A4
Wireless LANs
HomeRF
2.4GHz Cordless Phones
GND
2.4GHz ISM Radios
C3 BIAS A3
CIRCUIT
VCCB

SHDN PD_OUT VCC2

C2 B2 A2

Actual Size
DET
1.5mm ✕ 2.0mm

C1 B1 A1
Typical Application Circuit appears at end of data sheet. GND
BIAS RF_OUT

UCSP is a trademark of Maxim Integrated Products, Inc. 3✕4 UCSP

________________________________________________________________ Maxim Integrated Products 1

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
 2.4GHz to 2.5GHz
Linear Power Amplifier
ABSOLUTE MAXIMUM RATINGS
MAX2242

VCC1, VCC2 to GND (no RF signal applied) ..........-0.3V to +5.5V Operating Temperature Range ...........................-40°C to +85°C
RF Input Power ...............................................................+10dBm Thermal Resistance .........................................................25°C/W
SHDN, BIAS, PD_OUT, RF_OUT ................-0.3V to (VCC + 0.3V) Junction Temperature ......................................................+150°C
DC Input Current at RF_IN Port.............................-1mA to +1mA Storage Temperature Range .............................-65°C to +125°C
Maximum VSWR Without Damage ........................................10:1 Lead Temperature (soldering, 10s) .................................+260°C
Maximum VSWR for Stable Operation.....................................5:1 Continuous Operating Lifetime.....................10yrs × 0.92(TA - 60°C)
Continuous Power Dissipation (TA = +85°C) (For Operating Temperature, TA ≥ +60°C)
3✕4 UCSP (derate 80mW/°C above +85°C) ..................1.6W

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

CAUTION! ESD SENSITIVE DEVICE

DC ELECTRICAL CHARACTERISTICS
(VCC = +2.7V to +3.6V, fIN = 2.4GHz to 2.5GHz, V SHDN = VCC, RF_IN = RF_OUT = connected to 50Ω load, TA = -40°C to +85°C.
Typical values are measured at VCC = +3.3V, fIN = 2.45GHz, TA = +25°C, unless otherwise noted.) (Note 1)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Supply Voltage 2.7 3.6 V
POUT = +22dBm, VCC = +3.3V, idle current = 280mA 300 335
Supply Current
POUT = +13dBm, idle current = 55mA 90 mA
(Notes 2, 3, 6)
POUT = +5dBm, idle current = 25mA 50
Shutdown Supply Current V SHDN = 0, no RF input 0.5 10 µA
Logic Input Voltage High 2.0 V
Logic Input Voltage Low 0.8 V
Logic Input Current High -1 5 µA
Logic Input Current Low -1 1 µA

2 _______________________________________________________________________________________
 2.4GHz to 2.5GHz
Linear Power Amplifier
AC ELECTRICAL CHARACTERISTICS

MAX2242
(MAX2242 Evaluation Kit, VCC = +3.3V, V SHDN = VCC, 50Ω source and load impedance, fIN = 2.45GHz, TA = +25°C, unless other-
wise noted.) (Note 6)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Frequency Range (Notes 3, 4) 2.4 2.5 GHz
TA = +25°C 26.5 28.5
Power Gain (Notes 1, 3) dB
TA = -40°C to +85°C 25.5
Gain Variation Over Temperature
TA = -40°C to +85°C ±1.2 dB
(Note 3)
Gain Variation Over VCC (±10%)
VCC = +3.0V to +3.6V ±0.3 dB
(Note 3)

ACPR,
Output Power (Notes 3, 5, 8) 1st-side lobe < -33dBc, 21.5 22.5 dBm
2nd-side lobe < -55dBc

Saturated Output Power PIN = +5dBm 26.5 dBm

Harmonic Output (2f, 3f, 4f) -40 dBc
Input VSWR Over full PIN range 1.5:1
Output VSWR Over full POUT range 2.5:1
Power Ramp Turn-On Time
SHDN from low to high 1 1.5 µs
(Note 7)
Power Ramp Turn-Off Time
SHDN from high to low 1 1.5 µs
(Note 7)
RF Output Detector Response
2.5 5 µs
TIme
Po = +22dBm (Note 9) 1.8
RF Output Detector Voltage Po = +13dBm (Note 9) 0.9 V
Po = +5dBm (Note 9) 0.55
Note 1: Specifications over TA = -40°C to +85°C are guaranteed by design. Production tests are performed at TA = +25°C.
Note 2: Idle current is controlled by external DAC for best efficiency over the entire output power range.
Note 3: Parameter measured with RF modulation based on IEEE 802.11b standard.
Note 4: Power gain is guaranteed over this frequency range. Operation outside this range is possible, but is not guaranteed.
Note 5: Output two-tone third-order intercept point (OIP3) is production tested at TA = +25°C. The OIP3 is tested with two signals at
f1 = 2.450GHz and f2 = 2.451GHz with fixed PIN.
Note 6: Min/max limits are guaranteed by design and characterization.
Note 7: The total turn-on and turn-off times required for PA output power to settle to within 0.5dB of the final value.
Note 8: Excludes PC board loss of approximately 0.15dB.
Note 9: See Typical Operating Characteristics for statistical variation.

_______________________________________________________________________________________ 3
 2.4GHz to 2.5GHz
Linear Power Amplifier
MAX2242

Typical Operating Characteristics

(VCC = +3.3V, fIN = 2.45MHz, RF modulation = IEEE 802.11b, V SHDN = VCC, TA = +25°C, unless otherwise noted.)

GAIN vs. SUPPLY VOLTAGE ICC vs. SUPPLY VOLTAGE OUTPUT POWER vs. INPUT POWER
31 28
MAX2242 toc01

MAX2242 toc02

MAX2242 toc03
PO = +22dBm TA = -40°C 320 PO = +22dBm 27
26
30 25
300

OUTPUT POWER (dBm)

24
TA = +25°C
29 23
GAIN (dB)

280
ICC (mA)

TA = -40°C 22
21
28 260
TA = +25°C 20
19
TA = +85°C
27 TA = +85°C 18
240
IDLE CURRENT SET TO 280mA 17
AT VCC = +3.3V, TA = +25°C 16
26 220 15
2.7 3.0 3.3 3.6 2.7 3.0 3.3 3.6 -15 -13 -11 -9 -7 -5 -3 -1 1 3 5
SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) INPUT POWER (dBm)

ICC vs. OUTPUT POWER ACPR vs. OUTPUT POWER ACPR vs. FREQUENCY
330 -24 -32
MAX2242 toc04

MAX2242 toc05

MAX2242 toc06
300 -25 IDLE CURRENT = 280mA POUT = +22 dBm
-26
270 IDLE CURRENT ADJUSTED TO
KEEP ACPR/ALT = -33/-55dBc -27
240 -28
-29 -33
210 TA = -40°C -30
ACPR (dBc)

ACPR (dBc)
ICC (mA)

-31
180 -32 TA = -40°C
150 TA = +25°C -33
-34
120 TA = +25°C
-35 -34
90 TA = +85°C -36
60 -37
TA = +85°C
-38
30
-39
0 -40 -35
0 2 4 6 8 10 12 14 16 18 20 22 16 17 18 19 20 21 22 23 24 25 2400 2425 2450 2475 2500
OUTPUT POWER (dBm) OUTPUT POWER (dBm) FREQUENCY (MHz)

POWER DETECTOR VOLTAGE OUTPUT POWER HISTOGRAM AT FIXED

ICC vs. FREQUENCY vs. OUTPUT POWER 1.6V POWER DETECTOR VOLTAGE
320 2 30
MAX2242 toc08

MAX2242 toc09
MAX2242 toc07

VCC = +3.0V, TA = +25°C SIGMA = 0.14dBm

PO = +22dBm
315 1.8 VCC = +3.3V, TA = +85°C BASED ON
25
POWER DETECTOR VOLTAGE (V)

VCC = +3.3V, TA = -40°C 100 PARTS

310 1.6 VCC = +3.6V, TA = +25°C
TA = +25°C TA = +85°C
VCC = +3.3V, TA = +25°C
20
OCCURENCES

305 1.4
ICC (mA)

300 1.2 15

295 1
10
290 TA = -40°C 0.8
5
285 0.6 VCC = +2.7V, TA = +25°C

280 0.4 0
2400 2425 2450 2475 2500 0 2 4 6 8 10 12 14 16 18 20 22 21.6 21.8 22 22.2 22.4
FREQUENCY (MHz) OUTPUT POWER (dBm) OUTPUT POWER (dBm)

4 _______________________________________________________________________________________
 p2.4GHz to 2.5GHz
Linear Power Amplifier
Typical Operating Characteristics (continued)

MAX2242
(VCC = +3.3V, fIN = 2.45MHz, RF modulation = IEEE 802.11b, V SHDN = VCC, TA = +25°C, unless otherwise noted.)

OUTPUT POWER HISTOGRAM AT FIXED OUTPUT POWER HISTOGRAM AT FIXED

0.8V POWER DETECTOR VOLTAGE 0.5V POWER DETECTOR VOLTAGE
25 20

MAX2242 toc11
MAX2242 toc10
SIGMA = 0.25dBm SIGMA = 0.75dBm
BASED ON 100 PARTS BASED ON 100 PARTS
20
15

OCCURRENCES
OCCURRENCES

15
10
10

5
5

0 0
12.1 12.3 12.5 12.7 12.9 13.1 13.3 13.5 13.7 2.2 2.8 3.4 4.0 4.6 5.2 5.8 6.4 7.0
OUTPUT POWER (dBm) OUTPUT POWER (dBm)

MAX2242
S11, S22, vs. FREQUENCY S21 vs. FREQUENCY
30
MAX2242 toc12

MAX2242 toc13
-1 PIN = -15dBm PIN = -15dBm

-3 29

-5 S22
S11, S22 (dB)

28
S21 (dB)

-7

-9 27

-11 S11
26
-13

-15 25
2400 2420 2440 2460 2480 2500 2400 2420 2440 2460 2480 2500
FREQUENCY (MHz) FREQUENCY (MHz)

_______________________________________________________________________________________ 5
 2.4GHz to 2.5GHz
Linear Power Amplifier
Pin Description
MAX2242

PIN NAME FUNCTION

A1 GND 3rd Stage Ground. Refer to Application Information section for detailed PC-board layout information.
A2 VCC2 2nd Stage Supply Voltage. Bypass to ground using configuration in the typical operating circuit.
A3 GND 3rd Stage Ground. Refer to Application Information section for detailed PC-board layout information.
A4 VCC1 1st Stage Supply Voltage. Bypass to ground using configuration in the typical operating circuit.
B1 RF_OUT RF Output. Requires external matching.
Power Detector Output. This output is a DC voltage indicating the PA output power. Connect a
B2 PD_OUT
47kΩ resistor to GND.
B4 GND 1st Stage and Bias Control Circuit Ground
Bias Control. Connect one 8kΩ resistor from BIAS to GND and one 8kΩ resistor from BIAS to DAC
C1 BIAS
block to set the idle current.
Shutdown Input. Drive logic low to place the device in shutdown mode. Drive logic high for normal
C2 SHDN
operation.
Bias Circuit DC Supply Voltage. Bypass to ground using configuration in the typical operating
C3 VCCB
circuit.
C4 RF_IN RF Input. Requires external matching.

Detailed Description the DAC voltage, as shown in the Typical Application

Circuit. Resistor values R1 and R2 are determined as
The MAX2242 is a linear PA intended for 2.4GHz ISM-
follows:
band wireless LAN applications. The PA is fully charac-
terized in the 2.4GHz to 2.5GHz ISM band. The PA VMAX = 1.0 + (1.0 ✕ R1) / R2;
consists of two driver stages and an output stage. The (ICC = 0, VDAC = VMAX) (1)
MAX2242 also features an integrated power detector IMAX = (1.0 ✕ 1867) ✕ (R1 + R2) / (R1 ✕ R2);
and power shutdown control mode. (ICC = IMAX = max value, VDAC = 0) (2)
Dynamic Power Control IDAC = (VDAC - 1.0) / R1 (3)
The MAX2242 is designed to provide optimum power- IMID = (1.0 ✕ 1867) / R2;
added efficiency (PAE) in both high and low power
(VDAC = 1.0V or floating) (4)
applications. For a +3.3V supply at high output power
level, the output power is typically +22.5dBm with an ICC = 1867 ✕ IBIAS (5)
idle current of 280mA. At low output-power levels, the where
DC current can be reduced by an external DAC to
increase PAE while still maintaining sufficient ACPR VMAX = is the maximum DAC voltage
performance. This is achieved by using external resis- IMAX = is the maximum idle current
tors connected to the BIAS pin to set the bias currents
of the driver and output stages. The resistors are typi- IMID = is the idle current with VDAC = 1.0V or not
cally 8kΩ. Typically, a DAC voltage of 1.0V will give a connected
280mA bias current. Increasing the DAC voltage will VDAC = is the DAC voltage
decrease the idle current. Similarly, decreasing the IDAC = is the DAC current
DAC voltage will increase the idle current.
If no DAC is used and a constant idle current is
The BIAS pin is maintained at a constant voltage of desired, use equation 4 to determine the resistor values
1.0V, allowing the user to set the desired idle current for a given total bias current. Only R2 is required.
using only two off-chip 1% resistors: a shunt resistor,
R2, from BIAS to ground; and a series resistor, R1, to

6 _______________________________________________________________________________________
 2.4GHz to 2.5GHz
Linear Power Amplifier
For a DAC capable of both sourcing and sinking cur- The RFOUT port is an open-collector output that must

MAX2242
rents, the full voltage range of the DAC (typically from 0 be pulled to VCC through a 10nH RF choke for proper
to +3V) can be used. By substituting the desired values biasing. A shunt 33pF capacitor to ground is required
of VMAX and IMAX into equations 1 and 2, R1 and R2 at the supply side of the inductor. In addition, a match-
can be easily calculated. ing network is required for optimum gain, efficiency,
For a DAC capable of sourcing current only, use equa- ACPR, and output power. The load impedance seen at
tion 4 to determine the value of resistor R2 for the the RFOUT port of the MAX2242 on the EV kit is
desired maximum current. Use equation 1 to determine approximately 8 + j5Ω. This should serve as a good
the value of resistor R1 for the desired minimum current. starting point for your layout. However, optimum perfor-
mance is layout dependent and some component opti-
For a DAC capable of sinking current only, set resistors mization may be required. See the Typical Application
R1 and R2 to 0 and connect the DAC directly to the Circuit for the lumped and discrete component values
BIAS pin. Use equation 5 to determine the DAC current used on the MAX2242 EV kit to achieve this impedance.
required for a given ICC.
Ground Vias
Shutdown Mode Placement and type of ground vias are important to
Apply logic low to SHDN (pin C2) to place the achieve optimum gain and output power and ACPR
MAX2242 into shutdown mode. In this mode, all gain performance. Each ground pin requires its own through-
stages are disabled and supply current typically drops hole via (via diameter = 10mils) placed as near to the
to 0.5µA. Note that the shutdown current is lowest when device pin as possible to reduce ground inductance
V SHDN = 0. and feedback between stages. Use the MAX2242 EV
Power Detector kit PC board layout as a guide.
The power detector generates a voltage proportional to Layout and Thermal Management Issues
the output power by monitoring the output power using The MAX2242 EV kit serves as a layout guide. Use con-
an internal coupler. It is fully temperature compensated trolled-impedance lines on all high-frequency inputs
and allows the user to set the bandwidth with an exter- and outputs. The GND pins also serve as heat sinks.
nal capacitor. For maximum bandwidth, connect a Connect all GND pins directly to the topside RF ground.
47kΩ resistor from PD_OUT to GND and do not use any On boards where the ground plane is not on the com-
external capacitor. ponent side, connect all GND pins to the ground plane
Applications Information with plated multiple throughholes close to the package.
PC board traces connecting the GND pins also serve
Interstage Matching and Bypassing as heat sinks. Make sure that the traces are sufficiently
VCC1 and VCC2 provide bias to the first and second wide.
stage amplifiers, and are also part of the interstage
matching networks required to optimize performance UCSP Reliability
between the three amplifier stages. See the Typical UCSP represents a unique packaging form factor that
Application Circuit for the lumped and discrete compo- may not perform equally to a packaged product
nent values used on the MAX2242 EV kit for optimum through traditional mechanical reliability tests. UCSP
interstage matching and RF bypassing. In addition to reliability is integrally linked to the user’s assembly
RF bypass capacitors on each bias line, a global methods, circuit-board material, and usage environ-
bypass capacitor of 22µF is necessary to filter any ment. The user should closely review these areas when
noise on the supply line. Route separate V CC bias considering use of a UCSP. Performance through the
paths from the global bypass capacitor (star topology) operating-life test and moisture resistance remains
to avoid coupling between PA stages. Use the uncompromised as it is primarily determined by the
MAX2242 EV kit PC board layout as a guide. wafer-fabrication process. Mechanical stress perfor-
mance is a greater consideration for a UCSP. UCSPs
External Matching are attached through direct solder contact to the user’s
The RFIN port requires a matching network. The RFIN PC board, foregoing the inherent stress relief of a pack-
port impedance is 16–j30 at 2.45GHz. See the Typical aged-product lead frame. Solder joint contact integrity
Application Circuit for recommended component values. must be considered. Testing done to characterize the

_______________________________________________________________________________________ 7
 2.4GHz to 2.5GHz
Linear Power Amplifier
Typical Application Circuit
MAX2242

VCC
VCC
DET
DAC OUT
0.1µF
47kΩ
0.1µF
R1 SHDN VCC2 PD_OUT
8kΩ
R2 50Ω
8kΩ BIAS
33pF

VCCB
VCC BIAS
DETECTOR
CIRCUIT
33pF
10nH
VCC1
VCC
0.1µF
100pF

RF_IN RF_OUT
1.8pF
6pF
2.2nH

GND GND GND

NOTE: REFER TO MAX2242 EV KIT DATA SHEET FOR DETAILED LAYOUT INFORMATION.

UCSP reliability performance shows that it is capable of

Package Diagram
performing reliably through environmental stresses.
Users should also be aware that as with any intercon- 1.5
nect system there are electromigration-based current 0.5
0.75
limits that, in this case, apply to the maximum allowable MAX
current in the bumps. Reliability is a function of this cur-
rent, the duty cycle, lifetime, and bump temperature. C4 B4 A4
See the Absolute Maximum Ratings section for any
specific limitations listed under Continuous Operating
Lifetime.Results of environmental stress tests and addi- B3
tional usage data and recommendations are detailed in C3 NOT A3
the UCSP application note, which can be found on USED
Maxim’s website at www.maxim-ic.com.
2.0

Chip Information C2 B2 A2
TRANSISTOR COUNT: 486
0.5

C1 B1 A1

BOTTOM VIEW SIDE VIEW

CHIP-SCALE PACKAGE (ALL DIMENSIONS IN mm)

8 _______________________________________________________________________________________
2.4GHz to 2.5GHz
Linear Power Amplifier
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)

12L, UCSP 4x3.EPS

PACKAGE OUTLINE, 4x3 UCSP
1
21-0104 F 1

Note: MAX2242 does not use bump B3.

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 _____________________ 9

© 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.