ESP32-C6-WROOM-1

Datasheet

Module that supports 2.4 GHz Wi-Fi 6 (802.11 ax), Bluetooth® 5 (LE), Zigbee and Thread
(802.15.4)
Built around ESP32-C6 series of SoCs, 32-bit RISC-V single-core microprocessor
Flash up to 16 MB
23 GPIOs, rich set of peripherals
On-board PCB antenna

ESP32-C6-WROOM-1

Pre-release v0.5
Espressif Systems
Copyright © 2023

www.espressif.com
1 Module Overview

1 Module Overview
Note:

Check the link or the QR code to make sure that you use the latest version of this document:
https://espressif.com/documentation/esp32-c6-wroom-1_datasheet_en.pdf

1.1 Features

CPU and On-Chip Memory – 20 MHz and 40 MHz bandwidth

• ESP32-C6 embedded, 32-bit RISC-V single-core – Data rate up to 150 Mbps

microprocessor, up to 160 MHz – Wi-Fi Multimedia (WMM)
• ROM: 320 KB – TX/RX A-MPDU, TX/RX A-MSDU
• HP SRAM: 512 KB – Immediate Block ACK
• LP SRAM: 16 KB
– Fragmentation and defragmentation

Wi-Fi – Transmit opportunity (TXOP)

• 1T1R in 2.4 GHz band – Automatic Beacon monitoring (hardware

TSF)
• Operating frequency: 2412 ~ 2484 MHz
– 4 × virtual Wi-Fi interfaces
• IEEE 802.11ax-compliant
– Simultaneous support for Infrastructure BSS
– 20 MHz-only non-AP mode
in Station mode, SoftAP mode, Station +
– MCS0 ~MCS9 SoftAP mode, and promiscuous mode
Note that when ESP32-C6 scans in Station
– Uplink and downlink OFDMA, especially
mode, the SoftAP channel will change along
suitable for simultaneous connections in
with the Station channel
high-density environments
– 802.11mc FTM
– Downlink MU-MIMO (multi-user, multiple
input, multiple output) to increase network
Bluetooth
capacity

– Beamformee that improves signal quality • Bluetooth LE: Bluetooth 5.3 certified

– Channel quality indication (CQI) • Bluetooth mesh

– DCM (dual carrier modulation) to improve • High power mode (20 dBm)
link robustness
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
– Spatial reuse to maximize parallel
• Advertising extensions
transmissions
• Multiple advertisement sets
– Target wake time (TWT) that optimizes
power saving mechanisms • Channel selection algorithm #2

• Fully compatible with IEEE 802.11b/g/n protocol • LE power control

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1 Module Overview

• Internal co-existence mechanism between Wi-Fi ADC, temperature sensor, general-purpose

and Bluetooth to share the same antenna timers, watchdog timers, etc.

IEEE 802.15.4 Integrated Components on Module

• Compliant with IEEE 802.15.4-2015 protocol • 40 MHz crystal oscillator

• OQPSK PHY in 2.4 GHz band • SPI flash
• Data rate: 250 Kbps
Antenna Options
• Thread 1.3
• On-board PCB antenna
• Zigbee 3.0

Peripherals Operating Conditions

• GPIO, SPI, parallel IO interface, UART, I2C, I2S, • Operating voltage/Power supply: 3.0 ~ 3.6 V
RMT (TX/RX), pulse counter, LED PWM, USB • Operating ambient temperature:
Serial/JTAG controller, MCPWM, SDIO2.0 slave
– 85 °C version module: –40 ~ 85 °C
controller, GDMA, TWAI® controller, on-chip
debug functionality via JTAG, event task matrix, – 105 °C version module: –40 ~ 105 °C

1.2 Description
ESP32-C6-WROOM-1 is a general-purpose Wi-Fi, IEEE 802.15.4, and Bluetooth LE module. The rich set of
peripherals and high performance make the module an ideal choice for smart homes, industrial automation,
health care, consumer electronics, etc.

ESP32-C6-WROOM-1 module features an external SPI flash.

The ordering information for ESP32-C6-WROOM-1 is as follows:

Table 1: ESP32-C6-WROOM-1 Ordering Information

Ambient Temp.1 Size2

Ordering Code Flash
(°C) (mm)
ESP32-C6-WROOM-1-N4 –40 ~ 85
4 MB (Quad SPI)
ESP32-C6-WROOM-1-H4 –40 ~ 105
18.0 × 25.5 × 3.1
ESP32-C6-WROOM-1-N8 8 MB (Quad SPI) –40 ~ 85
ESP32-C6-WROOM-1-N16 16 MB (Quad SPI) –40 ~ 85
1
Ambient temperature specifies the recommended temperature range of the environment
immediately outside the Espressif module.
2
For details, refer to Section 8.1 Physical Dimensions.

At the core of this module is ESP32-C6, a 32-bit RISC-V single-core processor.

ESP32-C6 integrates a rich set of peripherals including SPI, parallel IO interface, UART, I2C, I2S, RMT (TX/RX),
LED PWM, USB Serial/JTAG controller, MCPWM, SDIO2.0 slave controller, GDMA, TWAI® controller, on-chip
debug functionality via JTAG, event task matrix, as well as up to 23 GPIOs, etc.

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1 Module Overview

Note:
* For more information on ESP32-C6, please refer to ESP32-C6 Series Datasheet.

1.3 Applications
• Smart Home • POS machines

• Industrial Automation • Service robot

• Health Care • Audio Devices

• Consumer Electronics • Generic Low-power IoT Sensor Hubs

• Smart Agriculture • Generic Low-power IoT Data Loggers

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Contents

Contents

1 Module Overview 2
1.1 Features 2
1.2 Description 3
1.3 Applications 4

2 Block Diagram 9

3 Pin Definitions 10
3.1 Pin Layout 10
3.2 Pin Description 10
3.3 Strapping Pins 11
3.3.1 SDIO Sampling and Driving Clock Edge Control 13
3.3.2 Chip Boot Mode Control 13
3.3.3 ROM Messages Printing Control 13
3.3.4 JTAG Signal Source Control 14

4 Electrical Characteristics 15
4.1 Absolute Maximum Ratings 15
4.2 Recommended Operating Conditions 15
4.3 DC Characteristics (3.3 V, 25 °C) 15
4.4 Current Consumption Characteristics 16
4.4.1 RF Current Consumption in Active Mode 16
4.4.2 Current Consumption in Other Modes 17

5 RF Characteristics 18
5.1 Wi-Fi Radio 18
5.1.1 Wi-Fi RF Transmitter (TX) Characteristics 18
5.1.2 Wi-Fi RF Receiver (RX) Characteristics 19
5.2 Bluetooth LE Radio 21
5.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 21
5.2.2 Bluetooth LE RF Receiver (RX) Characteristics 22
5.3 802.15.4 Radio 24
5.3.1 802.15.4 RF Transmitter (TX) Characteristics 25
5.3.2 802.15.4 RF Receiver (RX) Characteristics 25

6 Module Schematics 26

7 Peripheral Schematics 27

8 Physical Dimensions and PCB Land Pattern 28

8.1 Physical Dimensions 28
8.2 Recommended PCB Land Pattern 29

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Contents

9 Product Handling 30
9.1 Storage Conditions 30
9.2 Electrostatic Discharge (ESD) 30
9.3 Soldering Profile 30
9.3.1 Reflow Profile 30
9.4 Ultrasonic Vibration 31

10 Related Documentation and Resources 32

Revision History 33

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List of Tables

List of Tables
1 ESP32-C6-WROOM-1 Ordering Information 3
2 Pin Definitions 10
3 Default Configuration of Strapping Pins 12
4 Description of Timing Parameters for the Strapping Pins 12
5 SDIO Input Sampling Edge/Output Driving Edge Control 13
6 Boot Mode Control 13
7 ROM Messages Printing Control 14
8 JTAG Signal Source Control 14
9 Absolute Maximum Ratings 15
10 Recommended Operating Conditions 15
11 DC Characteristics (3.3 V, 25 °C) 15
12 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 16
13 Current Consumption for Bluetooth LE in Active Mode 16
14 Current Consumption for 802.15.4 in Active Mode 16
15 Current Consumption in Modem-sleep Mode 17
16 Current Consumption in Low-Power Modes 17
17 Wi-Fi RF Characteristics 18
18 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 18
19 TX EVM Test 18
20 RX Sensitivity 19
21 Maximum RX Level 20
22 RX Adjacent Channel Rejection 20
23 Bluetooth LE RF Characteristics 21
24 Bluetooth LE - Transmitter Characteristics - 1 Mbps 21
25 Bluetooth LE - Transmitter Characteristics - 2 Mbps 21
26 Bluetooth LE - Transmitter Characteristics - 125 Kbps 22
27 Bluetooth LE - Transmitter Characteristics - 500 Kbps 22
28 Bluetooth LE - Receiver Characteristics - 1 Mbps 22
29 Bluetooth LE - Receiver Characteristics - 2 Mbps 23
30 Bluetooth LE - Receiver Characteristics - 125 Kbps 24
31 Bluetooth LE - Receiver Characteristics - 500 Kbps 24
32 802.15.4 RF Characteristics 24
33 802.15.4 Transmitter Characteristics - 250 Kbps 25
34 802.15.4 Receiver Characteristics - 250 Kbps 25

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List of Figures

List of Figures
1 ESP32-C6-WROOM-1 Block Diagram 9
2 Pin Layout (Top View) 10
3 Visualization of Timing Parameters for the Strapping Pins 13
4 ESP32-C6-WROOM-1 Schematics 26
5 Peripheral Schematics 27
6 Physical Dimensions 28
7 Recommended PCB Land Pattern 29
8 Reflow Profile 30

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2 Block Diagram

2 Block Diagram

40 MHz
3V3 Crystal Antenna

RF Matching
EN ESP32-C6
GPIOs

VDD_SPI
SPICS0
SPICLK

SPIWP
SPIHD
SPIQ
SPID
GND

QSPI Flash

Figure 1: ESP32-C6-WROOM-1 Block Diagram

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3 Pin Definitions

3 Pin Definitions

3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 8.1 Physical Dimensions.

Keepout Zone

GND 1 28 GND

3V3 2 27 IO2

EN 3 26 IO3

IO4 4 25 TXD0
GND GND GND

IO5 5 24 RXD0
29
GND GND
GND
IO6 6 23 IO15
GND GND GND

IO7 7 22 NC

IO0 8 21 IO23

IO1 9 20 IO22

IO8 10 19 IO21

IO10 11 18 IO20

IO11 12 17 IO19

IO12 13 16 IO18

IO13 14 15 IO9

Figure 2: Pin Layout (Top View)

Pin Layout (Top View)
3.2 Pin Description
The module has 29 pins. See pin definitions in Table 2 Pin Definitions.

Table 2: Pin Definitions

Name No. Type1 Function

GND 1 P Ground
3V3 2 P Power supply
High: on, enables the chip.
EN 3 I
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
Cont’d on next page

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3 Pin Definitions

Table 2 – cont’d from previous page

1
Name No. Type Function
IO4 4 I/O/T MTMS, GPIO4, LP_GPIO4, LP_UART_RXD, ADC1_CH4, FSPIHD
IO5 5 I/O/T MTDI, GPIO5, LP_GPIO5, LP_UART_TXD, ADC1_CH5, FSPIWP
IO6 6 I/O/T MTCK, GPIO6, LP_GPIO6, LP_I2C_SDA, ADC1_CH6, FSPICLK
IO7 7 I/O/T MTDO, GPIO7, LP_GPIO7, LP_I2C_SCL, FSPID
IO0 8 I/O/T GPIO0, XTAL_32K_P, LP_GPIO0, LP_UART_DTRN, ADC1_CH0
IO1 9 I/O/T GPIO1, XTAL_32K_N, LP_GPIO1, LP_UART_DSRN, ADC1_CH1
IO8 10 I/O/T GPIO8
IO10 11 I/O/T GPIO10
IO11 12 I/O/T GPIO11
IO12 13 I/O/T GPIO12, USB_D-
IO13 14 I/O/T GPIO13, USB_D+
IO9 15 I/O/T GPIO9
IO18 16 I/O/T GPIO18, SDIO_CMD, FSPICS2
IO19 17 I/O/T GPIO19, SDIO_CLK, FSPICS3
IO20 18 I/O/T GPIO20, SDIO_DATA0, FSPICS4
IO21 19 I/O/T GPIO21, SDIO_DATA1, FSPICS5
IO22 20 I/O/T GPIO22, SDIO_DATA2
IO23 21 I/O/T GPIO23, SDIO_DATA3
NC 22 — NC
IO15 23 I/O/T GPIO15
RXD0 24 I/O/T U0RXD, GPIO17, FSPICS1
TXD0 25 I/O/T U0TXD, GPIO16, FSPICS0
IO3 26 I/O/T GPIO3, LP_GPIO3, LP_UART_CTSN, ADC1_CH3
IO2 27 I/O/T GPIO2, LP_GPIO2, LP_UART_RTSN, ADC1_CH2, FSPIQ
GND 28 P Ground
EPAD 29 P Ground
1
P: power supply; I: input; O: output; T: high impedance.

3.3 Strapping Pins

Note:
The content below is excerpted from ESP32-C6 Series Datasheet > Section Strapping Pins. For the strapping pin mapping
between the chip and modules, please refer to Chapter 6 Module Schematics.

At each startup or reset, a chip requires some initial configuration parameters, such as in which boot mode to
load the chip, etc. These parameters are passed over via the strapping pins. After reset, the strapping pins
operate as regular IO pins.

The parameters controlled by the given strapping pins at chip reset are as follows:

• SDIO sampling and driving clock edge – MTMS and MTDI

• Chip boot mode – GPIO8 and GPIO9

• ROM code printing to UART – GPIO8

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3 Pin Definitions

• JTAG signal source – GPIO15

GPIO9 is connected to the chip’s internal weak pull-up resistor at chip reset. This resistor determines the default
bit value of GPIO9. Also, the resistor determines the bit value if GPIO9 is connected to an external
high-impedance circuit.

Table 3: Default Configuration of Strapping Pins

Strapping Pin Default Configuration Bit Value

MTMS Floating –
MTDI Floating –
GPIO8 Floating –
GPIO9 Pull-up 1
GPIO15 Floating –

To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the
ESP32-C6 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host
MCU.

All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping
pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in
any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed
up to be used as regular IO pins after reset.

Regarding the timing requirements for the strapping pins, there are such parameters as setup time and hold time.
For more information, see Table 4 and Figure 3.

Table 4: Description of Timing Parameters for the Strapping Pins

Parameter Description Min (ms)

Setup time is the time reserved for the power rails to stabilize before
tSU 0
the CHIP_PU pin is pulled high to activate the chip.
Hold time is the time reserved for the chip to read the strapping pin
tH values after CHIP_PU is already high and before these pins start 3
operating as regular IO pins.

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3 Pin Definitions

tSU tH

VIL_nRST
CHIP_PU

VIH

Strapping pin

Figure 3: Visualization of Timing Parameters for the Strapping Pins

3.3.1 SDIO Sampling and Driving Clock Edge Control

The strapping pin MTMS and MTDI can be used to decide on which clock edge to sample signals and drive
output lines. See Table 5 SDIO Input Sampling Edge/Output Driving Edge Control.

Table 5: SDIO Input Sampling Edge/Output Driving Edge Control

MTMS MTDI Edge behavior

– (Floating) – (Floating) Default Configuration
0 0 Falling edge sampling, falling edge output
0 1 Falling edge sampling, rising edge output
1 0 Rising edge sampling, falling edge output
1 1 Rising edge sampling, rising edge output

3.3.2 Chip Boot Mode Control

GPIO8 and GPIO9 control the boot mode after the reset is released. See Table 6 Boot Mode Control Boot Mode
Control.

Table 6: Boot Mode Control

Boot Mode GPIO8 GPIO9

Default Configuration – (Floating) 1 (Pull-up)
SPI Boot (default) Any value 1
Download Boot 1 0
1
Invalid combination 0 0
1
This combination triggers unexpected behavior
and should be avoided.

3.3.3 ROM Messages Printing Control

During boot process the messages by the ROM code can be printed to:

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3 Pin Definitions

• USB Serial/JTAG controller. For this, EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT should be 0 and

USB Serial/JTAG controller should be enabled.

• UART0. For this, set EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT to 1. In this case,

EFUSE_UART_PRINT_CONTROL and GPIO8 control ROM messages printing as shown in Table 7 ROM
Messages Printing Control.

Table 7: ROM Messages Printing Control

eFuse1 GPIO8 ROM Code Printing

0 Ignored Always enabled
0 Enabled
1
1 Disabled
0 Disabled
2
1 Enabled
3 Ignored Always disabled
1
eFuse: EFUSE_UART_PRINT_CONTROL

3.3.4 JTAG Signal Source Control

The strapping pin GPIO15 can be used to control the source of JTAG signals during the early boot process. This
pin does not have any internal pull resistors and the strapping value must be controlled by the external circuit that
cannot be in a high impedance state.

As Table 8 shows, GPIO15 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and

EFUSE_JTAG_SEL_ENABLE.

Table 8: JTAG Signal Source Control

eFuse 1a eFuse 2b eFuse 3c GPIO15 JTAG Signal Source

0 Ignored USB Serial/JTAG Controller
0 0 0 JTAG pins MTDI, MTCK, MTMS, and MTDO
1
1 USB Serial/JTAG Controller
0 1 Ignored Ignored JTAG pins MTDI, MTCK, MTMS, and MTDO
1 0 Ignored Ignored USB Serial/JTAG Controller
1 1 Ignored Ignored JTAG is disabled
a
eFuse 1: EFUSE_DIS_PAD_JTAG
b
eFuse 2: EFUSE_DIS_USB_JTAG
c
eFuse 3: EFUSE_JTAG_SEL_ENABLE

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4 Electrical Characteristics

4 Electrical Characteristics
The values presented in this section are preliminary and may change with the final release of this
datasheet.

4.1 Absolute Maximum Ratings

Stresses above those listed in Table 9 Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these or any other conditions beyond
those indicated under Table 10 Recommended Operating Conditions is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 9: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C

4.2 Recommended Operating Conditions

Table 10: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
85 °C version 85
TA Operating ambient temperature –40 — °C
105 °C version 105

4.3 DC Characteristics (3.3 V, 25 °C)

Table 11: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

CIN Pin capacitance — 2 — pF
1 1
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
1
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
2 1
VOH High-level output voltage 0.8 × VDD — — V
2 1
VOL Low-level output voltage — — 0.1 × VDD V
1
High-level source current (VDD = 3.3 V, VOH >=
IOH — 40 — mA
2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Pull-up resistor — 45 — kΩ

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4 Electrical Characteristics

RP D Pull-down resistor — 45 — kΩ
1 1
VIH_nRST Chip reset release voltage 0.75 × VDD — VDD + 0.3 V
1
VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD V
1
VDD is the I/O voltage for pins of a particular power domain.
2
VOH and VOL are measured using high-impedance load.

4.4 Current Consumption Characteristics

4.4.1 RF Current Consumption in Active Mode
The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current
consumption is rated at a 100% duty cycle.

RX current consumption is rated when the peripherals are disabled and the CPU idle.

Table 12: Current Consumption for Wi-Fi (2.4 GHz) in Active Mode

Work Mode RF Condition Description Peak (mA)

802.11b, 1 Mbps, DSSS @ 20.5 dBm 382
802.11g, 54 Mbps, OFDM @ 19.0 dBm 316
TX 802.11n, HT20, MCS7 @ 18.0 dBm 295
802.11n, HT40, MCS7 @ 17.5 dBm 280
Active (RF working)
802.11ax, MCS9 @ 15.5 dBm 251
802.11b/g/n, HT20 78
RX 802.11n, HT40 82
802.11ax, HE20 78

Table 13: Current Consumption for Bluetooth LE in Active Mode

Work Mode RF Condition Description Peak (mA)

Bluetooth LE @ 20.0 dBm 322
TX Bluetooth LE @ 9.0 dBm 190
Active (RF working) Bluetooth LE @ 0 dBm 130
Bluetooth LE @ –24.0 dBm 90
RX Bluetooth LE 73

Table 14: Current Consumption for 802.15.4 in Active Mode

Work Mode RF Condition Description Peak (mA)

802.15.4 @ 20.0 dBm 316
TX 802.15.4 @ 12.0 dBm 190
Active (RF working) 802.15.4 @ 0 dBm 120
802.15.4 @ –24.0 dBm 84
RX 802.15.4 73

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4 Electrical Characteristics

Note:
The content below is excerpted from Section Current Consumption in Other Modes in ESP32-C6 Series Datasheet.

4.4.2 Current Consumption in Other Modes

Table 15: Current Consumption in Modem-sleep Mode

Typ (mA)
CPU Frequency
All Peripherals All Peripherals
Mode (MHz) Description
Clocks Disabled Clocks Enabled1
CPU is running 27 38
160
CPU is idle 17 28
Modem-sleep2,3
CPU is running 19 30
80
CPU is idle 14 25
1
In practice, the current consumption might be different depending on which peripherals are
enabled.
2
In Modem-sleep mode, Wi-Fi is clock gated.
3
In Modem-sleep mode, the consumption might be higher when accessing flash.

Table 16: Current Consumption in Low-Power Modes

Mode Description Typ (µA)

CPU and wireless communication modules are powered down, pe-
180
Light-sleep ripheral clocks are disabled, and all GPIOs are high-impedance
CPU, wireless communication modules and peripherals are pow-
35
ered down, and all GPIOs are high-impedance
Deep-sleep RTC timer and LP memory are powered on 7
Power off CHIP_PU is set to low level, the chip is powered off 1

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5 RF Characteristics

5 RF Characteristics
This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the
antenna port, where RF cable is connected, including the front-end loss.

Devices should operate in the center frequency range allocated by regional regulatory authorities. The target
center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and
Test Guide for instructions.

Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient
temperature.

5.1 Wi-Fi Radio

Table 17: Wi-Fi RF Characteristics

Name Description
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n/ax

5.1.1 Wi-Fi RF Transmitter (TX) Characteristics

Table 18: TX Power with Spectral Mask and EVM Meeting 802.11 Standards

Min Typ Max

Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps, DSSS — 20.5 —
802.11b, 11 Mbps, CCK — 20.5 —
802.11g, 6 Mbps, OFDM — 20.0 —
802.11g, 54 Mbps, OFDM — 19.0 —
802.11n, HT20, MCS0 — 19.0 —
802.11n, HT20, MCS7 — 18.0 —
802.11n, HT40, MCS0 — 18.5 —
802.11n, HT40, MCS7 — 17.5 —
802.11ax, HE20, MCS0 — 19.0 —
802.11ax, HE20, MCS9 — 15.5 —

Table 19: TX EVM Test1

Min Typ Limit

Rate (dB) (dB) (dB)
802.11b, 1 Mbps, DSSS — –25.0 –10.0
802.11b, 11 Mbps, CCK — –25.0 –10.0
802.11g, 6 Mbps, OFDM — –24.0 –5.0
802.11g, 54 Mbps, OFDM — –28.0 –25.0
Cont’d on next page

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5 RF Characteristics

Table 19 – cont’d from previous page

Min Typ Limit
Rate (dB) (dB) (dB)
802.11n, HT20, MCS0 — –27.5 –5.0
802.11n, HT20, MCS7 — –30.0 –27.0
802.11n, HT40, MCS0 — –27.0 –5.0
802.11n, HT40, MCS7 — –29.5 –27.0
802.11ax, HE20, MCS0 — –27.0 –5.0
802.11ax, HE20, MCS9 — –34.0 –32.0
1
EVM is measured at the corresponding typical TX power provided
in Table 18 TX Power with Spectral Mask and EVM Meeting 802.11
Standards above.

5.1.2 Wi-Fi RF Receiver (RX) Characteristics

For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n/ax.

Table 20: RX Sensitivity

Min Typ Max

Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps, DSSS — –99.2 —
802.11b, 2 Mbps, DSSS — –96.8 —
802.11b, 5.5 Mbps, CCK — –93.6 —
802.11b, 11 Mbps, CCK — –90.0 —
802.11g, 6 Mbps, OFDM — –94.0 —
802.11g, 9 Mbps, OFDM — –93.0 —
802.11g, 12 Mbps, OFDM — –92.4 —
802.11g, 18 Mbps, OFDM — –90.0 —
802.11g, 24 Mbps, OFDM — –86.8 —
802.11g, 36 Mbps, OFDM — –83.0 —
802.11g, 48 Mbps, OFDM — –78.8 —
802.11g, 54 Mbps, OFDM — –77.6 —
802.11n, HT20, MCS0 — –93.6 —
802.11n, HT20, MCS1 — –92.0 —
802.11n, HT20, MCS2 — –89.4 —
802.11n, HT20, MCS3 — –86.0 —
802.11n, HT20, MCS4 — –82.8 —
802.11n, HT20, MCS5 — –78.6 —
802.11n, HT20, MCS6 — –77.0 —
802.11n, HT20, MCS7 — –75.4 —
802.11n, HT40, MCS0 — –91.0 —
802.11n, HT40, MCS1 — –89.6 —
802.11n, HT40, MCS2 — –87.0 —
802.11n, HT40, MCS3 — –83.4 —
Cont’d on next page

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5 RF Characteristics

Table 20 – cont’d from previous page

Min Typ Max
Rate (dBm) (dBm) (dBm)
802.11n, HT40, MCS4 — –80.4 —
802.11n, HT40, MCS5 — –76.2 —
802.11n, HT40, MCS6 — –74.6 —
802.11n, HT40, MCS7 — –73.2 —
802.11ax, HE20, MCS0 — –93.8 —
802.11ax, HE20, MCS1 — –91.0 —
802.11ax, HE20, MCS2 — –88.0 —
802.11ax, HE20, MCS3 — –85.6 —
802.11ax, HE20, MCS4 — –82.0 —
802.11ax, HE20, MCS5 — –78.0 —
802.11ax, HE20, MCS6 — –76.6 —
802.11ax, HE20, MCS7 — –74.4 —
802.11ax, HE20, MCS8 — –70.8 —
802.11ax, HE20, MCS9 — –68.6 —

Table 21: Maximum RX Level

Min Typ Max

Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps, DSSS — 5 —
802.11b, 11 Mbps, CCK — 5 —
802.11g, 6 Mbps, OFDM — 5 —
802.11g, 54 Mbps, OFDM — 0 —
802.11n, HT20, MCS0 — 5 —
802.11n, HT20, MCS7 — 0 —
802.11n, HT40, MCS0 — 5 —
802.11n, HT40, MCS7 — 0 —
802.11ax, HE20, MCS0 — 5 —
802.11ax, HE20, MCS9 — 0 —

Table 22: RX Adjacent Channel Rejection

Min Typ Max

Rate (dB) (dB) (dB)
802.11b, 1 Mbps, DSSS — 38 —
802.11b, 11 Mbps, CCK — 38 —
802.11g, 6 Mbps, OFDM — 31 —
802.11g, 54 Mbps, OFDM — 20 —
802.11n, HT20, MCS0 — 31 —
802.11n, HT20, MCS7 — 16 —
Cont’d on next page

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5 RF Characteristics

Table 22 – cont’d from previous page

Min Typ Max
Rate (dB) (dB) (dB)
802.11n, HT40, MCS0 — 28 —
802.11n, HT40, MCS7 — 10 —
802.11ax, HE20, MCS0 — 25 —
802.11ax, HE20, MCS9 — 2 —

5.2 Bluetooth LE Radio

Table 23: Bluetooth LE RF Characteristics

Name Description
Center frequency range of operating channel 2402 ~ 2480 MHz
RF transmit power range –24.0 ~ 20.0 dBm

5.2.1 Bluetooth LE RF Transmitter (TX) Characteristics

Table 24: Bluetooth LE - Transmitter Characteristics - 1 Mbps

Parameter Description Min Typ Max Unit

Max. |fn |n=0, 1, 2, 3, ...k — 1.3 — kHz
Max. |f0 − fn |n=2, 3, 4, ...k — 1.5 — kHz
Carrier frequency offset and drift
Max. |fn − fn−5 |n=6, 7, 8, ...k — 0.9 — kHz
|f1 − f0 | — 0.6 — kHz
∆ F 1avg — 249.9 — kHz
Modulation characteristics Min. ∆ F 2max (for at least
— 212.1 — kHz
99.9% of all ∆ F 2max )
∆ F 2avg /∆ F 1avg — 0.88 — —
± 2 MHz offset — –29 — dBm
In-band emissions ± 3 MHz offset — –36 — dBm
> ± 3 MHz offset — –39 — dBm

Table 25: Bluetooth LE - Transmitter Characteristics - 2 Mbps

Parameter Description Min Typ Max Unit

Max. |fn |n=0, 1, 2, 3, ...k — 2.2 — kHz
Max. |f0 − fn |n=2, 3, 4, ...k — 1.1 — kHz
Carrier frequency offset and drift
Max. |fn − fn−5 |n=6, 7, 8, ...k — 1.1 — kHz
|f1 − f0 | — 0.5 — kHz
∆ F 1avg — 499.4 — kHz
Modulation characteristics Min. ∆ F 2max (for at least
— 443.5 — kHz
99.9% of all ∆ F 2max )
Cont’d on next page

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5 RF Characteristics

Table 25 – cont’d from previous page

Parameter Description Min Typ Max Unit
∆ F 2avg /∆ F 1avg — 0.95 — —
± 4 MHz offset — –40 — dBm
In-band emissions ± 5 MHz offset — –41 — dBm
> ± 5 MHz offset — –42 — dBm

Table 26: Bluetooth LE - Transmitter Characteristics - 125 Kbps

Parameter Description Min Typ Max Unit

Max. |fn |n=0, 1, 2, 3, ...k — 0.7 — kHz
Max. |f0 − fn |n=1, 2, 3, ...k — 0.3 — kHz
Carrier frequency offset and drift
|f0 − f3 | — 0.1 — kHz
Max. |fn − fn−3 |n=7, 8, 9, ...k — 0.4 — kHz
∆ F 1avg — 250.0 — kHz
Modulation characteristics
Min. ∆ F 1max (for at least
— 238.0 — kHz
99.9% of all ∆ F 1max )
± 2 MHz offset — –29 — dBm
In-band emissions ± 3 MHz offset — –36 — dBm
> ± 3 MHz offset — –39 — dBm

Table 27: Bluetooth LE - Transmitter Characteristics - 500 Kbps

Parameter Description Min Typ Max Unit

Max. |fn |n=0, 1, 2, 3, ...k — 0.5 — kHz
Max. |f0 − fn |n=1, 2, 3, ...k — 0.3 — kHz
Carrier frequency offset and drift
|f0 − f3 | — 0.1 — kHz
Max. |fn − fn−3 |n=7, 8, 9, ...k — 0.4 — kHz
∆ F 2avg — 230.7 — kHz
Modulation characteristics
Min. ∆ F 2max (for at least
— 217.6 — kHz
99.9% of all ∆ F 2max )
± 2 MHz offset — –28 — dBm
In-band emissions ± 3 MHz offset — –36 — dBm
> ± 3 MHz offset — –39 — dBm

5.2.2 Bluetooth LE RF Receiver (RX) Characteristics

Table 28: Bluetooth LE - Receiver Characteristics - 1 Mbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –98.0 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Cont’d on next page

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5 RF Characteristics

Table 28 – cont’d from previous page

Parameter Description Min Typ Max Unit
Co-channel F = F0 MHz — 7 — dB
F = F0 + 1 MHz — 4 — dB
F = F0 – 1 MHz — 3 — dB
F = F0 + 2 MHz — –21 — dB
F = F0 – 2 MHz — –22 — dB
Adjacent channel
C/I and receiver F = F0 + 3 MHz — –28 — dB
selectivity performance F = F0 – 3 MHz — –36 — dB
F ≥ F0 + 4 MHz — –27 — dB
F ≤ F0 – 4 MHz — –36 — dB
Image frequency — — –26 — dB
Adjacent channel to F = Fimage + 1 MHz — –29 — dB
image frequency F = Fimage – 1 MHz — –28 — dB
30 MHz ~ 2000 MHz — –16 — dBm
Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –24 — dBm
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –1 — dBm
Intermodulation — — –27 — dBm

Table 29: Bluetooth LE - Receiver Characteristics - 2 Mbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –95.0 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel F = F0 MHz — 8 — dB
F = F0 + 2 MHz — 3 — dB
F = F0 – 2 MHz — 2 — dB
F = F0 + 4 MHz — –23 — dB
F = F0 – 4 MHz — –25 — dB
Adjacent channel
C/I and receiver F = F0 + 6 MHz — –31 — dB
selectivity performance F = F0 – 6 MHz — –35 — dB
F ≥ F0 + 8 MHz — –36 — dB
F ≤ F0 – 8 MHz — –36 — dB
Image frequency — — –23 — dB
Adjacent channel to F = Fimage + 2 MHz — –30 — dB
image frequency F = Fimage – 2 MHz — 3 — dB
30 MHz ~ 2000 MHz — –18 — dBm
Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –28 — dBm
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –1 — dBm
Intermodulation — — –29 — dBm

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5 RF Characteristics

Table 30: Bluetooth LE - Receiver Characteristics - 125 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –105.5 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel F = F0 MHz — 2 — dB
F = F0 + 1 MHz — –1 — dB
F = F0 – 1 MHz — –3 — dB
F = F0 + 2 MHz — –31 — dB
F = F0 – 2 MHz — –27 — dB
Adjacent channel
C/I and receiver F = F0 + 3 MHz — –33 — dB
selectivity performance F = F0 – 3 MHz — –42 — dB
F ≥ F0 + 4 MHz — –31 — dB
F ≤ F0 – 4 MHz — –48 — dB
Image frequency — — –31 — dB
Adjacent channel to F = Fimage + 1 MHz — –36 — dB
image frequency F = Fimage – 1 MHz — –33 — dB

Table 31: Bluetooth LE - Receiver Characteristics - 500 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –101.5 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel F = F0 MHz — 4 — dB
F = F0 + 1 MHz — 1 — dB
F = F0 – 1 MHz — –1 — dB
F = F0 + 2 MHz — –23 — dB
F = F0 – 2 MHz — –24 — dB
Adjacent channel
C/I and receiver F = F0 + 3 MHz — –33 — dB
selectivity performance F = F0 – 3 MHz — –41 — dB
F ≥ F0 + 4 MHz — –31 — dB
F ≤ F0 – 4 MHz — –41 — dB
Image frequency — — –30 — dB
Adjacent channel to F = Fimage + 1 MHz — –35 — dB
image frequency F = Fimage – 1 MHz — –27 — dB

5.3 802.15.4 Radio

Table 32: 802.15.4 RF Characteristics

Name Description
Center frequency range of operating channel 2405 ~ 2480 MHz
1
Zigbee in the 2.4 GHz range supports 16 channels at 5 MHz spacing from
channel 11 to channel 26.

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5 RF Characteristics

5.3.1 802.15.4 RF Transmitter (TX) Characteristics

Table 33: 802.15.4 Transmitter Characteristics - 250 Kbps

Parameter Min Typ Max Unit

RF transmit power range –24.0 — 20.0 dBm
EVM — 13% — —

5.3.2 802.15.4 RF Receiver (RX) Characteristics

Table 34: 802.15.4 Receiver Characteristics - 250 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @1% PER — — –104.0 — dBm
Maximum received signal @1% PER — — 8 — dBm
F = F0 + 5 MHz — 27 — dB
Adjacent channel
F = F0 – 5 MHz — 32 — dB
Relative jamming level
F = F0 + 10 MHz — 47 — dB
Alternate channel
F = F0 – 10 MHz — 50 — dB

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 Espressif Systems

6 Module Schematics
6 Module Schematics
This is the reference design of the module.

GND

GND GND

3
Y1

GND

GND XOUT
C1 C4
The values of C1 and C4 vary with

XIN
TBD TBD
the selection of the crystal.

2
The value of R4 varies with the actual 40MHz VDD33 GND GND
PCB board. U3 ESP32-C6-WROOM-1
VDD33 29
GND 1 EPAD 28
2 GND GND 27 GPIO2
CHIP_EN 3 3V3 IO2 26 GPIO3
C3 C2 GPIO4 4 EN IO3 25 U0TXD
GPIO23 GPIO5 5 IO4 TXD0 24 U0RXD
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1uF 10nF GPIO22 D1 GPIO6 6 IO5 RXD0 23 GPIO15

GPIO21 ESD GPIO7 7 IO6 IO15 22
IO7 NC 21

0
GPIO20 GPIO0 8 GPIO23
VDD33 GND GND R17 0 GPIO19 GPIO1 9 IO0 IO23 20 GPIO22
GPIO18 GPIO8 10 IO1 IO22 19 GPIO21
L1 2.0nH(0.1nH) GPIO10 11 IO8 IO21 18 GPIO20
IO10 IO20 17

R4
GND GND GPIO11 12 GPIO19
C6 C7 C8 C9 GND GPIO12 13 IO11 IO19 16 GPIO18
GPIO13 14 IO12 IO18 15 GPIO9
10uF 1uF 0.1uF 0.1uF IO13 IO9

41

40
39
38
37
36
35
34
33
32
31
26

C10

GND

VDDA2

SDIO_DATA3
SDIO_DATA2
SDIO_DATA1
SDIO_DATA0
XTAL_P
XTAL_N
VDDA1

SDIO_CLK
SDIO_CMD
GND GND GND GND 0.1uF VDD33
ESP32-C6-WROOM-1(Pin-out)
ANT1
1 RF_ANT L2 TBD LNA_IN 1 30 U0RXD
2 2 ANT U0RXD 29 R3 499 U0TXD
3 VDDA3P3 U0TXD 28
C11 C12
PCB_ANT CHIP_EN 4 VDDA3P3 VDDPST2 27 GPIO15
TBD TBD 5 CHIP_EN GPIO15 26 R16 0 SPID
GPIO0 6 VDDPST1 SPID 25 R15 0 SPICLK
GPIO1 7 XTAL_32K_P SPICLK 24 R14 0 SPIHD VDD_SPI
GPIO2 8 XTAL_32K_N SPIHD 23
GND GND GND
GPIO3 9 GPIO2 VDD_SPI 22 R13 0 SPIWP
GPIO4 10 GPIO3 SPIWP 21 R10 0 SPIQ
MTMS SPIQ
The values of C11, L2 and C12 VDD33 GPIO10 R8
GPIO11
GPIO12
GPIO13
SPICS0
vary with the actual PCB board.
GPIO8
GPIO9
MTDO
MTCK

C16 C17 VDD_SPI 10K(NC)

MTDI

NC: No component.

8
C15 0.1uF 1uF
U1 ESP32-C6-QFN40 SPICS0 1 5 SPID

VCC
ESP32-C6-WROOM-1 Datasheet v0.5

11
12
13
14
15
16
17
18
19
20
0.1uF /CS DI
GND GND SPICLK 6 2 SPIQ
CLK DO

GND
GND SPIHD 7 3 SPIWP
/HOLD /WP
GPIO10
GPIO11
GPIO12
GPIO13
SPICS0
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9

U2 FLASH

4
GND

Figure 4: ESP32-C6-WROOM-1 Schematics

7 Peripheral Schematics

7 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).

GND GND
VDD33 VDD33 U1 ESP32-C6-WROOM-1
29
1 EPAD 28 VDD33
2 GND GND 27 IO2 JP1
EN 3 3V3 IO2 26 IO3 1
R1 C1 C2 IO4 4 EN IO3 25 TXD0 2 1
TBD IO5 5 IO4 TXD0 24 RXD0 3 2
SW1 22uF 0.1uF IO6 6 IO5 RXD0 23 IO15 4 3
R2 0 EN IO7 7 IO6 IO15 22 4
IO0 8 IO7 NC 21 IO23 UART
C4 0.1uF GND GND IO1 9 IO0 IO23 20 IO22 GND
C3 IO8 10 IO1 IO22 19 IO21
TBD JP4 IO10 11 IO8 IO21 18 IO20
4 TMS IO11 12 IO10 IO20 17 IO19
4 3 TDI IO12 13 IO11 IO19 16 IO18 JP2
GND GND 3 2 TCK IO13 14 IO12 IO18 15 IO9 1
2 1 TDO IO13 IO9 2 1
1 2
JTAG Boot Option
GND
VDD33
GND C5 12pF(NC)
JP3
1

X1 R3 0(NC) R6 TBD USB_D+ 2

R5

32.768KHz(NC) R7 TBD USB_D- 1 2

R8 R4 0(NC) 1
X1: ESR
10K C7 C8 USB
NC

= Max. 70 KΩ
2

IO8 TBD TBD NC: No component.

GND
C6 12pF(NC)

GND GND

Figure 5: Peripheral Schematics

• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste.

• To ensure that the power supply to the ESP32-C6 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-C6’s power-up and reset sequence
timing diagram, please refer to ESP32-C6 Series Datasheet > Section Power Supply.

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8 Physical Dimensions and PCB Land Pattern

8 Physical Dimensions and PCB Land Pattern

8.1 Physical Dimensions

Unit: mm

18±0.25 3.1±0.15
0.8
6

3.3

1.27
0.8
15.8
0.45
25.5±0.25

28 x 0.9

28 x Ø0.55
16.51

1.27

17.6

7.495

28 x 0.9

12.29
5

0.45
0.

0.8
3.3
Ø

1.05
1.5

28 x 0.45 0.98 28 x 0.85

Top View Side View Bottom View

Figure 6: Physical Dimensions

Note:
For information about tape, reel, and product marking, please refer to Espressif Module Packaging Information.

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8 Physical Dimensions and PCB Land Pattern

8.2 Recommended PCB Land Pattern

Unit: mm
Via for thermal pad
Copper

18

7.49
Antenna Area

6
28x1.5

3.3
1 28
0.8
0.45
28x0.9

25.5
3.3
16.51

1.27
12.29
0.45
1.5

0.8

7.495
14 15

0.5
17.5

Figure 7: Recommended PCB Land Pattern

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9 Product Handling

9 Product Handling

9.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.

After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
60%RH. If the above conditions are not met, the module needs to be baked.

9.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V

9.3 Soldering Profile

9.3.1 Reflow Profile
Solder the module in a single reflow.
Temperature (℃)

Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s

Ramp-up zone
1 ~ 3 ℃/s
100

50

25
Time (sec.)
0
0 50 100 150 200 250

Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy

Figure 8: Reflow Profile

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9 Product Handling

9.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.

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10 Related Documentation and Resources

10 Related Documentation and Resources

Related Documentation
• ESP32-C6 Series Datasheet – Specifications of the ESP32-C6 hardware.
• ESP32-C6 Technical Reference Manual – Detailed information on how to use the ESP32-C6 memory and peripherals.
• Certificates
https://espressif.com/en/support/documents/certificates
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents

Developer Zone
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos

Products
• ESP32-C6 Series SoCs – Browse through all ESP32-C6 SoCs.
https://espressif.com/en/products/socs?id=ESP32-C6
• ESP32-C6 Series Modules – Browse through all ESP32-C6-based modules.
https://espressif.com/en/products/modules?id=ESP32-C6
• ESP32-C6 Series DevKits – Browse through all ESP32-C6-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-C6
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en

Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions

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Revision History

Revision History

Date Version Release notes

2023-02-16 v0.5 Preliminary release

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 Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property
www.espressif.com of their respective owners, and are hereby acknowledged.
Copyright © 2023 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.